A high-speed cutting optimization method and system for Pin needles

Abstract

The present invention discloses a high-speed cutting optimization method and system for pin pins, which relates to the technical field of electronic component processing, including obtaining pin pin material information and electronic component product information, judging whether the pin pin material meets the requirements of the electronic component pin pin, establishing a pin pin cutting optimization model for the electronic component pin pin, optimizing the pin pin cutting parameters based on the pin pin cutting optimization model, obtaining the pin pin cutting parameter information, and cutting the pin pin material at high speed based on the pin pin cutting parameter information. The present invention accurately analyzes the degree of difference between the pin pin material and the actual demand through the pin pin material difference coefficient, accurately identifies abnormal data through the historical pin pin data abnormality index, ensures the stability and reliability of the data, adjusts the pin pin cutting parameters through the pin pin cutting evaluation index, improves production efficiency and product quality, saves resources, enhances product competitiveness, and is easy to adapt to higher process requirements.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component processing, and in particular to a high-speed cutting optimization method and system for a pin. Background Art

[0002] A connector is a device that connects two active devices and transmits current or signals. With the rapid growth of consumer electronics, automotive electronics, and communication terminal markets, the output of connectors has also increased significantly worldwide. Pins are a type of metal material used in connectors to conduct electrical signals. Pin pins are key components of industrial plug-ins and directly determine the quality of the product.

[0003] At present, there are still problems in the cutting of pin pins, such as the inability to accurately analyze the pin pin materials, select suitable pin pin materials for processing, accurately predict the quality of pin pin cutting, accurately evaluate the impact of different cutting parameters on the pin pins of electronic components, and optimize the cutting parameters according to the specific parameters of the electronic components. Summary of the invention

[0004] In order to solve the above technical problems, a high-speed cutting optimization method and system for Pin needles are provided. This technical solution solves the problems raised in the above background technology that it is impossible to accurately analyze the Pin needle materials, select suitable Pin needle materials for processing, accurately predict the Pin needle cutting quality, accurately evaluate the impact of different cutting parameters on the Pin needles of electronic components, and optimize the cutting parameters according to the specific parameters of the electronic components.

[0005] In order to achieve the above purpose, the technical solution adopted by the present invention is:

[0006] A high-speed cutting optimization method for a pin needle comprises:

[0007] Obtaining pin material information and electronic component product information, wherein the pin material information includes pin material type information and pin material specification information;

[0008] According to the pin material information and the electronic component product information, determine whether the pin material meets the pin requirements of the electronic component. If not, the pin material cannot be used. If so, obtain the pin position information and the pin specification information of the electronic component according to the electronic component product information.

[0009] Establishing a Pin cutting optimization model for the Pins of the electronic components, wherein the Pin cutting optimization model is used to predict the output Pin cutting quality status;

[0010] Based on the Pin cutting optimization model, the Pin cutting parameters are optimized to obtain the Pin cutting parameter information;

[0011] Based on the pin cutting parameter information, the pin material is cut at high speed.

[0012] Preferably, judging whether the pin material meets the pin requirements of the electronic component according to the pin material information and the electronic component product information specifically includes:

[0013] According to the electronic component product information, obtain the electronic component pin specification information, wherein the electronic component pin specification information includes the electronic component pin length information and the electronic component pin diameter information;

[0014] Evaluate the difference between the pin material and the pin of the electronic component to obtain the pin material difference coefficient;

[0015] Based on the requirements of electronic component pins, obtain the pin material difference coefficient threshold;

[0016] According to the pin material difference coefficient and the pin material difference coefficient threshold, determine whether the pin material meets the pin requirements of the electronic component;

[0017] If the pin material difference coefficient is higher than the pin material difference coefficient threshold, the pin material cannot be used; if the pin material difference coefficient is lower than the pin material difference coefficient threshold, the pin material can be used.

[0018] The calculation formula of the Pin material difference coefficient is:

[0019]

[0020] In the formula, The pin material difference coefficient of the x-th pin material, is the diameter of the electronic component pin, is the diameter of the Pin material, The cutting impact index of the pin material. is the length of the electronic component pin, is the influence coefficient of the cutting of the Pin material, where ,but ,like ,but , The length of the pin material is cut off.

[0021] Preferably, the step of optimizing the Pin cutting parameters based on the Pin cutting optimization model and obtaining the Pin cutting parameter information specifically includes:

[0022] Acquire historical pin cutting data, wherein the historical pin cutting data includes historical pin cutting length information, historical pin cutting diameter information, and historical pin cutting parameter information;

[0023] According to the historical Pin cutting data, a Pin cutting data training set is obtained;

[0024] Based on the pin cutting data training set, the existing model is trained to obtain the pin cutting optimization model;

[0025] According to the pin position information of the electronic component, the characteristic pin information of the electronic component is obtained;

[0026] According to the characteristic pin information of the electronic component, the pin position coefficient is obtained;

[0027] Based on the pin cutting optimization model and the pin position coefficient, the pin cutting evaluation index is obtained;

[0028] According to the pin cutting evaluation index, pin cutting parameter information is acquired, wherein the pin cutting parameter information includes pin cutting speed information and pin cutting pressure information.

[0029] Preferably, the step of obtaining a training set of Pin cutting data based on historical Pin cutting data specifically includes:

[0030] According to the historical pin cutting data, historical pin performance information is obtained, wherein the historical pin performance information includes historical pin mechanical strength information, historical pin corrosion resistance information, historical pin electrical performance information and historical pin defect information;

[0031] Match the historical Pin performance information with the historical Pin cut-off data to obtain the historical Pin dataset Z, that is:

[0032]

[0033] In the formula, is the historical Pin dataset, The Pin cutting length of the nth group of historical Pin cutting data. It is the pin cutting diameter of the nth group of historical pin cutting data. It is the Pin cutting parameter of the nth group of historical Pin cutting data. The pin quality index of the nth group of historical pin cutting data;

[0034] Among them, the calculation formula of Pin quality index is:

[0035]

[0036] In the formula, For the mechanical strength of the Pin, is the corrosion resistance coefficient of the Pin, is the influence coefficient of the ith electrical index, is the value of the electrical index of the pin i, is the quality influence of the jth defect of the pin, m is the total number of electrical indicators of the pin, and g is the total number of defects of the pin;

[0037] According to the historical Pin data set, based on data processing, a Pin cutting data training set is obtained.

[0038] Preferably, the step of obtaining a Pin cutting data training set based on data processing according to a historical Pin dataset specifically includes:

[0039] According to the historical Pin data set, obtain the historical Pin data interval difference data;

[0040] Get the box plot of historical Pin data interval difference data;

[0041] Perform data analysis on the historical Pin data interval difference data box line chart to obtain the historical Pin data interval difference data threshold;

[0042] According to the historical Pin data interval difference data and the historical Pin data interval difference data threshold, the historical Pin mark data is obtained;

[0043] According to the historical Pin mark data and the historical Pin data set, obtain the historical Pin data abnormality index;

[0044] According to the historical Pin data abnormality index, the historical Pin mark data is screened to obtain the historical Pin abnormality data;

[0045] Remove historical Pin abnormal data and obtain Pin cut data training set;

[0046] Among them, the calculation formula of the historical Pin data abnormality index is:

[0047]

[0048] In the formula, is the historical Pin data anomaly index of the y-th historical Pin mark data, The pin cutting length of the yth historical pin marking data. The pin cutting diameter of the yth historical pin marking data. is the cutting speed of the yth historical Pin mark data, is the cut-off pressure of the yth historical Pin marking data, is the Pin quality index of the yth historical Pin marking data, is the Pin cutting length of the hth group of historical Pin cutting data, is the pin cutting diameter of the hth group of historical pin cutting data, is the cutting speed of the hth group of historical Pin cutting data, is the cut-off pressure of the hth group of historical Pin cut-off data, It is the pin quality index of the hth group of historical pin cutting data.

[0049] Preferably, the obtaining of the Pin cutting parameter information according to the Pin cutting evaluation index specifically includes:

[0050] According to the pin position information of the electronic component, a plane coordinate system is established to obtain the pin position coordinate data;

[0051] According to the Pin position coordinate data, obtain the Pin position index of the electronic component:

[0052]

[0053] In the formula, R is The electronic component pin position index of the electronic component pin, For the The distance between the pin of the first electronic component and the pin of the sth electronic component, Is the total number of electronic component pins;

[0054] Based on the arrangement of the electronic component pin array, obtain the electronic component pin position index range threshold;

[0055] Compare the electronic component pin position index with the electronic component pin position index range threshold to obtain the electronic component feature pin information;

[0056] According to the characteristic pin information of the electronic component, the pin position coefficient is obtained;

[0057] Based on the pin cutting optimization model and the pin position coefficient, the pin cutting evaluation index is obtained;

[0058] Adjust the pin cutting parameters until the pin cutting evaluation index reaches the maximum, and obtain the pin cutting parameter information;

[0059] Among them, the calculation formula of the Pin cutting evaluation index is:

[0060]

[0061] In the formula, is the Pin cutting evaluation index, V is the Pin cutting speed, It is the pin cutting pressure. is the length of the sth electronic component Pin, is the diameter of the material of the pin of the sth electronic component pin, is the energy efficiency factor, is the Pin quality cutting influence coefficient, is the pin position coefficient of the sth electronic component pin, For the The first electronic component pin and the The distance between the characteristic pins of electronic components, It is the total number of characteristic pins of electronic components.

[0062] Furthermore, a high-speed cutting optimization system for Pin needles is proposed, which is used to implement the above-mentioned optimization method, including:

[0063] A main control module, wherein the main control module is used to determine whether the pin material meets the pin requirements of the electronic component according to the pin material information and the electronic component product information, obtain historical pin marking data according to the historical pin data interval difference data and the historical pin data interval difference data threshold, screen the historical pin marking data according to the historical pin data abnormality index, obtain the historical pin abnormality data, obtain the pin cutting data training set according to the historical pin cutting data, train the existing model based on the pin cutting data training set, obtain the pin cutting optimization model, obtain the historical pin data abnormality index according to the historical pin marking data and the historical pin data set, adjust the pin cutting parameters until the pin cutting evaluation index reaches the maximum, and obtain the pin cutting parameter information;

[0064] An information acquisition module, the information acquisition module is used to acquire Pin material information, electronic component product information, Pin material type information and Pin material specification information, acquire electronic component Pin specification information, electronic component Pin length information and electronic component Pin diameter information according to the electronic component product information, acquire historical Pin cutting data, historical Pin cutting length information, historical Pin cutting diameter information and historical Pin cutting parameter information, acquire historical Pin performance information, historical Pin mechanical strength information, historical Pin corrosion resistance information, historical Pin electrical performance information and historical Pin defect information according to the historical Pin cutting data;

[0065] An evaluation module, wherein the evaluation module is used to evaluate the difference between the pin needle material and the pin needle of the electronic component, obtain the pin needle material difference coefficient, obtain the electronic component pin needle position index according to the pin needle position coordinate data, obtain the pin needle position coefficient according to the electronic component characteristic pin needle information, and obtain the pin needle cutting evaluation index based on the pin needle cutting optimization model and the pin needle position coefficient;

[0066] The display module interacts with the main control module and is used to display the Pin cutting evaluation index and the Pin cutting parameter information.

[0067] Optionally, the main control module specifically includes:

[0068] A control unit, the control unit is used to obtain a training set of pin cutting data according to historical pin cutting data, train an existing model based on the training set of pin cutting data, obtain a pin cutting optimization model, obtain an abnormal index of historical pin data according to historical pin marking data and historical pin data sets, adjust pin cutting parameters until the pin cutting evaluation index reaches a maximum, and obtain pin cutting parameter information;

[0069] An information receiving unit, which interacts with the information acquisition module and the evaluation module to receive data and transmit it to the judgment unit;

[0070] A judgment unit, wherein the judgment unit is used to judge whether the pin material meets the pin requirements of the electronic component according to the pin material information and the electronic component product information, obtain historical pin marking data according to the historical pin data interval difference data and the historical pin data interval difference data threshold, and screen the historical pin marking data according to the historical pin data abnormality index to obtain the historical pin abnormality data.

[0071] Optionally, the information acquisition module specifically includes:

[0072] A first acquisition unit, the first acquisition unit is used to acquire Pin needle material information, electronic component product information, Pin needle material type information and Pin needle material specification information, and acquire electronic component Pin needle specification information, electronic component Pin needle length information and electronic component Pin needle diameter information according to the electronic component product information;

[0073] The second acquisition unit is used to acquire historical pin cutting data, historical pin cutting length information, historical pin cutting diameter information and historical pin cutting parameter information, and acquire historical pin performance information, historical pin mechanical strength information, historical pin corrosion resistance information, historical pin electrical performance information and historical pin defect information based on the historical pin cutting data.

[0074] Optionally, the evaluation module specifically includes:

[0075] A material evaluation unit, the material evaluation unit is used to evaluate the difference between the pin material and the pin of the electronic component, and obtain the pin material difference coefficient;

[0076] The cutting evaluation unit is used to obtain the electronic component pin position index according to the pin position coordinate data, obtain the pin position coefficient according to the electronic component characteristic pin information, and obtain the pin cutting evaluation index based on the pin cutting optimization model and the pin position coefficient.

[0077] Compared with the prior art, the present invention has the following beneficial effects:

[0078] The present invention proposes a high-speed cutting optimization method and system for Pin pins, which accurately analyzes the degree of difference between Pin pin materials and actual requirements through the Pin pin material difference coefficient, accurately identifies abnormal data through the historical Pin pin data abnormality index, ensures the stability and reliability of the data, and adjusts the Pin pin cutting parameters through the Pin pin cutting evaluation index, thereby improving production efficiency and product quality, saving resources, enhancing product competitiveness, and facilitating adaptation to higher process requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0079] Figure 1 A flow chart of a high-speed cutting optimization method for Pin needles proposed by the present invention;

[0080] Figure 2 A flow chart for obtaining the Pin material difference coefficient in the present invention;

[0081] Figure 3 It is a flow chart of obtaining the Pin cutting parameter information in the present invention;

[0082] Figure 4 A flowchart for obtaining a Pin cutting data training set in the present invention;

[0083] Figure 5 This is a structural block diagram of a high-speed cutting optimization system for Pin needles proposed by the present invention. DETAILED DESCRIPTION

[0084] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art may think of other obvious variations.

[0085] Reference Figure 1 - Figure 4 As shown, a high-speed cutting optimization method for a Pin needle in an embodiment of the present invention includes:

[0086] Obtaining pin material information and electronic component product information, wherein the pin material information includes pin material type information and pin material specification information;

[0087] According to the pin material information and the electronic component product information, determine whether the pin material meets the pin requirements of the electronic component. If not, the pin material cannot be used. If so, obtain the pin position information and the pin specification information of the electronic component according to the electronic component product information.

[0088] Specifically, according to the pin material information and electronic component product information, it is judged whether the pin material meets the pin requirements of the electronic component, including:

[0089] According to the electronic component product information, obtain the electronic component pin specification information, wherein the electronic component pin specification information includes the electronic component pin length information and the electronic component pin diameter information;

[0090] Evaluate the difference between the pin material and the pin of the electronic component to obtain the pin material difference coefficient;

[0091] Based on the requirements of electronic component pins, obtain the pin material difference coefficient threshold;

[0092] According to the pin material difference coefficient and the pin material difference coefficient threshold, determine whether the pin material meets the pin requirements of the electronic component;

[0093] If the pin material difference coefficient is higher than the pin material difference coefficient threshold, the pin material cannot be used; if the pin material difference coefficient is lower than the pin material difference coefficient threshold, the pin material can be used.

[0094] The calculation formula of the Pin material difference coefficient is:

[0095]

[0096] In the formula, The pin material difference coefficient of the x-th pin material, is the diameter of the electronic component pin, is the diameter of the Pin material, The cutting impact index of the pin material. is the length of the electronic component pin, is the influence coefficient of the cutting of the Pin material, where ,but ,like ,but , The length of the pin material is cut off.

[0097] In this solution, the difference between the pin material and the pin of the electronic component is evaluated to obtain the pin material difference coefficient. According to the pin material difference coefficient and the pin material difference coefficient threshold, it is judged whether the pin material meets the pin requirements of the electronic component, and the difference between the pin material and the actual requirements is accurately analyzed, thereby improving the pin cutting efficiency.

[0098] It can be understood that high-speed cutting of pins refers to cutting off a pin of required length from a longer pin material, so the difference between the pin material and the required pin is crucial.

[0099] Establishing a Pin cutting optimization model for the Pins of the electronic components, wherein the Pin cutting optimization model is used to predict the output Pin cutting quality status;

[0100] Based on the Pin cutting optimization model, the Pin cutting parameters are optimized to obtain the Pin cutting parameter information;

[0101] Specifically, based on the Pin cutting optimization model, the Pin cutting parameters are optimized to obtain Pin cutting parameter information, including:

[0102] Acquire historical pin cutting data, wherein the historical pin cutting data includes historical pin cutting length information, historical pin cutting diameter information, and historical pin cutting parameter information;

[0103] According to the historical Pin cutting data, a Pin cutting data training set is obtained;

[0104] Based on the pin cutting data training set, the existing model is trained to obtain the pin cutting optimization model;

[0105] According to the pin position information of the electronic component, the characteristic pin information of the electronic component is obtained;

[0106] According to the characteristic pin information of the electronic component, the pin position coefficient is obtained;

[0107] Based on the pin cutting optimization model and the pin position coefficient, the pin cutting evaluation index is obtained;

[0108] According to the pin cutting evaluation index, pin cutting parameter information is acquired, wherein the pin cutting parameter information includes pin cutting speed information and pin cutting pressure information.

[0109] Specifically, according to the historical Pin cutting data, a Pin cutting data training set is obtained, which specifically includes:

[0110] According to the historical pin cutting data, historical pin performance information is obtained, wherein the historical pin performance information includes historical pin mechanical strength information, historical pin corrosion resistance information, historical pin electrical performance information and historical pin defect information;

[0111] Match the historical Pin performance information with the historical Pin cut-off data to obtain the historical Pin dataset Z, that is:

[0112] In the formula, is the historical Pin dataset, The Pin cutting length of the nth group of historical Pin cutting data. It is the pin cutting diameter of the nth group of historical pin cutting data. It is the Pin cutting parameter of the nth group of historical Pin cutting data. The pin quality index of the nth group of historical pin cutting data;

[0113] Among them, the calculation formula of Pin quality index is:

[0114]

[0115] In the formula, For the mechanical strength of the Pin, is the corrosion resistance coefficient of the Pin, is the influence coefficient of the ith electrical index, is the value of the electrical index of the pin i, is the quality influence of the jth defect of the pin, m is the total number of electrical indicators of the pin, and g is the total number of defects of the pin;

[0116] According to the historical Pin data set, based on data processing, a Pin cutting data training set is obtained.

[0117] In this scheme, the historical pin performance information is matched with the historical pin cutting data to obtain the historical pin data set. The pin quality index is used to accurately analyze the pin quality under different cutting parameters, thereby improving the stability and accuracy of the pin cutting optimization model.

[0118] The method of obtaining a Pin cutting data training set based on historical Pin data sets and data processing specifically includes:

[0119] According to the historical Pin data set, obtain the historical Pin data interval difference data;

[0120] Get the box plot of historical Pin data interval difference data;

[0121] Perform data analysis on the historical Pin data interval difference data box line chart to obtain the historical Pin data interval difference data threshold;

[0122] According to the historical Pin data interval difference data and the historical Pin data interval difference data threshold, the historical Pin mark data is obtained;

[0123] According to the historical Pin mark data and the historical Pin data set, obtain the historical Pin data abnormality index;

[0124] According to the historical Pin data abnormality index, the historical Pin mark data is screened to obtain the historical Pin abnormality data;

[0125] Remove historical Pin abnormal data and obtain Pin cut data training set;

[0126] Among them, the calculation formula of the historical Pin data abnormality index is:

[0127]

[0128] In the formula, is the historical Pin data anomaly index of the y-th historical Pin mark data, The pin cutting length of the yth historical pin marking data. The pin cutting diameter of the yth historical pin marking data. is the cutting speed of the yth historical Pin mark data, is the cut-off pressure of the yth historical Pin marking data, is the Pin quality index of the yth historical Pin marking data, is the Pin cutting length of the hth group of historical Pin cutting data, is the pin cutting diameter of the hth group of historical pin cutting data, is the cutting speed of the hth group of historical Pin cutting data, is the cut-off pressure of the hth group of historical Pin cut-off data, It is the pin quality index of the hth group of historical pin cutting data.

[0129] In this solution, historical Pin data mark data is obtained through historical Pin data interval difference data and historical Pin data interval difference data threshold, and the historical Pin data is traversed based on the box plot method to mark the data that exceeds the historical Pin data interval difference data threshold. The historical Pin data anomaly index is obtained through the historical Pin mark data and the historical Pin data set. According to the historical Pin data anomaly index, the historical Pin mark data is screened to accurately identify abnormal data, thereby ensuring the stability and reliability of the data.

[0130] Specifically, according to the Pin cutting evaluation index, Pin cutting parameter information is obtained, including:

[0131] According to the pin position information of the electronic component, a plane coordinate system is established to obtain the pin position coordinate data;

[0132] According to the Pin position coordinate data, obtain the Pin position index of the electronic component:

[0133]

[0134] In the formula, R is The electronic component pin position index of the electronic component pin, For the The distance between the pin of the first electronic component and the pin of the sth electronic component, Is the total number of electronic component pins;

[0135] Based on the arrangement of the electronic component pin array, obtain the electronic component pin position index range threshold;

[0136] Compare the electronic component pin position index with the electronic component pin position index range threshold to obtain the electronic component feature pin information;

[0137] According to the characteristic pin information of the electronic component, the pin position coefficient is obtained;

[0138] Based on the pin cutting optimization model and the pin position coefficient, the pin cutting evaluation index is obtained;

[0139] Adjust the pin cutting parameters until the pin cutting evaluation index reaches the maximum, and obtain the pin cutting parameter information;

[0140] Among them, the calculation formula of the Pin cutting evaluation index is:

[0141]

[0142] In the formula, is the Pin cutting evaluation index, V is the Pin cutting speed, It is the pin cutting pressure. is the length of the sth electronic component Pin, is the diameter of the material of the pin of the sth electronic component pin, is the energy efficiency factor, is the Pin quality cutting influence coefficient, is the pin position coefficient of the sth electronic component pin, For the The first electronic component pin and the The distance between the characteristic pins of electronic components, It is the total number of characteristic pins of electronic components.

[0143] In this solution, a plane coordinate system is established through the pin position information of the electronic component, and the pin position coordinate data is obtained. According to the pin position coordinate data, the pin position index of the electronic component is obtained. Based on the pin array arrangement of the electronic component, the pin position index of the electronic component is compared with the pin position index range threshold of the electronic component to obtain the characteristic pin of the electronic component. According to the characteristic pin information of the electronic component, the pin position coefficient is obtained. Based on the pin cutting optimization model and the pin position coefficient, the pin cutting evaluation index is obtained. The pin cutting parameters are adjusted according to the pin cutting evaluation index, which improves production efficiency and product quality, saves resources, enhances product competitiveness, and facilitates adaptation to higher process requirements.

[0144] Based on the pin cutting parameter information, the pin material is cut at high speed.

[0145] Reference Figure 5 As shown, further, in combination with the above-mentioned high-speed cutting optimization method of a Pin needle, a high-speed cutting optimization system of a Pin needle is proposed, including:

[0146] A main control module, wherein the main control module is used to determine whether the pin material meets the pin requirements of the electronic component according to the pin material information and the electronic component product information, obtain historical pin marking data according to the historical pin data interval difference data and the historical pin data interval difference data threshold, screen the historical pin marking data according to the historical pin data abnormality index, obtain the historical pin abnormality data, obtain the pin cutting data training set according to the historical pin cutting data, train the existing model based on the pin cutting data training set, obtain the pin cutting optimization model, obtain the historical pin data abnormality index according to the historical pin marking data and the historical pin data set, adjust the pin cutting parameters until the pin cutting evaluation index reaches the maximum, and obtain the pin cutting parameter information;

[0147] An information acquisition module, the information acquisition module is used to acquire Pin material information, electronic component product information, Pin material type information and Pin material specification information, acquire electronic component Pin specification information, electronic component Pin length information and electronic component Pin diameter information according to the electronic component product information, acquire historical Pin cutting data, historical Pin cutting length information, historical Pin cutting diameter information and historical Pin cutting parameter information, acquire historical Pin performance information, historical Pin mechanical strength information, historical Pin corrosion resistance information, historical Pin electrical performance information and historical Pin defect information according to the historical Pin cutting data;

[0148] An evaluation module, wherein the evaluation module is used to evaluate the difference between the pin needle material and the pin needle of the electronic component, obtain the pin needle material difference coefficient, obtain the electronic component pin needle position index according to the pin needle position coordinate data, obtain the pin needle position coefficient according to the electronic component characteristic pin needle information, and obtain the pin needle cutting evaluation index based on the pin needle cutting optimization model and the pin needle position coefficient;

[0149] The display module interacts with the main control module and is used to display the Pin cutting evaluation index and the Pin cutting parameter information.

[0150] Main control module, including:

[0151] A control unit, the control unit is used to obtain a training set of pin cutting data according to historical pin cutting data, train an existing model based on the training set of pin cutting data, obtain a pin cutting optimization model, obtain an abnormal index of historical pin data according to historical pin marking data and historical pin data sets, adjust pin cutting parameters until the pin cutting evaluation index reaches a maximum, and obtain pin cutting parameter information;

[0152] An information receiving unit, which interacts with the information acquisition module and the evaluation module to receive data and transmit it to the judgment unit;

[0153] A judgment unit, wherein the judgment unit is used to judge whether the pin material meets the pin requirements of the electronic component according to the pin material information and the electronic component product information, obtain historical pin marking data according to the historical pin data interval difference data and the historical pin data interval difference data threshold, and screen the historical pin marking data according to the historical pin data abnormality index to obtain the historical pin abnormality data.

[0154] Information acquisition module, specifically including:

[0155] A first acquisition unit, the first acquisition unit is used to acquire Pin needle material information, electronic component product information, Pin needle material type information and Pin needle material specification information, and acquire electronic component Pin needle specification information, electronic component Pin needle length information and electronic component Pin needle diameter information according to the electronic component product information;

[0156] The second acquisition unit is used to acquire historical pin cutting data, historical pin cutting length information, historical pin cutting diameter information and historical pin cutting parameter information, and acquire historical pin performance information, historical pin mechanical strength information, historical pin corrosion resistance information, historical pin electrical performance information and historical pin defect information based on the historical pin cutting data.

[0157] Assessment modules include:

[0158] A material evaluation unit, the material evaluation unit is used to evaluate the difference between the pin material and the pin of the electronic component, and obtain the pin material difference coefficient;

[0159] The cutting evaluation unit is used to obtain the electronic component pin position index according to the pin position coordinate data, obtain the pin position coefficient according to the electronic component characteristic pin information, and obtain the pin cutting evaluation index based on the pin cutting optimization model and the pin position coefficient.

[0160] To sum up, the advantages of the present invention are: by evaluating the difference between the pin needle material and the pin needle of the electronic component, the pin needle material difference coefficient is obtained, and the difference degree between the pin needle material and the actual demand is accurately analyzed through the pin needle material difference coefficient, and the historical pin needle mark data and the historical pin needle data set are used to obtain the historical pin needle data anomaly index, and the abnormal data is accurately identified through the historical pin needle data anomaly index, thereby ensuring the stability and reliability of the data, and the pin needle cutting evaluation index is obtained through the pin needle cutting optimization model and the pin needle position coefficient, and the pin needle cutting parameters are adjusted through the pin needle cutting evaluation index, thereby improving production efficiency and product quality, saving resources, enhancing product competitiveness, and facilitating adaptation to higher process requirements.

[0161] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A high-speed cutting optimization method for a pin, characterized in that: include: Obtaining pin material information and electronic component product information, wherein the pin material information includes pin material type information and pin material specification information; According to the pin material information and the electronic component product information, determine whether the pin material meets the pin requirements of the electronic component. If not, the pin material cannot be used. If so, obtain the pin position information and the pin specification information of the electronic component according to the electronic component product information. Establishing a Pin cutting optimization model for the Pins of the electronic components, wherein the Pin cutting optimization model is used to predict the output Pin cutting quality status; Based on the Pin cutting optimization model, the Pin cutting parameters are optimized to obtain the Pin cutting parameter information; Based on the Pin cutting parameter information, the Pin material is cut at high speed; The step of optimizing the pin cutting parameters based on the pin cutting optimization model and obtaining the pin cutting parameter information specifically includes: Acquire historical pin cutting data, wherein the historical pin cutting data includes historical pin cutting length information, historical pin cutting diameter information, and historical pin cutting parameter information; According to the historical Pin cutting data, a Pin cutting data training set is obtained; Based on the pin cutting data training set, the existing model is trained to obtain the pin cutting optimization model; According to the pin position information of the electronic component, the characteristic pin information of the electronic component is obtained; According to the characteristic pin information of the electronic component, the pin position coefficient is obtained; Based on the pin cutting optimization model and the pin position coefficient, the pin cutting evaluation index is obtained; According to the Pin cutting evaluation index, Pin cutting parameter information is obtained, wherein the Pin cutting parameter information includes Pin cutting speed information and Pin cutting pressure information; The step of obtaining a training set of Pin cutting data according to historical Pin cutting data specifically includes: According to the historical pin cutting data, historical pin performance information is obtained, wherein the historical pin performance information includes historical pin mechanical strength information, historical pin corrosion resistance information, historical pin electrical performance information and historical pin defect information; Match the historical Pin performance information with the historical Pin cut-off data to obtain the historical Pin dataset Z, that is: In the formula, is the historical Pin dataset, The Pin cutting length of the nth group of historical Pin cutting data. It is the pin cutting diameter of the nth group of historical pin cutting data. It is the Pin cutting parameter of the nth group of historical Pin cutting data. The pin quality index of the nth group of historical pin cutting data; Among them, the calculation formula of Pin quality index is: In the formula, For the mechanical strength of the Pin, is the corrosion resistance coefficient of the Pin, is the influence coefficient of the ith electrical index, is the value of the electrical index of the pin i, is the quality influence of the jth defect of the pin, m is the total number of electrical indicators of the pin, and g is the total number of defects of the pin; According to the historical Pin data set, based on data processing, a Pin cutting data training set is obtained; The step of obtaining the Pin cutting parameter information according to the Pin cutting evaluation index specifically includes: According to the pin position information of the electronic component, a plane coordinate system is established to obtain the pin position coordinate data; According to the Pin position coordinate data, obtain the Pin position index of the electronic component: In the formula, R is The electronic component pin position index of the electronic component pin, For the The distance between the pin of the first electronic component and the pin of the sth electronic component, Is the total number of electronic component pins; Based on the arrangement of the electronic component pin array, obtain the electronic component pin position index range threshold; Compare the electronic component pin position index with the electronic component pin position index range threshold to obtain the electronic component feature pin information; According to the characteristic pin information of the electronic component, the pin position coefficient is obtained; Based on the pin cutting optimization model and the pin position coefficient, the pin cutting evaluation index is obtained; Adjust the pin cutting parameters until the pin cutting evaluation index reaches the maximum, and obtain the pin cutting parameter information; Among them, the calculation formula of the Pin cutting evaluation index is: In the formula, is the Pin cutting evaluation index, V is the Pin cutting speed, It is the pin cutting pressure. is the length of the sth electronic component Pin, is the diameter of the material of the pin of the sth electronic component pin, is the energy efficiency factor, is the Pin quality cutting influence coefficient, is the pin position coefficient of the sth electronic component pin, For the The first electronic component pin and the The distance between the characteristic pins of electronic components, It is the total number of characteristic pins of electronic components.

2. The high-speed cutting optimization method of a pin needle according to claim 1, characterized in that: The step of judging whether the pin material meets the pin requirements of the electronic component according to the pin material information and the electronic component product information specifically includes: According to the electronic component product information, obtain the electronic component pin specification information, wherein the electronic component pin specification information includes the electronic component pin length information and the electronic component pin diameter information; Evaluate the difference between the pin material and the pin of the electronic component to obtain the pin material difference coefficient; Based on the requirements of electronic component pins, obtain the pin material difference coefficient threshold; According to the pin material difference coefficient and the pin material difference coefficient threshold, determine whether the pin material meets the pin requirements of the electronic component; If the pin material difference coefficient is higher than the pin material difference coefficient threshold, the pin material cannot be used; if the pin material difference coefficient is lower than the pin material difference coefficient threshold, the pin material can be used. The calculation formula of the Pin material difference coefficient is: In the formula, The pin material difference coefficient of the x-th pin material, is the diameter of the electronic component pin, is the diameter of the Pin material, The cutting impact index of the pin material. is the length of the electronic component pin, is the influence coefficient of the cutting of the Pin material, where ,but ,like ,but , The length of the pin material is cut off.

3. The high-speed cutting optimization method of a pin according to claim 1, characterized in that: The method of obtaining a Pin cutting data training set based on historical Pin data sets and data processing specifically includes: According to the historical Pin data set, obtain the historical Pin data interval difference data; Get the box plot of historical Pin data interval difference data; Perform data analysis on the historical Pin data interval difference data box line chart to obtain the historical Pin data interval difference data threshold; According to the historical Pin data interval difference data and the historical Pin data interval difference data threshold, the historical Pin mark data is obtained; According to the historical Pin mark data and the historical Pin data set, obtain the historical Pin data abnormality index; According to the historical Pin data abnormality index, the historical Pin mark data is screened to obtain the historical Pin abnormality data; Remove historical Pin abnormal data and obtain Pin cut data training set; Among them, the calculation formula of the historical Pin data abnormality index is: In the formula, is the historical Pin data anomaly index of the y-th historical Pin mark data, The pin cutting length of the yth historical pin marking data. The pin cutting diameter of the yth historical pin marking data. is the cutting speed of the yth historical Pin mark data, is the cut-off pressure of the yth historical Pin marking data, is the Pin quality index of the yth historical Pin marking data, is the Pin cutting length of the hth group of historical Pin cutting data, is the pin cutting diameter of the hth group of historical pin cutting data, is the cutting speed of the hth group of historical Pin cutting data, is the cut-off pressure of the hth group of historical Pin cut-off data, It is the pin quality index of the hth group of historical pin cutting data.

4. A high-speed cutting optimization system for Pin needles, used to implement the optimization method according to any one of claims 1 to 3, characterized in that: include: A main control module, wherein the main control module is used to determine whether the pin material meets the pin requirements of the electronic component according to the pin material information and the electronic component product information, obtain historical pin marking data according to the historical pin data interval difference data and the historical pin data interval difference data threshold, screen the historical pin marking data according to the historical pin data abnormality index, obtain the historical pin abnormality data, obtain the pin cutting data training set according to the historical pin cutting data, train the existing model based on the pin cutting data training set, obtain the pin cutting optimization model, obtain the historical pin data abnormality index according to the historical pin marking data and the historical pin data set, adjust the pin cutting parameters until the pin cutting evaluation index reaches the maximum, and obtain the pin cutting parameter information; An information acquisition module, the information acquisition module is used to acquire Pin material information, electronic component product information, Pin material type information and Pin material specification information, acquire electronic component Pin specification information, electronic component Pin length information and electronic component Pin diameter information according to the electronic component product information, acquire historical Pin cutting data, historical Pin cutting length information, historical Pin cutting diameter information and historical Pin cutting parameter information, acquire historical Pin performance information, historical Pin mechanical strength information, historical Pin corrosion resistance information, historical Pin electrical performance information and historical Pin defect information according to the historical Pin cutting data; An evaluation module, wherein the evaluation module is used to evaluate the difference between the pin needle material and the pin needle of the electronic component, obtain the pin needle material difference coefficient, obtain the electronic component pin needle position index according to the pin needle position coordinate data, obtain the pin needle position coefficient according to the electronic component characteristic pin needle information, and obtain the pin needle cutting evaluation index based on the pin needle cutting optimization model and the pin needle position coefficient; A display module interacts with the main control module and is used to display the Pin cutting evaluation index and the Pin cutting parameter information.

5. The high-speed cutting optimization system for pins according to claim 4 is characterized in that: The main control module specifically includes: A control unit, the control unit is used to obtain a training set of pin cutting data according to historical pin cutting data, train an existing model based on the training set of pin cutting data, obtain a pin cutting optimization model, obtain an abnormal index of historical pin data according to historical pin marking data and historical pin data sets, adjust pin cutting parameters until the pin cutting evaluation index reaches a maximum, and obtain pin cutting parameter information; An information receiving unit, which interacts with the information acquisition module and the evaluation module to receive data and transmit it to the judgment unit; A judgment unit, wherein the judgment unit is used to judge whether the pin material meets the pin requirements of the electronic component according to the pin material information and the electronic component product information, obtain historical pin marking data according to the historical pin data interval difference data and the historical pin data interval difference data threshold, and screen the historical pin marking data according to the historical pin data abnormality index to obtain the historical pin abnormality data.

6. The high-speed cutting optimization system for pins according to claim 4, characterized in that: The information acquisition module specifically includes: A first acquisition unit, the first acquisition unit is used to acquire Pin needle material information, electronic component product information, Pin needle material type information and Pin needle material specification information, and acquire electronic component Pin needle specification information, electronic component Pin needle length information and electronic component Pin needle diameter information according to the electronic component product information; The second acquisition unit is used to acquire historical pin cutting data, historical pin cutting length information, historical pin cutting diameter information and historical pin cutting parameter information, and acquire historical pin performance information, historical pin mechanical strength information, historical pin corrosion resistance information, historical pin electrical performance information and historical pin defect information based on the historical pin cutting data.

7. The high-speed cutting optimization system for pins according to claim 4, characterized in that: The evaluation module specifically includes: A material evaluation unit, the material evaluation unit is used to evaluate the difference between the pin material and the pin of the electronic component, and obtain the pin material difference coefficient; The cutting evaluation unit is used to obtain the electronic component pin position index according to the pin position coordinate data, obtain the pin position coefficient according to the electronic component characteristic pin information, and obtain the pin cutting evaluation index based on the pin cutting optimization model and the pin position coefficient.

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