Vibration-damping support member and vibration-damping support device

Abstract

The present invention provides a vibration-damping support member and a vibration-damping support device, relating to the field of vibration reduction technology. The vibration-damping support member may include: a plurality of hollow structures and a plurality of low-frequency resonant structures arranged in an array. The plurality of low-frequency resonant structures correspond one-to-one with a plurality of first hollow structures, each of which is a portion of the plurality of hollow structures; each of the plurality of low-frequency resonant structures is embedded in a corresponding first hollow structure. This application can enhance the effectiveness of low-frequency vibration reduction.

Description

Technical Field

[0001] The present invention relates to the field of vibration reduction technology, and in particular to a vibration reduction support member and a vibration reduction support device. Background Art

[0002] Low-frequency vibrations typically have large amplitudes and low velocities, which can easily cause structural resonance, leading to structural damage and fatigue. Therefore, controlling and mitigating low-frequency vibrations is particularly important in engineering applications. However, current vibration reduction structures are unable to effectively mitigate low-frequency vibrations, resulting in poor results. Summary of the Invention

[0003] In order to solve the above problems, the present invention provides a vibration-damping support member and a vibration-damping support device, which can improve the effect of low-frequency vibration reduction.

[0004] In a first aspect, the present invention provides a vibration-damping support member, comprising: a plurality of hollow structures and a plurality of low-frequency resonant structures arranged in an array, wherein: the plurality of low-frequency resonant structures correspond one-to-one to a plurality of first hollow structures, and the plurality of first hollow structures are part of the plurality of hollow structures; each of the plurality of low-frequency resonant structures is embedded in the corresponding first hollow structure.

[0005] Optionally, the vibration damping support member further includes: a plurality of active low-frequency vibration damping structures and a first processor, wherein: each of the plurality of active low-frequency vibration damping structures includes a first sensing element and a piezoelectric stack driver; the plurality of active low-frequency vibration damping structures correspond one-to-one to a plurality of second hollow structures, the plurality of second hollow structures are part of the plurality of hollow structures, and the intersection of the plurality of second hollow structures and the plurality of first hollow structures is empty; each active low-frequency vibration damping structure is arranged in the corresponding second hollow structure; the first sensing element in the first active low-frequency vibration damping structure is used to generate a first vibration signal when detecting that the vibration damping support member is subjected to external low-frequency vibration, and send the first vibration signal to the first processor; the first active low-frequency vibration damping structure is any one of the plurality of active low-frequency vibration damping structures; the first processor is used to generate a first control signal according to the first vibration signal, and send the first control signal to the piezoelectric stack driver in the first active low-frequency vibration damping structure; the piezoelectric stack driver in the first active low-frequency vibration damping structure is used to perform a first vibration damping operation in response to the first control signal.

[0006] Optionally, the vibration damping support also includes: a plurality of active mid-high frequency vibration damping structures and a second processor, wherein: each of the plurality of active mid-high frequency vibration damping structures includes a second sensing element and at least one piezoelectric fiber composite material driver; the plurality of active mid-high frequency vibration damping structures correspond one-to-one to a plurality of third hollow structures, the plurality of third hollow structures are part of the plurality of hollow structures, and the intersection of the plurality of third hollow structures, the plurality of first hollow structures and the plurality of second hollow structures is empty; each of the active mid-high frequency vibration damping structures is arranged in the corresponding third hollow structure; the first active mid-high frequency vibration damping structure The second sensing element is used to generate a second vibration signal when it detects that the vibration-damping support is subjected to external medium and high frequency vibration, and send the second vibration signal to the second processor; the first active medium and high frequency vibration damping structure is any one of the multiple active medium and high frequency vibration damping structures; the second processor is used to generate a second control signal according to the second vibration signal, and send the second control signal to at least one piezoelectric fiber composite material driver in the first active medium and high frequency vibration damping structure; the at least one piezoelectric fiber composite material driver in the first active medium and high frequency vibration damping structure is used to perform a second vibration damping operation in response to the second control signal.

[0007] Optionally, the plurality of hollow structures arranged in the array form a zero Poisson's ratio configuration.

[0008] Optionally, the low-frequency resonant structure is a local resonant superstructure; the local resonant superstructure includes a matrix, multiple scatterers and multiple wrapping layers; the multiple scatterers and the multiple wrapping layers correspond one to one, and a corresponding wrapping layer is provided on the periphery of each of the multiple scatterers; each scatterer and the corresponding wrapping layer are embedded in the matrix and pass through the matrix.

[0009] Optionally, the array is arranged in N rows and M columns; the multiple first hollow structures include a first row of hollow structures, a second row of hollow structures, an N-1th row of hollow structures and an Nth row of hollow structures; the multiple second hollow structures include a third row of hollow structures and an N-2th row of hollow structures.

[0010] Optionally, the array is arranged in N rows and M columns; the multiple third hollow structures include a fourth row of hollow structures and an N-3th row of hollow structures.

[0011] Optionally, the thickness of the vibration-damping support member is positively correlated with the support stiffness of the vibration-damping support member.

[0012] Optionally, the resonant frequency of the low-frequency resonant structure is determined according to the material and structure of the low-frequency resonant structure.

[0013] In a second aspect, the present application provides a vibration-damping support device comprising a base, four first support members and eight second support members, wherein: the first support member is a rectangular vibration-damping support member as described in any one of the first aspects, and the second support member is a right-angled triangle vibration-damping support member as described in any one of the first aspects; each of the four first support members corresponds to two second support members, and different first support members correspond to different second support members; the four first support members are combined to form a support structure, and the support structure is arranged on the base; the right-angled side of each of the eight second support members is connected to the right-angled side formed by the corresponding first support member and the base.

[0014] The beneficial effects of the vibration-damping support member of the present invention are:

[0015] Because the vibration-damping support member includes multiple hollow structures arranged in an array, when the vibration-damping support member is subjected to external low-frequency vibration, the multiple hollow structures arranged in an array gradually compress under the action of the external low-frequency vibration to consume the energy of the external low-frequency vibration, prevent the further propagation of the external low-frequency vibration, and achieve low-frequency vibration reduction. Furthermore, because the vibration-damping support member also includes multiple low-frequency resonant structures, when the vibration-damping support member is subjected to external low-frequency vibration, the multiple low-frequency resonant structures absorb and isolate the energy of the external low-frequency vibration through their own low-frequency resonance phenomenon, prevent the further propagation of the external low-frequency vibration, and achieve low-frequency vibration reduction. In this way, in the vibration-damping support member, the multiple hollow structures arranged in an array and the multiple low-frequency resonant structures can simultaneously isolate the external low-frequency vibration, not only achieving low-frequency vibration reduction, but also improving the effect and efficiency of low-frequency vibration reduction.

[0016] Moreover, since the multiple first hollow structures are part of the multiple hollow structures, and the multiple low-frequency resonance structures correspond one-to-one to the multiple first hollow structures, each low-frequency resonance structure in the multiple low-frequency resonance structures is embedded in the corresponding first hollow structure. Therefore, compared with setting the multiple low-frequency resonance structures at any position outside the multiple hollow structures, the volume of the vibration-damping support member is reduced, and the space optimization of the vibration-damping support member is achieved, so as to achieve vibration reduction control as much as possible within a limited volume.

[0017] Furthermore, since the vibration-damping support member includes a plurality of hollow structures and a plurality of low-frequency resonance structures arranged in an array, the structure is simple and easy to implement. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic structural diagram of a vibration-damping support member provided in an embodiment of the present application;

[0019] Figure 2 for Figure 1 The main view;

[0020] Figure 3 A schematic diagram of a negative Poisson's ratio configuration provided in an embodiment of the present application;

[0021] Figure 4 A schematic diagram of a positive Poisson's ratio configuration provided in an embodiment of the present application;

[0022] Figure 5 A schematic diagram of a low-frequency resonant structure provided in an embodiment of the present application being embedded in a corresponding first hollow structure;

[0023] Figure 6 A schematic diagram showing a first active low-frequency vibration reduction structure provided in an embodiment of the present application disposed in a corresponding second hollow structure;

[0024] Figure 7 A schematic structural diagram of a piezoelectric fiber composite material driver provided in an embodiment of the present application;

[0025] Figure 8 Schematic diagram of a first active mid- and high-frequency vibration reduction structure provided in an embodiment of the present application being disposed in a corresponding third hollow structure;

[0026] Figure 9 A schematic diagram of a zero Poisson's ratio configuration provided in an embodiment of the present application;

[0027] Figure 10 A schematic diagram of a local resonant superstructure provided in an embodiment of the present application;

[0028] Figure 11 A schematic structural diagram of a vibration-damping support device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0029] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. Although certain embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as being limited to the embodiments described herein. Instead, these embodiments are provided to provide a more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of protection of the present invention.

[0030] The term "including" and its variations used in this document are open inclusions, that is, "including but not limited to"; the term "based on" means "at least partially based on"; the term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments"; the term "optionally" means "optional embodiments". The relevant definitions of other terms will be given in the following description. It should be noted that the concepts of "first", "second", etc. mentioned in the present invention are only used to distinguish different devices, modules, units or objects, and are not used to limit the order or interdependence of the functions performed by these devices, modules, units or objects.

[0031] It should be noted that the modifications of "one" and "multiple" mentioned in the present invention are illustrative rather than restrictive. Those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0032] In the related art, the vibration reduction structure generally includes a support member, a base, and a vibration reduction element. Among them, the support member is usually made of a high-rigidity metal material, such as a titanium alloy plate, to enhance the structural stability of the support member. The vibration reduction element can usually be a vibration reduction pad, a vibration reduction pump mounting plate, a vibration reduction base plate, or a vibration reduction transition plate. The vibration reduction element is arranged between the support member and the base. In this way, when the support member is subjected to external low-frequency vibration, the vibration reduction element can isolate the transmission of vibration to a certain extent, reduce the low-frequency vibration transmitted to the base, and thus achieve the effect of low-frequency vibration reduction.

[0033] However, in the related art, only vibration-damping elements such as vibration-damping pads, vibration-damping pump mounting plates, vibration-damping base plates or vibration-damping transition plates are used to isolate the transmission of low-frequency vibrations. Therefore, low-frequency vibrations cannot be effectively damped, resulting in poor low-frequency vibration damping effects.

[0034] In order to solve the above technical problems, the embodiment of the present application provides a vibration-damping support. Figure 1 As shown, the vibration-damping support member 100 may include a plurality of hollow structures and a plurality of low-frequency resonance structures arranged in an array.

[0035] The material of the vibration-damping support member 100 includes, but is not limited to, steel plate, titanium alloy, composite material plate, etc. The shape of the vibration-damping support member 100 can be set as required, for example, the vibration-damping support member 100 can be rectangular or triangular, etc., and this embodiment of the application does not specifically limit this.

[0036] One of the multiple hollow structures 101 is as follows Figure 1 and Figure 2 As shown. Among them, Figure 2 for Figure 1The size, shape and number of the hollow structure can be set according to the vibration reduction requirements, and the embodiment of the present application does not make any special restrictions on this.

[0037] The plurality of hollow structures arranged in an array can form a vibration-damping configuration such as a broad chiral configuration, a star configuration, a negative Poisson's ratio configuration or a positive Poisson's ratio configuration. For example, a negative Poisson's ratio configuration such as Figure 3 As shown, the positive Poisson's ratio configuration is as follows Figure 4 shown.

[0038] The low-frequency resonant structure may refer to a structure with a resonant frequency within the low-frequency range. The low-frequency resonant structure includes but is not limited to passive low-frequency vibration reduction structures such as vibration damping pads and rubber isolators, and the present application does not specifically limit this.

[0039] The shape of the low-frequency resonant structure may be, for example, a polyhedron such as a cube or a cuboid, and the embodiment of the present application does not impose any special limitation on this.

[0040] The multiple low-frequency resonant structures correspond one-to-one to the multiple first hollow structures, and the multiple first hollow structures are part of the multiple hollow structures.

[0041] Exemplarily, when the array is arranged in N rows and M columns, the multiple first hollow structures may be hollow structures in some rows of the N rows of hollow structures, the multiple first hollow structures may also be hollow structures in some columns of the M columns of hollow structures, and the multiple first hollow structures may also be hollow structures in some rows and some columns of the N rows and M columns.

[0042] Each of the plurality of low-frequency resonant structures is embedded in the corresponding first hollow structure. For example, the process of embedding a low-frequency resonant structure 501 in the corresponding first hollow structure 502 is as follows: Figure 5 shown.

[0043] When the vibration-damping support 100 is subjected to external low-frequency vibration, the multiple hollow structures arranged in the array are compressed under the action of the external low-frequency vibration to consume the energy of the external low-frequency vibration, thereby preventing the external low-frequency vibration from further propagating in the multiple hollow structures arranged in the array, thereby achieving low-frequency vibration reduction.

[0044] Moreover, when the vibration-damping support member 100 is subjected to external low-frequency vibration, each of the multiple low-frequency resonance structures absorbs and isolates the energy of the external low-frequency vibration through its own low-frequency resonance phenomenon, preventing the further propagation of the external low-frequency vibration, thereby achieving low-frequency vibration reduction.

[0045] Obviously, because the vibration-damping support member 100 includes multiple hollow structures arranged in an array, when the vibration-damping support member 100 is subjected to external low-frequency vibration, the multiple hollow structures arranged in the array gradually compress under the action of the external low-frequency vibration to consume the energy of the external low-frequency vibration, preventing the further propagation of the external low-frequency vibration, and thus achieving low-frequency vibration reduction. Furthermore, because the vibration-damping support member 100 also includes multiple low-frequency resonant structures, when the vibration-damping support member 100 is subjected to external low-frequency vibration, the multiple low-frequency resonant structures absorb and isolate the energy of the external low-frequency vibration through their own low-frequency resonance phenomenon, preventing the further propagation of the external low-frequency vibration, and thus achieving low-frequency vibration reduction. In this way, in the vibration-damping support member 100, the multiple hollow structures arranged in an array and the multiple low-frequency resonant structures can simultaneously isolate external low-frequency vibration, not only achieving low-frequency vibration reduction, but also improving the effectiveness and efficiency of low-frequency vibration reduction.

[0046] Moreover, since the multiple first hollow structures are part of the multiple hollow structures, and the multiple low-frequency resonance structures correspond one-to-one to the multiple first hollow structures, each low-frequency resonance structure in the multiple low-frequency resonance structures is embedded in the corresponding first hollow structure. Therefore, compared with setting the multiple low-frequency resonance structures at any position outside the multiple hollow structures, the volume of the vibration-damping support member 100 is reduced, and the space optimization of the vibration-damping support member 100 is achieved, so as to achieve vibration reduction control as much as possible within a limited volume.

[0047] Furthermore, since the vibration-damping support member 100 includes a plurality of hollow structures and a plurality of low-frequency resonance structures arranged in an array, the structure is simple and easy to implement.

[0048] In some embodiments, the vibration-damping support member may further include: a plurality of active low-frequency vibration-damping structures and a first processor, wherein:

[0049] Each of the plurality of active low-frequency vibration reduction structures may include a first sensing element and a piezoelectric stack driver.

[0050] For example, the first sensing element can be a sensor or other element that can sense motion parameters such as displacement, velocity, and acceleration. The piezoelectric stack actuator can be composed of a stack of multiple piezoelectric ceramic sheets. When voltage is applied to the piezoelectric stack actuator, the piezoelectric stack within the actuator expands or contracts linearly along the direction of the electric field. In this way, when subjected to external low-frequency vibrations, the piezoelectric stack actuator is controlled to expand or contract in a direction opposite to the external low-frequency vibrations, thereby achieving low-frequency vibration reduction.

[0051] Piezoelectric stack actuators, due to their high force output and small displacement capabilities, are suitable for low-frequency vibration reduction applications. They also offer fast response, high precision, a wide frequency response range, ease of processing, and low power loss.

[0052] The multiple active low-frequency vibration reduction structures correspond one-to-one to the multiple second hollow structures. The multiple second hollow structures are part of the multiple hollow structures. The intersection of the multiple second hollow structures and the multiple first hollow structures is empty. Each active low-frequency vibration reduction structure is arranged in the corresponding second hollow structure.

[0053] Exemplarily, when the array is arranged in N rows and M columns, the multiple second hollow structures may be hollow structures in some rows of the N rows of hollow structures, the multiple second hollow structures may also be hollow structures in some columns of the M columns of hollow structures, and the multiple second hollow structures may also be hollow structures in some rows and some columns of the N rows and M columns.

[0054] The following takes the first active low-frequency vibration reduction structure as an example to illustrate the specific configuration and working process of the first active low-frequency vibration reduction structure. It should be noted that the first active low-frequency vibration reduction structure is any one of the multiple active low-frequency vibration reduction structures.

[0055] like Figure 6 As shown, the first active low-frequency vibration reduction structure may include a first sensing element 603 and a piezoelectric stack driver 602. The first active low-frequency vibration reduction structure is disposed in the corresponding second hollow structure 604 in a specific manner: the first sensing element 603 is disposed on the inner wall of the second hollow structure 604, and the piezoelectric stack driver 602 is disposed in the second hollow structure 604, so that the upper and lower ends of the piezoelectric stack driver 602 are in contact with the upper and lower inner walls of the second hollow structure 604.

[0056] The working process of the first active low-frequency vibration reduction structure can be shown as follows:

[0057] The first sensing element 603 in the first active low-frequency vibration reduction structure may generate a first vibration signal when detecting that the vibration reduction support member is subjected to external low-frequency vibration, and send the first vibration signal to the first processor 601 .

[0058] Specifically, the first sensing element 603 can detect whether the vibration-damping support member is subjected to external low-frequency vibration by capturing vibration signals, such as motion parameters such as displacement, velocity, and acceleration. Specifically, if the first sensing element 603 captures a vibration signal, it is detected that the vibration-damping support member is subjected to external low-frequency vibration. If the first sensing element 603 does not capture a vibration signal, it is detected that the vibration-damping support member is not subjected to external low-frequency vibration.

[0059] When the first sensing element 603 detects that the vibration-damping support member is subjected to external low-frequency vibration, a first vibration signal is generated based on the detected direction, velocity, acceleration and displacement of the external low-frequency vibration, so that the first vibration signal carries the direction, velocity, acceleration and displacement of the external low-frequency vibration.

[0060] The first processor 601 may generate a first control signal according to the first vibration signal, and send the first control signal to the piezoelectric stack driver 602 in the first active low-frequency vibration reduction structure.

[0061] Specifically, the first processor 601 may generate a first control signal based on the direction, velocity, acceleration, and displacement of the external low-frequency vibration carried in the first vibration signal. The first control signal indicates the specific implementation of the first vibration reduction operation, such as the direction and magnitude of the force of the first vibration reduction operation. The first vibration reduction operation may be an expansion or contraction operation of the piezoelectric stack actuator 602.

[0062] It should be noted that the direction of the force of the first vibration reduction operation is opposite to the direction of the external low-frequency vibration.

[0063] The piezoelectric stack driver 602 in the first active low-frequency vibration reduction structure may perform a first vibration reduction operation in response to the first control signal.

[0064] Specifically, the piezoelectric stack driver 602 performs the first vibration reduction operation according to the specific implementation method of the first vibration reduction operation indicated by the first control signal, so as to prevent the further transmission of the external low-frequency vibration through the first vibration reduction operation in the opposite direction of the external low-frequency vibration, thereby achieving low-frequency vibration reduction and improving the low-frequency vibration reduction effect.

[0065] It should be noted that, since the working process of each active low-frequency vibration reduction structure is similar, the working process of other active low-frequency vibration reduction structures can refer to the working process of the first active low-frequency vibration reduction structure above, and will not be repeated here.

[0066] Obviously, since the vibration damping support also includes multiple active low-frequency vibration damping structures and a first processor, and the first sensing element in any one of the multiple active low-frequency vibration damping structures (i.e., the first active low-frequency vibration damping structure) can generate a first vibration signal when detecting that the vibration damping support is subjected to external low-frequency vibration, and send the first vibration signal to the first processor, so that the first processor generates a first control signal according to the first vibration signal, and sends the first control signal to the piezoelectric stack driver in the first active low-frequency vibration damping structure, so that the piezoelectric stack driver in the first active low-frequency vibration damping structure responds to the first control signal and performs a first vibration damping operation, further preventing the further transmission of low-frequency vibration, thereby achieving low-frequency vibration damping and further improving the effect and efficiency of low-frequency vibration damping.

[0067] Moreover, since the first vibration reduction operation performed by the piezoelectric stack driver is generated based on the external low-frequency vibration of the vibration reduction support detected by the first sensing element, it can be understood that the vibration reduction method of the first active low-frequency vibration reduction structure is active and can adapt to the dynamic changes of the external low-frequency vibration, thereby effectively suppressing the low-frequency vibration.

[0068] Moreover, since the multiple active low-frequency vibration damping structures correspond one-to-one to the multiple second hollow structures, the multiple second hollow structures are part of the multiple hollow structures, and each active low-frequency vibration damping structure is arranged in the corresponding second hollow structure. Therefore, compared with setting the multiple active low-frequency vibration damping structures at any position outside the multiple hollow structures, the volume of the vibration damping support is reduced, and the space optimization of the vibration damping support is achieved, so as to achieve vibration damping control as much as possible within a limited volume.

[0069] In some embodiments, the vibration-damping support member may further include a plurality of active mid- and high-frequency vibration-damping structures and a second processor.

[0070] Each of the plurality of active mid-high frequency vibration reduction structures may include a second sensing element and at least one piezoelectric fiber composite (MFC) driver.

[0071] The description of the second sensing element can refer to the description of the first sensing element, which will not be repeated here. The number of the at least one piezoelectric fiber composite material driver can be set according to the vibration reduction requirements, and this embodiment of the application does not impose any special restrictions on this.

[0072] For example, Figure 7 As shown, the piezoelectric fiber composite actuator 700 may include: a first electrode layer 701, a second electrode layer 702, an epoxy resin 703, and a plurality of piezoelectric fibers 704. The epoxy resin 703 is disposed between the first electrode layer 701 and the second electrode layer 702, and the plurality of piezoelectric fibers 704 are embedded in the epoxy resin 703.

[0073] Piezoelectric fiber composite actuators are thin-film actuators and sensors with high performance, flexibility, and reliability. They can be applied as thin, conformable sheets to various structures or embedded in composite structures. When a voltage is applied to the actuator, it bends or distorts the material to which it is attached.

[0074] It should be noted that when no voltage is applied to the piezoelectric fiber composite material actuator, the piezoelectric fiber composite material actuator can be used as a sensor to sense deformation and vibration. In this way, the second sensing element can also be a piezoelectric fiber composite material actuator.

[0075] Piezoelectric fiber composite actuators, due to their low force output and large displacement capacity, are suitable for medium- and high-frequency vibration reduction applications. Furthermore, they offer a wide frequency bandwidth and excellent durability, making them suitable for low-voltage operation. Furthermore, their flexible nature allows them to be conformed to or integrated into irregular surfaces and structures.

[0076] The multiple active mid- and high-frequency vibration damping structures correspond one-to-one with the multiple third hollow structures. The multiple third hollow structures are part of the multiple hollow structures. The intersection of the multiple third hollow structures, the multiple first hollow structures, and the multiple second hollow structures is hollow. Each active mid- and high-frequency vibration damping structure is disposed within a corresponding third hollow structure.

[0077] Exemplarily, when the array is arranged in N rows and M columns, the multiple third hollow structures may be hollow structures in some rows of the N rows of hollow structures, the multiple third hollow structures may also be hollow structures in some columns of the M columns of hollow structures, and the multiple third hollow structures may also be hollow structures in some rows and some columns of the N rows and M columns.

[0078] The following describes the specific configuration and operation of the first active mid-high frequency vibration reduction structure as an example. It should be noted that the first active mid-high frequency vibration reduction structure is any one of the multiple active mid-high frequency vibration reduction structures.

[0079] like Figure 8 As shown, the first active mid- and high-frequency vibration reduction structure may include a second sensing element 804 and two piezoelectric fiber composite drivers 802 and 803. The first active mid- and high-frequency vibration reduction structure is disposed within the corresponding third hollow structure 805 by disposing the second sensing element 804 on the inner wall of the third hollow structure 805. The piezoelectric fiber composite driver 802 is affixed to the upper inner wall of the third hollow structure 805, and the piezoelectric fiber composite driver 803 is affixed to the lower inner wall of the third hollow structure 805.

[0080] The working process of the first active mid- and high-frequency vibration reduction structure can be shown as follows:

[0081] The second sensing element 804 in the first active medium and high frequency vibration reduction structure can generate a second vibration signal when detecting that the vibration reduction support is subjected to external medium and high frequency vibrations, and send the second vibration signal to the second processor 801.

[0082] Specifically, the second sensing element 804 can detect whether the vibration-damping support member is subjected to external medium- or high-frequency vibrations by capturing vibration signals, such as motion parameters such as displacement, velocity, and acceleration. Specifically, if the second sensing element 804 captures a vibration signal, it is detected that the vibration-damping support member is subjected to external medium- or high-frequency vibrations. If the second sensing element 804 does not capture a vibration signal, it is detected that the vibration-damping support member is not subjected to external medium- or high-frequency vibrations.

[0083] When the second sensing element 804 detects that the vibration-damping support is subjected to external medium and high frequency vibrations, a second vibration signal is generated based on the detected direction, speed, acceleration and displacement of the external medium and high frequency vibrations, so that the second vibration signal carries the direction, speed, acceleration and displacement of the external medium and high frequency vibrations.

[0084] The second processor 801 may generate a second control signal according to the second vibration signal, and send the second control signal to the piezoelectric fiber composite drivers 802 and 803 in the first active medium and high frequency vibration reduction structure.

[0085] Specifically, the second processor 801 may generate a second control signal based on the direction, velocity, acceleration, and displacement of the external medium- and high-frequency vibrations carried in the second vibration signal. The second control signal indicates the specific implementation of the second vibration reduction operation, such as the direction and magnitude of the force of the second vibration reduction operation. The second vibration reduction operation may be a bending or twisting operation of the piezoelectric fiber composite actuators 802 and 803.

[0086] It should be noted that the direction of the bending moment of the second vibration reduction operation is opposite to the direction of the external medium and high frequency vibrations.

[0087] The piezoelectric fiber composite drivers 802 and 803 in the first active medium and high frequency vibration reduction structure can perform a second vibration reduction operation in response to a second control signal to prevent further transmission of external medium and high frequency vibrations through a second vibration reduction operation in the opposite direction of the external medium and high frequency vibrations, thereby achieving medium and high frequency vibration reduction.

[0088] It should be noted that since the working process of each active mid-high frequency vibration reduction structure is similar, the working process of other active mid-high frequency vibration reduction structures can refer to the working process of the first active mid-high frequency vibration reduction structure above, and will not be repeated here.

[0089] Obviously, since the vibration damping support also includes multiple active medium and high frequency vibration damping structures and a second processor, and the second sensing element in any one of the multiple active medium and high frequency vibration damping structures (i.e., the first active medium and high frequency vibration damping structure) can generate a second vibration signal when detecting that the vibration damping support is subjected to external medium and high frequency vibration, and send the second vibration signal to the second processor, so that the second processor generates a second control signal according to the second vibration signal, and sends the second control signal to at least one piezoelectric fiber composite material driver in the first active medium and high frequency vibration damping structure, so that at least one piezoelectric fiber composite material driver in the first active medium and high frequency vibration damping structure responds to the second control signal and performs a second vibration damping operation to prevent further transmission of external medium and high frequency vibrations, thereby achieving medium and high frequency vibration damping.

[0090] Moreover, since the second vibration reduction operation performed by the piezoelectric fiber composite driver is generated based on the external medium and high frequency vibrations detected by the second sensing element to which the vibration reduction support member is subjected, it can be understood that the vibration reduction method of the first active medium and high frequency vibration reduction structure is active and can adapt to the dynamic changes of external medium and high frequency vibrations, thereby effectively suppressing the medium and high frequency vibrations.

[0091] Moreover, since the multiple active mid- and high-frequency vibration damping structures correspond one-to-one to the multiple third hollow structures, and the multiple third hollow structures are part of the multiple hollow structures, compared to setting the multiple active mid- and high-frequency vibration damping structures at any position outside the multiple hollow structures, the volume of the vibration damping support is reduced, and the space optimization of the vibration damping support is achieved, so as to achieve vibration damping control as much as possible within a limited volume.

[0092] Furthermore, since mid- and high-frequency vibration reduction can be achieved through multiple active mid- and high-frequency vibration reduction structures and the second processor, the range of vibration reduction frequencies is expanded and the vibration reduction effect is improved.

[0093] In some embodiments, the plurality of hollow structures arranged in an array may form a zero Poisson's ratio configuration. Figure 9 shown.

[0094] Because a zero-Poisson's ratio configuration doesn't cause lateral deformation under longitudinal impact, its deformation is a layer-by-layer compression from one end of the longitudinal impact toward the other. Therefore, a zero-Poisson's ratio configuration offers superior stability. Thus, when multiple hollow structures arranged in an array form a zero-Poisson's ratio configuration, the stability of the vibration-damping support can be improved.

[0095] In some embodiments, the low frequency resonant structure may be a local resonant superstructure. Figure 10 As shown, a locally resonant superstructure 1000 may include a base 1001, a plurality of scatterers 1002, and a plurality of wrapping layers 1003. The plurality of scatterers 1002 and the plurality of wrapping layers 1003 correspond one to one, and a corresponding wrapping layer 1003 is disposed around the periphery of each scatterer in the plurality of scatterers 1002. Each scatterer 1002 and the corresponding wrapping layer 1003 are embedded in the base 1001 and penetrate the base 1001.

[0096] It should be noted that in Figure 10 In the embodiment, the number of the plurality of scatterers 1002 and the number of the plurality of wrapping layers 1003 are both 5. Figure 10 The numbers shown in are merely exemplary and are not intended to limit the number of the plurality of scatterers 1002 and the plurality of wrapping layers 1003 .

[0097] In the embodiment of the present application, a theoretical estimation formula of the band gap range of the local resonant superstructure 1000 can be derived based on the mass-spring system model, and the band gap formation mechanism and influencing factors can be analyzed. Secondly, the finite element method is used to calculate and study the band structure, vibration mode, displacement field, acceleration field and attenuation characteristics of the local resonant superstructure 1000. Among them, Figure 10 As shown, by optimizing the material parameters (elastic modulus, density, Poisson's ratio of the scatterer, wrapping layer and substrate) and structural parameters (radius and shape of the scatterer, wrapping layer, substrate lattice and shape, etc.) of the local resonant superstructure 1000, the position and width of the band gap are controlled to obtain the optimal parameters, and ultimately the local resonant superstructure 1000 has a good vibration reduction effect in the low frequency band.

[0098] In some embodiments, the array is arranged in N rows and M columns. Based on this, the plurality of first hollow structures may include a first row of hollow structures, a second row of hollow structures, an N-1th row of hollow structures, and an Nth row of hollow structures. The plurality of second hollow structures may include a third row of hollow structures and an N-2th row of hollow structures.

[0099] Since the plurality of first hollow structures may include a first row of hollow structures, a second row of hollow structures, an N-1th row of hollow structures, and an Nth row of hollow structures, and the plurality of second hollow structures may include a third row of hollow structures and an N-2th row of hollow structures, when subjected to external vibration, vibration reduction operations can be performed simultaneously in rows, thereby improving vibration reduction efficiency.

[0100] In some embodiments, the array is arranged in N rows and M columns. Based on this, the plurality of third hollow structures may include a fourth row of hollow structures and an N-3th row of hollow structures.

[0101] Since the plurality of third hollow structures may include the fourth row of hollow structures and the N-3th row of hollow structures, when subjected to external vibration, vibration reduction operations can be performed simultaneously in rows, thereby improving vibration reduction efficiency.

[0102] In some embodiments, the thickness of the vibration-damping support member is positively correlated with the support stiffness of the vibration-damping support member.

[0103] Specifically, the thicker the vibration-damping support member, the stronger its support stiffness, while the thinner the vibration-damping support member, the weaker its support stiffness. Thus, the thickness of the vibration-damping support member can be determined based on the support stiffness requirement to ensure that the support stiffness index of the vibration-damping support member is met.

[0104] In some embodiments, the resonant frequency of the low frequency resonant structure is determined according to the material and structure of the low frequency resonant structure.

[0105] Because the resonant frequency of a low-frequency resonant structure is related to its materials and structure, it can be adjusted to keep the resonant frequency within the low-frequency range. This allows the resonance of the low-frequency resonant structure to absorb and isolate vibration energy, thereby achieving a vibration reduction effect.

[0106] like Figure 11 As shown, the embodiment of the present application further provides a vibration-damping support device, including a base 1101, four first support members 1102 and eight second support members 1103, wherein:

[0107] The first support member 1102 is a rectangular vibration-damping support member provided in any of the aforementioned embodiments, and the second support member 1103 is a right-angled triangle vibration-damping support member provided in any of the aforementioned embodiments. Each of the four first support members 1102 corresponds to two second support members 1103, and different first support members 1102 correspond to different second support members 1103. The four first support members 1102 together form a support structure, which is disposed on the base 1101. The right-angled side of each of the eight second support members 1103 is connected to the right-angled side formed by the corresponding first support member 1102 and the base 1101.

[0108] It should be noted that the vibration-damping support device can achieve similar effects to the vibration-damping support member described above, so it will not be described in detail here.

[0109] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0110] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A vibration-damping support member, characterized in that: include: Multiple hollow structures and multiple low-frequency resonant structures arranged in an array, wherein: The multiple low-frequency resonant structures correspond one-to-one to the multiple first hollow structures, and the multiple first hollow structures are part of the multiple hollow structures; Each of the plurality of low-frequency resonance structures is embedded in the corresponding first hollow structure; The vibration-damping support member further includes: a plurality of active low-frequency vibration-damping structures and a first processor, wherein: Each of the plurality of active low-frequency vibration reduction structures includes a first sensing element and a piezoelectric stack driver; The multiple active low-frequency vibration reduction structures correspond one-to-one to the multiple second hollow structures, the multiple second hollow structures are part of the multiple hollow structures, and the intersection of the multiple second hollow structures and the multiple first hollow structures is empty; Each active low-frequency vibration reduction structure is arranged in the corresponding second hollow structure; a first sensing element in a first active low-frequency vibration reduction structure, configured to generate a first vibration signal upon detecting that the vibration reduction support member is subjected to external low-frequency vibration, and transmit the first vibration signal to the first processor; the first active low-frequency vibration reduction structure being any one of the plurality of active low-frequency vibration reduction structures; The first processor is configured to generate a first control signal according to the first vibration signal, and send the first control signal to a piezoelectric stack driver in the first active low-frequency vibration reduction structure; The piezoelectric stack driver in the first active low-frequency vibration reduction structure is configured to perform a first vibration reduction operation in response to the first control signal; The vibration reduction support also includes: a plurality of active medium and high frequency vibration reduction structures and a second processor, wherein: Each of the plurality of active mid- and high-frequency vibration reduction structures includes a second sensing element and at least one piezoelectric fiber composite material driver; The multiple active mid- and high-frequency vibration reduction structures correspond one-to-one to the multiple third hollow structures, the multiple third hollow structures are part of the multiple hollow structures, and the intersection of the multiple third hollow structures, the multiple first hollow structures, and the multiple second hollow structures is empty; Each of the active mid- and high-frequency vibration reduction structures is arranged in the corresponding third hollow structure; a second sensing element in the first active mid-high frequency vibration reduction structure, configured to generate a second vibration signal upon detecting that the vibration reduction support member is subjected to external mid-high frequency vibration, and transmit the second vibration signal to the second processor; the first active mid-high frequency vibration reduction structure being any one of the plurality of active mid-high frequency vibration reduction structures; The second processor is configured to generate a second control signal according to the second vibration signal, and send the second control signal to at least one piezoelectric fiber composite material driver in the first active medium and high frequency vibration reduction structure; The at least one piezoelectric fiber composite material driver in the first active medium and high frequency vibration reduction structure is configured to perform a second vibration reduction operation in response to the second control signal.

2. The vibration-damping support member according to claim 1, characterized in that: The plurality of hollow structures arranged in an array form a zero Poisson's ratio configuration.

3. The vibration-damping support member according to claim 1, characterized in that: The low-frequency resonant structure is a local resonant superstructure; The local resonance superstructure includes a substrate, a plurality of scatterers and a plurality of wrapping layers; The plurality of scatterers and the plurality of wrapping layers correspond to each other one by one, and a corresponding wrapping layer is provided on the periphery of each of the plurality of scatterers; Each scatterer and the corresponding wrapping layer are embedded in the matrix and penetrate the matrix.

4. The vibration-damping support member according to claim 1, characterized in that: The array is arranged in N rows and M columns; The plurality of first hollow structures include a first row of hollow structures, a second row of hollow structures, an N-1th row of hollow structures, and an Nth row of hollow structures; The plurality of second hollow structures include a third row of hollow structures and an N-2th row of hollow structures.

5. The vibration-damping support member according to claim 1, characterized in that: The array is arranged in N rows and M columns; The plurality of third hollow structures include a fourth row of hollow structures and an N-3th row of hollow structures.

6. The vibration-damping support member according to claim 1, characterized in that: The thickness of the vibration-damping support member is positively correlated with the support stiffness of the vibration-damping support member.

7. The vibration-damping support member according to claim 1, characterized in that: The resonant frequency of the low-frequency resonant structure is determined according to the material and structure of the low-frequency resonant structure.

8. A vibration-damping support device, characterized in that: It comprises a base, four first support members and eight second support members, wherein: The first support member is a rectangular vibration-damping support member according to any one of claims 1 to 7, and the second support member is a right-angled triangle vibration-damping support member according to any one of claims 1 to 7; Each of the four first support members corresponds to two second support members, and different first support members correspond to different second support members; The four first support members are combined to form a support structure, and the support structure is arranged on the base; The right-angle side of each of the eight second support members is connected to the right-angle side formed by the corresponding first support member and the base.

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