Temperature control method and system for automatic soldering equipment

Abstract

The present invention discloses a temperature control method and system for automatic soldering equipment, which belongs to the field of intelligent control, wherein the method includes: building a temperature numerical control center; obtaining the preheating temperature and the soldering temperature; performing preheating treatment, making the conveying unit of the tin feeding mechanism in a pre-starting state, inputting the soldering temperature into the soldering iron temperature control module for heating control, and detecting the real-time temperature data of the soldering iron tip of the soldering iron equipment; comparing the real-time temperature data with the soldering temperature, when the real-time temperature data meets the soldering temperature, and the conveying unit of the tin feeding mechanism is in a pre-starting state, controlling the automatic soldering equipment to start. The present application solves the technical problem that the existing welding process lacks prediction and preheating of the temperature of the tin feeding mechanism, resulting in the soldering process being easily affected by the temperature difference under different working environments, resulting in unstable welding quality, and achieves the technical effect of temperature prediction and equipment preheating based on the tin feeding structure, stabilizing the welding process, and improving welding quality and welding efficiency.

Description

Technical Field

[0001] The present invention relates to the field of intelligent control, and in particular to a temperature control method and system for automatic soldering equipment. Background Art

[0002] Automatic spot welding in automated welding technology is one of the key technologies to realize the automation of electronic product assembly. Existing automatic soldering equipment uses direct heating of the soldering iron to solder, and lacks consideration of the temperature of the tin feeding mechanism. As a result, the temperature difference between the equipment temperature and the working environment temperature leads to low soldering efficiency and unstable soldering quality. Summary of the invention

[0003] The present application provides a temperature control method and system for automatic soldering equipment, aiming to solve the technical problem that the existing soldering process lacks prediction and preheating of the temperature of the tin feeding mechanism, resulting in the soldering process being easily affected by temperature differences under different operating environments, leading to unstable welding quality.

[0004] In view of the above problems, the present application provides a temperature control method and system for automatic soldering equipment.

[0005] The first aspect disclosed in the present application provides a temperature control method for automatic soldering equipment, the method comprising: building a temperature numerical control center, the temperature numerical control center comprising a tin feeding temperature control module and a soldering iron temperature control module, wherein the tin feeding temperature control module is connected to a tin feeding mechanism control terminal, and the soldering iron temperature control module is connected to a soldering iron equipment control terminal for soldering; obtaining tin material property information and tin geometric size information in the tin feeding mechanism; obtaining a first preheating temperature and a first soldering temperature according to the tin material property information and the tin geometric size information, wherein the first preheating temperature comprises performing data testing according to the tin material property information and the tin geometric size information, outputting temperature-hardness change data, obtaining a preset hardness of the tin feeding mechanism when feeding tin, identifying the temperature-hardness change data according to the preset hardness, and obtaining Take the temperature corresponding to the preset hardness, use the temperature corresponding to the preset hardness as the input variable to respond to the abnormal interference, obtain the first response temperature, and output the first response temperature as the first preheating temperature; input the first preheating temperature into the tin feeding temperature control module to preheat the conveying shell of the tin feeding mechanism, and when the preheating is completed, the conveying unit of the tin feeding mechanism is in a pre-start state; input the first solder temperature into the soldering iron temperature control module for heating control, and set a stress patch temperature sensor on the top of the soldering iron equipment to detect the real-time temperature data of the soldering iron tip of the soldering iron equipment; upload the real-time temperature data to the soldering iron temperature control module for comparison with the first solder temperature. When the real-time temperature data meets the first solder temperature and the conveying unit of the tin feeding mechanism is in the pre-start state, control the automatic soldering equipment to start.

[0006] Another aspect disclosed in the present application provides a temperature control system for automatic soldering equipment, the system comprising: a CNC center building unit for building a temperature CNC center, the temperature CNC center comprising a tin feeding temperature control module and a soldering iron temperature control module, wherein the tin feeding temperature control module is connected to a tin feeding mechanism control terminal, and the soldering iron temperature control module is connected to a soldering iron equipment control terminal for soldering; a tin information acquisition unit for acquiring tin material property information and tin geometric size information in the tin feeding mechanism; a first temperature acquisition unit for acquiring a first preheating temperature and a first soldering temperature according to the tin material property information and the tin geometric size information, wherein the first preheating temperature comprises performing data testing according to the tin material property information and the tin geometric size information, outputting temperature-hardness change data, acquiring a preset hardness of the tin feeding mechanism when feeding tin, and identifying the temperature-hardness change data according to the preset hardness. , obtain the temperature corresponding to the preset hardness, use the temperature corresponding to the preset hardness as the input variable to respond to the abnormal interference, obtain the first response temperature, and output the first response temperature as the first preheating temperature; the preheating treatment unit is used to input the first preheating temperature into the tin feeding temperature control module to preheat the conveying shell of the tin feeding mechanism, and when the preheating is completed, the conveying unit of the tin feeding mechanism is in a pre-start state; the heating control unit is used to input the first solder temperature into the soldering iron temperature control module for heating control, and set a stress patch temperature sensor at the top of the soldering iron equipment to detect the real-time temperature data of the soldering iron tip of the soldering iron equipment; the equipment startup control unit is used to upload the real-time temperature data to the soldering iron temperature control module for comparison with the first solder temperature. When the real-time temperature data meets the first solder temperature and the conveying unit of the tin feeding mechanism is in the pre-start state, the automatic soldering equipment is controlled to start.

[0007] One or more technical solutions provided in this application have at least the following technical effects or advantages:

[0008] The temperature numerical control center is built, including a tin feeding temperature control module and a soldering iron temperature control module, which are connected to the control terminal to realize closed-loop control of the soldering temperature and improve control accuracy; the tin material property information and geometric size information are obtained to lay the foundation for dynamic parameter setting based on the soldering object; the first preheating temperature and the first soldering temperature are calculated according to the tin material properties and geometric dimensions to realize temperature parameter setting based on the soldering object; the first preheating temperature is input into the tin feeding temperature control module for preheating to realize temperature control of the tin feeding system and ensure that the tin wire temperature is appropriate; the first soldering temperature is input into the soldering iron temperature control module, and the temperature sensor is used to monitor the temperature of the soldering iron tip in real time to realize closed-loop control of the soldering iron temperature; the real-time temperature and the first soldering temperature are compared, and the technical solution of automatic soldering is realized in combination with the status of the tin feeding system, which solves the technical problem that the existing welding process lacks prediction and preheating of the temperature of the tin feeding mechanism, resulting in the soldering process being easily affected by temperature differences under different operating environments, resulting in unstable welding quality, and achieves the technical effect of temperature prediction and equipment preheating based on the tin feeding structure, stabilizing the welding process, and improving welding quality and welding efficiency.

[0009] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 A flow chart of a temperature control method for an automatic soldering device is provided for an embodiment of the present application;

[0011] Figure 2 A schematic flow chart of obtaining the first response temperature in a temperature control method of an automatic soldering device is provided for an embodiment of the present application;

[0012] Figure 3 A structural schematic diagram of a temperature control system of an automatic soldering device is provided for an embodiment of the present application.

[0013] Description of the accompanying drawings: CNC center construction unit 11, tin information acquisition unit 12, first temperature acquisition unit 13, preheating treatment unit 14, heating control unit 15, equipment start control unit 16. DETAILED DESCRIPTION

[0014] The overall idea of ​​the technical solution provided by this application is as follows:

[0015] The embodiment of the present application provides a temperature control method and system for automatic soldering equipment. First, a temperature numerical control center is established, including a tin feeding temperature control module and a soldering iron temperature control module, and closed-loop control of the solder temperature is achieved by connecting the equipment control terminal to improve the control accuracy. At the same time, the tin material properties and geometric dimensions are obtained, and the dynamic solder temperature is set according to these parameters to achieve temperature control optimization based on different soldering objects. During operation, a temperature sensor is used to monitor and feedback temperature information in real time, and closed-loop control is performed in combination with parameter comparison, so that the soldering environment can quickly reach the optimal temperature, realize automatic and efficient soldering, and achieve the technical problem of dynamically realizing solder preheating and improving temperature response speed.

[0016] After introducing the basic principles of the present application, various non-limiting implementation methods of the present application will be specifically described below in conjunction with the drawings in the specification.

[0017] Embodiment 1

[0018] like Figure 1 As shown, an embodiment of the present application provides a temperature control method for automatic soldering equipment, the method comprising:

[0019] Build a temperature digital control center, which includes a tin feeding temperature control module and a soldering iron temperature control module, wherein the tin feeding temperature control module is connected to a tin feeding mechanism control terminal, and the soldering iron temperature control module is connected to a soldering iron equipment control terminal for soldering;

[0020] In a feasible implementation, the temperature numerical control center is an integrated control processor that realizes intelligent closed-loop control of relevant equipment and process parameters in the entire automatic soldering process. The temperature numerical control center includes a tin temperature control module and a soldering iron temperature control module, wherein the tin feeding temperature control module is used to monitor and control the temperature of the tin feeding mechanism in the automatic soldering equipment, and the softening degree of the tin material is controlled by heating the shell of the tin feeding mechanism that transports the tin material; the soldering iron temperature control module is used to monitor and control the temperature of the soldering iron equipment used for soldering in the automatic soldering equipment. The tin feeding mechanism control terminal is arranged on the tin feeding mechanism, connected to the tin feeding temperature control module, and used to receive and execute the control signal output by the tin feeding temperature control module; the soldering iron equipment control terminal is arranged on the soldering iron equipment, connected to the soldering iron temperature control module, and used to receive and execute the control signal output by the soldering iron temperature control module.

[0021] By building a temperature CNC center, connecting the tin feeding temperature control module with the tin feeding mechanism control terminal, and connecting the soldering iron temperature control module with the soldering iron equipment control terminal, the intelligent monitoring and control of the tin feeding temperature and soldering iron temperature in the automatic soldering process can be achieved to ensure a reliable and efficient soldering process.

[0022] Acquiring tin material property information and tin geometric size information in the tin delivery mechanism;

[0023] In the embodiment of the present application, in order to improve the soldering quality of the soldering equipment, the relevant parameter information of the tin material is obtained for obtaining the first preheating temperature and the first soldering temperature. Among them, the tin material attribute information refers to the attribute parameters such as the material composition and component ratio of the tin material, which directly affect the thermal properties such as the melting point and thermal conductivity of the tin material; the tin geometric size information refers to the size parameters such as the length, width, and thickness of the tin material, which affect the volume of the tin material, thereby affecting the heat conduction during the transportation and heating process.

[0024] Specifically, the property information of the tin material is obtained from the product manual provided by the tin material supplier, and the actual geometric size information of the tin material in the tin delivery mechanism is obtained by measurement. After the property information of the tin material and the geometric size information of the tin are obtained, a basis is provided for calculating a reasonable first preheating temperature.

[0025] According to the tin material property information and the tin geometric dimension information, obtaining a first preheating temperature and a first soldering temperature;

[0026] In a feasible implementation manner, after obtaining the tin material property information and the tin geometric size information, it is necessary to calculate a first preheating temperature for preheating the tin material and a first soldering temperature for the soldering iron device to solder. The first preheating temperature is used to preheat the tin feeding mechanism. The first soldering temperature is the temperature required for the actual soldering obtained by the computer. The calculation step of the first preheating temperature includes:

[0027] Data testing is performed based on the tin material property information and the tin geometric dimension information, and temperature-hardness change data is output; a preset hardness of the tin feeding mechanism for tin feeding is obtained, the temperature-hardness change data is identified based on the preset hardness, and the temperature corresponding to the preset hardness is obtained; the temperature corresponding to the preset hardness is used as an input variable to respond to interference anomalies, a first response temperature is obtained, and the first response temperature is output as the first preheating temperature.

[0028] In a preferred embodiment, in order to accurately determine the first preheating temperature, first, after obtaining the tin material property information and the tin geometric size information, an actual test experiment is performed to obtain the temperature-hardness relationship curve of the tin material. The test method is to set different temperature environments, place the tin material therein for heating, and test the hardness value of the tin material at different temperatures. As the temperature changes, the hardness of the tin material will also change, and finally obtain the corresponding relationship curve between the temperature and the hardness value, that is, the temperature-hardness change data.

[0029] Before automatic tin feeding, determine the degree of softening of the tin material after being heated to be most suitable for transportation, and use the preset hardness value of the tin material as the preset hardness, which is determined comprehensively based on factors such as the characteristics of the tin material and the structure of the transportation channel. After obtaining the preset hardness, find the temperature point corresponding to this hardness value on the obtained temperature-hardness change data, that is, convert the preset hardness, the intermediate variable, into the corresponding temperature value, which will make the tin material reach a softened state just suitable for transportation.

[0030] Subsequently, in order to obtain an accurate first preheating temperature, the determined temperature matching the preset hardness is input into the interference anomaly response model for reprocessing. The model can eliminate the influence of various random environmental noises and output a temperature value after response optimization, namely the first response temperature. The first response temperature can accurately correspond to the preset hardness target and can resist the interference disturbance of environmental noise. Finally, the first response temperature is used as the temperature control target value for preheating the tin material, that is, the first preheating temperature, and is transmitted to the tin delivery temperature control module to reliably control the temperature of the tin material.

[0031] The first preheating temperature is determined based on the melting point, specific heat capacity, density, thermal conductivity and other thermophysical parameters of the tin material, combined with the volume of the tin material, to ensure that the tin material can be completely softened when it reaches the soldering iron equipment, but avoid overheating and oxidation of the tin material. The first soldering temperature is based on the heat resistance temperature of the PCB board and components, combined with soldering process parameters such as time and pressure, and taking into account the heat loss of the soldering process, to obtain the temperature value required by the soldering iron equipment, to ensure a reliable soldering connection, and to provide a basis for temperature control execution.

[0032] According to the first preheating temperature, the conveying shell of the tin conveying mechanism is preheated, and when the preheating is completed, the conveying unit of the tin conveying mechanism is in a pre-starting state;

[0033] In the embodiment of the present application, after the first preheating temperature is calculated, the temperature value is input into the tin feeding temperature control module. The tin feeding temperature control module heats the conveying shell used to convey the tin material in the tin feeding mechanism according to the input first preheating temperature to achieve preheating treatment of the tin material. Among them, the conveying shell is a shell component arranged in the tin feeding mechanism and in direct contact with the tin material. By heating the conveying shell, the heat is transferred to the tin material by heat conduction, so that the tin material reaches a softened state.

[0034] When the tin feeding temperature control module detects that the conveying shell has been heated to the first preheating temperature, the preheating treatment of the tin material is completed. At this time, the tin feeding temperature control module sends a control signal to put the conveying unit in the tin feeding mechanism into a pre-start state. Among them, the conveying unit is an actuator in the tin feeding mechanism used to drive the tin material to be conveyed forward. Putting it into the pre-start state is to prepare for the subsequent automatic soldering operation.

[0035] The first solder temperature is input into the soldering iron temperature control module for heating control, and a stress patch temperature sensor is arranged on the top of the soldering iron device to detect the real-time temperature data of the soldering iron tip of the soldering iron device;

[0036] In the implementation of this application, after obtaining the first solder temperature, the temperature value is input into the soldering iron temperature control module. The soldering iron temperature control module controls the heating component in the soldering iron equipment according to the input temperature value so that the soldering iron tip reaches the first solder temperature. At the same time, a stress patch temperature sensor is set at the top position of the soldering iron of the soldering iron equipment. The sensor monitors the temperature of the soldering iron tip in real time and transmits the collected real-time temperature data of the soldering iron tip. Among them, the stress patch temperature sensor is a thin patch sensor that can be attached to the curved surface of the soldering iron tip without affecting the contact between the soldering iron tip and the PCB board. The sensor monitors the temperature of its pressure point in real time, realizes the accurate collection of the temperature at the top of the soldering iron tip, provides a basis for subsequent temperature control and feedback, and realizes closed-loop control of the temperature of the soldering iron tip.

[0037] The real-time temperature data is uploaded to the soldering iron temperature control module for comparison with the first solder temperature. When the real-time temperature data meets the first solder temperature and the conveying unit of the tin feeding mechanism is in a pre-start state, the automatic soldering equipment is controlled to start.

[0038] In an embodiment of the present application, a stress patch-type temperature sensor arranged at the top of the soldering iron device monitors the real-time temperature data of the soldering iron tip in real time, and uploads the real-time temperature data to the soldering iron temperature control module. After obtaining the real-time temperature data, the soldering iron temperature control module compares the real-time temperature data with the determined first solder temperature. When the real-time temperature data indicates that the soldering iron tip has reached the first solder temperature, the soldering iron tip temperature condition is met. At this time, the soldering iron temperature control module detects whether the conveying unit of the tin feeding mechanism is in a pre-start state. The conveying unit being in a pre-start state is a sign to ensure that the tin material has been preheated and is ready. When both of the above conditions are met, that is, the temperature of the soldering iron tip reaches the first solder temperature and the conveying unit is in a pre-start state, the soldering iron temperature control module sends a control signal to the automatic soldering device, causing the automatic soldering device to start and perform automated soldering operations. Through double confirmation, the temperature condition of the automatic soldering device can quickly reach the optimal soldering temperature, ensuring the efficiency of the automatic soldering process.

[0039] Furthermore, the embodiment of the present application also includes:

[0040] The temperature digital control center also includes a panel temperature control module;

[0041] Preset a second preheating temperature, input the second preheating temperature into the board surface temperature control module to preheat the surface of the PCB to be welded, and perform real-time sensing on the surface of the PCB to be welded according to a plurality of temperature sensors, and output a plurality of surface temperature data, wherein the plurality of temperature sensors are evenly distributed on the surface of the PCB to be welded;

[0042] The multiple surface temperature data are uploaded to the board temperature control module for comparison with the second preheating temperature. When the multiple surface temperature data meet the second preheating temperature, the real-time temperature data meets the first soldering temperature, and the conveying unit of the tin feeding mechanism is in a pre-start state, the automatic soldering equipment is controlled to start.

[0043] In a preferred embodiment, the temperature control data center includes not only the tin temperature control module and the soldering iron temperature control module, but also a board temperature control module. The board temperature control module is used to preheat the PCB board so that the board surface reaches the optimized soldering temperature.

[0044] First, the second preheating temperature is determined in advance according to the material heat capacity, thermal conductivity, board thickness and other parameters of the PCB board and the judgment of professional technicians. Secondly, the second preheating temperature is input into the board surface temperature control module, and the board surface temperature control module heats the PCB board to achieve board surface preheating. At the same time, multiple temperature sensors are set on the surface of the PCB board, and these sensors detect the board surface temperature in real time and output multiple surface temperature data. Multiple temperature sensors are evenly distributed on the surface of the PCB board to monitor the temperature distribution of the entire board surface. Then, the multiple temperature sensors on the board surface upload the detected multiple surface temperature data to the board surface temperature control module. After receiving these surface temperature data, the board surface temperature control module compares them with the pre-set second preheating temperature. If the surface temperature data indicates that the surface of the PCB board has reached the second preheating temperature, the board surface preheating is completed. At the same time, it is detected whether the temperature of the soldering iron tip reaches the first solder temperature, and whether the conveying unit of the tin feeding mechanism is in the pre-start state.

[0045] When the PCB surface reaches the second preheating temperature, the soldering iron tip reaches the first soldering temperature, and the tin feeding unit is pre-started, the board temperature control module sends a control signal to the automatic soldering equipment to start the automatic soldering equipment and start the automatic soldering process, thereby achieving closed-loop control of the PCB surface temperature and coordinating with the soldering iron tip temperature and the tin feeding unit action to ensure stable startup and operation of the automatic soldering equipment.

[0046] Furthermore, the embodiment of the present application also includes:

[0047] By identifying the uniformity of temperature changes on the plurality of surface temperature data, a preheating uniformity is obtained, wherein the preheating uniformity is used to identify the uniformity of the temperature of the surface of the PCB board to be soldered during preheating;

[0048] When the preheating uniformity does not meet the preset uniformity, first reminder information is obtained, wherein the first reminder information is used to remind the panel temperature control module that the preheating is uneven.

[0049] In a preferred embodiment, in order to improve the temperature control of the automatic soldering process, first, after obtaining multiple surface temperature data collected by multiple temperature sensors on the PCB board, the variance of each surface temperature data is calculated as an indicator for judging the consistency of temperature changes. The smaller the variance, the more consistent the change. Then, the obtained variance is converted into a uniformity index of 0-100 as the preheating uniformity, which reflects the uniformity of the temperature of the surface of the PCB board to be soldered during preheating.

[0050] During the preheating process of the board surface, the data collected by the temperature sensor is calculated in real time to obtain the preheating uniformity that reflects the current preheating uniformity of the PCB board. At the same time, the ideal uniformity threshold, that is, the preset uniformity, is preset by experts based on experience. Once the calculated preheating uniformity is lower than the preset uniformity, it indicates that the current preheating temperature distribution of the board surface is not uniform enough. At this time, the first reminder information, that is, the uneven preheating reminder signal, is obtained and sent to the board surface temperature control module. After receiving the first reminder information, the board surface temperature control module makes timely adjustments, such as changing the heat source distribution, adding auxiliary heating, etc., to improve the uniformity of preheating. Through closed-loop control, the preheating temperature distribution of the PCB board surface is automatically optimized.

[0051] Further, such as Figure 2 As shown, the embodiment of the present application also includes:

[0052] Acquire temperature-hardness change data of multiple parallel tests, and then identify the temperature-hardness change data after the multiple parallel tests according to the preset hardness to obtain multiple parallel temperatures;

[0053] Performing average processing on the multiple parallel temperatures and outputting a first average temperature;

[0054] Training an interference abnormal response model, wherein the interference abnormal response model is obtained by performing disturbance training using real-time temperature samples of the execution environment of the tin delivery mechanism, thermal conductivity samples of the shell of the tin delivery mechanism used to deliver tin materials, and temperature random error samples as interference factors;

[0055] The first mean temperature is input into the interference abnormal response model to obtain the first response temperature.

[0056] In a feasible implementation, in order to improve the accuracy of the first preheating temperature, an interference abnormal response model is established to obtain the first response temperature. First, under the same conditions, the corresponding hardness value tests at different temperatures are repeatedly performed on the tin material to obtain the temperature-hardness change data of multiple parallel tests. Then, in the temperature-hardness change data of multiple parallel tests, according to the preset hardness value that the tin material needs to reach when tinning, that is, the preset hardness, the temperature value corresponding to the preset hardness in each data group is identified to obtain multiple groups of temperature values, that is, multiple parallel temperatures. Then, the average of the multiple parallel temperatures is calculated to obtain the first average temperature.

[0057] Subsequently, the temperature data of the actual working environment of the tin delivery mechanism is collected as the actual temperature sample, and the thermal characteristic data of the tin delivery mechanism shell of different materials and structures are tested as the shell thermal conductivity performance sample. The temperature random disturbance sample is generated by the random number generation algorithm as the interference factor; the actual temperature sample is preprocessed by denoising and dividing the time window, the shell thermal conductivity performance sample is preprocessed by normalization, and the interference factor is preprocessed by deduplication. Then, a model suitable for processing dynamic time series data is selected, such as LSTM, and the network structure is defined, including the input layer, hidden layer and output layer, and the loss function, optimizer, etc. are defined. After that, the preprocessed actual temperature sample, shell thermal conductivity performance sample and interference factor are used for training, and the model structure and parameters are adjusted to minimize the training error. The model is evaluated using the validation set and the hyperparameters are adjusted to obtain an interference abnormal response model that is adaptable to ambient temperature changes and abnormal disturbances. Then, the first mean temperature is input into the interference abnormal response model to obtain the first response temperature and improve the accuracy of the first preheating temperature.

[0058] Furthermore, the embodiment of the present application also includes:

[0059] By grading the first solder temperature, a multi-stage heating temperature is obtained, wherein the multi-stage heating temperature comprises at least a primary heating temperature and a secondary heating temperature, and the primary heating temperature is less than or equal to half of the secondary heating temperature;

[0060] The soldering iron temperature control module is controlled according to the multi-stage heating temperature, and when the soldering iron device is in a standby state, the soldering iron device is heated and controlled at the first-stage heating temperature.

[0061] In a preferred embodiment, first, the first solder temperature is graded to obtain a multi-stage heating temperature. The first solder temperature refers to the temperature value that the soldering iron needs to reach when melting the tin material; the multi-stage heating temperature is to divide the first solder temperature into a plurality of different levels of temperature values ​​according to a certain ratio, wherein the multi-stage heating temperature level includes at least a first-stage heating temperature and a second-stage heating temperature, and the first-stage heating temperature is lower than the second-stage heating temperature and is equal to half of the second-stage heating temperature. Such a multi-stage heating temperature design allows the soldering iron to gradually heat up from a low temperature to a high temperature, avoiding overshoot, and can use different levels of heating temperatures according to the working state, thereby improving the flexibility of temperature control.

[0062] Subsequently, the temperature control module of the soldering iron is heated and controlled by the obtained multi-stage heating temperature. When the soldering iron equipment is in standby mode, the soldering iron temperature control module uses the first-stage heating temperature to heat the soldering iron. The first-stage heating temperature is the lowest temperature among the multi-stage heating temperatures. Compared with directly using high-temperature heating, using a lower first-stage heating temperature reduces the energy loss of the soldering iron in standby mode, which not only achieves temperature maintenance control, but also improves the response speed of switching from standby mode to working mode, and prepares the correct preheating temperature for the soldering iron.

[0063] Furthermore, the embodiment of the present application also includes:

[0064] Acquire the real-time position information of the soldering iron device, and when the real-time position information is at a prepared starting position, detect the continuous waiting time of the soldering iron device;

[0065] When the continuous waiting time is longer than the preset waiting time, the soldering iron device is put into a standby state.

[0066] In a feasible implementation, in order to improve the reduction of energy consumption, it is determined whether the soldering iron device is in a standby state. First, the real-time position information of the soldering iron device is collected by a position sensor installed on the soldering iron device. When the real-time position information shows that the soldering iron device is in a preparatory starting position, the continuous waiting time of the soldering iron is detected. Among them, the preparatory starting position refers to the initial position where the soldering iron device is ready to start working, and the monitoring of its continuous waiting time is started. By obtaining the continuous waiting time of the soldering iron device in the preparatory starting position, the working state of the soldering iron device is determined. When the soldering iron waits at the preparatory starting position for more than a certain period of time, it is determined that it is currently in an idle state, and then the standby state control operation is performed.

[0067] The preset waiting time is customized according to the user's usage habits. When the continuous waiting time of the soldering iron device in the preparation starting position exceeds the preset waiting time, it indicates that the soldering iron device is currently in an idle state and is not heating. At this time, the soldering iron temperature control module sends a control signal to put the soldering iron into a standby state to reduce energy consumption and realize energy-saving management of the soldering iron device.

[0068] In summary, the temperature control method of an automatic soldering device provided in the embodiment of the present application has the following technical effects:

[0069] Build a temperature numerical control center, which includes a tin feeding temperature control module and a soldering iron temperature control module, wherein the tin feeding temperature control module is connected to the control terminal of the tin feeding mechanism, and the soldering iron temperature control module is connected to the control terminal of the soldering iron equipment used for soldering, so as to realize closed-loop control and improve temperature control accuracy. Obtain the tin material property information and tin geometric size information in the tin feeding mechanism to provide a basis for setting dynamic temperature control parameters. According to the tin material property information and tin geometric size information, obtain the first preheating temperature and the first soldering temperature to realize dynamic parameter setting based on the soldering object. According to the first preheating temperature, input the tin feeding temperature control module to preheat the conveying shell of the tin feeding mechanism. When the preheating is completed, the conveying unit of the tin feeding mechanism is in the pre-start state to ensure that the tin wire reaches the appropriate temperature. Input the first soldering temperature into the soldering iron temperature control module for heating control, and set a stress patch temperature sensor at the top of the soldering iron equipment to detect the real-time temperature data of the soldering iron head of the soldering iron equipment to realize real-time monitoring and feedback. The real-time temperature data is uploaded to the soldering iron temperature control module for comparison with the first solder temperature. When the real-time temperature data meets the first solder temperature and the conveying unit of the tin feeding mechanism is in the pre-start state, the automatic soldering equipment is controlled to start, so that the temperature of the entire soldering process can quickly reach the optimal soldering temperature, thereby improving the temperature response speed and the soldering efficiency.

[0070] Embodiment 2

[0071] Based on the same inventive concept as the temperature control method of an automatic soldering device in the aforementioned embodiment, Figure 3 As shown, an embodiment of the present application provides a temperature control system for an automatic soldering device, the system comprising:

[0072] A numerical control center construction unit 11 is used to construct a temperature numerical control center, wherein the temperature numerical control center includes a tin feeding temperature control module and a soldering iron temperature control module, wherein the tin feeding temperature control module is connected to a tin feeding mechanism control terminal, and the soldering iron temperature control module is connected to a soldering iron equipment control terminal for soldering;

[0073] A tin information acquisition unit 12, used to acquire tin material property information and tin geometric size information in the tin delivery mechanism;

[0074] A first temperature acquisition unit 13, used to acquire a first preheating temperature and a first soldering temperature according to the tin material property information and the tin geometric size information, wherein the first preheating temperature includes performing data testing according to the tin material property information and the tin geometric size information, and outputting temperature-hardness change data;

[0075] Acquire a preset hardness of the tin-feeding mechanism for tin-feeding, identify the temperature-hardness change data according to the preset hardness, and acquire a temperature corresponding to the preset hardness;

[0076] Using the temperature corresponding to the preset hardness as an input variable to respond to abnormal interference, obtaining a first response temperature, and outputting the first response temperature as the first preheating temperature;

[0077] A preheating treatment unit 14 is used to input the first preheating temperature into the tin feeding temperature control module to preheat the conveying shell of the tin feeding mechanism, and when the preheating is completed, the conveying unit of the tin feeding mechanism is in a pre-start state;

[0078] A heating control unit 15, used for inputting the first solder temperature into the soldering iron temperature control module for heating control, and arranging a stress patch temperature sensor at the top of the soldering iron device to detect the real-time temperature data of the soldering iron tip of the soldering iron device;

[0079] The equipment startup control unit 16 is used to upload the real-time temperature data to the soldering iron temperature control module for comparison with the first solder temperature. When the real-time temperature data meets the first solder temperature and the conveying unit of the tin feeding mechanism is in a pre-start state, the automatic soldering equipment is controlled to start.

[0080] Furthermore, the embodiment of the present application also includes a panel temperature control module unit, which includes the following execution steps:

[0081] Preset a second preheating temperature, input the second preheating temperature into the board surface temperature control module to preheat the surface of the PCB to be welded, and perform real-time sensing on the surface of the PCB to be welded according to a plurality of temperature sensors, and output a plurality of surface temperature data, wherein the plurality of temperature sensors are evenly distributed on the surface of the PCB to be welded;

[0082] The multiple surface temperature data are uploaded to the board temperature control module for comparison with the second preheating temperature. When the multiple surface temperature data meet the second preheating temperature, the real-time temperature data meets the first soldering temperature, and the conveying unit of the tin feeding mechanism is in a pre-start state, the automatic soldering equipment is controlled to start.

[0083] Furthermore, the panel temperature control module unit also includes the following execution steps:

[0084] By identifying the uniformity of temperature changes on the plurality of surface temperature data, a preheating uniformity is obtained, wherein the preheating uniformity is used to identify the uniformity of the temperature of the surface of the PCB board to be soldered during preheating;

[0085] When the preheating uniformity does not meet the preset uniformity, first reminder information is obtained, wherein the first reminder information is used to remind the panel temperature control module that the preheating is uneven.

[0086] Furthermore, the first temperature acquisition unit 13 includes the following execution steps:

[0087] Acquire temperature-hardness change data of multiple parallel tests, and then identify the temperature-hardness change data after the multiple parallel tests according to the preset hardness to obtain multiple parallel temperatures;

[0088] Performing average processing on the multiple parallel temperatures and outputting a first average temperature;

[0089] Training an interference abnormal response model, wherein the interference abnormal response model is obtained by performing disturbance training using real-time temperature samples of the execution environment of the tin delivery mechanism, thermal conductivity samples of the shell of the tin delivery mechanism used to deliver tin materials, and temperature random error samples as interference factors;

[0090] The first mean temperature is input into the interference abnormal response model to obtain the first response temperature.

[0091] Furthermore, the heating control unit 15 includes the following execution steps:

[0092] By grading the first solder temperature, a multi-stage heating temperature is obtained, wherein the multi-stage heating temperature comprises at least a primary heating temperature and a secondary heating temperature, and the primary heating temperature is less than or equal to half of the secondary heating temperature;

[0093] The soldering iron temperature control module is controlled according to the multi-stage heating temperature, and when the soldering iron device is in a standby state, the soldering iron device is heated and controlled at the first-stage heating temperature.

[0094] Furthermore, the heating control unit 15 includes the following execution steps:

[0095] Acquire the real-time position information of the soldering iron device, and when the real-time position information is at a prepared starting position, detect the continuous waiting time of the soldering iron device;

[0096] When the continuous waiting time is longer than the preset waiting time, the soldering iron device is put into a standby state.

[0097] Any step of the method described above can be stored as a computer instruction or program in an unlimited computer memory, and can be called and recognized by an unlimited computer processor to implement any method in the embodiments of the present application, without any unnecessary restrictions.

[0098] Furthermore, the first or second mentioned above may not only represent an order relationship, but may also represent a specific concept, and / or refer to multiple elements that can be selected individually or in full. Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the present application and its equivalents, the present application intends to include these modifications and variations.

Claims

1. A temperature control method for automatic soldering equipment, characterized in that: The method comprises: Build a temperature digital control center, which includes a tin feeding temperature control module and a soldering iron temperature control module, wherein the tin feeding temperature control module is connected to a tin feeding mechanism control terminal, and the soldering iron temperature control module is connected to a soldering iron equipment control terminal for soldering; Acquiring tin material property information and tin geometric size information in the tin delivery mechanism; According to the tin material property information and the tin geometric size information, a first preheating temperature and a first soldering temperature are obtained, wherein the first preheating temperature includes performing data testing according to the tin material property information and the tin geometric size information, outputting temperature-hardness change data, obtaining a preset hardness of the tin feeding mechanism for tin feeding, identifying the temperature-hardness change data according to the preset hardness, obtaining a temperature corresponding to the preset hardness, using the temperature corresponding to the preset hardness as an input variable for an interference abnormality response, obtaining a first response temperature, and outputting the first response temperature as the first preheating temperature; According to the first preheating temperature, the conveying shell of the tin conveying mechanism is preheated, and when the preheating is completed, the conveying unit of the tin conveying mechanism is in a pre-starting state; The first solder temperature is input into the soldering iron temperature control module for heating control, and a stress patch temperature sensor is arranged on the top of the soldering iron device to detect the real-time temperature data of the soldering iron tip of the soldering iron device; Uploading the real-time temperature data to the soldering iron temperature control module for comparison with the first solder temperature, and when the real-time temperature data meets the first solder temperature and the conveying unit of the solder feeding mechanism is in a pre-start state, controlling the automatic soldering device to start; Wherein, the temperature corresponding to the preset hardness is used as an input variable to perform an abnormal interference response, and the method further includes: Acquire temperature-hardness variation data of multiple parallel tests, and then identify the temperature-hardness variation data after the multiple parallel tests according to the preset hardness to obtain multiple parallel temperatures; Performing average processing on the multiple parallel temperatures and outputting a first average temperature; Training an interference abnormal response model, wherein the interference abnormal response model is obtained by performing disturbance training using real-time temperature samples of the execution environment of the tin delivery mechanism, thermal conductivity samples of the shell of the tin delivery mechanism used to deliver tin materials, and temperature random error samples as interference factors; The first mean temperature is input into the interference abnormal response model to obtain the first response temperature.

2. The method according to claim 1, characterized in that The temperature digital control center also includes a panel temperature control module, including: Preset a second preheating temperature, input the second preheating temperature into the board surface temperature control module to preheat the surface of the PCB to be welded, and perform real-time sensing on the surface of the PCB to be welded according to a plurality of temperature sensors, and output a plurality of surface temperature data, wherein the plurality of temperature sensors are evenly distributed on the surface of the PCB to be welded; The multiple surface temperature data are uploaded to the board temperature control module for comparison with the second preheating temperature. When the multiple surface temperature data meet the second preheating temperature, the real-time temperature data meets the first soldering temperature, and the conveying unit of the tin feeding mechanism is in a pre-start state, the automatic soldering equipment is controlled to start.

3. The method according to claim 2, characterized in that The method further comprises: By identifying the uniformity of temperature changes on the plurality of surface temperature data, a preheating uniformity is obtained, wherein the preheating uniformity is used to identify the uniformity of the temperature of the surface of the PCB board to be soldered during preheating; When the preheating uniformity does not meet the preset uniformity, first reminder information is obtained, wherein the first reminder information is used to remind the panel temperature control module that the preheating is uneven.

4. The method according to claim 1, characterized in that The method further comprises: By grading the first solder temperature, a multi-stage heating temperature is obtained, wherein the multi-stage heating temperature comprises at least a primary heating temperature and a secondary heating temperature, and the primary heating temperature is less than or equal to half of the secondary heating temperature; The soldering iron temperature control module is controlled according to the multi-stage heating temperature, and when the soldering iron device is in a standby state, the soldering iron device is heated and controlled at the first-stage heating temperature.

5. The method according to claim 4, characterized in that The method further comprises: Acquire the real-time position information of the soldering iron device, and when the real-time position information is at a prepared starting position, detect the continuous waiting time of the soldering iron device; When the continuous waiting time is longer than the preset waiting time, the soldering iron device is put into a standby state.

6. A temperature control system for automatic soldering equipment, characterized in that: A temperature control method for automatic soldering equipment according to any one of claims 1 to 5, the system comprising: A CNC center building unit, the CNC center building unit is used to build a temperature CNC center, the temperature CNC center includes a tin feeding temperature control module and a soldering iron temperature control module, wherein the tin feeding temperature control module is connected to a tin feeding mechanism control terminal, and the soldering iron temperature control module is connected to a soldering iron equipment control terminal for soldering; A tin information acquisition unit, the tin information acquisition unit is used to acquire the tin material property information and tin geometric size information in the tin delivery mechanism; A first temperature acquisition unit, the first temperature acquisition unit is used to acquire a first preheating temperature and a first soldering temperature according to the tin material property information and the tin geometric size information, wherein the first preheating temperature includes performing data testing according to the tin material property information and the tin geometric size information, and outputting temperature-hardness change data; acquiring a preset hardness of the tin feeding mechanism when feeding tin, identifying the temperature-hardness change data according to the preset hardness, and acquiring a temperature corresponding to the preset hardness; using the temperature corresponding to the preset hardness as an input variable to perform an interference abnormal response, acquiring a first response temperature, and outputting the first response temperature as the first preheating temperature; A preheating treatment unit, the preheating treatment unit is used to input the first preheating temperature into the tin feeding temperature control module to preheat the conveying shell of the tin feeding mechanism, and when the preheating is completed, the conveying unit of the tin feeding mechanism is in a pre-start state; A heating control unit, the heating control unit is used to input the first solder temperature into the soldering iron temperature control module for heating control, and a stress patch temperature sensor is arranged on the top of the soldering iron device to detect the real-time temperature data of the soldering iron tip of the soldering iron device; An equipment startup control unit is used to upload the real-time temperature data to the soldering iron temperature control module for comparison with the first solder temperature. When the real-time temperature data meets the first solder temperature and the conveying unit of the tin feeding mechanism is in a pre-start state, the automatic soldering equipment is controlled to start.

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