A power chip heat dissipation device and a heat dissipation method

Abstract

The present invention belongs to the technical field of power chip heat dissipation, and discloses a power chip heat dissipation device and a heat dissipation method. The power chip heat dissipation device specifically includes a chip, the chip is connected to a circuit board through pins, a lower blocking component is provided in contact with one end of the chip close to the circuit board, a heat dissipation component is provided in contact with one end of the chip away from the lower blocking component, the lower blocking component can be connected to the heat dissipation component, the heat dissipation component includes a carrier plate, a heat dissipation cavity is formed in the carrier plate, and cooling components are respectively connected to both sides of the heat dissipation cavity distributed along the length direction. By providing the lower blocking component and the heat dissipation component, the outer end of the chip is protected, and the lower blocking component and the heat dissipation component are connected by a plug-in board, so that the heat dissipation cavity and the heat storage cavity are communicated, and solid heat conduction and gas heat conduction cooperate with each other to ensure the stable heat dissipation efficiency of the chip.

Description

Technical Field

[0001] The present invention belongs to the technical field of power chip heat dissipation, and specifically relates to a power chip heat dissipation device and a heat dissipation method. Background Art

[0002] Since the development direction of integrated circuits is towards miniaturization and micro-miniaturization, this has led to a large amount of heat generated by the chip. At the same time, due to the small area of the chip, the heat is concentrated, causing the chip to be severely heated and damaged. Also, since the chip pins are in the form of thin filaments or flat metal, under the action of external forces, they are easily bent, resulting in a large amount of deformation, and causing the pins to separate from the pads, thereby leading to virtual soldering or desoldering. At the same time, due to the dense distribution of the chip pins, they are extremely prone to damage due to temperature rise.

[0003] Chinese Patent with Application No. CN202321627739.6 discloses a power IC chip that is easy to dissipate heat, including a chip body. A plurality of pins are connected to both sides of the chip body. Side plates are fixedly connected to both sides of the chip body. A second heat sink is fixedly connected to the tops of the two side plates together. A bottom plate is fixedly connected to the bottoms of the two side plates together. A plurality of top columns are fixedly connected to both sides of the bottom plate. It is convenient to better dissipate heat of the chip body under the influence of wind through the setting of the second heat sink and the third heat sink. It is convenient to set through the ventilation holes and the first heat sink. Although the above technical solution realizes the heat dissipation of the chip pins, at the same time, during the long-term use of the chip, the heat dissipation only through the heat sink cannot meet the heat dissipation requirements of the chip.

[0004] However, at the same time, due to the different usage times of the power chip, the heat intensity during the use of the chip will also be different. Therefore, only a single heat dissipation method cannot effectively dissipate heat from the chip. And during the use of the chip, the chip body is extremely prone to damage due to external impacts, affecting its normal use.

[0005] Therefore, based on the above technical problems, it is necessary for those skilled in the art to develop a power chip heat dissipation device. Summary of the Invention

[0006] The object of the present invention is to solve the above problems. The present invention provides a power chip heat dissipation device and a heat dissipation method, which have the advantages of good heat dissipation performance and high protection effect.

[0007] To achieve the above object, the present invention provides the following technical solution: A power chip heat dissipation device includes a chip. The chip is connected to a circuit board through pins. A lower blocking component is provided in contact with one end of the chip close to the circuit board. A heat dissipation component is provided in contact with the end of the chip away from the lower blocking component. The lower blocking component can be connected to the heat dissipation component;

[0008] The heat dissipation component includes a carrier plate, a heat dissipation cavity is formed in the carrier plate, cooling components are respectively connected and arranged on both sides of the heat dissipation cavity distributed along the length direction, a plurality of heat conduction components are connected between the two cooling components, and one end of the heat conduction component penetrates through the carrier plate and abuts against the chip.

[0009] Preferably, the heat conduction component includes a ventilation pipe, the ventilation pipe penetrates through the carrier plate, a contact end is movably arranged on the ventilation pipe, a plurality of transmission holes are formed through the contact end, a connecting plate is fixedly arranged in the ventilation pipe, an elastic part is connected to one end of the contact end close to the connecting plate, one end of the elastic part far away from the contact end is connected to the connecting plate, and a fan blade is connected to one end of the connecting plate far away from the elastic part.

[0010] Preferably, the height of the ventilation pipe in the heat dissipation cavity is less than the height of the heat dissipation cavity.

[0011] Preferably, the lower baffle component includes a heat dissipation plate, a plurality of heat dissipation holes are formed through the heat dissipation plate, a heat storage cavity is formed inside the heat dissipation plate, a plurality of insertion slots are formed on one side of the heat dissipation plate close to the chip, and the insertion slots are communicated with the heat storage cavity.

[0012] Preferably, the heat dissipation component further includes an insertion plate, a heat conduction cavity is formed through the insertion plate, one end of the heat conduction cavity is communicated with the heat dissipation cavity, and the insertion plate can be inserted into the insertion slot.

[0013] Preferably, a plurality of heat dissipation grooves are formed at one end of the heat dissipation component close to the chip, and a through groove is formed in the heat dissipation groove, and the through groove penetrates through the carrier plate.

[0014] Preferably, both of the two cooling components include cooling boxes, a cooling medium is filled in the cooling boxes, a plurality of communicating pipes are connected between the two cooling boxes, the communicating pipes can be clamped with the through grooves, and an exchange hole is formed through one end of the cooling box far away from the chip.

[0015] Preferably, the contact end is made of a thermosensitive material.

[0016] Preferably, baffles are connected between the heat dissipation component, the lower baffle component and the chip.

[0017] A heat dissipation method includes the following steps:

[0018] S1. Using the heat dissipation component and the lower baffle component to wrap the chip and waiting for the chip to cool down during use;

[0019] S2. During the use of the chip, first perform heat exchange on the surface of the chip by using the heat dissipation plate, the carrier plate and the contact end;

[0020] S3. When the operating temperature of the chip continues to rise, gas circulation occurs in the heat storage cavity and the heat dissipation cavity. After the temperature of the contact end rises, it prompts the fan blade to rotate.

[0021] S4. Use the exchange holes to exchange the heat inside the heat dissipation cavity.

[0022] S5. When the rotation speed of the fan blade reaches the maximum, control the cooling medium in the cooling box and the connecting pipe to circulate.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] 1. Through the set lower blocking component and heat dissipation component, the outer end of the chip is protected, and the lower blocking component and the heat dissipation component are connected by the plug-in board, so that the heat dissipation cavity and the heat storage cavity are connected, enabling solid heat conduction and gas heat conduction to cooperate with each other to ensure stable heat dissipation efficiency of the chip.

[0025] 2. By setting the heat conduction component to contact the chip, the contact end can cooperate with the bearing plate and the heat dissipation plate to jointly conduct the heat on the chip. And as the heat conducted increases, the resistance of the contact end will decrease, thereby controlling the rotation of the fan blade and driving the gas around the chip to flow, improving the heat dissipation efficiency of the chip, while alleviating the heat conduction pressure of the lower blocking component and the heat dissipation component, ensuring the stable temperature of the chip, and after being impacted, the contact end and the elastic part can buffer the impact force, reducing the probability of the chip being damaged.

[0026] 3. After the heat generated by the chip is transferred to the heat dissipation cavity, the exchange holes can neutralize the heat in the heat dissipation cavity, reducing the temperature increase rate in the heat dissipation cavity. And when the rotation speed of the fan blade increases to the maximum, at this time, the cooling medium in the cooling box and the connecting pipe will flow, thereby improving the temperature adjustment rate of the heat dissipation cavity. And during the flow of the cooling medium in the connecting pipe, it will absorb the temperature on the surface of the chip, achieving the stability of the operating temperature of the chip. Description of the Drawings

[0027] Figure 1 is a three-dimensional structural schematic diagram of the overall device of the present invention;

[0028] Figure 2 is an exploded structural schematic diagram of the overall device of the present invention;

[0029] Figure 3 is a connection structural schematic diagram of the heat dissipation component and the lower blocking component of the present invention;

[0030] Figure 4 is a three-dimensional structural schematic diagram of the lower blocking component of the present invention;

[0031] Figure 5Schematic cross-sectional structure diagram of the lower baffle component of the present invention;

[0032] Figure 6 Schematic connection structure diagram of the heat conduction component of the present invention;

[0033] Figure 7 Schematic connection structure diagram of the cooling component of the present invention;

[0034] Figure 8 Schematic three-dimensional structure diagram of the heat conduction component of the present invention.

[0035] Description of the drawings: 1. Baffle; 2. Heat dissipation component; 201. Carrier plate; 2011. Heat dissipation groove; 2012. Through groove; 2013. Heat dissipation cavity; 202. Plug-in board; 2021. Heat conduction cavity; 3. Lower baffle component; 301. Heat dissipation plate; 3011. Heat storage cavity; 302. Heat dissipation hole; 303. Plug-in slot; 4. Chip; 5. Heat conduction component; 501. Vent pipe; 502. Fan blade; 503. Connecting plate; 504. Elastic part; 505. Contact end; 5051. Transmission hole; 6. Cooling component; 601. Cooling box; 602. Connecting pipe; 603. Exchange hole. Detailed implementation manners

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0037] Embodiment 1

[0038] During the use of the power chip, a large amount of heat is generated, which affects the use efficiency of the power chip and further affects the overall use of the circuit board. Therefore, the present invention provides a power chip heat dissipation device and a heat dissipation method.

[0039] As Figure 1 - Figure 2As shown in the figure, a heat dissipation device for a power chip includes a chip 4, where the chip 4 is the main body of the power chip and includes the common structures during the use of the power chip. Here, the structure of the chip 4 will not be elaborated too much. The chip 4 is connected to the circuit board through pins to ensure that the chip 4 can be used normally. One end of the chip 4 close to the circuit board is in contact with a lower blocking component 3 that plays a role in heat dissipation and protection. One end of the chip 4 far from the lower blocking component 3 is in contact with a heat dissipation component 2 used to convert the heat generated during the use of the chip 4. The lower blocking component 3 can be connected to the heat dissipation component 2 to ensure that the heat of the chip 4 can be fully absorbed, and the outer side of the chip 4 is protected by the lower blocking component 3 and the heat dissipation component 2. By the mutual contact between the lower blocking component 3, the heat dissipation component 2 and the chip 4, the heat generated by the chip 4 is absorbed to ensure that the chip 4 can be used normally.

[0040] In order to ensure that the heat dissipation component 2 can effectively absorb the heat generated by the chip 4, the heat dissipation component 2 includes a bearing plate 201. The surface area of the bearing plate 201 is larger than the area of the contact surface with the chip 4, and the bearing plate 201 can be in contact with the chip 4. A heat dissipation cavity 2013 is formed on the bearing plate 201. The heat generated during the use of the chip 4 can be converted by using the heat dissipation cavity 2013 to achieve the purpose of heat dissipation. That is, during the contact between the bearing plate 201 and the chip 4, the heat generated by the chip 4 is transmitted to the heat dissipation cavity 2013 by the bearing plate 201. Cooling components 6 are respectively connected to both sides of the heat dissipation cavity 2013 distributed along the length direction. A plurality of heat conduction components 5 are connected between the two cooling components 6. The plurality of heat conduction components 5 are evenly distributed on the bearing plate 201. The heat conduction components 5 improve the heat conduction efficiency of the chip 4, and the cooling components 6 are used to quickly cool the heat inside the heat dissipation cavity 2013 to improve the heat exchange efficiency between the heat dissipation component 2 and the lower blocking component 3. One end of the heat conduction component 5 penetrates the bearing plate 201 and is in contact with the chip 4. On the one hand, it promotes the increase in the conversion efficiency of the heat on the chip 4 by the heat conduction component 5, and on the other hand, the heat conduction component 5 is used to identify the temperature change of the chip 4 during use to realize the adjustment of the heat dissipation method to ensure the normal use of the chip 4.

[0041] Through the above-mentioned technical features and solutions, the heat dissipation component 2 and the lower blocking component 3 are connected to the chip 4, and then the chip 4 is connected to the circuit board. During the use of the chip 4, the heat generated by the chip 4 is absorbed and transported through the bearing plate 201 and the heat conduction components 5, so that the heat of the chip 4 is transmitted into the heat dissipation cavity 2013, and then the cooling components 6 are used to adjust the temperature in the heat dissipation cavity 2013 to ensure the stable use efficiency of the chip 4.

[0042] To ensure that the heat-conducting component 5 can absorb and convert the heat generated by the chip 4 and can identify and control the temperature generated by the chip 4, as Figure 7 - Figure 8 shown, further, the heat-conducting component 5 includes a ventilation pipe 501. The ventilation pipe 501 penetrates through the carrier plate 201, and uses the ventilation pipe 501 to provide a conveying pipeline for the heat generated by the chip 4, thereby reducing the heat stored in the heat-conducting medium and improving the heat exchange efficiency. The ventilation pipe 501 is movably provided with a contact end 505. One end of the contact end 505 can be in contact with the chip 4. A plurality of transmission holes 5051 are provided through the contact end 505, and gas circulation is realized by using the transmission holes 5051, so as to realize heat exchange and maintain the working temperature of the chip 4. A connecting plate 503 is fixedly provided in the ventilation pipe 501. The connecting plate 503 is used to fix the positions of related devices of the heat-conducting component 5. One end of the contact end 505 close to the connecting plate 503 is connected with an elastic part 504. The elastic part 504 can be a spring, an elastic rod and other materials or devices with elastic deformation in this solution. In this solution, in order to facilitate the description of the function of the elastic part 504, the elastic part 504 is preferably a spring. One end of the elastic part 504 away from the contact end 505 is connected with the connecting plate 503. One end of the connecting plate 503 away from the elastic part 504 is connected with a fan blade 502. The rotation of the fan blade 502 is affected by the contact end 505.

[0043] By providing the elastic part 504, when the heat dissipation component 2 contacts the chip 4, the contact end 505 contacts the surface of the chip 4. As the distance between the heat dissipation component 2 and the chip 4 decreases, it will drive the contact end 505 to move in the ventilation pipe 501, and then drive the elastic part 504 to be compressed, so that the contact end 505 can be in full contact with the chip 4, realizing the conduction of the heat of the chip 4. And during the process of the contact end 505 contacting and conducting heat with the chip 4, when the heat dissipation component 2 is collided or shaken, the impact on the chip 4 can be effectively reduced by using the contact end 505 and the elastic part 504, and at the same time, the probability of the chip 4 being damaged is reduced.

[0044] It should be noted that the contact end 505 is made of a thermosensitive material, that is, the higher the temperature of the contact end 505, the smaller the resistance. The control end of the fan blade 502 is connected to the contact end 505. As the usage time of the chip 4 increases, the body temperature of the contact end 505 rises, causing its body resistance to decrease, prompting the fan blade 502 to start rotating to improve the heat exchange efficiency of the chip 4, and the higher the temperature of the contact end 505, the faster the rotation speed of the fan blade 502.

[0045] Among them, the height of the ventilation pipe 501 in the heat dissipation cavity 2013 is less than the height of the heat dissipation cavity 2013, ensuring that the ventilation pipe 501 can transmit the heat generated by the chip 4 to the inside of the heat dissipation cavity 2013 and ensuring the heat dissipation efficiency.

[0046] To achieve all-round heat dissipation for the chip 4, while protecting the chip 4 from possible damage during use and ensuring the service life of the chip 4, as Figure 3 - Figure 5 shown, further, the lower blocking component 3 includes a heat dissipation plate 301. The planar area of the heat dissipation plate 301 is the same as that of the carrier plate 201 and is larger than the planar area of the chip 4, so that the heat dissipation plate 301 abuts against one end of the chip 4, separating the chip 4 from the circuit board, ensuring that the circuit board will not be damaged by the high temperature of the chip 4. At the same time, the heat dissipation plate 301 is used to cool the side of the chip 4 close to the circuit board to ensure all-round heat dissipation of the chip 4. A plurality of heat dissipation holes 302 are penetrated through the heat dissipation plate 301. The heat dissipation holes 302 can increase the contact area between the heat dissipation plate 301 and the outside, thus preventing the temperature of the heat dissipation plate 301 from being too high. A heat storage cavity 3011 is provided inside the heat dissipation plate 301 to store and exchange the heat of the heat dissipation plate 301, ensuring that the temperature of the heat dissipation plate 301 is always lower than the heat dissipated by the chip 4, and further maintaining the smooth progress of the heat exchange between the heat dissipation plate 301 and the chip 4. A number of insertion slots 303 are provided on the side of the heat dissipation plate 301 close to the chip 4. The insertion slots 303 are communicated with the heat storage cavity 3011. When the temperature in the heat storage cavity 3011 rises, the heat inside the heat storage cavity 3011 is discharged through the insertion slots 303 to exchange with the cooler air, so as to achieve the purpose of cooling.

[0047] When the temperature of the lower blocking component 3 rises, the heat generated in the lower blocking component 3 will damage the circuit board. Therefore, during use, the heat on the lower blocking component 3 needs to be cooled in a reasonable way, as Figure 2 - Figure 3 shown, further, the heat dissipation component 2 further includes an insertion board 202. A heat conduction cavity 2021 is penetrated through the insertion board 202. One end of the heat conduction cavity 2021 is communicated with the heat dissipation cavity 2013. The insertion board 202 can be inserted into the insertion slot 303. When the carrier plate 201, the heat dissipation plate 301 and the chip 4 are docked, the insertion board 202 can be inserted into the insertion slot 303, so that the heat storage cavity 3011 and the heat dissipation cavity 2013 are communicated through the heat conduction cavity 2021. When the temperature in the heat storage cavity 3011 is higher than the temperature in the heat dissipation cavity 2013, it will cause the hot gas in the heat storage cavity 3011 to move into the heat dissipation cavity 2013 through the heat conduction cavity 2021, thus forming gas exchange, and the volume of the heat dissipation cavity 2013 is larger than the volume of the heat storage cavity 3011.

[0048] It should be noted that since the areas of the carrier plate 201 and the heat dissipation plate 301 are both larger than the area of the chip 4, when the insertion board 202 is connected to the insertion slot 303, the edge of the chip 4 will be protected, thus further improving the safety of the chip 4.

[0049] As Figure 6As shown, a plurality of heat dissipation slots 2011 are provided at one end of the heat dissipation component 2 close to the chip 4, and through slots 2012 are provided in the heat dissipation slots 2011, and the through slots 2012 penetrate the carrier plate 201, thereby ensuring that the heat absorption efficiency and heat dissipation efficiency of the carrier plate 201 can maintain the stable working temperature of the chip 4.

[0050] In order to ensure that the heat absorbed by the heat dissipation component 2 and the lower block component 3 can be effectively absorbed, so that the heat dissipation component 2 and the lower block component 3 can always be in the process of absorbing heat, the two cooling components 6 include a cooling box 601, and the cooling box 601 is filled with a cooling medium, wherein the cooling medium can be a coolant, and a plurality of connecting pipes 602 are connected between the two cooling boxes 601, so that the coolants in the two cooling boxes 601 are exchanged through the connecting pipes 602, so as to avoid the situation where the temperature of one of the cooling components 6 is too high, and the connecting pipe 602 can be connected with the through groove 2012, so that The connecting tube 602 is close to the body of the chip 4. When the heat exchange rate of the heat dissipation component 2 decreases, the connecting tube 602 in the through groove 2012 can be used to directly perform heat exchange to ensure that the operating temperature of the chip 4 is stable. An exchange hole 603 is provided at the end of the cooling box 601 away from the chip 4, wherein the exchange hole 603 can exchange the hot gas in the heat dissipation cavity 2013 to achieve cooling of the heat dissipation cavity 2013. It should be noted that the exchange hole 603 can only allow gas to pass through, and the coolant inside the cooling box 601 will not flow out through the exchange hole 603, thereby ensuring the normal operation of the cooling component 6.

[0051] like Figure 1 As shown, further, a baffle 1 is provided between the heat dissipation component 2, the lower baffle component 3 and the chip 4, and the baffle 1 is utilized to ensure a tight connection between the heat dissipation component 2 and the lower baffle component 3, thereby ensuring that the chip 4 does not suffer from heat dissipation failure during use.

[0052] When the device is in use, the lower block component 3 is firstly connected with the chip 4 by abutment, and then the pin of the chip 4 is connected with the circuit board. When the position of the chip 4 is fixed, the heat dissipation component 2 is then placed opposite to the chip 4 and close to it, so that the abutment end 505 is first in contact with the chip 4. At this time, the movement of the heat dissipation component 2 does not stop, thereby driving the abutment end 505 to move in the ventilation pipe 501, and at the same time causing the elastic part 504 to be compressed, so that the plug-in board 202 is docked with the plug-in slot 303, and the baffle 1 is used to realize the secondary fixation of the heat dissipation component 2 and the lower block component 3, so as to realize the assembly of the heat dissipation device and the exchange of the temperature of the chip 4 when it is in use.

[0053] During the use of chip 4, the temperature of chip 4 rises, and then heat exchange is achieved with the surface of chip 4 using the carrier plate 201 and the heat sink 301, and the generated heat is conducted to the heat sink cavity 2013, so as to avoid the carrier plate 201 and the heat sink 301 from heating up too fast and affecting their heat conduction efficiency, thereby maintaining the working temperature of chip 4 in a normal working state.

[0054] Furthermore, when the carrier plate 201 and the heat sink 301 cool down the chip 4 , the abutting end 505 always abuts against the chip 4 , and the abutting end 505 also absorbs the heat generated by the chip 4 , ensuring that the temperature of the chip 4 is constant.

[0055] As the heat absorption time of the carrier plate 201 and the heat sink 301 on the surface of the power chip increases, the thermal conductivity of the carrier plate 201 and the heat sink 301 will decrease, which will eventually affect the heat dissipation of the power chip. At this time, the connecting tube 602 and the circulation of the coolant in the connecting tube 602 are used to delay the heating efficiency of the carrier plate 201, so that the heat generated by the power chip will not heat the air in the heat storage cavity 3011 and the heat dissipation cavity 2013. Since the volume of the heat storage cavity 3011 is smaller than the volume of the heat dissipation cavity 2013, the hot air in the heat storage cavity 3011 will enter the heat dissipation cavity 2013 through the heat conduction cavity 2021. The heat in the heat dissipation cavity 2013 is heat-exchanged with the coolant in the cooling box 601 through the exchange hole 603, so as to maintain the temperature in the heat dissipation cavity 2013 constant and ensure that the heat dissipation component 2 can meet the temperature control of the chip 4.

[0056] In the process of heating up the carrier plate 201 and the heat sink 301, the surface temperature of the abutting end 505 is in an increasing state at the same time, thereby reducing the resistance of the abutting end 505, causing the fan blade 502 to rotate, and the heat on the chip 4 is first introduced into the heat dissipation cavity 2013 through the transmission hole 5051 and then through the ventilation pipe 501, thereby increasing the flow rate of the gas around the chip 4, thereby increasing the heat dissipation efficiency of the chip 4, achieving compensation for the heat conduction rate of the carrier plate 201 and the heat sink 301, ensuring that the temperature of the chip 4 is constant, and when the temperature of the abutting end 505 is in a continuous rising process, the rotation speed of the fan blade 502 also continues to increase.

[0057] When the rotation speed of the fan blade 502 increases to the maximum, the rotation speed of the fan blade 502 is maintained unchanged, and the coolant in the cooling box 601 is controlled to flow in the connecting tube 602, so as to cool the tube wall of the connecting tube 602 and increase the conversion efficiency of the heat on the surface of the chip 4. At the same time, when the exchange hole 603 regulates the temperature in the heat dissipation cavity 2013, the connecting tube 602 can also be used to neutralize the heat in the heat dissipation cavity 2013, thereby improving the temperature reduction efficiency in the heat dissipation cavity 2013.

[0058] Moreover, during the process of cooling the chip 4 by using the heat dissipation component 2, the lower blocking component 3, and the heat conduction component 5, the protection of the chip 4 can also be achieved. When the chip 4 is impacted, the lower blocking component 3 and the heat dissipation component 2 can offset the direct impact on the chip 4. At the same time, after the heat dissipation component 2 is impacted, the contact end 505 and the elastic part 504 can offset its impact force to ensure the safe use of the chip 4. When necessary, when there is an open fire on the chip 4, after the heat dissipation component 2 is burned, the cooling tank 601 will leak, and the coolant in the cooling tank 601 is used to extinguish the open fire on the chip 4 to avoid greater economic losses.

[0059] Embodiment 2

[0060] A heat dissipation method includes the following steps:

[0061] S1. Use the heat dissipation component 2 and the lower blocking component 3 to wrap the chip 4 and wait for the chip 4 to cool down during use;

[0062] S101. Make the plug-in board 202 dock with the plug-in slot 303 to promote the communication between the heat storage cavity 3011 and the heat dissipation cavity 2013;

[0063] S2. When the chip 4 is in use, first perform heat exchange on the surface of the chip 4 by using the heat dissipation plate 301, the bearing plate 201, and the contact end 505;

[0064] S3. When the operating temperature of the chip 4 continues to rise, gas flows in the heat storage cavity 3011 and the heat dissipation cavity 2013, and after the temperature of the contact end 505 rises, the fan blade 502 is promoted to rotate;

[0065] S4. Use the exchange hole 603 to exchange the heat inside the heat dissipation cavity 2013;

[0066] S5. When the rotation speed of the fan blade 502 reaches the maximum, control the cooling medium in the cooling tank 601 and the connecting pipe 602 to flow.

[0067] It should be noted that in this article, the term "including", "comprising", or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, article, or device including a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or device.

[0068] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A power chip heat dissipation device, comprising a chip (4), wherein the chip (4) is connected to a circuit board via pins, and characterized in that: One end of the chip (4) close to the circuit board is in contact with a lower stop assembly (3), and one end of the chip (4) away from the lower stop assembly (3) is in contact with a heat dissipation assembly (2), and the lower stop assembly (3) can be connected to the heat dissipation assembly (2); The heat dissipation component (2) comprises a carrier plate (201), a heat dissipation cavity (2013) is provided on the carrier plate (201), cooling components (6) are respectively connected to two sides of the heat dissipation cavity (2013) distributed along the length direction, a plurality of heat conduction components (5) are connected between two cooling components (6), and one end of the heat conduction component (5) passes through the carrier plate (201) and contacts the chip (4); The heat-conducting component (5) comprises a vent pipe (501), the vent pipe (501) passes through the supporting plate (201), the vent pipe (501) is movably provided with a contact end (505), the contact end (505) is penetrated with a plurality of transmission holes (5051), and a connecting plate (503) is fixedly provided inside the vent pipe (501), an end of the contact end (505) close to the connecting plate (503) is connected with an elastic part (504), an end of the elastic part (504) away from the contact end (505) is connected to the connecting plate (503), and an end of the connecting plate (503) away from the elastic part (504) is connected to a fan blade (502); The height of the ventilation pipe (501) in the heat dissipation cavity (2013) is smaller than the height of the heat dissipation cavity (2013); The lower block assembly (3) comprises a heat dissipation plate (301), a plurality of heat dissipation holes (302) are formed through the heat dissipation plate (301), a heat storage cavity (3011) is formed inside the heat dissipation plate (301), a plurality of plug-in slots (303) are formed on a side of the heat dissipation plate (301) close to the chip (4), and the plug-in slots (303) are connected to the heat storage cavity (3011); The abutment end (505) is made of a heat-sensitive material.

2. The power chip heat dissipation device according to claim 1, characterized in that: The heat dissipation component (2) further comprises a plug-in board (202), a heat conduction cavity (2021) extending through the plug-in board (202), one end of the heat conduction cavity (2021) being in communication with the heat dissipation cavity (2013), and the plug-in board (202) being capable of being plugged into the plug-in slot (303).

3. The power chip heat dissipation device according to claim 1, characterized in that: A plurality of heat dissipation grooves (2011) are provided at one end of the heat dissipation component (2) close to the chip (4), and through grooves (2012) are provided in the heat dissipation grooves (2011), and the through grooves (2012) penetrate the carrier plate (201).

4. The power chip heat dissipation device according to claim 3, characterized in that: The two cooling components (6) each include a cooling box (601), the cooling box (601) is filled with a cooling medium, a plurality of connecting pipes (602) are connected between the two cooling boxes (601), the connecting pipes (602) can be snap-fitted into the through groove (2012), and an exchange hole (603) is provided through one end of the cooling box (601) away from the chip (4).

5. The power chip heat dissipation device according to claim 1, characterized in that: A baffle (1) is provided between the heat dissipation component (2), the lower baffle component (3) and the chip (4).

6. A heat dissipation method using the power chip heat dissipation device according to claim 4, characterized in that: The following steps are involved: S1, using the heat dissipation component (2) and the lower blocking component (3) to wrap the chip (4), and waiting for the chip (4) to cool down when in use; S101, docking the plug board (202) with the plug slot (303), thereby causing the heat storage chamber (3011) to communicate with the heat dissipation chamber (2013); S2. When the chip (4) is in use, the heat dissipation plate (301), the carrier plate (201) and the abutment end (505) are first used to perform heat exchange on the surface of the chip (4); S3, when the operating temperature of the chip (4) continues to rise, gas is circulated in the heat storage chamber (3011) and the heat dissipation chamber (2013), and after the temperature of the abutment end (505) rises, the fan blade (502) is prompted to rotate; S4, using the exchange hole (603) to exchange heat inside the heat dissipation cavity (2013); S5. When the rotation speed of the fan blade (502) reaches the maximum, the cooling medium in the cooling box (601) and the connecting pipe (602) is controlled to circulate.

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