A hot-pressing mold and a method for adjusting warpage of a copper-clad ceramic substrate using the same

Abstract

The application provides a hot-pressing mold and a warping adjustment method for a copper-clad ceramic substrate using the same. The hot-pressing mold comprises a base and a cover plate. One side surface of the base is concave, one side surface of the cover plate is convex, the concave surface and the convex surface are matched, and the concave surface and the convex surface are used for placing products for hot-pressing treatment. The maximum depth of the concave surface is 0.15-0.25 mm. The adjustment method comprises placing the product in the hot-pressing mold, performing temperature rising hot-pressing and temperature lowering treatment, and completing the warping of the product. The application adjusts the warping of the copper-clad ceramic substrate in different directions and sizes by using a specially-made hot-pressing mold to perform hot-pressing shaping treatment on the copper-clad ceramic substrate, adjusting the curvature of the hot-pressing mold and the height of the hot-pressing, and ensuring the warping degree of the product without adjusting the copper thickness. The structure is simple and suitable for promotion.

Description

Technical Field

[0001] This invention belongs to the field of copper-clad ceramic substrate shaping technology, and relates to a hot pressing mold and a method for adjusting the warpage of copper-clad ceramic substrates using the same. Background Technology

[0002] Copper-clad ceramic substrates have excellent electrical insulation properties, high thermal conductivity, good thermal cycling performance, excellent solderability, and high adhesion strength. They can also be etched with various patterns like PCB boards. Therefore, they have been widely used in fields such as semiconductor coolers, power semiconductor modules, solid-state relays, high-frequency power switches, hybrid vehicles, and high-power LEDs.

[0003] For copper-clad ceramic substrates used in high-end power devices, the requirements for appearance performance are also gradually increasing. In particular, substrate warpage is a significant concern, as it directly affects the soldering performance of the chip, thus requiring specific warpage rates. However, due to the differences in the coefficients of thermal expansion between copper, ceramic, and the bonding layer, warpage occurs in the sintered copper-clad ceramic substrate, necessitating measures to mitigate this warpage.

[0004] The existing technical solution discloses a process method for improving the warpage of copper-clad ceramic substrates, including attaching flexible pads to both the upper and lower surfaces of the copper-clad ceramic substrate with unqualified warpage values; pressing the upper and lower surfaces of the copper-clad ceramic substrate with the attached flexible pads together using two pressure plates; making the environment in which the copper-clad ceramic substrate is located an oxygen-deficient environment; increasing the temperature of the environment in which the copper-clad ceramic substrate is located; decreasing the temperature of the environment in which the copper-clad ceramic substrate is located to room temperature; and after the temperature of the copper-clad ceramic substrate remains constant, removing the oxygen-deficient environment in which the copper-clad ceramic substrate is located.

[0005] However, existing technologies still have the problem of adjusting the warp direction by varying the copper thickness, and cannot guarantee the direction and size of the warp. Currently, users do not want to change the copper thickness to control the warp. Therefore, it is urgent to design and develop a hot pressing mold and a method for adjusting the warp of copper-clad ceramic substrates using it, to overcome the defects of existing technologies and meet the needs of practical applications. Summary of the Invention

[0006] To address the shortcomings of existing technologies, the present invention aims to provide a hot pressing mold and a method for adjusting the warpage of copper-clad ceramic substrates using the same. In this invention, a specially designed hot pressing mold is used to perform hot pressing and shaping on the copper-clad ceramic substrate. By adjusting the curvature of the hot pressing mold and the height of the hot pressing, warpage of the copper-clad ceramic substrate in different directions and sizes can be achieved. This ensures that the warpage of the product is controlled without adjusting the copper thickness. The structure is simple and suitable for widespread application.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] In a first aspect, the present invention provides a hot pressing mold, the hot pressing mold including a base and a cover plate, one side surface of the base being concave and one side surface of the cover plate being convex, the concave surface and the convex surface being matched and disposed, and the space between the concave surface and the convex surface being used for placing a product for hot pressing; the maximum depth of the concave surface is 0.15 to 0.25 mm.

[0009] In this invention, a specially designed hot-pressing mold is used to hot-press and shape the copper-clad ceramic substrate. By adjusting the curvature of the hot-pressing mold and the height of the hot pressing, the warping of the copper-clad ceramic substrate in different directions and sizes can be achieved. This ensures that the warping of the product is constant without adjusting the copper thickness. The structure is simple and suitable for widespread application.

[0010] It should be noted that the maximum depth of the concave surface in this invention is 0.15 to 0.25 mm, for example, it can be 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm, 0.2 mm, 0.21 mm, 0.22 mm, 0.23 mm, 0.24 mm, 0.25 mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0011] It should be noted that the material of the hot pressing mold in this invention is not specifically limited, and those skilled in the art can make adaptive adjustments according to the actual situation. The maximum depth of the concave surface is the lowest point of the concave surface on the base, and it is concentrically positioned with the highest point of the convex surface and subsequent grooves.

[0012] It should be noted that the hot press mold in this invention is mainly customized according to the actual warp size requirements. The curvature of the hot press mold is mainly based on the maximum depth of the concave surface mentioned above. According to the required warp direction, the etched master plate is placed on the customized hot press mold. If the graphic surface needs to be concave, it is placed on the hot press mold with the graphic surface facing up. If the graphic surface needs to be convex, it is placed on the hot press mold with the graphic surface facing down.

[0013] As a preferred technical solution of the present invention, the length of the base is 70-80mm, for example, it can be 70mm, 71mm, 72mm, 73mm, 74mm, 75mm, 76mm, 77mm, 78mm, 79mm, 80mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0014] Preferably, the width of the base is 70-80mm, for example, it can be 70mm, 71mm, 72mm, 73mm, 74mm, 75mm, 76mm, 77mm, 78mm, 79mm, 80mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0015] Preferably, the height of the base is 10-12mm, for example, it can be 10mm, 10.2mm, 10.4mm, 10.6mm, 10.8mm, 11mm, 11.2mm, 11.4mm, 11.6mm, 11.8mm, 12mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0016] In this invention, the base has a length of 70-80mm, a width of 70-80mm, and a height of 10-12mm. This is because the mold and the product are compatible within this range. If the base is not within this range, the mold and the product will not fit together completely, making the product easy to deform and resulting in a low yield rate.

[0017] As a preferred technical solution of the present invention, the length of the cover plate is 70-80mm, for example, it can be 70mm, 71mm, 72mm, 73mm, 74mm, 75mm, 76mm, 77mm, 78mm, 79mm, 80mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0018] Preferably, the width of the cover plate is 70-80mm, for example, it can be 70mm, 71mm, 72mm, 73mm, 74mm, 75mm, 76mm, 77mm, 78mm, 79mm, 80mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0019] Preferably, the height of the cover plate is 10-12mm, for example, it can be 10mm, 10.2mm, 10.4mm, 10.6mm, 10.8mm, 11mm, 11.2mm, 11.4mm, 11.6mm, 11.8mm, 12mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0020] In this invention, the length of the cover plate is 70-80mm, the width is 70-80mm, and the height is 10-12mm. This is because the mold and the product are compatible within this range. If they are not within this range, the mold and the product will not fit together completely, making the product easy to deform and resulting in a low yield rate.

[0021] As a preferred technical solution of the present invention, a groove is provided on the side surface of the cover plate facing away from the convex surface, and the groove and the highest point of the convex surface are concentrically arranged.

[0022] Preferably, the diameter of the groove is 4 to 5 mm, for example, it can be 4 mm, 4.1 mm, 4.2 mm, 4.3 mm, 4.4 mm, 4.5 mm, 4.6 mm, 4.7 mm, 4.8 mm, 4.9 mm, 5 mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0023] Preferably, the depth of the groove is 5 to 6 mm, for example, it can be 5 mm, 5.1 mm, 5.2 mm, 5.3 mm, 5.4 mm, 5.5 mm, 5.6 mm, 5.7 mm, 5.8 mm, 5.9 mm, 6 mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0024] Secondly, the present invention provides a method for adjusting the warpage of a copper-clad ceramic substrate, the method comprising:

[0025] The product is placed in a hot press mold, and then subjected to hot pressing and cooling to complete the product warping.

[0026] The hot pressing mold is the hot pressing mold described in the first aspect.

[0027] As a preferred embodiment of the present invention, the heating and hot pressing process is performed in the following manner:

[0028] The product is placed in a hot press mold, heated to a certain temperature, and then pressed down using a hot press head. After heat preservation, the hot press head is lifted.

[0029] As a preferred technical solution of the present invention, the heating rate of the hot pressing is 10-12℃ / min, for example, it can be 10℃ / min, 10.2℃ / min, 10.4℃ / min, 10.6℃ / min, 10.8℃ / min, 11℃ / min, 11.2℃ / min, 11.4℃ / min, 11.6℃ / min, 11.8℃ / min, 12℃ / min, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0030] In this invention, the heating rate of hot pressing is 10-12℃ / min because this range results in the highest product yield. If it is not within this range, it will lead to low production efficiency and low product yield.

[0031] Preferably, the specified temperature is 300 to 400°C, for example, it can be 300°C, 310°C, 320°C, 330°C, 340°C, 350°C, 360°C, 370°C, 380°C, 390°C, 400°C, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0032] The temperature in this invention is 300-400℃ because the yield rate of the product is highest within this range. If it is outside this range, the temperature is too low and the stress of the product is not fully released; if the temperature is too high, the cooling time is too long and the processing efficiency is affected.

[0033] As a preferred technical solution of the present invention, the heat preservation time is 2 to 2.5 hours, for example, it can be 2 hours, 2.1 hours, 2.2 hours, 2.3 hours, 2.4 hours, 2.5 hours, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0034] The heat preservation time in this invention is 2 to 2.5 hours because the product yield is highest within this range. If it is outside this range, the heat preservation time is too short and the improvement effect is poor; if the heat preservation time is too long, the processing efficiency is too low.

[0035] Preferably, the pressure of the heating and hot pressing is 5 to 8 kPa, for example, it can be 5 kPa, 5.5 kPa, 6 kPa, 6.5 kPa, 7 kPa, 7.5 kPa, 8 kPa, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0036] In this invention, the pressure of hot pressing is 5 to 8 kPa because the product yield is highest within this range. If it is outside this range, the pressure is too low and the improvement effect is not good; if the pressure is too high, it is easy to cause hidden cracks in the product.

[0037] As a preferred embodiment of the present invention, the cooling process is natural cooling.

[0038] It should be noted that the natural cooling method used in this invention is more beneficial to the warpage of the product compared to other cooling methods. This is because rapid cooling can lead to stress concentration in the product, thus reducing the warpage improvement effect.

[0039] As a preferred technical solution of the present invention, the adjustment method specifically includes:

[0040] The product is placed in a hot press mold, and then subjected to hot pressing and cooling to complete the product warping.

[0041] The heating and hot pressing process is carried out in the following manner:

[0042] The product is placed in a hot press mold, heated to a certain temperature, and then pressed down using a hot press head. After heat preservation, the hot press head is lifted.

[0043] The heating rate of the hot pressing is 10-12℃ / min, the specific temperature is 300-400℃, the holding time is 2-2.5h, the pressure of the hot pressing is 5-8KPa, and the cooling process is natural cooling.

[0044] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0045] In this invention, a specially designed hot-pressing mold is used to hot-press and shape the copper-clad ceramic substrate. By adjusting the curvature of the hot-pressing mold and the height of the hot pressing, the warping of the copper-clad ceramic substrate in different directions and sizes can be achieved. This ensures that the warping of the product is constant without adjusting the copper thickness. The structure is simple and suitable for widespread application. Attached Figure Description

[0046] Figure 1 This is a front view of the base in the hot pressing mold provided in Embodiment 1 of the present invention;

[0047] Figure 2 This is a side view of the base in the hot pressing mold provided in Embodiment 1 of the present invention;

[0048] Figure 3 This is a front view of the cover plate in the hot pressing mold provided in Embodiment 1 of the present invention;

[0049] Figure 4 This is a side view of the cover plate in the hot pressing mold provided in Embodiment 1 of the present invention;

[0050] Figure 5 This is a front view of the base in the hot pressing mold provided in Embodiment 2 of the present invention;

[0051] Figure 6 This is a side view of the base in the hot pressing mold provided in Embodiment 2 of the present invention;

[0052] Figure 7 This is a front view of the cover plate in the hot pressing mold provided in Embodiment 2 of the present invention;

[0053] Figure 8 This is a side view of the cover plate in the hot press mold provided in Embodiment 2 of the present invention;

[0054] Figure 9 This is a front view of the base in the hot pressing mold provided in Embodiment 3 of the present invention;

[0055] Figure 10 This is a side view of the base in the hot pressing mold provided in Embodiment 3 of the present invention;

[0056] Figure 11 This is a front view of the cover plate in the hot pressing mold provided in Embodiment 3 of the present invention;

[0057] Figure 12This is a side view of the cover plate in the hot pressing mold provided in Embodiment 3 of the present invention;

[0058] Among them, 1-base; 2-cover plate; 3-concave surface; 4-convex surface; 5-groove. Detailed Implementation

[0059] It should be understood that in the description of this invention, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0060] It should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0061] Those skilled in the art should understand that the present invention necessarily includes the necessary pipelines, conventional valves and general pump equipment for achieving complete process, but the above content is not the main inventive point of the present invention. Those skilled in the art can add layouts based on process flow and equipment structure selection, and the present invention does not make any special requirements or specific limitations in this regard.

[0062] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0063] In one specific embodiment, the present invention provides a hot pressing mold, the hot pressing mold including a base 1 and a cover plate 2, one side surface of the base 1 is a concave surface 3, one side surface of the cover plate 2 is a convex surface 4, the concave surface 3 and the convex surface 4 are matched and arranged, and the space between the concave surface 3 and the convex surface 4 is used to place the product for hot pressing; the maximum depth of the concave surface 3 is 0.15 to 0.25 mm.

[0064] It should be noted that the maximum depth of the concave surface 3 in this invention is 0.15 to 0.25 mm, for example, it can be 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm, 0.2 mm, 0.21 mm, 0.22 mm, 0.23 mm, 0.24 mm, 0.25 mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0065] It should be noted that the material of the hot pressing mold in this invention is not specifically limited, and those skilled in the art can make adaptive adjustments according to the actual situation. The maximum depth of the concave surface 3 is the lowest point of the concave surface 3 on the base 1, and it is concentrically positioned with the highest point of the convex surface 4 and the subsequent groove 5.

[0066] It should be noted that the hot press mold in this invention is mainly customized according to the actual warp size requirements. The curvature of the hot press mold is mainly referenced to the maximum depth of the concave surface 3 mentioned above. According to the required warp direction, the etched master plate is placed on the customized hot press mold. If the graphic surface needs to be concave, it is placed on the hot press mold with the graphic surface facing up. If the graphic surface needs to be convex, it is placed on the hot press mold with the graphic surface facing down.

[0067] Furthermore, the length of the base 1 is 70-80mm, for example, it can be 70mm, 71mm, 72mm, 73mm, 74mm, 75mm, 76mm, 77mm, 78mm, 79mm, 80mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0068] Furthermore, the width of the base 1 is 70-80mm, for example, it can be 70mm, 71mm, 72mm, 73mm, 74mm, 75mm, 76mm, 77mm, 78mm, 79mm, 80mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0069] Furthermore, the height of the base 1 is 10 to 12 mm, for example, it can be 10 mm, 10.2 mm, 10.4 mm, 10.6 mm, 10.8 mm, 11 mm, 11.2 mm, 11.4 mm, 11.6 mm, 11.8 mm, 12 mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0070] Furthermore, the length of the cover plate 2 is 70-80mm, for example, it can be 70mm, 71mm, 72mm, 73mm, 74mm, 75mm, 76mm, 77mm, 78mm, 79mm, 80mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0071] Furthermore, the width of the cover plate 2 is 70-80mm, for example, it can be 70mm, 71mm, 72mm, 73mm, 74mm, 75mm, 76mm, 77mm, 78mm, 79mm, 80mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0072] Furthermore, the height of the cover plate 2 is 10 to 12 mm, for example, it can be 10 mm, 10.2 mm, 10.4 mm, 10.6 mm, 10.8 mm, 11 mm, 11.2 mm, 11.4 mm, 11.6 mm, 11.8 mm, 12 mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0073] Furthermore, a groove 5 is provided on the side surface of the cover plate 2 facing away from the convex surface 4, and the groove 5 and the highest point of the convex surface 4 are concentrically arranged.

[0074] Furthermore, the diameter of the groove 5 is 4 to 5 mm, for example, it can be 4 mm, 4.1 mm, 4.2 mm, 4.3 mm, 4.4 mm, 4.5 mm, 4.6 mm, 4.7 mm, 4.8 mm, 4.9 mm, 5 mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0075] Furthermore, the depth of the groove 5 is 5 to 6 mm, for example, it can be 5 mm, 5.1 mm, 5.2 mm, 5.3 mm, 5.4 mm, 5.5 mm, 5.6 mm, 5.7 mm, 5.8 mm, 5.9 mm, 6 mm, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0076] In another specific embodiment, the present invention provides a method for adjusting the warpage of a copper-clad ceramic substrate, the method comprising:

[0077] The product is placed in a hot press mold, and then subjected to hot pressing and cooling to complete the product warping.

[0078] The hot pressing mold used hereby adopts the aforementioned hot pressing mold.

[0079] Furthermore, the hot pressing process is carried out as follows:

[0080] The product is placed in a hot press mold, heated to a certain temperature, and then pressed down using a hot press head. After heat preservation, the hot press head is lifted.

[0081] Furthermore, the heating rate of the hot pressing is 10–12 °C / min, for example, it can be 10 °C / min, 10.2 °C / min, 10.4 °C / min, 10.6 °C / min, 10.8 °C / min, 11 °C / min, 11.2 °C / min, 11.4 °C / min, 11.6 °C / min, 11.8 °C / min, 12 °C / min, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0082] Furthermore, a certain temperature is 300 to 400℃, for example, it can be 300℃, 310℃, 320℃, 330℃, 340℃, 350℃, 360℃, 370℃, 380℃, 390℃, 400℃, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0083] Furthermore, the heat preservation time is 2 to 2.5 hours, for example, it can be 2 hours, 2.1 hours, 2.2 hours, 2.3 hours, 2.4 hours, 2.5 hours, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0084] Furthermore, the pressure for hot pressing is 5 to 8 kPa, for example, it can be 5 kPa, 5.5 kPa, 6 kPa, 6.5 kPa, 7 kPa, 7.5 kPa, 8 kPa, etc., but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0085] Furthermore, the cooling process is natural cooling.

[0086] Example 1

[0087] This embodiment provides a hot pressing mold, such as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, where:

[0088] The hot press mold includes a base 1 and a cover plate 2. One side surface of the base 1 is a concave surface 3, and one side surface of the cover plate 2 is a convex surface 4. The concave surface 3 and the convex surface 4 are matched and arranged, and the space between the concave surface 3 and the convex surface 4 is used to place the product for hot pressing. The maximum depth of the concave surface 3 is 0.15mm.

[0089] The base 1 is 70mm long, 70mm wide, and 10mm high.

[0090] The cover plate 2 is 70mm long, 70mm wide, and 10mm high.

[0091] A groove 5 is provided on the side surface of the cover plate 2 facing away from the convex surface 4. The groove 5 and the highest point of the convex surface 4 are concentric. The diameter of the groove 5 is 4mm and the depth of the groove 5 is 5mm.

[0092] Example 2

[0093] This embodiment provides a hot pressing mold, such as Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the difference from Embodiment 1 is that the maximum depth of the concave surface 3 is 0.2 mm; the length of the base 1 is 75 mm, the width of the base 1 is 75 mm, and the height of the base 1 is 11 mm; the length of the cover plate 2 is 75 mm, the width of the cover plate 2 is 75 mm, and the height of the cover plate 2 is 11 mm; all other parameters are the same as in Embodiment 1.

[0094] Example 3

[0095] This embodiment provides a hot pressing mold, such as Figure 9 , Figure 10 , Figure 11 and Figure 12 As shown, the difference from Embodiment 1 is that the maximum depth of the concave surface 3 is 0.25mm; the length of the base 1 is 80mm, the width of the base 1 is 80mm, and the height of the base 1 is 12mm; the length of the cover plate 2 is 80mm, the width of the cover plate 2 is 80mm, and the height of the cover plate 2 is 12mm; all other parameters are the same as in Embodiment 1.

[0096] Example 4

[0097] This embodiment provides a method for adjusting the warpage of a copper-clad ceramic substrate, wherein:

[0098] The product is placed in the hot press mold of Example 1, and subjected to hot pressing and cooling treatments to complete the warping of the product.

[0099] The hot pressing process is carried out in the following manner:

[0100] The product is placed in a hot press mold, heated to a certain temperature, and then pressed down using a hot press head. After heat preservation, the hot press head is lifted.

[0101] The heating rate of the hot pressing is 10℃ / min, the constant temperature is 300℃, the holding time is 2h, the pressure of the hot pressing is 5KPa, and the cooling process is natural cooling.

[0102] Example 5

[0103] This embodiment provides a method for adjusting the warpage of a copper-clad ceramic substrate, wherein:

[0104] The product is placed in the hot press mold of Example 1, and subjected to hot pressing and cooling treatments to complete the warping of the product.

[0105] The hot pressing process is carried out in the following manner:

[0106] The product is placed in a hot press mold, heated to a certain temperature, and then pressed down using a hot press head. After heat preservation, the hot press head is lifted.

[0107] The heating rate of the hot pressing is 11℃ / min, the constant temperature is 350℃, the holding time is 2.2h, the pressure of the hot pressing is 6KPa, and the cooling process is natural cooling.

[0108] Example 6

[0109] This embodiment provides a method for adjusting the warpage of a copper-clad ceramic substrate, wherein:

[0110] The product is placed in the hot press mold of Example 2, and subjected to hot pressing and cooling treatments to complete the warping of the product.

[0111] The hot pressing process is carried out in the following manner:

[0112] The product is placed in a hot press mold, heated to a certain temperature, and then pressed down using a hot press head. After heat preservation, the hot press head is lifted.

[0113] The heating rate of the hot pressing is 10℃ / min, the constant temperature is 360℃, the holding time is 2h, the pressure of the hot pressing is 8KPa, and the cooling process is natural cooling.

[0114] Example 7

[0115] This embodiment provides a method for adjusting the warpage of a copper-clad ceramic substrate, wherein:

[0116] The product is placed in the hot press mold of Example 2, and subjected to hot pressing and cooling treatments to complete the warping of the product.

[0117] The hot pressing process is carried out in the following manner:

[0118] The product is placed in a hot press mold, heated to a certain temperature, and then pressed down using a hot press head. After heat preservation, the hot press head is lifted.

[0119] The heating rate of the hot pressing is 12℃ / min, the constant temperature is ~400℃, the holding time is 2h, the pressure of the hot pressing is 6KPa, and the cooling process is natural cooling.

[0120] Example 8

[0121] This embodiment provides a method for adjusting the warpage of a copper-clad ceramic substrate, wherein:

[0122] The product is placed in the hot press mold of Example 3, and subjected to hot pressing and cooling treatments to complete the warping of the product.

[0123] The hot pressing process is carried out in the following manner:

[0124] The product is placed in a hot press mold, heated to a certain temperature, and then pressed down using a hot press head. After heat preservation, the hot press head is lifted.

[0125] The heating rate of the hot pressing is 11℃ / min, the constant temperature is 340℃, the holding time is 2.1h, the pressure of the hot pressing is 5.8KPa, and the cooling process is natural cooling.

[0126] The warpage of the products in Examples 4-8 above was tested. The warpage value was defined numerically as the distance between the two points that are farthest apart in the height direction of the warpage plane. The design quality prediction was mainly carried out using injection molding CAE to obtain the maximum warpage deformation, as shown in Table 1 below.

[0127] Table 1. Warpage of products before and after hot pressing in Examples 4-8

[0128]

[0129] In summary, this invention uses a specially designed hot-pressing mold to hot-press and shape the copper-clad ceramic substrate. By adjusting the curvature of the hot-pressing mold and the height of the hot press, the warping of the copper-clad ceramic substrate in different directions and sizes can be achieved. This ensures that the warping of the product is controlled without adjusting the copper thickness. The structure is simple and suitable for widespread application.

[0130] The above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention fall within the protection and disclosure scope of the present invention.

Claims

1. A hot pressing mold, characterized in that, The hot press mold includes a base and a cover plate. One side surface of the base is concave, and one side surface of the cover plate is convex. The concave surface and the convex surface are matched and arranged, and the space between the concave surface and the convex surface is used to place the product for hot pressing. The maximum depth of the concave surface is 0.15~0.25mm; The cover plate has a groove on the side of the surface facing away from the convex surface, and the groove and the highest point of the convex surface are concentrically arranged. The diameter of the groove is 4~5mm; The depth of the groove is 5~6mm; The length of the cover plate is 70~80mm; The width of the cover plate is 70~80mm; The height of the cover plate is 10~12mm.

2. The hot pressing mold according to claim 1, characterized in that, The base is 70-80mm long.

3. The hot pressing mold according to claim 1, characterized in that, The width of the base is 70~80mm.

4. The hot pressing mold according to claim 1, characterized in that, The height of the base is 10~12mm.

5. A method for adjusting the warpage of a copper-clad ceramic substrate, characterized in that, The adjustment method includes: The product is placed in a hot press mold, and then subjected to hot pressing and cooling to adjust the product's warp. The hot pressing mold is the hot pressing mold according to any one of claims 1-4.

6. The adjustment method according to claim 5, characterized in that, The heating and hot pressing process is carried out in the following manner: The product is placed in a hot press mold, heated to a certain temperature, and then pressed down using a hot press head. After heat preservation, the hot press head is lifted.

7. The adjustment method according to claim 6, characterized in that, The heating rate of the hot pressing is 10~12℃ / min.

8. The adjustment method according to claim 6, characterized in that, The specified temperature is 300~400℃.

9. The adjustment method according to claim 6, characterized in that, The heat preservation time is 2~2.5h.

10. The adjustment method according to claim 6, characterized in that, The pressure of the heated and hot-pressed process is 5~8 kPa.

11. The adjustment method according to claim 5, characterized in that, The cooling process is natural cooling.

12. The adjustment method according to claim 5, characterized in that, The adjustment method specifically includes: The product is placed in a hot press mold, and then subjected to hot pressing and cooling to adjust the product's warp. The heating and hot pressing process is carried out in the following manner: The product is placed in a hot press mold, heated to a certain temperature, and then pressed down using a hot press head. After heat preservation, the hot press head is lifted. The heating rate of the hot pressing is 10~12℃ / min, the specific temperature is 300~400℃, the holding time is 2~2.5h, the pressure of the hot pressing is 5~8KPa, and the cooling process is natural cooling.

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