A real-time monitoring method for screen deformation in LTCC green sheet printing process

Abstract

The present invention relates to a method for real-time monitoring of the deformation amount of a screen plate during the printing process of LTCC green ceramic chips. The method includes the following steps: designing alignment holes for the green ceramic chips to be printed, dividing the green ceramic chips into multiple regions, and setting a circular hole as an alignment hole in each region; designing alignment marks for the printing screen plate, setting a "field" - shaped alignment mark network equal in number to the alignment holes on the printing screen plate, and the "field" - shaped alignment mark network is set corresponding to the alignment holes one by one; judging the deformation of the screen plate and calculating the deformation amount. The present invention eliminates the repeated measurement steps of the screen plate, reduces the waste caused during the process of collecting slurry due to continuous measurement of the screen plate, and also avoids the scrapping of the green ceramic chips to be printed caused by the failure to timely detect the deformation of the screen plate.

Description

Technical Field

[0001] This invention relates to the field of LTCC printing technology, specifically to a method for real-time monitoring of screen deformation during LTCC green ceramic sheet printing. Background Technology

[0002] In the printing process of low-temperature co-fired ceramic (LTCC) circuit green ceramic sheets in hybrid microelectronics integration, a printing screen is required. The screen is typically composed of an aluminum alloy frame and stainless steel wire woven together, then coated with latex of the corresponding shape according to the design drawings. During printing, the screen deforms under the pressure of the squeegee, contacting the LTCC green ceramic sheet to be printed, transferring the ink from the screen to the green ceramic sheet to complete the printing process. With each printing cycle, the screen is continuously subjected to the pressure of the squeegee, resulting in irreversible plastic deformation. This deformation causes the printed pattern to deviate from the original design position, causing defects such as relative positional deviations in the circuit and misalignment of vertical connections. As the amount of screen deformation accumulates, the degree of defect increases. When it exceeds the design performance tolerance, the screen must be scrapped.

[0003] In actual production, the lifespan of printing screens is usually predicted based on production experience. After a certain number of printing cycles (e.g., 50 or 80), the screen is removed from the printing press, and its deformation is measured on a vision measuring instrument. If the deformation is within acceptable limits, it continues to be used; otherwise, it is scrapped. This measurement is repeated until the screen deformation exceeds the tolerance value. However, this continuous measurement of the screen and the subsequent collection of printing paste results in paste waste. Furthermore, because deformation measurements are performed at intervals, it's difficult to detect screen deformation in a timely manner, leading to the scrapping of unprinted ceramic sheets. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the present invention aims to provide a method for real-time monitoring of screen deformation during LTCC green ceramic sheet printing.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A method for real-time monitoring of screen deformation during LTCC green ceramic tile printing, the method comprising the following steps:

[0007] S1. Design of alignment holes for ceramic tiles to be printed

[0008] The raw ceramic tile is divided into multiple areas, and a circular hole is set in each area as an alignment hole.

[0009] S2, Printing screen alignment mark design

[0010] Set a "field"-shaped alignment mark network equal to the number of alignment holes on the printing screen, and the "field"-shaped alignment mark network is set corresponding to the alignment holes one by one.

[0011] S3. Screen deformation judgment and deformation amount calculation

[0012] Judge the deformation of the screen according to the position of the alignment holes on the green ceramic chip in the corresponding "field"-shaped alignment mark network, and calculate the deformation amount of the screen according to the detailed position of the alignment holes on the green ceramic chip in the corresponding "field"-shaped alignment mark network.

[0013] According to a preferred embodiment of the present invention, in the step S1, the design of the alignment holes of the to-be-printed green ceramic chip includes:

[0014] S11. Take the center point of the green ceramic chip as a reference point, draw a straight line on the green ceramic chip along the X direction and the Y direction respectively, divide the green ceramic chip into four regions, the region above and to the right of the reference point is SZone 1, the region below and to the right of the reference point is SZone 2, the region below and to the left of the reference point is SZone 3, and the region above and to the left of the reference point is SZone 4.

[0015] S12. Set a circular hole as an alignment hole in each region; a total of 4 circular holes are set on the green ceramic chip as alignment holes, the diameters of the four alignment holes are the same, and the four alignment holes are arranged at the four end corners of the green ceramic chip.

[0016] According to a preferred embodiment of the present invention, in the step S2, the design of the alignment marks on the printing screen includes:

[0017] Set four "field"-shaped alignment mark networks on the printing screen corresponding to the alignment holes on the green ceramic chip one by one; take the center point of the printing screen as a reference point, starting from the reference point, divide the overall printing area of the screen into four regions through the four "field"-shaped alignment mark networks: the region above and to the right of the reference point is WZone 1, the region below and to the right of the reference point is WZone 2, the region below and to the left of the reference point is WZone 3, and the region above and to the left of the reference point is WZone 4; the four regions WZone 1 to WZone 4 correspond to the four regions SZone 1 to SZone 4 of the green ceramic chip.

[0018] According to a preferred embodiment of the present invention, in the step S2, the "field"-shaped alignment mark network is a "field"-shaped network structure composed of three horizontal lines arranged along the X direction and three vertical lines arranged along the Y direction.

[0019] Preferably according to the present invention, in the step S2, the line width of the horizontal line, the line width of the vertical line, the spacing between adjacent horizontal lines, and the spacing between adjacent vertical lines are all equal to the aperture of the alignment hole; the three horizontal lines and the three vertical lines together form 9 intersection points and 25 subdivision positions.

[0020] Preferably according to the present invention, in the step S3, the stencil deformation judgment and deformation amount calculation include:

[0021] S31. During the printing process, taking the center point of the green ceramic chip as the reference point, and judging the deformation situation of the stencil according to the relative positions of the alignment holes on the green ceramic chip and the corresponding "field"-shaped alignment mark network.

[0022] S311. If the alignment hole of the green ceramic chip is located at the center of the corresponding "field"-shaped alignment mark network, it is determined that the stencil has not deformed in the area of the green ceramic chip where the alignment hole of the green ceramic chip is located.

[0023] S312. If the alignment hole of the green ceramic chip is located within the two mutually perpendicular cross regions in the middle of the corresponding "field"-shaped alignment mark network, it is determined that the stencil has only deformed in the horizontal or vertical direction within the area of the green ceramic chip where the alignment hole of the green ceramic chip is located.

[0024] S3121. Taking the center of the green ceramic chip as the reference point, if the alignment hole of the green ceramic chip is within the cross region far from the center of the green ceramic chip, it is determined that the stencil has shrunk.

[0025] S3122. Taking the center of the green ceramic chip as the reference point, if the alignment hole of the green ceramic chip is within the cross region close to the center of the green ceramic chip, it is determined that the stencil has elongated.

[0026] S313. If the alignment hole of the green ceramic chip is located outside the two mutually perpendicular cross regions in the middle of the corresponding "field"-shaped alignment mark network, the stencil has deformed in both the horizontal and vertical directions within the area of the green ceramic chip where the alignment hole of the green ceramic chip is located.

[0027] S32. According to the position of the alignment hole on the green ceramic chip in the corresponding "field"-shaped alignment mark network, determine the subdivision position of the alignment hole on the green ceramic chip in the corresponding "field"-shaped alignment mark network, and determine the magnitude of the deformation amount according to the subdivision position where the alignment hole is located.

[0028] Compared with the prior art, the advantages of the present invention are:

[0029] (1) By adding a special light painting design before plate making, a corresponding "field" - shaped alignment mark network pattern is made on the screen printing plate. At the same time, round holes are punched at the corresponding positions of the green ceramic chips to be printed as alignment holes. By obtaining the detailed positions of the alignment holes in the "field" - shaped alignment mark network, the deformation situation of the screen printing plate is judged, and the deformation amount of the screen printing plate is calculated, so as to realize the real - time monitoring of the deformation of the screen printing plate during the printing process. Through this invention, the repeated measurement steps of the screen printing plate are omitted, the waste caused by continuously measuring the screen printing plate during the slurry collection process is reduced, and at the same time, the scrapping of the green ceramic chips to be printed caused by the failure to detect the deformation of the screen printing plate in time is avoided.

[0030] (2) In the current production of printing processes, there has been no fast and efficient measurement method for the continuous deformation of the screen printing plate. Usually, after a specified number of printings, the screen printing plate is cleaned and then its deformation amount is tested on a measuring device to prevent the printing alignment deviation caused by the deformation of the screen printing plate. Through the corresponding design of the aperture diameter and line width of the alignment hole and the screen printing plate alignment mark, as well as the special "field" - shaped alignment design of the screen printing plate in this invention, during the printing process, by observing the specific position of the alignment hole in the alignment mark, the specific deformation situation of the screen printing plate can be monitored in real - time. For example, whether the screen printing plate shrinks or elongates, and the range of the shrinkage amount and elongation amount can be obtained, without the need to unload and clean the screen printing plate for measurement. The production efficiency is greatly improved, and at the same time, the loss of alignment deviation caused by the failure to detect the deformation of the screen printing plate in time is reduced.

[0031] (3) In the existing technical means, the use of the alignment hole and the screen printing plate alignment mark is only for the alignment recognition of the green ceramic chip and the screen printing plate during the printing process, and there are no special requirements and designs for the shape and size of the alignment hole and the alignment mark. In this invention, special designs are made for the shape, quantity, position distribution, and size of the alignment hole. At the same time, the shape of the alignment mark adopts a unique "field" - shaped design, the alignment mark line width design with the same diameter as the alignment hole, and the design of 25 alignment areas with equal areas in the "field". According to the position of the alignment, the deformation amount of the screen printing plate can be intuitively obtained, playing a role in real - time monitoring of the deformation amount of the screen printing plate during the printing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a flow chart of the method for real - time monitoring of the deformation amount of the screen printing plate during the LTCC green ceramic chip printing process according to the present invention;

[0033] Figure 2 is a schematic diagram of the design of the alignment hole of the green ceramic chip according to the present invention;

[0034] Figure 3 is a schematic diagram of the design of the alignment mark of the printing screen printing plate according to the present invention;

[0035] Figure 4 is a schematic diagram of the alignment hole located at the center of the "field" - shaped alignment mark network according to the present invention;

[0036] Figure 5 Schematic diagram of the cross position of the alignment holes in the present invention on the side away from the center of the green ceramic chip;

[0037] Figure 6 Schematic diagram of the cross position of the alignment holes in the present invention on the side close to the center of the green ceramic chip;

[0038] Figure 7 Schematic diagram when the alignment holes in the present invention are outside the cross position and within the perimeter of the "field" - shaped alignment mark network;

[0039] Figure 8 Schematic diagram when the alignment holes in the present invention are around the perimeter of the "field" - shaped alignment mark network outside the cross position. Detailed implementation manners

[0040] The following further describes the present invention with reference to the accompanying drawings:

[0041] As Figure 1 Shown is a method for real - time monitoring of the deformation amount of a stencil during the printing process of an LTCC green ceramic chip. This method mainly realizes the real - time monitoring of the stencil deformation amount through the following three aspects: the design of alignment marks on the待印刷生瓷片 is replaced with "green ceramic chip to be printed", the design of alignment marks on the printing stencil, and the calculation of the stencil deformation amount.

[0042] S1. Design of alignment holes on the green ceramic chip to be printed: Taking the center point of the green ceramic chip as a reference point, starting from the reference point, draw a straight line along the X - direction and the Y - direction respectively on the green ceramic chip, dividing the green ceramic chip into four regions. Set a circular hole as an alignment hole in each region. The diameter of the circular alignment hole is equal to the line width of the stencil alignment mark, and the specific deformation amount of the stencil can be determined by their relative positions.

[0043] To more accurately and comprehensively reflect the local deformation area of the stencil, taking the center point of the green ceramic chip as a reference point, starting from the reference point, divide the entire area of the green ceramic chip to be printed into 4 equal rectangular regions. The region above and to the right of the reference point is SZone 1, the region below and to the right of the reference point is SZone 2, the region below and to the left of the reference point is SZone 3, and the region above and to the left of the reference point is SZone 4. To ensure accuracy, this step may require the use of precision measuring tools to ensure that the lines are straight and the division is uniform.

[0044] In each region, use a mechanical punching machine to punch out 1 circular hole as an alignment hole for alignment identification marks during printing. A total of 4 circular holes are set on the green ceramic chip as alignment holes. The diameters of the four alignment holes are the same, and the four alignment holes are set at the four corner ends of the green ceramic chip.

[0045] The green ceramic chips are divided into four regions (SZone 1 to SZone 4), mainly to more meticulously monitor and compensate for possible position offsets or screen deformations that may occur during the printing process. The alignment holes in different regions can help with more precise positioning, ensuring that the printed pattern is accurately positioned on the ceramic chip. This is particularly important for multi-color or multi-layer printing processes that require high-precision alignment. The diameters of all alignment holes are kept consistent, which helps to unify the identification standard and reduce identification errors caused by aperture differences. The size of the alignment holes should be appropriate, being able to be clearly identified without affecting the overall structure of the ceramic chip or subsequent processing. Using a mechanical drilling machine for punching ensures the precision and consistency of the holes and is an important step in ensuring printing quality. Appropriate punching parameters (such as punching force, drill bit material, etc.) are selected to avoid damaging the ceramic chip or generating cracks. By dividing the green ceramic chip into different regions and setting an alignment hole in each region, potential problems with the screen can be detected in a timely manner, enabling refined management.

[0046] S2. Design of the printing screen alignment marks: Taking the center point of the printing screen as the reference point, a "field" - shaped alignment mark network corresponding one - to - one with the alignment holes on the green ceramic chip is set on the printing screen; the "field" - shaped alignment mark network is a "field" - shaped network structure composed of three horizontal lines arranged along the X - direction and three vertical lines arranged along the Y - direction. The three horizontal lines and the three vertical lines together form 9 intersection points and 25 subdivision positions; the line width of the horizontal lines, the line width of the vertical lines, the spacing between adjacent horizontal lines, and the spacing between adjacent vertical lines are all equal to the aperture of the alignment holes. The screen alignment marks adopt a unique "field" - shaped grid design, which can evenly divide the alignment mark area into 25 regions with equal areas, facilitating visually obtaining the screen deformation situation and the specific deformation amount after printing.

[0047] During the printing process, the deformation of the stencil is divided into the horizontal direction (X) and the vertical direction (Y). In order to simultaneously reflect the deformation of the stencil in both directions and the magnitude of the deformation, the stencil alignment marks are designed as a "field" - shaped network structure composed of 3 horizontal lines and 3 vertical lines. Among them, the 3 horizontal lines are parallel to each other, the 3 vertical lines are parallel to each other, the horizontal lines and the vertical lines are perpendicular to each other, and the line widths and line spacings of the horizontal lines and the vertical lines are the same and equal to the diameter of the alignment holes on the green ceramic wafer to be printed. Thus, the alignment marks can be divided into 25 positions. At the positions corresponding to the 4 alignment holes on the green ceramic wafer on the printing stencil, 4 such alignment marks are designed respectively. The center of the "field" - shaped network corresponds to the center of the alignment hole of the green ceramic wafer to be printed. Taking the center point as the reference point, starting from the reference point, the overall printing area of the stencil is divided into four regions: the region on the upper - right side of the reference point is WZone 1, the region on the lower - right side of the reference point is WZone 2, the region on the lower - left side of the reference point is WZone3, and the region on the upper - left side of the reference point is WZone4. To ensure accuracy, this step may require the use of precision measuring tools to ensure that the lines are straight and the division is uniform. The four regions WZone 1 - WZone 4 correspond to the four regions SZone 1 - SZone4 of the green ceramic wafer.

[0048] By designing a "field" - shaped grid - like alignment mark on the printing stencil, a rich number of reference points can be provided for accurately tracking and evaluating any minor displacement or deformation of the stencil in the X - direction and the Y - direction. The line widths and spacings of the horizontal and vertical lines are both set to be equal to the diameter of the alignment holes, facilitating quick and accurate alignment adjustment during the printing process. This design can not only help in real - time monitoring and correcting the deformation in the X - and Y - axis directions, but also enhance the flexibility and accuracy of alignment through the refined 25 alignment points.

[0049] S3. Judgment of stencil deformation and calculation of deformation magnitude: During the printing process, taking the center point of the green ceramic wafer as the reference point, according to the relative position between the alignment holes on the green ceramic wafer and the "field" - shaped alignment mark network, judge the deformation situation of the stencil, and determine the deformation magnitude of the stencil according to the offset distance between the alignment holes on the green ceramic wafer and the center point of the "field" - shaped alignment mark network.

[0050] S31. During the printing process, taking the center point of the green ceramic wafer as the reference point, judge the deformation situation of the stencil according to the relative position between the alignment holes on the green ceramic wafer and the corresponding "field" - shaped alignment mark network:

[0051] S311. If the alignment hole on the green ceramic wafer is located at the center of the corresponding "field" - shaped alignment mark network, it is determined that the stencil has not deformed in the area of the green ceramic wafer where the alignment hole on the green ceramic wafer is located.

[0052] S312. If the alignment holes of the green ceramic chip are located within the two mutually perpendicular cross regions in the middle of the corresponding "field" - shaped alignment mark network, it is determined that the stencil has only undergone deformation in the horizontal or vertical direction within the region of the green ceramic chip where the alignment holes of the green ceramic chip are located.

[0053] S3121. Taking the center of the green ceramic chip as the reference point, if the alignment holes of the green ceramic chip are within the cross region on the side far from the center of the green ceramic chip, it is determined that the stencil has shrunk.

[0054] S3122. Taking the center of the green ceramic chip as the reference point, if the alignment holes of the green ceramic chip are within the cross region on the side close to the center of the green ceramic chip, it is determined that the stencil has elongated.

[0055] S313. If the alignment holes of the green ceramic chip are located outside the two mutually perpendicular cross regions in the middle of the corresponding "field" - shaped alignment mark network, the stencil has undergone deformation in both the horizontal and vertical directions within the region of the green ceramic chip where the alignment holes of the green ceramic chip are located.

[0056] S32. According to the offset distance between the center of the alignment holes on the green ceramic chip and the center point of the corresponding "field" - shaped alignment mark network, the deformation amount of the stencil is determined. The farther the center of the alignment holes of the green ceramic chip deviates from the center of the "field" - shaped alignment mark network, the greater the deformation amount of the stencil. The specific value can be directly determined by the specific region where the alignment holes of the green ceramic chip are located in the "field" - shaped alignment mark.

[0057] The following combines specific implementation cases to describe in detail a method for real - time monitoring of the deformation amount of the stencil during the printing process of LTCC green ceramic chips provided by the present invention to solve the problems in the above - mentioned background technology. This method includes the design of alignment holes on the green ceramic chip, the design of alignment marks on the printing stencil, and the design of calculating the deformation amount of the stencil, and can perform real - time monitoring of the deformation of the stencil during the batch printing process of LTCC green ceramic chips.

[0058] S1. Design of alignment holes on the green ceramic chip

[0059] Select a 6 - inch green ceramic chip with a size of 152×152 mm. Since the deformation of the stencil during the printing process is not all uniformly deformed as a whole, and there will also be deformation in individual local areas, a mechanical punching machine is used to punch alignment holes with a diameter of 0.1 mm at the four corners of the green ceramic chip, a total of 4. Among them, in order to avoid the printing pattern of the stencil and increase the usable area of the stencil, the distance from each hole to the edge of the green ceramic chip is 10 mm. The green ceramic chip is divided into four regions, SZone 1 (upper right), SZone 2 (lower right), SZone 3 (lower left), and SZone 4 (upper left) according to the position of the alignment holes. When local area deformation of the stencil occurs, it can be accurately positioned by region, as Figure 2 shown.

[0060] S2. Design of Alignment Marks on the Printing Screen

[0061] Select a stainless steel screen with a mesh count of 325 and a wire diameter of 23 μm, and expose 4 groups of alignment marks at the positions corresponding to the four alignment mark holes on the green ceramic chip. Since there are several deformation situations of the screen during the printing process: only horizontal (X) deformation occurs, only vertical (Y) deformation occurs, and both horizontal and vertical deformations occur simultaneously. In order to simultaneously reflect the deformations of the screen in two directions and the magnitude of the deformation, the alignment marks on the screen of the present invention are designed as a "field" - shaped network structure composed of 3 horizontal lines and 3 vertical lines, as Figure 3 shown, where the shaded area is the alignment mark pattern on the screen, and this shaded area is the alignment area where the paste is printed onto the surface of the green ceramic chip during the printing process.

[0062] Among the above - mentioned alignment marks, the 3 horizontal lines are parallel to each other, the 3 vertical lines are parallel to each other, the horizontal lines and the vertical lines are perpendicular to each other, and the line widths and line spacings of the horizontal lines and the vertical lines are the same, and are equal to the diameter of the alignment hole on the green ceramic chip to be printed, which is 0.1 mm. Thus, the alignment marks can be divided into 25 positions, and the center of the "field" - shaped network corresponds to the center of the alignment hole on the green ceramic chip to be printed.

[0063] S3. Judgment of Screen Deformation and Calculation of Deformation Amount

[0064] During the printing process, taking the center point of the green ceramic chip as a reference point, according to the relative positions of the alignment holes on the green ceramic chip and the corresponding "field" - shaped alignment mark network, judge the deformation situation of the screen; according to the positions of the alignment holes on the green ceramic chip in the corresponding "field" - shaped alignment mark network, determine the detailed positions of the alignment holes on the green ceramic chip in the corresponding "field" - shaped alignment mark network, and determine the magnitude of the deformation amount according to the detailed positions where the alignment holes are located.

[0065] When the alignment hole on the green ceramic chip is exactly located at the center of the "field" - shaped alignment mark network on the screen, it indicates that there is no obvious deformation of the screen in this local area and it maintains an ideal flat state. If the alignment hole deviates from the center of the "field" - shaped alignment mark network but still falls within the "field" - shaped alignment mark network, especially within the cross - shaped area formed by the two perpendicular lines, it indicates that there is a single - direction deformation of the screen in this area. Further, according to the direction of the alignment hole deviating from the center (towards or away from the center of the green ceramic chip), it can be distinguished whether it is a horizontal or vertical deformation, and whether it is elongation or contraction. The side closer to the center indicates elongation, and the side farther from the center indicates contraction. If the alignment hole deviates to the external area of the "field" - shaped alignment mark network, that is, not within any cross - shaped area formed by the two vertical lines, it indicates that the screen has suffered deformations in both horizontal and vertical directions in this local area.

[0066] The deviation distance between the alignment hole of the green ceramic chip and the center of the "field" - shaped alignment mark network directly reflects the degree of screen plate deformation. The farther the deviation, the greater the deformation amount. According to the specific position of the alignment hole in different "field" - shaped grids, the specific value or range of deformation can be estimated.

[0067] During the printing process, let δ represent the shrinkage or elongation value. Take the WZone 1 area as an example.

[0068] (1) When the alignment hole of the green ceramic chip happens to be at the center of the "field" - shaped alignment mark network, that is, at position 13, it means that the screen plate has not deformed in the WZone 1 area of this green ceramic chip, as Figure 4 shown.

[0069] (2) When the alignment hole of the green ceramic chip is within the two mutually perpendicular cross positions in the middle of the corresponding "field" - shaped alignment mark network, as Figure 5 shown, it means that the screen plate has only deformed in the horizontal or vertical direction in the WZone 1 area of this green ceramic chip.

[0070] Furthermore, taking the center of the green ceramic chip as a reference point, when the alignment hole is within the cross position on the side far from the center of the green ceramic chip, as Figure 5 shown, it means that the screen plate has shrunk. The size of the shrinkage range can be judged according to the specific position of the alignment hole among the 25 positions. When it is between positions 13 and 14, the screen plate in the WZone 1 area shrinks in the horizontal direction, and the shrinkage range is δ ≤ 100μm. When it is between positions 14 and 15, the shrinkage range is 100μm ≤ δ ≤ 200μm. When it is between positions 13 and 8, the screen plate in the WZone 1 area shrinks in the vertical (Y) direction, and the shrinkage range is δ ≤ 100μm; when it is between positions 8 and 3, the shrinkage range is 100μm ≤ δ ≤ 200μm.

[0071] When the alignment hole is within the cross position on the side close to the center of the green ceramic chip, as Figure 6 shown, it means that the screen plate in the WZone 1 has elongated; when it is between positions 13 and 12, the screen plate elongates in the horizontal direction, and the elongation range is δ ≤ 100μm; when it is between positions 12 and 11, the elongation range is 100μm ≤ δ ≤ 200μm; when it is between positions 13 and 18, the screen plate in the WZone 1 area elongates in the vertical (Y) direction, and the shrinkage range is δ ≤ 100μm; when it is between positions 18 and 23, the elongation range is 100μm ≤ δ ≤ 200μm.

[0072] When the alignment holes of the green ceramic chips are located outside the two mutually perpendicular cross positions in the middle of the "field" - shaped alignment mark network, it represents that the stencil has deformed in both the horizontal and vertical directions within the WZone 1 area; when in position 9, the WZone 1 area of the stencil has shrunk in both the horizontal and vertical directions, and the shrinkage value is δ = 100 μm; when in position 17, the WZone 1 area of the stencil has elongated in both the horizontal and vertical directions, and the elongation value is δ = 100 μm; when in position 7, the WZone 1 area of the stencil has elongated in the horizontal direction and shrunk in the vertical direction, and both the shrinkage value and the elongation value are δ = 100 μm; when in position 19, the WZone 1 area of the stencil has shrunk in the horizontal direction and elongated in the vertical direction, and both the shrinkage value and the elongation value are δ = 100 μm, as Figure 7 shown.

[0073] When in positions 4, 5, and 10, the WZone 1 area of the stencil has shrunk in both the horizontal and vertical directions, and the shrinkage range is 100 μm ≤ δ ≤ 200 μm; when in positions 16, 21, and 22, the WZone 1 area of the stencil has elongated in both the horizontal and vertical directions, and the elongation range is 100 μm ≤ δ ≤ 200 μm; when in positions 1, 2, and 6, the WZone 1 area of the stencil has elongated in the horizontal direction and shrunk in the vertical direction, and both the elongation and shrinkage ranges are 100 μm ≤ δ ≤ 200 μm; when in positions 20, 24, and 25, the WZone 1 area of the stencil has shrunk in the horizontal direction and elongated in the vertical direction, and both the elongation and shrinkage ranges are 100 μm ≤ δ ≤ 200 μm, as Figure 8 shown.

[0074] The above - described embodiments are only descriptions of the preferred embodiments of the present invention, and do not limit the scope of the present invention. Without departing from the design spirit of the present invention, various deformations and improvements made by those of ordinary skill in the art to the technical solutions of the present invention shall fall within the protection scope determined by the claims of the present invention.

Claims

1. A method for real-time monitoring of screen deformation during LTCC green ceramic tile printing, characterized in that, The method includes the following steps: S1. Design of alignment holes for the green ceramic chips to be printed The green ceramic chip is divided into 4 regions with equal areas. A circular hole is set as an alignment hole in each region, and the 4 alignment holes are symmetrically distributed about the center line of the green ceramic chip in pairs. S2. Design of alignment marks on the printing screen On the printing screen, a "field" - shaped alignment mark network equal in number to the alignment holes is set, and the "field" - shaped alignment mark network is set corresponding to the alignment holes one by one. S3. Judgment of screen deformation and calculation of deformation amount According to the positions of the alignment holes on the green ceramic chip in the corresponding "field" - shaped alignment mark network, judge the deformation situation of the screen and calculate the screen deformation amount. In step S3, the judgment of screen deformation and calculation of deformation amount include: S31. During the printing process, taking the center point of the green ceramic chip as a reference point, judge the deformation situation of the screen according to the relative positions of the alignment holes on the green ceramic chip and the corresponding "field" - shaped alignment mark network. S311. If the alignment hole of the green ceramic chip is located at the center of the corresponding "field" - shaped alignment mark network, it is determined that the screen has not deformed in the region of the green ceramic chip where the alignment hole of the green ceramic chip is located. S312. If the alignment hole of the green ceramic chip is located within the two mutually perpendicular cross regions in the middle of the corresponding "field" - shaped alignment mark network, it is determined that the screen has only deformed in the horizontal or vertical direction in the region of the green ceramic chip where the alignment hole of the green ceramic chip is located. S3121. Taking the center of the green ceramic chip as a reference point, if the alignment hole of the green ceramic chip is within the cross region far from the center of the green ceramic chip, it is determined that the screen has shrunk. S3122. Taking the center of the green ceramic chip as a reference point, if the alignment hole of the green ceramic chip is within the cross region close to the center of the green ceramic chip, it is determined that the screen has elongated. S313. If the alignment hole of the green ceramic chip is located outside the two mutually perpendicular cross regions in the middle of the corresponding "field" - shaped alignment mark network, the screen has deformed simultaneously in the horizontal and vertical directions in the region of the green ceramic chip where the alignment hole of the green ceramic chip is located. S32. According to the positions of the alignment holes on the green ceramic chip in the corresponding "field" - shaped alignment mark network, determine the detailed positions of the alignment holes on the green ceramic chip in the corresponding "field" - shaped alignment mark network, and determine the magnitude of the deformation amount according to the detailed positions where the alignment holes are located.

2. The method for real - time monitoring of the deformation amount of the screen during the printing process of LTCC green ceramic chips according to claim 1, wherein In step S1, the design of alignment holes for the green ceramic chips to be printed includes: S11. Taking the center point of the green ceramic chip as a reference point, draw a straight line on the green ceramic chip along the X - direction and the Y - direction respectively, dividing the green ceramic chip into four regions. The region above and to the right of the reference point is SZone 1, the region below and to the right of the reference point is SZone2, the region below and to the left of the reference point is SZone 3, and the region above and to the left of the reference point is SZone 4. S12. Set a circular hole as an alignment hole in each region; a total of 4 circular holes are set as alignment holes on the green ceramic chip, the diameters of the four alignment holes are the same, and the four alignment holes are set at the four corner positions of the green ceramic chip.

3. The real-time monitoring method for the screen plate deformation amount during the LTCC green ceramic chip printing process according to claim 2, wherein in the step S2, the design of the printing screen plate alignment marks includes: arranging a "field" - shaped alignment mark network on the printing screen plate corresponding one - to - one to the alignment holes on the green ceramic chip; taking the center point of the printing screen plate as a reference point, starting from the reference point, dividing the overall printing area of the screen plate into four regions through the four "field" - shaped alignment mark networks: the region above and to the right of the reference point is WZone 1, the region below and to the right of the reference point is WZone 2, the region below and to the left of the reference point is WZone 3, and the region above and to the left of the reference point is WZone 4; the four regions WZone 1 - WZone 4 correspond to the four regions SZone 1 - SZone 4 of the green ceramic chip.

4. The real-time monitoring method for the screen plate deformation amount during the LTCC green ceramic chip printing process according to claim 3, wherein in the step S2, the "field" - shaped alignment mark network is a "field" - shaped network structure composed of three horizontal lines arranged along the X - direction and three vertical lines arranged along the Y - direction.

5. The real-time monitoring method for the screen plate deformation amount during the LTCC green ceramic chip printing process according to claim 4, wherein in the step S2, the line width of the horizontal lines, the line width of the vertical lines, the spacing between adjacent horizontal lines, and the spacing between adjacent vertical lines are all equal to the aperture of the alignment holes; the three horizontal lines and the three vertical lines together form 9 intersection points and 25 subdivision positions.

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