A single crystal silicon wafer edge repair device and repair process

Abstract

This invention belongs to the field of silicon wafer repair technology, and particularly relates to a device and process for repairing the edge of a monocrystalline silicon wafer. It includes a monocrystalline silicon wafer clamping component, a grinding and repair component on the side of the clamping component, and four grinding stone shells mounted on the grinding and repair component. Two grinding stone support components are crosswise mounted inside each of the four grinding stone shells. Each of the two grinding stone support components has a grinding stone, and the two grinding stones form a certain angle. The two grinding stones forming the angle simultaneously grind and repair the edges and corners on both sides of the monocrystalline silicon wafer, which is more efficient than traditional single-sided grinding. Furthermore, the grinding stone support components on the four grinding stone shells are each equipped with four sets of grinding stones of different roughness, which sequentially grind and repair the edge of the monocrystalline silicon wafer, resulting in a smooth and flat edge after grinding.

Description

Technical Field

[0001] This invention belongs to the field of silicon wafer repair technology, and particularly relates to a device and process for repairing the edge of a single-crystal silicon wafer. Background Technology

[0002] The existing monocrystalline silicon wafer edge repair device only sets up a set of grinding stones perpendicular to the cross section of the monocrystalline silicon wafer to grind the edge surface of the monocrystalline silicon wafer. If there are defects in the edge corners of the monocrystalline silicon wafer, the angle of the grinding stone needs to be adjusted. After grinding one side of the edge corner, the angle of the grinding stone needs to be changed to grind the symmetrical edge corners of the monocrystalline silicon wafer with the same curvature. The operation is troublesome and wastes time.

[0003] For example, patent application number CN202110615968.5 describes a silicon wafer edge repair grinding machine, which includes a frame and a grinding wheel. The front end of the frame has a worktable that can move back and forth. The grinding wheel is located behind the worktable. A silicon wafer alignment device is set in front of the grinding wheel. The silicon wafer alignment device includes a vertically set column welded and fixed to the side of the frame. The upper end of the column is rotatably connected to a swingable support plate through a hinge shaft. The hinge shaft is fixed to the bottom of the support plate. An alignment cylinder is fixed on the support plate. A square plate is fixed to the front end of the push rod of the alignment cylinder. The square plate is set perpendicular to the support plate. A drive mechanism for driving the hinge shaft to rotate or the support plate to swing is fixed on the column. A blocking rod is fixed on the column. A vertically set straightening plate is set on the worktable. The straightening plate is directly opposite the alignment cylinder. However, the disadvantage of this technical solution is that the grinding wheel cannot simultaneously grind and repair the edges and corners of the monocrystalline silicon wafer, making it inconvenient to use and cumbersome to operate. Summary of the Invention

[0004] The purpose of this invention is to provide a device and process for repairing the edge of a single-crystal silicon wafer, in order to solve the problems in the prior art. The specific technical solution is as follows:

[0005] A single-crystal silicon wafer edge repair device includes a single-crystal silicon wafer clamping component, a grinding and repair component on the side of the single-crystal silicon wafer clamping component, four grinding stone shells mounted on the grinding and repair component, two grinding stone support components crosswise mounted inside each of the four grinding stone shells, and grinding stones are mounted on the two grinding stone support components, with the two grinding stones forming a certain angle.

[0006] Furthermore, the polishing stone support component includes a polishing stone support rod, the middle of which rotates on a cylinder two fixed inside the polishing stone shell, one end of the polishing stone support rod is slidably connected to a cylinder one, and the other end of the polishing stone support rod is slidably connected to a slider two.

[0007] Furthermore, the slider two is rotatably connected to the end of the screw four, the screw four is threadedly connected to the polishing stone support rod, the slider two is internally threadedly connected to the screw five, the end of the screw five is fixedly connected to the polishing stone, the cylinder one slides inside the polishing stone shell, the cylinder one is fixedly connected to the pull rod, the pull rod is rotatably connected to the screw three, and the screw three is threadedly connected to the polishing stone shell.

[0008] Furthermore, the grinding and repair component includes a base frame one, which is fixedly connected to a single-crystal silicon wafer fixing component. A base frame two is slidably connected to the base frame one, and the base frame two is rotatably connected to the end of a screw one. The screw one is threadedly connected to one side wall of the base frame. A base frame three is slidably connected inside the base frame two, and the base frame three is rotatably connected to the end of the screw two. The screw two is threadedly connected to the side wall of the base frame two.

[0009] Furthermore, a central rod is rotatably connected to the upper end of the second base frame, and a locking block three is slidably connected to the central rod. The front end of the locking block three is locked onto the side wall of the third base frame. One end of the locking block three is fixed to the spring three, and the other end of the spring three is fixed to the end of the central rod. A square frame is fixed in the middle of the central rod, and four polishing stone shells are fixed to the outside of the square frame. Multiple reinforcing ribs are provided at the connection between the four polishing stone shells and the square frame.

[0010] Furthermore, the single-crystal silicon wafer clamping component includes a frame, on which a silicon wafer support is fixed. The silicon wafer support consists of a bottom arc frame, a left support wall, and a right support wall. The bottom arc frame is fixed to the frame, and the left and right support walls are fixed to both sides of the bottom arc frame. A fixing tube is fixed to the right support wall. A sliding tube is slidably connected to the outside of the fixing tube, and an outer rotating tube is rotatably connected to the outside of the sliding tube. An inner rotating tube is rotatably connected to the right support wall and the fixing tube. A spiral push rod is internally threaded to the inner rotating tube. One end of the fixing tube is fixedly connected to a spring, and the other end of the spring is fixed to the sliding tube.

[0011] Furthermore, the outer rotating tube is rotatably connected to one end of the connecting plate, and the inner rotating wheel is rotatably connected to the other end of the connecting plate. The inner rotating wheel is rotatably connected to the rotating rod, and the inner rotating wheel is slidably connected to a protrusion fixed on the rotating rod. Multiple locking blocks are slidably connected to the outer side of the inner rotating wheel, and a spring is provided between the locking block and the inner rotating wheel. The inner rotating wheel is rotatably connected to the outer rotating wheel, and the locking block is slidably connected to the outer rotating wheel. The rotating rod is connected to the output end of the motor, and the motor is fixed on the frame. The outer rotating tube is connected to one end of the belt for transmission, and the other end of the belt is connected to the outer rotating wheel for transmission.

[0012] Furthermore, the rotating rod is rotatably connected to the frame, and a gear one is fixed at the end of the rotating rod. Gear one meshes with gear two, gear two meshes with gear three, and gear three meshes with gear four. Gear one, gear two, gear three, and gear four are all rotatably connected to the left support wall. Gear four is fixedly connected to the rotating shaft. The rotating shaft is slidably connected to the spiral push rod two. The spiral push rod two is threadedly connected to the inner rotating tube two. The inner rotating tube two is rotatably connected to the left support wall, and a gear groove is provided on the outer side of the inner rotating tube two.

[0013] Furthermore, a cylinder is fixed on the frame, the cylinder output end is connected to a push rod, the push rod is fixedly connected to a connecting plate, a connecting rod is fixed to the end of the push rod, a second locking block is fixed to the end of the connecting rod, the outer rotating tube is rotatably connected to one end of four bent rods, the other end of the four bent rods is rotatably connected to four sliders, the four sliders slide in the four-leaf bracket, the four-leaf bracket is fixed on the sliding tube, and the sliders are fixedly connected to the arc-shaped clamp.

[0014] A single-crystal silicon wafer edge repair process, applied to any of the single-crystal silicon wafer edge repair devices described above, includes the following steps:

[0015] S1. Fix the monocrystalline silicon wafer at the center of the monocrystalline silicon wafer clamping component;

[0016] S2. Move the polishing and repairing component closer to the single-crystal silicon wafer clamping component so that the two polishing stones forming a certain angle fit against the edges of both sides of the single-crystal silicon wafer.

[0017] S3. The single-crystal silicon wafer clamping component drives the single-crystal silicon wafer to rotate, and two polishing stones forming a certain angle simultaneously polish and repair the edges on both sides of the single-crystal silicon wafer.

[0018] The advantages of this invention are:

[0019] Two grinding stones forming a certain angle simultaneously grind and repair the edges and corners on both sides of the monocrystalline silicon wafer, which is more efficient than traditional single-sided grinding. At the same time, the grinding stone support components on the four grinding stone shells are equipped with four sets of grinding stones with different roughness, which grind and repair the edges of the monocrystalline silicon wafer in turn, making the edges of the polished monocrystalline silicon wafer smooth and flat. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 ;

[0021] Figure 2 This is a schematic diagram of the overall structure of the present invention. Figure 2 ;

[0022] Figure 3 This is a schematic diagram of the structure of the single-crystal silicon wafer clamping component of the present invention. Figure 1 ;

[0023] Figure 4 This is a schematic diagram of the structure of the single-crystal silicon wafer clamping component of the present invention. Figure 2 ;

[0024] Figure 5 This is a schematic diagram of the structure of the single-crystal silicon wafer clamping component of the present invention. Figure 3 ;

[0025] Figure 6This is a schematic diagram of the structure of the single-crystal silicon wafer clamping component of the present invention. Figure 4 ;

[0026] Figure 7 This is a schematic diagram of the structure of the single-crystal silicon wafer clamping component of the present invention. Figure 5 ;

[0027] Figure 8 This is a schematic diagram of the structure of the single-crystal silicon wafer clamping component of the present invention. Figure 6 ;

[0028] Figure 9 This is a schematic diagram of the grinding and repair component structure of the present invention. Figure 1 ;

[0029] Figure 10 This is a schematic diagram of the grinding and repair component structure of the present invention. Figure 2 ;

[0030] Figure 11 This is a schematic diagram of the grinding and repair component structure of the present invention. Figure 3 ;

[0031] Figure 12 This is a schematic diagram of the grinding and repair component structure of the present invention. Figure 4 ;

[0032] Explanation of markings in the diagram:

[0033] 1. Frame; 2. Bottom arc frame; 3. Left support wall; 4. Right support wall; 5. Fixed tube; 6. Sliding tube; 7. Outer rotating tube; 8. Inner rotating tube one; 9. Helical push rod one; 10. Spring one; 11. Connecting plate; 12. Belt; 13. Motor; 14. Rotating rod; 15. Protrusion; 16. Inner rotating wheel; 17. Spring two; 18. Locking block one; 19. Outer rotating wheel; 20. Gear one; 21. Gear two; 22. Gear three; 23. Gear four; 24. Rotating shaft; 25. Helical push rod two; 26. Inner rotating tube two; 27. Cylinder; 28. Push rod; 29. ​​Connecting rod; 3 0. Locking Block Two; 31. Gear Groove; 32. Bent Rod; 33. Slider One; 34. Four-Leaf Bracket; 35. Arc-Shaped Clamping Plate; 36. Base Frame One; 37. Screw One; 38. Base Frame Two; 39. Screw Two; 40. Base Frame Three; 41. Center Rod; 42. Locking Block Three; 43. Spring Three; 44. Square Frame; 45. Polishing Stone Shell; 46. Screw Three; 47. Pull Rod; 48. Cylinder One; 49. Polishing Stone Support Rod; 50. Cylinder Two; 51. Slider Two; 52. Screw Four; 53. Screw Five; 54. Polishing Stone; 55. Reinforcing Rib; 56. Gear Protective Shell. Detailed Implementation

[0034] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0036] Example 1

[0037] like Figure 1-12 As shown, a single-crystal silicon wafer edge repair device includes a single-crystal silicon wafer clamping component, a grinding and repair component on the side of the single-crystal silicon wafer clamping component, four grinding stone shells 45 mounted on the grinding and repair component, two grinding stone support components crosswise mounted inside each of the four grinding stone shells 45, and grinding stones 54 are provided on each of the two grinding stone support components, with the two grinding stones 54 forming a certain angle.

[0038] The working principle of the above technical solution is as follows: A monocrystalline silicon wafer is fixed at the center of a monocrystalline silicon wafer clamping component. The clamping component can rotate the monocrystalline silicon wafer, moving the polishing and repair component closer to the clamping component. This causes the polishing stone housing 45 on one side and its two polishing stone support components to move closer to the clamping component, so that the two polishing stones 54, forming a certain angle, fit against the edges of both sides of the monocrystalline silicon wafer. As the monocrystalline silicon wafer rotates continuously, the two polishing stones 54 at a certain angle simultaneously polish and repair the edges of both sides of the monocrystalline silicon wafer, resulting in high polishing and repair efficiency. The four polishing stone housings 45... The polishing stone support component is equipped with four sets of polishing stones 54 with different roughness. First, the two polishing stones 54 used for polishing the monocrystalline silicon wafer have rough surfaces, which speeds up the polishing and repair of the monocrystalline silicon wafer edge. The polishing and repair component is rotated 90 degrees, so that the two polishing stones 54 with fine surfaces can polish the monocrystalline silicon wafer edge. The polishing and repair component is rotated 90 degrees again, so that the two polishing stones 54 with even finer surfaces can polish the monocrystalline silicon wafer edge. The polishing and repair component is rotated 90 degrees again, so that the two polishing stones 54 with the finest surfaces can polish the monocrystalline silicon wafer edge, making the monocrystalline silicon wafer edge smooth and flat.

[0039] The beneficial effects of the above technical solution are as follows: two polishing stones 54 forming a certain angle simultaneously polish and repair the edges on both sides of the monocrystalline silicon wafer, which is more efficient than traditional single-sided polishing. At the same time, the polishing stone support components on the four polishing stone shells 45 are respectively equipped with four sets of polishing stones 54 with different roughness, which polish and repair the edges of the monocrystalline silicon wafer in turn, so that the edges of the polished monocrystalline silicon wafer are smooth and flat.

[0040] Example 2

[0041] like Figure 1-12 As shown, the polishing stone support component includes a polishing stone support rod 49, the middle of which rotates on a cylinder 50 inside the polishing stone housing 45. One end of the polishing stone support rod 49 is slidably connected to a cylinder 48, and the other end of the polishing stone support rod 49 is slidably connected to a slider 51.

[0042] The slider 2 51 is rotatably connected to the end of the screw 4 52. The screw 4 52 is threadedly connected to the polishing stone support rod 49. The slider 2 51 is internally threaded with the screw 53. The end of the screw 53 is fixedly connected to the polishing stone 54. The cylinder 1 48 slides inside the polishing stone shell 45. The cylinder 1 48 is fixedly connected to the pull rod 47. The pull rod 47 is rotatably connected to the screw 3 46. The screw 3 46 is threadedly connected to the polishing stone shell 45.

[0043] The working principle of the above technical solution is as follows: Rotating the two screws 53 causes the two polishing stones 54 to rotate respectively. The slider 2 51 rotates threadedly with the screws 53, causing the screws 53 and polishing stones 54 to move forward or backward relative to the slider 2 51, thereby changing the distance between the two polishing stones 54 and thus adapting to single-crystal silicon wafers of different thicknesses. Rotating the screw 42 causes the screw 42 to rotate threadedly with the polishing stone support rod 49, causing the slider 2 51 to slide with the polishing stone support rod 49, thereby changing the position of the screws 53 and polishing stones 54, and thus adjusting the position of the two polishing stones 54. Rotating the screw 3 4... 6. The grinding stone housing 45 and the screw 46 rotate in a threaded manner. The screw 46 drives the pull rod 47 to move, and the pull rod 47 pulls the cylinder 48 to move, which in turn drives the two grinding stone support rods 49 to rotate about the two cylinders 50. This changes the included angle between the two grinding stone support rods 49, which in turn changes the angle between the two grinding stones 54, and thus changes the angle at which the edge of the monocrystalline silicon wafer is ground. Because some uneven areas of the monocrystalline silicon wafer are biased towards the transverse surface, and some uneven areas of the monocrystalline silicon wafer are biased towards the circumferential surface, the angle between the two grinding stones 54 can be adjusted according to the uneven position of the edge of the monocrystalline silicon wafer.

[0044] Example 3

[0045] like Figure 1-12As shown, the grinding and repair component includes a base frame 36, which is fixedly connected to a single-crystal silicon wafer fixing component. A base frame 38 is slidably connected to the base frame 36. The base frame 38 is rotatably connected to the end of a screw 37. The screw 37 is threadedly connected to the side wall of the base frame 36. A base frame 40 is slidably connected inside the base frame 38. The base frame 40 is rotatably connected to the end of a screw 39. The screw 39 is threadedly connected to the side wall of the base frame 38.

[0046] A central rod 41 is rotatably connected to the upper end of the base frame 38. A locking block 42 is slidably connected to the central rod 41. The front end of the locking block 42 is locked onto the side wall of the base frame 3 40. One end of the locking block 42 is fixed to the spring 43. The other end of the spring 43 is fixed to the end of the central rod 41. A square frame 44 is fixed in the middle of the central rod 41. Four polishing stone shells 45 are fixed to the outside of the square frame 44. Multiple reinforcing ribs 55 are provided at the connection between the four polishing stone shells 45 and the square frame 44.

[0047] The working principle of the above technical solution is as follows: Rotating screw 39 causes base frame 38 to rotate threadedly with screw 39, which in turn causes base frame 40 to slide within base frame 38. This causes two polishing stones 54 to move parallel to the direction of the single-crystal silicon wafer clamping component, so that the two polishing stones 54 are symmetrically positioned on both sides of the single-crystal silicon wafer. Rotating screw 37 causes base frame 36 to rotate threadedly with screw 37, which in turn causes base frame 38 to slide within base frame 36. This causes the two polishing stones 54 to move closer to the single-crystal silicon wafer clamping component, where they rest against the edges of the single-crystal silicon wafer. The single-crystal silicon wafer clamping component causes the single-crystal silicon wafer to rotate, and the two polishing stones... Stone 54 polishes and repairs the edge of the monocrystalline silicon wafer. Pulling back the locking block 42 causes it to slide against the center rod 41, separating the front end of the locking block 42 from the base frame 4, which compresses the spring 43. Simultaneously, the locking block 42 rotates 90 degrees, causing the center rod 41 to rotate 90 degrees, which in turn causes the square frame 44 to rotate 90 degrees. This causes another set of polishing stones 54 with different roughness to rotate to the corresponding side of the monocrystalline silicon wafer, performing fine polishing on the monocrystalline silicon wafer. In this manner, four sets of polishing stones 54 with different roughness are rotated to the corresponding side of the monocrystalline silicon wafer to polish and repair the monocrystalline silicon wafer until the edge of the monocrystalline silicon wafer is polished smooth and flat.

[0048] Example 4

[0049] like Figure 1-12As shown, the single-crystal silicon wafer clamping component includes a frame 1, on which a silicon wafer support is fixed. The silicon wafer support consists of a bottom arc frame 2, a left support wall 3, and a right support wall 4. The bottom arc frame 2 is fixed on the frame 1, and the left support wall 3 and the right support wall 4 are fixed on both sides of the bottom arc frame 2. A fixing tube 5 is fixed on the right support wall 4. A sliding tube 6 is slidably connected to the outside of the fixing tube 5. An outer rotating tube 7 is rotatably connected to the outside of the sliding tube 6. An inner rotating tube 8 is rotatably connected to the right support wall 4 and the fixing tube 5. A spiral push rod 9 is threadedly connected to the inner rotating tube 8. One end of the fixing tube 5 is fixedly connected to a spring 10, and the other end of the spring 10 is fixed to the sliding tube 6.

[0050] The outer rotating tube 7 is rotatably connected to one end of the connecting plate 11, and the inner rotating wheel 16 is rotatably connected to the other end of the connecting plate 11. The inner rotating wheel 16 is rotatably connected to the rotating rod 14, and the inner rotating wheel 16 is slidably connected to the protrusion 15 fixed on the rotating rod 14. Multiple locking blocks 18 are slidably connected to the outer side of the inner rotating wheel 16. A spring 17 is provided between the locking block 18 and the inner rotating wheel 16. The inner rotating wheel 16 is rotatably connected to the outer rotating wheel 19, and the locking block 18 is slidably connected to the outer rotating wheel 19. The rotating rod 14 is connected to the output end of the motor 13. The motor 13 is fixed on the frame 1. The outer rotating tube 7 is connected to one end of the belt 12 in a transmission engagement, and the other end of the belt 12 is connected to the outer rotating wheel 19 in a transmission engagement.

[0051] Rotating rod 14 is rotatably connected to frame 1. Gear 1 20 is fixed at the end of rotating rod 14. Gear 1 20 meshes with gear 2 21, gear 2 21 meshes with gear 3 22, gear 3 22 meshes with gear 4 23. Gear 1 20, gear 2 21, gear 3 22 and gear 4 23 are all rotatably connected to left support wall 3. Gear 4 23 is fixedly connected to rotating shaft 24. Rotating shaft 24 is slidably connected to spiral push rod 25. Spiral push rod 25 is threadedly connected to inner rotating tube 26. Inner rotating tube 26 is rotatably connected to left support wall 3. Gear groove 31 is provided on the outer side of inner rotating tube 26.

[0052] A cylinder 27 is fixed on the frame 1. The output end of the cylinder 27 is connected to the push rod 28. The push rod 28 is fixedly connected to the connecting plate 11. A connecting rod 29 is fixed to the end of the push rod 28. A second locking block 30 is fixed to the end of the connecting rod 29. The outer rotating tube 7 is rotatably connected to one end of four bent rods 32. The other end of the four bent rods 32 is rotatably connected to four sliders 33 respectively. The four sliders 33 slide in the four-leaf bracket 34. The four-leaf bracket 34 is fixed on the slide tube 6. The sliders 33 are fixedly connected to the arc-shaped clamp 35.

[0053] A gear protective shell 56 is fixed on the left support wall 3. The gear protective shell 56 encloses gear 1 20, gear 2 21, gear 3 22 and gear 4 23 to prevent gear 1 20, gear 2 21, gear 3 22 and gear 4 23 from accidentally injuring the operator during rotation.

[0054] The working principle of the above technical solution is as follows: The monocrystalline silicon wafer to be repaired is placed between the left support wall 3 and the right support wall 4, with the lower end of the monocrystalline silicon wafer abutting against the bottom arc frame 2. The monocrystalline silicon wafer is located between the spiral push rod 1 9 and the spiral push rod 25. The cylinder 27 is activated, which drives the push rod 28 to move forward. The push rod 28 drives the connecting plate 11 to move forward. At one end of the connecting plate 11, the connecting plate 11 drives the outer rotating tube 7 to move forward, which drives the slide tube 6 to slide forward on the fixed tube 5. This causes the spring 10 to be compressed, which drives the four-leaf blade fixed on the outer rotating tube 7. The bracket 34 moves forward, driving the four bent rods 32 and the four sliders 33 to move forward, and driving the four arc-shaped clamps 35 to move to the outer periphery of the monocrystalline silicon wafer. At the other end of the connecting plate 11, the connecting plate 11 drives the inner rotating wheel 16 to slide forward on the rotating rod 14. The protrusion 15 is located inside the inner rotating wheel 16. The belt 12, the second spring 17, the first clamp 18 and the outer rotating wheel 19 follow the inner rotating wheel 16 to move forward. At the same time, the push rod 28 moves forward, driving the connecting rod 29 to move forward, and driving the second clamp 30 to move forward and engage in the gear groove 31.

[0055] The starter motor 13 drives the rotating rod 14 to rotate, which in turn drives the inner rotating wheel 16 to rotate. This causes the spring 17 and the locking block 18 to rotate with the inner rotating wheel 16. The locking block 18 presses against the protrusion inside the outer rotating wheel 19, causing the outer rotating wheel 19 to rotate. This causes the belt 12 to rotate, which in turn drives the outer rotating tube 7 to rotate. This causes the ends of the four bent rods 32 to rotate with the outer rotating tube 7. The other end of the bent rods 32 pulls the slider 33 to slide inward on the four-leaf bracket 34, causing the four arc-shaped clamps 35 to move together. The four arc-shaped clamps 35 fix the monocrystalline silicon wafer, ensuring that the center position of the monocrystalline silicon wafer is consistent with the center position of the outer rotating tube 7. This ensures that the monocrystalline silicon wafer rotates concentrically during later rotation, avoiding eccentric rotation that could affect the edge polishing and repair of the monocrystalline silicon wafer.

[0056] After the four arc-shaped clamping plates 35 clamp and fix the monocrystalline silicon wafer, the four sliders 33 can no longer move inward on the four-leaf bracket 34, the bent rod 32 cannot rotate, the outer rotating tube 7 cannot rotate, and therefore the belt 12 and the outer rotating wheel 19 cannot rotate either. At this time, the inner rotating wheel 16 continues to rotate. At this time, the clamping block 18 presses the protrusion inside the outer rotating wheel 19. Since the outer rotating wheel 19 cannot rotate, the clamping block 18 slides into the inner rotating wheel 16, which causes the spring 17 to be compressed and the inner rotating wheel 16 to pass over the protrusion inside the outer rotating wheel 19. This causes the clamping block 18 to slide relative to the protrusion inside the outer rotating wheel 19, thus preventing the rotating rod 14 from rotating continuously and the outer rotating wheel 19 from being unable to rotate, which could cause damage to the device.

[0057] Rotating rod 14 continues to rotate, driving gear 1 20 to rotate, driving gear 21 and gear 3 22 to rotate, driving gear 4 23 to rotate, driving rotating shaft 24 and spiral push rod 25 to rotate. Since gear groove 31 is blocked and limited by locking block 2 30, inner rotating tube 2 26 cannot rotate, causing spiral push rod 2 25 to rotate with inner rotating tube 2 26, causing spiral push rod 2 25 to move forward, causing rotating shaft 24 to slide with spiral push rod 2 25, thereby shortening the distance between spiral push rod 1 9 and spiral push rod 2 25, and thus clamping and fixing the single crystal silicon wafer through spiral push rod 1 9 and spiral push rod 2 25.

[0058] Rotating rod 14 continues to rotate. After the spiral push rod 19 and spiral push rod 25 clamp and fix the monocrystalline silicon wafer, cylinder 27 is activated again, causing push rod 28 to retract and move, which in turn moves connecting plate 11 backward. At one end of connecting plate 11, connecting plate 11 pulls outer rotating tube 7 backward, causing slide tube 6 to slide backward on fixed tube 5, causing four-leaf bracket 34 to move backward, causing four bent rods 32 and four sliders 1 33 to move backward, causing four arc-shaped clamping plates 35 to separate from the monocrystalline silicon wafer. At the other end of connecting plate 11, connecting plate 11 pulls inner rotating wheel 16, spring 2 17 and clamping block 1 18 backward. The belt 12 and outer wheel 19 move backward, the inner wheel 16 separates from the protrusion 15, and when the rotating rod 14 rotates, it cannot drive the inner wheel 16 to rotate. The push rod 28 retracts and moves, driving the connecting rod 29 to retract and move, driving the second locking block 30 to separate from the gear groove 31. Then, after the inner rotating tube 26 loses the limit of the second locking block 30, when the gear 4 23 drives the rotating shaft 24 and the spiral push rod 25 to rotate, it drives the spiral push rod 25, the inner rotating tube 26, the single crystal silicon wafer, the inner rotating tube 1 8 and the spiral push rod 1 9 to rotate as a whole, thereby driving it to rotate around its own center. The two polishing stones 54 polish its edges.

[0059] The beneficial effects of the above technical solution are: it can fix monocrystalline silicon wafers of different diameters and quickly fix them at the center of the monocrystalline silicon wafer to prevent eccentric rotation during rotation, which would affect the subsequent polishing effect. Only one motor and one cylinder are needed to complete the fixing and rotation of the monocrystalline silicon wafer through linkage. It is easy to operate, saves energy, and is quick to install.

[0060] Example 5

[0061] like Figure 1-12 As shown, a single-crystal silicon wafer edge repair process, applied to any of the single-crystal silicon wafer edge repair devices described above, includes the following steps:

[0062] S1. Fix the monocrystalline silicon wafer at the center of the monocrystalline silicon wafer clamping component;

[0063] S2. Move the polishing and repairing component closer to the single-crystal silicon wafer clamping component so that the two polishing stones 54 forming a certain angle fit against the edges of both sides of the single-crystal silicon wafer.

[0064] S3. The single-crystal silicon wafer clamping component drives the single-crystal silicon wafer to rotate, forming two polishing stones 54 at a certain angle to simultaneously polish and repair the edges on both sides of the single-crystal silicon wafer.

[0065] The working principle of the above technical solution is as follows: A monocrystalline silicon wafer is fixed at the center of a monocrystalline silicon wafer clamping component. The clamping component can rotate the monocrystalline silicon wafer, moving the polishing and repair component closer to the clamping component. This causes the polishing stone shell 45 on one side and its two polishing stone support components to move closer to the clamping component, so that the two polishing stones 54, forming a certain angle, fit against the edges of both sides of the monocrystalline silicon wafer. As the monocrystalline silicon wafer rotates continuously, the two polishing stones 54 at a certain angle simultaneously polish and repair the edges of both sides of the monocrystalline silicon wafer, resulting in high polishing and repair efficiency. The polishing stone support components on the four polishing stone shells 45 are respectively equipped with four sets of polishing stones 54 with different roughness levels. The two polishing stones 54 that first polish the monocrystalline silicon wafer have rough surfaces, accelerating the edge polishing of the monocrystalline silicon wafer. The grinding and repair component is rotated 90 degrees, allowing the two finer grinding stones 54 to finely grind the edge of the monocrystalline silicon wafer. The component is then rotated 90 degrees again, allowing the two even finer grinding stones 54 to finely grind the edge of the monocrystalline silicon wafer. Finally, the component is rotated 90 degrees again, allowing the two finest grinding stones 54 to polish the edge of the monocrystalline silicon wafer, resulting in a smooth and flat edge. Two grinding stones 54 at a certain angle simultaneously grind and repair the edges on both sides of the monocrystalline silicon wafer, which is more efficient than traditional single-sided grinding. Simultaneously, the grinding stone support components on the four grinding stone shells 45 are equipped with four sets of grinding stones 54 of different roughness, which grind and repair the edge of the monocrystalline silicon wafer in sequence, resulting in a smooth and flat edge after grinding.

[0066] It is understood that the present invention has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the invention. Furthermore, under the teachings of the present invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present invention.

Claims

1. A device for repairing the edge of a single-crystal silicon wafer, characterized in that, It includes a single crystal silicon wafer clamping component, a grinding and repair component on the side of the single crystal silicon wafer clamping component, and four grinding stone shells (45) installed on the grinding and repair component. Two grinding stone support components are installed crosswise inside each of the four grinding stone shells (45). Two grinding stone support components are installed on each of the two grinding stone support components, and the two grinding stones (54) form a certain angle. The polishing stone support component includes a polishing stone support rod (49), the middle of which rotates on a cylinder two (50) inside a fixed polishing stone shell (45). One end of the polishing stone support rod (49) is slidably connected to a cylinder one (48), and the other end of the polishing stone support rod (49) is slidably connected to a slider two (51). The single-crystal silicon wafer clamping component includes a frame (1), on which a silicon wafer support is fixed. The silicon wafer support consists of a bottom arc frame (2), a left support wall (3), and a right support wall (4). The bottom arc frame (2) is fixed on the frame (1), and the left support wall (3) and the right support wall (4) are fixed on both sides of the bottom arc frame (2). A fixing tube (5) is fixed on the right support wall (4). A sliding tube (6) is slidably connected to the outside of the fixing tube (5). An outer rotating tube (7) is rotatably connected to the outside of the sliding tube (6). An inner rotating tube (8) is rotatably connected to the right support wall (4) and the fixing tube (5). A spiral top rod (9) is threadedly connected to the inner rotating tube (8). One end of the fixing tube (5) is fixedly connected to a spring (10), and the other end of the spring (10) is fixed on the sliding tube (6). The outer rotating tube (7) is rotatably connected to one end of the connecting plate (11), and the inner rotating wheel (16) is rotatably connected to the other end of the connecting plate (11). The inner rotating wheel (16) is rotatably connected to the rotating rod (14), and the inner rotating wheel (16) is slidably connected to the protrusion (15) fixed on the rotating rod (14). Multiple locking blocks (18) are slidably connected to the outer side of the inner rotating wheel (16). A spring (17) is provided between the locking block (18) and the inner rotating wheel (16). The inner rotating wheel (16) is rotatably connected to the outer rotating wheel (19), and the locking block (18) is slidably connected to the outer rotating wheel (19). The rotating rod (14) is connected to the output end of the motor (13). The motor (13) is fixed on the frame (1). The outer rotating tube (7) is connected to one end of the belt (12) in a transmission cooperation, and the other end of the belt (12) is connected to the outer rotating wheel (19) in a transmission cooperation. The rotating rod (14) is rotatably connected to the frame (1). Gear 1 (20) is fixed at the end of the rotating rod (14). Gear 1 (20) meshes with gear 2 (21), gear 2 (21) meshes with gear 3 (22), gear 3 (22) meshes with gear 4 (23). Gear 1 (20), gear 2 (21), gear 3 (22) and gear 4 (23) are all rotatably connected to the left support wall (3). Gear 4 (23) is fixedly connected to the rotating shaft (24). The rotating shaft (24) is slidably connected to the spiral top rod 2 (25). The spiral top rod 2 (25) is threadedly connected to the inner rotating tube 2 (26). The inner rotating tube 2 (26) is rotatably connected to the left support wall (3). The outer side of the inner rotating tube 2 (26) is provided with a gear groove (31). A cylinder (27) is fixed on the frame (1). The output end of the cylinder (27) is connected to the push rod (28). The push rod (28) is fixedly connected to the connecting plate (11). A connecting rod (29) is fixed at the end of the push rod (28). A second locking block (30) is fixed at the end of the connecting rod (29). The outer rotating tube (7) is rotatably connected to one end of the four bent rods (32). The other end of the four bent rods (32) is rotatably connected to the four sliders (33). The four sliders (33) slide in the four-leaf bracket (34). The four-leaf bracket (34) is fixed on the sliding tube (6). The sliders (33) are fixedly connected to the arc-shaped clamp (35).

2. The single-crystal silicon wafer edge repair device according to claim 1, characterized in that, The slider two (51) is rotatably connected to the end of the screw four (52), the screw four (52) is threadedly connected to the polishing stone support rod (49), the slider two (51) is internally threaded with the screw five (53), the end of the screw five (53) is fixedly connected to the polishing stone (54), the cylinder one (48) slides inside the polishing stone shell (45), the cylinder one (48) is fixedly connected to the pull rod (47), the pull rod (47) is rotatably connected to the screw three (46), and the screw three (46) is threadedly connected to the polishing stone shell (45).

3. The single-crystal silicon wafer edge repair device according to claim 2, characterized in that, The grinding and repair component includes a base frame one (36), which is fixedly connected to a single crystal silicon wafer fixing component. A base frame two (38) is slidably connected to the base frame one (36). The base frame two (38) is rotatably connected to the end of a screw one (37). The screw one (37) is threadedly connected to the side wall of the base frame one (36). A base frame three (40) is slidably connected inside the base frame two (38). The base frame three (40) is rotatably connected to the end of a screw two (39). The screw two (39) is threadedly connected to the side wall of the base frame two (38).

4. The single-crystal silicon wafer edge repair device according to claim 3, characterized in that, The upper end of the base frame 2 (38) is rotatably connected to a central rod (41), and a locking block 3 (42) is slidably connected to the central rod (41). The front end of the locking block 3 (42) is locked onto the side wall of the base frame 3 (40). The locking block 3 (42) is fixed to one end of the spring 3 (43), and the other end of the spring 3 (43) is fixed to the end of the central rod (41). A square frame (44) is fixed in the middle of the central rod (41), and four polishing stone shells (45) are fixed to the outside of the square frame (44). Multiple reinforcing ribs (55) are provided at the connection between the four polishing stone shells (45) and the square frame (44).

5. A single-crystal silicon wafer edge repair process, applied to the single-crystal silicon wafer edge repair device according to any one of claims 1-4, characterized in that, Includes the following steps: S1. Fix the monocrystalline silicon wafer at the center of the monocrystalline silicon wafer clamping component; S2. Move the polishing and repairing component closer to the single crystal silicon wafer clamping component so that the two polishing stones (54) forming a certain angle fit against the edges of both sides of the single crystal silicon wafer. S3. The single-crystal silicon wafer clamping component drives the single-crystal silicon wafer to rotate, forming two polishing stones (54) at a certain angle to polish and repair the edges on both sides of the single-crystal silicon wafer at the same time.

Images