A cutting device for chip wafer processing

Abstract

The present invention relates to the field of chip processing technology, and discloses a cutting device for chip wafer processing, including a workbench, an outer wall on one side of the top of the workbench is provided with an XY axis moving platform, and a placing truncated table is provided on the XY axis moving platform, a laser cutting head is provided above the placing truncated table, a plurality of notches are provided at equal distances on the outer wall on the top of the placing truncated table, and a telescopic mechanism is provided directly below each notch, and a lifting plate is provided on each of the telescopic mechanisms, and L-shaped plates are fixedly connected to the outer walls on both sides of the top of the lifting plate. The present invention can make the upper arc clamping plate and the lower arc clamping plate do circular motion through a driving mechanism, and wafers of different diameters can be clamped and fixed through the protruding parts of the upper arc clamping plate and the lower arc clamping plate, so as to avoid the wafer from being offset due to the movement of the XY axis moving platform, and greatly improve the accuracy of wafer cutting.

Description

Technical Field

[0001] The present invention relates to the technical field of chip processing, and in particular to a cutting device for chip wafer processing. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.

[0003] The Chinese patent with the patent publication number CN207577693U discloses a laser wafer cutting device, including a base, a laser wafer cutting body, a laser cutting head, a working plate, a rotating motor, a transmission shaft, a micromotor, an active roller, a conveyor belt and a driven roller. The base is arranged on the lower side of the laser wafer cutting body, the working plate is arranged on the upper end face of the laser wafer cutting body, the laser cutting head runs through the upper end face of the working plate, the rotating motor is fixed inside the base, and the transmission shaft is fixed on the upper end face of the rotating motor. The design solves the problem that the original laser wafer cutting device has no omnidirectional rotating structure. The micromotor is arranged on the rear side of the working plate, the active roller is fixed on the front end face of the micromotor, and the driven roller is arranged on the right side of the active roller. The active roller is connected to the driven roller through a conveyor belt. The design solves the problem that the original laser wafer cutting device has no electric transmission structure. In the process of cutting, the position of the wafer needs to be adjusted, and the above device does not have the function of fixing the wafer. In the process of adjusting the position of the wafer, it is easy for the wafer to slide and cause offset, thereby causing deviation in cutting accuracy and even causing damage to the wafer.

[0004] In view of this, the present invention proposes a cutting device for chip wafer processing to solve the problems existing in the above-mentioned prior art. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a cutting device for chip wafer processing.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A cutting device for chip wafer processing comprises a workbench, an outer wall on one side of the top of the workbench is provided with an XY-axis moving platform, and a placing truncated table is provided on the XY-axis moving platform, a laser cutting head is provided above the placing truncated table, a plurality of notches are provided on the outer wall on the top of the placing truncated table at equal distances, and a telescopic mechanism is provided directly below each notch, a lifting plate is provided on each of the telescopic mechanisms, and L-shaped plates are fixedly connected to the outer walls on both sides of the top of the lifting plate, a rotating shaft 2 is rotatably connected between the two L-shaped plates, and a rotating sleeve is rotatably connected to the outer wall of the rotating shaft 2, a connecting plate is fixedly connected to the outer wall of the rotating shaft 2, and an upper arc-shaped clamping plate is fixedly connected to one end of the upper connecting plate, and a lower arc-shaped clamping plate is fixedly connected to one end of the other connecting plate, a driving mechanism is provided below the two L-shaped plates, and the center of the circle of the upper arc-shaped clamping plate and the lower arc-shaped clamping plate coincides with the center of the circle of the rotating shaft 2.

[0008] Furthermore, the telescopic mechanism includes a accommodating chamber, an electromagnet is arranged on one side of the accommodating chamber, and a magnetic plate is slidably connected to the inner wall of the accommodating chamber, a connecting spring is fixedly connected between the magnetic plate and the electromagnet, and the magnetic force generated by the electromagnet after power is supplied attracts the magnetic plate.

[0009] Furthermore, a telescopic plate is slidably connected to the other side of the accommodating cavity, and one side of the telescopic plate is fixedly connected to the magnetic plate, and two electric push rods are inlaid on the other side of the telescopic plate, and the lifting plate is fixedly connected to the telescopic ends of the two electric push rods.

[0010] Furthermore, the driving mechanism includes a rotating shaft 1 and a rotating shaft 3, the rotating shaft 1 is rotatably connected between the two L-shaped plates, and a rotating motor 1 is arranged on one side of the rotating shaft 1, and the rotating motor 1 is fixedly connected to the outer wall of one of the L-shaped plates, the rotating shaft 3 is rotatably connected to the other L-shaped plate, and a gear 2 is arranged on one side of the rotating shaft 3, and a gear 1 is arranged on the other side of the rotating shaft 1, and the gear 1 is meshed with the gear 2.

[0011] Furthermore, the outer walls of the rotating shaft 1 and the rotating shaft 3 are both fixedly connected with pulley 1, the outer walls of the rotating sleeve and the rotating shaft 2 are both fixedly connected with pulley 2, and belts are sleeved on the outer walls of pulley 1 and pulley 2 on the same side.

[0012] Furthermore, the outer walls of the upper arc-shaped clamping plate and the lower arc-shaped clamping plate are both provided with arc-shaped grooves, and the inner walls of the arc-shaped grooves are both fixedly connected with curved guide rods, and the outer walls of the curved guide rods are both slidably connected with arc-shaped sliders.

[0013] Furthermore, a plurality of connecting springs 2 are fixedly connected between the arc-shaped slider and the arc-shaped groove, and a rubber pad is fixedly connected between the outer walls on opposite sides of the two arc-shaped sliders.

[0014] Furthermore, an installation cavity is provided on the top of the workbench, and a rotating shaft four is rotatably connected to the top of the installation cavity, a rotating motor two is provided at the bottom end of the rotating shaft four, and a swing plate is fixedly connected to the top of the rotating shaft four.

[0015] Furthermore, the bottom outer wall of the swing plate is fixedly connected to two fixed plates, and an air pipe is arranged between the two fixed plates, a plurality of nozzles are arranged at equal distances on the bottom outer wall of the air pipe, a fan is arranged on the outer wall of the workbench, and an air supply pipe is connected between the output end of the fan and the air pipe.

[0016] The beneficial effects of the present invention are:

[0017] 1. The present invention can make the upper arc clamping plate and the lower arc clamping plate move in a circular motion through the driving mechanism. The protruding parts of the upper arc clamping plate and the lower arc clamping plate can clamp and fix wafers of different diameters, thereby avoiding the wafer from being offset as the XY axis moving platform moves, thereby greatly improving the accuracy of wafer cutting.

[0018] 2. By setting up rubber pads, when the upper arc clamping plate and the lower arc clamping plate move toward the wafer placed on the round table, the edge of the wafer will be inserted into the gap between the upper arc clamping plate and the lower arc clamping plate, so that the rubber pads can wrap the parts clamped by the upper arc clamping plate and the lower arc clamping plate, thereby preventing the upper arc clamping plate and the lower arc clamping plate from scratching the wafer.

[0019] 3. When the wafer is cut and leaves the placing table, the rotating motor 2 can make the multiple nozzles under the air pipe face the placing table. The fan can make the multiple nozzles spray high-speed airflow, so as to clean the placing table and remove the debris and impurities generated during cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic structural diagram of a chip wafer processing cutting device proposed in Example 1;

[0021] Figure 2 This is a schematic diagram of a placement truncated table structure of a chip wafer processing cutting device proposed in Example 1;

[0022] Figure 3 A schematic diagram of the cross-sectional structure of a truncated table for placing a chip wafer processing cutting device proposed in Example 1;

[0023] Figure 4 A chip wafer processing cutting device proposed in Example 1 Figure 2 A schematic diagram of the structure enlargement in the middle;

[0024] Figure 5A schematic diagram of the top structure of a telescopic plate of a chip wafer processing cutting device proposed in Example 2;

[0025] Figure 6 A schematic diagram of the arc groove structure of a chip wafer processing cutting device proposed in Example 2;

[0026] Figure 7 This is a schematic diagram of the structure of a workbench portion of a chip wafer processing cutting device proposed in Example 3;

[0027] Figure 8 A chip wafer processing cutting device proposed in Example 3 Figure 7 Schematic diagram of the cross-sectional structure at point B in the middle.

[0028] In the figure: 1, workbench; 2, XY axis moving platform; 3, placing round table; 4, laser cutting head; 5, telescopic plate; 6, missing groove; 7, upper arc clamping plate; 8, L-shaped plate; 9, lower arc clamping plate; 10, electromagnet; 11, magnetic plate; 12, connecting spring 1; 13, accommodating chamber; 14, gear 1; 15, rotating shaft 1; 16, rotating motor 1; 17, pulley 1; 18, belt; 19, pulley 2; 20, rotating sleeve ; 21. Connecting plate; 22. Rotating shaft two; 23. Rotating shaft three; 24. Gear two; 25. Lifting plate; 26. Electric push rod; 27. Arc groove; 28. Rubber pad; 29. ​​Bending guide rod; 30. Arc slider; 31. Connecting spring two; 32. Fan; 33. Air pipe; 34. Rotating shaft four; 35. Swinging plate; 36. Fixed plate; 37. Air pipe; 38. Injection head; 39. Rotating motor two; 40. Installation cavity. DETAILED DESCRIPTION

[0029] The technical solution of the present invention is further described in detail below in conjunction with specific implementation methods.

[0030] Example 1: Reference Figure 1-Figure 4A chip wafer processing cutting device comprises a workbench 1, an XY axis moving platform 2 is arranged on the outer wall of one side of the top of the workbench 1, and a placing truncated table 3 is arranged on the XY axis moving platform 2, a laser cutting head 4 is arranged above the placing truncated table 3, a plurality of notches 6 are arranged on the outer wall of the top of the placing truncated table 3 at equal distances, and a telescopic mechanism is arranged directly below each notch 6, each telescopic mechanism is arranged on a lifting plate 25, and the outer walls on both sides of the top of the lifting plate 25 are fixedly connected with L-shaped plates 8, and the two L-shaped plates The two L-shaped plates 8 are rotatably connected with a second rotating shaft 22, and the outer wall of the second rotating shaft 22 is rotatably connected with a rotating sleeve 20, and the rotating sleeve 20 and the outer wall of the second rotating shaft 22 are fixedly connected with a connecting plate 21, and one end of the upper connecting plate 21 is fixedly connected with an upper arc-shaped clamping plate 7, and one end of the other connecting plate 21 is fixedly connected with a lower arc-shaped clamping plate 9, and a driving mechanism is arranged under the two L-shaped plates 8, and the center of the upper arc-shaped clamping plate 7 and the lower arc-shaped clamping plate 9 coincides with the center of the second rotating shaft 22. Before wafer cutting, the wafer The wafer is placed on the placing truncated table 3, and then the upper arc clamping plate 7 and the lower arc clamping plate 9 between the L-shaped plates 8 are moved toward the wafer at the same time through multiple telescopic mechanisms. As the upper arc clamping plate 7 and the lower arc clamping plate 9 move, the edge of the wafer can be inserted into the gap between the upper arc clamping plate 7 and the lower arc clamping plate 9, and then the upper arc clamping plate 7 and the lower arc clamping plate 9 are moved toward each other through the driving mechanism, so that the placing truncated table can be adjusted by merging the upper arc clamping plate 7 and the lower arc clamping plate 9. 3 is clamped and fixed, and when the upper arc clamping plate 7 and the lower arc clamping plate 9 clamp and fix the edge of the wafer, the area of ​​the edge of the wafer is small, which will not affect the cutting work, and by setting the notch 6, it can be ensured that the upper arc clamping plate 7 and the lower arc clamping plate 9 can be inserted into the notch 6, so that the wafer with a smaller diameter can be clamped and fixed, avoiding the wafer from being offset as the XY axis moving platform 2 moves, and greatly improving the accuracy of wafer cutting.

[0031] As a further solution in the present invention, the telescopic mechanism includes a accommodating chamber 13, an electromagnet 10 is arranged on one side of the accommodating chamber 13, and a magnetic plate 11 is slidably connected to the inner wall of the accommodating chamber 13, a connecting spring 12 is fixedly connected between the magnetic plate 11 and the electromagnet 10, and the magnetic force generated by the electromagnet 10 after being energized attracts the magnetic plate 11, so that the electromagnet 10 is energized, and the magnetic force generated by the electromagnet 10 after being energized attracts the magnetic plate 11 to approach the electromagnet 10.

[0032] As a further solution in the present invention, a telescopic plate 5 is slidably connected to the other side of the accommodating cavity 13, and one side of the telescopic plate 5 is fixedly connected to the magnetic plate 11, and two electric push rods 26 are inlaid on the other side of the telescopic plate 5, and the lifting plate 25 is fixedly connected to the telescopic ends of the two electric push rods 26, so that the length of the telescopic plate 5 extending into the accommodating cavity 13 is lengthened, and by changing the current input to the electromagnet 10, the distance between the magnetic plate 11 and the electromagnet 10 can be controlled, thereby synchronously controlling the telescopic length of the telescopic plate 5, and the height of the lifting plate 25 can be adjusted by the electric push rod 26, which can ensure that the wafer can be inserted into the gap between the upper arc clamping plate 7 and the lower arc clamping plate 9, and when the wafer is fixed, the wafer can be placed on the placing table 3 by the electric push rod 26 to prevent the wafer from being empty.

[0033] As a further solution in the present invention, the driving mechanism includes a rotating shaft 15 and a rotating shaft 3 23, the rotating shaft 15 is rotatably connected between the two L-shaped plates 8, and a rotating motor 16 is provided on one side of the rotating shaft 15, and the rotating motor 16 is fixedly connected to the outer wall of one of the L-shaped plates 8, the rotating shaft 3 23 is rotatably connected to the other L-shaped plate 8, and a gear 2 24 is provided on one side of the rotating shaft 3 23, and a gear 14 is provided on the other side of the rotating shaft 15, and the gear 14 is meshed with the gear 2 24. The rotating shaft 15 is rotated by rotating the motor 16, and the rotating shaft 15 will synchronously rotate the gear 14. Because the gear 14 is meshed with the gear 2 24 on the rotating shaft 3 23, the rotating shaft 3 23 is synchronously rotated, and the rotation direction of the rotating shaft 3 23 is opposite to the rotation direction of the rotating shaft 15.

[0034] As a further solution of the present invention, a pulley 17 is fixedly connected to the outer wall of the rotating shaft 15 and the rotating shaft 3 23, a pulley 2 19 is fixedly connected to the outer wall of the rotating sleeve 20 and the rotating shaft 2 22, and a belt 18 is sleeved on the outer wall of the pulley 17 and the pulley 2 19 located on the same side, and the rotating sleeve 20 and the rotating shaft 2 22 can be rotated respectively by the pulley 17, the belt 18 and the pulley 2 19, and the rotating sleeve 20 and the rotating shaft 2 22 have the same rotation direction as the rotating shaft 15, and the rotating shaft 2 22 and the rotating shaft 3 23 have the same rotation direction.

[0035] Working principle: before wafer cutting, the wafer is placed on the placing truncated table 3, and then the electromagnet 10 in the accommodating cavity 13 is energized. The magnetic force generated by the electromagnet 10 after being energized attracts the magnetic plate 11 to approach the electromagnet 10, thereby lengthening the length of the telescopic plate 5 extending into the accommodating cavity 13, and by changing the current input to the electromagnet 10, the distance between the magnetic plate 11 and the electromagnet 10 can be controlled, and the telescopic length of the telescopic plate 5 can be synchronously controlled, so that the upper arc clamping plate 7 and the lower arc clamping plate 9 between the L-shaped plate 8 can be simultaneously approached to the wafer, with the movement of the upper arc clamping plate 7 and the lower arc clamping plate 9, the edge of the wafer can be inserted into the gap between the upper arc clamping plate 7 and the lower arc clamping plate 9, and then the rotating motor 16 is used to rotate the shaft 15, and the shaft 15 will synchronously rotate the gear 14, because the gear 14 and the rotating shaft 2 The gear 24 on 3 is meshed, thereby synchronously rotating the shaft 3 23, and the rotation direction of the shaft 3 23 is opposite to that of the shaft 1 15, and through the pulley 1 17, the belt 18 and the pulley 2 19, the rotating sleeve 20 and the shaft 2 22 can be rotated respectively, and the rotating sleeve 20 has the same rotation direction as the shaft 1 15, and the shaft 2 22 has the same rotation direction as the shaft 3 23, which can make the upper arc clamping plate 7 and the lower arc clamping plate 9 approach each other, so that the wafer placed on the truncated table 3 can be clamped and fixed by merging the upper arc clamping plate 7 and the lower arc clamping plate 9, and by setting the notch 6, it can ensure that the upper arc clamping plate 7 and the lower arc clamping plate 9 can be inserted into the notch 6, so that the wafer with a smaller diameter can be clamped and fixed, avoiding the wafer from being offset as the XY axis moving platform 2 moves, thereby greatly improving the accuracy of wafer cutting.

[0036] Example 2: Reference Figure 1-Figure 6 , a cutting device for chip wafer processing. Compared with Example 1, on the basis of Example 1, the outer walls of the upper arc-shaped clamping plate 7 and the lower arc-shaped clamping plate 9 are both provided with arc-shaped grooves 27, and the inner walls of the arc-shaped grooves 27 are fixedly connected with curved guide rods 29, and the outer walls of the curved guide rods 29 are slidably connected with arc-shaped sliders 30. When the wafer is placed on the placement table 3, each telescopic mechanism is started at the same time, so that the upper arc-shaped clamping plate 7 and the lower arc-shaped clamping plate 9 are close to the wafer on the placement table 3 at the same time.

[0037] As a further solution in the present invention, a plurality of connecting springs 231 are fixedly connected between the arc-shaped slider 30 and the arc-shaped groove 27, and a rubber pad 28 is fixedly connected between the outer walls of the opposite sides of the two arc-shaped sliders 30. As the upper arc-shaped clamping plate 7 and the lower arc-shaped clamping plate 9 gradually approach each other, the rubber pad 28 will contact the wafer. As the upper arc-shaped clamping plate 7 and the lower arc-shaped clamping plate 9 continue to move, the edge of the wafer will be inserted into the gap between the upper arc-shaped clamping plate 7 and the lower arc-shaped clamping plate 9. At the same time, the rubber pad 28 will wrap the surface of the wafer between the upper arc-shaped clamping plate 7 and the lower arc-shaped clamping plate 9. When the upper arc-shaped clamping plate 7 and the lower arc-shaped clamping plate 9 approach each other to clamp and fix the wafer, there is a rubber pad 28 between the upper arc-shaped clamping plate 7 and the lower arc-shaped clamping plate 9 and the wafer, thereby preventing the upper arc-shaped clamping plate 7 and the lower arc-shaped clamping plate 9 from scratching the wafer.

[0038] Working principle: When the wafer is placed on the placing table 3, each telescopic mechanism is started at the same time, so that the upper arc clamping plate 7 and the lower arc clamping plate 9 are close to the wafer on the placing table 3 at the same time, as the upper arc clamping plate 7 and the lower arc clamping plate 9 gradually approach each other, the rubber pad 28 will contact the wafer, and as the upper arc clamping plate 7 and the lower arc clamping plate 9 continue to move, the edge of the wafer will be inserted into the gap between the upper arc clamping plate 7 and the lower arc clamping plate 9, and at the same time, the rubber pad 28 will wrap the surface of the wafer between the upper arc clamping plate 7 and the lower arc clamping plate 9, when the upper arc clamping plate 7 and the lower arc clamping plate 9 are close to each other to clamp and fix the wafer, there is a rubber pad 28 between the upper arc clamping plate 7 and the lower arc clamping plate 9 and the wafer, thereby preventing the upper arc clamping plate 7 and the lower arc clamping plate 9 from scratching the wafer.

[0039] Example 3: Reference Figure 1-Figure 8 , a cutting device for chip wafer processing, compared with embodiment 2, on the basis of embodiment 2, a mounting cavity 40 is provided on the top of the workbench 1, and a rotating shaft four 34 is rotatably connected to the top of the mounting cavity 40, a rotating motor two 39 is provided at the bottom end of the rotating shaft four 34, and a swing plate 35 is fixedly connected to the top of the rotating shaft four 34. When the wafer is cut and leaves the placing truncated table 3, the rotating motor two 39 is started to make the rotating shaft four 34 move, so that the swing plate 35 on the rotating shaft four 34 can be moved.

[0040] As a further solution in the present invention, two fixed plates 36 are fixedly connected to the bottom outer wall of the swing plate 35, and an air pipe 37 is arranged between the two fixed plates 36, and a plurality of nozzles 38 are arranged at equal distances on the bottom outer wall of the air pipe 37. A fan 32 is arranged on the outer wall of the workbench 1, and an air supply pipe 33 is connected between the output end of the fan 32 and the air pipe 37. When the air pipe 37 under the swing plate 35 is located above the placed truncated table 3, the swing plate 35 stops moving, and then the fan 32 is started, so that the plurality of nozzles 38 under the air pipe 37 can eject high-speed airflow, which can clean the placed truncated table 3 and remove debris and impurities generated during cutting. The swing plate 35 can be made to swing back and forth in a small range by rotating the motor 2 39, so that various places of the placed truncated table 3 can be cleaned to avoid residual waste and impurities during cutting.

[0041] Working principle: When the wafer is cut and leaves the placing table 3, the rotating motor 2 39 starts to make the rotating shaft 4 34 move, so that the swing plate 35 on the rotating shaft 4 34 can move, and when the air pipe 37 under the swing plate 35 is located above the placing table 3, the swing plate 35 stops moving, and then the fan 32 starts, so that the multiple nozzles 38 under the air pipe 37 can spray high-speed airflow, which can clean the placing table 3 and remove the debris and impurities generated during cutting. The rotating motor 2 39 makes the swing plate 35 swing back and forth in a small range, so that various places of the placing table 3 can be cleaned to avoid the residual waste impurities during cutting.

[0042] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A cutting device for chip wafer processing, comprising a workbench (1), an outer wall on one side of the top of the workbench (1) is provided with an XY axis moving platform (2), and a placing truncated table (3) is provided on the XY axis moving platform (2), and a laser cutting head (4) is provided above the placing truncated table (3), characterized in that: The outer wall of the top of the placing truncated table (3) is provided with a plurality of notches (6) at equal distances, and a telescopic mechanism is provided directly below each notch (6), and a lifting plate (25) is provided on each of the telescopic mechanisms, and the outer walls on both sides of the top of the lifting plate (25) are fixedly connected to L-shaped plates (8), a second rotating shaft (22) is rotatably connected between the two L-shaped plates (8), and a rotating sleeve (20) is rotatably connected to the outer wall of the second rotating shaft (22), and a connecting plate (21) is fixedly connected to the outer wall of the second rotating shaft (22), and the rotating sleeve (20) and the outer wall of the second rotating shaft (22) are fixedly connected to the connecting plate (21), and one end of the upper connecting plate (21) is fixedly connected to the upper arc-shaped clamping plate (7), and one end of the other connecting plate (21) is fixedly connected to the lower arc-shaped clamping plate (9), and a driving mechanism is provided below the two L-shaped plates (8), and the center of the circle of the upper arc-shaped clamping plate (7) and the lower arc-shaped clamping plate (9) coincides with the center of the circle of the second rotating shaft (22); The driving mechanism comprises a rotating shaft 1 (15) and a rotating shaft 3 (23), wherein the rotating shaft 1 (15) is rotatably connected between the two L-shaped plates (8), and a rotating motor 1 (16) is disposed on one side of the rotating shaft 1 (15), and the rotating motor 1 (16) is fixedly connected to the outer wall of one of the L-shaped plates (8), and the rotating shaft 3 (23) is rotatably connected to the other L-shaped plate (8), and a gear 2 (24) is disposed on one side of the rotating shaft 3 (23), and a gear 1 (14) is disposed on the other side of the rotating shaft 1 (15), and the gear 1 (14) is meshed with the gear 2 (24); The outer walls of the rotating shaft 1 (15) and the rotating shaft 3 (23) are both fixedly connected with a pulley 1 (17), the outer walls of the rotating sleeve (20) and the rotating shaft 2 (22) are both fixedly connected with a pulley 2 (19), and the outer walls of the pulley 1 (17) and the pulley 2 (19) located on the same side are sleeved with a belt (18).

2. A chip wafer processing cutting device according to claim 1, characterized in that: The telescopic mechanism comprises a housing chamber (13), an electromagnet (10) is arranged on one side of the housing chamber (13), a magnetic plate (11) is slidably connected to the inner wall of the housing chamber (13), a connecting spring (12) is fixedly connected between the magnetic plate (11) and the electromagnet (10), and the magnetic force generated by the electromagnet (10) when energized attracts the magnetic plate (11).

3. A chip wafer processing cutting device according to claim 2, characterized in that: A telescopic plate (5) is slidably connected to the other side of the accommodating cavity (13), and one side of the telescopic plate (5) is fixedly connected to the magnetic plate (11). Two electric push rods (26) are embedded on the other side of the telescopic plate (5), and the lifting plate (25) is fixedly connected to the telescopic ends of the two electric push rods (26).

4. The chip wafer processing cutting device according to claim 1, characterized in that: The outer walls of the upper arc-shaped clamping plate (7) and the lower arc-shaped clamping plate (9) are both provided with arc-shaped grooves (27), and the inner walls of the arc-shaped grooves (27) are both fixedly connected with curved guide rods (29), and the outer walls of the curved guide rods (29) are both slidably connected with arc-shaped sliders (30).

5. A chip wafer processing cutting device according to claim 4, characterized in that: A plurality of connecting springs (31) are fixedly connected between the arc-shaped slider (30) and the arc-shaped groove (27), and a rubber pad (28) is fixedly connected between the outer walls of the two arc-shaped sliders (30) on opposite sides.

6. The chip wafer processing cutting equipment according to claim 1, characterized in that: The workbench (1) is provided with a mounting cavity (40) at the top, and a rotating shaft (34) is rotatably connected to the top of the mounting cavity (40). A rotating motor (39) is provided at the bottom of the rotating shaft (34), and a swing plate (35) is fixedly connected to the top of the rotating shaft (34).

7. A chip wafer processing cutting device according to claim 6, characterized in that: Two fixed plates (36) are fixedly connected to the outer wall at the bottom of the swing plate (35), and an air pipe (37) is arranged between the two fixed plates (36). A plurality of air jet heads (38) are arranged at equal distances on the outer wall at the bottom of the air pipe (37). A fan (32) is arranged on the outer wall of the workbench (1), and an air delivery pipe (33) is connected between the output end of the fan (32) and the air pipe (37).

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