Comprehensive optimization design method for flow channel of free boundary liquid cooling plate with non-uniform heat load

Abstract

The present invention provides a method for comprehensive optimization design of flow channels of a free-boundary liquid cooling plate with non-uniform heat load, including: determining design parameters of a liquid cooling plate used in electronic equipment; determining multi-input and multi-output boundary conditions according to the design parameters, and determining the heat load in two non-uniform heat load application scenarios; establishing a comprehensive optimization design target of the liquid cooling plate using the design parameters, boundary conditions, and the heat load distribution; solving the comprehensive optimization design target to obtain the optimal design parameters of the liquid cooling plate to complete the flow channel layout design of the liquid cooling plate. The present invention proposes a comprehensive flow channel design method by comprehensively considering actual working conditions such as heat load, multi-input / output boundary conditions, and gravity direction, and also proposes two typical non-uniform heat loads of discrete and continuous types, and designs a design constraint function of the minimum unit maximum temperature difference. On the basis of improving the heat dissipation performance of the flow channel, the flow channel of the liquid cooling plate is more reasonable and has a wide range of engineering application value.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic equipment, and in particular relates to a comprehensive optimization design method for a flow channel of a free boundary liquid cooling plate with non-uniform heat load. Background Art

[0002] With the development trend of miniaturization, intelligence, high integration and multifunctionality of electronic equipment, the thermal problem of power devices in electronic equipment has become a key issue restricting its efficiency and performance. Thermal management has gradually become the core design of electronic equipment together with structural design, and the design concept of thermal-structural integration has also received more and more attention. Liquid cooling plates, as an efficient cooling carrier, can provide structural support and thermal control for electronic equipment at the same time. They are widely used in the substrate design of electronic equipment, among which the layout design of the flow channel is crucial.

[0003] Since Okkels introduced the temperature field into Navier-Stokes flow and successfully applied topology optimization to the design of micro-nano flow cooling systems, the design of heat dissipation systems based on topology optimization methods has become popular, including the morphology design of heat dissipation fins under natural convection and the layout design of flow channels under forced convection. The design results are also widely used in high-power electronic devices such as concentrated photovoltaic arrays, lithium battery arrays and transmitting antenna arrays, and a design model with the optimization of fluid dissipation power and surface temperature uniformity as the target has gradually been formed. In the past, in the flow channel design process based on topology optimization, the establishment of the objective function and the influence of the optimization parameters on the flow channel were usually considered, such as the weight factor of the multi-objective function and the penalty factor (Jiao Wang, Study of the influence of objective functions on the topology optimization design of battery cold plate, Applied Thermal Engineering 226 (2023) 120326; Zhuo Liu, Numerical analysis of topology-optimized cold plates for thermal management of battery packs, Applied Thermal Engineering 238 (2024) 121983; Chen Sun, Thermal design of composite cold plates by topology optimization, International Journal of Mechanical Sciences 259 (2023) 108594. etc.).

[0004] The flow channel distribution of the liquid cooling plate is not only related to the above factors, but also affected by factors including the surface heat load distribution, inlet and outlet boundary conditions, and the direction of gravity, which have been mostly ignored in previous studies. Among them, the heat load distribution is particularly important. The heat load distribution can be divided into two cases: the first case is the active phased array antenna, whose surface heat load depends on the T / R component unit, and the heat load distribution is mostly discrete; the second case is the concentrated photovoltaic conversion system. Due to the characteristics of the concentrated system, the heat distribution on the photovoltaic cell array is mostly continuous and non-uniform. Hengsong Ji (Topology design of cold plates for pouch battery thermal management considering heat distribution characteristics, Applied Thermal Engineering 224 (2023) 119940) expressed the heat load as a continuous function related to the design domain size, and compared it with the uniform heat load. However, the influence of the flow channel inlet and outlet on the flow channel distribution when the design is similar to the length and width ratio is ignored, which limits the further improvement of the performance of the liquid cooling plate. Summary of the invention

[0005] In order to solve the above problems existing in the prior art, the present invention provides a comprehensive optimization design method for the flow channel of a free boundary liquid cooling plate with non-uniform heat load. The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0006] The present invention provides a comprehensive optimization design method for a flow channel of a free boundary liquid cooling plate with non-uniform heat load, comprising:

[0007] S100, determining design parameters of a liquid cooling plate applied to the electronic device according to actual parameters of the electronic device;

[0008] S200, determining multi-input and multi-output boundary conditions of the liquid cooling plate according to the design parameters;

[0009] S300, establishing two discrete and continuous non-uniform heat load application scenarios, and determining heat loads in the two non-uniform heat load application scenarios;

[0010] S400, establishing a comprehensive optimization design target of the liquid cooling plate by using the design parameters, the boundary conditions and the heat load distribution;

[0011] S500, solving the comprehensive optimization design target to obtain optimal design parameters that comprehensively consider the heat load distribution and the inlet and outlet boundary positions.

[0012] The beneficial effects of the present invention are:

[0013] 1) The present invention proposes a comprehensive optimization design method for the flow channel of a free boundary liquid cooling plate with non-uniform heat load, and proposes a comprehensive flow channel design method that simultaneously considers actual working conditions such as heat load, multiple inlet / outlet boundary conditions and gravity direction, which can better meet actual engineering applications.

[0014] 2) The comprehensive optimization design method for the free boundary liquid cooling plate flow channel of the non-uniform heat load designed by the present invention proposes two typical non-uniform heat loads, discrete type and continuous type, which are more in line with the actual design conditions, and the designed flow channel is more general and has wider engineering applicability.

[0015] 3) The comprehensive optimization design method for the flow channel of the free boundary liquid cooling plate with non-uniform heat load designed in the present invention utilizes the topology optimization method to design the internal flow channel layout, and at the same time uses multiple inlet / outlet boundary conditions as design variables, getting rid of the manual experience in selecting the inlet and outlet positions, making the inlet / outlet boundary determination more scientific.

[0016] 4) The comprehensive optimization design method for the free boundary liquid cooling plate flow channel of the non-uniformly distributed heat load designed in the present invention proposes a design constraint method for the minimum unit maximum temperature difference, which is more in line with the local temperature uniformity requirements of electronic equipment and makes the design flow channel more reasonable.

[0017] 5) The comprehensive optimization design method for the free boundary liquid cooling plate flow channel with non-uniform heat load designed in the present invention can automatically and simultaneously design the optimal inlet / outlet boundary position and flow channel layout under any heat load, gravity direction and multiple boundary conditions, which can carry out more extensive discussions and research.

[0018] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a flow chart of the comprehensive optimization design method of the free boundary liquid cooling plate flow channel of the non-uniformly distributed heat load of the present invention;

[0020] Figure 2 It is a schematic diagram of the parameterized design of multiple input / output boundary conditions in the present invention;

[0021] Figure 3 It is a schematic diagram of two typical application scenarios of non-uniform heat load distribution in the present invention;

[0022] Figure 4 It is a schematic diagram of the definition of discrete non-uniform heat load in the present invention;

[0023] Figure 5 It is a schematic diagram of the definition of continuous non-uniform heat load in the present invention;

[0024] Figure 6It is a flow channel configuration diagram before comprehensive optimization of discrete non-uniform heat load in the present invention;

[0025] Figure 7 It is the temperature distribution diagram of the liquid cooling plate before the comprehensive optimization of the discrete non-uniform heat load in the present invention;

[0026] Figure 8 It is the minimum unit temperature diagram before comprehensive optimization of discrete non-uniform heat load in the present invention;

[0027] Fig. 9 It is a flow channel configuration diagram after comprehensive optimization of discrete non-uniform heat load in the present invention;

[0028] Fig.10 It is the temperature distribution diagram of the liquid cooling plate after comprehensive optimization of the discrete non-uniform heat load in the present invention;

[0029] Fig.11 It is the minimum unit temperature diagram after comprehensive optimization of discrete non-uniform heat load in the present invention;

[0030] Fig.12 It is a flow channel configuration diagram before comprehensive optimization of continuous non-uniform heat load in the present invention;

[0031] Fig.13 It is the temperature distribution diagram of the liquid cooling plate before the comprehensive optimization of the continuous non-uniform heat load in the present invention;

[0032] Fig.14 It is a flow channel configuration diagram after comprehensive optimization of continuous non-uniform heat load in the present invention;

[0033] Fig.15 It is the temperature distribution diagram of the liquid cooling plate after comprehensive optimization of the continuous non-uniform heat load in the present invention. DETAILED DESCRIPTION

[0034] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0035] Combination Figure 1 The present invention provides a method for comprehensive optimization design of free boundary liquid cooling plate flow channel with non-uniform heat load, including:

[0036] S100, determining design parameters of a liquid cooling plate applied to the electronic device according to actual parameters of the electronic device;

[0037] refer to Figure 2 ,According to the actual situation of the electronic equipment, that is, the actual parameters of the electronic equipment, the overall size parameters, boundary parameters, size parameters of the design domain, environmental application parameters, thermal conductivity parameters of the material itself and heat transfer parameters of the coolant are designed.

[0038] Among them, the overall size parameters include: length l cp and width cp The size parameters of the design domain include the design domain length l Ω and the design domain width w Ω The boundary parameters include two entrances and two exits, and the width of the two entrances is l in , the width of both outlets is l out The two entrance positions are h in,1 With h in,2 The two exit positions are h out,1 With h out,2 ; The environmental application parameter is the direction of gravity, and the direction of gravity is positioned as follows Figure 2 In the direction of the middle arrow; if the solid material of the liquid cooling plate is aluminum 6061-T6, the thermal conductivity parameters of the material itself include thermal conductivity k s , specific heat capacity cp s and density ρ s ; The heat transfer parameters of the coolant include thermal conductivity k f , constant pressure specific heat capacity cp f and density ρ f .

[0039] S200, determining multi-input and multi-output boundary conditions of the liquid cooling plate according to the design parameters;

[0040] This step uses boundary parameters to design the multi-input boundary conditions, multi-output boundary conditions and insulation conditions of the liquid cooling plate; Figure 2 The figure shows the schematic diagram of the parameterized design of multiple inlet / outlet boundary conditions. The multiple inlet / outlet boundary conditions refer to two inlet boundaries and two outlet boundaries. The boundary conditions are composed of flow and heat transfer. The boundary conditions are parameterized. Among them, the parameters of the inlet boundary are: inlet width l in , entrance position h in,1 With h in,2 , inlet fluid temperature T in,1 With T in,2 , inlet flow rate U in,1 with U in,2 The parameters of the outlet boundary are outlet width l out 、Exit location h out,1 With h out,2 , outlet pressure P out,1 With P out,2 . Therefore, the boundary conditions of multiple inputs are expressed as:

[0041]

[0042] The extra boundary conditions are expressed as:

[0043]

[0044] In addition, the external heat transfer condition of the design domain Ω is adiabatic condition, which is expressed as:

[0045]

[0046] In the formula, Γ in , Γ out They represent the boundary conditions of the inlet and outlet respectively, and n is the outlet boundary Γ out The outer normal vector of the particle, I is the unit vector, μ is the dynamic viscosity, and U is the velocity vector.

[0047] S300, establishing two discrete and continuous non-uniform heat load application scenarios, and determining heat loads in the two non-uniform heat load application scenarios;

[0048] This step continues to define the heat load that exists in the actual working process, mainly including two typical working conditions: discrete and continuous.

[0049] In a specific embodiment of the present invention, S300 includes:

[0050] S310, establish two non-uniform heat load application scenarios: discrete and continuous;

[0051] like Figure 3 As shown in the figure, there are two typical scenarios of non-uniform heat load. Figure 3 The left side in the middle is a discrete non-uniform heat load application scenario, with the active phased array antenna array in microwave wireless energy transmission as a typical representative. In microwave wireless energy transmission, in order to ensure that energy is transmitted and intercepted with maximum efficiency, the antenna array usually uses array units with different radiation powers for arrangement and distribution. Due to the device efficiency, the heat load of array units with different radiation powers also presents non-uniform distribution characteristics. For example, Xun Li (Study of Stepped Amplitude Distribution Taper for Microwave Power Transmission for SSPS, IEEE Transactions on Antennas and Propagation, 2017, 65(10): 5396-5405) designed the antenna to be stepped, with high radiation power at the center and low at the edge. The antenna array unit is divided into several table-shaped rings, and each ring uses a radiator of one power. Its heat load also presents a stepped distribution with high center and low edge, and has the characteristic of constant heat load in each step ring.

[0052] Figure 3The middle right side is an application scenario of continuous non-uniform heat load, with the concentrated photovoltaic array in the energy system of the space power station as a typical representative. In the concentrated space energy collection system, in order to ensure efficient energy collection and conversion, the concentrating system usually optimizes the configuration of the concentrator or the battery receiving array, and also adopts a modular design concept. The energy on the photovoltaic array often shows a ring-shaped continuous energy distribution due to the form of the concentrator, such as the OMEGA solution or the Fresnel lens concentrating system. In addition, due to the presence of various error factors such as splicing errors and tracking errors in the concentrating system, the energy on the battery receiving array breaks the ring-shaped continuous characteristics, and the energy or heat load on it also shows strong irregular and non-uniform characteristics, and the heat load at each point also has the characteristics of random distribution.

[0053] S320, dividing the surface of the liquid cooling plate in the discrete non-uniform heat load application scenario into N×M first grid units of equal size from two dimensions, longitudinally and transversely, and applying a constant heat load to each of the first grid units to obtain a heat load in the discrete non-uniform heat load application scenario;

[0054] refer to Figure 4 In this step, the cold plate surface is divided into N and M first grid units of equal size from the longitudinal and transverse dimensions respectively. The size of each first grid unit is

[0055] l H = l Ω / M,w H =w Ω / N;

[0056] In the formula, l H With w H are the length and width of the first grid unit respectively;

[0057] A constant heat load Q is applied inside each first grid unit. d,i , constant heat load Q d,i Assigned to four levels, the surface heat load can be expressed as:

[0058] Q d,i ∈Q d =[Q d1 ,Q d2 ,Q d3 ,Q d4 ],i=1,2,…,N×M;

[0059] In the formula, Q d is a set of discrete non-uniform heat load levels, Q d1 , Q d2 , Q d3 With Q d4 They represent the heat loads of the first, second, third and fourth stages respectively, and are all constant values;

[0060] When applying unit thermal load, a load level is randomly selected and applied to the surface of the i-th grid unit, which can be expressed as:

[0061] Q d,i =(randperm(numel(Q),1)).

[0062] S330, dividing the surface of the liquid cooling plate in the application scenario of continuous non-uniform heat load into N second grid units of equal size from two dimensions, longitudinally or transversely; applying a continuous non-uniformly distributed heat load within a set range to each of the second grid units to obtain a continuous heat load;

[0063] There are four levels for the constant heat load and the continuously non-uniformly distributed heat load, and the heat loads are added to the grid units by randomly selecting heat loads from the corresponding heat load sets.

[0064] refer to Figure 5 In this step, the surface of the cold plate is divided into N equal-sized long strip grid units from the longitudinal or transverse dimensions. The size of each second grid unit is:

[0065]

[0066] In the formula, l H With w H are the length and width of the second grid unit respectively;

[0067] A continuous non-uniformly distributed heat load Q is applied to each second grid element. s,i , non-uniformly distributed heat load Q s,i It is also specified as four levels, expressed as

[0068] Q s,i ∈Q s =[Q s1 ,Q s2 ,Q s3 ,Q s4 ],i=1,2,…,N;

[0069] In the formula, Q s is the set of continuous non-uniform heat load levels, Q s1 , Q s2 , Q s3 With Q s4 Represents the continuous non-uniformly distributed heat loads of the first, second, third and fourth levels, all of which are random value changes within a range, expressed as:

[0070]

[0071] Where f1(x) is any random continuous distribution function, Q s1 and They represent the upper and lower limits of the continuous non-uniformly distributed heat load respectively. The heat loads of the other three levels are expressed in the same way as the first level. cp Indicates the overall length of the liquid cooling plate, l Ω Represents the design domain length of the liquid cooling plate.

[0072] S400, establishing a comprehensive optimization design target of the liquid cooling plate by using the design parameters, the boundary conditions and the heat load distribution;

[0073] In this step, based on the determined multi-inlet / outlet boundary conditions and discrete / continuous thermal loads, a comprehensive flow channel design model is further established that simultaneously considers actual working conditions such as thermal loads, multi-inlet / outlet boundary conditions and gravity direction.

[0074] In a specific embodiment of the present invention, S400 includes:

[0075] S410, determining a design variable using the boundary parameters and the boundary conditions, wherein the design variable is expressed as:

[0076] Find(H,γ);

[0077] Where H is the vector containing the entry / exit boundary position, H = [h in,1 h in,2 ;h out,1 h out,1 ]; γ is a pseudo-density variable representing the topological design;

[0078] S420, establish an initial optimization target, expressed as:

[0079] min f cp =w1T ave +w2Φ;

[0080] In the formula, w1 and w2 are weight factors of the objective function. In order to evenly weigh the impact of the two objectives, in this objective function, w1+w2=1, w1=w2=0.5, T ave and Φ represent the normalized mean surface temperature of the cold plate and the pump work required by the flow channel, respectively, and are expressed as:

[0081]

[0082]

[0083] Where T is the average surface temperature of the cold plate, (∫ Ω TdΩ / ∫ Ω dΩ)|0 is the initial value of temperature uniformity; Qcp is the surface heat load: Q cp =Q d or Q s ;P cp is the flow resistance loss of the cold plate system, ΔT is the temperature difference between the inlet and outlet of the liquid cold plate, (Q cp P cp / cp f ρ f ΔT)|0 is the initial value of the pump work required by the flow channel;

[0084] In addition to the constraints of the flow and heat transfer control equations, there are also gravity environment constraints considering the actual working scenario, that is, F = mg, and the direction of gravity is specified according to the actual force environment. Therefore, it is necessary to constrain the thermal load.

[0085] S430, determine the constraint functions of discrete and continuous non-uniform heat loads, expressed as

[0086] g d =max(max(T Ω,i )-min(T Ω,i ))≤ΔT du ;

[0087] g s =max(max(T Ω,i )-min(T Ω,i ))≤ΔT su ;

[0088] In the formula, max(T Ω,i ) and min(T Ω,i ) represents the maximum and minimum temperature of the i-th grid cell on the design domain Ω, ΔT du With ΔT su Respectively represent the maximum temperature difference of a given unit grid;

[0089] S440, using the design variables, the initial optimization objectives, and the constraint function to establish a comprehensive optimization design objective of the liquid cooling plate, expressed as:

[0090] find(H,γ)

[0091] min f cp

[0092] stg d -ΔT du ≤0 or g s -ΔT su ≤0

[0093] ρ f ∫ Ω γdΩ-ξm Ω ≤0

[0094] NS Eqs&Γ in &Γ out

[0095] H∈U H &γ∈U γ ;

[0096] Where U H with U γ is the feasible interval of the design variable, ρ f ∫ Ω γdΩ-ξm Ω ≤0 is the material constraint in the flow channel topology design process, ξ is the mass constraint factor, m Ω Overall quality designed for liquid cold plates.

[0097] S500, solving the comprehensive optimization design target to obtain optimal design parameters that comprehensively consider the heat load distribution and the inlet and outlet boundary positions.

[0098] After S500, the method for comprehensive optimization design of flow channels of a free boundary liquid cooling plate with non-uniform heat load further includes:

[0099] The optimal design parameters are used to complete the design of the liquid cooling plate.

[0100] The comprehensive optimization design method of the free boundary liquid cooling plate flow channel with non-uniform heat load of the present invention can be further illustrated by a simulation case:

[0101] 1. Simulation parameters

[0102] like Figure 2 As shown, the liquid cooling plate dimensions are: l cp =19cm, w cp =14cm, design domain: l Ω =18cm, w Ω =13cm, l in (Entrance width) = l out (Outlet width) = 10 mm, the default thickness of the liquid cooling plate is d = 5 mm. The initial value of the inlet / outlet boundary position H0 = [0 120; 0 120] (unit: mm). Inlet temperature T in = [20 20] (unit: °C), define the inlet Reynolds number Re = 600, the outlet pressure P out =[0 0](unit: Pa). The solid phase material of the liquid cooling plate is aluminum 6061-T6, and the liquid phase material is water. The mass constraint factor ξ is 0.5.

[0103] Discrete heat load level Q d =[1,2,4,6](unit: W / cm 2), the upper and lower limits of the continuous heat load level are Q s1 ∈[1,2], Q s2 ∈[2,3], Q s3 ∈[3,4], Q s4 ∈[4,5](unit W / cm 2 ).

[0104] 2. Simulation content and results

[0105] like Figure 6 and Fig. 9 They are the flow channel configuration diagrams before and after the optimization of discrete non-uniform heat load. Fig.12 and 14 They are flow channel configuration diagrams before and after optimization of continuous non-uniform heat load, and Table 1 shows the data of the corresponding flow channel inlet / outlet positions.

[0106] like Figure 7 and 10 They are the surface temperature distribution diagrams of the liquid cooling plate before and after the comprehensive optimization of discrete non-uniform heat load. Figure 8 and Fig.11 It is the minimum unit temperature diagram before and after the comprehensive optimization of discrete non-uniform heat load; Fig.13 and 15 They are the surface temperature distribution diagrams of the liquid cooling plate before and after the comprehensive optimization of continuous non-uniform heat load. Table 2 shows the corresponding maximum temperature, average temperature and flow resistance loss data of the cold plate system. The pump power consumption can be obtained from the flow resistance loss.

[0107] Table 1. Flow channel inlet / outlet positions before and after optimization

[0108] Discrete heat source inlet / outlet position H Continuous heat source inlet / outlet position H Before optimization [0 120；0 120] [0 120；0 120] After optimization [3.76 83.49；13.58 89.84] [35.53 105.44；4.91 73.96]

[0109] Table 2 Characteristic parameter values ​​before and after optimization

[0110]

[0111] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0112] Although the present application is described herein in conjunction with various embodiments, in the process of implementing the claimed application, those skilled in the art may understand and implement other variations of the disclosed embodiments by reviewing the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality of components or steps.

[0113] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A comprehensive optimization design method for flow channels of a free boundary liquid cooling plate with non-uniform heat load, characterized in that: include: S100, determining design parameters of a liquid cooling plate applied to the electronic device according to actual parameters of the electronic device; S200, determining multi-input and multi-output boundary conditions of the liquid cooling plate according to the design parameters; S300, establishing two discrete and continuous non-uniform heat load application scenarios, and determining heat loads in the two non-uniform heat load application scenarios; S400, establishing a comprehensive optimization design target of the liquid cooling plate by using the design parameters, the boundary conditions and the heat load distribution; S500, solving the comprehensive optimization design target to obtain optimal design parameters that comprehensively consider the heat load distribution and the inlet and outlet boundary positions; S100 includes: According to the actual parameters of the electronic equipment, design the overall size parameters, boundary parameters, size parameters of the design domain, environmental application parameters, thermal conductivity parameters of the material itself and heat transfer parameters of the coolant of the liquid cooling plate; Among them, the overall size parameters include: length l cp and width cp The size parameters of the design domain include the design domain length l Ω and the design domain width w Ω The boundary parameters include two entrances and two exits, and the width of the two entrances is l in , the width of both outlets is l out The two entrance positions are h in,1 With h in,2 The two exit positions are h out,1 With h out,2 ; The environmental application parameter is the direction of gravity; The thermal conductivity parameters of the material itself include thermal conductivity k s , specific heat capacity cp s and density ρ s ; The heat transfer parameters of the coolant include thermal conductivity k f , constant pressure specific heat capacity cp f and density ρ f ; S400 includes: S410, determining a design variable using the boundary parameters and the boundary conditions, wherein the design variable is expressed as: Find(H,γ); Where H is the vector containing the entry / exit boundary position, H = [h in,1 h in,2 ;h out,1 h out,1 ]; γ is the pseudo density variable of topological design; S420, establish an initial optimization target, expressed as: min f cp =w1T ave +w2Φ; Where w1 and w2 are weight factors of the objective function, T ave and Φ represent the normalized mean surface temperature of the cold plate and the pump work required by the flow channel, respectively, and are expressed as: Where T is the average surface temperature of the cold plate, (∫ Ω TdΩ / ∫ Ω dΩ)|0 is the initial value of temperature uniformity; Q cp is the surface heat load: Q cp =Q d or Q s ;P cp is the flow resistance loss of the cold plate system, ΔT is the temperature difference between the inlet and outlet of the liquid cold plate, (Q cp P cp / cp f ρ f ΔT)|0 is the initial value of the pump work required by the flow channel; Ω represents the design domain, Q d is a set of discrete non-uniform heat load levels, Q s is a collection of continuous non-uniform heat load levels; S430, determine the constraint functions of discrete and continuous non-uniform heat loads, expressed as g d =max(max(T Ω,i )-min(T Ω,i ))≤ΔT du ; g s =max(max(T Ω,i )-min(T Ω,i ))≤ΔT su ; In the formula, max(T Ω,i ) and min(T Ω,i ) represents the maximum and minimum temperature of the i-th grid cell on the design domain Ω, ΔT du With ΔT su Respectively represent the maximum temperature difference of a given unit grid; S440, using the design variables, the initial optimization objectives, and the constraint function to establish a comprehensive optimization design objective of the liquid cooling plate, expressed as: Where U H with U γ is the feasible interval of the design variable, ρ f ∫ Ω γdΩ-ξm Ω ≤0 is the material constraint in the flow channel topology design process, ξ is the mass constraint factor, m Ω Overall quality designed for liquid cold plates.

2. The method for comprehensive optimization design of flow channels of free boundary liquid cooling plates with non-uniform heat load according to claim 1 is characterized in that: S200 includes: Use boundary parameters to design the multi-input boundary conditions, multi-output boundary conditions and insulation conditions of the liquid cooling plate; Among them, the boundary conditions of multiple inputs are expressed as: Where U in,1 Indicates and U in,2 represents the inlet flow rate, T in,1 and T in,2 represents the inlet fluid temperature; The extra boundary conditions are expressed as: Where P out,1 and P out,2 Indicates outlet pressure; The adiabatic condition is expressed as: In the formula, Γ in , Γ out They represent the boundary conditions of the inlet and outlet respectively, and n is the outlet boundary Γ out The outer normal vector of the particle, I is the unit vector, μ is the dynamic viscosity, and U is the velocity vector.

3. The method for comprehensive optimization design of flow channels of free boundary liquid cooling plates with non-uniform heat load according to claim 1, characterized in that: S300 includes: S310, establish two non-uniform heat load application scenarios: discrete and continuous; S320, dividing the surface of the liquid cooling plate in the discrete non-uniform heat load application scenario into N×M first grid units of equal size from two dimensions, longitudinally and transversely, and applying a constant heat load to each of the first grid units to obtain a heat load in the discrete non-uniform heat load application scenario; S330, dividing the surface of the liquid cooling plate in the continuous non-uniform heat load application scenario into N second grid units of equal size from two dimensions, longitudinally or transversely; applying a continuous non-uniformly distributed heat load within a set range to each of the second grid units to obtain a continuous heat load; There are four levels for the constant heat load and the continuously non-uniformly distributed heat load, and the heat loads are added to the grid units by randomly selecting heat loads from the corresponding heat load sets.

4. The method for comprehensive optimization design of flow channels of free boundary liquid cooling plates with non-uniform heat load according to claim 3 is characterized in that: The size of each first grid unit in S320 is: l H =l Ω / M,w H =w Ω / N; In the formula, l H With w H are the length and width of the first grid unit respectively; In S320, a constant heat load is applied to each first grid unit as follows: Q d,i ∈Q d =[Q d1 ,Q d2 ,Q d3 ,Q d4 ],i=1,2,…,N×M; In the formula, Q d1 , Q d2 , Q d3 With Q d4 They represent the heat loads of the first, second, third and fourth stages respectively, and are all constant values; The size of each second grid unit in S330 is: In the formula, l H With w H are the length and width of the second grid unit respectively; The continuous non-uniformly distributed heat load applied to each grid unit in S330 is expressed as: Q s,i ∈Q s =[Q s1 ,Q s2 ,Q s3 ,Q s4 ],i=1,2,…,N; In the formula, Q s1 , Q s2 , Q s3 With Q s4 Represents the continuous non-uniformly distributed heat loads of the first, second, third and fourth levels, all of which are random value changes within a range, expressed as: In the formula, f i (x) is any random continuous distribution function, Q si and They represent the upper and lower limits of the continuous non-uniformly distributed heat load, l cp Indicates the overall length of the liquid cooling plate, l Ω Represents the design domain length of the liquid cooling plate.

5. The method for comprehensive optimization design of flow channels of free boundary liquid cooling plates with non-uniform heat load according to claim 1, characterized in that: After S500, the non-uniformly distributed heat load free boundary liquid cooling plate flow channel comprehensive optimization design method further includes: The optimal design parameters are used to complete the design of the liquid cooling plate.

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