A micro-dewar activation system and activation method

Abstract

The present invention relates to a micro-dewar activation system and activation method, and to the technical field of infrared detectors. In the embodiment of the present application, a signal acquisition unit is provided to collect the temperature of a chip in a micro-dewar and the vacuum degree of the micro-dewar; a cooling unit is provided to cool the micro-dewar; a control unit receives the temperature and the vacuum degree, and controls the working state of the activation unit and the cooling unit based on the temperature, and controls the working state of the exhaust table vacuum unit and the activation unit based on the vacuum degree, thereby solving the problem that the process personnel are required to manually adjust the activation current, time, vacuum degree and temperature throughout the existing activation process, resulting in low efficiency and poor reliability of the activation process, and the activation process cannot be recorded, thereby improving the automation degree, activation efficiency and reliability of the getter activation process, and at the same time being able to record detailed information of the activation process, so as to facilitate the control of the activation process.

Description

Technical Field

[0001] The invention relates to the technical field of infrared detectors, and in particular to a micro-Dewar activation system and an activation method. Background Art

[0002] Micro Dewar is mainly used in refrigerated semiconductor infrared detectors. In the field of infrared detectors, micro Dewar is used as a carrier for packaging infrared detector chips. It is mainly used to package infrared detector chips into the cavity inside the micro Dewar, and use vacuum exhaust equipment to extract the gas in the micro Dewar cavity to form a high vacuum environment inside the micro Dewar, which is used to maintain the high reliability of the micro Dewar and extend the service life of the infrared detector chip and the micro Dewar.

[0003] In order to obtain a reliable high vacuum environment, a getter is generally installed inside the micro-Dewar chamber to assist the micro-Dewar exhaust process. The getter is a porous material that can use its porous structure to adsorb gas molecules, or react with surrounding gas molecules under the action of external current to consume surrounding gas molecules, thereby improving the vacuum degree of the Dewar chamber. The process of electrifying the getter to make it react is generally called the activation of the micro-Dewar.

[0004] At present, the activation of getters is mainly carried out using simple tooling such as DC power supplies and wires. The activation process requires process personnel to manually adjust the activation current, time, vacuum degree, temperature, etc., which makes the activation process inefficient and unreliable, and it is impossible to record the activation process. Summary of the invention

[0005] The embodiment of the present invention provides a micro-Dewar activation system and activation method, which can solve the problem that the process personnel need to manually adjust the activation current, time, vacuum degree and temperature throughout the existing activation process, resulting in low efficiency and poor reliability of the activation process, and the activation process cannot be recorded.

[0006] In a first aspect, an embodiment of the present application provides a micro-Dewar activation system, comprising:

[0007] A signal acquisition unit, used to collect the temperature of the chip in the micro-Dewar and the vacuum degree of the micro-Dewar;

[0008] An exhaust table vacuum unit, used for evacuating the micro-Dewar;

[0009] an activation unit, used for activating the getter in the micro-Dewar;

[0010] A cooling unit, used for cooling the micro-Dewar; and

[0011] A control unit is connected to the signal acquisition unit, the activation unit and the cooling unit, and is used to receive the temperature and the vacuum degree, and control the working states of the activation unit and the cooling unit based on the temperature, and control the working states of the exhaust table vacuum unit and the activation unit based on the vacuum degree.

[0012] In one embodiment, the exhaust table vacuum unit includes a vacuum gauge, which is connected to the signal acquisition unit; the micro-Dewar includes a temperature sensing element, which is connected to the signal acquisition unit.

[0013] In one embodiment, the activation unit is a constant current power supply.

[0014] In one embodiment, the cooling unit includes: a high-pressure gas source for providing cooling gas; a cooling device connected to the high-pressure gas source and inserted into the cold finger tube of the micro-Dewar, blowing the cooling gas to the cold finger tube to reduce the temperature of the micro-Dewar; a controllable pressure regulating valve, arranged between the high-pressure gas source and the cooling device, for adjusting the pressure of the cooling gas provided by the high-pressure gas source.

[0015] In one embodiment, the cooling device includes a horizontal pipe section and an inclined pipe section, a preset gap is provided between the horizontal pipe section and the inner wall of the cold finger tube, a preset angle is provided between the inclined pipe section and the horizontal pipe section, and the inclined pipe section is used to guide the cooling gas blown into the cold finger tube to form a cooling circuit.

[0016] In one embodiment, the cooling device includes a spiral coil and a throttling device; one end of the spiral coil is connected to the controllable pressure regulating valve, and the other end of the spiral coil is connected to the throttling device.

[0017] In a second aspect, an embodiment of the present application provides a micro-Dewar activation method, comprising:

[0018] Connect the signal acquisition unit, the exhaust stage vacuum unit and the activation unit to the micro-Dewar respectively;

[0019] The preset upper limit temperature, the preset lower limit temperature, the vacuum threshold value and the activation current control parameters are set by the control unit;

[0020] activating the getter in the micro-Dewar based on the activation current control parameter;

[0021] The temperature of the chip of the micro-Dewar and the vacuum degree of the micro-Dewar are collected by the signal collection unit;

[0022] controlling the working states of the activation unit and the cooling unit based on the temperature;

[0023] The operating states of the exhaust stage vacuum unit and the activation unit are controlled based on the vacuum degree.

[0024] In one embodiment, the preset upper limit temperature is 80°C, the preset lower limit temperature is 10°C, and the vacuum threshold is 5×10 -4 pa, the activation current control parameters include a plurality of stage current parameters in which the current increases sequentially, and the stage current parameters include a stage current value and a stage activation time.

[0025] In one embodiment, the working states of the activation unit and the cooling unit are controlled based on the temperature, specifically: if the temperature is greater than the preset upper limit temperature, the controllable pressure regulating valve of the cooling unit is adjusted to increase the pressure of the cooling gas output by the high-pressure gas source, and / or the activation unit is closed; if the temperature is less than or equal to the preset lower limit temperature, the controllable pressure regulating valve of the cooling unit is adjusted to reduce the pressure of the cooling gas output by the high-pressure gas source.

[0026] In one embodiment, the working states of the exhaust table vacuum unit and the activation unit are controlled based on the vacuum degree, specifically: if the vacuum degree is greater than the vacuum degree threshold, the activation unit is closed, and the micro-Dewar is evacuated through the vacuum exhaust unit.

[0027] Compared with the prior art, the embodiment of the present application can collect the temperature of the chip in the micro-Dewar and the vacuum degree of the micro-Dewar by setting a signal acquisition unit; can cool the micro-Dewar by setting a cooling unit; receive the temperature and the vacuum degree through a control unit, and control the working states of the activation unit and the cooling unit based on the temperature, and control the working states of the exhaust table vacuum unit and the activation unit based on the vacuum degree, thereby solving the problem that the process personnel need to manually adjust the activation current, time, vacuum degree and temperature throughout the prior activation process, resulting in low efficiency and poor reliability of the activation process, and unable to record the activation process, thereby improving the automation degree, activation efficiency and reliability of the getter activation process, and at the same time being able to record detailed information of the activation process, so as to facilitate the control of the activation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Hereinafter, the present invention will be described in more detail based on embodiments and with reference to the accompanying drawings.

[0029] Figure 1 is a schematic diagram of a micro-Dewar activation system provided by an embodiment of the present invention;

[0030] Figure 2 is a schematic structural diagram of a cooling device provided by an embodiment of the present invention;

[0031] Figure 3It is a flow chart of a micro-Dewar activation method provided in one embodiment of the present invention.

[0032] Reference numerals:

[0033] 10. Signal acquisition unit; 20. Exhaust table vacuum unit; 30. Activation unit; 410. High-pressure gas source; 420. Cooling device; 4201. Horizontal pipe section; 4202. Inclined pipe section; 4203. Spiral coil; 4204. Throttling device; 430. Controllable pressure regulating valve; 50. Control unit; 60. Micro Dewar; 610. Getter; 620. Temperature sensing element; 630. Cold finger tube. DETAILED DESCRIPTION

[0034] The present invention will be further described below in conjunction with the accompanying drawings.

[0035] In the field of infrared detectors, micro-dewar is used as a carrier for packaging infrared detector chips. It is mainly used to package infrared detector chips into the cavity inside the micro-dewar, and use vacuum exhaust equipment to extract the gas in the micro-dewar cavity to form a high vacuum environment inside the micro-dewar, so as to maintain the high reliability of the dewar and extend its service life.

[0036] A micro-Dewar is generally composed of a getter, an ohm's ring, an insulator needle, a cold finger tube and other structures. Installing a getter inside the micro-Dewar cavity can assist the micro-Dewar exhaust process. The getter is a porous structure material. Normally, the porous structure can be used to adsorb the gas molecules in the micro-Dewar. At the same time, it can also react with the gas molecules around the getter under the action of external current, and use the reaction to consume the gas molecules around the getter, thereby increasing the vacuum degree of the micro-Dewar cavity. The process of electrifying the getter to react is generally called the activation process of the micro-Dewar.

[0037] After the micro-Dewar structure is welded and installed on the exhaust table for exhaust for a period of time, the getter inside the micro-Dewar needs to be powered on and activated. A large amount of heat will be generated during the activation process, which will then be transferred to the components around the getter, causing the temperature of the micro-Dewar to rise. At the same time, as the activation current increases, a large amount of adsorbed gas will be quickly released, causing the vacuum degree of the micro-Dewar to decrease. The current activation process is mainly carried out using simple tooling such as a DC power supply and wiring. The activation process requires the process personnel to operate the entire process. On the one hand, the process personnel need to keep a close eye on the vacuum degree changes of the micro-Dewar 60 and adjust the activation current according to the changes in the vacuum degree of the micro-Dewar; on the other hand, the process personnel also need to cool down the Dewar. The entire activation process takes a long time and must be fully participated by the process personnel. The activation process is inefficient, and the temperature of the micro-Dewar and the vacuum degree of the micro-Dewar cavity during the activation process cannot be fully recorded. At the same time, since the activation process is manually operated by the process personnel, the activation process of each micro-Dewar is actually not completely consistent, which will have a great impact on the process stability.

[0038] In response to the above technical issues, such as Figure 1 , Figure 2 As shown, this embodiment provides a micro-Dewar 60 activation system, including:

[0039] The signal acquisition unit 10 is used to collect the temperature of the chip in the micro Dewar 60 and the vacuum degree of the micro Dewar 60;

[0040] The exhaust stage vacuum unit 20 is used to evacuate the micro Dewar 60;

[0041] An activation unit 30 for activating a getter 610 in the micro-Dewar 60;

[0042] A cooling unit, used for cooling the micro-Dewar 60; and

[0043] The control unit 50 is connected to the signal acquisition unit 10, the activation unit 30 and the cooling unit, and is used to receive the temperature and the vacuum degree, and control the working state of the activation unit 30 and the cooling unit based on the temperature, and control the working state of the exhaust table vacuum unit 20 and the activation unit 30 based on the vacuum degree.

[0044] It should be noted that the signal acquisition unit 10 is connected to the exhaust table vacuum unit 20, and the exhaust table vacuum unit 20 is connected to the micro-Dewar 60 to evacuate the micro-Dewar 60. The signal acquisition unit 10 can collect the vacuum degree of the exhaust table vacuum unit 20, that is, the vacuum degree of the micro-Dewar 60; the signal acquisition unit 10 is connected to the micro-Dewar 60 to collect the temperature in the cavity of the micro-Dewar 60. The temperature and vacuum degree collected by the signal acquisition unit 10 can be adjusted by adjusting the working states of the exhaust table vacuum unit 20, the activation unit 30, and the cooling unit, so that the temperature and vacuum degree of the micro-Dewar 60 meet the requirements of the activation process / use.

[0045] In some embodiments, the exhaust stage vacuum unit 20 includes a vacuum gauge, which is connected to the signal acquisition unit 10 ; the micro-Dewar 60 includes a temperature sensing element 620 , which is connected to the signal acquisition unit 10 .

[0046] It should be noted that when the micro-Dewar 60 is installed on the exhaust table for activation / exhaust process, the exhaust table vacuum unit 20 is connected to the cavity of the micro-Dewar 60. During the activation process, the getter 610 will release a certain amount of gas, which will cause the vacuum degree of the micro-Dewar 60 / exhaust table vacuum unit 20 to deteriorate. The deterioration of the vacuum degree will affect the performance of the infrared detector chip. Therefore, the vacuum degree of the micro-Dewar 60 / exhaust table vacuum unit 20 needs to be detected.

[0047] It should be noted that when the micro-dewar 60 is installed on the exhaust table for the activation process, a large amount of heat will be generated. This heat will increase the temperature of the micro-dewar 60, and the temperature increase will affect the performance and service life of the infrared detector chip. Therefore, the temperature of the micro-dewar 60 needs to be detected, wherein the temperature sensing element 620 is usually arranged next to the infrared detector chip to accurately detect the temperature of the infrared detector chip.

[0048] It should be noted that the temperature sensing element 620 is a temperature measuring transistor. In order to improve the accuracy of temperature detection, during the activation process, the signal acquisition unit 10 sends a bias current value to the base of the temperature measuring transistor and collects the voltage value of the temperature measuring transistor. By using the temperature calibration data of the temperature measuring transistor, the current temperature of the temperature measuring transistor can be accurately determined.

[0049] It should be noted that the activation unit 30 is usually an activation power source, and the activation power source may be a constant current power source.

[0050] In some embodiments, the cooling unit comprises:

[0051] A high pressure gas source 410, for providing cooling gas;

[0052] The cooling device 420 is connected to the high pressure gas source 410 and inserted into the cold finger tube 630 of the micro Dewar 60 to blow the cooling gas to the cold finger tube 630 to reduce the temperature of the micro Dewar 60;

[0053] The controllable pressure regulating valve 430 is disposed between the high-pressure gas source 410 and the cooling device 420 , and is used to adjust the pressure of the cooling gas provided by the high-pressure gas source 410 .

[0054] It should be noted that the high-pressure gas source 410 can be a high-pressure pipeline or a high-pressure gas cylinder. The high-pressure gas source 410 can provide the cooling device 420 with high-pressure gas at room temperature. The high-pressure gas at room temperature is generally a gas that can be used for throttling refrigeration, such as nitrogen, air, etc.; the cooling device 420 is inserted into the cold finger tube 630 of the micro-Dewar 60 to directly cool the infrared detector chip located in the micro-Dewar 60.

[0055] It should be noted that the high-pressure gas source 410 is connected to the controllable pressure regulating valve 430 through a gas pipeline, the controllable pressure regulating valve 430 is connected to the cooling device 420 through a gas pipeline, the controllable pressure regulating valve 430 is connected to the control unit 50, and can accept instructions from the control unit 50 to adjust the pressure of the cooling gas output from the high-pressure gas source 410 to the cooling device 420, thereby adjusting the cooling efficiency of the cooling unit.

[0056] It should be noted that the control unit 50 includes software and hardware for the activation system. The control unit 50 can receive the temperature and vacuum degree of the micro-Dewar 60 collected by the signal acquisition unit 10, and when the temperature of the micro-Dewar 60 is greater than the preset upper limit temperature, adjust the controllable pressure regulating valve 430 of the cooling unit to increase the pressure and flow rate of the cooling gas output by the high-pressure gas source 410, and / or close the activation unit 30; when the temperature of the micro-Dewar 60 is less than or equal to the preset lower limit temperature, adjust the controllable pressure regulating valve 430 of the cooling unit to reduce the pressure and flow rate of the cooling gas output by the high-pressure gas source 410; when the vacuum degree of the micro-Dewar 60 is greater than the vacuum degree threshold, close the activation unit 30, and evacuate the micro-Dewar 60 through the vacuum exhaust unit, so as to realize automatic control of the activation process of the micro-Dewar 60. Among them, the preset upper limit temperature is 80°C, the preset lower limit temperature is 10°C, and the vacuum degree threshold is 5×10 - 4 pa.

[0057] In some embodiments, the cooling device 420 includes a horizontal pipe section 4201 and an inclined pipe section 4202. There is a preset gap between the horizontal pipe section 4201 and the inner wall of the cold finger tube 630, and there is a preset angle between the inclined pipe section 4202 and the horizontal pipe section 4201. The inclined pipe section 4202 is used to guide the cooling gas blown into the cold finger tube 630 to form a cooling circuit.

[0058] It should be noted that the horizontal pipe section 4201 is parallel to the inner wall of the cold finger tube 630 of the micro-dewar 60, and the preset gap between the horizontal pipe section 4201 and the inner wall of the cold finger tube 630 is used to discharge the cooling gas blown from the cooling device 420 to the bottom end of the cold finger tube 630, and the specific value of the preset gap can be set according to actual needs; the left end of the inclined pipe section 4202 is connected to the right end of the horizontal pipe section 4201, and the right end of the inclined pipe section 4202 points to the bottom end of the cold finger tube 630, wherein the preset angle between the inclined pipe section 4202 and the horizontal pipe section 4201 is usually between 90° and 180°, so that the diameter of the right end of the inclined pipe section 4202 is smaller than the diameter of the left end of the inclined pipe section 4202, forming a reduced circular hole, the inclined pipe section 4202 can play a throttling role on the one hand, and on the other hand, can guide the cooling gas blown to the bottom end of the cold finger tube 630 into the preset gap, forming a cooling circuit, thereby improving the cooling efficiency.

[0059] In some embodiments, the cooling device 420 includes a spiral coil 4203 and a throttling device 4204 ; one end of the spiral coil 4203 is connected to the controllable pressure regulating valve 430 , and the other end of the spiral coil 4203 is connected to the throttling device 4204 .

[0060] It should be noted that the use of the spiral coil 4203 can increase the cooling area of ​​the cooling device 420 , and the use of the throttling device 4204 can throttle and cool the cooling gas provided by the high-pressure gas source 410 , thereby improving the cooling efficiency of the cooling device 420 .

[0061] In summary, the embodiment of the present application can collect the temperature of the chip in the micro-Dewar 60 and the vacuum degree of the micro-Dewar 60 by setting the signal acquisition unit 10; can cool the micro-Dewar 60 by setting the cooling unit; by controlling the single receiving temperature and vacuum degree, and controlling the working states of the activation unit 30 and the cooling unit based on the temperature, and controlling the working states of the exhaust table vacuum unit 20 and the activation unit 30 based on the vacuum degree, thereby solving the problem that the process personnel need to manually adjust the activation current, time, vacuum degree and temperature throughout the existing activation process, resulting in low efficiency and poor reliability of the activation process, and being unable to record the activation process, thereby improving the automation degree, activation efficiency and reliability of the activation process of the getter 610, and at the same time being able to record detailed information of the activation process, so as to facilitate the control of the activation process.

[0062] Second, as Figure 3 As shown, this embodiment provides a method for activating a micro-Dewar 60, which is applied to the micro-Dewar 60 activation system described in any embodiment of the first aspect, comprising:

[0063] S101: Connect the signal acquisition unit 10, the exhaust stage vacuum unit 20 and the activation unit 30 to the micro Dewar 60 respectively;

[0064] It should be noted that before activating the micro-Dewar 60, the micro-Dewar 60 needs to be placed on the exhaust table, the exhaust table vacuum unit 20 includes a vacuum gauge, the micro-Dewar 60 includes a temperature sensing element 620, the signal acquisition unit 10 is connected to the temperature sensing element 620 in the micro-Dewar 60 through wires and / or tooling, and the activation unit 30 is connected to the getter 610 in the micro-Dewar 60 through wires and / or tooling, wherein the signal acquisition unit 10 is used to collect the temperature and vacuum degree of the micro-Dewar 60; the activation unit 30 is used to activate the micro-Dewar 60; and the exhaust table vacuum unit 20 is used to evacuate the micro-Dewar 60.

[0065] It should be noted that after the signal acquisition unit 10, the exhaust table vacuum unit 20 and the activation unit 30 are respectively connected to the micro-Dewar 60, the cooling device 420 needs to be inserted into the cold finger tube 630 of the micro-Dewar 60 to cool the micro-Dewar 60 during the activation process.

[0066] S102: Setting a preset upper limit temperature, a preset lower limit temperature, a vacuum threshold and an activation current control parameter by the control unit 50;

[0067] In some embodiments, the preset upper limit temperature is 80°C, the preset lower limit temperature is 10°C, and the vacuum threshold is 5×10 -4 pa, the activation current control parameters include a plurality of stage current parameters in which the current increases sequentially, and the stage current parameters include a stage current value and a stage activation time.

[0068] It should be noted that most semiconductor devices usually need to be used at a certain temperature level, so it is necessary to set a preset upper limit temperature and a preset lower limit temperature so that during the activation process, when the temperature of the micro-dewar 60 exceeds the operating temperature of the infrared detector chip, it can be adjusted. This embodiment does not specifically limit the specific values ​​of the preset upper limit temperature and the preset lower limit temperature gauge vacuum threshold, and can be adjusted as needed.

[0069] It should be noted that, usually the activation process is carried out in stages, so it usually has multiple stage current parameters, such as the current parameter of the first stage is 1.5A, the current parameter of the second stage is 2A, the current parameter of the third stage is 2.5A, the current parameter of the fourth stage is 3A, the current parameter of the fifth stage is 3.5A, and the current parameter of the sixth stage is 4A. Usually, the activation time of each stage does not exceed 10 minutes. The specific activation time can be adjusted as needed. By setting multiple stage current parameters, the activation effect of the current can be slowed down to avoid too fast activation process, which will cause the gas release rate of the getter 610 in the micro Dewar 60 to be too fast, causing the vacuum degree to deteriorate rapidly. The specific values ​​of the current parameters of multiple stages can be adjusted as needed.

[0070] S103: activating the getter 610 in the micro Dewar 60 based on the activation current control parameter;

[0071] It should be noted that the activation process can be carried out after setting the preset upper limit temperature, the preset lower limit temperature and the vacuum threshold. Usually, the activation process is activated according to multiple stage activation current parameters. After the activation process is completed, the activation completion prompt will be displayed.

[0072] S104: collecting the temperature of the chip of the micro Dewar 60 and the vacuum degree of the micro Dewar 60 through the signal collection unit 10;

[0073] S105: Controlling the working states of the activation unit 30 and the cooling unit based on the temperature;

[0074] It should be noted that in order to ensure the normal progress of the activation process, the temperature and vacuum degree of the micro-Dewar 60 need to be monitored in real time during the activation process so as to adjust the temperature and vacuum degree of the micro-Dewar 60 in time.

[0075] In some embodiments, the working states of the activation unit 30 and the cooling unit are controlled based on the temperature, specifically: if the temperature is greater than the preset upper limit temperature, the controllable pressure regulating valve 430 of the cooling unit is adjusted to increase the pressure of the cooling gas output by the high-pressure gas source 410, and / or the activation unit 30 is closed; if the temperature is less than or equal to the preset lower limit temperature, the controllable pressure regulating valve 430 of the cooling unit is adjusted to reduce the pressure of the cooling gas output by the high-pressure gas source 410.

[0076] It should be noted that when the temperature is greater than the preset upper limit temperature, the control unit 50 can be used to adjust the controllable pressure regulating valve 430 of the cooling unit to increase the pressure and flow rate of the cooling gas output by the high-pressure gas source 410, and then monitor in real time whether the temperature of the micro-Dewar 60 returns to the normal temperature within a certain period of time. If the temperature of the micro-Dewar 60 returns to the normal temperature, there is no need to close the activation unit 30; if the temperature of the micro-Dewar 60 does not return to the normal temperature, there is no need to close the activation unit 30 to reduce the temperature of the micro-Dewar 60.

[0077] It should be noted that if the temperature is less than or equal to the preset lower limit temperature, the control unit 50 can be used to adjust the controllable pressure regulating valve 430 of the cooling unit to reduce the pressure and flow rate of the cooling gas output by the high-pressure gas source 410, and it can also be further determined whether the vacuum degree of the micro-Dewar 60 is stable within a normal range for a certain period of time. If the vacuum degree of the micro-Dewar 60 is stable within a normal range for a certain period of time, the current value of the activation current can be increased, which can increase the temperature of the micro-Dewar 60 on the one hand and speed up the activation process on the other.

[0078] S106: Controlling the working states of the exhaust stage vacuum unit 20 and the activation unit 30 based on the vacuum degree.

[0079] It should be noted that the activation process is usually to obtain a good vacuum degree, so the vacuum degree of the micro-Dewar 60 needs to be monitored in real time so as to adjust the vacuum degree of the micro-Dewar 60 in time.

[0080] In some embodiments, the working states of the exhaust table vacuum unit 20 and the activation unit 30 are controlled based on the vacuum degree, specifically: if the vacuum degree is greater than the vacuum degree threshold, the activation unit 30 is turned off, and the micro-Dewar 60 is evacuated through the vacuum exhaust unit.

[0081] It should be noted that when performing the activation process, since the getter 610 will release a large amount of gas, the vacuum degree of the micro-dewar 60 and the exhaust table vacuum unit 20 will deteriorate. Therefore, when the vacuum degree is greater than the vacuum degree threshold, the activation unit 30 must be closed, and the micro-dewar 60 must be evacuated through the vacuum exhaust unit, and re-activated when the vacuum degree of the micro-dewar 60 returns to a normal range; if the vacuum degree is less than or equal to the vacuum degree threshold, the activation current can be increased, which can, on the one hand, restore the vacuum degree of the micro-dewar 60 to a normal range; on the other hand, it can speed up the activation process.

[0082] It should be noted that during the activation process, the current value, activation time, vacuum value and other data in the activation current control parameters need to be recorded in real time in order to control and trace the activation process and ensure the reliability of the activation process.

[0083] In summary, compared with the prior art, the embodiment of the present application connects the signal acquisition unit 10, the exhaust table vacuum unit 20 and the activation unit 30 to the micro-Dewar 60 respectively; sets a preset upper limit temperature, a preset lower limit temperature, a vacuum threshold and an activation current control parameter through the control unit 50; collects the temperature of the chip of the micro-Dewar 60 and the vacuum degree of the micro-Dewar 60 through the signal acquisition unit 10; controls the working states of the activation unit 30 and the cooling unit based on the temperature; activates the getter 610 in the micro-Dewar 60 based on the activation current control parameter; controls the working states of the exhaust table vacuum unit 20 and the activation unit 30 based on the vacuum degree, thereby automatically activating the micro-Dewar 60, and automatically adjusting the temperature and vacuum degree of the micro-Dewar 60 during the activation process, thereby saving human resources, improving the efficiency of the activation process, and effectively recording the detailed data of the activation process, thereby improving the reliability and controllability of the activation process.

[0084] It should be understood that, in the description of the present invention, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more. In the description of the present invention, the first feature "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features not being in direct contact but being in contact through another feature between them.

[0085] In the description of the present invention, “on”, “over” and “above” a first feature from a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0086] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0087] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0088] Although the present invention has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced by equivalents without departing from the scope of the present invention. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A micro-Dewar activation system, characterized in that: include: A signal acquisition unit connected to the micro-dewar and used to collect the temperature of the chip in the micro-dewar and the vacuum degree of the micro-dewar; An exhaust table vacuum unit, connected to the micro-Dewar and the signal acquisition unit, and used for evacuating the micro-Dewar; The exhaust table vacuum unit includes a vacuum gauge, and the vacuum gauge is connected to the signal acquisition unit; An activation unit, used to activate the getter in the micro-Dewar; the activation unit is a constant current power supply; A cooling unit is used to cool the micro-Dewar; the cooling unit includes a high-pressure gas source, a cooling device and a controllable pressure regulating valve; the high-pressure gas source is used to provide cooling gas; the cooling device is connected to the high-pressure gas source, inserted into the cold finger tube of the micro-Dewar, and blows the cooling gas to the cold finger tube to reduce the temperature of the micro-Dewar; the controllable pressure regulating valve is arranged between the high-pressure gas source and the cooling device, and is used to adjust the pressure of the cooling gas provided by the high-pressure gas source; as well as A control unit connected to the signal acquisition unit, the activation unit and the cooling unit, for receiving the temperature and the vacuum degree, and controlling the working states of the activation unit and the cooling unit based on the temperature, and controlling the working states of the exhaust table vacuum unit and the activation unit based on the vacuum degree; the control unit is used to receive the temperature and vacuum degree of the micro-Dewar collected by the signal acquisition unit, and when the temperature is greater than a preset upper limit temperature, adjust the controllable pressure regulating valve to increase the pressure and flow of the cooling gas output by the high-pressure gas source, and / or close the activation unit; When the temperature is less than or equal to the preset lower limit temperature, the controllable pressure regulating valve is adjusted to reduce the pressure and flow rate of the cooling gas output by the high-pressure gas source; when the vacuum degree is greater than the vacuum degree threshold, the activation unit is closed, and the micro-Dewar is evacuated through the vacuum exhaust unit to achieve automatic control of the micro-Dewar activation process.

2. The micro-Dewar activation system according to claim 1, characterized in that: The micro-Dewar includes a temperature sensing element, and the temperature sensing element is connected to the signal acquisition unit.

3. The micro-Dewar activation system according to claim 1, characterized in that: The cooling device includes a horizontal pipe section and an inclined pipe section. There is a preset gap between the horizontal pipe section and the inner wall of the cold finger tube, and there is a preset angle between the inclined pipe section and the horizontal pipe section. The inclined pipe section is used to guide the cooling gas blown into the cold finger tube to form a cooling circuit.

4. The micro-Dewar activation system according to claim 1, characterized in that: The cooling device comprises a spiral coil and a throttling member; One end of the spiral coil is connected to the controllable pressure regulating valve, and the other end of the spiral coil is connected to the throttling element.

5. A micro-Dewar activation method, applied to the micro-Dewar activation system as claimed in any one of claims 1 to 4, characterized in that: include: Connect the signal acquisition unit, the exhaust stage vacuum unit and the activation unit to the micro-Dewar respectively; The preset upper limit temperature, the preset lower limit temperature, the vacuum threshold value and the activation current control parameters are set by the control unit; activating the getter in the micro-Dewar based on the activation current control parameter; The temperature of the chip of the micro-Dewar and the vacuum degree of the micro-Dewar are collected by the signal collection unit; controlling the working states of the activation unit and the cooling unit based on the temperature; The operating states of the exhaust stage vacuum unit and the activation unit are controlled based on the vacuum degree.

6. The micro-Dewar activation method according to claim 5, characterized in that: The preset upper limit temperature is 80°C, the preset lower limit temperature is 10°C, the vacuum threshold is 5×10-4Pa, and the activation current control parameters include multiple stage current parameters in which the current increases successively, and the stage current parameters include stage current values ​​and stage activation times.

7. The micro-Dewar activation method according to claim 5, characterized in that: The controlling the working states of the activation unit and the cooling unit based on the temperature is specifically: If the temperature is greater than the preset upper limit temperature, the controllable pressure regulating valve of the cooling unit is adjusted to increase the pressure of the cooling gas output by the high-pressure gas source, and / or the activation unit is turned off; If the temperature is less than or equal to the preset lower limit temperature, the controllable pressure regulating valve of the cooling unit is adjusted to reduce the pressure of the cooling gas output by the high-pressure gas source.

8. The micro-Dewar activation method according to claim 5, characterized in that: The controlling of the working states of the exhaust table vacuum unit and the activation unit based on the vacuum degree is specifically: If the vacuum degree is greater than the vacuum degree threshold, the activation unit is turned off, and the micro-Dewar is evacuated through the vacuum exhaust unit.

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