Semiconductor process chamber and tray assembly

Abstract

The present application discloses a semiconductor process chamber and a tray assembly, which belongs to the field of semiconductor processing technology. The semiconductor process chamber includes a chamber body and a rotating assembly, the rotating assembly includes a rotating shaft and a tray holder connected to the rotating shaft, the rotating shaft is rotatably connected to the top of the chamber body, and when the rotating assembly is rotated to a preset angle, the tray holder can be connected or separated from the tray assembly for carrying the substrate. In this scheme, the substrate can be suspended on the top of the inner cavity so that the process surface of the substrate is set downward, so that the particles formed on the inner wall of the inner cavity of the chamber body cannot fall onto the process surface of the substrate, and the process surface of the substrate is not easy to form dropped object defects, etc.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor processing technology, and specifically relates to a semiconductor process chamber and a tray assembly. Background Art

[0002] In semiconductor processes, it is often necessary to perform epitaxial growth of semiconductor materials (such as Si, Ge, SiGe, GaAs, AlN, GaN, SiC, etc.) on substrates. Chemical vapor deposition (CVD) is the main technical means of epitaxial process at present. Generally, the substrate is placed on a tray with the epitaxial surface facing up, and is transferred to the semiconductor process chamber by a robot. Then, process gas is introduced into the semiconductor process chamber to react at a certain temperature to achieve the purpose of epitaxially growing a thin film on the substrate surface. While the thin film is growing on the substrate surface, particles are formed on the inner wall of the semiconductor process chamber, and these particles are easy to fall onto the substrate surface, resulting in drop defects on the substrate. Especially for semiconductor process chambers with horizontal air intake, drop defects are more likely to form on the substrate.

[0003] In an existing horizontal air inlet semiconductor process chamber, process gas enters the semiconductor process chamber horizontally from the process air inlet end of the semiconductor process chamber, flows through the substrate in the semiconductor process chamber and then flows out from the process air outlet end of the semiconductor process chamber. During the epitaxial growth process, particles will be deposited on the inner wall of the semiconductor process chamber. Since the particles have a loose structure, the particles on the upper wall of the semiconductor process chamber are easy to fall onto the surface of the substrate, causing the thin film on the substrate to have dropped defects or triangular defects caused by the dropped objects.

[0004] Therefore, there is a problem that dropped material defects are easily formed on the substrate during the process of processing the substrate in the existing semiconductor process chamber. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a semiconductor process chamber and a tray assembly, which can solve the problem of drop defects that are easily formed on the substrate when the existing semiconductor process chamber in the related art performs epitaxial growth on the substrate.

[0006] In a first aspect, an embodiment of the present application provides a semiconductor process chamber, comprising:

[0007] chamber body;

[0008] A rotating assembly, the rotating assembly comprising a rotating shaft and a tray holder connected to the rotating shaft, the rotating shaft being rotatably connected to the top of the chamber body, and when the rotating assembly is rotated to a preset angle, the tray holder can be connected to or separated from the tray assembly for carrying the substrate.

[0009] In a second aspect, an embodiment of the present application further provides a tray assembly, which is suitable for a semiconductor process chamber, wherein the bottom of the tray assembly is used to fix a substrate, and the tray assembly is provided with a card slot, and the card slot is adapted to the tray card holder of the semiconductor process chamber.

[0010] The tray assembly is also provided with a slide groove, which is communicated with the card slot, and the tray card holder can extend into the slide groove and slide along the slide groove to the card slot.

[0011] In the embodiment of the present application, after the tray assembly is transferred to the inner cavity of the chamber body, it is rotatably connected to the top of the chamber body through the rotating assembly, and the tray assembly is used to fix the substrate so that the process surface of the substrate faces downward, so that the substrate is suspended at the top of the inner cavity. In this way, since the substrate is suspended at the top of the inner cavity and the process surface of the substrate faces downward, the particles formed on the inner wall of the inner cavity cannot fall onto the process surface of the substrate, and the process surface of the substrate is not prone to falling defects, etc., thereby greatly improving the maintenance cycle of semiconductor process equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a front view of a semiconductor process chamber disclosed in an embodiment of the present application;

[0013] Figure 2 is a cross-sectional view of a semiconductor process chamber disclosed in an embodiment of the present application;

[0014] Figure 3 is an exploded view of the upper cavity disclosed in the embodiment of the present application;

[0015] Figure 4 is a top view of the upper horizontal heating portion disclosed in the embodiment of the present application;

[0016] Figure 5 is a distribution diagram of the rotating flow channel disclosed in the embodiment of the present application;

[0017] Figure 6 is a distribution diagram of the positioning flow channels disclosed in the embodiment of the present application;

[0018] Figure 7 is a partial schematic diagram of the upper cavity disclosed in the embodiment of the present application;

[0019] Figure 8 is a front view of the rotating assembly disclosed in the embodiment of the present application;

[0020] Fig. 9 is a side view of a rotating assembly disclosed in an embodiment of the present application;

[0021] Fig.10 is a bottom view of the rotating assembly disclosed in the embodiment of the present application;

[0022] Fig.11 is a connection relationship diagram of the rotating cover and the rotating shaft disclosed in the embodiment of the present application;

[0023] Fig.12 is a bottom view of the rotating cover disclosed in the embodiment of the present application;

[0024] Fig.13 is a partial schematic diagram of the rotating cover in an inverted state disclosed in an embodiment of the present application;

[0025] Fig.14 It is a front view of the rotating assembly with the rotating cover and the rotating shaft hidden in the embodiment of the present application;

[0026] Fig.15 is a top view of the rotating assembly with the rotating cover and the rotating shaft hidden according to the embodiment of the present application;

[0027] Fig.16 is a side view of a positioning member disclosed in an embodiment of the present application;

[0028] Fig.17 is a top view of a positioning member disclosed in an embodiment of the present application;

[0029] Fig.18 is a top view of a tray disclosed in an embodiment of the present application;

[0030] Fig.19 is a side view of a tray disclosed in an embodiment of the present application;

[0031] Fig. 20 is an axial schematic diagram of a tray disclosed in an embodiment of the present application;

[0032] Fig.21 is a top view of a substrate support disclosed in an embodiment of the present application;

[0033] Fig. 22 is a partial schematic diagram of a substrate support disclosed in an embodiment of the present application;

[0034] Fig.23 is a schematic diagram of the tray assembly disclosed in the embodiment of the present application being transferred into the inner cavity;

[0035] Fig.24 It is a schematic diagram of the tray assembly disclosed in the embodiment of the present application being connected with the tray card holder;

[0036] Fig.25 is a schematic diagram of the rotating assembly disclosed in the embodiment of the present application in an air-floating rotating state;

[0037] Fig.26 It is a schematic diagram of the state after the tray assembly disclosed in the embodiment of the present application is connected to the substrate.

[0038] Description of reference numerals:

[0039] 100-chamber body; 110-upper cavity; 111-upper horizontal heating part; 1110-cavity;

[0040] 112-upper arc-shaped heating part; 113-boss; 114-positioning cavity forming member; 1141-tray slot;

[0041] 115-positioning flow channel; 1151-first fluid inflow channel; 1152-positioning rotating chamber;

[0042] 11521-positioning rotation groove; 1153-first fluid outflow channel; 1154-first expansion port;

[0043] 1155 - second expansion port; 116 - rotating flow channel; 1161 - main flow channel; 1162 - branch flow channel;

[0044] 1613-connecting flow channel; 117-installation groove; 120-lower cavity; 121-lower horizontal heating part;

[0045] 122-lower arc-shaped heating part; 130-side support block; 140-inner cavity; 200-tray assembly;

[0046] 210-tray; 211-slide slot; 2111-first through slot; 2112-second through slot; 212-card slot;

[0047] 220 - substrate support; 221 - support protrusion; 222 - opening; 300 - rotating assembly; 310 - rotating cover;

[0048] 311-top plate; 312-annular side plate; 313-first rotating groove; 314-second rotating groove;

[0049] 320-rotating shaft; 321-rotating shaft; 322-sliding column; 323-threaded hole; 324-connecting screw;

[0050] 330 - tray card holder; 331 - card holder body; 332 - connection part; 340 - positioning piece; 341 - first part; 342 - second part; 343 - square hole; 400 - substrate. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0052] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0053] The semiconductor process chamber provided in the embodiment of the present application is described in detail below through specific embodiments and their application scenarios in combination with the accompanying drawings.

[0054] refer to Figure 1-26 A semiconductor process chamber provided by an embodiment of the present application may include a chamber body 100 and a rotating assembly 300, wherein the rotating assembly 300 includes a rotating shaft 320 and a tray holder 330, wherein the tray holder 330 may be connected to the rotating shaft 320, and the rotating shaft 320 may be rotatably connected to the top of the chamber body 100, and when the rotating assembly 300 is rotated to a preset angle, the tray holder 330 may be connected to or separated from the tray assembly 200, wherein the tray assembly 200 is used to carry a substrate 400. In this way, the tray assembly 200 may be suspended on the top of the chamber body 100 through the rotating assembly 300, that is, the substrate 400 may be suspended on the top of the inner cavity 140.

[0055] Optionally, the bottom of the tray assembly 200 has an opening 222 disposed downward, and the opening 222 can expose at least a portion of the process surface of the substrate 400, so as to facilitate processing of the process surface of the substrate 400. Here, the tray assembly 200 can be transferred to the inner cavity 140 of the chamber body 100, so that the substrate 400 can be processed in the inner cavity 140 of the chamber body 100.

[0056] It should be noted that the semiconductor process chamber of the embodiment of the present application may be, for example, a chemical vapor deposition (CVD) process chamber, which may, for example, perform an epitaxial process on a substrate such as SiC.

[0057] Here, since the substrate 400 is suspended on the top of the inner cavity 140 and the process surface of the substrate 400 is set downward, the particles formed on the inner wall of the inner cavity 140 cannot fall onto the process surface of the substrate 400, and the process surface of the substrate 400 is not prone to falling defects, etc., thereby greatly improving the maintenance cycle of semiconductor process equipment.

[0058] In an optional embodiment of the present application, the rotating assembly 300 can be raised and lowered on the chamber body 100 , and the rotating assembly 300 can move between a first position and a second position, where the first position can be lower than the second position.

[0059] When the rotating assembly 300 is located at the first position and rotated to a preset angle, the tray card holder 330 can be connected to or separated from the tray assembly 200; when the rotating assembly 300 is located at the second position, the tray card holder 330 can drive the tray assembly 200 to rotate.

[0060] Here, the rotating assembly 300 is liftably disposed on the chamber body 100. Compared with the rotating assembly 300 that is not liftably disposed on the chamber body 100, on the one hand, it is convenient to disassemble and assemble the tray assembly 200. On the other hand, when processing the substrate 400, the tray assembly 200 can be located at a high place, which can make it easier for the process gas to act on the substrate 400 and reduce the amount of particulate matter deposited on the tray assembly 200.

[0061] In other embodiments, the rotating assembly 300 is disposed on the chamber body 100 in a non-elevable manner.

[0062] In an optional embodiment of the present application, a positioning channel 115 may be provided on the chamber body 100, and the positioning channel 115 may be used for passing a first fluid, so that the first fluid drives the rotating assembly 300 to rotate to a preset angle. The first fluid may be, for example, a gas or a liquid. When the first fluid is a gas, the gas may be, for example, an inert gas such as Ar. In this way, the first fluid may be used to position the rotating assembly 300, so that the rotating assembly 300 may be maintained at a preset angle, thereby facilitating the connection or separation of the tray assembly 200 and the tray tray 330.

[0063] In other embodiments, the chamber body 100 is not provided with a positioning channel 115, and the tray assembly 200 and the tray card holder 330 can be connected or separated while the rotating assembly 300 remains fixed, or the rotating assembly 300 is fixed at a preset angle with the aid of external tools and then the tray assembly 200 and the tray card holder 330 are connected or separated.

[0064] In an optional embodiment, the rotating assembly 300 may further include a positioning member 340, which is connected to the rotating shaft 320. The positioning channel 115 may include a positioning rotating chamber 1152, a first fluid inflow channel 1151, and a first fluid outflow channel 1153 that are connected. The first fluid inflow channel 1151 and the first fluid outflow channel 1153 may be located on opposite sides of the positioning rotating chamber 1152, respectively. The positioning member 340 may be rotatably disposed in the positioning rotating chamber 1152. The first fluid may drive the positioning member 340 to rotate to a preset angle, so that the rotating assembly 300 rotates to a preset angle. Here, the first fluid inflow channel 1151 and the first fluid outflow channel 1153 may be disposed in a horizontally staggered manner.

[0065] Compared with the method in which the first fluid directly drives the rotating assembly 300 to rotate, the method in which the first fluid drives the rotating assembly 300 to rotate by driving the positioning member 340 located in the positioning rotating chamber 1152 to rotate is more convenient for driving the rotating assembly 300 to rotate and for keeping the rotating assembly 300 at a preset angle.

[0066] Of course, the rotating assembly 300 may not include the positioning member 340 , and the positioning channel 115 may only include the first fluid inflow channel 1151 and the first fluid outflow channel 1153 , and the rotating assembly 300 is located between the first fluid inflow channel 1151 and the first fluid outflow channel 1153 .

[0067] Optionally, in order to ensure that the first fluid can drive the positioning member 340 to rotate and keep the positioning member 340 at a preset angle, the outlet of the first fluid inflow channel 1151 can have a first center point, and the inlet of the first fluid outflow channel 1153 can have a second center point. The line connecting the first center point and the second center point intersects with the rotation axis of the positioning member 340. At this time, the first fluid can contact the positioning member 340 in a large amount, thereby more reliably driving the positioning member 340 to rotate.

[0068] Of course, the line connecting the first center point and the second center point may not intersect with the rotation axis of the positioning member 340 .

[0069] Further optionally, a first flare 1154 may be provided at the outlet of the first fluid inflow channel 1151, and a second flare 1155 may be provided at the inlet of the first fluid outflow channel 1153. The first flare 1154 and the second flare 1155 may be symmetrical about the rotation axis of the positioning member 340, and the flow area of ​​the first flare 1154 gradually increases along the direction from the outlet of the first fluid inflow channel 1151 to the rotation axis of the positioning member 340, and the flow area of ​​the second flare 1155 gradually increases along the direction from the inlet of the first fluid outflow channel 1153 to the rotation axis of the positioning member 340. In this way, the driving area of ​​the first fluid can be increased, and the positioning member 340 can be driven to rotate more easily, so that the positioning member 340 can be driven to rotate to a preset angle quickly.

[0070] In other embodiments, the first expansion opening 1154 may not be provided at the outlet of the first fluid inflow channel 1151, and the second expansion opening 1155 may not be provided at the inlet of the first fluid outflow channel 1153, that is, the flow area at the outlet of the first fluid inflow channel 1151 and the flow area at the inlet of the first fluid outflow channel 1153 are both constant values.

[0071] In this embodiment, the angles of the first flare 1154 and the second flare 1155 can both be 90 degrees, and the angles between the lines connecting the center points of the first flare 1154 and the second flare 1155 and the first fluid inlet channel 1151 and the first fluid outlet channel 1153 can both be 45 degrees.

[0072] In an optional embodiment, the positioning member 340 may include a first portion 341 and a second portion 342, the second portion 342 may be horizontally connected to the first portion 341, and the first portion 341 may be coaxially connected to the rotating shaft 320, and the longitudinal cross-sectional area of ​​the second portion 342 gradually decreases along the direction from the first portion 341 to the second portion 342, and the longitudinal cross-sectional area may be parallel to the axis of the rotating assembly 300. In this way, since the longitudinal cross-sectional area of ​​the second portion 342 gradually decreases and its weight is small, the first fluid can more easily drive the second portion 342 to rotate, thereby more easily realizing the rotation of the positioning member 340. In addition, the second portion 342 can guide the first fluid, so that the first fluid flows more smoothly in the positioning flow channel.

[0073] In this embodiment, the positioning member 340 may be in a water drop-shaped structure.

[0074] Of course, along the direction from the first portion 341 to the second portion 342 , the longitudinal cross-sectional area of ​​the second portion 342 may also remain unchanged.

[0075] In an optional embodiment of the present application, the positioning member 340 can be sleeved outside the rotating shaft 320 and cooperate with the rotating shaft 320 in a circumferential limit. In this way, the positioning member 340 will not affect the lifting and lowering of the rotating assembly 300, and thus will not affect the disassembly and assembly of the tray assembly 200. Here, when the rotating assembly 300 moves between the first position and the second position, the positioning member 340 can slide up and down relative to the rotating shaft 320.

[0076] In other embodiments, the positioning member 340 and the rotating shaft 320 are an integrated structure, and the two are relatively fixed.

[0077] In an optional embodiment, the rotating shaft 320 may include a rotating shaft 321 and a sliding column 322, the bottom of the sliding column 322 may be connected to the tray card holder 330, the top of the sliding column 322 may be detachably connected to the rotating shaft 321, and the positioning member 340 is sleeved outside the sliding column 322 and cooperates with the sliding column 322 in a circumferential limiting manner. In this way, the tray card holder 330 and the rotating shaft 320 will not affect the installation of the positioning member 340 and the positioning cavity forming member 114 described below.

[0078] Of course, the rotating shaft 321 and the sliding column 322 can be fixedly connected in an indestructible manner. Specifically, the rotating shaft 321 and the sliding column 322 can be an integrated structure.

[0079] In this embodiment, a threaded hole 323 is provided at the bottom of the rotating shaft 321, and a connecting screw 324 is provided at the top of the sliding column 322. The connecting screw 324 can extend into the threaded hole 323 and connect with the threaded hole 323 to achieve a detachable connection between the sliding column 322 and the rotating shaft 321.

[0080] Here, the sliding column 322 can be a square column, and the positioning member 340 is provided with a square hole 343 matching the square column. Of course, the sliding column 322 and the positioning member 340 can also achieve circumferential positioning and matching through a triangular structure, an elliptical structure, etc.

[0081] In an optional embodiment, the top of the chamber body 100 may be provided with a positioning and rotating groove 11521 and a mounting groove 117, the mounting groove 117 may be located below the positioning and rotating groove 11521 and may be connected to the positioning and rotating groove 11521; and the semiconductor process chamber may further include a positioning cavity forming member 114, the positioning cavity forming member 114 may be embedded in the mounting groove 117 and detachably connected to the groove wall of the mounting groove 117, and a positioning and rotating cavity 1152 may be formed between the positioning cavity forming member 114 and the positioning and rotating groove 11521. In this way, it is convenient to install the positioning member 340 in the positioning and rotating cavity 1152.

[0082] Here, the positioning cavity forming member 114 may be provided with a through hole for the rotation shaft 320 or part of the tray card holder 330 to pass through, so as to avoid affecting the installation of the rotation assembly 300 .

[0083] In this embodiment, the positioning cavity forming member 114 can be threadedly connected to the groove wall of the installation groove 117 .

[0084] In other embodiments, the semiconductor process chamber may not include the positioning cavity forming member 114 , the top of the chamber body 100 may be directly provided with a positioning rotation cavity 1152 , and the positioning member 340 and the rotating assembly 300 may be processed from a portion of the structure of the chamber body 100 .

[0085] Optionally, a tray groove 1141 may be provided on one side of the positioning cavity forming member 114 away from the positioning rotation groove 11521. When the rotation assembly 300 is located at the second position, the tray groove 1141 may be used to accommodate at least part of the tray assembly 200. In this way, it is possible to prevent particles in the inner cavity 140 of the chamber body 100 from being deposited on the side of the tray assembly 200, or reduce the amount of particles deposited on the side of the tray assembly 200.

[0086] Of course, the tray groove 1141 may not be provided on the side of the positioning cavity forming member 114 away from the positioning rotation groove 11521 .

[0087] In an optional embodiment of the present application, a rotating flow channel 116 may be further provided on the chamber body 100, and the rotating flow channel 116 may be used for the passage of a second fluid; the rotating assembly 300 may also include a rotating cover 310, one end of the rotating shaft 320 is connected to the rotating cover 310, and the other end may be connected to the tray assembly 200, and the outlet of the rotating flow channel 116 may be oriented toward the rotating cover 310, so that the second fluid can drive the rotating assembly 300 to move to the second position and drive the rotating assembly 300 to rotate. In this way, compared with the method in which the rotating flow channel 116 is not provided on the chamber body 100, the rotating flow channel 116 is provided on the chamber body 100, and the rotating assembly 300 can be driven to rotate by the second fluid, without the need to use a power component to drive the rotating assembly 300 to rotate, which is conducive to reducing costs and is not affected by temperature. Moreover, in the embodiment of the present application, the second fluid can make the rotating assembly 300 suspend and rotate without entering the inner cavity 140, effectively avoiding the influence of the second fluid on the process gas flow field and ensuring process uniformity. The second fluid may be, for example, a gas or a liquid. When the second fluid is a gas, the gas may include, for example, Ar and H 2 At least one of .

[0088] In other embodiments, the rotating channel 116 may not be provided on the chamber body 100, and the rotating assembly 300 may be driven to rotate by a driving component such as a motor.

[0089] In this embodiment, the rotating flow channel 116 may be located above the positioning flow channel 115 , and the rotating flow channel 116 is not connected to the positioning flow channel 115 to avoid mutual interference.

[0090] In an optional embodiment, the rotating cover 310 may be provided with a plurality of rotating grooves, which may be distributed along the circumference of the rotating shaft 320, and the outlet of the rotating flow channel 116 may be opposite to at least one rotating groove, so that the second fluid can drive the rotating assembly 300 to move to the second position and drive the rotating assembly 300 to rotate. In this way, the second fluid can flow along the rotating grooves, which is conducive to applying a circumferential force to the rotating cover 310, thereby facilitating driving the rotating cover 310 to rotate.

[0091] Of course, the rotating cover 310 may not be provided with the rotating groove.

[0092] Optionally, the rotating cover 310 may include a top plate 311 and an annular side plate 312, the annular side plate 312 may be arranged around the edge of the top plate 311, the top end of the rotating shaft 320 may be connected to the top plate 311, each rotating groove may include a first rotating groove 313 and a second rotating groove 314, the first rotating groove 313 may be connected to the second rotating groove 314, the first rotating groove 313 may be arranged on the top plate 311, and each first rotating groove 313 may be distributed along the circumference of the top plate 311, each first rotating groove 313 may extend in a direction away from the rotating shaft 320, here, each first rotating groove 313 may be an arc groove and bend in the same circumferential direction, the outlet of the rotating flow channel 116 may be opposite to at least one first rotating groove 313, so that the second fluid may enter at least one first rotating groove 313, and since the first rotating groove 313 is an arc groove, the second fluid may apply a circumferential force to the top plate 311, thereby causing the top plate 311 to rotate. The second rotation groove 314 can be arranged on the annular side plate 312, and each second rotation groove 314 can extend spirally from the top to the bottom of the annular side plate 312, and the bending direction of the second rotation groove 314 can be the same as the bending direction of the first rotation groove 313. In this way, after the second fluid enters the second rotation groove 314, it can apply a force to the annular side plate 312 in the same direction as the top plate 311, thereby more reliably driving the rotating cover 310 to rotate.

[0093] In other embodiments, the rotation groove may include only the first rotation groove 313 , and the first rotation groove 313 may not be an arc-shaped groove.

[0094] In an optional embodiment, the rotating flow channel 116 may include a main flow channel 1161 and at least two branch flow channels 1162, each branch flow channel 1162 may be distributed along the circumference of the rotating shaft 320, the inlet of each branch flow channel 1162 may be connected to the outlet of the main flow channel 1161, and the outlet of each branch flow channel 1162 may be opposite to at least one rotating groove. In this way, the second fluid can drive the rotating assembly 300 from multiple positions through each branch flow channel 1162, which is more conducive to driving the rotating assembly 300 to rotate and improving the stability of the rotating assembly 300 when rotating.

[0095] Of course, the rotating flow channel 116 may include only one flow channel, the outlet of which is opposite to the at least one rotating groove.

[0096] Here, in order to make the main channel 1161 communicate with each branch channel 1162, the rotating channel 116 may further include at least two connecting channels 1613, the two ends of the connecting channel 1613 may be respectively connected with the outlet of the main channel 1161 and the inlet of the branch channel 1162, and the connecting channel 1613 may be located on the same horizontal plane as the main channel 1161. In this embodiment, at least one branch channel 1162 may be directly connected with the main channel 1161.

[0097] Optionally, a boss 113 may be provided at the top of the chamber body 100, the rotating shaft 320 may pass through the boss 113 and may be rotatably connected to the boss 113, at least a portion of the boss 113 may be located in the rotating cover 310, and each branch channel 1162 may be provided on the boss 113. In this way, the branch channels 1162 are conveniently arranged, and the second fluid is conveniently allowed to enter the rotating cover 310.

[0098] Of course, the boss 113 may not be provided on the top of the chamber body 100 .

[0099] In this embodiment, the rotating flow channel 116 may include three branch flow channels 1162, which are evenly distributed along the circumference of the boss 113, and the three branch flow channels 1162 may be parallel to the rotating shaft 320 and extend upward to the top of the boss 113, that is, the outlets of the three branch flow channels 1162 are located at the top of the boss 113. Here, the boss 113 may be a circular boss.

[0100] In an optional embodiment of the present application, the process gas inlet and the process gas outlet of the chamber body 100 may be located on both sides of the inner cavity 140, respectively, and the process gas inlet and the process gas outlet may be located on the same horizontal plane. In this way, the process gas can flow horizontally in the inner cavity 140. Here, since the substrate 400 is suspended on the top of the inner cavity 140 of the chamber body 100, the particles in the inner cavity 140 of the chamber body 100 will not fall onto the process surface of the substrate 400 when they fall downward, and no drop defects will be formed on the substrate 400. In addition, the process gas flows horizontally, which makes it easier to contact the process surface of the substrate 400, thereby making it easier to process the process surface of the substrate 400.

[0101] Of course, the process gas inlet and the process gas outlet of the chamber body 100 may also be located on the same vertical plane, or the process gas inlet and the process gas outlet may be staggered.

[0102] In an optional embodiment, a heating element may be provided on the chamber body 100, or at least a portion of the chamber body 100 is a heating element. In this way, the process gas entering the inner cavity 140 of the chamber body 100 may be heated to facilitate processing of the substrate 400. For example, the semiconductor process chamber may implement an epitaxial process of a substrate.

[0103] In this embodiment, the chamber body 100 may include an upper cavity 110, a lower cavity 120 and a side support block 130, the upper cavity 110, the side support block 130 and the lower cavity 120 are sequentially connected, and an inner cavity 140 may be formed between the upper cavity 110, the lower cavity 120 and the side support block 130. Here, the side support block 130 may be an annular structure, and both the process gas inlet and the process gas outlet may be provided on the side support block 130.

[0104] The upper cavity 110 may include an upper horizontal heating portion 111 and an upper arc-shaped heating portion 112 connected to the upper horizontal heating portion 111, and a cavity 1110 is formed between the upper horizontal heating portion 111 and the upper arc-shaped heating portion 112, and the rotating cover 310 and the boss 113 are located in the cavity 1110. Here, the cavity 1110 may provide a rotating space for the rotating cover 310.

[0105] It should be noted that the second fluid can be discharged through the cavity 1110 and will not enter the inner cavity 140 of the chamber body 100 , thus effectively avoiding the influence of the flotation airflow on the process airflow field.

[0106] The lower cavity 120 may include a lower horizontal heat-generating portion 121 and a lower arc-shaped heat-generating portion 122 connected to the lower horizontal heat-generating portion 121 .

[0107] In this embodiment, the upper cavity 110 and the lower cavity 120 are both heating elements, which can improve the heating effect of the process gas, thereby facilitating the improvement of the process efficiency.

[0108] Optionally, the upper cavity 110 and the lower cavity 120 can both be made of graphite material, and the lower surface of the upper cavity 110 is provided with a silicon carbide coating (SiC coating) or a tantalum carbide coating (TaC coating), the upper surface of the lower cavity 120 is provided with a silicon carbide coating (SiC coating) or a tantalum carbide coating (TaC coating), and the side support block 130 can be made of silicon carbide ceramic material.

[0109] The present application also provides a tray assembly 200, which can be applied to a semiconductor process chamber. The bottom of the tray assembly 200 can be used to fix the substrate 400. The tray assembly 200 can be provided with a slot 212, which can be matched with a tray holder 330 of the semiconductor process chamber. When the rotating assembly 300 is located at the first position and rotated to a preset angle, the tray holder 330 can be connected or separated from the slot 212. In this way, the rotating assembly 300 can be connected or separated from the tray assembly 200, which is convenient for operation.

[0110] In other embodiments, the tray assembly 200 may not be provided with the slot 212 , and when the rotating assembly 300 is located at the first position and rotated to a preset angle, the rotating assembly 300 may be connected to or separated from the tray assembly 200 via a fixing member.

[0111] The tray assembly 200 may also be provided with a slide groove 211, which may be connected to the card slot 212, and the tray card holder 330 may extend into the slide groove 211 and slide along the slide groove 211 to the card slot 212. After being arranged in this way, the slide groove 211 may provide a guide for the relative movement of the tray card holder 330 and the tray assembly 200, thereby facilitating the stability of the connection between the tray card holder 330 and the tray assembly 200 and improving the connection efficiency.

[0112] In this embodiment, the slot 212 may be located at the center of the tray assembly 200 .

[0113] Of course, the tray assembly 200 may not be provided with the slide groove 211 , and the tray card holder 330 may be directly engaged with the card groove 212 .

[0114] Optionally, the slide groove 211 may include a first through groove 2111 and a second through groove 2112, and the first through groove 2111 and the second through groove 2112 may both penetrate the tray assembly 200 in a direction perpendicular to the thickness direction of the tray assembly 200, so that the tray card holder 330 may enter the slide groove 211 from either end of the slide groove 211 or slide out of the slide groove 211, which is convenient for operation. In addition, the first through groove 2111 may penetrate the top of the tray assembly 200 in the thickness direction of the tray assembly 200 and communicate with the second through groove 2112, and the width of the first through groove 2111 may be smaller than the width of the second through groove 2112, and the first through groove 2111 and the second through groove 2112 may both communicate with the card slot 212. Here, the width of the first through groove 2111 is smaller than the width of the second through groove 2112, so that the tray card holder 330 may be prevented from being disengaged from the top of the first through groove 2111 and separated from the tray assembly 200 after the tray card holder 330 extends into the slide groove 211.

[0115] The above-mentioned tray assembly 200 can be applicable to the semiconductor process chamber described in any of the above-mentioned embodiments. The tray card holder 330 of the semiconductor process chamber may include a card holder body 331 and a connecting part 332 connected to the card holder body 331. The first through groove 2111 can allow the connecting part 332 to extend into and slide with the connecting part 332, that is, the connecting part 332 can extend into the first through groove 2111 and slide along the first through groove 2111. The second through groove 2112 can slide with the card holder body 331 so that the card holder body 331 is embedded in the card slot 212, that is, the card holder body 331 can extend into the second through groove 2112 and slide along the second through groove 2112, and the card holder body 331 can be embedded in the card slot 212, thereby realizing the connection between the tray card holder 330 and the tray assembly 200. Similarly, the tray card holder 330 can be detached from the card slot 212, and the connecting portion 332 can slide and slide out along the first through slot 2111 in a direction away from the card slot 212, and the card holder body 331 can slide and slide out along the second through slot 2112 in a direction away from the card slot 212, thereby realizing the separation of the tray card holder 330 from the tray assembly 200.

[0116] In other embodiments, the slide groove 211 may only include the first through groove 2111 .

[0117] Further optionally, the card slot 212 can be located above the second through slot 2112, and the card slot 212 is opened on the side wall of the first through slot 2111. In this way, when the rotating assembly 300 drives the tray assembly 200 to rotate, the tray card holder 330 can be prevented from being separated from the tray assembly 200, and when the tray assembly rises relative to the chamber body, the tray card holder 330 can cooperate with the card slot 212, and the entire action process is smoother. In addition, the card slot 212 is opened on the side wall of the first through slot 2111, so that the card slot 212 and the first through slot 2111 are at the same height, and the entire tray card holder 330 occupies less space. Of course, the card slot 212 can also be located at the same height as the second through slot 2112.

[0118] In an optional embodiment of the present application, the tray assembly 200 may include a tray 210 and a substrate support 220. The tray 210 may be connected to the tray holder 330, and the top of the substrate support 220 may be connected to the tray 210. Specifically, the substrate support 220 may be threadedly connected to the tray 210, and a receiving space for receiving the substrate 400 may be formed between the substrate support 220 and the tray 210. The bottom of the substrate support 220 may be provided with an opening 222, and the opening 222 may be connected to the receiving space and allow at least a portion of the process surface of the substrate 400 to be exposed, so as to facilitate processing of the process surface of the substrate 400.

[0119] Here, the bottom of the substrate support 220 may be provided with a supporting protrusion 221 , which may be used to support the substrate 400 , and the supporting protrusion 221 may be provided around the opening 222 and protrude toward the opening 222 .

[0120] In this way, the substrate 400 can be easily disassembled and assembled, so that the tray assembly 200 can be reused.

[0121] In this embodiment, the sliding groove 211 and the locking groove 212 mentioned above can be arranged on the tray 210 .

[0122] In other embodiments, the tray assembly 200 may include only the tray 210 , the lower end surface of the tray 210 may be provided with an adsorption device, and the substrate 400 may be adsorbed on the lower end surface of the tray 210 by the adsorption device.

[0123] In this embodiment, the rotating assembly 300 described above may be made of graphite material, the tray assembly 200 may be made of graphite material, and the surface of the substrate support 220 is provided with a silicon carbide coating (SiC coating) or a tantalum carbide coating (TaC coating).

[0124] The semiconductor process chamber and tray assembly 200 provided in the present application can be used together. Before use, the rotating assembly 300 is first installed on the upper cavity 110, and the rotating cover 310 of the rotating assembly 300 is set outside the boss 113, so that the rotating assembly 300 is in the first position, even if the rotating assembly 300 is in the low position. A certain amount of the first fluid is introduced into the positioning flow channel 115, such as 1-20slm (standard liters per minute) of argon (Ar gas) is introduced into the positioning flow channel 115, and the second part 342 of the positioning member 340 is blown to the center line position of the second expansion 1155 of the first fluid outflow channel 1153. At this time, the rotating assembly 300 follows the positioning member 340 to rotate to this direction, and the tray card holder 330 of the rotating assembly 300 rotates to a preset angle, where the preset angle can be 45 degrees. The first fluid is continuously introduced to fix the rotating assembly 300 at the preset angle.

[0125] Then, the tray assembly 200 equipped with the substrate 400 is transferred to the inner cavity 140 of the chamber body 100 by the robot. During the transfer, the slide groove 211 of the tray assembly 200 is parallel to the extension direction of the rotating flow channel 116, and the height of the second through groove 2112 of the slide groove 211 is consistent with the height of the tray body 331 of the tray card holder 330. As the tray assembly 200 moves, the tray card holder 330 is inserted into the slide groove 211. When the tray card holder 330 is aligned with the center of the tray assembly 200, the transfer is stopped. The robot moves downward to make the tray card holder 330 snap into the slot 212 of the tray assembly 200, and then retracts the robot.

[0126] Stop introducing the first fluid, the positioning member 340 is no longer affected by the fluid and can rotate freely, that is, the rotating assembly 300 can resume the rotating state. At this time, a certain amount of the second fluid is introduced into the rotating channel 116, where the second fluid can be argon or hydrogen or a mixture of argon and hydrogen. Specifically, 2-50slm of the second fluid can be introduced into the rotating channel 116. Under the action of the second fluid, the rotating cover 310 floats up to the second position and forms an air flow layer with the boss 113. At this time, the positioning member 340 slides to the lower side of the sliding column 322, and the tray assembly 200 enters the tray groove 1141. Since the rotating cover 310 is provided with a rotating groove, under the action of the spiral airflow, the rotating assembly 300 drives the tray assembly 200 to realize air floating rotation, and the epitaxial process can be started after the rotation is stable.

[0127] When the epitaxial process is completed, the second fluid is stopped from being introduced, and the first fluid is introduced into the positioning channel 115. The first fluid drives the positioning member 340 to drive the rotating component 300 to rotate to a preset angle. Even if the rotating component 300 rotates to the initial position, at this time, the second part 342 of the positioning member 340 is away from the end of the first part 341 and is located on the center line of the second expansion opening 1155 of the first fluid outflow channel 1153 and is at a 45-degree angle to the first fluid outflow channel 1153 to ensure that the extension direction of the slide groove 211 of the tray assembly 200 is parallel to the extension direction of the rotating channel 116, so that when the robot takes the tray assembly 200, the tray tray 330 can slide in the slide groove 211.

[0128] The robot arm is extended to lift the tray assembly 200 , and the tray card holder 330 enters the slide slot 211 from the card slot 212 . As the tray assembly 200 moves outward, the tray card holder 330 is pulled out from the slide slot 211 , thereby separating the tray assembly 200 from the rotating assembly 300 .

[0129] Finally, the robot transfers the tray assembly 200 to the loading chamber.

[0130] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A semiconductor process chamber, characterized in that: include: A chamber body (100), wherein a rotating flow channel (116) is provided on the chamber body (100), and the rotating flow channel (116) is used for allowing a second fluid to pass through; A rotating assembly (300), wherein the rotating assembly (300) comprises a rotating shaft (320) and a tray holder (330), wherein the rotating shaft (320) is rotatably connected to the top of the chamber body (100), and the rotating assembly (300) further comprises a rotating cover (310), wherein one end of the rotating shaft (320) is connected to the rotating cover (310), and the other end is connected to the tray holder (330), and the outlet of the rotating flow channel (116) faces the rotating cover (310), so that the second fluid drives the rotating assembly (300) to rotate in suspension, and the second fluid does not enter the inner cavity (140) of the chamber body (100), and when the rotating assembly (300) is rotated to a preset angle, the tray holder (330) can be connected to or separated from the tray assembly (200) for carrying a substrate (400).

2. The semiconductor process chamber according to claim 1, characterized in that: The rotating assembly (300) is movably disposed on the chamber body (100), and the rotating assembly (300) is movable between a first position and a second position, wherein the first position is lower than the second position; When the rotating assembly (300) is located at the first position and the rotating assembly (300) is rotated to the preset angle, the tray card holder (330) can be connected to or separated from the tray assembly (200); When the rotating assembly (300) is located at the second position, the tray card holder (330) can drive the tray assembly (200) to rotate.

3. The semiconductor process chamber according to claim 2, characterized in that: The chamber body (100) is provided with a positioning flow channel (115), and the positioning flow channel (115) is used for allowing a first fluid to pass through, so that the first fluid drives the rotating component (300) to rotate to the preset angle.

4. The semiconductor process chamber according to claim 3, characterized in that: The rotating assembly (300) further comprises a positioning member (340), wherein the positioning member (340) is connected to the rotating shaft (320), and the positioning flow channel (115) comprises a positioning rotating chamber (1152), a first fluid inflow channel (1151) and a first fluid outflow channel (1153) which are connected to each other, wherein the first fluid inflow channel (1151) and the first fluid outflow channel (1153) are respectively located on two opposite sides of the positioning rotating chamber (1152), and the positioning member (340) is rotatably disposed in the positioning rotating chamber (1152).

5. The semiconductor process chamber according to claim 4, characterized in that: The outlet of the first fluid inflow channel (1151) has a first center point, the inlet of the first fluid outflow channel (1153) has a second center point, and the line connecting the first center point and the second center point intersects with the rotation axis of the positioning member (340).

6. The semiconductor process chamber according to claim 5, characterized in that: A first flare (1154) is provided at the outlet of the first fluid inflow channel (1151), and a second flare (1155) is provided at the inlet of the first fluid outflow channel (1153). The first flare (1154) and the second flare (1155) are symmetrical about the rotation axis of the positioning member (340), and the flow area of ​​the first flare (1154) gradually increases along the direction from the outlet of the first fluid inflow channel (1151) to the rotation axis of the positioning member (340), and the flow area of ​​the second flare (1155) gradually increases along the direction from the inlet of the first fluid outflow channel (1153) to the rotation axis of the positioning member (340).

7. The semiconductor process chamber according to claim 4, characterized in that: The positioning member (340) comprises a first portion (341) and a second portion (342) horizontally connected to the first portion (341); the first portion (341) is coaxially connected to the rotating shaft (320); along the direction from the first portion (341) to the second portion (342), the longitudinal cross-sectional area of ​​the second portion (342) gradually decreases; the longitudinal cross-section is parallel to the axis of the rotating assembly (300).

8. The semiconductor process chamber according to claim 4, characterized in that: The positioning member (340) is sleeved outside the rotating shaft (320) and cooperates with the rotating shaft (320) in a circumferential limiting manner.

9. The semiconductor process chamber according to claim 8, characterized in that: The rotating shaft (320) comprises a rotating shaft (321) and a sliding column (322); the bottom of the sliding column (322) is connected to the tray card holder (330); the top of the sliding column (322) is detachably connected to the rotating shaft (321); and the positioning member (340) is sleeved outside the sliding column (322) and cooperates with the sliding column (322) in a circumferential limiting manner.

10. The semiconductor process chamber according to claim 4, wherein: The top of the chamber body (100) is provided with a positioning rotation groove (11521) and a mounting groove (117), wherein the mounting groove (117) is located below the positioning rotation groove (11521) and is in communication with the positioning rotation groove (11521); The semiconductor process chamber also includes a positioning cavity forming member (114), wherein the positioning cavity forming member (114) is embedded in the mounting groove (117) and is detachably connected to the groove wall of the mounting groove (117), wherein the positioning cavity forming member (114) and the positioning rotation groove (11521) form the positioning rotation cavity (1152), and the positioning cavity forming member (114) is provided with a through hole for the rotation shaft (320) or a part of the tray card holder (330) to pass through.

11. The semiconductor process chamber according to claim 10, characterized in that: A tray groove (1141) is provided on a side of the positioning cavity forming member (114) away from the positioning rotation groove (11521), and when the rotation assembly (300) is located at the second position, the tray groove (1141) is used to accommodate at least a portion of the tray assembly (200).

12. The semiconductor process chamber according to claim 2, wherein: The rotating cover (310) is provided with a plurality of rotating grooves, the plurality of rotating grooves being distributed along the circumference of the rotating shaft (320), and an outlet of the rotating flow channel (116) is opposite to at least one of the rotating grooves, so that the second fluid can drive the rotating component (300) to move to the second position and drive the rotating component (300) to rotate.

13. The semiconductor process chamber according to claim 12, wherein: The rotating cover (310) comprises a top plate (311) and an annular side plate (312), wherein the annular side plate (312) is arranged around the edge of the top plate (311), and the top end of the rotating shaft (320) is connected to the top plate (311); Each of the rotating grooves comprises a first rotating groove (313) and a second rotating groove (314) connected to the first rotating groove (313); the first rotating groove (313) is arranged on the top plate (311); each of the first rotating grooves (313) is distributed along the circumference of the top plate (311); each of the first rotating grooves (313) extends in a direction away from the rotating axis (320); each of the first rotating grooves (313) is an arc-shaped groove and is curved in the same circumferential direction; an outlet of the rotating flow channel (116) is opposite to at least one of the first rotating grooves (313); the second rotating grooves (314) are arranged on the annular side plate (312); each of the second rotating grooves (314) extends in a spiral direction from the top to the bottom of the annular side plate (312); and the curvature direction of the second rotating groove (314) is the same as that of the first rotating groove (313).

14. The semiconductor process chamber according to claim 12, wherein: The rotating flow channel (116) comprises a main flow channel (1161) and at least two branch flow channels (1162), each of the branch flow channels (1162) being distributed along the circumference of the rotating axis (320), the inlet of each of the branch flow channels (1162) being connected to the outlet of the main flow channel (1161), and the outlet of each of the branch flow channels (1162) being opposite to at least one of the rotating grooves.

15. The semiconductor process chamber according to claim 14, wherein: A boss (113) is provided on the top of the chamber body (100); the rotating shaft (320) passes through the boss (113) and is rotatably connected to the boss (113); at least a portion of the boss (113) is located in the rotating cover (310), and each of the branch channels (1162) is provided on the boss (113).

16. The semiconductor process chamber according to claim 1, wherein: The process gas inlet and the process gas outlet of the chamber body (100) are respectively located on two sides of the inner cavity (140) of the chamber body (100), the process gas inlet and the process gas outlet are located in the same horizontal plane, and a heating element is provided on the chamber body (100), or at least a part of the chamber body (100) is a heating element.

17. The semiconductor process chamber according to claim 1, wherein: The bottom of the tray assembly (200) is used to fix the substrate (400), and the tray assembly (200) is provided with a card slot (212), and the card slot (212) is adapted to the tray card holder (330) of the semiconductor process chamber. The tray assembly (200) is also provided with a slide groove (211), the slide groove (211) being in communication with the card slot (212), and the tray card holder (330) can extend into the slide groove (211) and slide along the slide groove (211) to the card slot (212).

18. The semiconductor process chamber according to claim 17, wherein: The slide groove (211) comprises a first through groove (2111) and a second through groove (2112); the first through groove (2111) and the second through groove (2112) both penetrate the tray assembly (200) in a direction perpendicular to the thickness direction of the tray assembly (200); the first through groove (2111) penetrates the top of the tray assembly (200) in the thickness direction of the tray assembly (200) and is connected to the second through groove (2112); the width of the first through groove (2111) is smaller than the width of the second through groove (2112); the first through groove (2111) and the second through groove (2112) are both connected to the card slot (212).

19. The semiconductor process chamber according to claim 18, wherein: The tray card holder (330) of the semiconductor process chamber comprises a connecting portion (332) and a card holder body (331) connected to the connecting portion (332); The first through slot (2111) allows the connecting portion (332) to extend into and slidably cooperate with the connecting portion (332), and the second through slot (2112) can slidably cooperate with the card holder body (331), so that the card holder body (331) can be embedded in the card slot (212).

20. The semiconductor process chamber according to claim 18, wherein: The card slot (212) is located above the second through slot (2112), and the card slot (212) is opened on the side wall of the first through slot (2111).

21. The semiconductor process chamber according to claim 17, wherein: The tray assembly (200) comprises a tray (210) and a substrate support (220), wherein the tray (210) can be connected to the tray holder (330), the top of the substrate support (220) is connected to the tray (210), a storage space for storing the substrate (400) is formed between the substrate support (220) and the tray (210), an opening (222) is provided at the bottom of the substrate support (220), and the opening (222) is connected to the storage space and allows at least part of the process surface of the substrate (400) to be exposed, and a supporting protrusion (221) is provided at the bottom of the substrate support (220), the supporting protrusion (221) is used to support the substrate (400), and the supporting protrusion (221) is arranged around the opening (222) and protrudes toward the opening (222).

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