Large size silicon wafer single wafer cleaning machine

Abstract

The application discloses a large-size silicon wafer single-piece cleaning machine and particularly relates to the technical field of silicon wafer processing, which comprises a fixed plate one, a fixed plate two and a pair of spraying systems for spraying cleaning liquid on the silicon wafer, the fixed plate two is fixedly connected to the fixed plate one, the lateral surface of the fixed plate one is slidably connected with three sliding seats one, each of the sliding seats one is rotatably connected with a supporting roller for supporting the silicon wafer in rolling, the three supporting rollers form a triangular structure, the bottom of one of the sliding seats one is provided with a spring one, and the spring one is arranged on the fixed plate one. The application solves the technical problems that the silicon wafer is prone to collision at the edge when being fed at too high a speed or being insufficiently positioned, and that the transmission and limiting property of the silicon wafer is insufficient during the rotating cleaning, leading to incomplete cleaning cycle and affecting the stability of the rotating cleaning.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer processing technology, and more specifically, to a large-size silicon wafer single-wafer cleaning machine. Background Technology

[0002] Silicon wafers, also known as silicon ingots, are made from silicon ingots. Through specialized processes, millions of transistors can be etched onto silicon wafers, making them widely used in integrated circuit manufacturing. Silicon ingots are ground, polished, and sliced ​​to form silicon wafers, or wafers. Cleaning wafers involves specialized cleaning equipment. In CMP (Chemical Mechanical Polishing) equipment, after polishing, the wafer surface is cleaned using roller brushes in the cleaning module to remove residual abrasive particles, organic matter, metal residues, and other contaminants.

[0003] In related technologies, the cleaning method for large-size, single-wafer silicon wafers often employs a rolling support structure for rolling support, combined with the spraying of cleaning fluid and brushing components to clean residual contaminants on the silicon wafer. However, during the actual cleaning process, if the silicon wafer is fed in too quickly or the alignment is insufficient, it can easily cause collisions at the wafer edges, resulting in damage to the silicon wafer. In addition, during the rotational cleaning process, the transmission and limiting properties of the silicon wafer are insufficient, leading to incomplete cleaning cycles and affecting the stability of the rotational cleaning process. Summary of the Invention

[0004] In order to overcome the above-mentioned defects of the prior art, the embodiments of the present invention provide a large-size silicon wafer single-wafer cleaning machine. The technical problem to be solved by the present invention is that: when the silicon wafer is fed in too fast or the alignment of the feeding is insufficient, it is easy to cause collisions at the edge of the wafer. In addition, during the rotation cleaning process, the transmission and positioning of the silicon wafer is insufficient, resulting in incomplete cleaning cycle during rotation cleaning, and also affecting the stability of rotation cleaning.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a large-size silicon wafer single-wafer cleaning machine, comprising a fixing plate 1, a fixing plate 2, and a pair of spraying systems for spraying cleaning liquid onto the silicon wafer. The fixing plate 2 is fixedly connected to the fixing plate 1. Three slide blocks 1 are slidably connected to the side of the fixing plate 1, and each slide block 1 is rotatably connected to a support roller for rolling support of the silicon wafer. The three support rollers form a triangular structure. A spring 1 is provided at the bottom of one of the slide blocks 1, and the spring 1 is provided on the fixing plate 1.

[0006] One of the support rollers is fixedly connected to a shaft, and the other two support rollers are rotatably connected to connecting rods, and a pair of connecting rods are rotatably connected to the shaft.

[0007] A belt drive structure is provided, which is mounted on the fixed plate 2 and is used to drive the shaft to rotate.

[0008] A transmission tensioning assembly is disposed on the fixed plate two and the belt drive structure;

[0009] A washing assembly, comprising a pair of washing rollers, with a gap between the pair of washing rollers for inserting silicon wafers, and sliding tensioning components at both ends of the pair of washing rollers.

[0010] A cleaning drive structure is disposed on the sliding tensioning assembly, and the cleaning drive structure is used to drive a pair of cleaning rollers to rotate relative to each other.

[0011] In a preferred embodiment, two slide blocks are laterally slidably connected to the fixed plate, and another slide block is longitudinally slidably connected to the fixed plate. The fixed plate has a groove for sliding the slide block.

[0012] In a preferred embodiment, the spring is fixedly connected to the bottom of the slide block, and the end of the spring facing away from the slide block is fixedly connected to the groove at the bottom.

[0013] In a preferred embodiment, the belt drive structure includes a first pulley, a second pulley, a third pulley, a drive belt, and a first rotating device. The second pulley is rotatably connected to the second fixed plate, the third pulley is fixedly connected to one end of the shaft, the drive belt is drivenly connected to the first pulley, the second pulley, and the third pulley, the first rotating device is fixedly connected to the second fixed plate, and the output end of the first rotating device passes through the second fixed plate and is connected to the second pulley. The third pulley is fixedly connected to one end of the shaft.

[0014] In a preferred embodiment, the transmission tensioning assembly includes a second slide block and a second spring. The second slide block is slidably connected to the second fixed plate, and the second spring is fixedly connected to the bottom end of the second slide block.

[0015] In a preferred embodiment, the fixed plate 2 is provided with a slide groove 2 for sliding the slide block 2, the spring 2 is disposed in the slide groove 2, and one end of the spring 2 is fixedly connected to the inner wall of the slide groove 2, and the pulley 1 is rotatably connected to the slide block 2.

[0016] In a preferred embodiment, the sliding tensioning assembly includes a support plate, a pair of slide blocks three, and a pair of springs three. The support plate is fixedly connected to the fixed plate one, the pair of slide blocks three are slidably connected to the support plate, and the springs three are fixedly connected to the side of the slide blocks three.

[0017] In a preferred embodiment, the support plate has a slide groove for sliding the slide block, the spring is disposed in the slide groove, and one end of the spring is fixedly connected to the inner wall of the slide groove.

[0018] In a preferred embodiment, the cleaning drive structure includes a pair of bearing seats, a telescopic rod assembly 1, a pair of bevel gears 1, a pair of bevel gears 2, a telescopic rod assembly 2, and a rotating device 2. The pair of bearing seats are fixedly connected to a pair of slide seats 3 on the same side. The telescopic rod assembly 1 is rotatably connected to the pair of bearing seats, and both ends of the telescopic rod assembly 1 are fixedly connected to the opposite surfaces of the pair of bevel gears 1. The pair of bevel gears 2 are fixedly connected to the shaft ends of a pair of cleaning rollers. The pair of bevel gears 1 are meshed with the pair of bevel gears 2. The telescopic rod assembly 2 is rotatably connected to the support plate, and one end of the telescopic rod assembly 2 is fixedly connected to one of the bevel gears 1. The rotating device 2 is fixedly connected to the support plate, and the output end of the rotating device 2 passes through the support plate and is fixedly connected to the other end of the telescopic rod assembly 2.

[0019] In a preferred embodiment, the telescopic rod assembly one and the telescopic rod assembly two have the same structure. The telescopic rod assembly one includes an outer tube and a cross-shaped insert rod, which is movably inserted into the outer tube.

[0020] The technical effects and advantages of this invention are as follows:

[0021] This invention discloses a large-size silicon wafer single-wafer cleaning machine. As a pair of cleaning rollers for brushing silicon wafers, on the one hand, in conjunction with the spraying of cleaning liquid from the spray system, the pair of cleaning rollers rotate relative to each other and act on both ends of the silicon wafer to achieve a brushing effect. On the other hand, a sliding tensioning component provides relative inward contraction tension to the pair of cleaning rollers. At the same time, by utilizing the reserved insertion gap, the pair of cleaning rollers can provide elastic tightening for rolling feeding of silicon wafers and provide rotational power for feeding to control the movement of silicon wafers. In this way, silicon wafer cleaning can achieve a conveyor-type feeding effect with high feeding stability and meet the centering alignment effect, so as to avoid collision damage during silicon wafer feeding.

[0022] The present invention discloses a large-size silicon wafer single-wafer cleaning machine, which, by setting a cleaning drive structure, can provide a telescopic drive effect for a pair of cleaning rollers and satisfy the drive performance of opposite-direction transmission, so as to adapt to the brushing drive of a pair of cleaning rollers to realize the tensioning and feeding of silicon wafers.

[0023] This invention discloses a large-size silicon wafer single-wafer cleaning machine. When cleaning large-size, single silicon wafers, a cleaning roller provides a conveying feeding action for the silicon wafer. Under the action of the silicon wafer's gravity, the opening and closing effect of a pair of connecting rods allows three support rollers to adaptively shift and roll on the annular surface of the silicon wafer. This achieves an automatic rolling limit effect for the rotating cleaning of the silicon wafer. By improving the rolling fit, the rotation frequency can be guaranteed when the support rollers drive the silicon wafer to rotate for cleaning, resulting in a stable and high transmission effect.

[0024] The present invention discloses a large-size silicon wafer single-wafer cleaning machine, which, with the adaptive support movement of the support rollers, can provide effective cleaning drive for the support rollers in real time through the cooperation of the belt drive structure and the transmission tensioning component, and can transfer the position pressure of the support rollers so that the support rollers can effectively move and be tensioned along with the loading of silicon wafers. Attached Figure Description

[0025] Figure 1 This is a first-view structural schematic diagram of the present invention.

[0026] Figure 2 This is a structural schematic diagram of the entire invention from a second perspective.

[0027] Figure 3 For the present invention Figure 1 A partial structural diagram.

[0028] Figure 4 This is a schematic diagram of the connection structure between the fixing plate and the supporting roller of the present invention.

[0029] Figure 5 This is a schematic diagram of the fixed plate 2 and the belt drive structure of the present invention.

[0030] Figure 6 For the present invention Figure 1 A schematic diagram of the structure of another part.

[0031] Figure 7 This is a schematic diagram of the cleaning drive structure of the present invention.

[0032] The attached diagram is labeled as follows: 1. Fixed plate one; 2. Fixed plate two; 3. Spraying system; 4. Slide one; 5. Support roller; 6. Spring one; 7. Shaft; 71. Connecting rod; 8. Pulley one; 81. Pulley two; 82. Pulley three; 83. Drive belt; 84. Rotating device one; 9. Slide two; 91. Spring two; 10. Cleaning roller; 11. Support plate; 111. Slide three; 112. Spring three; 12. Bearing seat; 121. Telescopic rod assembly one; 122. Bevel gear one; 123. Bevel gear two; 124. Telescopic rod assembly two; 125. Rotating device two; 10. Cleaning roller. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] See also Figures 1-4 This invention provides a large-size silicon wafer single-wafer cleaning machine, including a fixed plate 1, a fixed plate 2, and a pair of spray systems 3 for spraying cleaning liquid onto the silicon wafer. The fixed plate 2 is fixedly connected to the fixed plate 1. Three slide blocks 4 are slidably connected to the side of the fixed plate 1, and each slide block 4 is rotatably connected to a support roller 5 for rolling support of the silicon wafer. The three support rollers 5 form a triangular structure. A spring 6 is provided at the bottom of one of the slide blocks 4, and the spring 6 is provided on the fixed plate 1. In this application, the support roller 5 is provided with a V-shaped groove for rolling support of the silicon wafer.

[0035] One of the support rollers 5 is fixedly connected to a shaft 7, and the other two support rollers 5 are rotatably connected to connecting rods 71, and a pair of connecting rods 71 ​​are rotatably connected to the shaft 7.

[0036] Specifically, the sliding block 4 allows the support rollers 5 to have rolling movement. Under the influence of the silicon wafer's gravity, when the silicon wafer is fed onto the support rollers 5 at the bottom of the triangular position, the spring 6 can be compressed, allowing the bottom support rollers 5 to move downwards. At the same time, a pair of connecting rods 71 ​​can pull the pair of higher support rollers 5 laterally and relatively closer until the support rollers 5 roll on the annular surface of the silicon wafer. In this way, the three support rollers 5 provide three-point limiting to stabilize the rotation position of the silicon wafer. Under the condition of ensuring rolling fit, the rotation of the bottom support rollers 5 can meet the transmission matching of the silicon wafer cleaning rotation. Because of the high transmission fit, the support rollers 5 can control the silicon wafer to reach the specified number of cleaning rotations, resulting in a stable and high transmission effect and high cleaning quality.

[0037] Two of the slide blocks 4 are slidably connected to the fixed plate 1 laterally, and the other slide block 4 is slidably connected to the fixed plate 1 longitudinally. The fixed plate 1 has a sliding groove for the slide block 4 to slide, that is, two of the support rollers 5 can move laterally and roll on the annular surface of the silicon wafer. The other support roller 5 provides bottom support for the silicon wafer, and the pressure of the silicon wafer can drive the two support rollers 5 above to tighten on the silicon wafer.

[0038] Spring 6 is fixedly connected to the bottom of slide 4 located at the bottom, and the end of spring 6 facing away from slide 4 is fixedly connected to slide groove 1 located at the bottom. The spring 6 is configured to be tensioned and moved downward when the support roller 5 located at the bottom is subjected to the pressure of the silicon wafer.

[0039] The aforementioned large-size silicon wafer single-wafer cleaning machine also includes a belt drive structure, a transmission tensioning component, a washing component, and a cleaning drive structure.

[0040] See also Figure 5 The belt drive structure is mounted on the fixed plate 2. The belt drive structure is used to drive the shaft 7 to rotate. The belt drive structure includes pulley 1 8, pulley 2 81, pulley 3 82, drive belt 83 and rotating device 1 84. Pulley 2 81 is rotatably connected to the fixed plate 2. Pulley 3 82 is fixedly connected to one end of the shaft 7. The drive belt 83 is drively connected to pulley 1 8, pulley 2 81 and pulley 3 82. The rotating device 1 84 is fixedly connected to the fixed plate 2, and the output end of the rotating device 1 84 passes through the fixed plate 2 and is connected to pulley 2 81. Pulley 3 82 is fixedly connected to one end of the shaft 7.

[0041] The transmission tensioning assembly includes a slide block 2 9 and a spring 2 91. The slide block 2 9 is slidably connected to the fixed plate 2, and the spring 2 91 is fixedly connected to the bottom end of the slide block 2 9.

[0042] The fixed plate 2 is provided with a slide groove 2 for sliding the slide block 2 9. The spring 2 91 is provided in the slide groove 2, and one end of the spring 2 91 is fixedly connected to the inner wall of the slide groove 2. The pulley 1 8 is rotatably connected to the slide block 2 9.

[0043] Specifically, after the silicon wafer is positioned on the three support rollers 5, the rotating device 84 drives the pulley 81 to rotate. Under the action of the transmission belt 83, the pulley 82 can drive the support roller 5 located at the bottom to rotate through the shaft 7, so that the silicon wafer can achieve a rotating cleaning effect.

[0044] It is worth noting that since the support roller 5 at the bottom can move in the longitudinal direction, the slide 2 9 can move down along with the pulley 3 82, which can drive the pulley 1 8 to move down. The spring 2 91 provides transmission tension for the pulley 1 8, which makes it easy to adjust the transmission position of the transmission belt 83 to ensure the effectiveness of the pulley and belt transmission. In addition, since the weight of the belt transmission structure does not act on the support roller 5 when the entire belt transmission structure provides rotational drive for the support roller 5, this driving method allows the spring 1 6 to compress and deform solely under the gravity of the silicon wafer, thus ensuring the tension of the three support rollers 5 in the rolling and limiting of the silicon wafer.

[0045] See also Figure 6The washing assembly includes a pair of washing rollers 10, with a gap between the pair of washing rollers 10 for inserting silicon wafers. The washing rollers 10 of this application can be made of sponge material to clean the surface of the silicon wafers. The size of the gap should be relatively smaller than the thickness of the silicon wafer. When it is convenient to insert the silicon wafer locally, the friction of the washing rollers 10 and the flexibility of the material are used to increase the safe friction of the silicon wafer feeding. In this way, the rotating washing rollers 10 can be used to drive the silicon wafer to move and feed until it is fed onto the support roller 5 located at the bottom. In this way, the silicon wafer can achieve a stable feeding effect. Sliding tensioning components are provided at both ends of the pair of washing rollers 10.

[0046] The cleaning rollers 10 in this application are used in two ways. One way is to spray the cleaning liquid in conjunction with the spray system 3 and control the relative rotation of a pair of cleaning rollers 10 to act on both ends of the silicon wafer. At the same time, the support rollers 5 drive the silicon wafer to rotate for cleaning. In this way, the cleaning rollers 10 can achieve a brushing effect on the silicon wafer. The other way is to use a sliding tensioning component to provide a relatively inward contraction tension for a pair of cleaning rollers 10. By using the gap insertion, the pair of cleaning rollers 10 are controlled to rotate for feeding. When feeding the silicon wafer, the pair of cleaning rollers 10 can provide elastic tightening for rolling feeding to stably drive the silicon wafer to move downward. In this way, the silicon wafer cleaning can achieve the effect of transmission feeding, with high feeding stability and the effect of centering and alignment, so as to avoid collision damage during silicon wafer feeding.

[0047] The sliding tensioning assembly includes a support plate 11, a pair of slide blocks 311 and a pair of springs 312. The support plate 11 is fixedly connected to the fixed plate 11, the pair of slide blocks 311 are slidably connected to the support plate 11, and the springs 312 are fixedly connected to the side of the slide blocks 311.

[0048] The support plate 11 has a slide groove 3 for sliding the slide block 3 111. The spring 3 112 is set in the slide groove 3, and one end of the spring 3 112 is fixedly connected to the inner wall of the slide groove 3.

[0049] Specifically, the slide block 111 allows the cleaning roller 10 to move laterally, and the spring 112 provides tension to the slide block 111. After the silicon wafer is inserted into the gap, since the gap is smaller than the thickness of the silicon wafer, the pair of cleaning rollers 10 can tension the silicon wafer for feeding.

[0050] See also Figure 7The cleaning drive structure includes a pair of bearing seats 12, a telescopic rod assembly 121, a pair of bevel gears 122, a pair of bevel gears 123, a telescopic rod assembly 124, and a rotating device 125. The pair of bearing seats 12 are fixedly connected to a pair of sliding blocks 111 on the same side. The telescopic rod assembly 121 is rotatably connected to the pair of bearing seats 12, and both ends of the telescopic rod assembly 121 are fixedly connected to the opposite surfaces of the pair of bevel gears 122. The pair of bevel gears 123 are fixedly connected to the shaft ends of a pair of cleaning rollers 10. The pair of bevel gears 122 are meshed with the pair of bevel gears 123. The telescopic rod assembly 124 is rotatably connected to a support plate 11, and one end of the telescopic rod assembly 124 is fixedly connected to one of the bevel gears 122. The rotating device 125 is fixedly connected to the support plate 11, and the output end of the rotating device 125 passes through the support plate 11 and is fixedly connected to the other end of the telescopic rod assembly 124.

[0051] Telescopic rod assembly 121 and telescopic rod assembly 124 have the same structure. Telescopic rod assembly 121 includes an outer tube and a cross-shaped insert rod. The cross-shaped insert rod is movably inserted into the outer tube. In this application, the outer tube and the cross-shaped insert rod of telescopic rod assembly 121 are rotatably connected to the bearing seat 12. One end of the cross-shaped insert rod is fixedly connected to a bevel gear 122. The outer tube of telescopic rod assembly 124 is connected to the output end of the rotating device 125. The cross-shaped insert rod is fixedly connected to another bevel gear 122.

[0052] Specifically, when the silicon wafer is inserted into the gap between a pair of cleaning rollers 10 and is elastically tightened by the pair of cleaning rollers 10, the rotating device 2 125 can drive a bevel gear 122 to rotate through the telescopic rod assembly 2 124. Under the meshing action of the bevel gear 122 and the bevel gear 2 123, the pair of cleaning rollers 10 can rotate relative to each other, thus driving the silicon wafer to move down until it is supported on the support roller 5 at the bottom. When it is necessary to clean the silicon wafer, the support roller 5 drives the silicon wafer to rotate, the spray system 3 sprays cleaning liquid onto the silicon wafer, and the pair of cleaning rollers 10 can brush the surface of the silicon wafer. When it is necessary to remove the cleaned silicon wafer, the cleaning rollers 10 can be rotated in reverse.

[0053] It is worth noting that the telescopic rod assembly is used to transmit power, which can accommodate the rotational transmission of a pair of cleaning rollers with 10 tensioned feeding and brushing, while simultaneously achieving synchronous and opposite-direction transmission effects.

[0054] In this invention, the technical effects brought about by the above embodiments can solve the technical problems that the current silicon wafers are prone to collision at the wafer edge due to excessively fast loading speed or insufficient loading alignment during cleaning, as well as the insufficient transmission and positioning of silicon wafers during the rotation cleaning process, which leads to incomplete cleaning cycle and affects the stability of rotation cleaning.

Claims

1. A large-size silicon wafer single-wafer cleaning machine, comprising a first fixing plate (1), a second fixing plate (2), and a pair of spraying systems (3) for spraying cleaning fluid onto the silicon wafer, wherein the second fixing plate (2) is fixedly connected to the first fixing plate (1), characterized in that: The side of the fixed plate (1) is slidably connected to three slide blocks (4), and each slide block (4) is rotatably connected to a support roller (5) for rolling support of silicon wafers. The three support rollers (5) form a triangular structure. A spring (6) is provided at the bottom of one of the slide blocks (4), and the spring (6) is provided on the fixed plate (1). One of the support rollers (5) is fixedly connected to a shaft (7), and the other two support rollers (5) are rotatably connected to connecting rods (71), and a pair of connecting rods (71) are rotatably connected to the shaft (7); A belt drive structure is provided on the fixed plate 2 (2) and is used to drive the shaft (7) to rotate. A transmission tensioning assembly is disposed on the fixed plate two (2) and the belt drive structure; A washing assembly, the washing assembly including a pair of washing rollers (10), a gap for inserting silicon wafers is provided between the pair of washing rollers (10), and sliding tensioning components are provided at both ends of the pair of washing rollers (10). A cleaning drive structure is disposed on the sliding tension assembly, and the cleaning drive structure is used to drive a pair of cleaning rollers (10) to rotate relative to each other; The belt drive structure includes pulley one (8), pulley two (81), pulley three (82), drive belt (83) and rotating device one (84). The pulley two (81) is rotatably connected to the fixed plate two (2). The drive belt (83) is drivenly connected to the pulley one (8), pulley two (81) and pulley three (82). The rotating device one (84) is fixedly connected to the fixed plate two (2), and the output end of the rotating device one (84) passes through the fixed plate two (2) and is connected to the pulley two (81). The pulley three (82) is fixedly connected to one end of the shaft (7). The transmission tensioning assembly includes a slide block two (9) and a spring two (91). The slide block two (9) is slidably connected to the fixed plate two (2), and the spring two (91) is fixedly connected to the bottom end of the slide block two (9). The sliding tensioning assembly includes a support plate (11), a pair of slide blocks (111) and a pair of spring blocks (112). The support plate (11) is fixedly connected to the fixed plate (1), and the pair of slide blocks (111) are slidably connected to the support plate (11). The spring blocks (112) are fixedly connected to the side of the slide blocks (111).

2. The large-size silicon wafer single-wafer cleaning machine according to claim 1, characterized in that: Two of the slide blocks (4) are slidably connected to the fixed plate (1) laterally, and the other slide block (4) is slidably connected to the fixed plate (1) longitudinally. The fixed plate (1) is provided with a groove for the slide block (4) to slide.

3. The large-size silicon wafer single-wafer cleaning machine according to claim 1, characterized in that: The spring (6) is fixedly connected to the bottom of the slide block (4) located at the bottom, and the end of the spring (6) facing away from the slide block (4) is fixedly connected to the slide groove located at the bottom.

4. A large-size silicon wafer single-wafer cleaning machine according to claim 1, characterized in that: The fixed plate 2 (2) is provided with a sliding groove 2 for sliding of the slide block 2 (9). The spring 2 (91) is provided in the sliding groove 2, and one end of the spring 2 (91) is fixedly connected to the inner wall of the sliding groove 2. The pulley 1 (8) is rotatably connected to the slide block 2 (9).

5. A large-size silicon wafer single-wafer cleaning machine according to claim 1, characterized in that: The support plate (11) has a sliding groove three for sliding the slide block three (111), and the spring three (112) is disposed in the sliding groove three, and one end of the spring three (112) is fixedly connected to the inner wall of the sliding groove three.

6. A large-size silicon wafer single-wafer cleaning machine according to claim 1, characterized in that: The cleaning drive structure includes a pair of bearing seats (12), a telescopic rod assembly (121), a pair of bevel gears (122), a pair of bevel gears (123), a telescopic rod assembly (124), and a rotating device (125). A pair of bearing seats (12) are fixedly connected to a pair of sliding seats (111) on the same side. The telescopic rod assembly one (121) is rotatably connected to a pair of bearing seats (12), and the two ends of the telescopic rod assembly one (121) are fixedly connected to the opposite surfaces of a pair of bevel gears one (122). A pair of bevel gears two (123) are fixedly connected to the shaft ends of a pair of cleaning rollers (10). A pair of bevel gears one (122) are meshed with a pair of bevel gears two (123). The telescopic rod assembly two (124) is rotatably connected to the support plate (11), and one end of the telescopic rod assembly two (124) is fixedly connected to one of the bevel gears one (122). The rotating device two (125) is fixedly connected to the support plate (11), and the output end of the rotating device two (125) passes through the support plate (11) and is fixedly connected to the other end of the telescopic rod assembly two (124).

7. A large-size silicon wafer single-wafer cleaning machine according to claim 6, characterized in that: The telescopic rod assembly one (121) and the telescopic rod assembly two (124) have the same structure. The telescopic rod assembly one (121) includes an outer tube and a cross-shaped insert rod, which is movably inserted into the outer tube.

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