UV curing equipment for semiconductor manufacturing

Abstract

The present invention provides a UV curing device for semiconductor manufacturing, comprising: a curing chamber, a main illumination module, a homogenizing module, a measuring module, two or more supplementary light modules and a control module; a base is arranged in the curing chamber; the main illumination module is located above the curing chamber; the homogenizing module is located between the main illumination module and the base, and is used to evenly disperse the UV light emitted by each module to the top of the base; the measuring module is used to measure the UV power after homogenization by the homogenizing module; each supplementary light module includes at least one UV lamp, the sum of the actual power of the UV lamps of each supplementary light module is less than 60% of the sum of the calibrated power of the main illumination module, and the sum of the actual power of the UV lamps of different supplementary light modules is different; the control module is connected with the measuring module and each supplementary light module, so as to start the corresponding supplementary light module based on the measurement result of the measuring module, so that the UV power after homogenization by the homogenizing module meets the process requirements. The present invention can improve the uniformity of curing, reduce production costs, and reduce environmental pollution.

Description

Technical Field

[0001] The invention relates to the technical field of integrated circuit manufacturing, and in particular to a UV curing device used in semiconductor manufacturing. Background Art

[0002] UV curing (UV Cure) is a common process in semiconductor chip manufacturing. For example, after photolithography development, photoresist is often cured to improve its strength and prevent the photolithography pattern from collapsing. Or UV curing is performed after the protective glue is applied to enhance the strength of the protective glue. Existing UV curing devices usually use multiple UV lamps to directly irradiate the wafer to be processed to achieve UV curing, and there is often a problem of uneven curing. On the other hand, UV lamps are prone to aging after a period of use, resulting in insufficient power, resulting in poor curing effect. If a UV lamp fails, it needs to be shut down for replacement, resulting in a decrease in equipment output. For UV lamps whose actual power is lower than the rated power (i.e., the factory power provided by the UV lamp manufacturer) due to aging, if the difference with the rated power is not large, for example, the difference is within 20%, some semiconductor factories continue to use it and compensate for the problem of insufficient UV lamp power by extending the illumination time, but the disadvantage of this treatment is a decrease in equipment output (i.e., a decrease in WPH, wafer per hour, the number of wafers produced per hour). If the actual power of a UV lamp differs too much from the rated power, for example, the difference is more than 40%, most semiconductor factories will discard the UV lamp. Since UV lamps are expensive and used in large quantities, this will increase production costs, and discarded UV lamps will also cause environmental pollution problems due to the mercury they contain.

[0003] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present invention and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because these solutions are described in the background technology section of the present invention. Summary of the invention

[0004] In view of the shortcomings of the prior art described above, the object of the present invention is to provide a UV curing device for semiconductor manufacturing, which is used to solve the problems in the prior art of using a single UV light module to directly irradiate and cure the wafer, which is prone to uneven curing, and the need to shut down and replace the UV lamp when it fails, and / or when the actual power of the UV lamp is insufficient, the illumination time is extended, which will lead to a decrease in equipment output, and the UV lamp with insufficient actual power is directly scrapped, resulting in increased production costs and pollution.

[0005] To achieve the above-mentioned purpose and other related purposes, the present invention provides a UV curing device for semiconductor manufacturing, comprising: a curing chamber, a main illumination module, a homogenizing module, a measuring module, two or more fill-in light modules and a control module; a base for carrying a substrate to be cured is arranged in the curing chamber; the main illumination module is located above the curing chamber, and comprises at least one UV lamp; the homogenizing module is located between the main illumination module and the base, and is used to evenly disperse the UV light emitted by the main illumination module and the fill-in light module above the base; the measuring module is used to measure the UV power after homogenization by the homogenizing module; each fill-in light module comprises at least one UV lamp, the sum of the actual powers of the UV lamps of each fill-in light module is less than 60% of the sum of the calibrated powers of the main illumination module, and the sum of the actual powers of the UV lamps of different fill-in light modules is different; the control module is connected with the measuring module and each fill-in light module, so as to start the corresponding fill-in light module based on the measurement result of the measuring module, so that the UV power after homogenization by the homogenizing module meets the process requirements.

[0006] Optionally, the light homogenizing module includes a light homogenizing cavity and a light homogenizer disposed in the light homogenizing cavity, and the main illumination module and each fill light module are located above the light homogenizing module.

[0007] Optionally, a light-proof layer and / or a reflective material layer is provided on the non-irradiated surface of the light homogenizing cavity.

[0008] Optionally, when there are more than three fill light modules, the sum of the actual powers of UV lamps of different fill light modules is an arithmetic progression, and the tolerance is 10% of the rated power of the main illumination module.

[0009] Optionally, the measuring module includes a power meter and / or an illuminance meter.

[0010] Optionally, the UV curing device further includes a driving mechanism for driving the base to rotate and / or lift.

[0011] Optionally, the UV curing device further comprises a dimming module, and the dimming module is used to reduce the UV light intensity when the sum of the UV lamp powers of the main illumination module and the supplemental light module exceeds a certain threshold value required by the process.

[0012] In an optional solution, the light reduction module includes a thermochromic layer located below the light homogenization module.

[0013] In another optional solution, the dimming module includes a baffle that can be moved below the light homogenization module, and the light transmittance of the baffle is less than the light transmittance of the exit surface of the light homogenization module.

[0014] Optionally, the UV curing device further comprises an alarm module, which is connected to the measuring module to issue an alarm message when the result detected by the measuring module exceeds a preset value.

[0015] As described above, the UV curing device for semiconductor manufacturing provided by the present invention has the following beneficial effects: the UV curing device for semiconductor manufacturing provided by the present invention can improve the curing uniformity and ensure the curing effect through the ingenious design and coordination of the main illumination module, the uniform illumination module, the measurement module, two or more supplementary illumination modules and the control module, and can significantly extend the service life of the UV light irradiation module, and reduce the problem of equipment output rate reduction due to maintenance under the existing single UV light irradiation module. In addition, the reuse of defective UV lamps can be realized, which can not only reduce production costs, but also reduce the waste of UV lamps and reduce environmental pollution. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The figure shows an exemplary cross-sectional structure diagram of a UV curing device for semiconductor manufacturing provided by the present invention. DETAILED DESCRIPTION

[0017] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. For example, when describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional view showing the device structure will not be partially enlarged according to the general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0018] For ease of description, spatially relative terms such as "under", "below", "below", "below", "above", "on", etc. may be used herein to describe the relationship of one element or feature shown in the drawings to other elements or features. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the drawings. In addition, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.

[0019] In the context of the present invention, a structure in which a first feature is described as being "above" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0020] It should be noted that the diagrams provided in this embodiment are only schematic illustrations of the basic concept of the present invention, and the diagrams only show the components related to the present invention rather than the number, shape and size of the components in actual implementation. The type, quantity and proportion of each component in actual implementation may be changed at will, and the layout of the components may also be more complicated. In order to make the diagrams as concise as possible, not all structures are marked in the drawings.

[0021] like Figure 1 As shown, the present invention provides a UV curing device for semiconductor manufacturing, comprising: a curing chamber 1, a main illumination module 2, a uniform light module 3, a measurement module 4, two or more fill light modules 5 and a control module 6.

[0022] The UV curing device can be a device for curing the developed photoresist by light in the photolithography process, or a device for curing the protective glue in the packaging process, or a device for curing the bonding glue in the bonding process. Or it can be a device for UV irradiation of the deposited film layer after the CVD process. It can be UV curing for wafers, UV curing for LCD processes, or curing for LED processes. The specific use is not limited in this embodiment, but the model and curing temperature of the UV lamp used are different according to the specific use occasions.

[0023] Depending on the substrate 7 to be processed, the curing chamber 1 may have different shapes, for example, the curing chamber 1 may be generally cylindrical. The inner wall surface of the curing chamber 1 may be provided with a heat-insulating material layer, such as a graphite layer, to prevent heat from diffusing outward. Valves 12 for the substrate 7 to enter and exit may be provided on opposite sides of the cavity. In some examples, an air inlet and an exhaust port (not shown) may be provided on the curing chamber 1. The air inlet and the exhaust port may be provided at different positions or at the same position on the surface of the curing chamber 1. The curing chamber 1 may be evacuated and / or exhausted through the air inlet and the exhaust port so that the curing process is carried out in a vacuum or inert gas atmosphere. A base 11 for carrying the substrate 7 to be cured is provided in the curing chamber 1. The substrate 7 may be a semiconductor material such as a silicon wafer, a glass material, or a polymer compound material. The shape of the base 11 varies depending on the shape of the substrate 7. For example, in this embodiment, the substrate 7 is a silicon wafer, and the base 11 has at least one circular carrier that matches the morphology of the wafer, and the carrier can fix the wafer on its surface based on the principle of electrostatic adsorption or vacuum adsorption. In some examples, the base 11 also includes a support shaft connected to the bottom of the carrier and extending to the outside of the curing chamber 1, and the support shaft is connected to a driving mechanism (not shown) to drive the base 11 to rotate and / or lift. For example, the driving mechanism includes a lifting cylinder, and when the substrate 7 is placed in the cavity or removed from the cavity, the substrate 7 can be moved to a corresponding height by lifting the base 11.

[0024] The main illumination module 2 is located above the curing chamber 1, includes at least one UV lamp, and can be located above the center of the base 11. When it includes multiple UV lamps, the multiple UV lamps can be arranged side by side or on the same circular surface. The main illumination module 2 is the first light source for irradiating and curing the substrate 7, and it is kept normally open during the process, that is, during the UV curing process. In a preferred example, initially, the UV lamps of the main illumination module 2 are all qualified new products from the UV lamp manufacturer, and the actual power of each UV lamp is the rated power of the lamp, and the sum of the rated powers of all UV lamps in the main illumination module 2 is the power required for the curing process. When the UV light power it provides is not enough to meet the process requirements, the fill light module 5 is started.

[0025] The light homogenizing module 3 is located between the main illumination module 2 and the base 11, and is used to evenly disperse the UV light emitted by the main illumination module 2 and the fill light module 5 above the base 11, so as to UV cure the substrate 7 located on the surface of the base 11. In order to minimize the light loss, in some examples, the light homogenizing module 3 includes a light homogenizing cavity and a light homogenizer arranged in the light homogenizing cavity, and the main illumination module 2 and each fill light module 5 are located above the light homogenizing module 3, for example, multiple fill light modules 5 are arranged around the main illumination module 2, that is, the main illumination module is located above the center of the cavity. The UV lamps of the fill light module and the main illumination module can be directly incident on the surface of the light homogenizer. Or the main illumination module and the fill light module can have a frame with a transparent material on the bottom surface to place the UV lamps of each module in the corresponding frame. Depending on the structure of the light homogenizer, the light homogenizing cavity can have different shapes, but the UV light emitting surface of its bottom surface must be basically consistent with the morphology and size of the substrate 7. For example, in some examples, the homogenizing cavity can be a conical annular cavity with an upper size smaller than a lower size. In other examples, the homogenizing cavity can also be a cylindrical annular cavity. The homogenizer can be made of an optical material with high light transmittance, such as optical glass and / or a polymer film, and a precise optical structure is arranged inside. Through optical refraction and reflection, the incident optical light is reflected and refracted multiple times, so that the light is diffused during the propagation process, thereby achieving a uniform distribution effect of the output light. The specific type of the homogenizer is not limited in this embodiment, as long as it can meet the homogenizing effect and its material is sufficient to withstand UV irradiation. To further reduce the light loss, in some examples, the non-irradiated surface of the homogenizing cavity, such as its side wall surface and the top surface except for the UV light incident, can be provided with an opaque layer, for example, the surface of the homogenizing cavity can be coated with a graphite layer with light shielding and heat insulation. In other examples, the non-irradiated surface of the homogenizing cavity is provided with a reflective material layer with high reflectivity such as silver to reflect the UV light incident on the cavity wall back to the homogenizer. Alternatively, the non-irradiated surface of the light homogenizing cavity may be provided with a light-shielding material layer and a reflective material layer located on the surface of the light-shielding material layer.

[0026] The measuring module 4 is used to measure the UV power after being homogenized by the homogenizing module 3 to detect whether the UV power after homogenization meets the process requirements. The setting position of the measuring module 4 can be determined according to the type of the measuring module 4. For example, in some examples, the measuring module 4 is a power meter, which can be set at a position adjacent to the bottom surface of the homogenizing module 3. In other examples, the measuring module 4 is an illuminometer, which can also be set at a position adjacent to the bottom surface of the homogenizing module 3. Or both types of measuring modules 4 can be set at the same time, or an instrument with both detection functions can be used, such as a UV energy irradiation recorder that can simultaneously detect the light intensity and energy value of the UV light source. And when there are more than two measuring modules 4, it is preferred that different measuring modules 4 are set at different positions, and the homogenization effect of the homogenizing module 3 can be verified by comparing the detection results of different measuring modules 4, further improving the detection accuracy. When it is detected that the UV power at two different positions is different and the difference is large, the equipment can be tested. In other examples, a thermometer can be used to determine whether the UV illumination meets the process requirements. Because UV curing achieves the curing of the material on the surface of substrate 7 by making the surface of substrate 7 reach a certain temperature through UV irradiation, a thermometer can be set near substrate 7, or a thermometer can be directly embedded on the surface of base 11 to detect whether the temperature after UV light irradiation reaches the curing temperature.

[0027] There are at least two fill-in light modules 5. Each fill-in light module 5 includes at least one UV lamp, and the sum of the actual power of the UV lamps of each fill-in light module 5 is less than 60% of the sum of the rated power of the main illumination module 2, preferably less than 50%, and the sum of the actual power of the UV lamps of different fill-in light modules 5 is different. The UV lamps in the fill-in light module 5 and the main illumination module 2 are preferably of the same model, so each UV lamp has the same rated power, but the actual power is different. For example, in some examples, the initial power of the UV lamp of the main illumination module 2 is the rated power, while the UV lamp of the fill-in light module 5 is identified as a defective product or a scrap product that was originally to be discarded according to the original standards of the semiconductor factory, so the actual power is less than 50% of the rated power, or even less than 20% of the rated power. The number of UV lamps of each fill-in light module 5 can be the same or different. What is important is to look at the actual power of the UV lamp to ensure that the sum of the actual power of the UV lamps of different fill-in light modules 5 is different. The method for measuring the actual power of the UV lamp of the fill-in light module 5 can be different depending on its source. For example, if it is a scrapped product on the equipment of a semiconductor factory, the aforementioned power meter and / or illuminance meter can be used for detection, and the accuracy of the measurement results can be further verified by process experiments. If it is a defective product purchased from a UV lamp manufacturer, the value provided by the manufacturer can be used as a basis, and process verification can be performed if necessary. If the fill light module 5 contains more than two UV lamps, the sum of the powers of several UV lamps can be measured in addition to the actual power of each UV lamp measured separately. Depending on the number of fill light modules 5, the actual power of each fill light module 5 can also be flexibly set. For example, if there are two fill light modules 5, the power of one of the fill light modules 5 can be set to 60% of the rated power of the main illumination module 2, and the other can be set to 40% of the rated power of the main illumination module 2. If there are more than three fill light modules 5, the sum of the actual powers of the UV lamps of different fill light modules 5 is an arithmetic progression, and the tolerance can be set to a process deviation value. For example, it can be set to 10% of the rated power of the main illumination module 2, such as the actual power of the UV lamp of the fill light module 5 is 60%, 50%, 40%, 30%, 20%, 10% of the rated power of the main illumination module 2, respectively. The more the number of fill light modules 5, the higher the fill light accuracy, but the corresponding equipment is also more complex. Preferably, there are 2-4 fill light modules 5.

[0028] The control module 6 is connected to the measuring module 4 and each fill-in light module 5 (the main illumination module is in a normally open state during the process, and it can also be controlled by the control module) to start the corresponding fill-in light module 5 based on the measurement result of the measuring module 4, so that the UV power after the uniform light module 3 meets the process requirements. The control module can be a module including a single-chip microcomputer or an industrial computer. For example, when the actual power of the main illumination module 2 is measured to be 70% of the power required for the curing process, the control module 6 starts the fill-in light module 5 whose actual power is 30% of the rated power. If there is no fill-in light module 5 that meets this power, then under the first principle of minimizing the difference, the control module 6 will give priority to starting the fill-in light module 5 whose actual power value is greater than 30% of the rated power. For example, when the actual power of the main illumination module 2 is measured to be 70% of the power required for the curing process, and there are only two types of fill-in light modules 5 whose actual power is 40% and 20% of the rated power, the control module 6 will choose to start the fill-in light module 5 whose actual power is 40% of the rated power. As required, the control module 6 can start a single fill light module 5 at a time, or it may start two or more fill light modules 5 at the same time. For example, when the actual power of the main illumination module 2 is measured to be 50% of the power required for the curing process, but there is no fill light module 5 whose actual power sum is 50% of the total calibrated power, and there are only two fill light modules 5 whose actual power sum is 20% and 30% of the total calibrated power, then the control module 6 will start the two fill light modules 5 at the same time. And it should be particularly noted that the sum of the actual power of the main illumination module 2 and the fill light module 5 will change with the extension of the use time, so which fill light module 5 is specifically enabled is not fixed. Specifically, the control module 6 selects the best one according to the measurement results of the measurement module 4, the process curing process and the tolerance set in advance. In addition, the control module can adjust the main illumination module and the fill light module according to the actual situation. For example, when the actual power of the main illumination module drops below the actual power of the fill-light module, the corresponding fill-light module can be adjusted to the main illumination module and the main illumination module can be adjusted to the fill-light module, so as to minimize the number of activated illumination modules without stopping the equipment and extend the service life of the equipment. Alternatively, a standby illumination module that is normally turned off (whose actual power is the same as the initial actual power of the main illumination module) can be provided. When the actual power of the main illumination module is less than a certain power (for example, its actual power drops by more than 50%), it is downgraded to a fill-light module, and the standby illumination module is activated as the main illumination module, which helps to further extend the service life of the equipment.

[0029] The UV curing device for semiconductor manufacturing provided by the present invention can improve the curing uniformity and ensure the curing effect through the ingenious design and coordination of the main illumination module, the uniform illumination module, the measurement module, two or more supplementary illumination modules and the control module, and can significantly extend the service life of the UV light irradiation module, and reduce the problem of equipment output rate reduction due to maintenance under the existing single UV light irradiation module. In addition, the re-use of defective UV lamps can be realized, which can not only reduce production costs, but also reduce the waste of UV lamps and reduce environmental pollution.

[0030] The UV light irradiation power is not as large as possible, especially in some fine graphics processes, if the actual power is too large, it may cause excessive hardening of the photoresist, resulting in difficulty in subsequent glue removal. However, due to the limited number of fill light modules 5, sometimes after starting the fill light module 5, when the sum of the actual powers of the fill light module 5 and the main illumination module 2 exceeds a certain threshold value (for example, exceeding 20%) of the sum of the powers required for the process, intervention may be required. To this end, in some examples, the UV curing device also includes a dimming module, which is used to reduce the UV light intensity when the sum of the UV lamp powers of the main illumination module 2 and the fill light module 5 exceeds a certain threshold value required by the process (for example, exceeding 20% ​​of the power required for the process). For example, in some examples, the dimming module includes a thermochromic layer located below the homogenizing module 3, for example, a thermochromic material layer can be arranged in the emission direction of the homogenizing cavity. Select a suitable material according to the curing temperature. When the temperature after UV light irradiation exceeds the discoloration threshold of the thermochromic layer, the thermochromic layer changes color, and its transmittance changes, so that the UV light irradiated to the surface of the substrate 7 is reduced. The material of the thermochromic layer depends on the curing temperature, and can be an organic polymer material that is transparent at room temperature, or an inorganic material such as tungsten oxide, vanadium oxide, etc., without specific restrictions. In addition to thermochromic materials, suitable electrochromic materials can also be used to achieve similar effects. In some other examples, the dimming module includes a baffle 9 that can be moved to the bottom of the light homogenizing module 3, and the transmittance of the baffle 9 is less than the transmittance of the exit surface of the light homogenizing module 3. The baffle 9 is, for example, 2 semicircular or 4 fan-shaped glass materials. When the baffle 9 is moved to the top of the base 11, its combined size is basically the same as the size of the substrate 7. The scheme of using a thermochromic layer and a baffle 9 in the dimming module has its own advantages and disadvantages. For example, the use of a thermochromic layer is simpler in structure, but the selection of a suitable material requires complex experiments. The scheme using the baffle 9 is simpler in material selection, but its setting is more complicated.

[0031] In some examples, when the dimming module is not provided, the UV curing device further includes an alarm module 8, which is connected to the measuring module 4 to send out an alarm message when the result detected by the measuring module 4 exceeds a preset value, for example, when it exceeds 20% of the curing process power, so as to remind the staff to take countermeasures, for example, the staff can adjust the power by adjusting the power size. The alarm module can be an acoustic and optical alarm, or can be an alarm device with a communication function to send the alarm message to the mobile phone and / or computer of the relevant staff by SMS notification.

[0032] As mentioned above, the actual power of the main lighting module and the supplementary light module will change with the extension of the use time, so regular inspections can be carried out, such as inspections during equipment maintenance, and rearranged according to the inspection results. For example, the UV lamps of each module can be re-tested and matched when the sum of the actual power of all modules is less than half of the initial power, or the UV lamps of each module can be re-tested and matched when the sum of the actual power of the main lighting module is less than half of the sum of the calibrated power. There is no specific limitation.

[0033] In summary, the present invention provides a UV curing device for semiconductor manufacturing, comprising: a curing chamber, a main illumination module, a homogenizing module, a measuring module, two or more fill-in light modules and a control module; a base for carrying a substrate to be cured is arranged in the curing chamber; the main illumination module is located above the curing chamber, and comprises at least one UV lamp; the homogenizing module is located between the main illumination module and the base, and is used to evenly disperse the UV light emitted by the main illumination module and the fill-in light module above the base; the measuring module is used to measure the UV power after homogenization by the homogenizing module; each fill-in light module comprises at least one UV lamp, the sum of the actual powers of the UV lamps of each fill-in light module is less than 60% of the sum of the calibrated powers of the main illumination module, and the sum of the actual powers of the UV lamps of different fill-in light modules is different; the control module is connected with the measuring module and each fill-in light module, so as to start the corresponding fill-in light module based on the measurement result of the measuring module, so that the UV power after homogenization by the homogenizing module meets the process requirements. The UV curing device for semiconductor manufacturing provided by the present invention can improve the curing uniformity and ensure the curing effect through the ingenious cooperation of the main illumination module, the uniform illumination module, the measuring module, two or more supplementary illumination modules and the control module, and can significantly extend the service life of the UV light irradiation module, and reduce the problem of equipment output rate reduction due to maintenance under the existing single UV light irradiation module. In addition, the re-use of defective UV lamps can be realized, which can not only reduce production costs, but also reduce the waste of UV lamps and reduce environmental pollution.

[0034] Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

[0035] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A UV curing device for semiconductor manufacturing, characterized in that: include: Curing chamber, main lighting module, uniform light module, measurement module, two or more fill light modules, control module; A base for carrying a substrate to be cured is arranged in the curing chamber; the main illumination module is located above the curing chamber and includes at least one UV lamp; the homogenizing module is located between the main illumination module and the base and is used to evenly disperse the UV light emitted by the main illumination module and the fill light module above the base; the measuring module is used to measure the UV power after homogenization by the homogenizing module; each fill light module includes at least one UV lamp, the sum of the actual powers of the UV lamps of each fill light module is less than 60% of the sum of the calibrated powers of the main illumination module, and the sum of the actual powers of the UV lamps of different fill light modules is different; the control module is connected to the measuring module and each fill light module to start the corresponding fill light module based on the measurement result of the measuring module, so that the UV power after homogenization by the homogenizing module meets the process requirements.

2. The UV curing device according to claim 1, characterized in that: The light homogenizing module comprises a light homogenizing cavity and a light homogenizer arranged in the light homogenizing cavity, and the main illumination module and each supplementary light module are located above the light homogenizing module.

3. The UV curing device according to claim 2, characterized in that: The non-irradiated surface of the light homogenizing cavity is provided with a light-proof layer and / or a reflective material layer.

4. The UV curing device according to claim 1, characterized in that: When there are more than three fill light modules, the sum of the actual powers of the UV lamps of different fill light modules is an arithmetic progression, and the tolerance is 10% of the rated power of the main lighting module.

5. The UV curing device according to claim 1, characterized in that: The measuring module includes a power meter and / or an illuminance meter.

6. The UV curing device according to claim 1, characterized in that: The UV curing device also includes a driving mechanism for driving the base to rotate and / or lift.

7. The UV curing device according to claim 1, characterized in that: The UV curing device further comprises a light reduction module, which is used to reduce the UV light intensity when the sum of the UV lamp powers of the main illumination module and the supplementary light module exceeds a certain threshold value required by the process.

8. The UV curing device according to claim 7, characterized in that: The light reduction module includes a thermochromic layer located below the light uniformity module.

9. The UV curing device according to claim 7, characterized in that: The dimming module includes a baffle that can be moved to the bottom of the light homogenizing module, and the light transmittance of the baffle is less than the light transmittance of the exit surface of the light homogenizing module.

10. The UV curing device according to claim 1, characterized in that: The UV curing device also includes an alarm module, which is connected to the measuring module to issue an alarm message when the result detected by the measuring module exceeds a preset value.

Images