An inorganic material encapsulated MIP structure and preparation method

Abstract

The present invention relates to the field of new LED display technology, and discloses an inorganic material encapsulation MIP structure and a preparation method, comprising a base, a connecting plate fixedly connected to the base, an L-shaped rail provided on the connecting plate, a lifting bar slidably connected to one side of the connecting plate, a slider slidably connected to the lifting bar, a deflection rod rotatably connected to one end of the lifting bar, a lower clamp connected to one end of the deflection rod, the connecting plate is connected to a telescopic cylinder through a cylinder hoop, the telescopic end of the telescopic cylinder is connected to a propulsion frame, and a transmission member for driving one end of the slider is connected to the propulsion frame. The present invention adopts a lower clamp to complete the clamping of the substrate, so that before packaging, the packaging surface of the substrate faces downward to prevent dust and other impurities from falling on the substrate, and at the same time, the downward structure is adopted to facilitate the detection of the adhesion degree of the colloid, thereby improving the subsequent docking efficiency between the substrate and the carrier.

Description

Technical Field

[0001] The invention relates to the technical field of LED novel display, and in particular to an inorganic material encapsulated MIP structure and a preparation method thereof. Background Art

[0002] MIP is an emerging technology in new LED display applications. The commonly used process is to use organic adhesive materials to stick MicroLED chips on glass substrates or sapphire substrates, and then form a MIP package through semiconductor metal interconnection technology as a pixel of the display screen.

[0003] However, the current packaging MIP preparation method and structure have problems: the organic glue has poor adhesion to the metal interconnection above, and the thermal expansion coefficients are different, so they are easy to separate and cause the metal to fall off. In addition, during the packaging process with organic glue, the substrate structure is facing upward, and the glue is easy to adhere to the free-falling dust, so that the bonded circuits are contaminated by impurities, affecting the packaging quality. In addition, the dust will also interfere with the subsequent cleaning of the glue, which hinders the cleaning of the glue on the board surface and interferes with the normal packaging operation of the MIP.

[0004] Based on this, an inorganic material encapsulated MIP structure and a preparation method are proposed. Summary of the invention

[0005] The purpose of the present invention is to solve the above problems and to propose an inorganic material encapsulated MIP structure and a preparation method.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] The cam is provided with an L-shaped rail, one side of the connecting plate is slidably connected with a lifting strip, the lifting strip is slidably connected with a sliding block, one end of the lifting strip is rotatably connected with a deflection rod, and one end of the deflection rod is connected with a lower clamping hand. The connecting plate is connected with a telescopic cylinder through a cylinder hoop, and the telescopic end of the telescopic cylinder is connected with a propulsion frame, and the propulsion frame is connected with a transmission member for driving one end of the slider. The connecting plate is connected with a button and a fixed plate, the fixed plate is slidably connected with a sliding clamp 1, and the sliding clamp 1 is connected with an upper clamping hand. The fixed plate is connected with a cover plate and a cylinder frame, the cylinder frame is connected with a separation cylinder, the separation cylinder is connected with a separation push frame, and the upper clamping hand is connected with an inclined block and a reset spring, and a flipping mechanism is provided on one side of the connecting plate to drive the lower clamping hand to flip and dock with the upper clamping hand, so that the substrate and the carrier plate are accurately bonded after coating with glue.

[0008] Preferably, a slide rail is fixedly connected to the connecting plate, a second slide clamp is slidably connected to the slide rail, and the second slide clamp is fixedly connected to the lifting bar.

[0009] Preferably, a groove is provided on the lifting bar, and one end of the sliding block is slidably connected in the groove on the lifting bar.

[0010] Preferably, a baffle and a clamping strip are fixedly connected inside the lower clamping hand and the upper clamping hand, and the baffle is arranged between the clamping strips.

[0011] Preferably, the transmission member comprises a traction bar, one end of which is rotatably connected to a slide bar, one end of which is connected to a sleeve, and the sleeve is sleeved on the slide bar.

[0012] Preferably, the upper end of the upper clamp is connected to a limit rod, the limit rod is connected through the cover plate, the upper end of the return spring is connected to the cover plate, and the return spring is sleeved on the limit rod.

[0013] Preferably, the flipping mechanism includes a translation frame, one side of the translation frame is connected to an insertion strip, the insertion strip is slidably connected to the connecting plate through an inner sliding groove, a convex groove is opened on the translation frame, a limiting column is connected to the translation frame, and one end of the deflection rod is connected to a deflection clamp.

[0014] A method for preparing an inorganic material encapsulated MIP comprises the following steps:

[0015] S1. Prepare a low melting point metal on a carrier by electron beam evaporation or sputtering, and prepare a metal interconnect electrode and a metal PAD of the MIP package by photolithography, corrosion or etching;

[0016] S2. Place the substrate on the lower gripper, apply UV glue on the substrate placed on the lower gripper, and arrange the MicroLED chips on the glue film of the substrate in a matrix manner;

[0017] S3, placing the carrier board on the upper clamp, aligning the metal interconnect electrodes on the carrier board with the electrodes of the MicroLED on the substrate by controlling the operation of the telescopic cylinder, and performing reflow soldering to solder the two boards together;

[0018] S4, separating the MicroLED chip from the UV adhesive film on the substrate by irradiating the back of the MicroLED substrate with UV light or other methods;

[0019] S5. Evaporate or sputter an oxide dielectric film on the substrate with the MicroLED chip to protect it, exposing the metal PAD for subsequent display mounting.

[0020] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0021] 1. The present application adopts a lower clamp to clamp the substrate, so that before packaging, the packaging surface of the substrate faces downward to prevent dust and other impurities from falling on the substrate. At the same time, the downward structure is used to facilitate the detection of the adhesion degree of the colloid, and the excess colloid will fall freely to avoid excessive interference of the colloid with the docking packaging between the substrate and the carrier, thereby improving the subsequent docking efficiency between the substrate and the carrier.

[0022] 2. This application adopts inorganic materials instead of organic glue, and the MicroIC chip is pasted on the inorganic material. There is no thermal mismatch problem and the bonding reliability is good. The MicroIC chip is separated from the UV glue film on the substrate by irradiating the back of the MicroIC substrate with ultraviolet light, and the docking packaging process is not contaminated by dust, thereby improving the packaging quality between the boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It shows a schematic diagram of the overall structure of the package MIP structure provided according to an embodiment of the present invention;

[0024] Figure 2 It shows a schematic structural diagram of a traction strip connection provided in accordance with an embodiment of the present invention;

[0025] Figure 3 A schematic diagram of a bottom view of a packaging structure provided according to an embodiment of the present invention is shown;

[0026] Figure 4 It shows a schematic structural diagram of a sliding rod connection provided by an embodiment of the present invention;

[0027] Figure 5 A schematic diagram of the exploded structure of the deflection clamp connection provided according to an embodiment of the present invention is shown.

[0028] Legend:

[0029] 1. Base; 2. Connecting plate; 3. Cylinder hoop; 4. Telescopic cylinder; 5. Push frame; 6. L-shaped rail; 7. Button; 8. Slide rail; 9. Lifting strip; 10. Sliding block; 11. Sleeve; 12. Inner slide groove; 13. Insert strip; 14. Translation frame; 15. Lower clamp; 16. Fixed plate; 17. Cover plate; 18. Upper clamp; 19. Limit rod; 20. Oblique block; 21. Separation cylinder; 22. Pulling strip; 23. Slide rod; 24. Sliding clamp 1; 25. Deflection clamp; 26. Limit column; 27. Cylinder frame; 28. Clamp strip; 29. ​​Block; 30. Sliding clamp 2; 31. Convex groove; 32. Deflection rod; 33. Separation push frame; 34. Reset spring. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] See also Figure 1-5 , the present invention provides a technical solution:

[0032] An inorganic material encapsulation MIP structure comprises a base 1, a connecting plate 2 is fixedly connected to the base 1, the stability of the connecting plate 2 structure is improved by setting the base 1, an L-shaped rail 6 is provided on the connecting plate 2, the L-shaped rail 6 is inverted, a lifting bar 9 is slidably connected to one side of the connecting plate 2, a slider 10 is slidably connected to the lifting bar 9, a deflection rod 32 is rotatably connected to one end of the lifting bar 9, a lower clamping hand 15 is connected to one end of the deflection rod 32, in an initial state, the lower clamping hand 15 is vertically downward, the connecting plate 2 is connected to a telescopic cylinder 4 through a cylinder hoop 3, the firmness of the connection of the telescopic cylinder 4 is ensured by setting the cylinder hoop 3 structure, a propulsion frame 5 is connected to the telescopic end of the telescopic cylinder 4, the propulsion frame 5 is slidably clamped on the connecting plate 2, a transmission member for driving one end of the slider 10 is connected to the propulsion frame 5, a button 7 and a fixed plate 16 are connected to the connecting plate 2, and the button 7 structure is arranged on the L-shaped rail 6 structure At one end, a sliding clamp 24 is slidably connected to the fixed plate 16, and the sliding clamp 24 is clamped on both sides of the fixed plate 16. An upper clamp 18 is connected to the sliding clamp 24. A cover plate 17 and a cylinder frame 27 are connected to the fixed plate 16. The cover plate 17 is arranged just above the upper clamp 18. A separation cylinder 21 is connected to the cylinder frame 27. A separation push frame 33 is connected to the telescopic end of the separation cylinder 21. A through groove is opened on the fixed plate 16 to facilitate the separation push frame 33 to pass through the groove, so as to push the substrate and the carrier plate arranged on one side, forcing the packaged plate to move to the transport structure. An inclined block 20 and a reset spring 34 are connected to the upper clamp 18. The inclined surface of the inclined block 20 is inclined upward, and the inclined surface is arranged on the side facing the connecting plate 2. One side of the connecting plate 2 is provided with a flipping mechanism for driving the lower clamp 15 to flip and dock with the upper clamp 18, so that the substrate and the carrier plate are accurately bonded after being coated with glue.

[0033] Specifically, Figure 1 and Figure 5 As shown, a slide rail 8 is fixedly connected to the connecting plate 2, a slide clamp 2 30 is slidably connected to the slide rail 8, and the slide clamp 2 30 is fixedly connected to the lifting bar 9. The slide rail 8 structure is provided to improve the stability of the lifting bar 9 structure when it is lifted up and down, wherein the slide clamp 2 30 and the slide rail 8 are slidably matched, and the structures cannot be separated from each other, thereby ensuring the stability of the connection.

[0034] Specifically, Figure 1 As shown, a groove is provided on the lifting bar 9, and one end of the slider 10 is slidably connected in the groove on the lifting bar 9. One end of the slider 10 is slidably matched with the structure of the lifting bar 9, thereby improving the stability of the slider 10 sliding on the lifting bar 9.

[0035] Specifically, Figure 3 As shown, a baffle 29 and a clamping strip 28 are fixedly connected inside the lower clamp 15 and the upper clamp 18. The baffle 29 is arranged between the clamping strips 28. Two clamping strips 28 are arranged on the left and right sides of the lower clamp 15 and the upper clamp 18. The two clamping strips 28 are used to clamp the plate. The plate is slidably embedded between the clamping strips 28, and the lower clamp 15 and the upper clamp 18 are used to clamp the plate on the left and right sides to ensure the firmness of the connection structure. When the plate is embedded in the lower clamp 15 and the upper clamp 18, the plate contacts the baffle 29 and stops moving. The baffle 29 structure plays a positioning role.

[0036] Specifically, Figure 2 and Figure 4 As shown, the transmission member includes a traction bar 22, one end of which is rotatably connected to a slide bar 23, and one end of the slider 10 is connected to a sleeve 11, which is sleeved on the slide bar 23, and the slide bar 23 is pulled by the traction bar 22 to slide on the L-shaped rail 6.

[0037] Specifically, Figure 1 As shown, the upper end of the upper clamping hand 18 is connected to a limiting rod 19, and the limiting rod 19 is connected through the cover plate 17. The limiting rod 19 and the cover plate 17 are perpendicular to each other. The upper end of the return spring 34 is connected to the cover plate 17, and the return spring 34 is sleeved on the limiting rod 19. The setting of the limiting rod 19 improves the stability of the upper clamping hand 18 in moving up and down.

[0038] Specifically, Figure 5 As shown, the flipping mechanism includes a translation frame 14, one side of the translation frame 14 is connected to an insertion strip 13, two insertion strips 13 are arranged, the insertion strips 13 are slidably connected to the connecting plate 2 through an inner slide groove 12, and the insertion strip 13 structure is arranged to make the horizontal movement of the translation frame 14 more stable, a convex groove 31 is opened on the translation frame 14, a limiting column 26 is connected to the translation frame 14, and a deflection clamp 25 is connected to one end of the deflection rod 32, and the mutual limitation between the deflection clamp 25 and the limiting column 26 is relied on to realize the flipping of the lower clamping hand 15, wherein the deflection clamp 25 is clamped on the limiting column 26.

[0039] In summary, the inorganic material encapsulation MIP structure and preparation method provided in this embodiment, when MIP encapsulation is required, the substrate is placed on the lower clamping hand 15, and the clamping strip 28 of the lower clamping hand 15 is used to limit the substrate, and one side of the substrate needs to abut against the upper baffle 29 thereof, and then the carrier is placed on the upper clamping hand 18, and the upper baffle 29 thereof is used to complete the positioning of the carrier position;

[0040] The operator needs to apply UV glue on the lower surface of the substrate. The excess UV glue will fall under the action of gravity, so that a glue film is formed on the surface of the substrate, avoiding excessive UV glue coating on the board surface and causing no colloid pollution to the board surface, thereby improving the firmness of subsequent board surface connection, and then placing the chip on the glue film, and then controlling the telescopic cylinder 4 to operate;

[0041] When the telescopic cylinder 4 is extended, it can cooperate with the traction bar 22 to pull the slide bar 23 to slide on the L-shaped rail 6, and use the slide bar 23 to drive the slider 10 and the lifting bar 9 to rise in height. The slide bar 23 first moves vertically along the L-shaped rail 6 and then moves horizontally. When the lifting bar 9 rises in height, it drives the deflection rod 32 and the lower clamping hand 15 to rise in height. At this time, the deflection rod 32 slides in the convex groove 31 on the translation frame 14. When the deflection rod 32 contacts the protrusion of the convex groove 31, the translation frame 14 moves toward the connecting plate 2. At this time, the insertion strip 13 moves on the inner slide groove 12. At the same time, because the deflection clamp 25 is limited by the limiting column 26, the lower clamping hand 15 begins to flip until the lower clamping hand 15 drives the substrate to complete the flip, and the collected substrate is coated with UV glue.

[0042] When the slide bar 23 changes from vertical movement to horizontal movement, the lower gripper 15 stops rising in height and maintains an upward state. As the slide bar 23 continues to move, it drives the slider 10 to slide on the lifting bar 9. At this time, the slider 10 structure moves toward the button 7 structure. Since the movement of the slider 10 is completed under the premise of the extension of the telescopic cylinder 4, before the slider 10 contacts the button 7, the telescopic cylinder 4 can first drive the propulsion frame 5 to move toward the side of the fixed plate 16. An inclined surface structure is provided on one end of the propulsion frame 5 and the inclined block 20, and the two inclined surfaces are mutually opposite. They are parallel to each other, wherein one end of the push frame 5 abuts against the inclined block 20, thereby pushing the inclined block 20 down in height, at which time the carrier plate connected to the upper clamping hand 18 is forced to approach the substrate, and the reset spring 34 is in a stretched state. When the inclined block 20 moves down to the maximum distance, the lower end of the push frame 5 contacts the upper surface of the inclined block 20, rather than the inclined surface. At this time, the push frame 5 continues to move, and the inclined block 20 maintains the same height. In this state, the substrate on the lower clamping hand 15 and the carrier plate on the upper clamping hand 18 are just docked, and the colloid is used to complete the docking and packaging between the plates;

[0043] When the slider 10 moves to contact the button 7 structure, the button 7 structure is pressed. The button 7 has the function of controlling the extension of the separation cylinder 21. At this time, the extension of the separation cylinder 21 drives the separation push frame 33 to complete the pushing effect on the packaged plate, so that the plate and the upper clamp 18 and the lower clamp 15 move relative to each other until they are separated. A conveyor belt structure is set on one side so that the packaged plate can be transported. Subsequently, the plate is further welded by welding and other methods to improve the firmness of the package connection between the plates.

[0044] The above description of the embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An inorganic material encapsulated MIP structure, comprising a base (1), characterized in that: The base (1) is fixedly connected to a connecting plate (2), an L-shaped rail (6) is provided on the connecting plate (2), a lifting bar (9) is slidably connected to one side of the connecting plate (2), a slider (10) is slidably connected to the lifting bar (9), one end of the lifting bar (9) is rotatably connected to a deflection rod (32), one end of the deflection rod (32) is connected to a lower gripper (15), the connecting plate (2) is connected to a telescopic cylinder (4) via a cylinder hoop (3), the telescopic end of the telescopic cylinder (4) is connected to a propulsion frame (5), a transmission member for driving the slider (10) to move is connected to the propulsion frame (5), and a button (7) and a push button (8) are connected to the connecting plate (2). A fixed plate (16), wherein a sliding clamp (24) is slidably connected to the fixed plate (16), an upper clamp (18) is connected to the sliding clamp (24), a cover plate (17) and a cylinder frame (27) are connected to the fixed plate (16), a separation cylinder (21) is connected to the cylinder frame (27), a separation push frame (33) is connected to the telescopic end of the separation cylinder (21), an inclined block (20) and a return spring (34) are connected to the upper clamp (18), and a flipping mechanism is provided on one side of the connecting plate (2) for driving the lower clamp (15) to flip and dock with the upper clamp (18), so that the substrate and the carrier are precisely bonded after being coated with glue; The transmission member comprises a traction bar (22), one end of the traction bar (22) is rotatably connected to a slide bar (23), one end of the slider (10) is connected to a sleeve (11), and the sleeve (11) is sleeved on the slide bar (23); The flip mechanism comprises a translation frame (14), one side of the translation frame (14) is connected to an insertion strip (13), the insertion strip (13) is slidably connected to the connection plate (2) via an inner slide groove (12), a convex groove (31) is provided on the translation frame (14), a limiting column (26) is connected to the translation frame (14), and one end of the deflection rod (32) is connected to a deflection clamp (25).

2. The inorganic material encapsulation MIP structure according to claim 1, characterized in that: The connecting plate (2) is fixedly connected to a slide rail (8), the slide rail (8) is slidably connected to a second slide clamp (30), and the second slide clamp (30) is fixedly connected to the lifting bar (9).

3. The inorganic material encapsulation MIP structure according to claim 1, characterized in that: The lifting bar (9) is provided with a groove, and one end of the sliding block (10) is slidably connected in the groove on the lifting bar (9).

4. The inorganic material encapsulation MIP structure according to claim 1, characterized in that: The lower clamping hand (15) and the upper clamping hand (18) are both fixedly connected with a baffle (29) and a clamping strip (28), and the baffle (29) is arranged between the clamping strips (28).

5. The inorganic material encapsulation MIP structure according to claim 1, characterized in that: The upper end of the upper gripper (18) is connected to a limit rod (19), the limit rod (19) penetrates and is connected to the cover plate (17), the upper end of the return spring (34) is connected to the cover plate (17), and the return spring (34) is sleeved on the limit rod (19).

6. A method for preparing an inorganic material encapsulated MIP, using an inorganic material encapsulated MIP structure according to claim 1, characterized in that: The following steps are involved: S1. Prepare a low melting point metal on a carrier by electron beam evaporation or sputtering, and prepare a metal interconnect electrode and a metal PAD of the MIP package by photolithography, corrosion or etching; S2, placing the substrate on the lower clamp (15), coating the substrate placed on the lower clamp (15) with ultraviolet glue, and arranging the MicroLED chips on the adhesive film of the substrate in a matrix manner; S3, placing the carrier board on the upper clamp (18), controlling the operation of the telescopic cylinder (4) to align the metal interconnect electrodes on the carrier board with the electrodes of the MicroLED on the substrate, and performing reflow soldering to solder the two boards together; S4, irradiating ultraviolet light to the back of the MicroLED substrate to separate the MicroLED chip from the ultraviolet adhesive film on the substrate; S5. Evaporate or sputter an oxide dielectric film on the substrate with the MicroLED chip to protect it, exposing the metal PAD for subsequent display mounting.

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