Wafer slicing non-dead angle cleaning and drying integrated device

Abstract

The application discloses a wafer slice no-dead-angle cleaning and drying integrated device and concretely relates to the wafer processing technical field. The wafer slice no-dead-angle cleaning and drying integrated device comprises a base, a support is arranged on the base, a lifting disc is arranged below the support, an extension device for driving the lifting disc to vertically lift is arranged on the support, a pair of spraying assemblies are arranged between the lifting disc and the base, the spraying assembly comprises a hollow seat, a plurality of flow guide branches fixedly connected to the hollow seat, a flow guide groove arranged on each flow guide branch, a spoiler fixedly connected in the flow guide groove and a spoiler block fixedly connected to one end of the spoiler away from the hollow seat, the flow guide groove arranged on the flow guide branch is communicated with the hollow seat, one side of the spoiler facing the wafer is provided with a continuous triangular shape, and the spoiler block is provided in a downward inclined mode. The wafer cleaning and drying can reach the no-dead-angle, high-efficiency and ideal effect.

Description

Technical Field

[0001] This invention relates to the field of wafer processing technology, and more specifically, to an integrated device for cleaning and drying wafer slicing without dead angles. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer. Wafer cleaning is extremely important for the electronics industry, especially the semiconductor industry. In the manufacturing process of semiconductor devices and integrated circuits, almost every step involves cleaning and drying to ensure the wafer can proceed to the next processing step. The effectiveness of wafer cleaning and drying directly affects product yield and output.

[0003] The current technical problem to be solved is how to achieve a thorough, efficient, and ideal cleaning and drying process for wafers. Existing technologies, such as nozzle cleaning, are prone to problems with uneven cleaning and dead spots. In addition, the drying and cleaning processes are handled by two separate devices, which increases wafer processing costs and reduces processing efficiency. Summary of the Invention

[0004] In order to overcome the above-mentioned defects of the prior art, the embodiments of the present invention provide an integrated device for cleaning and drying wafer slicing without dead angles. The technical problem to be solved by the present invention is: how to achieve a dead angle-free, efficient and ideal effect during wafer cleaning and drying.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a wafer slicing cleaning and drying integrated device without dead angles, comprising a base, a support on the base, a lifting plate disposed below the support, a telescopic device for driving the lifting plate to move vertically on the support, a pair of spraying assemblies disposed between the lifting plate and the base, the spraying assembly comprising a hollow base, a plurality of guide plates fixedly connected to the hollow base, a guide groove formed on each guide plate, a baffle plate fixedly connected to the guide groove, and a baffle block fixedly connected to the baffle plate at one end facing away from the hollow base, the guide grooves arranged on the guide plates communicating with the hollow base, the side of the baffle plate facing the wafer being arranged in a continuous series of triangles, and the baffle block being inclined downwards;

[0006] The gas-liquid conductive element is provided in two sets, and each set is fixedly connected to a pair of hollow seats. The gas-liquid conductive element is used to introduce water for wafer cleaning and gas for wafer drying.

[0007] The gas-liquid conduction component on the top hollow seat is installed on the lifting plate, and the gas-liquid conduction component on the bottom hollow seat is installed on the base.

[0008] The column is provided in multiple sets and is fixedly connected to the base. Each column is provided with a wafer carrier ring for carrying the wafer, and one of the wafer carrier rings is provided with a gear.

[0009] A wafer angle adjustment driving structure is provided, which is disposed on the base and the lifting plate. The wafer angle adjustment driving structure includes a rotary transmission module and a rotary drive module. A clearance structure is provided on the wafer angle adjustment driving structure, which is used for connecting and disconnecting the transmission between the rotary transmission module and the rotary drive module.

[0010] When the top-mounted jet assembly descends and adheres to the upper surface of the wafer, the rotary transmission module disengages from the rotary drive module through the clearance structure, and the wafer mounted on the wafer carrier ring does not rotate.

[0011] As the top-mounted jet assembly rises away from the upper surface of the wafer, the rotary transmission module is connected to the rotary drive module via a clearance structure, causing the wafer mounted on the wafer carrier ring to rotate.

[0012] In a preferred embodiment, the length of the flow guide plate is greater than the radius of the wafer.

[0013] In a preferred embodiment, the top guide plate is fixedly connected to the bottom of the lifting plate, the bottom guide plate is fixedly mounted on the base, the end face of the hollow base is fixedly connected with a rubber ring, and a rubber strip is fixedly connected along the length of each guide plate. The rubber strip surrounds the outside of the guide groove, and the rubber strip and the rubber ring are at the same height.

[0014] In a preferred embodiment, a fixed seat is fixedly connected to the base, and a flow guide plate located at the bottom is fixedly connected to the fixed seat.

[0015] In a preferred embodiment, a washer is fixedly connected to the end face of the middle part of the wafer carrier ring, and the rubber ring on the hollow seat at the bottom is at the same height as the washer.

[0016] In a preferred embodiment, the gas-liquid conduit includes a three-way pipe and a pair of solenoid valves disposed on the three-way pipe. The three-way pipe is fixedly connected to the hollow seat. The three-way pipe located at the top is fixedly inserted through the lifting plate, and the three-way pipe located at the bottom is fixedly inserted through the base.

[0017] In a preferred embodiment, the rotary transmission module includes a mounting plate fixedly connected to the base, a support block fixedly connected to the mounting plate, and a pair of gears rotatably connected to the support block via a rotating shaft. The pair of gears are coaxially arranged, and one of the gears meshes with the gear one.

[0018] In a preferred embodiment, the rotary drive module includes a second mounting plate fixedly connected to the lifting plate, a pair of elastic telescopic members fixedly connected to the second mounting plate, a lifting plate fixedly connected to the pair of elastic telescopic members, and a toothed block fixedly connected to the lifting plate, the toothed block being used to mesh with another gear.

[0019] In a preferred embodiment, the clearance structure includes a top block one fixedly connected to the lifting plate, a limiting frame fixedly connected to the mounting plate one, a torsion spring shaft disposed inside the limiting frame, a fixing plate disposed on the torsion spring shaft, and a top block two fixedly connected to the fixing plate. The fixing plate is rotatably connected to the limiting frame via the torsion spring shaft. The opposing surfaces of the top block one and the top block two are both arc-shaped, and the top block one and the top block two are in movable contact.

[0020] In a preferred embodiment, the lifting plate is provided with a clearance opening, which corresponds to the position above the mounting plate.

[0021] The technical effects and advantages of this invention are as follows:

[0022] This invention discloses an integrated wafer slicing cleaning and drying device with no dead angles. By tightly positioning a pair of spray components on both ends of the wafer and extending them to the outer circumferential surface, multiple cleaning or drying channels are branched off on the wafer's end faces by several flow guide plates. Fluid movement on continuously triangularly arranged baffles achieves pressure differential changes, thereby increasing fluid pressure and flow rate. Simultaneously, the baffle positions promote fluid action on the outer circumferential surface of the wafer, thus avoiding dead angles in wafer cleaning or drying. The effective impact of the fluid on the wafer surface improves the quality of wafer surface rinsing and drying. Furthermore, since the spray components collectively provide conductivity for the fluid medium during wafer rinsing and drying, wafer processing costs are reduced while simultaneously improving cleaning and drying efficiency.

[0023] The present invention provides an integrated device for cleaning and drying wafer slicing without dead angles. By setting a rubber ring and a rubber strip on the spraying component, the fluid movement concentration in the guide channel can be improved when the two come into contact with the wafer end face, so that the fluid can be sprayed under pressure in the guide channel in a pressurized environment. This can improve the quality and reliability of wafer surface rinsing and drying.

[0024] This invention discloses an integrated wafer slicing cleaning and drying device with no dead angles. When the top spray assembly descends and adheres to the upper surface of the wafer, the rotary transmission module is disengaged from the rotary drive module through a clearance structure, and the wafer mounted on the wafer carrier ring does not rotate. When the top spray assembly rises and moves away from the upper surface of the wafer, the rotary transmission module is reconnected to the rotary drive module through the clearance structure, and the wafer mounted on the wafer carrier ring rotates. This allows the wafer to achieve a step-by-step rotation effect in contact with the spray assembly, ensuring that the outer surface of the wafer is fully in contact with the drying or cleaning fluid, guaranteeing a comprehensive and thorough cleaning and drying of the wafer, thereby improving the cleaning effect and efficiency. Attached Figure Description

[0025] Figure 1 This is a first-view structural schematic diagram of the present invention.

[0026] Figure 2 This is a structural schematic diagram of the entire invention from a second perspective.

[0027] Figure 3 This is a schematic diagram of the base and wafer adjustment drive structure of the present invention.

[0028] Figure 4 This is a schematic diagram of the structure of the injection assembly and the gas-liquid conduction component of the present invention.

[0029] Figure 5 For the present invention Figure 4 A plan view of the injection assembly.

[0030] Figure 6 This is a schematic diagram of the wafer adjustment driving structure of the present invention.

[0031] Figure 7 For the present invention Figure 6 Enlarged view of section A.

[0032] The attached diagram is labeled as follows: 1. Base; 2. Bracket; 3. Lifting plate; 4. Telescopic device; 5. Spray assembly; 51. Hollow seat; 52. Guide plate; 53. Guide channel; 54. Baffle plate; 55. Baffle block; 6. Gas-liquid conduit; 61. T-pipe; 62. Solenoid valve; 7. Column; 71. Wafer carrier ring; 8. Gear one; 9. Wafer angle adjustment drive structure; 91. Mounting plate one; 92. Support block; 93. Gear two; 94. Mounting plate two; 95. Elastic telescopic component; 96. Lifting plate; 97. Gear block; 10. Clearance structure; 101. Top block one; 102. Limiting frame; 103. Torsion spring shaft; 104. Fixing plate; 105. Top block two; 11. Fixing seat; 12. Rubber ring; 121. Rubber strip; 13. Clearance opening. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] See also Figures 1-7 This invention provides an integrated device for cleaning and drying wafer slicing without dead angles, including a base 1, a support 2 on the base 1, a lifting plate 3 inside and below the support 2, and a telescopic device 4 on the support 2 for driving the vertical lifting of the lifting plate 3. Two sets of telescopic devices 4 can be used to improve the balance of the lifting plate 3. The telescopic devices 4 can be implemented using a telescopic motor or a screw-driven mechanism to achieve the lifting of the lifting plate 3. A pair of spraying components 5 are arranged between the lifting plate 3 and the base 1. The spraying components 5 include a hollow base 51, several guide plates 52 fixedly connected to the hollow base 51, a guide groove 53 formed on each guide plate 52, a baffle plate 54 fixedly connected to the guide groove 53, and a fixed connecting... A baffle block 55 is attached to the end of the baffle plate 54 facing away from the hollow base 51. A guide groove 53 arranged on the guide support plate 52 is connected to the hollow base 51. The side of the baffle plate 54 facing the wafer is arranged with continuous triangles. The baffle block 55 is arranged at a downward inclination. The arrangement of several guide grooves 53 can form multiple branched cleaning or drying channels on the wafer end face, which can make the fluid movement more concentrated. In this application, the wave-shaped position of the baffle plate 54 is triangular, and the triangle is an obtuse triangle. When the fluid passes through the side of the baffle plate 54 facing the wafer end face, it can be disturbed, achieving the effect of expansion and then compression. In this way, the fluid with pressure difference can pass through faster, and at the same time, it is beneficial to impact the wafer surface to achieve beneficial cleaning or drying.

[0035] The length of the flow guide plate 52 is greater than the radius of the wafer. The advantage of this setting is that the position of the baffle block 55 is obliquely aligned with the outer ring surface of the wafer. In this way, the fluid passing through the flow guide groove 53 can bounce and impact the outer ring surface of the wafer and be discharged. This, together with the position of the baffle plate 54, accelerates the processing of the fluid on the wafer end face, so that the wafer can achieve a cleaning and drying effect without dead angles.

[0036] The top guide plate 52 is fixedly connected to the bottom of the lifting plate 3, and the bottom guide plate 52 is fixedly mounted on the base 1. The end face of the hollow base 51 is fixedly connected with a rubber ring 12. Each guide plate 52 is fixedly connected with a rubber strip 121 along its length. The rubber strip 121 surrounds the outside of the guide groove 53. The rubber strip 121 and the rubber ring 12 are at the same height. The rubber ring 12 and the rubber strip 121 can be made of rubber.

[0037] A fixed seat 11 is fixedly connected to the base 1, and a flow guide plate 52 located at the bottom is fixedly connected to the fixed seat 11.

[0038] Specifically, when the hollow seat 51 and the flow guide plate 52 at the top approach the wafer via the telescopic device 4, the rubber strip 121 and rubber ring 12 located above and below the wafer can adhere to the wafer end face. This allows the flow guide groove 53 to achieve a relatively sealed effect except at the end position, so that the fluid can flow in a concentrated manner, ensuring the pressure and flow rate of the fluid flow.

[0039] The aforementioned integrated device for cleaning and drying wafer slicing without dead angles also includes a gas-liquid conduction component 6, a column 7, a wafer angle adjustment drive structure 9, and a clearance structure 10.

[0040] There are two sets of gas-liquid conductive parts 6, which are fixedly connected to a pair of hollow seats 51 respectively. The gas-liquid conductive parts 6 are used to introduce water for wafer cleaning and gas for wafer drying. The gas-liquid conductive parts 6 on the top hollow seat 51 are set on the lifting plate 3, and the gas-liquid conductive parts 6 on the bottom hollow seat 51 are set on the base 1.

[0041] The gas-liquid conduit 6 includes a three-way pipe 61 and a pair of solenoid valves 62 disposed on the three-way pipe 61. The three-way pipe 61 is fixedly connected to the hollow base 51. The three-way pipe 61 located at the top is fixedly inserted through the lifting plate 3, and the three-way pipe 61 located at the bottom is fixedly inserted through the base 1. In this application, apart from the one-way pipe connected to the hollow base 51, the other two pipes of the three-way pipe 61 can be connected to the wafer cleaning fluid and the wafer drying fluid, respectively. The cleaning fluid can be wafer-specific cleaning water, and the drying fluid can be nitrogen or steam, etc. The pair of solenoid valves 62 can be used to control the independent switching of the cleaning fluid and the drying fluid in the three-way pipe 61.

[0042] There are multiple sets of columns 7, which are fixedly connected to the base 1. Each column 7 is provided with a wafer carrier ring 71 for carrying wafers. One of the wafer carrier rings 71 is provided with a gear 8.

[0043] A washer is fixedly connected to the end face of the middle part of the wafer carrier ring 71. The rubber ring 12 on the hollow seat 51 at the bottom is at the same height as the washer. In this application, the wafer carrier ring 71 is provided with a convex structure. The washer on the wafer carrier ring 71 facilitates the rotation of the wafer. At the same time, it uses the same rubber material as the rubber ring 12 and the rubber strip 121, which has a certain elasticity. In this way, when the guide plate 52 at the top drives the corresponding rubber strip 121 to press down, the tightness of the contact between the rubber strip 121 at the bottom and the lower end face of the wafer can be improved.

[0044] The wafer angle adjustment drive structure 9 is mounted on the base 1 and the lifting plate 3. The wafer angle adjustment drive structure 9 includes a rotary transmission module and a rotary drive module. The wafer angle adjustment drive structure 9 is provided with a clearance structure 10, which is used for connecting and disconnecting the rotary transmission module and the rotary drive module.

[0045] The rotary transmission module includes a mounting plate 91 fixedly connected to the base 1, a support block 92 fixedly connected to the mounting plate 91, and a pair of gears 93 rotatably connected to the support block 92 via a rotating shaft. The pair of gears 93 are coaxially arranged, and one of the gears 93 meshes with gear 8. In this application, the pair of gears 93 are a cylindrical gear and a bevel gear, and gear 8 is also a bevel gear.

[0046] The rotary drive module includes a mounting plate 94 fixedly connected to the lifting plate 3, a pair of elastic telescopic members 95 fixedly connected to the mounting plate 94, a lifting plate 96 fixedly connected to the pair of elastic telescopic members 95, and a gear block 97 fixedly connected to the lifting plate 96. The gear block 97 is used to mesh with another gear 93. In this application, the elastic telescopic member 95 is composed of a telescopic rod and a spring. The telescopic rod is fixedly connected to the mounting plate 94 and the lifting plate 96, and the spring is sleeved on the telescopic rod. The two ends of the spring are respectively fixedly connected to the opposite surfaces of the mounting plate 94 and the lifting plate 96.

[0047] The clearance structure 10 includes a top block 101 fixedly connected to the lifting plate 96, a limiting frame 102 fixedly connected to the mounting plate 91, a torsion spring shaft 103 disposed inside the limiting frame 102, a fixing plate 104 disposed on the torsion spring shaft 103, and a top block 105 fixedly connected to the fixing plate 104. The fixing plate 104 is rotatably connected to the limiting frame 102 via the torsion spring shaft 103. The opposing surfaces of the top block 101 and the top block 105 are both arc-shaped. 101 and top block 2 105 are in active contact. The top block 101 and top block 2 105 with curved surfaces can slide into contact easily. In this application, the limiting frame 102 can limit the path of the fixed plate 104 connected to the torsion spring shaft 103 to rotate downward, that is, limit the downward rotation of top block 2 105 in the horizontal direction. In this application, the torsion spring shaft 103 is composed of a torsion spring and a shaft, and the elastic force of the torsion spring is greater than that of the spring. In this way, top block 101 can more easily press down to push top block 2 105 to fold and flip.

[0048] Specifically, after the wafer is placed on several wafer carrier rings 71 manually or by a robotic arm, the top spraying assembly 5 is simultaneously driven by the telescopic device 4 to adhere to the upper surface of the wafer until a pair of spraying assemblies 5 are tightly adhered to both ends of the wafer. At this time, the top block 101 contacts and pushes the top block 205. Since the top block 205 cannot rotate downwards, the top block 101 can drive the lifting plate 96 to press to one side, and the elastic telescopic component 95 can retract. At this time, the toothed block 97 can pass over the gear 203, and the top block 101 is located below the top block 205. In this way, the gear 203 does not drive the gear 108 to rotate, and the wafer continues to move. When it is necessary to change the cleaning or drying position of the wafer, the top spray assembly 5 first moves upward. During this process, top block 101 can slide to contact top block 2 105. Since top block 2 105 can rotate upward through the torsion spring shaft 103, the elastic telescopic member 95 can not be compressed. Top block 2 105 avoids top block 101, so the toothed block 97 can contact and push the cylindrical gear. In this way, the bevel gear can drive gear 1 8 to rotate. The rotation of gear 1 8 can drive the wafer ring to rotate through the wafer carrier ring 71. In this way, the close contact position between the wafer and the flow guide plate 52 can be adjusted so that the wafer can be fully cleaned or dried.

[0049] It is worth noting that, in order to ensure that the wafer carrier ring 71 provides effective friction for the rotation of the wafer, an additional set of gears 8, wafer angle adjustment drive structure 9 and clearance structure 10 can be added in combination.

[0050] The lifting plate 3 is provided with a clearance opening 13, which is located above the mounting plate 91. The clearance opening 13 allows the wafer angle adjustment drive structure 9 to pass through effectively.

Claims

1. A wafer slicing cleaning and drying integrated device with no dead angle, comprising a base (1), a support (2) disposed on the base (1), a lifting plate (3) disposed below the support (2), a telescopic device (4) disposed on the support (2) for driving the lifting plate (3) to move vertically, and a pair of spraying components (5) disposed between the lifting plate (3) and the base (1), characterized in that: The spray assembly (5) includes a hollow base (51), a plurality of flow guide plates (52) fixedly connected to the hollow base (51), a flow guide groove (53) opened on each flow guide plate (52), a baffle plate (54) fixedly connected to the flow guide groove (53), and a baffle block (55) fixedly connected to one end of the baffle plate (54) facing away from the hollow base (51). The flow guide groove (53) arranged on the flow guide plate (52) is connected to the hollow base (51). The side of the baffle plate (54) facing the wafer is arranged in a continuous triangle. The baffle block (55) is inclined downward. Gas-liquid conductive element (6), the number of gas-liquid conductive elements (6) is two sets, and they are respectively fixedly connected to a pair of hollow seats (51). The gas-liquid conductive element (6) is used to introduce water for wafer cleaning and gas for wafer drying. The gas-liquid conductive part (6) on the hollow seat (51) at the top is set on the lifting plate (3), and the gas-liquid conductive part (6) on the hollow seat (51) at the bottom is set on the base (1); The column (7) is in multiple sets and is fixedly connected to the base (1). The column (7) is provided with a wafer carrier ring (71) for carrying the wafer, and one of the wafer carrier rings (71) is provided with a gear (8). A wafer angle adjustment drive structure (9) is provided on the base (1) and the lifting plate (3). The wafer angle adjustment drive structure (9) includes a rotary transmission module and a rotary drive module. A clearance structure (10) is provided on the wafer angle adjustment drive structure (9). The clearance structure (10) is used for connecting and disconnecting the transmission between the rotary transmission module and the rotary drive module. When the top-mounted jet assembly (5) descends and adheres to the upper surface of the wafer, the rotary transmission module is disengaged from the rotary drive module through the clearance structure (10), and the wafer mounted on the wafer carrier ring (71) does not rotate. When the top-mounted jet assembly (5) rises away from the upper surface of the wafer, the rotary transmission module is connected to the rotary drive module through the clearance structure (10), and the wafer arranged on the wafer carrier ring (71) rotates.

2. The integrated device for cleaning and drying wafer slicing without dead angles according to claim 1, characterized in that: The length of the flow guide plate (52) is greater than the radius of the wafer.

3. The integrated device for cleaning and drying wafer slicing without dead angles according to claim 1, characterized in that: The top guide plate (52) is fixedly connected to the bottom of the lifting plate (3), and the bottom guide plate (52) is fixedly mounted on the base (1). The end face of the hollow seat (51) is fixedly connected with a rubber ring (12). Each guide plate (52) is fixedly connected with a rubber strip (121) along its length. The rubber strip (121) surrounds the outside of the guide groove (53). The rubber strip (121) and the rubber ring (12) are at the same height.

4. The integrated device for cleaning and drying wafer slicing without dead angles according to claim 3, characterized in that: A fixed seat (11) is fixedly connected to the base (1), and a flow guide plate (52) located at the bottom is fixedly connected to the fixed seat (11).

5. The integrated device for cleaning and drying wafer slicing without dead angles according to claim 3, characterized in that: A washer is fixedly connected to the end face of the middle part of the wafer carrier ring (71), and the rubber ring (12) on the hollow seat (51) at the bottom is at the same height as the washer.

6. The integrated device for cleaning and drying wafer slicing without dead angles according to claim 1, characterized in that: The gas-liquid conductive component (6) includes a three-way pipe (61) and a pair of solenoid valves (62) disposed on the three-way pipe (61). The three-way pipe (61) is fixedly connected to the hollow seat (51). The three-way pipe (61) located at the top is fixedly inserted through the lifting plate (3), and the three-way pipe (61) located at the bottom is fixedly inserted through the base (1).

7. The integrated device for cleaning and drying wafer slicing without dead angles according to claim 1, characterized in that: The rotary transmission module includes a mounting plate (91) fixedly connected to the base (1), a support block (92) fixedly connected to the mounting plate (91), and a pair of gears (93) rotatably connected to the support block (92) via a rotating shaft. The pair of gears (93) are coaxially arranged, and one of the gears (93) meshes with the gear (8).

8. The integrated device for cleaning and drying wafer slicing without dead angles according to claim 7, characterized in that: The rotary drive module includes a second mounting plate (94) fixedly connected to the lifting plate (3), a pair of elastic telescopic members (95) fixedly connected to the second mounting plate (94), a lifting plate (96) fixedly connected to the pair of elastic telescopic members (95), and a toothed block (97) fixedly connected to the lifting plate (96). The toothed block (97) is used to mesh with another gear (93).

9. The integrated device for cleaning and drying wafer slicing without dead angles according to claim 8, characterized in that: The clearance structure (10) includes a top block one (101) fixedly connected to the lifting plate (96), a limiting frame (102) fixedly connected to the mounting plate one (91), a torsion spring shaft (103) disposed inside the limiting frame (102), a fixing plate (104) disposed on the torsion spring shaft (103), and a top block two (105) fixedly connected to the fixing plate (104). The fixing plate (104) is rotatably connected to the limiting frame (102) through the torsion spring shaft (103). The opposing surfaces of the top block one (101) and the top block two (105) are both arc-shaped, and the top block one (101) and the top block two (105) are in contact.

10. The wafer slicing cleaning and drying integrated device according to claim 8, characterized in that: The lifting plate (3) is provided with a clearance opening (13), which corresponds to the position above the mounting plate (91).

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