A spray cleaning machine for wafer cleaning

Abstract

The application discloses a kind of wafer cleaning spray cleaning machine, specifically relates to wafer cleaning machine technical field including equipment frame, the inside fixed mounting of the equipment frame is equipped with transmission mechanism, the top fixed mounting of the transmission mechanism is equipped with clamping mechanism, the one side fixed mounting of the clamping mechanism is equipped with spray mechanism, transmission mechanism includes rotating mechanism and linkage mechanism, the inside fixed mounting of the rotating mechanism is equipped with vibration mechanism.This is used for the spray cleaning machine of wafer cleaning, by the rotating mechanism of being set and the clamping mechanism rotation is driven simultaneously, by linkage mechanism and drive vibration mechanism operation, and then by vibration mechanism and drive clamping mechanism up and down vibration, make wafer vibrate while rotating at the bottom of spray mechanism, make cleaning fluid form more uniform flow on wafer surface, avoid cleaning fluid to accumulate in some areas, ensure that the entire wafer surface obtains consistent cleaning effect, vibration can help to break the adhesion of contaminant and wafer surface, increase cleaning effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer cleaning, in particular to a spray cleaning machine for wafer cleaning. BACKGROUND

[0002] Wafer is a basic material in semiconductor manufacturing, which is made by processing high-purity semiconductor materials (usually silicon, sometimes germanium, gallium arsenide, etc.) into a circular thin sheet. This thin sheet is the basic platform for manufacturing integrated circuits (ICs), on which millions or even billions of transistors and other electronic components can be grown.

[0003] With the development of semiconductor manufacturing process, more and more cleaning processes use single wafer spray machine, which is a device specially used for cleaning and processing single wafer in the process of semiconductor manufacturing. Compared with traditional batch processing spray machine, single wafer spray machine only processes one wafer at a time, which brings several obvious advantages, single wafer spray machine can more effectively control the cross contamination between wafers, because each wafer is processed only once, reducing the risk of contamination spread between different wafers.

[0004] Although the single wafer spray machine in the prior art meets the use requirements to a certain extent, the current single wafer spray machine usually only has the function of spraying cleaning, and for some particles or organic contaminants with strong adhesion, simple spraying may not be enough to completely remove them. SUMMARY

[0005] The purpose of the present application is to provide a spray cleaning machine for wafer cleaning to solve the problems raised in the background.

[0006] To achieve the above purpose, the present application provides the following technical scheme: a spray cleaning machine for wafer cleaning, comprising a device frame, a transmission mechanism is fixedly installed inside the device frame, a clamping mechanism is fixedly installed on the top of the transmission mechanism, a spraying mechanism is fixedly installed on one side of the clamping mechanism, the transmission mechanism comprises a rotating mechanism and a linkage mechanism, a vibration mechanism is fixedly installed inside the rotating mechanism, the output shaft of the rotating mechanism is connected to one side of the vibration mechanism through the linkage mechanism, and the rotating mechanism is fixedly installed at the bottom of the clamping mechanism.

[0007] The rotating mechanism drives the clamping mechanism to rotate at the same time, and drives the vibration mechanism to operate through the linkage mechanism, and then drives the clamping mechanism to vibrate up and down through the vibration mechanism, so that the wafer rotates at the bottom of the spraying mechanism at the same time, which promotes the cleaning liquid to form more uniform flow on the wafer surface, avoids the accumulation of cleaning liquid in some areas, and ensures that the entire wafer surface is cleaned uniformly.

[0008] Preferably, the rotating mechanism comprises a first motor and a mounting disc, the output shaft of the first motor is fixedly connected with a first pulley through a shaft coupling, the outer wall of the first pulley is sleeved with a transmission belt, the inner part of the transmission belt is sleeved with a second pulley, the top of the second pulley is fixedly installed with two groups of sliding sleeves, the mounting disc is movably installed in the sliding sleeves, and the mounting disc is fixedly installed at the bottom of the clamping mechanism.

[0009] Preferably, the vibrating mechanism comprises a mounting frame, the mounting frame is rotatably installed in the second pulley, the inner part of the mounting frame is slidably installed with a first connecting rod, one side of the first connecting rod is rotatably installed with two groups of transmission gears, the two groups of transmission gears are meshed with each other, one side of the transmission gear is fixedly connected with an eccentric block, the top of the first connecting rod is fixedly installed with a baffle, the baffle is fixedly installed at the bottom of the mounting disc, the outer wall of the first connecting rod is sleeved with a first spring, and the first spring is arranged between the mounting frame and the baffle.

[0010] Preferably, the linkage mechanism comprises a first bevel gear, the first bevel gear is fixedly installed on the output shaft of the first motor, one side of the first bevel gear is meshedly connected with a second bevel gear, one side of the second bevel gear is fixedly installed with a transmission rod, the transmission rod is fixedly connected on one side of the transmission gear, and the inner part of the transmission rod is fixedly installed with a cross slider shaft coupling.

[0011] Preferably, the clamping mechanism comprises a tray, a plurality of displacement grooves are formed in the inner part of the tray, a rotating block is rotatably installed at the bottom of the tray, a plurality of connecting pieces are rotatably installed at the bottom of the rotating block, a clamping jaw is rotatably installed at one end of the connecting piece, and the clamping jaw is slidably installed in the displacement groove.

[0012] Preferably, the clamping mechanism further comprises a cylinder, the cylinder is arranged between the two groups of clamping jaws, one side of the cylinder is fixedly installed with an adjusting mechanism, one side of the adjusting mechanism is fixedly installed with a tension sensor, and the adjusting mechanism is fixedly installed on one side of the clamping jaw through the tension sensor.

[0013] Preferably, the adjusting mechanism comprises a second screw rod, the second screw rod is fixedly installed at the bottom of the clamping jaw, a sliding rod is slidably installed in the inner part of the second screw rod, the sliding rod is fixedly installed on one side of the cylinder, the outer wall of the second screw rod is threadedly connected with a through-shaft lead screw motor, the outer wall of the second screw rod is sleeved with a tension spring, the tension spring is fixedly installed between the through-shaft lead screw motor and the sliding rod, and the adjusting mechanism further comprises a limiting rod, and the through-shaft lead screw motor is slidably installed in the limiting rod.

[0014] Preferably, the spraying mechanism comprises a mounting table, a telescopic column is fixedly installed on the top of the mounting table, a mounting rod is slidably installed in the telescopic column, and an atomizing nozzle is fixedly installed on one end of the mounting rod.

[0015] Preferably, a mounting block is rotatably installed on the top of the mounting table, a mounting column is arranged on the top of the mounting block, a second connecting rod is rotatably installed on the top of the mounting column, the second connecting rod is rotatably installed on the bottom of the mounting rod, and a distance sensor is fixedly installed on one side of the clamping jaw.

[0016] A first screw rod is rotatably installed in the mounting block, the second connecting rod is threadedly connected to the outer wall of the first screw rod, a second motor is fixedly installed on one side of the mounting block, and the output shaft of the second motor is fixedly connected to one side of the first screw rod through a shaft coupling.

[0017] In order to solve the above technical problems, the present application further provides a process for mixing cable material, a spraying cleaning machine for wafer cleaning and a using method thereof, which comprises the following steps:

[0018] Compared with the prior art, the spraying cleaning machine for wafer cleaning has the advantages that:

[0019] 1. The rotating mechanism drives the clamping mechanism to rotate, the linkage mechanism drives the vibration mechanism to operate, and the vibration mechanism drives the clamping mechanism to vibrate up and down, so that the wafer vibrates while rotating at the bottom of the spraying mechanism, the cleaning liquid forms a more uniform flow on the wafer surface, the accumulation of the cleaning liquid in some areas is avoided, the entire wafer surface is ensured to have consistent cleaning effect, the vibration can help to break the adhesion between the pollutants and the wafer surface, and the spraying liquid can more easily remove the small particles, residual chemicals or other impurities from the wafer surface.

[0020] 2. The displacement groove, the rotating block and the connecting plate cooperate to make the plurality of clamping jaws displace on the top of the tray to clamp the wafer, the operation of the air cylinder is stopped when the tension sensor senses that the clamping jaws have appropriate clamping force on the wafer, and the clamping is completed, the above-mentioned arrangement enables the device to clamp wafers of various sizes, the cooperation between the second screw rod, the slide rod and the tension spring absorbs and reduces the impact force when the wafer is clamped and released, and the wafer is prevented from being broken or scratched on the surface due to sudden force.

[0021] 3. Through the cooperation between the through-shaft type screw motor and the limiting rod, the through-shaft type screw motor can be transversely displaced on the surface of the second screw rod when the through-shaft type screw motor operates, thereby changing the lifting degree of the tension spring, and the clamping force of the clamping jaw on the wafer can be accurately changed by cooperating with the pressure data obtained by the tension sensor, so that the wafer can maintain a stable position during the whole cleaning process, and the distribution uniformity of the cleaning agent and the consistency of the cleaning effect can be improved;

[0022] 4. The wafer on the top of the clamping mechanism is sprayed and cleaned by the atomizing nozzle, and the atomizing nozzle can be displaced up and down through the telescopic column, so that the wafer can be conveniently installed and removed from the top of the clamping mechanism, and the atomizing nozzle can reciprocatingly and linearly displace on the top of the wafer through the cooperation between the mounting block, the mounting column and the second connecting rod, so that the atomizing nozzle can ensure that each part of the wafer surface can be uniformly covered by the cleaning liquid, eliminate the cleaning dead angle and ensure the cleanliness of the wafer surface;

[0023] 5. The distance between the two groups of clamping jaws is measured by the distance sensor, and then the radius of the wafer is obtained, and according to the obtained radius, the first screw rod is driven to rotate by the second motor, and then the second connecting rod is displaced on the top of the mounting block, and then the displacement distance and position of the atomizing nozzle are changed, so that the atomizing nozzle can always reciprocatingly displace from the outer wall of the wafer to the center of the wafer, and the precision of the reciprocating displacement spraying is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the present application;

[0025] Figure 2 It is a structural schematic diagram of the internal structure of the present application;

[0026] Figure 3 It is a structural schematic diagram of the transmission mechanism of the present application;

[0027] Figure 4 It is a structural schematic diagram of the rotating mechanism of the present application;

[0028] Figure 5 It is a structural schematic diagram of the vibrating mechanism of the present application;

[0029] Figure 6 It is a structural schematic diagram of the linkage mechanism of the present application;

[0030] Figure 7 It is a structural schematic diagram of the clamping mechanism of the present application;

[0031] Figure 8 It is a structural schematic diagram of the adjusting mechanism of the present application;

[0032] Figure 9 It is a structural schematic diagram of the spraying mechanism of the present application;

[0033] Figure 10 The partial structure diagram of the spraying mechanism of the application.

[0034] In the figure: 1, equipment frame; 2, transmission mechanism; 21, rotating mechanism; 211, first motor; 212, first belt pulley; 213, transmission belt; 214, second belt pulley; 215, sliding sleeve; 216, mounting disc; 22, vibration mechanism; 221, mounting frame; 222, first connecting rod; 223, transmission gear; 224, eccentric block; 225, baffle; 226, first spring; 23, linkage mechanism; 231, first bevel gear; 232, second bevel gear; 233, transmission rod; 234, cross slider coupling; 3, clamping mechanism; 31, tray; 32, displacement groove; 33, rotating block; 34, connecting piece; 35, clamping jaw; 36, air cylinder; 4, spraying mechanism; 41, mounting table; 42, telescopic column; 43, mounting rod; 44, atomizing nozzle; 45, mounting block; 46, mounting column; 47, second connecting rod; 48, first screw rod; 49, second motor; 5, adjusting mechanism; 51, second screw rod; 52, sliding rod; 53, tension spring; 54, through-shaft type screw motor; 55, limiting rod; 6, tension sensor; 7, distance sensor. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the application will be apparently and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all the other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the application.

[0036] Please refer to Figures 1-6 The application provides a technical solution: a wafer cleaning spraying cleaning machine, comprising an equipment frame 1, a transmission mechanism 2 fixedly installed inside the equipment frame 1, a clamping mechanism 3 fixedly installed on the top of the transmission mechanism 2, and a spraying mechanism 4 fixedly installed on one side of the clamping mechanism 3. The transmission mechanism 2 comprises a rotating mechanism 21 and a linkage mechanism 23. The rotating mechanism 21 is internally fixedly installed with a vibration mechanism 22. The output shaft of the rotating mechanism 21 is connected to one side of the vibration mechanism 22 through the linkage mechanism 23. The rotating mechanism 21 is fixedly installed at the bottom of the clamping mechanism 3.

[0037] The rotating mechanism 21 comprises a first motor 211 and a mounting disc 216, the output shaft of the first motor 211 is fixedly connected with a first belt pulley 212 through a shaft coupling, the outer wall of the first belt pulley 212 is sleeved with a transmission belt 213, the inner part of the transmission belt 213 is sleeved with a second belt pulley 214, the top of the second belt pulley 214 is fixedly installed with two groups of sliding sleeves 215, the mounting disc 216 is movably installed in the inner part of the sliding sleeve 215, and the mounting disc 216 is fixedly installed at the bottom of the clamping mechanism 3;

[0038] The vibrating mechanism 22 comprises a mounting frame 221, the mounting frame 221 is rotatably installed in the inner part of the second belt pulley 214, the inner part of the mounting frame 221 is slidably installed with a first connecting rod 222, one side of the first connecting rod 222 is rotatably installed with two groups of transmission gears 223, the two groups of transmission gears 223 are meshed with each other, one side of the transmission gear 223 is fixedly connected with an eccentric block 224, the top of the first connecting rod 222 is fixedly installed with a baffle 225, the baffle 225 is fixedly installed at the bottom of the mounting disc 216, the outer wall of the first connecting rod 222 is sleeved with a first spring 226, and the first spring 226 is arranged between the mounting frame 221 and the baffle 225;

[0039] The linkage mechanism 23 comprises a first bevel gear 231, the first bevel gear 231 is fixedly installed on the output shaft of the first motor 211, one side of the first bevel gear 231 is meshedly connected with a second bevel gear 232, one side of the second bevel gear 232 is fixedly installed with a transmission rod 233, the transmission rod 233 is fixedly connected on one side of the transmission gear 223, and the inner part of the transmission rod 233 is fixedly installed with a cross slider shaft coupling 234.

[0040] Specifically, the first motor 211 drives the first belt pulley 212 to rotate, and the cooperation between the first belt pulley 212, the transmission belt 213, the second belt pulley 214, the sliding sleeve 215 and the mounting disc 216 drives the clamping mechanism 3 to rotate, and the cooperation between the sliding sleeve 215 and the mounting disc 216 enables the clamping mechanism 3 to displace up and down on the top of the rotating mechanism 21;

[0041] The cooperation between the first bevel gear 231, the second bevel gear 232 and the transmission rod 233 enables the first motor 211 to drive the clamping mechanism 3 to rotate and drive the vibrating mechanism 22 to operate at the same time, and the cross slider shaft coupling 234 compensates the angle deviation, radial deviation or axial deviation between the output shaft of the rotating mechanism 21 and the input shaft of the vibrating mechanism 22 in this process, so that the vibrating mechanism 22 can displace on one side of the rotating mechanism 21;

[0042] The transmission lever 233 drives the transmission gear 223 to rotate, and then drives the eccentric block 224 to rotate, and the eccentric block 224 drives the first connecting rod 222 to shake up and down inside the second belt pulley 214 through cooperation between the mounting frame 221 and the first connecting rod 222, and then makes the clamping mechanism 3 vibrate on the top of the transmission mechanism 2, and in this process, the spring can help limit the amplitude of the vibration of the first connecting rod 222 through cooperation between the mounting frame 221, the baffle 225 and the first spring 226, so that the vibration is within a safe and controllable range, and damage to the wafer caused by excessive vibration is prevented.

[0043] In summary, the rotating mechanism 21 drives the clamping mechanism 3 to rotate, and at the same time, the linkage mechanism 23 drives the vibration mechanism 22 to operate, and then the vibration mechanism 22 drives the clamping mechanism 3 to vibrate up and down, so that the wafer rotates and vibrates at the bottom of the spraying mechanism 4, and the cleaning liquid forms a more uniform flow on the surface of the wafer, avoiding the accumulation of cleaning liquid in some areas, and ensuring that the entire wafer surface is cleaned uniformly.

[0044] Please refer to Figures 7-8 The present application provides a technical scheme: a wafer cleaning spraying cleaning machine, the clamping mechanism 3 comprises a tray 31, a plurality of displacement grooves 32 are formed in the inside of the tray 31, a rotating block 33 is rotatably installed at the bottom of the tray 31, a plurality of connecting pieces 34 are rotatably installed at the bottom of the rotating block 33, a clamping jaw 35 is rotatably installed at one end of the connecting piece 34, and the clamping jaw 35 is slidably installed in the inside of the displacement groove 32.

[0045] The clamping mechanism 3 further comprises a cylinder 36, the cylinder 36 is arranged between the two groups of clamping jaws 35, an adjusting mechanism 5 is fixedly installed on one side of the cylinder 36, and a tension sensor 6 is fixedly installed on one side of the adjusting mechanism 5; the adjusting mechanism 5 is fixedly installed on one side of the clamping jaw 35 through the tension sensor 6.

[0046] The adjusting mechanism 5 comprises a second screw 51, the second screw 51 is fixedly installed at the bottom of the clamping jaw 35, a sliding rod 52 is slidably installed in the inside of the second screw 51, the sliding rod 52 is fixedly installed on one side of the cylinder 36, a through-shaft lead screw motor 54 is threadedly connected to the outer wall of the second screw 51, a tension spring 53 is sleeved and installed on the outer wall of the second screw 51, the tension spring 53 is arranged between the through-shaft lead screw motor 54 and the sliding rod 52, and the adjusting mechanism 5 further comprises a limiting rod 55, and the through-shaft lead screw motor 54 is slidably installed in the inside of the limiting rod 55.

[0047] The embodiment is characterized in that: the wafer is placed on the top of the tray 31, the air cylinder 36 is started to move the two groups of clamping jaws 35 in the displacement groove 32, and the clamping jaws 35 are synchronously displaced on the top of the tray 31 to clamp the wafer under the cooperation of the displacement groove 32, the rotating block 33 and the connecting piece 34; when the tension sensor 6 senses that the clamping jaws 35 have a proper clamping force on the wafer, the operation of the air cylinder 36 is stopped, and the clamping is completed; and the above-mentioned arrangement enables the device to clamp wafers of various sizes.

[0048] During the clamping of the wafer by the clamping jaws 35, the impact force during the clamping and releasing of the wafer is absorbed and reduced through the cooperation between the second screw rod 51, the sliding rod 52 and the tension spring 53, so as to avoid the breakage or surface scratch of the wafer caused by the sudden force; and through the cooperation between the through-shaft type lead screw motor 54 and the limiting rod 55, the through-shaft type lead screw motor 54 can be transversely displaced on the surface of the second screw rod 51 when the through-shaft type lead screw motor 54 operates, so as to change the tension of the tension spring 53, and the clamping force of the clamping jaws 35 on the wafer is accurately changed according to the pressure data obtained by the tension sensor 6; the accurate clamping force can ensure that the wafer maintains a stable position during the whole cleaning process, and helps to improve the uniformity of the distribution of the cleaning agent and the consistency of the cleaning effect.

[0049] Please refer to Figures 8-10 The present application provides a technical solution: a wafer cleaning spray cleaning machine, the spray mechanism 4 includes a mounting table 41, the top of the mounting table 41 is fixedly installed with a telescopic column 42, the inside of the telescopic column 42 is slidably installed with a mounting rod 43, one end of the mounting rod 43 is fixedly installed with an atomizing nozzle 44, and one side of a group of clamping jaws 35 is fixedly installed with a distance sensor 7.

[0050] The top of the mounting table 41 is rotatably installed with a mounting block 45, the top of the mounting block 45 is provided with a mounting column 46, the top of the mounting column 46 is rotatably installed with a second connecting rod 47, and the second connecting rod 47 is rotatably installed at the bottom of the mounting rod 43.

[0051] The inside of the mounting block 45 is rotatably installed with a first screw rod 48, the second connecting rod 47 is threadedly connected to the outer wall of the first screw rod 48, one side of the mounting block 45 is fixedly installed with a second motor 49, and the output shaft of the second motor 49 is fixedly connected to one side of the first screw rod 48 through a shaft coupling.

[0052] The embodiment is characterized in that: the wafer on the top of the clamping mechanism 3 is sprayed and cleaned by the atomizing nozzle 44, and the atomizing nozzle 44 can be displaced up and down by the telescopic column 42, which facilitates the installation and removal of the wafer on the top of the clamping mechanism 3. Meanwhile, the atomizing nozzle 44 can be reciprocally and linearly displaced on the top of the wafer by the rotary mounting block 45, the mounting column 46 and the second connecting rod 47, so that the atomizing nozzle 44 can ensure that each part of the wafer surface is uniformly covered by the cleaning liquid, eliminate the cleaning dead angle and ensure the cleanliness of the wafer surface.

[0053] The distance between the two groups of clamping jaws 35 is measured by the distance sensor 7, and then the radius of the wafer is obtained. According to the obtained radius, the first screw rod 48 is rotated by the second motor 49, and then the second connecting rod 47 is displaced on the top of the mounting block 45, thereby changing the distance and position of the reciprocating displacement of the atomizing nozzle 44, so that the atomizing nozzle 44 can always reciprocally displace from the outer wall of the wafer to the center of the wafer, and the precision of the reciprocating displacement spraying is ensured.

[0054] Working principle: when the wafer cleaning spraying machine and the method thereof are used, the wafer is placed on the top of the tray 31, the cylinder 36 is started to move the two groups of clamping jaws 35 in the displacement groove 32, and the clamping jaws 35 are synchronously displaced on the top of the tray 31 to clamp the wafer under the cooperation of the displacement groove 32, the rotating block 33 and the connecting piece 34. When the clamping jaws 35 have a suitable clamping force on the wafer, the operation of the cylinder 36 is stopped according to the sensing of the tension sensor 6, and the clamping is completed. The above-mentioned arrangement enables the device to clamp wafers of various sizes.

[0055] During the clamping of the wafer by the clamping jaws 35, the impact force during the clamping and releasing of the wafer is absorbed and reduced by the cooperation of the second screw rod 51, the slide rod 52 and the tension spring 53, so as to avoid the wafer from being broken or scratched due to sudden force. Meanwhile, the through-shaft type lead screw motor 54 can be transversely displaced on the surface of the second screw rod 51 when the through-shaft type lead screw motor 54 operates under the cooperation of the limiting rod 55, thereby changing the tension of the tension spring 53, and the clamping force of the clamping jaws 35 on the wafer is accurately changed according to the pressure data obtained by the tension sensor 6. The accurate clamping force can ensure that the wafer maintains a stable position during the entire cleaning process, which helps to improve the uniformity of the distribution of the cleaning agent and the consistency of the cleaning effect.

[0056] After clamping, the first belt pulley 212 is rotated by the first motor 211, and the clamping mechanism 3 is rotated under the cooperation of the first belt pulley 212, the transmission belt 213, the second belt pulley 214, the sliding sleeve 215 and the mounting disc 216. Under the cooperation of the sliding sleeve 215 and the mounting disc 216, the clamping mechanism 3 can be displaced up and down on the top of the rotating mechanism 21.

[0057] Through the cooperation between the first bevel gear 231, the second bevel gear 232 and the transmission rod 233, the first motor 211 drives the clamping mechanism 3 to rotate and drives the vibration mechanism 22 to operate at the same time. In this process, the angle deviation, radial deviation or axial deviation between the output shaft of the rotating mechanism 21 and the input shaft of the vibration mechanism 22 is compensated through the cross slider shaft coupling 234, so that the vibration mechanism 22 can be displaced on one side of the rotating mechanism 21;

[0058] The transmission rod 233 drives the transmission gear 223 to rotate, and then drives the eccentric block 224 to rotate. The eccentric block 224 drives the first connecting rod 222 to shake up and down inside the second belt pulley 214 through the cooperation between the mounting bracket 221 and the first connecting rod 222, and then makes the clamping mechanism 3 vibrate on the top of the transmission mechanism 2. In this process, the spring can help limit the amplitude of the vibration of the first connecting rod 222 through the cooperation between the mounting bracket 221, the baffle 225 and the first spring 226, so as to ensure that the vibration is within a safe and controllable range. Preventing excessive vibration from causing wafer damage;

[0059] The wafer on the top of the clamping mechanism 3 is sprayed and cleaned by the atomizing nozzle 44. In this process, the atomizing nozzle 44 can be displaced up and down through the telescopic column 42, which facilitates the installation and removal of the wafer from the top of the clamping mechanism 3. At the same time, through the rotation of the mounting block 45, the mounting rod 43 drives the atomizing nozzle 44 to reciprocate linearly on the top of the wafer under the cooperation between the mounting block 45, the mounting column 46 and the second connecting rod 47, so that the atomizing nozzle 44 can ensure that every part of the wafer surface can be uniformly covered by the cleaning liquid, eliminating the cleaning dead angle and ensuring the cleanliness of the wafer surface;

[0060] The distance between the two groups of clamping jaws 35 is measured by the distance sensor 7, and then the radius of the wafer is obtained. According to the obtained radius, the first screw rod 48 is driven to rotate by the second motor 49, and then the second connecting rod 47 is displaced on the top of the mounting block 45, and then the displacement distance and position of the atomizing nozzle 44 are changed, so that the atomizing nozzle 44 can always reciprocate from the outer wall of the wafer to the center of the wafer, ensuring the accuracy of reciprocating displacement.

[0061] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A spray cleaning machine for wafer cleaning, comprising a device frame (1), wherein a transmission mechanism (2) is fixedly installed inside the device frame (1), a clamping mechanism (3) is fixedly installed on the top of the transmission mechanism (2), and a spraying mechanism (4) is fixedly installed on one side of the clamping mechanism (3), characterized in that: The transmission mechanism (2) includes a rotating mechanism (21) and a linkage mechanism (23). A vibration mechanism (22) is fixedly installed inside the rotating mechanism (21). The output shaft of the rotating mechanism (21) is connected to one side of the vibration mechanism (22) through the linkage mechanism (23). The rotating mechanism (21) is fixedly installed at the bottom of the clamping mechanism (3). The rotating mechanism (21) drives the clamping mechanism (3) to rotate, and the linkage mechanism (23) drives the vibration mechanism (22) to run. In turn, the vibration mechanism (22) drives the clamping mechanism (3) to vibrate up and down, so that the wafer vibrates while rotating at the bottom of the spraying mechanism (4), which promotes the cleaning liquid to form a more uniform flow on the wafer surface, avoids the cleaning liquid from accumulating in some areas, and ensures that the entire wafer surface gets a consistent cleaning effect. The rotating mechanism (21) includes a first motor (211) and a mounting plate (216). The output shaft of the first motor (211) is fixedly connected to a first pulley (212) via a coupling. A transmission belt (213) is sleeved on the outer wall of the first pulley (212). A second pulley (214) is sleeved inside the transmission belt (213). Two sets of sliding sleeves (215) are fixedly installed on the top of the second pulley (214). The mounting plate (216) is movably installed inside the sliding sleeves (215). The mounting plate (216) is fixedly installed at the bottom of the clamping mechanism (3). The vibration mechanism (22) includes a mounting frame (221), which is rotatably mounted inside the second pulley (214). A first connecting rod (222) is slidably mounted inside the mounting frame (221). Two sets of transmission gears (223) are rotatably mounted on one side of the first connecting rod (222), and the two sets of transmission gears (223) mesh with each other. An eccentric block (224) is fixedly connected to one side of the transmission gears (223). A baffle (225) is fixedly mounted on the top of the first connecting rod (222), and the baffle (225) is fixedly mounted on the bottom of the mounting plate (216). A first spring (226) is sleeved on the outer wall of the first connecting rod (222), and the first spring (226) is disposed between the mounting frame (221) and the baffle (225). The linkage mechanism (23) includes a first bevel gear (231), which is fixedly mounted on the output shaft of the first motor (211). A second bevel gear (232) is meshed with one side of the first bevel gear (231). A transmission rod (233) is fixedly mounted on one side of the second bevel gear (232). The transmission rod (233) is fixedly connected to one side of the transmission gear (223). A cross-slider coupling (234) is fixedly mounted inside the transmission rod (233).

2. The spray cleaning machine for wafer cleaning according to claim 1, characterized in that, The clamping mechanism (3) includes a tray (31), the inside of which is provided with several displacement grooves (32). A rotating block (33) is rotatably mounted on the bottom of the tray (31). Several connecting pieces (34) are rotatably mounted on the bottom of the rotating block (33). A gripper (35) is rotatably mounted on one end of the connecting piece (34). The gripper (35) is slidably mounted inside the displacement groove (32).

3. The spray cleaning machine for wafer cleaning according to claim 2, characterized in that, The clamping mechanism (3) also includes a cylinder (36), which is disposed between the two sets of grippers (35). An adjustment mechanism (5) is fixedly installed on one side of the cylinder (36), and a tension sensor (6) is fixedly installed on one side of the adjustment mechanism (5). The adjustment mechanism (5) is fixedly installed on one side of the gripper (35) by the tension sensor (6).

4. The spray cleaning machine for wafer cleaning according to claim 3, characterized in that, The adjusting mechanism (5) includes a second screw (51), which is fixedly installed at the bottom of the gripper (35). A slide rod (52) is slidably installed inside the second screw (51). The slide rod (52) is fixedly installed on one side of the cylinder (36). A through-shaft type lead screw motor (54) is threadedly connected to the outer wall of the second screw (51). A tension spring (53) is sleeved on the outer wall of the second screw (51). The tension spring (53) is fixedly installed between the through-shaft type lead screw motor (54) and the slide rod (52). The adjusting mechanism (5) also includes a limiting rod (55), which is slidably installed inside the limiting rod (55).

5. The spray cleaning machine for wafer cleaning according to claim 1, characterized in that, The spraying mechanism (4) includes a mounting platform (41), a telescopic column (42) is fixedly installed on the top of the mounting platform (41), an installation rod (43) is slidably installed inside the telescopic column (42), and an atomizing nozzle (44) is fixedly installed at one end of the installation rod (43).

6. The spray cleaning machine for wafer cleaning according to claim 5, characterized in that, The mounting platform (41) is rotatably mounted with a mounting block (45), the mounting block (45) is provided with a mounting column (46) on the top, the mounting column (46) is rotatably mounted with a second connecting rod (47) on the top, the second connecting rod (47) is rotatably mounted with the bottom of the mounting rod (43), and a distance sensor (7) is fixedly mounted on one side of the gripper (35). The first screw (48) is rotatably mounted inside the mounting block (45), and the second connecting rod (47) is threadedly connected to the outer wall of the first screw (48). A second motor (49) is fixedly mounted on one side of the mounting block (45), and the output shaft of the second motor (49) is fixedly connected to one side of the first screw (48) through a coupling.

7. A method of using a spray cleaning machine for wafer cleaning, for use in the spray cleaning machine for wafer cleaning according to any one of claims 1-6, characterized in that, Includes the following steps: Step 1: Place the wafer on top of the tray (31), start the cylinder (36) to move the two sets of grippers (35) inside the displacement groove (32). With the cooperation of the displacement groove (32), the rotating block (33) and the connecting piece (34), the grippers (35) move synchronously on the top of the tray (31) to clamp the wafer. When the tension sensor (6) senses that the grippers (35) have a suitable clamping force on the wafer, stop the operation of the cylinder (36) to complete the clamping. Step 2: After clamping is completed, the first motor (211) drives the first pulley (212) to rotate. The cooperation between the first pulley (212), the transmission belt (213), the second pulley (214), the sliding sleeve (215), and the mounting plate (216) drives the clamping mechanism (3) to rotate. With the cooperation between the sliding sleeve (215) and the mounting plate (216), the clamping mechanism (3) moves up and down on the top of the rotating mechanism (21). Through the cooperation between the first bevel gear (231), the second bevel gear (232), and the transmission rod (233), the first motor (211) drives the clamping mechanism (3) to rotate while driving the vibration mechanism (22) to run. During this process, the cross-slider coupling (234) compensates for the angular deviation, radial deviation, or axial deviation between the output shaft of the rotating mechanism (21) and the input shaft of the vibration mechanism (22), so that the vibration mechanism (22) is displaced on one side of the rotating mechanism (21). The transmission rod (233) drives the transmission gear (223) to rotate, which in turn drives the eccentric block (224) to rotate. The eccentric block (224) drives the first connecting rod (222) to vibrate up and down inside the second pulley (214) through the cooperation between the mounting bracket (221) and the first connecting rod (222), which in turn causes the clamping mechanism (3) to vibrate on top of the transmission mechanism (2). During this process, through the cooperation between the mounting bracket (221), the baffle (225), and the first spring (226), the spring helps to limit the amplitude of the vibration of the first connecting rod (222), ensuring that the vibration is within a safe and controllable range, and preventing excessive vibration from damaging the wafer. While the rotating mechanism (21) drives the clamping mechanism (3) to rotate, the linkage mechanism (23) drives the vibration mechanism (22) to run, and then the vibration mechanism (22) drives the clamping mechanism (3) to vibrate up and down, so that the wafer vibrates while rotating at the bottom of the spraying mechanism (4), which promotes the cleaning fluid to form a more uniform flow on the wafer surface, avoids the cleaning fluid from accumulating in certain areas, and ensures that the entire wafer surface receives a consistent cleaning effect. Step 3: The wafer on top of the clamping mechanism (3) is sprayed and cleaned by the atomizing nozzle (44). During this process, the atomizing nozzle (44) is moved up and down by the telescopic column (42) to facilitate the installation and removal of the wafer from the top of the clamping mechanism (3). At the same time, by rotating the mounting block (45), the mounting rod (43) drives the atomizing nozzle (44) to move back and forth linearly on the top of the wafer in cooperation with the mounting block (45), the mounting column (46), and the second connecting rod (47), so that the atomizing nozzle (44) can ensure that every part of the wafer surface is evenly covered by the cleaning liquid, eliminating cleaning dead corners and ensuring the cleanliness of the wafer surface. Step 4: Calculate the distance between the two sets of grippers (35) by using the distance sensor (7) to obtain the radius of the wafer. Based on the obtained radius, drive the first screw (48) to rotate by the second motor (49), thereby driving the second connecting rod (47) to move at the top of the mounting block (45), thereby changing the distance and position of the atomizing nozzle (44) moving back and forth, so that the atomizing nozzle (44) always moves back and forth from the outer wall of the wafer to the center of the wafer, ensuring the accuracy of the back and forth spraying. Step 5: During the process of clamping the wafer by the jaws (35), the second screw (51), slide bar (52), and tension spring (53) work together to absorb and reduce the impact force when clamping and releasing the wafer, avoiding wafer breakage or surface scratches caused by sudden force. At the same time, through the cooperation between the through-shaft screw motor (54) and the limit rod (55), the through-shaft screw motor (54) moves laterally on the surface of the second screw (51) during operation, thereby changing the degree of tension of the tension spring (53). Combined with the pressure data obtained by the tension sensor (6), the clamping force of the jaws (35) on the wafer is precisely changed. The precise clamping force ensures that the wafer maintains a stable position throughout the cleaning process, which helps to improve the uniformity of the cleaning agent distribution and the consistency of the cleaning effect.

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