A method and system for appearance detection and analysis of a solar cell chip

Abstract

This invention discloses a method and system for appearance inspection and analysis of solar cell chips. The method includes: analyzing a second appearance image with a corresponding standard appearance image, and identifying the second appearance image as an abnormal second appearance image based on the analysis results; acquiring a third appearance image set at a third time point, and determining whether the similarity between a third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold; if it is greater than the second preset threshold, identifying the third appearance image as an abnormal third appearance image, and updating the abnormal appearance image set based on the abnormal third appearance image; and analyzing the appearance image set of at least one chip under test within a continuous period based on the updated abnormal appearance image set. This method solves the problem of poor detection accuracy caused by the single template image used in traditional appearance inspection comparisons.

Description

Technical Field

[0001] This invention belongs to the field of battery chip testing technology, and particularly relates to a method and system for appearance inspection and analysis of solar cell chips. Background Technology

[0002] In the photovoltaic industry, during the production of cadmium telluride thin-film solar cells, after the PN junction coating is completed, the chip film surface needs to undergo a cadmium chloride solution roller coating process. After this roller coating process, the quality of each chip film surface and light-receiving surface needs to be inspected on the first conveyor roller after the coating process area to check for cadmium chloride solution residue and uneven coating. In addition, if residual liquid appears at the tail of the chip, it will soak into the conveyor roller shaft, which will contaminate the light-receiving surface of the chip during chip transport and remain on the light-receiving surface (this phenomenon is also difficult to detect). Currently, the production cycle of each chip is 48 seconds. It is too difficult for humans to monitor the quality and appearance of each chip. It requires a lot of manpower and energy and cannot achieve precise control. Occasionally, batch production accidents will occur, causing significant losses to the company. Summary of the Invention

[0003] This invention provides a method and system for appearance inspection and analysis of solar cell chips, which solves the technical problem of the inability to perform real-time inspection of the film surface appearance of solar cell chips.

[0004] In a first aspect, the present invention provides a method for appearance inspection and analysis of solar cell chips, comprising:

[0005] Acquire a set of appearance images of at least one chip under test over a continuous period of time, wherein the set of appearance images contains appearance images of various regions of the chip under test.

[0006] A first appearance image set at a first time and a second appearance image set at a second time are obtained, and it is determined whether the similarity between each first appearance image in the first appearance image set and the corresponding second appearance image in the second appearance image set is greater than a first preset threshold. The first time and the second time are two adjacent times, and the first time is earlier than the second time.

[0007] If the similarity between a certain first appearance image and a corresponding certain second appearance image is not greater than a first preset threshold, then the certain second appearance image and a corresponding certain standard appearance image are analyzed, and the certain second appearance image is stored as an abnormal second appearance image in a preset abnormal appearance image set according to the analysis result. The certain standard appearance image is the appearance image of a certain area of ​​a normal standard chip.

[0008] Acquire a third set of appearance images at a third time point, and determine whether the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, wherein the certain third appearance image and the abnormal second appearance image are appearance images of the same area of ​​different chips under test.

[0009] If the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, then the certain third appearance image is regarded as an abnormal third appearance image, and the abnormal appearance image set is updated according to the abnormal third appearance image.

[0010] The appearance image set of at least one chip under test is analyzed based on the updated abnormal appearance image set over a continuous period of time, and an early warning is issued for the appearance condition of the at least one chip under test based on the analysis results.

[0011] In a second aspect, the present invention provides an appearance inspection and analysis device for solar cell chips, comprising:

[0012] The acquisition module acquires a set of appearance images of at least one chip under test over a continuous period of time, the set of appearance images containing appearance images of various regions of the chip under test.

[0013] The first judgment module is configured to acquire a first appearance image set at a first time and a second appearance image set at a second time, and to determine whether the similarity between each first appearance image in the first appearance image set and the corresponding second appearance image in the second appearance image set is greater than a first preset threshold, wherein the first time and the second time are two adjacent times, and the first time is earlier than the second time.

[0014] The analysis module is configured to analyze the second appearance image and the corresponding standard appearance image if the similarity between a first appearance image and the corresponding second appearance image is not greater than a first preset threshold, and store the second appearance image as an abnormal second appearance image in a preset abnormal appearance image set according to the analysis result. The standard appearance image is the appearance image of a certain area of ​​a normal standard chip.

[0015] The second judgment module is configured to acquire a third appearance image set at a third time and determine whether the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, wherein the certain third appearance image and the abnormal second appearance image are appearance images of the same area of ​​different chips under test.

[0016] The update module is configured to, if the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, then the certain third appearance image is regarded as an abnormal third appearance image, and the abnormal appearance image set is updated according to the abnormal third appearance image.

[0017] The early warning module is configured to analyze the appearance image set of at least one chip under test over a continuous period of time based on the updated abnormal appearance image set, and issue an early warning on the appearance condition of the at least one chip under test based on the analysis results.

[0018] Thirdly, an electronic device is provided, comprising: at least one processor, and a memory communicatively connected to the at least one processor, wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to perform the steps of the appearance inspection and analysis method for solar cell chips according to any embodiment of the present invention.

[0019] Fourthly, the present invention also provides a computer-readable storage medium having a computer program stored thereon, wherein when the program instructions are executed by a processor, the processor performs the steps of the appearance inspection and analysis method for solar cell chips according to any embodiment of the present invention.

[0020] The solar cell chip appearance inspection and analysis method and system of this application compares abnormal appearance images captured during the shooting process with the appearance images at the next moment. Compared with comparing chip images on the production line with template images, this method better meets the actual appearance inspection needs. Furthermore, by constructing an abnormal appearance image set, it can collect defects in different areas at different times, which can better support the comparison at the next moment. This solves the problem of poor detection accuracy caused by the single template image in traditional appearance inspection comparison. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A flowchart illustrating an appearance inspection and analysis method for solar cell chips according to an embodiment of the present invention;

[0023] Figure 2 This is a structural block diagram of an appearance inspection and analysis system for solar cell chips provided in an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Please see Figure 1 The diagram shows a flowchart of an appearance inspection and analysis method for a solar cell chip according to this application.

[0027] like Figure 1 As shown, the appearance inspection and analysis method for solar cell chips specifically includes the following steps:

[0028] Step S101: Obtain a set of appearance images of at least one chip under test over a continuous period of time, wherein the set of appearance images includes appearance images of various regions of the chip under test.

[0029] In this step, the chip under test refers to a chip whose presence of defects is uncertain and requires defect detection. The appearance images may include a front view and / or a back view of the chip; the front and back views are relative.

[0030] Step S102: Obtain a first appearance image set at a first time and a second appearance image set at a second time, and determine whether the similarity between each first appearance image in the first appearance image set and the corresponding second appearance image in the second appearance image set is greater than a first preset threshold, wherein the first time and the second time are two adjacent times, and the first time is earlier than the second time.

[0031] In this step, if the similarity between a certain first appearance image and a certain corresponding second appearance image is greater than a first preset threshold, then the third appearance image set at the third time point is obtained, and it is determined whether the similarity between a certain third appearance image in the third appearance image set and a certain second appearance image is greater than the first preset threshold; if the similarity between a certain third appearance image in the third appearance image set and a certain second appearance image is greater than the first preset threshold, then the certain third appearance image is analyzed with a certain corresponding standard appearance image.

[0032] Step S103: If the similarity between a certain first appearance image and a corresponding certain second appearance image is not greater than a first preset threshold, then the certain second appearance image and a corresponding certain standard appearance image are analyzed, and the certain second appearance image is stored as an abnormal second appearance image in a preset abnormal appearance image set according to the analysis result. The certain standard appearance image is the appearance image of a certain area of ​​a normal standard chip.

[0033] In this step, if the similarity between a first appearance image and a corresponding second appearance image is not greater than a first preset threshold, then a standard appearance image with the same region as the second appearance image is searched in the standard appearance image set; it is determined whether the similarity between the second appearance image and the standard appearance image is greater than the first preset threshold; if the similarity between the second appearance image and the standard appearance image is not greater than the first preset threshold, then the second appearance image is defined as an abnormal second appearance image, and an early warning is issued for the appearance of a chip under test corresponding to the second appearance image.

[0034] Specifically, if the similarity between a first appearance image and a corresponding second appearance image is not greater than a first preset threshold, it is further determined whether the second appearance image is consistent with a corresponding standard appearance image. If they are inconsistent, it indicates that the second appearance image is abnormal, which can further determine that the chip under test captured at the second moment has defects, thus improving the accuracy of the analysis.

[0035] Step S104: Obtain the third appearance image set at the third time point, and determine whether the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, wherein the certain third appearance image and the abnormal second appearance image are appearance images of the same area of ​​different chips under test.

[0036] In this step, if the similarity between a certain second appearance image and a certain standard appearance image is greater than a first preset threshold, then the certain second appearance image is defined as a normal second appearance image.

[0037] Step S105: If the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, then the certain third appearance image is regarded as an abnormal third appearance image, and the abnormal appearance image set is updated according to the abnormal third appearance image.

[0038] In this step, if the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is not greater than a second preset threshold, then the certain third appearance image is defined as a normal second appearance image, and the fourth appearance image set at the fourth time is obtained, and it is determined whether the similarity between a certain fourth appearance image in the fourth appearance image set and the abnormal second appearance image is greater than the second preset threshold.

[0039] It should be noted that updating the abnormal appearance image set based on the abnormal third appearance image includes: replacing the corresponding abnormal second appearance image with the abnormal third appearance image to obtain the updated abnormal appearance image set.

[0040] For example, appearance images A, B, C, D, and E. Among them, only appearance image B is abnormal.

[0041] First, after comparing and analyzing the appearance image A with the standard image, if the similarity is greater than the first preset threshold, then the appearance image A is determined to be normal. At this time, after comparing and analyzing the appearance image A with the appearance image B, if the similarity is not greater than the first preset threshold, then comparing the appearance image B with the standard image, if the similarity is not greater than the second preset threshold, then the appearance image B is determined to be abnormal, and the appearance image B is used as the new standard image for subsequent analysis of appearance images C, D, and E.

[0042] Step S106: Analyze the appearance image set of at least one chip under test over a continuous period of time based on the updated abnormal appearance image set, and issue an early warning on the appearance condition of the at least one chip under test based on the analysis results.

[0043] In summary, the method of this application, by using abnormal appearance images during the shooting process as comparisons for appearance images at the next moment, better meets the actual appearance inspection needs compared to comparing chip images on the production line with template images. Furthermore, the construction of an abnormal appearance image set can collect defects in different areas at different times, providing better support for comparison at the next moment. This solves the problem of poor detection accuracy caused by the single template image in traditional appearance inspection comparison.

[0044] Please see Figure 2 The diagram shows a structural block diagram of a solar cell chip appearance inspection and analysis system according to this application.

[0045] like Figure 2 As shown, the appearance inspection and analysis system 200 includes an acquisition module 210, a first judgment module 220, an analysis module 230, a second judgment module 240, an update module 250, and an early warning module 260.

[0046] The module 210 acquires a set of appearance images of at least one chip under test over a continuous period of time, the set of appearance images including appearance images of various regions of the chip under test; the first judgment module 220 is configured to acquire a first set of appearance images at a first time and a second set of appearance images at a second time, and to determine whether the similarity between each first appearance image in the first set of appearance images and the corresponding second appearance image in the second set of appearance images is greater than a first preset threshold, wherein the first time and the second time are two adjacent times, and the first time is earlier than the second time; the analysis module 230 is configured to analyze the second appearance image and its corresponding standard appearance image if the similarity between a certain first appearance image and a certain corresponding second appearance image is not greater than the first preset threshold, and to store the second appearance image as an abnormal second appearance image in a preset abnormal appearance image set according to the analysis result. The first standard appearance image is the appearance image of a certain area of ​​a normal standard chip; the second judgment module 240 is configured to acquire a third appearance image set at a third time and determine whether the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, wherein the certain third appearance image and the abnormal second appearance image are appearance images of the same area of ​​different chips under test; the second update module 250 is configured to, if the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than the second preset threshold, then regard the certain third appearance image as an abnormal third appearance image and update the abnormal appearance image set according to the abnormal third appearance image; the third warning module 260 is configured to, based on the updated abnormal appearance image set, analyze the appearance image set of at least one chip under test within a continuous period of time, and issue a warning about the appearance of the at least one chip under test based on the analysis results.

[0047] It should be understood that Figure 2 The modules and references described in the document Figure 1 The steps described in the text correspond to those in the method described above. Therefore, the operations, features, and corresponding technical effects described above also apply to the method described in the text. Figure 2 The various modules in the document will not be described in detail here.

[0048] In other embodiments, the present invention also provides a computer-readable storage medium having a computer program stored thereon, wherein when the program instructions are executed by a processor, the processor performs the appearance detection and analysis method for solar cell chips in any of the above method embodiments.

[0049] In one embodiment, the computer-readable storage medium of the present invention stores computer-executable instructions, which are configured as follows:

[0050] Acquire a set of appearance images of at least one chip under test over a continuous period of time, wherein the set of appearance images contains appearance images of various regions of the chip under test.

[0051] A first appearance image set at a first time and a second appearance image set at a second time are obtained, and it is determined whether the similarity between each first appearance image in the first appearance image set and the corresponding second appearance image in the second appearance image set is greater than a first preset threshold. The first time and the second time are two adjacent times, and the first time is earlier than the second time.

[0052] If the similarity between a certain first appearance image and a corresponding certain second appearance image is not greater than a first preset threshold, then the certain second appearance image and a corresponding certain standard appearance image are analyzed, and the certain second appearance image is stored as an abnormal second appearance image in a preset abnormal appearance image set according to the analysis result. The certain standard appearance image is the appearance image of a certain area of ​​a normal standard chip.

[0053] Acquire a third set of appearance images at a third time point, and determine whether the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, wherein the certain third appearance image and the abnormal second appearance image are appearance images of the same area of ​​different chips under test.

[0054] If the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, then the certain third appearance image is regarded as an abnormal third appearance image, and the abnormal appearance image set is updated according to the abnormal third appearance image.

[0055] The appearance image set of at least one chip under test is analyzed based on the updated abnormal appearance image set over a continuous period of time, and an early warning is issued for the appearance condition of the at least one chip under test based on the analysis results.

[0056] Computer-readable storage media may include a stored program area and a stored data area, wherein the stored program area may store an operating system and an application program required for at least one function; the stored data area may store data created based on the use of the solar cell chip appearance inspection and analysis system, etc. Furthermore, the computer-readable storage medium may include high-speed random access memory, and may also include memory, such as at least one disk storage device, flash memory device, or other non-volatile solid-state storage device. In some embodiments, the computer-readable storage medium may optionally include memory remotely disposed relative to a processor, and this remote memory may be connected to the solar cell chip appearance inspection and analysis system via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0057] Figure 3 This is a schematic diagram of the structure of the electronic device provided in the embodiment of the present invention, such as... Figure 3 As shown, the device includes a processor 310 and a memory 320. The electronic device may also include an input device 330 and an output device 340. The processor 310, memory 320, input device 330, and output device 340 can be connected via a bus or other means. Figure 3 Taking a bus connection as an example, the memory 320 is the computer-readable storage medium described above. The processor 310 executes various server functions and data processing by running non-volatile software programs, instructions, and modules stored in the memory 320, thereby implementing the solar cell chip appearance inspection and analysis method described in the above embodiment. The input device 330 can receive input digital or character information and generate key signal inputs related to user settings and function control of the solar cell chip appearance inspection and analysis system. The output device 340 may include a display screen or other display device.

[0058] The aforementioned electronic device can execute the method provided in the embodiments of the present invention, and has the corresponding functional modules and beneficial effects for executing the method. Technical details not described in detail in this embodiment can be found in the method provided in the embodiments of the present invention.

[0059] In one implementation, the above-described electronic device is applied to a solar cell chip appearance inspection and analysis system for a client, comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to:

[0060] Acquire a set of appearance images of at least one chip under test over a continuous period of time, wherein the set of appearance images contains appearance images of various regions of the chip under test.

[0061] A first appearance image set at a first time and a second appearance image set at a second time are obtained, and it is determined whether the similarity between each first appearance image in the first appearance image set and the corresponding second appearance image in the second appearance image set is greater than a first preset threshold. The first time and the second time are two adjacent times, and the first time is earlier than the second time.

[0062] If the similarity between a certain first appearance image and a corresponding certain second appearance image is not greater than a first preset threshold, then the certain second appearance image and a corresponding certain standard appearance image are analyzed, and the certain second appearance image is stored as an abnormal second appearance image in a preset abnormal appearance image set according to the analysis result. The certain standard appearance image is the appearance image of a certain area of ​​a normal standard chip.

[0063] Acquire a third set of appearance images at a third time point, and determine whether the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, wherein the certain third appearance image and the abnormal second appearance image are appearance images of the same area of ​​different chips under test.

[0064] If the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, then the certain third appearance image is regarded as an abnormal third appearance image, and the abnormal appearance image set is updated according to the abnormal third appearance image.

[0065] The appearance image set of at least one chip under test is analyzed based on the updated abnormal appearance image set over a continuous period of time, and an early warning is issued for the appearance condition of the at least one chip under test based on the analysis results.

[0066] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods of various embodiments or some parts of embodiments.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for appearance inspection and analysis of solar cell chips, characterized in that, include: Acquire a set of appearance images of at least one chip under test over a continuous period of time, wherein the set of appearance images contains appearance images of various regions of the chip under test. A first appearance image set at a first time and a second appearance image set at a second time are obtained, and it is determined whether the similarity between each first appearance image in the first appearance image set and the corresponding second appearance image in the second appearance image set is greater than a first preset threshold. The first time and the second time are two adjacent times, and the first time is earlier than the second time. If the similarity between a certain first appearance image and a corresponding certain second appearance image is not greater than a first preset threshold, then the certain second appearance image and a corresponding certain standard appearance image are analyzed, and the certain second appearance image is stored as an abnormal second appearance image in a preset abnormal appearance image set according to the analysis result. The certain standard appearance image is the appearance image of a certain area of ​​a normal standard chip. Acquire a third set of appearance images at a third time point, and determine whether the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, wherein the certain third appearance image and the abnormal second appearance image are appearance images of the same area of ​​different chips under test. If the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, then the certain third appearance image is regarded as an abnormal third appearance image, and the abnormal appearance image set is updated according to the abnormal third appearance image. The appearance image set of at least one chip under test is analyzed based on the updated abnormal appearance image set over a continuous period of time, and an early warning is issued for the appearance condition of the at least one chip under test based on the analysis results.

2. The method for appearance inspection and analysis of solar cell chips according to claim 1, characterized in that, After determining whether the similarity between each first appearance image in the first appearance image set and the corresponding second appearance image in the second appearance image set is greater than a first preset threshold, the method further includes: If the similarity between a certain first appearance image and a certain corresponding second appearance image is greater than a first preset threshold, then the third appearance image set at the third time point is obtained, and it is determined whether the similarity between a certain third appearance image in the third appearance image set and a certain second appearance image is greater than the first preset threshold. If the similarity between a third appearance image in the third appearance image set and a second appearance image is greater than a first preset threshold, then the third appearance image is analyzed with a corresponding standard appearance image.

3. The method for appearance inspection and analysis of a solar cell chip according to claim 1, characterized in that, If the similarity between a first appearance image and a corresponding second appearance image is not greater than a first preset threshold, then analyzing the second appearance image and its corresponding standard appearance image includes: If the similarity between a certain first appearance image and a corresponding certain second appearance image is not greater than a first preset threshold, then a certain standard appearance image with the same area as the certain second appearance image is searched in the standard appearance image set. Determine whether the similarity between a certain second appearance image and a certain standard appearance image is greater than a first preset threshold; If the similarity between a certain second appearance image and a certain standard appearance image is not greater than a first preset threshold, then the certain second appearance image is defined as an abnormal second appearance image, and an early warning is issued for the appearance of a certain chip under test corresponding to the certain second appearance image.

4. The method for appearance inspection and analysis of a solar cell chip according to claim 1, characterized in that, After determining whether the similarity between a certain second appearance image and a certain standard appearance image is greater than a first preset threshold, the method further includes: If the similarity between a certain second appearance image and a certain standard appearance image is greater than a first preset threshold, then the certain second appearance image is defined as a normal second appearance image.

5. The method for appearance inspection and analysis of solar cell chips according to claim 1, characterized in that, After determining whether the similarity between a third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, the method further includes: If the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is not greater than a second preset threshold, then the certain third appearance image is defined as a normal second appearance image, and the fourth appearance image set at the fourth time is obtained, and it is determined whether the similarity between a certain fourth appearance image in the fourth appearance image set and the abnormal second appearance image is greater than a second preset threshold.

6. The method for appearance inspection and analysis of a solar cell chip according to claim 1, characterized in that, The step of updating the abnormal appearance image set based on the abnormal third appearance image includes: Replace the corresponding abnormal second appearance image with the abnormal third appearance image to obtain an updated abnormal appearance image set.

7. A device for inspecting and analyzing the appearance of solar cell chips, characterized in that, include: The acquisition module acquires a set of appearance images of at least one chip under test over a continuous period of time, the set of appearance images containing appearance images of various regions of the chip under test. The first judgment module is configured to acquire a first appearance image set at a first time and a second appearance image set at a second time, and to determine whether the similarity between each first appearance image in the first appearance image set and the corresponding second appearance image in the second appearance image set is greater than a first preset threshold, wherein the first time and the second time are two adjacent times, and the first time is earlier than the second time. The analysis module is configured to analyze the second appearance image and the corresponding standard appearance image if the similarity between a first appearance image and the corresponding second appearance image is not greater than a first preset threshold, and store the second appearance image as an abnormal second appearance image in a preset abnormal appearance image set according to the analysis result. The standard appearance image is the appearance image of a certain area of ​​a normal standard chip. The second judgment module is configured to acquire a third appearance image set at a third time and determine whether the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, wherein the certain third appearance image and the abnormal second appearance image are appearance images of the same area of ​​different chips under test. The update module is configured to, if the similarity between a certain third appearance image in the third appearance image set and the abnormal second appearance image is greater than a second preset threshold, then the certain third appearance image is regarded as an abnormal third appearance image, and the abnormal appearance image set is updated according to the abnormal third appearance image. The early warning module is configured to analyze the appearance image set of at least one chip under test over a continuous period of time based on the updated abnormal appearance image set, and issue an early warning on the appearance condition of the at least one chip under test based on the analysis results.

8. An electronic device, characterized in that, include: At least one processor, and a memory communicatively connected to the at least one processor, wherein the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the program is executed by a processor, it implements the method described in any one of claims 1 to 6.

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