A distributed measurement system for strain acquisition

Abstract

The present invention discloses a distributed measurement system for strain acquisition, which relates to the technical field of signal acquisition. Compared with the previous distributed measurement systems, the present invention solves the problems that the existing distributed measurement systems often only measure the strain values at the sampling points, without considering other influencing factors, unable to ensure the accuracy of the acquired strain values, and that the existing distributed measurement systems generate too many signals for different sampling points and the built circuit is too complex, often consuming a large amount of preparation time and having a high cost; the system circuit is based on a main strain acquisition control system to control multiple full-bridge strain monitoring systems, which can greatly improve the efficiency of data acquisition at the sampling points, integrate power supply and communication into one, simplify the circuit, reduce the measurement cost, and also incorporate an attitude acquisition circuit and a temperature detection circuit, which can ensure the sampling accuracy of the acquired strain values at the sampling points and improve the sampling efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of signal acquisition, and particularly to a distributed measurement system for strain acquisition. Background Art

[0002] With the development of science and technology and the improvement of requirements for Internet of Things applications, the existing technology is developing towards large-capacity and multi-parameter measurement. Distributed measurement systems have been widely used in various fields, especially in structural monitoring, equipment condition monitoring, and safety management. In experiments, it is often necessary to measure multiple sampling points in a structure, and then find the weak points of the structural strength for reinforcement to reduce potential safety hazards.

[0003] Existing distributed measurement systems often only measure the strain of sampling points without considering other influencing factors, and cannot ensure the accuracy of the measured strain. Moreover, due to the excessive signals generated for different sampling points and the overly complex circuit built in existing distributed measurement systems, a large amount of preparation time is often consumed and the cost is high.

[0004] To solve the above problems, the present invention proposes a distributed measurement system for strain acquisition. Summary of the Invention

[0005] The purpose of the present invention is to propose a distributed measurement system for strain acquisition to solve the problems raised in the background art:

[0006] Existing distributed measurement systems often only measure the strain of sampling points without considering other influencing factors, and cannot ensure the accuracy of the measured strain. Moreover, due to the excessive signals generated for different sampling points and the overly complex circuit built in existing distributed measurement systems, a large amount of preparation time is often consumed and the cost is high.

[0007] To achieve the above purpose, the present invention adopts the following technical solutions:

[0008] A distributed measurement system for strain acquisition includes: a strain acquisition master control system and a full-bridge strain monitoring system; one strain acquisition master control system corresponds to several full-bridge strain monitoring systems;

[0009] The strain acquisition master control system is used to realize the control and management of the device;

[0010] The full-bridge strain monitoring system is used to realize the interaction function of the device according to the input and output interfaces of the device and realize strain measurement;

[0011] The strain acquisition master control system includes a first MCU, a first serial port debugging module, a first DEBUG module, a first FLASH module, a first power supply and signal line automatic switching module, a first power supply module, a USB 2 UART module, and a communication module;

[0012] The full-bridge strain monitoring system includes a second MCU, an MPU6050 module, a second serial port debugging module, a second power supply module, a second DEBUG module, a second FLASH module, a second power supply and signal line automatic switching module, a strain detection module, and a 4-wire PT100 temperature measurement module;

[0013] The first MCU and the second MCU are respectively connected to and control each module in the corresponding system;

[0014] The first serial port debugging module and the second serial port debugging module are used for serial port debugging;

[0015] The first DEBUG module and the second DEBUG module are used for debugging;

[0016] The first FLASH module and the second FLASH module are used for storage;

[0017] The first power supply and signal line automatic switching module and the second power supply and signal line automatic switching module are used to achieve power supply and communication and perform automatic switching;

[0018] The first power supply module converts the 12V voltage into 5V output voltage and 3.3V output voltage respectively to supply power to each module;

[0019] The USB 2 UART module is used to connect to the PC for communication; the communication module is used to connect to the DTU for communication;

[0020] The MPU6050 module is used to measure the attitude;

[0021] The second power supply module includes a first power conversion unit and a second power conversion unit, both of which are used to convert the 5V voltage into 3.3V output voltage. Among them, the voltage converted and output by the second power conversion unit acts on the strain detection module, and the voltage converted and output by the first power conversion unit acts on the rest of the modules.

[0022] Preferably, the first power supply and signal line automatic switching module of the strain acquisition main control system includes a thirty-second chip, an eighth resistor, a third MOS transistor, a fourth MOS transistor, a twenty-seventh resistor, a twenty-eighth resistor, a fourth triode, a thirty-second resistor, a thirty-first resistor, a fifth composite triode, a third transient suppression diode, a thirty-sixth capacitor, a thirty-seventh capacitor, a fourth transient suppression diode, and a first fuse. Among them, the fifth composite triode includes a first sub-triode and a second sub-triode;

[0023] The first pin of the thirty-second chip is connected to a 12V voltage, the second pin of the thirty-second chip is grounded, the sixth pin of the thirty-second chip is connected to the input voltage V+ terminal, the twelfth pin of the thirty-second chip is grounded, the thirteenth pin of the thirty-second chip is connected to the first end of the eighth resistor, and the second end of the eighth resistor is grounded;

[0024] The drains of the third MOS transistor and the fourth MOS transistor are both connected to the input voltage V+ terminal. The gate of the third MOS transistor is connected to the first end of the twenty-seventh resistor, the gate of the fourth MOS transistor is connected to the first end of the twenty-eighth resistor. The second ends of the twenty-seventh resistor and the twenty-eighth resistor are connected to the fourth end of the thirty-second chip. The sources of the third MOS transistor and the fourth MOS transistor are both connected to the emitter of the fourth triode, the first end of the thirty-first resistor, the cathode of the third transient suppression diode, the third end of the thirty-second chip, and the first end of the output port. The base of the fourth triode is connected to the first end of the thirty-second resistor. The second end of the thirty-second resistor is connected to the second end of the thirty-first resistor and the emitter of the second sub-triode of the fifth composite triode. In the fifth composite triode, the collectors of the first sub-triode and the second sub-triode are both grounded. The base of the second sub-triode is connected to the emitter of the first sub-triode. The bases of the first sub-triode and the fourth triode are both connected to the fifth end of the thirty-second chip. The anode of the third transient suppression diode and the second end of the output port are both grounded;

[0025] The first ends of the thirty-sixth capacitor, the thirty-seventh capacitor, the fourth transient suppression diode, and the first fuse are all connected to the input voltage V+ terminal. The second ends of the thirty-sixth capacitor, the thirty-seventh capacitor, and the fourth transient suppression diode are all grounded. The second end of the first fuse is connected to the first end of the control port, and the second end of the control port is grounded.

[0026] Preferably, the second power supply and signal line automatic switching module of the full-bridge strain monitoring system includes a first TVS diode, a thirteenth resistor, a fourteenth resistor, a third chip, a first capacitor, a second capacitor, a second rectifier bridge, a fourth resistor, an eighth resistor, a first triode, a sixth resistor, a tenth resistor, a third diode, a third capacitor, a third resistor, a first chip, an eleventh resistor, a twelfth resistor, a fourth capacitor, a second diode, a first inductor, a ninth capacitor, a first resistor, and a 5V control diode;

[0027] The first end of the first TVS diode is connected to the first end of the control bus, and the second end of the first TVS diode is connected to the second end of the control bus;

[0028] The first end of the third chip is connected to the 5V voltage, the second end of the third chip is connected to the first end of the thirteenth resistor, the third end of the third chip is connected to the first end of the fourteenth resistor, the eighth end of the third chip is grounded, and the second ends of the thirteenth resistor and the fourteenth resistor are both connected to the second MCU;

[0029] The first end of the first capacitor is respectively connected to the first end of the control bus and the third end of the second rectifier bridge. The first end of the second capacitor is respectively connected to the second end of the control bus and the fourth end of the second rectifier bridge. The second ends of the first capacitor and the second capacitor are both grounded. The second end of the second rectifier bridge is grounded. The first end of the second rectifier bridge is connected to the first end of the fourth resistor, the collector of the first triode, and the anode of the third diode. The second end of the fourth resistor is connected to the sixth end of the third chip and the first end of the eighth resistor. The second end of the eighth resistor is grounded. The base of the first triode is connected to the first end of the sixth resistor, and the emitter is connected to the first end of the tenth resistor. The second end of the sixth resistor is connected to the fifth end of the third chip. The second end of the tenth resistor is grounded. The cathode of the third diode is connected to the first end of the third capacitor, the first end of the third resistor, and the sixth end of the first chip. The second end of the third capacitor is grounded. The second end of the third resistor is connected to the seventh end of the first chip. The first end of the first chip is connected to the seventh end and the eighth end. The second end of the first chip is connected to the cathode of the second diode and the first end of the first inductor. The third end of the first chip is connected to the first end of the fourth capacitor. The fourth end of the first chip is grounded together with the second end of the fourth capacitor and the anode of the second diode. The fifth end of the first chip is connected to the first end of the eleventh resistor and the first end of the twelfth resistor. The second end of the twelfth resistor is grounded. The second end of the eleventh resistor is connected to the second end of the first inductor and the first end of the ninth capacitor to connect to the 5V voltage. The second end of the ninth capacitor is grounded;

[0030] The first end of the first resistor is connected to the 5V voltage, and the second end of the first resistor is connected to the anode of the 5V control diode. The cathode of the 5V control diode is grounded.

[0031] Preferably, the second end of the twenty-seventh resistor of the first power supply and signal line automatic switching module of the strain acquisition main control system is the BH end, the collector of the fourth triode is the BL end, and the cathode of the third transient suppression diode is the L+ end; the first ends of the first capacitor and the second capacitor of the second power supply and signal line automatic switching module of the full-bridge strain monitoring system are the PBUS1 end and the PBUS2 end respectively, the second end of the fourth resistor is the PB_PI end, and the second end of the sixth resistor is the PB_PO end;

[0032] When the strain acquisition master control system sends a control signal to the full-bridge strain monitoring system, the first power supply and signal line automatic switching module modulates the signal. Among them, the third MOS transistor and the fourth MOS transistor are used to control the interaction between the modulation signal and the carrier signal. The fourth triode and the fifth composite triode are used to modulate the carrier signal, and the third transient suppression diode is also used for voltage stabilization; then it is sent to the PBUS1 terminal or the PBUS2 terminal of the second power supply and signal line automatic switching module through the L+ terminal. A voltage fluctuation appears between the PBUS1 terminal and the PBUS2 terminal, which is sent to the third chip by the PB_PI terminal to be converted into a TTL level, and then sent to the STM32 chip of the first MCU for corresponding control;

[0033] When the strain acquisition master control system receives the signal fed back by the full-bridge strain monitoring system, the STM32 chip of the second MCU of the second power supply and signal line automatic switching module sends the signal to the third chip for level conversion, and is sent to the PB_PO terminal through the third chip. At this time, the base of the first triode is at a high level, the triode conducts, pulls down the input voltage V+, the load current increases instantaneously, and the first power supply and signal line automatic switching module of the strain acquisition master control system modulates the signal through the BH terminal and the BL terminal to detect the current fluctuation between the PBUS1 terminal and the PBUS2 terminal, and communicates through the thirty-second chip, and finally is transmitted to the PC terminal through the USB 2 UART module.

[0034] Preferably, the strain detection module detects and collects strain signals by lapping strain gauges, and also converts the detected data based on the analog-to-digital conversion chip of model CS1237-SOP8. The output of the analog-to-digital conversion chip is a digital output.

[0035] Preferably, the 4-wire PT100 temperature measurement module measures temperature based on the 4-wire PT100 in a way that an equivalent current source provides a constant current. It is amplified by two amplifiers respectively and the amplification factor is calculated. Based on the calculation of the resistance value of the 4-wire PT100, the current temperature value is obtained based on the look-up table.

[0036] Preferably, the look-up table is a look-up table of the 4-wire PT100 resistance value and the corresponding temperature.

[0037] Compared with the prior art, the present invention provides a distributed measurement system for strain acquisition, which has the following beneficial effects:

[0038] The system circuit of the present invention is based on a strain acquisition master control system to control multiple full-bridge strain monitoring systems, which can greatly improve the efficiency of sampling point data acquisition, and integrates power supply and communication into one, simplifies the circuit, reduces the measurement cost, and also incorporates an attitude acquisition circuit and a temperature detection circuit, which can ensure the sampling accuracy of the strain to be collected at the sampling point and improve the sampling efficiency. Description of the Drawings

[0039] Figure 1 It is the system block diagram mentioned in Embodiment 1 of the present invention;

[0040] Figure 2 It is the circuit diagram of the first MCU mentioned in Embodiment 1 of the present invention;

[0041] Figure 3 It is the circuit diagram of the first serial port debugging module mentioned in Embodiment 1 of the present invention;

[0042] Figure 4 It is the circuit diagram of the first DEBUG module mentioned in Embodiment 1 of the present invention;

[0043] Figure 5 It is the circuit diagram of the first FLASH module mentioned in Embodiment 1 of the present invention;

[0044] Figure 6 It is the circuit diagram of the first power supply and signal line automatic switching module mentioned in Embodiment 1 of the present invention;

[0045] Figure 7 It is the circuit diagram of the first power supply module mentioned in Embodiment 1 of the present invention;

[0046] Figure 8 It is the circuit diagram of the USB 2 UART module mentioned in Embodiment 1 of the present invention;

[0047] Figure 9 It is the circuit diagram of the communication module mentioned in Embodiment 1 of the present invention;

[0048] Figure 10 It is the circuit diagram of the second MCU mentioned in Embodiment 1 of the present invention;

[0049] Figure 11 It is the circuit diagram of the MPU6050 module mentioned in Embodiment 1 of the present invention;

[0050] Figure 12 It is the circuit diagram of the second serial port debugging module mentioned in Embodiment 1 of the present invention;

[0051] Figure 13 It is the circuit diagram of the first power conversion unit of the second power supply module mentioned in Embodiment 1 of the present invention;

[0052] Figure 14 It is the circuit diagram of the second power conversion unit of the second power supply module mentioned in Embodiment 1 of the present invention;

[0053] Figure 15 It is the circuit diagram of the second DEBUG module mentioned in Embodiment 1 of the present invention;

[0054] Figure 16 It is the circuit diagram of the second FLASH module mentioned in Embodiment 1 of the present invention;

[0055] Figure 17 It is the circuit diagram of the second power supply and signal line automatic switching module mentioned in Embodiment 1 of the present invention;

[0056] Figure 18 It is the circuit diagram of the strain detection module mentioned in Embodiment 1 of the present invention;

[0057] Figure 19 It is the circuit diagram of the 4-wire PT100 temperature measurement module mentioned in Embodiment 1 of the present invention. Specific embodiments

[0058] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0059] The system circuit of the present invention is based on a strain acquisition master control system to control multiple full-bridge strain monitoring systems, which can greatly improve the efficiency of data acquisition at sampling points, integrate power supply and communication into one, simplify the circuit, reduce the measurement cost, and also incorporate an attitude acquisition circuit and a temperature detection circuit, which can ensure the sampling accuracy of the strain at the sampling point and improve the sampling efficiency. The specific contents are as follows.

[0060] Embodiment 1:

[0061] Please refer to Figure 1-19 , a distributed measurement system for strain acquisition of the present invention includes:

[0062] A strain acquisition master control system and a full-bridge strain monitoring system; one strain acquisition master control system can correspond to multiple full-bridge strain monitoring systems and control the operation of multiple full-bridge strain monitoring systems at the same time; the function of each full-bridge strain monitoring system is to measure strain, and large-scale strain measurement can be carried out based on a single strain acquisition master control system.

[0063] Refer to Figure 10-19 , in the full-bridge strain monitoring system, the strain is collected based on the full-bridge strain gauge. Specifically, refer to Figure 18 , the strain is collected based on the global strain gauge, and then the signal is converted based on the ADC chip CS1237. Its working current is less than 2.5 mA, and it is a digital output, not an analog output. However, the strain is easily affected by the environment, especially temperature, so the temperature is measured through a 4-wire PT100. Refer to Figure 19, in the 4-wire PT100 temperature measurement module, a relatively stable constant current of I = 2.5V / R32 is provided by the current source equivalent to R30, U12, U13, C33, R31, Q2, and R32 at the lower left corner of the 4-wire PT100 to measure the temperature change of the 4-wire PT100. R34 and R35 on the right are respectively connected to two amplifiers in U15, and the amplification factor G = (1 + R40 / R38) * (V1 - V2) is compared, and the resistance value of the 4-wire PT100 is deduced from this, and the current temperature is retrieved based on the temperature conversion table of the 4-wire PT100. The device attitude is also accurately detected based on the MPU6050 chip. In case of equipment overturn caused by thunder, rain, landslide or geological landslide, etc., the accuracy of measurement data is ensured.

[0064] Refer to Figure 2-9 , in the strain acquisition main control system, communication with the PC end is realized based on the USB 2 UART module. The serial port data is also converted into IP data or the IP data is converted into serial port data and transmitted through the wireless communication network based on the communication module.

[0065] Refer to Figure 6 , the first power supply and signal line automatic switching module in the strain acquisition main control system includes U32, R8, Q3, Q4, R27, R28, T4, R32, R31, T5, Z3, C36, C37, T4, F1, where T5 includes a first sub-transistor and a second sub-transistor;

[0066] The first pin of U32 is connected to the 12V voltage, the second pin is grounded, the sixth pin is connected to the input voltage V+ terminal, the twelfth pin is grounded, the thirteenth pin is connected to the first end of R8, and the second end of R8 is grounded;

[0067] The drains of Q3 and Q4 are both connected to the input voltage V+ terminal. The gate of Q3 is connected to the first end of R27, the gate of Q4 is connected to the first end of R28. The second ends of R27 and R28 are connected to the fourth end of U32. The sources of Q3 and Q4 are both connected to the emitter of T4, the first end of R31, the cathode of Z3, the third end of U32, and the first end of the output port. The base of T4 is connected to the first end of R32. The second end of R32 is connected to the second end of R31 and the emitter of the second sub-transistor of T5. In T5, the collectors of the first sub-transistor and the second sub-transistor are both grounded. The base of the second sub-transistor is connected to the emitter of the first sub-transistor. The bases of the first sub-transistor and T4 are both connected to the fifth end of U32. The anode of Z3 and the second end of the output port are both grounded;

[0068] The first ends of C36, C37, Z4, and F1 are all connected to the input voltage V+ terminal. The second ends of C36, C37, and Z4 are all grounded. The second end of F1 is connected to the first end of the control port, and the second end of the control port is grounded.

[0069] Reference Figure 17

[0069] , the second power supply and signal line automatic switching module of the full-bridge strain monitoring system includes D1, R13, R14, U3, C1, C2, D2, R4, R8, Q1, R6, R10, D3, C3, R3, U1, R11, R12, C4, U2, L1, C9, R1 and 5VPower;

[0070] The first end of D1 is connected to the first end of the control bus, and the second end of the first TVS tube is connected to the second end of the control bus;

[0071] The first end of U3 is connected to the 5V voltage, the second end is connected to the first end of R13, the third end is connected to the first end of R14, the eighth end is grounded, and the second ends of R13 and R14 are both connected to the second MCU;

[0072] The first end of C1 is respectively connected to the first end of the control bus and the third end of D2, the first end of C2 is respectively connected to the second end of the control bus and the fourth end of D2, the second ends of C1 and C2 are both grounded, the second end of D2 is grounded, the first end is connected to the first end of R4, the collector of Q1 and the anode of D3, the second end of R4 is connected to the sixth end of U3 and the first end of R8, the second end of R8 is grounded, the base of Q1 is connected to the first end of R6, the emitter is connected to the first end of R10, the second end of R6 is connected to the fifth end of U3, the second end of R10 is grounded, the cathode of D3 is connected to the first end of C3, the first end of R3 and the sixth end of U1, the second end of C3 is grounded, the second end of R3 is connected to the seventh end of U1, the first end of U1 is connected to the seventh end and the eighth end, the second end is connected to the first end of U2 and the first end of L1, the third end is connected to the first end of C4, the fourth end is grounded together with the second end of C4 and the anode of U2, the fifth end is connected to the first end of R11 and the second end of R12, the second end of R12 is grounded, the second end of R11 is connected to the second end of L1, and the first end of C9 is connected to the 5V voltage, and the second end of C9 is grounded;

[0073] The first end of R1 is connected to the 5V voltage, the second end is connected to the anode of 5VPower, and the cathode of 5VPower is grounded.

[0074] In the strain acquisition main control system and the full-bridge strain monitoring system, when the full-bridge strain monitoring system is powered, the components on the right side of D3 form a voltage source to form a voltage of 12 - 36V for power supply.

[0075] When the strain acquisition master control system sends a control signal to the full-bridge strain monitoring system, the first power supply and signal line automatic switching module modulates the signal. Among them, Q3 and Q4 are used to control the interaction between the modulation signal and the carrier signal, T4 and T5 are used to modulate the carrier signal, and D3 is also used for voltage stabilization; then it is sent to the PBUS1 terminal or the PBUS2 terminal of the second power supply and signal line automatic switching module through the L+ terminal. There is a voltage fluctuation between the PBUS1 terminal and the PBUS2 terminal. Among them, R4 and R8 play a shunt role, and C3 plays a filtering role. It is sent to U3 through the PB_PI terminal to be converted into a TTL level, and then sent to the STM32 chip of the first MCU for corresponding control;

[0076] When the strain acquisition master control system receives the signal fed back by the full-bridge strain monitoring system, the STM32 chip of the second MCU of the second power supply and signal line automatic switching module sends the signal to U3 for level conversion, and is sent to the PB_PO terminal through U3. At this time, the base of Q1 is at a high level, the triode conducts, pulling down the input voltage V+, the load current increases instantaneously, and the first power supply and signal line automatic switching module of the strain acquisition master control system modulates the signal through the BH terminal and the BL terminal to detect the current fluctuation between the PBUS1 terminal and the PBUS2 terminal, and communicates through U32, and finally is transmitted to the PC terminal through the USB 2 UART module.

[0077] In the strain acquisition master control system and the full-bridge strain monitoring system, when the full-bridge strain monitoring system receives a signal, the signal is analyzed by parsing the voltage. When the full-bridge strain monitoring system sends a signal, the current between the PBUS1 terminal and the PBUS2 terminal is modulated by voltage to realize data reading. The baud rate of the signal should not be too large, which is helpful for stable analysis and reading of the signal.

[0078] As mentioned above, it is only the preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A distributed measurement system for strain acquisition, characterized in that, Including: A strain acquisition main control system and a full-bridge strain monitoring system; One said strain acquisition main control system corresponds to several full-bridge strain monitoring systems; The said strain acquisition main control system is used to realize the control and management of the equipment; The said full-bridge strain monitoring system is used to realize the interaction function of the equipment according to the input and output interfaces of the equipment and realize strain measurement; The said strain acquisition main control system includes a first MCU, a first serial port debugging module, a first DEBUG module, a first FLASH module, a first power supply and signal line automatic switching module, a first power supply module, a USB 2 UART module and a communication module; The said full-bridge strain monitoring system includes a second MCU, an MPU6050 module, a second serial port debugging module, a second power supply module, a second DEBUG module, a second FLASH module, a second power supply and signal line automatic switching module, a strain detection module and a 4-wire PT100 temperature measurement module; The said first MCU and the said second MCU are respectively connected to and control each module in the corresponding system; The said first serial port debugging module and the said second serial port debugging module are used for serial port debugging; The said first DEBUG module and the said second DEBUG module are used for debugging; The said first FLASH module and the said second FLASH module are used for storage; The said first power supply and signal line automatic switching module and the said second power supply and signal line automatic switching module are used to realize power supply and communication and perform automatic switching; The said first power supply module converts the 12V voltage into 5V output voltage and 3.3V output voltage respectively to supply power to each module; The said USB 2 UART module is used to connect to the PC side for communication; the said communication module is used to connect for DTU communication; The said MPU6050 module is used to measure the attitude; The said second power supply module includes a first power conversion unit and a second power conversion unit, both of which are used to convert the 5V voltage into 3.3V output voltage. Among them, the voltage converted and output by the second power conversion unit acts on the strain detection module, and the voltage converted and output by the first power conversion unit acts on the rest of the modules.

2. The distributed measurement system for strain acquisition according to claim 1, characterized in that, The first power supply and signal line automatic switching module of the said strain acquisition main control system includes a thirty-second chip, an eighth resistor, a third MOS transistor, a fourth MOS transistor, a twenty-seventh resistor, a twenty-eighth resistor, a fourth triode, a thirty-second resistor, a thirty-first resistor, a fifth composite triode, a third transient suppression diode, a thirty-sixth capacitor, a thirty-seventh capacitor, a fourth transient suppression diode, a first fuse, where the fifth composite triode includes a first sub-triode and a second sub-triode; The first pin of the said thirty-second chip is connected to the 12V voltage, the second pin of the thirty-second chip is grounded, the sixth pin of the thirty-second chip is connected to the input voltage V+ terminal, the twelfth pin of the thirty-second chip is grounded, the thirteenth pin of the thirty-second chip is connected to the first end of the eighth resistor, and the second end of the eighth resistor is grounded; The drains of the third MOS transistor and the fourth MOS transistor are both connected to the input voltage V+ terminal. The gate of the third MOS transistor is connected to the first terminal of the twenty-seventh resistor, and the gate of the fourth MOS transistor is connected to the first terminal of the twenty-eighth resistor. The second terminals of the twenty-seventh resistor and the twenty-eighth resistor are connected to the fourth terminal of the thirty-second chip. The sources of the third MOS transistor and the fourth MOS transistor are both connected to the emitter of the fourth triode, the first terminal of the thirty-first resistor, the cathode of the third transient suppression diode, the third terminal of the thirty-second chip, and the first terminal of the output port. The base of the fourth triode is connected to the first terminal of the thirty-second resistor, and the second terminal of the thirty-second resistor is connected to the second terminal of the thirty-first resistor and the emitter of the second sub-transistor of the fifth composite transistor. In the fifth composite transistor, the collectors of the first sub-transistor and the second sub-transistor are both grounded. The base of the second sub-transistor is connected to the emitter of the first sub-transistor. The bases of the first sub-transistor and the fourth triode are both connected to the fifth terminal of the thirty-second chip. The anode of the third transient suppression diode and the second terminal of the output port are both grounded; The first terminals of the thirty-sixth capacitor, the thirty-seventh capacitor, the fourth transient suppression diode, and the first fuse are all connected to the input voltage V+ terminal. The second terminals of the thirty-sixth capacitor, the thirty-seventh capacitor, and the fourth transient suppression diode are all grounded. The second terminal of the first fuse is connected to the first terminal of the control port, and the second terminal of the control port is grounded.

3. A distributed measurement system for strain acquisition according to claim 2, characterized in that, The second power supply and signal line automatic switching module of the full-bridge strain monitoring system includes a first TVS diode, a thirteenth resistor, a fourteenth resistor, a third chip, a first capacitor, a second capacitor, a second rectifier bridge, a fourth resistor, an eighth resistor, a first triode, a sixth resistor, a tenth resistor, a third diode, a third capacitor, a third resistor, a first chip, an eleventh resistor, a twelfth resistor, a fourth capacitor, a second diode, a first inductor, a ninth capacitor, a first resistor, and a 5V control diode; The first terminal of the first TVS diode is connected to the first terminal of the control bus, and the second terminal of the first TVS diode is connected to the second terminal of the control bus; The first terminal of the third chip is connected to the 5V voltage. The second terminal of the third chip is connected to the first terminal of the thirteenth resistor. The third terminal of the third chip is connected to the first terminal of the fourteenth resistor. The eighth terminal of the third chip is grounded. The second terminals of the thirteenth resistor and the fourteenth resistor are both connected to the second MCU; The first terminal of the first capacitor is connected to the first terminal of the control bus and the third terminal of the second rectifier bridge respectively. The first terminal of the second capacitor is connected to the second terminal of the control bus and the fourth terminal of the second rectifier bridge respectively. The second terminals of the first capacitor and the second capacitor are both grounded. The second terminal of the second rectifier bridge is grounded. The first terminal of the second rectifier bridge is connected to the first terminal of the fourth resistor, the collector of the first triode and the anode of the third diode. The second terminal of the fourth resistor is connected to the sixth terminal of the third chip and the first terminal of the eighth resistor. The second terminal of the eighth resistor is grounded. The base of the first triode is connected to the first terminal of the sixth resistor, and the emitter is connected to the first terminal of the tenth resistor. The second terminal of the sixth resistor is connected to the fifth terminal of the third chip. The second terminal of the tenth resistor is grounded. The cathode of the third diode is connected to the first terminal of the third capacitor, the first terminal of the third resistor and the sixth terminal of the first chip. The second terminal of the third capacitor is grounded. The second terminal of the third resistor is connected to the seventh terminal of the first chip. The first terminal of the first chip is connected to the seventh terminal and the eighth terminal. The second terminal of the first chip is connected to the cathode of the second diode and the first terminal of the first inductor. The third terminal of the first chip is connected to the first terminal of the fourth capacitor. The fourth terminal of the first chip, the second terminal of the fourth capacitor and the anode of the second diode are grounded. The fifth terminal of the first chip is connected to the first terminal of the eleventh resistor and the first terminal of the twelfth resistor. The second terminal of the twelfth resistor is grounded. The second terminal of the eleventh resistor, the second terminal of the first inductor and the first terminal of the ninth capacitor are connected to the 5V voltage. The second terminal of the ninth capacitor is grounded; The first terminal of the first resistor is connected to the 5V voltage, and the second terminal is connected to the anode of the 5V control diode. The cathode of the 5V control diode is grounded.

4. A distributed measurement system for strain acquisition according to claim 3, characterized in that, The second terminal of the twenty-seventh resistor of the first power supply and signal line automatic switching module of the strain acquisition main control system is the BH terminal. The collector of the fourth triode is the BL terminal. The cathode of the third transient suppression diode is the L+ terminal. The first terminal of the first capacitor and the second terminal of the second capacitor of the second power supply and signal line automatic switching module of the full-bridge strain monitoring system are the PBUS1 terminal and the PBUS2 terminal respectively. The second terminal of the fourth resistor is the PB_PI terminal. The second terminal of the sixth resistor is the PB_PO terminal; When the strain acquisition main control system sends a control signal to the full-bridge strain monitoring system, the first power supply and signal line automatic switching module modulates the signal. Among them, the third MOS transistor and the fourth MOS transistor are used to control the interaction between the modulation signal and the carrier signal. The fourth triode and the fifth composite triode are used to modulate the carrier signal, and the third transient suppression diode is also used for voltage stabilization; then it is sent to the PBUS1 terminal or the PBUS2 terminal of the second power supply and signal line automatic switching module through the L+ terminal. When there is a voltage fluctuation between the PBUS1 terminal and the PBUS2 terminal, it is sent to the third chip through the PB_PI terminal to be converted into a TTL level, and then sent to the STM32 chip of the first MCU for corresponding control; When the strain acquisition master control system receives the signal fed back by the full-bridge strain monitoring system, the STM32 chip of the second MCU of the second power supply and signal line automatic switching module sends the signal to the third chip for level conversion, and then sends it to the PB_PO terminal through the third chip. At this time, the base of the first triode is at a high level, the triode conducts, pulls down the input voltage V+, the load current instantaneously increases, and the first power supply and signal line automatic switching module of the strain acquisition master control system modulates the signal through the BH terminal and the BL terminal to detect the current fluctuation between the PBUS1 terminal and the PBUS2 terminal, and conducts signal communication through the thirty-second chip, and finally transmits it to the PC terminal through the USB 2 UART module.

5. A distributed measurement system for strain acquisition according to claim 1, characterized in that, The strain detection module detects and acquires strain signals by lapping strain gauges, and also converts the detected data based on the analog-to-digital conversion chip of model CS1237-SOP8, and the output of the analog-to-digital conversion chip is a digital output.

6. A distributed measurement system for strain acquisition according to claim 1, characterized in that, The 4-wire PT100 temperature measurement module measures temperature based on the 4-wire PT100 in a way that provides a constant current based on an equivalent current source. After being amplified by two amplifiers respectively and calculating the amplification factor, the resistance value of the 4-wire PT100 is calculated, and the current temperature value is obtained based on the look-up table.

7. A distributed measurement system for strain acquisition according to claim 6, characterized in that, The look-up table is a look-up table of the resistance values of the 4-wire PT100 and the corresponding temperatures.

Images