A durability performance testing method and system based on CYD integrated board
By analyzing the environment, vibration and impact test data of the integrated board, and comprehensively calculating durability performance indicators, the problem of insufficient comprehensive inspection of integrated boards in the existing technology is solved, and comprehensive inspection and detailed feedback on the performance of the integrated boards are achieved.
Patent Information
- Application Number
- CN202411124324.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2044-08-16
AI Technical Summary
The performance detection of integrated boards in the prior art is not comprehensive enough, and the durability performance of integrated boards cannot be fully understood through image information and fold resistance testing alone.
By acquiring and analyzing the environmental test data, vibration test data and impact test data of the integrated board, comprehensive analysis obtains durability performance test indicators and feedbacks the durability performance of the integrated board. Specifically, it includes obtaining indicators such as insulation resistance, dielectric strength and leakage current, constructing relevant calculation formulas, using the nonlinear least squares method to fit the curve, obtaining the weight ratio, and the analysis indicators are in the normal or abnormal range.
It realizes comprehensive inspection of the performance of the integrated board, can effectively detect the environmental resistance, vibration resistance and impact resistance of the integrated board, provide detailed performance feedback, and solves the problem of insufficient comprehensive detection in the prior art.
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Figure CN118640977B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of integrated board production, and in particular to a durability performance testing method and system based on a CYD integrated board. Background Art
[0002] With the development of society and the increase of electronic products, integrated boards are widely used in various fields, from household appliances to military equipment, from daily consumer goods to industrial control systems. In order to ensure that electronic products can operate stably in different environments, integrated boards are required to have good durability. As users' expectations for product quality and reliability increase, the durability requirements for integrated boards also increase.
[0003] The existing CYD integrated board durability test method and system realizes integrated board defect detection by collecting image information of the integrated board, processing the image information, and finally performing defect comparison to determine whether the integrated board meets product requirements.
[0004] For example, the invention patent with announcement number: CN114047123B announces a method and system for detecting defects in integrated board production, including: acquiring images of the integrated board; acquiring image information of multiple integrated boards through external detection equipment; secondly performing image processing; processing the acquired images and locating weld holes; finally performing defect comparison and outputting the processing results; judging whether the product requirements are met based on the comparison signals and outputting the results; at the same time, when performing weld hole defect detection, the positions of the weld holes will be matched first to ensure the accuracy of the position of each weld hole, thereby ensuring the accuracy of short circuit and open circuit detection, integrity detection and concave-convex detection.
[0005] For example, the patent application with publication number: CN116929956A discloses an in-situ folding precision tester for a flexible integrated circuit board, comprising a detection cylinder, on which two test frames are slidably arranged, an auxiliary bending mechanism for fixing and bending the middle part of the flexible integrated circuit board is centrally arranged on the detection cylinder, and a detector for detecting the on and off state of the flexible integrated circuit board is arranged in the detection cylinder; the test frame comprises a sliding sleeve, on the outer wall of the sliding sleeve a plurality of fixing rods are radiating outward, a socket board for plugging in the flexible integrated circuit board is arranged on the fixing rods, and the socket board is electrically connected to the detector, and the two ends of the flexible integrated circuit board are fixed by two test frames that move symmetrically back and forth on the detection cylinder, and when the auxiliary bending mechanism cooperates with the test frame to squeeze the flexible integrated circuit board, the middle part of the flexible integrated circuit board is pushed and pulled, so that two-way large curvature bending tests are performed on multiple flexible integrated circuit boards at the same time.
[0006] However, in the process of implementing the technical solution of the invention in the embodiments of the present application, the present application found that the above technology has at least the following technical problems:
[0007] In the prior art, integrated board production defect detection is achieved by collecting integrated board image information and comparing the image information to detect weld hole defects. The folding resistance of the integrated board is determined by performing a folding resistance test on the integrated board. However, since only the integrated board defects and the folding resistance of the integrated board are tested, there is a problem that the performance test of the integrated board is not comprehensive enough. Summary of the invention
[0008] The embodiment of the present application solves the problem of insufficient comprehensive performance testing of integrated boards in the prior art by providing a durability performance testing method and system based on a CYD integrated board, and achieves comprehensive and specific testing of the performance of the integrated board.
[0009] The embodiment of the present application provides a durability performance testing method and system based on a CYD integrated board, comprising the following steps: obtaining environmental test data of the CYD integrated board and analyzing the environmental test data to obtain environmental test indicators; obtaining vibration test data of the CYD integrated board and analyzing the vibration test data to obtain vibration test indicators; obtaining impact test data of the CYD integrated board and analyzing the impact test data to obtain impact test indicators; comprehensively analyzing the environmental test indicators, vibration test indicators and impact test indicators to obtain durability performance test indicators; analyzing and feeding back the durability performance of the CYD integrated board according to the durability performance test indicators.
[0010] Furthermore, the environmental test data include: the first insulation resistance, the first dielectric strength and the first leakage current of the CYD integrated board that has not been subjected to the environmental test, and the ring-measured insulation resistance, the ring-measured dielectric strength and the ring-measured leakage current of the CYD integrated board after the environmental test; the vibration test data include: the second insulation resistance, the second dielectric strength and the second leakage current of the CYD integrated board that has not been subjected to the vibration test, and the vibration insulation resistance, the vibration dielectric strength and the vibration leakage current of the CYD integrated board after the vibration test; the impact test data include: the third insulation resistance, the third dielectric strength and the third leakage current of the CYD integrated board that has not been subjected to the impact test, and the impact insulation resistance, the impact dielectric strength and the impact leakage current of the CYD integrated board after the impact test.
[0011] Furthermore, the environmental test index represents the performance status of the CYD integrated board after the environmental test; the vibration test index represents the performance status of the CYD integrated board after the vibration test; the impact test index represents the performance status of the CYD integrated board after the impact test.
[0012] Furthermore, the specific method for obtaining the environmental test index is: obtaining the preset weight ratio of the ring test insulation resistance, the ring test dielectric strength and the ring test leakage current from the database; constructing the environmental test index calculation formula; the specific environmental test index calculation formula is:
[0013] ;
[0014] In the formula, Expressed as environmental test indicators, It is expressed as the ring insulation resistance after environmental testing. It is expressed as the first insulation resistance of the CYD integrated board before environmental testing. It is the ring-tested dielectric strength of the CYD integrated board after environmental testing. It is expressed as the first dielectric strength of the CYD integrated board before environmental testing. It represents the ring leakage current of the CYD integrated board after environmental testing. It is the first leakage current of CYD integrated board before environmental test. It is expressed as the weight ratio of the ring insulation resistance in the environmental test index. It is expressed as the weight ratio of the ring test dielectric strength in the environmental test index. It is expressed as the weight ratio of the ring leakage current in the environmental test index. is a natural constant.
[0015] Furthermore, the specific analysis process of the environmental test indicator is: obtain the environmental test indicator, obtain the first threshold value of the environmental test indicator and the second threshold value of the environmental test indicator, compare the environmental test indicator with the first threshold value of the environmental test indicator and the second threshold value of the environmental test indicator, when the environmental test indicator is less than the first threshold value of the environmental test indicator and greater than the second threshold value of the environmental test indicator, it indicates that the environmental test indicator is in a normal range, that is, the environmental resistance of the CYD integrated board after the environmental test is in a passing range; when it is in other situations, it indicates that the environmental test indicator is in an abnormal range, that is, the environmental resistance of the CYD integrated board after the environmental test is in a failing range.
[0016] Furthermore, the specific analysis process of the vibration test index is: obtaining the vibration test index, obtaining a first threshold value of the vibration test index and a second threshold value of the vibration test index, comparing the vibration test index with the first threshold value of the vibration test index and the second threshold value of the vibration test index; when the vibration test index is less than the first threshold value of the vibration test index and greater than the second threshold value of the vibration test index, it indicates that the vibration test index is in a normal range, that is, the vibration resistance of the CYD integrated board is in a passing range after the vibration test; when it is in other situations, it indicates that the vibration test index is in an abnormal range, that is, the vibration resistance of the CYD integrated board is in a failing range after the vibration test.
[0017] Furthermore, the specific analysis process of the impact test index is: obtain the impact test index, obtain the first threshold value of the impact test index and the second threshold value of the impact test index, compare the impact test index with the first threshold value of the impact test index and the second threshold value of the impact test index, when the impact test index is less than the first threshold value of the impact test index and greater than the second threshold value of the impact test index, it indicates that the impact test index is in a normal range, that is, the impact resistance of the CYD integrated board after the impact test is in a passing range; when it is in other situations, it indicates that the impact test index is in an abnormal range, that is, the impact resistance of the CYD integrated board after the impact test is in a failing range.
[0018] Furthermore, the specific method for obtaining the durability performance test index is: obtaining the weight ratio of the preset environmental test index, vibration test index and impact test index from the database; constructing a durability performance test index calculation formula; the specific durability performance test index calculation formula is:
[0019] ;
[0020] In the formula, It is expressed as the durability performance test index of CYD integrated board. It is expressed as the environmental test index of CYD integrated board. It is expressed as the vibration test index of CYD integrated board. It is expressed as the impact test index of CYD integrated board. It is expressed as the weight ratio of environmental test index in the durability performance test index of CYD integrated board. It is expressed as the weight ratio of vibration test index in the durability performance test index of CYD integrated board. It is expressed as the weight ratio of the impact test index in the durability performance test index of the CYD integrated board. is a natural constant.
[0021] Furthermore, the specific analysis process of analyzing and feeding back the durability performance of the CYD integrated board according to the durability performance test index is: obtaining the durability performance test index, obtaining a first threshold value of the durability performance test index and a second threshold value of the durability performance test index, comparing the durability performance test index with the first threshold value of the durability performance test index and the second threshold value of the durability performance test index; when the durability performance test index is less than the first threshold value of the durability performance test index and greater than the second threshold value of the durability performance test index, it indicates that the durability performance test index is in a normal range, that is, the durability performance of the CYD integrated board is in a passing range; when it is in other situations, it indicates that the durability performance test index is in an abnormal range, that is, the durability performance of the CYD integrated board is in a failing range.
[0022] The embodiment of the present application provides a durability performance test system based on a CYD integrated board, including: an environmental test data acquisition module, a vibration test data acquisition module, an impact test data acquisition module, a data analysis module and a feedback module; wherein the environmental test data acquisition module is used to acquire the environmental test data of the CYD integrated board and analyze the environmental test data to obtain the environmental test index; the vibration test data acquisition module is used to acquire the vibration test data of the CYD integrated board and analyze the vibration test data to obtain the vibration test index; the impact test data acquisition module is used to acquire the impact test data of the CYD integrated board and analyze the impact test data to obtain the impact test index; the data analysis module is used to comprehensively analyze the environmental test index, the vibration test index and the impact test index to obtain the durability performance test index; the feedback module is used to analyze and feedback the durability performance of the CYD integrated board according to the durability performance test index.
[0023] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
[0024] 1. By acquiring and analyzing the environmental test data, vibration test data and impact test data of the CYD integrated board, the environmental test indicators, vibration test indicators and impact test indicators are obtained, and the environmental test indicators, vibration test indicators and impact test indicators are comprehensively analyzed to obtain the durability performance test indicators of the CYD integrated board, so as to analyze the durability performance test indicators and provide feedback on the durability performance of the CYD integrated board, thereby realizing a comprehensive and specific performance test of the integrated board, and effectively solving the problem that the performance test of the integrated board in the prior art is not comprehensive enough.
[0025] 2. By acquiring and analyzing the ring-test insulation resistance, ring-test dielectric strength and ring-test leakage current, the environmental test indicators of the CYD integrated board after environmental testing are obtained, thereby realizing the detection of the environmental resistance of the CYD integrated board.
[0026] 3. By acquiring and analyzing the vibration insulation resistance, vibration dielectric strength and vibration leakage current, the environmental test indicators of the CYD integrated board after the vibration test are obtained, thereby realizing the detection of the vibration resistance of the CYD integrated board. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 A flow chart of a durability performance testing method based on a CYD integrated board provided in an embodiment of the present application;
[0028] Figure 2 A durability performance test index curve diagram provided in an embodiment of the present application;
[0029] Figure 3A schematic diagram of the structure of a durability performance testing system based on a CYD integrated board provided in an embodiment of the present application. DETAILED DESCRIPTION
[0030] The embodiment of the present application solves the problem of insufficient comprehensiveness of the performance detection of the integrated board in the prior art by providing a durability performance testing method and system based on the CYD integrated board. The environmental test index, vibration test index and impact test index are obtained by acquiring and analyzing the environmental test data, vibration test data and impact test data of the CYD integrated board. The environmental test index, vibration test index and impact test index are comprehensively analyzed to obtain the durability performance test index of the CYD integrated board, thereby analyzing the durability performance test index and providing feedback on the durability performance of the CYD integrated board, thereby achieving comprehensive and specific detection of the performance of the integrated board.
[0031] The technical solution in the embodiment of the present application is to solve the problem that the performance detection of the integrated board is not comprehensive enough. The overall idea is as follows:
[0032] Environmental test indicators are obtained by obtaining the first insulation resistance, the first dielectric strength, the first leakage current, the ring-measured insulation resistance, the ring-measured dielectric strength and the ring-measured leakage current; vibration test indicators are obtained by obtaining the second insulation resistance, the second dielectric strength, the second leakage current, the vibration insulation resistance, the vibration dielectric strength and the vibration leakage current; impact test indicators are obtained by obtaining the third insulation resistance, the third dielectric strength, the third leakage current, the impact insulation resistance, the impact dielectric strength and the impact leakage current; the environmental test indicators, the vibration test indicators and the impact test data indicators are comprehensively analyzed to obtain the durability performance indicators; the durability performance of the CYD integrated board is analyzed and fed back according to the durability performance test indicators, thereby achieving a comprehensive and specific effect of detecting the performance of the integrated board.
[0033] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0034] like Figure 1 As shown, it is a flow chart of a durability performance testing method based on a CYD integrated board provided in an embodiment of the present application, the method comprising the following steps: obtaining environmental test data of the CYD integrated board and analyzing the environmental test data to obtain environmental test indicators; obtaining vibration test data of the CYD integrated board and analyzing the vibration test data to obtain vibration test indicators; obtaining impact test data of the CYD integrated board and analyzing the impact test data to obtain impact test indicators; comprehensively analyzing the environmental test indicators, vibration test indicators and impact test indicators to obtain durability performance test indicators; analyzing and feeding back the durability performance of the CYD integrated board according to the durability performance test indicators.
[0035] In this embodiment, the process of obtaining environmental test data is as follows: placing the CYD integrated board in a thermal cycle test box, performing a cycle change from low temperature to high temperature on the CYD integrated board, and then placing the CYD integrated board in an alternating humidity environment, applying a test voltage to the CYD integrated board to measure the ring-measured insulation resistance, ring-measured dielectric strength and ring-measured leakage current of the CYD integrated board, so as to obtain environmental test data; the process of obtaining vibration test data is as follows: fixing the CYD integrated board on a vibration table, applying vibrations of different frequencies and amplitudes, applying a test voltage to the CYD integrated board to measure the vibration insulation resistance, vibration dielectric strength and vibration leakage current of the CYD integrated board, so as to obtain vibration test data; the process of obtaining impact test data is as follows: placing the CYD integrated board on an impact tester, applying a specified impact force, applying a test voltage to the CYD integrated board to measure the impact insulation resistance, impact dielectric strength and impact leakage current of the CYD integrated board, so as to obtain impact test data.
[0036] In this embodiment, when the durability performance test index of the CYD integrated board is in the normal range, the system feedback indicates that the durability performance of the CYD integrated board is good; when the durability performance test index of the CYD integrated board is in the abnormal range, the system feedback indicates that the durability performance of the CYD integrated board is poor.
[0037] Furthermore, the environmental test data include: the first insulation resistance, the first dielectric strength and the first leakage current of the CYD integrated board that has not been subjected to the environmental test, and the ring-measured insulation resistance, the ring-measured dielectric strength and the ring-measured leakage current of the CYD integrated board after the environmental test; the vibration test data include: the second insulation resistance, the second dielectric strength and the second leakage current of the CYD integrated board that has not been subjected to the vibration test, and the vibration insulation resistance, the vibration dielectric strength and the vibration leakage current of the CYD integrated board after the vibration test; the impact test data include: the third insulation resistance, the third dielectric strength and the third leakage current of the CYD integrated board that has not been subjected to the impact test, and the impact insulation resistance, the impact dielectric strength and the impact leakage current of the CYD integrated board after the impact test.
[0038] In this embodiment, the first insulation resistance, the second insulation resistance and the third insulation resistance are respectively the insulation resistances of the CYD integrated board that has not undergone environmental testing, vibration testing and impact testing, and the first insulation resistance, the second insulation resistance and the third insulation resistance are obtained by an insulation resistance tester, the first dielectric strength, the second dielectric strength and the third dielectric strength are respectively the dielectric strengths of the CYD integrated board that has not undergone environmental testing, vibration testing and impact testing, and the first dielectric strength, the second dielectric strength and the third dielectric strength are obtained by a dielectric strength tester, the first leakage current, the second leakage current and the third leakage current are respectively the leakage currents of the CYD integrated board that has not undergone environmental testing, vibration testing and impact testing, and the first leakage current, the second leakage current and the third leakage current are obtained by a leakage current tester. The ring-measured insulation resistance, vibration insulation resistance and impact insulation resistance are the insulation resistances of the CYD integrated board after environmental test, vibration test and impact test, respectively, and are all obtained through an insulation resistance tester. The ring-measured dielectric strength, vibration dielectric strength and impact dielectric strength are the dielectric strengths of the CYD integrated board after environmental test, vibration test and impact test, respectively, and are all obtained through a dielectric strength tester. The ring-measured leakage current, vibration leakage current and impact leakage current are the leakage currents of the CYD integrated board after environmental test, vibration test and impact test, respectively, and are all obtained through a leakage current tester.
[0039] Furthermore, the environmental test index indicates the performance status of the CYD integrated board after the environmental test; the vibration test index indicates the performance status of the CYD integrated board after the vibration test; and the impact test index indicates the performance status of the CYD integrated board after the impact test.
[0040] In this embodiment, the environment in which the CYD integrated board is located and the scenario in which the CYD integrated board is subjected to vibration and impact are simulated through environmental testing, vibration testing and impact testing to obtain environmental testing indicators, vibration testing indicators and impact testing indicators. The environmental testing indicators, vibration testing indicators and impact testing indicators respectively represent the performance conditions of the CYD integrated board after the environmental testing, vibration testing and impact testing. The durability of the CYD integrated board can be derived by comprehensively analyzing the performance conditions of the CYD integrated board after the environmental testing, vibration testing and impact testing.
[0041] Furthermore, the specific method for obtaining the environmental test index is: obtaining the preset weight ratio of the ring test insulation resistance, the ring test dielectric strength and the ring test leakage current from the database; constructing the environmental test index calculation formula; the specific environmental test index calculation formula is:
[0042] ;
[0043] In the formula, Expressed as environmental test indicators, It is expressed as the ring insulation resistance after environmental testing. It is expressed as the first insulation resistance of the CYD integrated board before environmental testing. It is the ring-tested dielectric strength of the CYD integrated board after environmental testing. It is expressed as the first dielectric strength of the CYD integrated board before environmental testing. It represents the ring leakage current of the CYD integrated board after environmental testing. It is the first leakage current of CYD integrated board before environmental test. It is expressed as the weight ratio of the ring insulation resistance in the environmental test index. It is expressed as the weight ratio of the ring test dielectric strength in the environmental test index. It is expressed as the weight ratio of the ring leakage current in the environmental test index. is a natural constant.
[0044] In this embodiment, Represents the environmental resistance of CYD integrated board. It represents the ability of the insulating material on the CYD integrated board to block the flow of current after environmental testing, and it represents the ability of the CYD integrated board to prevent current leakage and short circuit risks after environmental testing. It represents the ability of the insulating material on the CYD integrated board that has not undergone environmental testing to block the flow of current, and it represents the ability of the CYD integrated board that has not undergone environmental testing to prevent current leakage and short circuit risks. It represents the maximum voltage that the CYD integrated board can withstand without breakdown under the action of electric field after environmental testing. It represents the maximum voltage that the CYD integrated board can withstand without breakdown under the action of electric field without environmental testing. Represents the tiny current of the insulation material or electrical gap of the CYD integrated board after environmental testing. Represents a tiny current that has not been tested environmentally in the CYD board insulation material or electrical clearance.
[0045] In this embodiment, historical data related to environmental test indicators are obtained, and the relationship between the ring-measured insulation resistance, ring-measured dielectric strength, ring-measured leakage current and the environmental test indicators is found. The nonlinear least squares method is used to perform curve fitting to obtain a first fitting curve. The fitting effect of the first fitting curve is obtained by analyzing the root mean square error. The first fitting curve with the smallest root mean square error is used as the first fitting curve with the best fitting effect. The real-time ring-measured insulation resistance, ring-measured dielectric strength and ring-measured leakage current are brought into the first fitting curve to obtain the corresponding weight ratio.
[0046] In this embodiment, the ring-measured insulation resistance, the ring-measured dielectric strength and the ring-measured leakage current all reflect the performance of the CYD integrated board after the environmental test. This embodiment comprehensively analyzes the relationship between the ring-measured insulation resistance, the ring-measured dielectric strength and the ring-measured leakage current after the environmental test and the first insulation resistance, the first dielectric strength and the first leakage current before the environmental test, so as to more accurately obtain the environmental resistance of the CYD integrated board. The above formula uses logarithmic operation to perform nonlinear transformation on the formula to smooth the influence of abnormal values, so that the obtained environmental test indicators are more reliable and explanatory.
[0047] Furthermore, the specific analysis process of the environmental test indicators is: obtain the environmental test indicators, obtain the first threshold value of the environmental test indicators and the second threshold value of the environmental test indicators, compare the environmental test indicators with the first threshold value of the environmental test indicators and the second threshold value of the environmental test indicators, when the environmental test indicators are less than the first threshold value of the environmental test indicators and greater than the second threshold value of the environmental test indicators, it indicates that the environmental test indicators are in the normal range, that is, the environmental resistance of the CYD integrated board after the environmental test is in the passing range; when in other situations, it indicates that the environmental test indicators are in the abnormal range, that is, the environmental resistance of the CYD integrated board after the environmental test is in the failing range.
[0048] In this embodiment, the environmental test indicator historical data is obtained, and the first environmental test indicator threshold and the second environmental test indicator threshold are determined according to the environmental test indicator historical data. The first environmental test indicator threshold and the second environmental test indicator threshold are respectively and , The value range is , The value range is , when the environmental test index is less than the first threshold value of the environmental test index and greater than the second threshold value of the environmental test index, that is, , indicating that the environmental test indicators are within the normal range, that is, after the environmental test, the environmental resistance of the CYD integrated board is within the qualified range; when it is in other situations, that is, or , it means that the environmental test index is in the abnormal range, that is, the environmental resistance of the CYD integrated board is in the unqualified range after the environmental test.
[0049] Furthermore, the specific analysis process of the vibration test index is: obtaining the vibration test index, obtaining the first threshold value of the vibration test index and the second threshold value of the vibration test index, comparing the vibration test index with the first threshold value of the vibration test index and the second threshold value of the vibration test index; when the vibration test index is less than the first threshold value of the vibration test index and greater than the second threshold value of the vibration test index, it indicates that the vibration test index is in a normal range, that is, the vibration resistance of the CYD integrated board is in a passing range after the vibration test; when it is in other situations, it indicates that the vibration test index is in an abnormal range, that is, the vibration resistance of the CYD integrated board is in a failing range after the vibration test.
[0050] In this embodiment, the specific method for obtaining the vibration test index is: obtaining the preset weight ratio of vibration insulation resistance, vibration dielectric strength and vibration leakage current from the database; constructing a vibration test index calculation formula; the specific vibration test index calculation formula is:
[0051] ;
[0052] In the formula, Expressed as a vibration test index, Expressed as the vibration insulation resistance after vibration test, It is expressed as the second insulation resistance of the CYD integrated board before the vibration test. Vibration dielectric strength of CYD integrated board after vibration test, It is expressed as the second dielectric strength of the CYD integrated board before the vibration test. It is expressed as the vibration leakage current of the CYD integrated board after the vibration test. It is represented as the second leakage current of CYD integrated board before vibration test. It is expressed as the weight ratio of vibration insulation resistance in vibration test index. It is expressed as the weight ratio of vibration dielectric strength in vibration test index. It is expressed as the weight ratio of vibration leakage current in the vibration test index. is a natural constant.
[0053] In this embodiment, Represents the vibration resistance of the CYD integrated board. It represents the ability of the insulating material on the CYD integrated board to block the flow of current after the vibration test, and it represents the ability of the CYD integrated board to prevent current leakage and short circuit risks after the vibration test. It represents the ability of the insulating material on the CYD integrated board that has not been tested for vibration to prevent the flow of current. It represents the ability of the CYD integrated board that has not been tested for vibration to prevent current leakage and short circuit risks. It represents the maximum voltage that the CYD integrated board can withstand without breakdown under the action of electric field after vibration test. It represents the maximum voltage that the CYD integrated board can withstand without breakdown under the action of electric field without vibration test. Represents the tiny current of the insulation material or electrical gap of the CYD integrated board after the vibration test. Represents a tiny current that has not been tested for vibration in the CYD board insulation or electrical clearances.
[0054] In this embodiment, historical data related to the vibration test index is obtained, the relationship between the vibration insulation resistance, vibration dielectric strength and vibration leakage current and the vibration test index is found, and the curve fitting is performed using the nonlinear least squares method to obtain a second fitting curve. The fitting effect of the second fitting curve is obtained by analyzing the root mean square error, and the second fitting curve with the smallest root mean square error is used as the second fitting curve with the best fitting effect. The real-time vibration insulation resistance, vibration dielectric strength and vibration leakage current are brought into the second fitting curve to obtain the corresponding weight ratio.
[0055] In this embodiment, the vibration insulation resistance, vibration dielectric strength and vibration leakage current all reflect the performance of the CYD integrated board after the vibration test. This embodiment comprehensively analyzes the relationship between the vibration insulation resistance, vibration dielectric strength and vibration leakage current after the vibration test and the second insulation resistance, second dielectric strength and second leakage current before the vibration test, thereby obtaining the vibration resistance of the CYD integrated board. The above formula uses exponential operation to perform nonlinear transformation on the formula to smooth the influence of abnormal values, which is conducive to reducing the distortion of the overall evaluation by extreme cases and making the obtained vibration test indicators more accurate.
[0056] In this embodiment, the historical data of the vibration test index is obtained, and the first threshold value of the vibration test index and the second threshold value of the vibration test index are determined according to the historical data of the vibration test index. The first threshold value of the vibration test index and the second threshold value of the vibration test index are respectively and , The value range is , The value range is , when the vibration test index is less than the first threshold value of the vibration test index and greater than the second threshold value of the vibration test index, that is, , indicating that the vibration test index is within the normal range, that is, after the vibration test, the vibration resistance of the CYD integrated board is within the qualified range; when it is in other situations, that is, or , it means that the vibration test index is in the abnormal range, that is, the vibration resistance of the CYD integrated board is in the unqualified range after the vibration test.
[0057] Furthermore, the specific analysis process of the impact test index is: obtain the impact test index, obtain the first threshold value of the impact test index and the second threshold value of the impact test index, compare the impact test index with the first threshold value of the impact test index and the second threshold value of the impact test index, when the impact test index is less than the first threshold value of the impact test index and greater than the second threshold value of the impact test index, it means that the impact test index is in the normal range, that is, the impact resistance of the CYD integrated board after the impact test is in the passing range; when it is in other situations, it means that the impact test index is in the abnormal range, that is, the impact resistance of the CYD integrated board after the impact test is in the failing range.
[0058] In this embodiment, the specific method for obtaining the impact test index is: obtaining the preset weight ratio of the impact insulation resistance, the impact dielectric strength and the ring leakage current from the database; constructing the impact test index calculation formula; the specific impact test index calculation formula is:
[0059] ;
[0060] In the formula, Expressed as an impact test index, It is expressed as the impact insulation resistance after the impact test. It is expressed as the third insulation resistance of the CYD integrated board before the impact test. Impact dielectric strength of CYD integrated board after impact test, It is expressed as the third dielectric strength of the CYD integrated board before the impact test. It is the impact leakage current of CYD integrated board after impact test. It is represented as the third leakage current of CYD integrated board before impact test. It is expressed as the weight ratio of the impact insulation resistance in the impact test index. It is expressed as the weight ratio of the impact dielectric strength in the impact test index. It is expressed as the weight ratio of the impact leakage current in the impact test index. is a natural constant.
[0061] In this embodiment, Represents the impact resistance of CYD integrated board. It represents the ability of the insulating material on the CYD integrated board to block the flow of current after the impact test, and represents the ability of the CYD integrated board to prevent current leakage and short circuit risks after the impact test. It represents the ability of the insulating material on the CYD integrated board that has not been impact tested to block the flow of current, and it represents the ability of the CYD integrated board that has not been impact tested to prevent current leakage and short circuit risks. It represents the maximum voltage that the CYD integrated board can withstand without breakdown under the action of electric field after impact test. It represents the maximum voltage that the CYD integrated board can withstand without breakdown under the action of electric field without undergoing impact test. Represents the tiny current of the insulation material or electrical gap of the CYD integrated board after the impact test. Represents a small current that has not been impact tested on the CYD integrated board insulation material or electrical clearance.
[0062] In this embodiment, historical data related to the impact test indicators are obtained, the relationship between the impact insulation resistance, impact dielectric strength, impact leakage current and the impact test indicators is found, and the curve fitting is performed using the nonlinear least squares method to obtain a third fitting curve. The fitting effect of the third fitting curve is obtained by analyzing the standard error, and the third fitting curve with the smallest standard error is used as the third fitting curve with the best fitting effect. The real-time impact insulation resistance, impact dielectric strength and impact leakage current are brought into the third fitting curve to obtain the corresponding weight ratio.
[0063] In this embodiment, the impact insulation resistance, impact dielectric strength and impact leakage current all reflect the performance of the CYD integrated board after the impact test. This embodiment comprehensively analyzes the relationship between the impact insulation resistance, impact dielectric strength and impact leakage current after the impact test and the second insulation resistance, second dielectric strength and second leakage current before the impact test, thereby obtaining the impact resistance of the CYD integrated board. The above formula performs square root processing on the data, which can compress the impact test data, reduce the influence of extreme values, and make the obtained impact test indicators more reliable.
[0064] In this embodiment, the historical data of the impact test indicator is obtained, and the first threshold value of the impact test indicator and the second threshold value of the impact test indicator are determined according to the historical data of the impact test indicator. The first threshold value of the impact test indicator and the second threshold value of the impact test indicator are respectively and , The value range is , The value range is , when the impact test index is less than the first impact test index threshold and greater than the second impact test index threshold, that is, , indicating that the impact test index is within the normal range, that is, after the impact test, the impact resistance of the CYD integrated board is within the qualified range; when it is in other situations, that is, or , it means that the impact test index is in the abnormal range, that is, the impact resistance of the CYD integrated board is in the unqualified range after the impact test.
[0065] Furthermore, the specific method for obtaining the durability performance test index is: obtaining the weight ratio of the preset environmental test index, vibration test index and impact test index from the database; constructing a durability performance test index calculation formula; the specific durability performance test index calculation formula is:
[0066] ;
[0067] In the formula, It is expressed as the durability performance test index of CYD integrated board. It is expressed as the environmental test index of CYD integrated board. It is expressed as the vibration test index of CYD integrated board. It is expressed as the impact test index of CYD integrated board. It is expressed as the weight ratio of environmental test index in the durability performance test index of CYD integrated board. It is expressed as the weight ratio of vibration test index in the durability performance test index of CYD integrated board. It is expressed as the weight ratio of the impact test index in the durability performance test index of the CYD integrated board. is a natural constant.
[0068] In this embodiment, historical data related to the durability performance test index is obtained, the relationship between the environmental test index, the vibration test index, the impact test index and the durability performance test index is found, and the curve fitting is performed using the nonlinear least squares method to obtain a fourth fitting curve. The fitting effect of the fourth fitting curve is obtained by analyzing the root mean square error, and the fourth fitting curve with the smallest root mean square error is used as the fourth fitting curve with the best fitting effect. The real-time environmental test index, the vibration test index and the impact test index are brought into the fourth fitting curve to obtain the corresponding weight ratio.
[0069] In this embodiment, the influence of environmental test index, vibration test index and impact test index on durability test index is comprehensively considered, and the performance of CYD integrated board after environmental test, vibration test and impact test is considered. The closer the environmental test index, vibration test index and impact test index are to the normal range, the better the durability performance of CYD integrated board is. This embodiment adopts hyperbolic tangent function for nonlinear transformation, which is helpful to improve the accuracy of durability test index and make the obtained durability test index more stable and reliable.
[0070] like Figure 2As shown, it is a durability performance test index curve diagram provided by the embodiment of the present application, with the environmental test index as the independent variable and the durability performance test index as the dependent variable. Through the increase and decrease analysis of curve 1, curve 2 and curve 3, it can be seen that when the environmental test index is larger, the durability performance test index is larger; when the environmental test index is smaller, the durability performance test index is smaller. The relevant data statistics of the durability performance test index are shown in Table 1:
[0071] Table 1 Statistics of durability performance test indicators
[0072]
[0073] It can be seen from Table 1 that for Curve 1, Curve 2 and Curve 3, when the environmental test index of Curve 1, Curve 2 and Curve 3 is 1.00, when the vibration test index of Curve 1, Curve 2 and Curve 3 is 0.60, 1.00 and 1.40 respectively, and other parameters are consistent, the durability performance test index of Curve 1, Curve 2 and Curve 3 is 0.96, 1.00 and 1.04 respectively. It can be seen that when the environmental test index is consistent with other parameters, when the vibration test index is larger, the durability performance test index is larger.
[0074] Furthermore, the specific analysis process of analyzing and feeding back the durability performance of the CYD integrated board according to the durability performance test index is: obtaining the durability performance test index, obtaining the first threshold value of the durability performance test index and the second threshold value of the durability performance test index, comparing the durability performance test index with the first threshold value of the durability performance test index and the second threshold value of the durability performance test index; when the durability performance test index is less than the first threshold value of the durability performance test index and greater than the second threshold value of the durability performance test index, it indicates that the durability performance test index is in a normal range, that is, the durability performance of the CYD integrated board is in a passing range; when it is in other situations, it indicates that the durability performance test index is in an abnormal range, that is, the durability performance of the CYD integrated board is in a failing range.
[0075] In this embodiment, the durability performance test indicator historical data is obtained, and the first threshold value of the durability performance test indicator and the second threshold value of the durability performance test indicator are determined according to the durability performance test indicator historical data. The first threshold value of the durability performance test indicator and the second threshold value of the durability performance test indicator are respectively and , The value range is , The value range is , when the durability performance test index is less than the first threshold value of the durability performance test index and greater than the second threshold value of the durability performance test index, that is, , indicating that the durability test index is within the normal range, that is, after the durability test, the durability of the CYD integrated board is within the qualified range; when it is in other situations, that is or , it means that the durability test index is in the abnormal range, that is, after the durability test, the durability resistance of the CYD integrated board is in the unqualified range.
[0076] like Figure 3 As shown, it is a structural schematic diagram of a durability performance test system based on a CYD integrated board provided in an embodiment of the present application. A durability performance test system based on a CYD integrated board provided in an embodiment of the present application includes: an environmental test data acquisition module, a vibration test data acquisition module, an impact test data acquisition module, a data analysis module and a feedback module; wherein the environmental test data acquisition module is used to acquire the environmental test data of the CYD integrated board and analyze the environmental test data to obtain the environmental test index; the vibration test data acquisition module is used to acquire the vibration test data of the CYD integrated board and analyze the vibration test data to obtain the vibration test index; the impact test data acquisition module is used to acquire the impact test data of the CYD integrated board and analyze the impact test data to obtain the impact test index; the data analysis module is used to comprehensively analyze the environmental test index, the vibration test index and the impact test index to obtain the durability performance test index; the feedback module is used to analyze and feedback the durability performance of the CYD integrated board according to the durability performance test index.
[0077] In summary, the embodiment of the present application obtains and analyzes the environmental test data, vibration test data and impact test data of the CYD integrated board to obtain environmental test indicators, vibration test indicators and impact test indicators, and comprehensively analyzes the environmental test indicators, vibration test indicators and impact test indicators to obtain the durability performance test indicators of the CYD integrated board, thereby analyzing the durability performance test indicators and providing feedback on the durability performance of the CYD integrated board, thereby achieving comprehensive and specific performance testing of the integrated board, and effectively solving the problem of insufficient comprehensive performance testing of the integrated board in the prior art.
[0078] It will be appreciated by those skilled in the art that embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.
[0079] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.
[0080] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.
[0081] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.
[0082] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.
[0083] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.
Claims
1. A durability performance test method based on CYD integrated board, It is characterized in that The following steps are involved: Obtain the environmental test data of the CYD integrated board and analyze the environmental test data to obtain environmental test indicators; Obtain the vibration test data of the CYD integrated board and analyze the vibration test data to obtain the vibration test index; Obtain the impact test data of the CYD integrated board and analyze the impact test data to obtain the impact test index; Comprehensively analyze environmental test indicators, vibration test indicators and impact test indicators to obtain durability performance test indicators; Analyze and provide feedback on the durability of the CYD integrated board based on durability test indicators; The environmental test data include: the first insulation resistance, the first dielectric strength and the first leakage current of the CYD integrated board before the environmental test, and the ring-measured insulation resistance, the ring-measured dielectric strength and the ring-measured leakage current of the CYD integrated board after the environmental test; The vibration test data include: the second insulation resistance, the second dielectric strength and the second leakage current of the CYD integrated board before the vibration test, and the vibration insulation resistance, the vibration dielectric strength and the vibration leakage current of the CYD integrated board after the vibration test; The impact test data include: the third insulation resistance, the third dielectric strength and the third leakage current of the CYD integrated board before the impact test, and the impact insulation resistance, impact dielectric strength and impact leakage current of the CYD integrated board after the impact test; The specific method for obtaining the environmental test indicators is: Obtain preset weight ratios of loop insulation resistance, loop dielectric strength and loop leakage current from a database; Construct environmental test index calculation formula; The specific environmental test index calculation formula is: ; In the formula, Expressed as environmental test indicators, It is expressed as the ring insulation resistance after environmental testing. It is expressed as the first insulation resistance of the CYD integrated board before environmental testing. It is the ring-tested dielectric strength of the CYD integrated board after environmental testing. It is expressed as the first dielectric strength of the CYD integrated board before environmental testing. It represents the ring leakage current of the CYD integrated board after environmental testing. It is the first leakage current of CYD integrated board before environmental test. It is expressed as the weight ratio of the ring insulation resistance in the environmental test index. It is expressed as the weight ratio of the ring test dielectric strength in the environmental test index. It is expressed as the weight ratio of the ring leakage current in the environmental test index. is a natural constant; The specific method for obtaining the durability performance test index is as follows: Obtain the weight ratio of the preset environmental test index, vibration test index and shock test index from the database; Construct calculation formula for durability performance test index; The specific calculation formula for the durability performance test index is: ; In the formula, It is expressed as the durability performance test index of CYD integrated board. It is expressed as the environmental test index of CYD integrated board. It is expressed as the vibration test index of CYD integrated board. Expressed as the impact test index of CYD integrated board, It is expressed as the weight ratio of environmental test index in the durability performance test index of CYD integrated board. It is expressed as the weight ratio of vibration test index in the durability performance test index of CYD integrated board. It is expressed as the weight ratio of the impact test index in the durability performance test index of the CYD integrated board. is a natural constant.
2. A durability performance testing method based on a CYD integrated board as claimed in claim 1, It is characterized in that The environmental test index indicates the performance status of the CYD integrated board after the environmental test; The vibration test index indicates the performance status of the CYD integrated board after the vibration test; The impact test index indicates the performance status of the CYD integrated board after the impact test.
3. A durability performance testing method based on a CYD integrated board as claimed in claim 1, It is characterized in that The specific analysis process of the environmental test indicators is as follows: Obtain an environmental test indicator, obtain a first threshold value of the environmental test indicator and a second threshold value of the environmental test indicator, compare the environmental test indicator with the first threshold value of the environmental test indicator and the second threshold value of the environmental test indicator, when the environmental test indicator is less than the first threshold value of the environmental test indicator and greater than the second threshold value of the environmental test indicator, it indicates that the environmental test indicator is within a normal range, that is, the environmental resistance of the CYD integrated board is within a qualified range after the environmental test; When it is in other situations, it means that the environmental test indicators are in an abnormal range, that is, after the environmental test, the environmental resistance of the CYD integrated board is in a failing range.
4. A durability performance testing method based on a CYD integrated board as claimed in claim 1, It is characterized in that The specific analysis process of the vibration test index is as follows: Obtain a vibration test index, obtain a first threshold value of the vibration test index and a second threshold value of the vibration test index, compare the vibration test index with the first threshold value of the vibration test index and the second threshold value of the vibration test index, when the vibration test index is less than the first threshold value of the vibration test index and greater than the second threshold value of the vibration test index, it indicates that the vibration test index is within a normal range, that is, after the vibration test, the vibration resistance of the CYD integrated board is within a qualified range; When it is in other situations, it means that the vibration test index is in an abnormal range, that is, the vibration resistance of the CYD integrated board is in a failing range after the vibration test.
5. A durability performance testing method based on a CYD integrated board as claimed in claim 1, It is characterized in that The specific analysis process of the impact test index is as follows: Obtain an impact test index, obtain a first threshold value of the impact test index and a second threshold value of the impact test index, compare the impact test index with the first threshold value of the impact test index and the second threshold value of the impact test index, and when the impact test index is less than the first threshold value of the impact test index and greater than the second threshold value of the impact test index, it indicates that the impact test index is within a normal range, that is, the impact resistance of the CYD integrated board is within a qualified range after the impact test; When it is in other situations, it means that the impact test index is in an abnormal range, that is, the impact resistance of the CYD integrated board is in a failing range after the impact test.
6. A durability performance testing method based on a CYD integrated board as claimed in claim 1, It is characterized in that The specific analysis process of analyzing and feeding back the durability performance of the CYD integrated board according to the durability performance test index is as follows: Obtain a durability performance test index, obtain a first threshold value of the durability performance test index and a second threshold value of the durability performance test index, compare the durability performance test index with the first threshold value of the durability performance test index and the second threshold value of the durability performance test index, when the durability performance test index is less than the first threshold value of the durability performance test index and greater than the second threshold value of the durability performance test index, it indicates that the durability performance test index is within a normal range, that is, the durability performance of the CYD integrated board is within a qualified range; When it is in other situations, it means that the durability performance test index is in an abnormal range, that is, the durability performance of the CYD integrated board is in a failing range.
7. A system using the durability performance testing method based on the CYD integrated board as described in any one of claims 1 to 6, It is characterized in that include: Environmental test data acquisition module, vibration test data acquisition module, impact test data acquisition module, data analysis module and feedback module; The environmental test data acquisition module is used to acquire the environmental test data of the CYD integrated board and analyze the environmental test data to obtain environmental test indicators; The vibration test data acquisition module is used to acquire the vibration test data of the CYD integrated board and analyze the vibration test data to obtain the vibration test index; The shock test data acquisition module is used to acquire the shock test data of the CYD integrated board and analyze the shock test data to obtain the shock test index; The data analysis module is used to comprehensively analyze environmental test indicators, vibration test indicators and impact test indicators to obtain durability performance test indicators; The feedback module is used to analyze and feedback the durability performance of the CYD integrated board according to the durability performance test index.
