System and method for testing glue curing shrinkage stability of optical-mechanical system of laser machine

Abstract

The invention relates to the technical field of optical-mechanical system glue application, and discloses a system and a method for testing glue curing shrinkage stability of an optical-mechanical system of a laser machine. The system comprises a pressing and fixing device which comprises a spring, a pull rod, a needle gauge, a pressing piece and a fixing block, and position switching of the needle gauge between the inner surface and the outer surface of the fixing block is achieved by rotating the pull rod head corresponding to the pull rod; the glue curing unit comprises a UV curing device, a precise temperature control heating platform and a moisture curing environment generator; the light source unit comprises a laser light source and a stable support structure with a clearance fit hoop; the optical machine gluing unit comprises a mirror base and a reflecting mirror; the pressing and fixing device is rigidly connected with the optical platform through the aluminum profile portal frame; the data acquisition unit comprises a CCD (charge coupled device) sensor, a three-dimensional adjustable fixing device and an analysis module, and the analysis module generates a multi-dimensional stability index by resolving the time sequence data of the coordinates of the reflected light spots acquired by the CCD sensor in real time so as to complete the glue curing shrinkage stability test.

Description

Technical Field

[0001] The present application relates to the technical field of glue application in opto-mechanical systems, and in particular, to a testing system and method for the curing shrinkage stability of glue in a laser machine opto-mechanical system. Background Art

[0002] In a laser machine opto-mechanical system, optical elements such as mirrors are usually fixed to the mirror base by adhesives. The shrinkage behavior during the glue curing process will cause stress changes, which in turn affect the position accuracy of the optical elements and the optical path stability. In the prior art, the following deficiencies exist in the testing methods for glue curing shrinkage:

[0003] 1. Traditional curing processes mostly use a single curing method (such as only UV curing or thermal curing), which is difficult to simulate complex combined curing scenarios (such as thermal curing after UV pre-curing) in actual applications, and lack accurate coupled monitoring of temperature during the curing process, resulting in the inability to accurately capture the shrinkage characteristics of the glue under different temperature fields;

[0004] 2. The pressing stability of the fixing device for the optical element is insufficient. The traditional mechanical fixing method is difficult to achieve stress-free position fixing during the curing process, and the adjustment accuracy is low, unable to meet the fixing requirements under small gaps (such as micro-bead gap control structures);

[0005] 3. The data acquisition dimension is single. Existing tests mostly only focus on the curing shrinkage rate, ignoring key indicators such as the directional offset and stress relaxation coefficient, and lack real-time time-series calculation of the spot coordinates, making it difficult to dynamically evaluate the multi-dimensional changes in the optical path stability during the curing process.

[0006] Therefore, there is an urgent need for a system and method to solve at least one of the above problems. Summary of the Invention

[0007] The present application provides a testing system and method for the curing shrinkage stability of glue in a laser machine opto-mechanical system, aiming to solve the problems in the prior art that the testing methods for glue curing shrinkage mostly use a single curing method, the pressing stability of the fixing device for the optical element is insufficient, and the data acquisition dimension is single.

[0008] In the first aspect, an embodiment of the present application provides a testing system for the curing shrinkage stability of glue in a laser machine opto-mechanical system, including:

[0009] A pressing and fixing device, including a spring, a pull rod, a pin gauge, a pressing piece and a fixing block, and the position of the pin gauge between the inner surface and the outer surface of the fixing block is switched by rotating the corresponding pull rod head of the pull rod;

[0010] The glue curing unit includes a UV curing device, a precision temperature-controlled heating platform, and a moisture curing environment generator. The precision temperature-controlled heating platform is used to achieve a sequential combined curing mode of UV curing and thermal curing;

[0011] The light source unit includes a laser light source and a stable support structure with a clearance fit hoop;

[0012] The optical mechanical adhesive unit includes a lens holder and a reflector. The surface of the lens holder is provided with a microbead gap control structure; the temperature sensor probe corresponding to the glue curing unit forms a direct contact thermal coupling with the dispensing surface of the lens holder;

[0013] The optical platform, the pressing and fixing device forms a rigid connection with the optical platform through an aluminum profile gantry;

[0014] The data acquisition unit includes a CCD sensor, a three-dimensional adjustable fixing device, and an analysis module. The analysis module generates multi-dimensional stability indicators including curing shrinkage rate, directional offset, and stress relaxation coefficient by real-time calculating the reflection spot coordinate time series data collected by the CCD sensor to complete the glue curing shrinkage stability test.

[0015] In some embodiments, a silicone pad with back glue is provided between the pressing piece of the pressing and fixing device and the optical element reflector. The compression deformation rate of the silicone pad in the pressed state is greater than or equal to a preset deformation rate, and the contact pressure uniform distribution coefficient with the surface of the lens holder is greater than or equal to a preset distribution coefficient.

[0016] In some embodiments, the position switching between the pin gauge and the fixed block includes: when the head of the pull rod rotates to a first angle, the bottom surface of the pin gauge closely adheres to the inner surface of the fixed block to form a pressing limit; when the head of the pull rod rotates to a second angle, the top surface of the pin gauge abuts against the outer surface of the fixed block to form a released state.

[0017] In some embodiments, the spring provides at least 10N controllable pre-tightening force in the pressed state, and the wire diameter tolerance of the spring is less than or equal to a preset tolerance, and the repeated positioning accuracy of the compression stroke is less than or equal to a preset accuracy.

[0018] In some embodiments, the sequential combined curing mode of the glue curing unit includes: the UV curing device triggers a photoinitiation reaction. After the curing degree reaches a preset range, the precision temperature-controlled heating platform starts a thermal curing program to form a two-stage UV-thermal curing.

[0019] In some embodiments, the gap between the hoop and the support frame is a dynamic buffer gap of 0 - 0.5mm, and the inner wall of the hoop is provided with a polyurethane damping layer.

[0020] In some embodiments, the microbeads in the microbead gap control structure are glass microbeads or ceramic microbeads, and are embedded in the surface of the lens holder in an array form.

[0021] In some embodiments, the real-time solution of the analysis module specifically includes: calculating the curing shrinkage rate based on the centroid drift algorithm of the reflected light spot coordinates corresponding to the time series data of the reflected light spot coordinates according to the initial light spot coordinates and the real-time coordinates; and calculating the peak-to-peak fluctuation amount of the light spot position before and after curing through a standard deviation analyzer.

[0022] Exemplarily, the centroid drift algorithm of the reflected light spot coordinates corresponding to the time series data of the reflected light spot coordinates calculates the curing shrinkage rate according to the initial light spot coordinates and the real-time coordinates, including: performing noise reduction and edge enhancement on the initial light spot coordinates and the real-time coordinates, and extracting the light spot contour features; inputting the light spot contour features and the time series corresponding to the time series data of the reflected light spot coordinates into an encoding model constructed based on a 3D convolutional neural network and a long short-term memory network for encoding the light spot contour features and the time series, and outputting a feature vector including the dynamic changes in the curing process; generating the curing shrinkage rate according to the feature vector; wherein, the training process of the encoding model introduces a physical constraint loss function based on the glue curing kinetics model, and the constraint conditions include the theoretical relationship between the volume change of the glue layer and the light spot offset amount, and the theoretical relationship is generated by the volume shrinkage amount of the glue layer, the offset amount of the centroid coordinates of the light spot, the optical path from the mirror to the CCD, and the change in the mirror inclination angle.

[0023] In a second aspect, the present application provides a method for testing the curing shrinkage stability of the glue in a laser machine optical-mechanical system, which is applied to the laser machine optical-mechanical system glue curing shrinkage stability test system provided in any embodiment of the present application, and the method includes:

[0024] By means of the spring, pull rod, needle gauge, pressing piece and fixing block of the pressing and fixing device, rotate the head of the pull rod to switch the position of the needle gauge between the inner surface and the outer surface of the fixing block, so as to realize the pressing and fixing of the lens holder and the mirror in the optical-mechanical adhesive unit;

[0025] Utilize the UV curing device, precision temperature control heating platform and moisture curing environment generator of the glue curing unit, and execute the sequential combination curing mode of UV curing and thermal curing through the precision temperature control heating platform, and directly contact the temperature sensor probe with the glue dispensing surface of the lens holder for thermal coupling to monitor the temperature during the curing process;

[0026] Start the laser light source of the light source unit, fix the light source through the stable support structure with a clearance fit clamp, and make the laser beam project onto the mirror of the optical-mechanical adhesive unit;

[0027] Adjust the position of the CCD sensor of the data acquisition unit through the three-dimensional adjustable fixing device for real-time acquisition of the time series data of the coordinates of the reflected light spot;

[0028] According to the analysis module, the collected time-series data of the spot coordinates are solved in real time to generate multi-dimensional stability indicators including the curing shrinkage rate, the directional offset, and the stress relaxation coefficient, completing the glue curing shrinkage stability test.

[0029] The provided system and method have the following beneficial effects:

[0030] 1. Solve the problem of the singularity of traditional curing processes and improve test compatibility: Multi-mode curing ability: Support UV, heat, moisture, and combined curing (such as UV + stepwise temperature increase), covering more than 95% of the adhesive types on the market (epoxy glue, silicone rubber, UV glue, etc.), especially suitable for new composite curing glues (such as UV shaping first and then heat curing for enhancement), avoiding the defect that traditional single-curing equipment cannot simulate the actual process. Precise temperature control and humidity control: The temperature sensor directly contacts the adhesive layer interface, solving the problem of heat conduction delay of the traditional heating platform "temperature control platform → mirror base → adhesive layer", ensuring a high degree of coincidence between the curing curve and the process parameters in the glue datasheet, and the test results are closer to the actual application scenario.

[0031] 2. Optimize the fixing stability of optical components and reduce test errors: Elastic pressing + pin gauge positioning: The spring provides a constant elastic force to compensate for possible thermal expansion of components or deformation of the adhesive layer during curing, and the pin gauge limits prevent the pressing piece from being pressed down excessively. Compared with the traditional rigid pressing with screws (which is prone to component deformation due to stress concentration), the displacement measurement error is reduced from ±5μm to within ±1μm. Microbead gap control structure: By standardizing the adhesive layer thickness (such as 50μm), the influence of uneven dispensing volume on the shrinkage rate is eliminated, making the test data of different batches comparable, and solving the problem of result dispersion caused by the thickness difference of traditional manual dispensing.

[0032] 3. Multi-dimensional data collection to comprehensively evaluate curing stability: Break through the limitation of single indicators: Traditional tests only measure the linear shrinkage or hardness after curing, while this system synchronously monitors "shrinkage rate (volume change) - pointing offset (functional impact) - stress relaxation (long-term stability)". For example, the shrinkage rate reflects the volume change of the adhesive layer before and after curing and the chemical reaction during curing; the pointing offset is directly related to the optical path stability of the optomechanical system (such as the offset of the reflector in a laser marking machine resulting in a deviation in the marking position); the stress relaxation coefficient predicts the risk of stress fatigue caused by temperature cycling during long-term use. Real-time dynamic analysis: By high-frequency spot collection (second-level resolution), capture the mutation signals at key stages during curing (such as the gel point), providing dynamic data support for glue formula optimization (such as adjusting the curing agent ratio). Compared with traditional offline measurement after curing, process defects (such as stress concentration caused by too fast heating rate) can be detected in advance.

[0033] 4. Engineering design improves test efficiency and reliability: Modular structure: Each unit (curing, fixing, collecting) is independently adjustable, supporting rapid replacement of test samples (mirror mounts) and glue types, and adapting to multi-scheme comparison tests in the R & D stage; Rigid reference and anti-interference: The rigid connection between the optical platform and the gantry, and the vibration isolation design of the light source clamp enable the system to operate stably in a common laboratory environment (non-super clean vibration isolation chamber), reducing the equipment deployment cost while ensuring μm-level displacement measurement accuracy.

[0034] In summary, through the technical combination of "adjustable elastic fixing - multi-mode precise curing - multi-dimensional dynamic measurement", this system constructs a full-process test system from curing process simulation to stability quantitative evaluation. It not only solves the three major pain points of traditional methods, but also improves the test accuracy and applicability to the engineering level through detailed innovations such as microbead gap control and direct thermal coupling temperature measurement, providing a scientific quantitative basis for the adhesive selection, process optimization and reliability design of the laser machine optical-mechanical system, and helping to improve the long-term stability and consistency of high-end laser equipment.

[0035] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and do not limit this application. Brief Description of the Drawings

[0036] In order to more clearly illustrate the technical solutions of the embodiments of this application, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0037] Figure 1 It is a schematic structural diagram of a glue curing shrinkage stability test system for a laser machine optical-mechanical system provided by an embodiment of the present invention;

[0038] Figure 2 It is a structural sectional view of a pressing and fixing device and an optical-mechanical adhesive unit provided by an embodiment of the present invention;

[0039] Figure 3 It is a structural sectional view after the pressing and fixing device is pressed provided by an embodiment of the present invention;

[0040] Figure 4 It is a schematic structural diagram after the pressing and fixing device is pulled up provided by an embodiment of the present invention;

[0041] Figure 5 It is a structural sectional view after the pressing and fixing device is pulled up and separated from the optical-mechanical adhesive unit provided by an embodiment of the present invention;

[0042] Figure 6Schematic structural diagram of the light source and its bracket provided by the embodiment of the present invention;

[0043] Figure 7 Schematic structural diagram of side dispensing of the optical machine adhesive unit provided by the embodiment of the present invention;

[0044] Figure 8 Schematic structural diagram of bottom dispensing of the optical machine adhesive unit provided by the embodiment of the present invention;

[0045] Figure 9 Graph showing the change of directivity of a kind of glue with time before curing, during curing and after curing for side dispensing of the glue provided by the embodiment of the present invention;

[0046] Figure 10 Graph showing the change of directivity of a kind of glue with time before curing, during curing and after curing for bottom dispensing of the glue provided by the embodiment of the present invention;

[0047] Figure 11 Schematic flow chart of the steps of a method for testing the shrinkage stability of glue curing in the optical machine system of a laser machine provided by the embodiment of the present invention.

[0048] Marking explanations corresponding to the attached drawings: 1 - pressing and fixing device, 2 - precisely temperature - controllable heating platform, 3 - light source unit, 4 - CCD sensor, 5 - optical machine adhesive unit, 6 - optical platform, 11 - spring, 12 - pull rod, 13 - pin gauge, 14 - pressing piece, 15 - silicone pad with adhesive backing, 16 - fixing block, 17 - aluminum profile gantry, 18 - screw with spring washer, 31 - laser light source, 32 - support frame, 33 - cross beam, 34 - hoop, 41 - CCD fixing and adjusting device, 51 - optical element mirror, 52 - mirror base, 53 - first side glue, 54 - second side glue, 55 - bottom dispensing, 121 - pull rod head, 161 - outer surface of the fixing block, 162 - inner surface of the fixing block.

[0049] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit this application. Detailed implementation manners

[0050] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0051] The flowcharts shown in the accompanying drawings are merely illustrative examples, not necessarily including all content and operations / steps, nor necessarily executed in the described order. For example, some operations / steps can also be decomposed, combined, or partially merged, so the actual execution order may change according to the actual situation.

[0052] It should be understood that, in order to facilitate a clear description of the technical solutions of the embodiments of the present invention, in the embodiments of the present invention, terms such as "first" and "second" are used to distinguish identical or similar items with basically the same functions and effects. Those skilled in the art can understand that the terms "first", "second", etc. do not limit the quantity and execution order, and the terms "first", "second", etc. do not necessarily limit to being different.

[0053] It should be understood that the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. As used in the specification of this application and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are intended to include the plural forms.

[0054] It should also be understood that the term "and / or" used in the specification of this application and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0055] The following will describe in detail some embodiments of this application in conjunction with the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0056] In a laser optical machine system, optical elements such as mirrors are usually fixed to the mirror base by adhesives. The shrinkage behavior during the glue curing process will cause stress changes, which in turn affect the position accuracy of the optical elements and the stability of the optical path. In the prior art, the test methods for glue curing shrinkage have the following deficiencies:

[0057] 1. Traditional curing processes mostly use a single curing method (such as only UV curing or thermal curing), which is difficult to simulate complex combined curing scenarios (such as thermal curing after UV pre-curing) in actual applications, and lack accurate coupling monitoring of the temperature during the curing process, resulting in the inability to accurately capture the shrinkage characteristics of the glue under different temperature fields;

[0058] 2. The pressing stability of the fixing device for the optical elements is insufficient. Traditional mechanical fixing methods are difficult to achieve stress-free position fixing during the curing process, and the adjustment accuracy is relatively low, unable to meet the fixing requirements under small gaps (such as micro-bead gap control structures);

[0059] 3. The data acquisition dimension is single. Existing tests mostly only focus on the curing shrinkage rate, ignoring key indicators such as the directional offset and stress relaxation coefficient, and lacking real-time sequential calculation of the spot coordinates, making it difficult to dynamically evaluate the multi-dimensional changes in the optical path stability during the curing process.

[0060] Therefore, there is an urgent need for a system and method to solve at least one of the above problems.

[0061] To solve the above problems, please refer to Figures 1 to 8 In an embodiment of the present application, a test system for the curing shrinkage stability of the glue in a laser machine optical system is provided, including: a pressing and fixing device, which includes a spring, a pull rod, a pin gauge, a pressing piece, and a fixing block, and the position of the pin gauge between the inner surface and the outer surface of the fixing block is switched by rotating the corresponding pull rod head; a glue curing unit, which includes a UV curing device, a precision temperature-controlled heating platform, and a moisture curing environment generator, and the precision temperature-controlled heating platform is used to realize the sequential combination curing mode of UV curing and thermal curing; a light source unit, which includes a laser light source and a stable support structure with a clearance fit clamp; an optical machine adhesive unit, which includes a lens holder and a mirror, and the surface of the lens holder is provided with a microbead clearance control structure; the temperature sensor probe corresponding to the glue curing unit forms a direct contact thermal coupling with the glue dispensing surface of the lens holder; an optical platform, and the pressing and fixing device is rigidly connected to the optical platform through an aluminum profile gantry; a data acquisition unit, which includes a CCD sensor, a three-dimensional adjustable fixing device, and an analysis module, and the analysis module generates multi-dimensional stability indicators including the curing shrinkage rate, directional offset, and stress relaxation coefficient by real-time calculating the sequential data of the reflected spot coordinates collected by the CCD sensor to complete the test of the curing shrinkage stability of the glue.

[0062] Specifically, the core composition and structure design of the system include: Pressing and fixing device: Structural composition: It includes a spring (11), a pull rod (12), a pin gauge (13), a pressing piece (14), a silicone pad with adhesive (15), a fixing block (16), and an aluminum profile gantry (17). Switching the position of the pin gauge by rotating the pull rod head (121): When pulling up and rotating, the pin gauge is fixed on the outer surface (161) of the fixing block, the spring is compressed, and the pressing piece is separated from the optical element; after release, the pin gauge fits the inner surface (162) of the fixing block, and the spring pressure (≥10N) is evenly transmitted to the optical element (mirror 51) through the silicone pad to ensure no stress distortion during fixation. Springs with different wire diameters / materials can control the pressing force, and the pin gauge is tightly fitted with the pull rod hole to achieve micron-level clearance calibration (such as controlling a 0.1-0.5mm clearance through microbeads when dispensing glue at the bottom edge).

[0063] The glue curing unit integrates a UV curing device, a precision temperature-controlled heating platform (2), and a moisture curing environment generator, supporting a combined curing mode: Precise temperature coupling: The heating platform is equipped with a thermocouple inside, and the probe directly contacts the dispensing surface of the lens holder (52). It can calibrate the temperature deviation caused by system heat dissipation in real time (temperature control accuracy ±0.5°C), and immediately perform thermal curing (temperature range 25 - 200°C, heating rate 1 - 5°C / min controllable) after UV curing (energy 0 - 1000 mJ / cm² adjustable), simulating the actual dual-curing process (such as UV pre-curing of acrylic adhesive + 80°C thermal curing). Coverage of multiple curing scenarios: Compatible with UV curing, thermal curing, moisture curing, and combined modes. For example, it can test the room-temperature moisture curing of silicone adhesives (humidity 50 - 90%RH controllable) or the stepwise heating curing of polyurethane adhesives (segmented curing at 25°C → 60°C → 100°C).

[0064] The light source unit and the optical machine adhesive unit are fixed by a laser light source (31) through a support frame (32), a cross beam (33), and a hoop (34). A gap of 0.1 - 0.4 mm is reserved between the hoop and the support frame, and elastic compression is used to reduce vibration interference; the distance between the light source and the reflector is ≥1 meter to extend the optical path and amplify the directivity offset.

[0065] By setting a microbead gap control structure (glass / ceramic microbeads, diameter 50 - 500 μm) on the surface of the lens holder, it supports side dispensing (the first side glue 53, the second side glue 54, dispensing diameter 0.3 - 2 mm adjustable) and bottom dispensing (55, the microbeads are evenly distributed to control the glue layer thickness), simulating the dispensing positions of the actual optical machine system ( Figure 7 、 Figure 8 ).

[0066] The data acquisition unit includes a CCD sensor (4), a three-dimensional adjustable fixing device (41), and an analysis module; it can capture the coordinates of the reflected light spot (X / Y axes, accuracy ±1 μm) in real time through the CCD, and the analysis module solves the timing data to generate the curing shrinkage rate (ΔV / V0), the directivity offset (Δθ, in mrad level), and the stress relaxation coefficient (D(t), fitted based on the amplitude fluctuation of the light spot), and synchronously records the temperature and humidity data (accuracy ±1°C, ±2%RH). The data is collected at a frequency of 10 Hz, and the curing process curve is plotted (as shown in Figure 9 、 Figure 10 . During UV curing, the coordinates of the light spot change suddenly, and during thermal curing, it drifts slowly. The difference in the final stable values reflects the shrinkage effect).

[0067] Break through the traditional single and fixed mode. Through the linkage of the heating platform and the UV lamp, the full-process simulation of "UV pre-curing → stepwise temperature rise thermal curing" is realized. The thermocouple directly contacts the dispensing surface of the lens holder, solving the problems of uneven temperature and difficult real-time monitoring during oven thermal curing (for example, when testing epoxy resin glue, first UV cure for 300 s, then heat up to 120 °C at a rate of 2 °C / min and hold for 2 h, and synchronously record the shrinkage data at each stage). The silica gel pad provides elastic buffering + spring constant force pressing (adjustable from 10 - 50 N), avoiding additional stress caused by mechanical fixation; when dispensing at the bottom edge, a 50-μm microbead is used to control a 0.05-mm gap, and when dispensing on the side, a screw valve or jet valve dispenser is used to control the dispensing volume and dispensing uniformity, meeting the micro-gap test requirements of a femtosecond-precision optical-mechanical system. In addition to the volume shrinkage rate, the directional offset (reflecting the change in the optical path angle) and stress relaxation coefficient (evaluating the residual stress stability of the glue layer) are introduced for the first time. For example, when 100 μL of epoxy resin glue is dispensed on the side and cured, the light spot shifts 15 μm along the X-axis, corresponding to a directional offset of 0.015 mrad, and combined with a shrinkage rate of 2%, comprehensively evaluate its impact on the optical path stability.

[0068] Taking the double-curing test of side dispensing as an example, the usage steps of the provided system are as follows:

[0069] (I) Preparation before testing: Install the optical-mechanical adhesive unit: Preset the dispensing positions on both sides of the lens holder (52), and place the mirror (51) above the lens holder. Rotate the head of the pull rod to fix the pin gauge on the outer surface of the fixed block, and lift the pressing piece to make the mirror in a free state.

[0070] Optical path calibration: Adjust the clamp of the light source bracket so that the laser light source (635 nm, power stable ±0.1%) is perpendicularly incident on the center of the mirror. After the reflected light spot travels through an optical path of at least 2 m, it is projected onto the CCD sensor (resolution 1280×1024, pixel size 4.65 μm). Adjust the CCD three-dimensional fixing device to ensure that the light spot center is located at the center of the sensor target surface, and record the initial coordinates (X0, Y0).

[0071] (II) Dispensing and curing process: Side dispensing: Use a dispenser to apply acrylic adhesive (single-component, UV + thermal curing type) on the two side edges of the lens holder. The dispensing diameter on each side is 1 mm, the length is 13 mm, and the glue volume is about 10 μL. Rotate the head of the pull rod to release the pin gauge to the inner surface of the fixed block, and the spring pressure of 15 N evenly presses the mirror through the silica gel pad to ensure a stable dispensing gap.

[0072] Combined curing test: UV pre-curing: Turn on the UV curing device (wavelength 365 nm, energy 500 mJ / cm²), irradiate for 1 min, and the glue is preliminarily cured (curing degree reaches 60%). The CCD synchronously records the sudden change in the light spot coordinates (due to the rapid shrinkage during UV curing causing the mirror to tilt slightly, such as Figure 9In the period of t = 1 - 2 min). Thermal curing stage: Immediately start the heating platform, raise the temperature to 80 °C at a rate of 3 °C / min, and maintain for 2 h (simulating the actual process). The thermocouple real-time feedbacks the temperature of the mirror base (control deviation ±1 °C), and records the slow drift of the light spot during the thermal curing process (due to further cross-linking and shrinkage of the adhesive layer, in the period of t = 2 - 4 h).

[0073] (III) Data acquisition and analysis: Real-time monitoring: The CCD collects the light spot coordinates at a frequency of 20 Hz, and the software real-time plots the X(t) and Y(t) curves. The temperature and humidity sensors synchronously record the environmental parameters (such as temperature 80 °C, humidity 30%RH). After curing is completed, wait for 30 min until the system is stable, record the final coordinates (X1, Y1), and calculate the pointing offset: ΔX = X1 - X0, ΔY = Y1 - Y0, and the offset angle Δθ = arctan(√(ΔX² + ΔY²) / L), where L is the optical path (≥2 m).

[0074] Calculation of multi-dimensional indicators: Curing shrinkage rate: Through the change in the volume of the side glue (initial volume V0 = πr²h, volume after curing V1, r = 1 mm, h = 1 mm, L = 13 mm), combined with the light spot offset to inversely deduce the shrinkage deformation of the adhesive layer. The formula is: ΔV / V0 = k·Δθ (k is the calibration coefficient, calibrated through ANSYS simulation). Stress relaxation coefficient: Analyze the amplitude of the light spot fluctuation within 24 h after curing, and fit the relaxation curve D(t) = A·e^(-t / τ) + B, where τ is the relaxation time constant, reflecting the stability of the residual stress of the adhesive layer.

[0075] The provided system has the following beneficial effects: It breaks through the single curing mode and supports combined processes such as UV + heat, heat + moisture, etc. For example, when testing dual-cured silicone, first UV cure to form a preliminary structure, and then moisture cure for 24 h. Monitor the shrinkage behavior at different stages throughout the process, filling the gap in the existing technology that cannot simulate the actual complex process.

[0076] The heating platform directly couples the temperature of the dispensing surface of the mirror base, avoiding the problem of "large temperature difference between the sample surface and the core adhesive layer" in the oven test (the measured temperature difference of the traditional oven is ±5 °C, and the temperature difference of this system is ±0.5 °C), ensuring the authenticity and reliability of the curing temperature parameters.

[0077] The spring + silicone pad flexible pressing structure, compared with the traditional rigid fixture (such as screw fixation resulting in an additional stress of 10 - 20 mN), the additional stress of this system < 5 mN, meeting the stress-free fixation requirements of high-precision optical components (flatness ≤ λ / 10). The cooperation of the pin gauge and the micro-bead realizes precise control of the dispensing gap of 0.05 - 0.5 mm (the gap error of the traditional method is ±0.1 mm, and the error of this system is ±5 μm), suitable for micro-gap scenarios such as bottom dispensing.

[0078] Multi-dimensional dynamic evaluation: The prior art only measures the volume shrinkage rate (accuracy ±5%), and this system adds the directional offset (accuracy ±0.001 mrad) and the stress relaxation coefficient (reflecting the change of residual stress over time, such as Figure 10 after dispensing glue at the bottom edge point in Figure 10 , the Y-axis offset is 0.008 mrad, and the corresponding influence on the optical path angle change is <0.1 μrad), comprehensively evaluating the influence of glue on the optical path stability. Real-time sequential data calculation (sampling frequency ≥10 Hz) captures the transient shrinkage mutation during the curing process (such as the shrinkage rate suddenly increasing by 1.2% in the first 30 s before UV curing). Compared with the traditional "single-point test before and after curing", key parameters such as the shrinkage rate and the occurrence time of the peak stress can be analyzed.

[0079] By comparing the directional offsets of different adhesives (such as the shrinkage rate of epoxy resin glue is 2% and that of silicone glue is 1%) (for the former, Δθ = 0.02 mrad, and for the latter, it is 0.01 mrad), it guides the selection of glue with low shrinkage and high stability. Testing the influence of different curing heating rates (1 °C / min vs 5 °C / min) on shrinkage, it is found that slow heating can reduce stress concentration (the relaxation coefficient D(t) drops from 0.8 to 0.5), optimizing the curing curve. In the research and development of precision laser processing equipment (such as femtosecond lasers), the influence of the dispensing position (side vs bottom) on the angle stability of the mirror is evaluated in advance, avoiding the optical path drift caused by glue shrinkage (such as for the requirement of processing accuracy ±5 μm, the directional offset needs to be controlled <0.005 mrad).

[0080] The system supports 5 types of mainstream adhesives (acrylic, polyurethane, hot melt adhesive, epoxy resin, silicone), covering 3 types of dispensing forms (side, bottom, combination), and the glue volume range is 10 μL - 200 μL. The resolution of the directional offset is 0.001 mrad, the temperature control accuracy is ±0.5 °C, and the gap control accuracy is ±5 μm, meeting the research and development requirements of the femtosecond-level optical-mechanical system. Through the CCD, the moving trajectory of the light spot is displayed in real time (such as Figure 9 、 Figure 10 curve), intuitively reflecting the dynamic influence of curing shrinkage on the optical path, which is convenient for R & D personnel to quickly locate problems.

[0081] Through structural innovation and the integration of multiple technologies, this test system systematically solves the deficiencies of traditional test methods in curing mode, fixing accuracy, and data dimension, providing a reliable quantitative evaluation tool for the adhesive selection and process optimization of precision optical-mechanical systems, and significantly improving the stability and precision design level of optical-mechanical systems.

[0082] In some embodiments, a glue curing shrinkage stability test system for the optical-mechanical system of a laser machine provided by the present invention, such as Figure 1As shown, it includes a clamping and fixing device 1, a glue curing unit, a light source unit 3, a data acquisition unit, and an optical-mechanical gluing unit 5. The clamping and fixing device is used to fix the position of the optical element 51 and the lens holder 52, and to control the glue dispensing gap between the optical element 51 and the lens holder 52. Figure 2 As shown, the clamping and fixing device includes a spring 11, a pull rod 12, a needle gauge 13, a pressing piece 14, a silicone pad 15 with adhesive backing, a fixing block 16, etc. Different wire diameters, materials, and lengths of the spring 11 control different clamping forces. The above components are fixed to the aluminum profile gantry 17 as a whole to improve the stability of the system. The bottom of the pull rod 12 is fixed to the pressing piece 14 by a screw 18 with an elastic washer. When the pull rod 12 is pulled, the pressing piece 14 can also move up and away from the reflector surface. The needle gauge 13 is tightly matched with the hole on the pull rod 12, and the bottom surface of the needle gauge 13 is tightly fixed on the inner surface 162 of the fixing block 16. The head 121 of the pull rod 12 is provided with knurling (for easy operation). When the head 121 is pulled up and rotated, the spring 11 is compressed, and the needle gauge 13 is simultaneously moved up and fixed on the upper surface 161 of the fixing block 16. The silicone pad 15 is attached to the pressing piece 14, and the pressing piece 14 and the silicone pad 15 are moved up synchronously and separated from the optical element 51. The spring 11 is always in a compressed state. When the pressing sheet 14 and the silicone pad 15 are in contact with the upper surface of the optical element 51, the pressure of the spring 11 is at least 10N. At this time, the silicone pad 15 is also in a compressed state, ensuring that the small amount of external force brought by the dispensing process does not cause additional fluctuations in the directivity. The clamping device applies a certain pressure to keep the lens and the lens holder in a stable state, reducing fluctuations caused by environmental changes such as air circulation, and will not fluctuate with the dispensing, which is easy to operate. The pressure is the same and stable every time, and the spring is also easy to replace.

[0083] In some embodiments, the glue curing unit includes a UV curing device, a precisely temperature-controlled heating platform 2, or moisture curing, and can perform curing in a variety of ways or combined curing. The precisely temperature-controlled heating platform 2 uses a thermocouple to monitor the temperature of the lens mount glue dispensing surface when in use, and calibrates the temperature drop caused by the heat dissipation of the system. The glue curing unit can start thermal curing after UV curing to monitor the changes in the dual-curing glue during the entire curing process. Glues include acrylic adhesives, polyurethane adhesives, hot melt adhesives, epoxy resin adhesives, silicone adhesives and combinations thereof. The system can also test the shrinkage of room temperature moisture-cured glue during curing, such as UV plus humidified gas curing dual-curing glue. The UV lamp curing energy is adjustable and the heating temperature is adjustable. The heating platform has high temperature control accuracy, and overcomes the problem that the change in thermal curing directionality in the oven is difficult to measure, and tests the volume change and stress release caused by further cross-linking of the glue during the thermal curing process.

[0084] In some embodiments, Figure 6As shown in the figure, the light source unit includes a stable laser light source 31 and its stable fixing device, including a support frame 32, a cross beam 33, and a hoop 34. The hoop 34 and the support frame 32 are provided with a gap less than 0.5 mm and greater than 0 for pressing the laser light source to improve the stability of the light source. Usually, the light source needs to be stable for a period of time after being turned on before testing.

[0085] In some embodiments, the data acquisition unit includes a CCD sensor 4, a CCD fixing and adjusting device 41, a temperature and humidity sensor, a computer, and recording software. The CCD sensor is used to record the directional change during the glue curing process in real time and non-contact. The temperature and humidity sensor is used to record the temperature, humidity, and their changes. The CCD fixing and adjusting device 41 can adjust the height and horizontal position of the CCD sensor.

[0086] In some embodiments, as Figure 7 shown, the optical machine gluing unit 5 includes a mirror 51, a mirror base 52, and glue. The glue can be applied by side dispensing, bottom dispensing, or side plus bottom dispensing. The dispensing uses an instrument such as a dispenser that can control the glue volume and also avoid air bubbles; the side dispensing includes a first side glue 53 and a second side glue 54, and can control the dispensing diameter, dispensing length, and dispensing position; the bottom dispensing 55 uses glass microspheres, ceramic microspheres, etc. to control different uniform dispensing gaps; side dispensing plus bottom dispensing can also be used. Glass microspheres, ceramic microspheres, etc. have different diameters and can control different dispensing gaps.

[0087] In some embodiments, as Figure 1 shown, the pressing and fixing device 1, the light source unit 3, and the CCD sensor 4 are all fixed on the optical platform 6. The distance between the light source unit 3 and the CCD sensor 4 from the mirror 51 is greater than 1 meter to extend the optical path and amplify the fluctuation of the curing shrinkage.

[0088] In some embodiments, for a method of testing the shrinkage stability of glue curing in an optical machine system of a laser machine, the side glue application method includes the following steps: Step S1: Pull up and rotate the head 121 of the pull rod 12, the spring 11 is compressed, and the needle gauge 13 is fixed on the upper surface 161 of the fixed block 16; Step S2: Adjust the positions of the reflector 51 and the mirror base 52 and the position of the CCD sensor, and the laser is reflected by the surface of the reflector 51 and enters the CCD sensor 4; Step S3: Pull up and rotate the head 121 of the pull rod 12, the needle gauge 13 is fixed on the inner surface 162 of the fixed block 16, and the reflector 51 and the mirror base 52 are tightly fixed; Step S4: Apply glue on the side, including the first side glue 53 and the second side glue 54, cure the glue through the UV lamp and the heating platform 2, and the CCD sensor 4 records the directivity change during the curing process; Step S5: Pull up and rotate the head 121 of the pull rod 12, the spring 11 is compressed, the needle gauge 13 is fixed on the upper surface 161 of the fixed block 16, and the optical machine adhesive unit 5 is taken out. Then start applying glue to the next sample.

[0089] The test data is recorded as Figure 9 shown. The CCD sensor records the change process of the X and Y coordinate values over time. Before glue application, the system is in a stable state with fluctuations of about 10 microns. Then there are no additional fluctuations during the glue application process. After starting the UV, there is a sudden change in shrinkage during glue curing. After the glue is cured, the system is in a stable state again. According to the difference in directivity numerical values before and after curing, the influence of the curing shrinkage of a glue and a process on the stability of the optical machine system is evaluated.

[0090] In some embodiments, for a method of testing the shrinkage stability of glue curing in an optical machine system of a laser machine provided by the present invention, the bottom glue application method includes the following steps: Step S1: Pull up and rotate the head 121 of the pull rod 12, the spring 11 is compressed, and the needle gauge 13 is fixed on the upper surface 161 of the fixed block 16; Step S2: Apply glue 55 with glass or ceramic microbeads on the upper surface of the mirror base 52, and then place the reflector 51; Step S3: Adjust the positions of the reflector 51 and the mirror base 52 and the position of the CCD sensor, and the laser is reflected by the surface of the reflector 51 and enters the CCD sensor 4; Step S4: Pull up and rotate the head 121 of the pull rod 12, the needle gauge 13 is fixed on the inner surface 162 of the fixed block 16, and the reflector 51 and the mirror base 52 are tightly fixed; Step S5: Cure the glue separately through the UV lamp and the heating platform 2, and the CCD sensor 4 records the directivity change during the curing process; Step S6: Pull up and rotate the head 121 of the pull rod 12, the spring 11 is compressed, the needle gauge 13 is fixed on the upper surface 161 of the fixed block 16, and the optical machine adhesive unit 5 is taken out.

[0091] The test data is recorded as Figure 10As shown, the CCD sensor records the variation of X and Y coordinate values over time. Before the glue cures, the system is in a stable state with a system fluctuation of about 10 microns. After starting the UV, the glue cures and shrinks suddenly, and the system is in a stable state again after the glue cures. According to the difference in the directivity numerical values before and after curing, the curing shrinkage of a glue and a dispensing process is evaluated for its impact on the stability of the opto-mechanical system.

[0092] Through finite element (such as ANSYS) simulation analysis, the evaluation results of the above test system for different dispensing methods and positions, different glue amounts, and different glue curing shrinkages are consistent with the simulation analysis results.

[0093] In some embodiments, a silicone pad with adhesive is provided between the pressing plate of the pressing and fixing device and the optical element mirror. The compression deformation rate of the silicone pad in the pressed state is greater than or equal to a preset deformation rate, and the contact pressure uniform distribution coefficient with the surface of the mirror base is greater than or equal to a preset distribution coefficient.

[0094] By setting a silicone pad with adhesive between the pressing plate of the pressing and fixing device and the optical element mirror, the silicone pad is pre-fixed to the pressing plate or the surface of the mirror base through the adhesive. When the pressing plate applies pressure to the mirror, the silicone pad undergoes compression deformation. The compression deformation rate (i.e., the ratio of the compression amount to the original thickness) of the silicone pad in the pressed state is designed to be greater than or equal to a preset deformation rate (for example, preset to 20%) to ensure that the silicone pad fully fills the contact surface gap. At the same time, by optimizing the hardness (such as Shore A 40 - 60), thickness uniformity, and surface roughness of the silicone pad, the contact pressure uniform distribution coefficient of the silicone pad with the surface of the mirror base (i.e., the ratio of the difference between the maximum pressure and the minimum pressure in the contact area to the average pressure) is greater than or equal to a preset distribution coefficient (for example, preset to 0.9, that is, the pressure distribution difference ≤ 10%).

[0095] The elastic deformation of the silicone pad can absorb external vibrations or mechanical stresses, avoiding the fragmentation or deformation of the mirror edge caused by rigid contact; the uniform contact pressure distribution can reduce the surface shape distortion of the mirror caused by local stress concentration, improving the position stability of the optical element; the adhesive design prevents the silicone pad from shifting, and combined with the preset deformation rate requirements, ensures the consistency of the pressing force during long-term use.

[0096] In some embodiments, the position switching between the pin gauge and the fixed block includes: when the head of the pull rod rotates to the first angle, the bottom surface of the pin gauge closely adheres to the inner surface of the fixed block to form a pressing limit; when the head of the pull rod rotates to the second angle, the top surface of the pin gauge abuts against the outer surface of the fixed block to form a released state.

[0097] The working state of the pin gauge and the fixed block is switched by the rotation angle of the head of the pull rod: Pressing and limiting state: When the head of the pull rod rotates clockwise (or counterclockwise) to the first angle (for example, 90°), the bottom surface of the pin gauge is closely attached to the inner surface of the fixed block, forming mechanical limitation to prevent the axial movement of the pin gauge and realizing the positioning and locking of the target component (such as an optical adjustment mechanism); Release state: When the head of the pull rod rotates reversely to the second angle (for example, the initial position of 0°), the top surface of the pin gauge abuts against the outer surface of the fixed block, the whole pin gauge is lifted upward, the bottom surface is separated from the inner surface of the fixed block, the limitation is released, and the target component is allowed to be freely adjusted. In the structural design, the mating surfaces of the pin gauge and the fixed block adopt a precision grinding process to ensure the positioning accuracy during angle switching (such as an angle tolerance of ±0.5°).

[0098] The limitation and release are realized through a simple rotation action, improving the operation efficiency; The two-way limitation design of bottom surface pressing and top surface abutting avoids the shaking problem of traditional single surface contact and enhances the positioning stiffness; The mechanical stop structure for angle switching can prevent the state change caused by accidental touch and improve the reliability of the mechanism.

[0099] In some embodiments, the spring provides at least 10N of controllable pre-tightening force in the pressed state, and the wire diameter tolerance of the spring is less than or equal to the preset tolerance, and the repeated positioning accuracy of the compression stroke is less than or equal to the preset accuracy.

[0100] The spring provides at least 10N of controllable pre-tightening force through pre-compression in the pressed state, and the pre-tightening force is precisely controlled by adjusting the initial compression amount of the spring (such as a nut adjustment mechanism). The wire diameter tolerance of the spring is controlled within the preset tolerance range (for example, ±0.02mm), and high-precision cold-drawn steel wire or titanium alloy materials are used to ensure the wire diameter consistency. The repeated positioning accuracy of the compression stroke is monitored in real time by a displacement sensor and is required to be less than or equal to the preset accuracy (for example, ±0.05mm). The lateral offset is reduced through the precise fit of the spring guide rod and the limit hole (such as an H7 / g6 tolerance fit). The pre-tightening force of ≥10N ensures the rigidity of the mechanical connection and avoids loosening caused by vibration; The strict requirements for wire diameter tolerance and repeated positioning accuracy ensure the performance consistency of the spring after multiple compressions and are applicable to precision mechanical systems (such as optical adjustment mounts) that require long-term reliable contact; The controllable pre-tightening force design allows adjusting parameters according to different load requirements and improves the versatility of the device.

[0101] In some embodiments, the sequential combined curing mode of the glue curing unit includes: The UV curing device triggers a photo-initiated reaction. After the curing degree reaches the preset range, the precision temperature-controlled heating platform starts a thermal curing program to form a two-stage UV-thermal curing.

[0102] The glue curing unit adopts a UV-thermal two-stage curing mode: UV curing stage: First, start the UV curing device (such as an LED light source with a wavelength of 365 nm and a light intensity ≥ 100 mW / cm²), which triggers a free radical reaction in the photoinitiator in the glue, causing the glue to be quickly and preliminarily cured until the curing degree reaches a preset range (such as 50%-70%, monitored in real time by a curing degree sensor); Thermal curing stage: After UV curing is completed, a precision temperature-controlled heating platform is started (such as a heating rate of 5 °C / min and a target temperature of 80-120 °C), entering the thermal curing program, and using heat to promote the cross-linking reaction of the glue to form complete curing. The time and temperature parameters of the two stages can be preset through the PLC system to achieve automated control. Combining high efficiency and deep curing: UV curing quickly shapes, shortening the production cycle; Thermal curing eliminates residual monomers after UV curing, enhancing the strength and durability of the glue layer; Reducing defects: Avoiding the problem of surface curing while the inside is not fully reacted that may be caused by single UV curing, or the slow curing defect of single thermal curing; Process controllability: Presetting the curing degree triggers thermal curing to ensure the scientific nature of the two-stage connection and improve the consistency of the glue bonding force.

[0103] In some embodiments, the gap between the hoop and the support frame is a dynamic buffer gap of 0-0.5 mm, and a polyurethane damping layer is provided on the inner wall of the hoop.

[0104] A dynamic buffer gap of 0-0.5 mm is designed between the hoop and the support frame, and the gap is controlled by adjusting the tightness of the bolts of the hoop. A polyurethane damping layer is pasted or injection-molded on the inner wall of the hoop. The thickness of the damping layer is 1-3 mm, the hardness is Shore A 80-90, and a microgroove structure is designed on the surface to increase the frictional damping. When the equipment vibrates, the hoop can displace slightly within the gap range, and the polyurethane layer absorbs vibration energy through viscoelastic deformation.

[0105] The dynamic gap allows the structure to adapt to small displacements, avoiding resonance problems of rigid connections; The polyurethane damping layer effectively attenuates high-frequency vibrations and reduces the vibration amplitude transmitted to precision components (such as mirrors); The damping layer acts as an elastic buffer medium, reducing the direct friction between the hoop and the support frame and extending the service life of mechanical components; Controlling the gap range (0-0.5 mm), while allowing small buffering, avoiding positioning accuracy failure caused by excessive displacement.

[0106] In some embodiments, the microbeads in the microbead gap control structure are glass microbeads or ceramic microbeads, and are embedded in the surface of the mirror base in an array form.

[0107] In the microbead gap control structure, the surface of the lens holder forms an array of grooves through precision machining (such as laser drilling or mechanical embedding). Glass microbeads (with a diameter of 50 - 100 μm and a hardness of HV 800 - 1000) or ceramic microbeads (such as Al2O3 with the same diameter) are embedded in the grooves. The top surface of the microbeads is flush with or slightly higher than the surface of the lens holder (such as 0.01 - 0.05 mm), forming regularly arranged dot-like contact surfaces (such as 3 microbeads with a spacing of 5 mm). The microbeads are fixed by high-strength glue or mechanical interference fit.

[0108] The rigid spherical structure of the microbeads can transform the contact between the lens holder and the mating component (such as a pressing piece) into point contact, precisely control the gap through the height of the microbeads (with an error of ±0.005 mm), and avoid uneven deformation in planar contact; the array of point contacts reduces the frictional resistance and at the same time disperses the local pressure to prevent scratching of the lens holder surface; the high hardness and low expansion coefficient of glass or ceramic microbeads are suitable for high-precision optical systems and reduce the influence of temperature changes on the gap.

[0109] In some embodiments, the real-time calculation of the analysis module specifically includes: calculating the curing shrinkage rate based on the centroid drift algorithm of the reflected light spot coordinates corresponding to the time series data of the reflected light spot coordinates according to the initial light spot coordinates and the real-time coordinates; and calculating the peak-to-peak fluctuation amount of the light spot position before and after curing through a standard deviation analyzer.

[0110] The real-time calculation process of the analysis module is as follows: Data acquisition: Real-time acquisition of the time series data of the reflected light spot coordinates through a CCD camera (sampling frequency ≥ 100 Hz); Centroid drift algorithm: Based on the initial light spot coordinates (the reference position before curing) and the real-time coordinates, calculate the displacement of the centroid of the light spot, and combine the change in the inclination angle of the mirror caused by the shrinkage of the adhesive layer during the glue curing process to deduce the curing shrinkage rate (formula: shrinkage rate = ΔL / L0, where ΔL is the change in the adhesive layer thickness, and is deduced from the light spot offset through geometric optical relationships); Fluctuation analysis: Use a standard deviation analyzer to calculate the peak-to-peak fluctuation amount of the light spot position before and after curing (that is, the difference between the maximum offset and the minimum offset) to evaluate the stability of the curing process. Digital filtering (such as Kalman filtering) is introduced into the algorithm to reduce noise interference and ensure the accuracy of coordinate calculation (sub-pixel level).

[0111] The shrinkage state of the adhesive layer is reflected in real time through the change in the light spot position, providing feedback for closed-loop control; the quantitative indicators of the curing shrinkage rate and the peak-to-peak fluctuation amount can accurately judge the curing quality and avoid the position drift of the mirror caused by uneven shrinkage; it provides data support for adjusting the curing parameters (such as temperature, UV light exposure time) and improves the process consistency.

[0112] Exemplarily, the spot centroid drift algorithm based on the reflection spot coordinate time-series data calculates the curing shrinkage rate according to the initial spot coordinates and real-time coordinates, including: performing noise reduction and edge enhancement on the initial spot coordinates and real-time coordinates, and extracting the spot contour features; inputting the spot contour features and the time series corresponding to the reflection spot coordinate time-series data into an encoding model constructed based on a 3D convolutional neural network and a long short-term memory network for encoding the spot contour features and the time series, and outputting a feature vector including the dynamic changes in the curing process; generating the curing shrinkage rate according to the feature vector; wherein, a physical constraint loss function based on the glue curing kinetics model is introduced in the training process of the encoding model, and the constraint conditions include the theoretical relationship between the glue layer volume change and the spot offset amount, and the theoretical relationship is generated from the glue layer volume shrinkage amount, the spot centroid coordinate offset amount, the optical path from the mirror to the CCD, and the mirror tilt angle change.

[0113] The steps for calculating the curing shrinkage rate based on the reflection spot coordinate time-series data are as follows: Pretreatment: Perform median filtering for noise reduction on the initial spot coordinates and real-time coordinates, use the Canny edge detection algorithm to enhance the spot edge, and extract the spot contour features (such as contour perimeter, area, centroid coordinates);

[0114] Encoding model construction: Input layer: Spot contour features (two-dimensional coordinate sequence) and time series (curing timestamp); Encoding layer: In the first half, use a 3D convolutional neural network (3D-CNN) to extract the dynamic change features of the spot contour in the spatio-temporal dimension (such as the evolution of the contour deformation over time), and in the second half, use a long short-term memory network (LSTM) to process the time series dependence relationship, and output a feature vector including the dynamic changes in the curing process; Introduction of physical constraints: When training the model, introduce a loss function based on the glue curing kinetics model, and the constraint condition is the theoretical relationship between the glue layer volume change and the spot offset amount:

[0115] Δx = 2Lθ / λ, θ = arctan(Δh / d); where Δx is the spot centroid offset amount, L is the optical path from the mirror to the CCD, θ is the mirror tilt angle change, Δh is the glue layer thickness shrinkage amount, and d is the glue layer action diameter. The consistency between the shrinkage rate predicted by the model and the actual optical offset is constrained by this relationship; Calculate the final curing shrinkage rate according to the feature vector and physical constraints, and control the error within ±2%.

[0116] Combining the spatial feature extraction of 3D-CNN and the time series analysis of LSTM, accurately capture the mapping relationship between the spot dynamic changes and the curing process; Introduce a physical constraint loss function for glue curing to avoid the "black box" problem of a pure data-driven model and improve the reliability of the prediction results; Through the coupled modeling of the optical geometric relationship and the glue layer deformation, achieve a high-precision inversion from the spot offset amount to the shrinkage rate, providing a scientific basis for curing process optimization.

[0117] In some embodiments, a silicone pad with adhesive is provided between the pressing piece of the pressing and fixing device and the optical element mirror. The compression deformation rate of the silicone pad in the pressed state is ≥ the preset deformation rate (such as 20%), and the contact pressure uniform distribution coefficient with the surface of the mirror base is ≥ the preset distribution coefficient (such as 0.9, that is, the pressure deviation ≤ 10%). The silicone pad is pre-pasted on the surface of the pressing piece or the mirror base through the adhesive (such as acrylate adhesive), and the thickness is designed according to the pressing stroke (such as the original thickness is 1 mm, and after compression ≥ 0.8 mm). The material is selected as food-grade silicone with a Shore hardness of A50, and the surface roughness Ra ≤ 0.2 μm to ensure uniform pressure conduction.

[0118] The elastic deformation of the silicone pad absorbs mechanical stress, avoiding cracking or surface distortion of the mirror edge due to rigid contact; the uniform distribution coefficient ensures that the pressure difference in the contact area is less than 10%, preventing local stress concentration from causing the mirror to tilt or deform, and improving the positioning accuracy of the optical element; the adhesive design prevents the silicone pad from shifting, and the preset deformation rate ensures that the pressing force attenuation ≤ 5% during long-term use, maintaining reliable contact.

[0119] In some embodiments, the state of the pin gauge and the fixed block is switched by rotating the head of the pull rod: when the head of the pull rod rotates to the first angle (such as 90°, positioned by a limit pin), the bottom surface of the pin gauge (after grinding treatment, flatness ≤ 5 μm) closely adheres to the inner surface of the fixed block, forming mechanical pressing and limiting; when rotating to the second angle (such as 0°), the top surface of the pin gauge (with anti-slip tooth patterns) abuts against the outer surface of the fixed block, releasing the limit and allowing the axial movement of the pin gauge. The material of the pin gauge is bearing steel (HRC58 - 62), and the mating surface with the fixed block adopts a clearance fit (tolerance H7 / g6), and the rotation torque is controlled within 0.5 - 1 N·m to ensure the operation convenience. The dual limiting structure of bottom surface pressing and top surface abutting eliminates the sloshing clearance of the traditional single-direction positioning (such as axial end play ≤ 10 μm), improving the rigidity of the mechanical structure; the state conversion can be achieved within seconds by angle rotation, which is suitable for optical alignment scenarios that require frequent adjustment; the precise tolerance fit and material selection ensure no wear after more than 5000 rotations, and the positioning repeatability accuracy ≤ ±5 μm.

[0120] In some embodiments, the spring provides a controllable pre-tightening force of ≥10 N in the compressed state. A stainless-steel spring (wire diameter tolerance ≤±0.01 mm, such as φ0.5 mm ±0.01 mm) is used, and the initial compression amount is adjusted by a regulating nut (such as a pre-compression amount of 5 mm, corresponding to a pre-tightening force of 15 N). The spring guide rod and the guide hole are in precise fit (coaxiality ≤0.02 mm), the repeated positioning accuracy of the compression stroke is ≤±0.03 mm (monitored in real time by a grating scale), and the free length tolerance of the spring is ≤±0.1 mm, ensuring the interchangeability of components in different batches. The controllable pre-tightening force avoids component damage caused by overpressure or loosening caused by underpressure, and is suitable for the elastic support of high-precision optical adjustment mounts; the strict wire diameter tolerance and material selection enable the spring to have a fatigue life of ≥100,000 compression cycles and an attenuation rate of ≤3%; the standardized spring parameters support rapid replacement, reducing maintenance costs.

[0121] In some embodiments, the glue curing unit adopts UV-thermal two-stage curing: First, the UV curing device (365 nm LED, light intensity 200 mW / cm²) irradiates for 10 - 30 s to trigger the reaction of the photoinitiator in the glue (such as Irgacure 184). When the curing degree reaches 60% ±5% (the double bond conversion rate is monitored in real time by Fourier transform infrared spectroscopy), the precision temperature control platform is started (heating rate 5℃ / min to 100℃, heat preservation for 30 min) to complete the thermal curing. The two stages are linked by a PLC. The distance between the UV light source and the dispensing surface is greater than or equal to 50 mm (such as 70 - 90 cm) to ensure uniform and consistent UV light intensity and not be particularly strong. The weaker light intensity can slow down the curing speed and reduce the curing stress.

[0122] The UV stage enables rapid shaping (reducing the risk of component displacement), and the thermal stage enables deep cross-linking (the tensile strength is increased by 30%), taking into account both efficiency and the performance of the glue layer; it avoids the problem of "hard surface and soft core" in single UV curing and eliminates the positioning deviation (≤±5 μm) caused by the glue flow in the initial stage of thermal curing; it supports various glues such as epoxy glue and acrylate glue, and adapts to different formulations by adjusting the temperature-time curve.

[0123] In some embodiments, a dynamic buffer gap of 0 - 0.5 mm is designed between the hoop and the support frame (achieved by adjusting bolts and nuts, with a gap precision of ±0.05 mm). A 2-mm-thick polyurethane damping layer (Shore hardness A90, loss factor ≥0.3) is pasted on the inner wall of the hoop. A grid groove with a depth of 0.5 mm (spacing 2 mm) is machined on the surface of the damping layer to increase the friction damping. When the device vibrates, the hoop can slide slightly within the gap. The polyurethane layer absorbs vibration energy in the frequency band of 10 - 2000 Hz through viscoelastic deformation, with a decay rate ≥80%. The buffer gap blocks the rigid vibration transmission, and the damping layer dissipates the vibration energy, so that the vibration acceleration transmitted to the mirror ≤0.1 g (@100 Hz); Adaptive adjustment: The 0 - 0.5 mm gap is compatible with components with different coefficients of thermal expansion, avoiding stress concentration caused by temperature changes; The damping layer serves as a protective layer, making the contact wear amount between the hoop and the support frame ≤5 μm per thousand vibrations, extending the service life of the device.

[0124] In some embodiments, in the microbead gap control structure, 3 glass microbeads (diameter 80 μm, roundness error ≤1 μm, refractive index 1.52) or ceramic microbeads (Al2O3, purity 99.5%) are embedded in the surface of the mirror mount (spacing 5 mm). The microbeads are embedded in blind holes with a diameter of 90 μm and a depth of 50 μm through vacuum adsorption, and the top surface is 10 ± 2 μm higher than the surface of the mirror mount. The array layout is centrosymmetric to ensure uniform stress, and the bonding strength between the microbeads and the mirror mount ≥5 N (pull-out test).

[0125] The high consistency of the microbead height (tolerance ±2 μm) enables precise control of the contact gap, avoiding the micron-level deformation differences in planar contact; The point contact mode reduces the contact area by more than 90%, and the friction coefficient drops from 0.3 in planar contact to below 0.1, facilitating fine adjustment of the mirror angle; The ceramic microbeads can withstand a temperature of at least 800 °C, with a compressive strength of 2000 N, suitable for optical systems in high and low temperature environments, and the coefficient of thermal expansion has a match difference of ≤10% with the mirror mount (such as invar).

[0126] In some embodiments, data acquisition: A CCD camera (resolution 1280×1024, pixel size 5.5μm) acquires reflected spot images at 100Hz, and extracts the centroid coordinates (sub-pixel accuracy, error ≤0.1 pixel); algorithm processing: Based on the initial coordinates (average value in the 30s before curing) and real-time coordinates, the spot profile is fitted by Gaussian fitting to calculate the centroid drift amount (Δx, Δy). Combining the optical path L = 2000mm, the shrinkage amount Δh of the adhesive layer is calculated using the geometric relationship Δh = (Δx²+Δy²)^0.5 × d / (2L) (d is the adhesive point spacing of 10mm), and the curing shrinkage rate η = Δh / h0 (h0 is the initial thickness of the adhesive layer) is obtained; fluctuation analysis: Calculate the peak-to-peak value (Max-Min) of the spot position within 30s before and after curing to evaluate the stability (e.g., qualified if the peak-to-peak value ≤5μm). The monitoring frequency of 100 times per second can timely capture the shrinkage rate change at the 0.1% level during the curing process, avoiding irreversible deformation; combining the absolute value of the shrinkage rate and the peak-to-peak value fluctuation, comprehensively judge the curing quality, reducing the missed judgment rate of manual detection (≤1%); directly correlating the deformation of the adhesive layer with the spot offset through the geometric optical model, with clear physical meaning and facilitating engineering debugging.

[0127] Exemplarily, noise reduction is performed on the spot image by median filtering (3×3 kernel), the contour is extracted by Canny edge detection, and the centroid coordinates are calculated through contour moments to generate time series data (time t - centroid x - centroid y); a 3D-CNN-LSTM hybrid network is constructed. The 3D-CNN layer (3 convolutional layers, kernel size 3×3×3) extracts the dynamic changes of the spot contour in the spatio-temporal dimension (such as the shrinkage trend of the contour area over time), and the LSTM layer (128 memory units) processes the time-dependent relationship, outputting a vector containing the characteristics of the curing stage; the training loss function is the mean square error (MSE) + physical constraint term. The physical constraint is based on the geometric relationship between the volume shrinkage of the adhesive layer ΔV = πr²Δh and the spot offset Δx = 2Lθ (θ = Δh / d), forcing the model prediction to meet Δh ≤ h0×5% (preset maximum shrinkage rate); the shrinkage rate η is generated in real time, with an error ≤±1.5%, and at the same time, the peak-to-peak fluctuation amount (accuracy ±1μm) is output.

[0128] 3D-CNN captures the spatio-temporal evolution of the spot contour (such as the change in edge blur reflects the curing degree), and LSTM processes the non-linear dynamics of the curing process, with an accuracy improvement of 50% compared to traditional algorithms; under environmental light fluctuations (±10%) or slight camera vibrations (±5μm), it can still accurately identify effective shrinkage signals, and its robustness is better than traditional filtering methods; through model interpretability analysis (such as feature visualization), locate the time points of abnormal shrinkage during the curing process (such as mutations caused by too fast heating during the thermal curing stage), guiding the adjustment of process parameters.

[0129] The embodiment of the present application provides a method for testing the shrinkage stability of glue curing in a laser machine optical machine system, which is applied to the testing system for the shrinkage stability of glue curing in the laser machine optical machine system provided in any embodiment of the present application. Specifically, as Figure 11 shown, the provided method for testing the shrinkage stability of glue curing in the laser machine optical machine system includes steps S101 to S105. Details are as follows:

[0130] Step S101. By means of the spring, pull rod, pin gauge, pressing piece and fixing block of the pressing and fixing device, rotate the head of the pull rod to switch the position of the pin gauge between the inner surface and the outer surface of the fixing block, so as to realize the pressing and fixing of the mirror base and the reflecting mirror in the optical machine adhesive unit.

[0131] Step S102. Utilize the UV curing device, precision temperature-controlled heating platform and moisture curing environment generator of the glue curing unit. Through the precision temperature-controlled heating platform, execute the sequential combination curing mode of UV curing and thermal curing, and directly contact and thermally couple the temperature sensor probe with the dispensing surface of the mirror base to monitor the temperature during the curing process.

[0132] Step S103. Start the laser light source of the light source unit, fix the light source through the stable support structure with clearance fit clamps, and make the laser beam project onto the reflecting mirror of the optical machine adhesive unit.

[0133] Step S104. Adjust the position of the CCD sensor of the data acquisition unit through the three-dimensional adjustable fixing device, which is used to collect the coordinate time series data of the reflected light spot in real time.

[0134] Step S105. According to the analysis module, perform real-time calculation on the collected light spot coordinate time series data, generate multi-dimensional stability indicators including curing shrinkage rate, directivity offset and stress relaxation coefficient, and complete the test of the shrinkage stability of glue curing.

[0135] It should be noted that those skilled in the art can clearly understand that for the convenience and conciseness of description, the above-described method for testing the shrinkage stability of glue curing in the laser machine optical machine system and the specific working processes of each step can refer to the corresponding processes in the embodiments of the testing system for the shrinkage stability of glue curing in the laser machine optical machine system described in the above embodiments, and will not be repeated here.

[0136] An embodiment of the present application provides a testing device 200 for the shrinkage stability of glue curing in a laser machine optical machine system. The testing device 200 for the shrinkage stability of glue curing in the laser machine optical machine system is used to execute the steps of the testing method for the shrinkage stability of glue curing in the laser machine optical machine system shown in the above embodiments. The testing device 200 for the shrinkage stability of glue curing in the laser machine optical machine system can be a single server or a server cluster, or the testing device 200 for the shrinkage stability of glue curing in the laser machine optical machine system can be a terminal, and the terminal can be a handheld terminal, a laptop computer, a wearable device, a robot, etc.

[0137] The testing device 200 for the shrinkage stability of glue curing in the laser machine optical machine system includes:

[0138] A pressing and fixing unit 201, which is used to rotate the head of the pull rod through the spring, pull rod, needle gauge, pressing piece and fixing block of the pressing and fixing device to switch the position of the needle gauge between the inner surface and the outer surface of the fixing block, so as to realize the pressing and fixing of the lens holder and the mirror in the optical machine adhesive unit;

[0139] A UV curing unit 202, which is used to utilize the UV curing device, precision temperature-controlled heating platform and moisture curing environment generator of the glue curing unit, execute the sequential combined curing mode of UV curing and thermal curing through the precision temperature-controlled heating platform, and directly contact and thermally couple the temperature sensor probe with the dispensing surface of the lens holder to monitor the temperature during the curing process;

[0140] A starting laser unit 203, which is used to start the laser light source of the light source unit, fix the light source through a stable support structure with a clearance fit clamp, and make the laser beam project onto the mirror of the optical machine adhesive unit;

[0141] A data acquisition unit 204, which is used to adjust the position of the CCD sensor of the data acquisition unit through a three-dimensional adjustable fixing device, and is used to collect the coordinate time series data of the reflected light spot in real time;

[0142] A test completion unit 205, which is used to perform real-time calculation on the collected light spot coordinate time series data according to the analysis module, generate multi-dimensional stability indexes including curing shrinkage rate, pointing deviation amount and stress relaxation coefficient, and complete the test of the shrinkage stability of glue curing.

[0143] It should be noted that those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the above-described testing device for the shrinkage stability of glue curing in the laser machine optical machine system and each module can refer to the corresponding processes in the embodiments of the testing method for the shrinkage stability of glue curing in the laser machine optical machine system described in the above embodiments, and will not be repeated here.

[0144] The above method for testing the shrinkage stability of glue curing in the laser machine optical machine system can be implemented in the form of a computer program, and the computer program can run on the provided device.

[0145] This application also provides a computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, the processor is caused to implement the steps of the method for testing the shrinkage stability of glue curing in the laser machine optical machine system provided in any embodiment of this application.

[0146] Among them, the computer-readable storage medium may be an internal storage unit of the control module described in the foregoing embodiment, such as the hard disk or memory of the control module. The computer-readable storage medium may also be an external storage device of the control module, such as a plug-in hard disk equipped on the control module, a Smart Media Card (SMC), a Secure Digital (SD) card, a Flash Card, etc.

[0147] The above is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed in this application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

1. A testing system for the shrinkage stability of glue curing in a laser machine optical system, characterized in that, Including: A pressing and fixing device, which includes a spring, a pull rod, a pin gauge, a pressing piece and a fixing block, and realizes the position switching of the pin gauge between the inner surface and the outer surface of the fixing block by rotating the corresponding pull rod head of the pull rod; A glue curing unit, which includes a UV curing device, a precision temperature-controlled heating platform and a moisture curing environment generator, and the precision temperature-controlled heating platform is used to realize the sequential combined curing mode of UV curing and thermal curing; A light source unit, which includes a laser light source and a stable support structure with a clearance fit hoop; An optical machine gluing unit, which includes a lens holder and a reflector, and the surface of the lens holder is provided with a microbead gap control structure; the temperature sensor probe corresponding to the glue curing unit forms a direct contact thermal coupling with the dispensing surface of the lens holder; An optical platform, and the pressing and fixing device is rigidly connected to the optical platform through an aluminum profile gantry; A data acquisition unit, which includes a CCD sensor, a three-dimensional adjustable fixing device and an analysis module. The analysis module generates multi-dimensional stability indexes including curing shrinkage rate, directional offset and stress relaxation coefficient by real-time solving the reflection spot coordinate time series data collected by the CCD sensor, so as to complete the glue curing shrinkage stability test.

2. The system according to claim 1, wherein A silicone pad with back glue is provided between the pressing piece of the pressing and fixing device and the optical element reflector. The compression deformation rate of the silicone pad in the pressed state is greater than or equal to a preset deformation rate, and the contact pressure uniform distribution coefficient with the surface of the lens holder is greater than or equal to a preset distribution coefficient.

3. The system according to claim 1, wherein The position switching of the pin gauge and the fixing block includes: When the pull rod head rotates to the first angle, the bottom surface of the pin gauge closely adheres to the inner surface of the fixing block to form a pressing limit; when the pull rod head rotates to the second angle, the top surface of the pin gauge abuts against the outer surface of the fixing block to form a released state.

4. The system according to claim 1, wherein The spring provides at least 10N controllable pre-tightening force in the pressed state, and the wire diameter tolerance of the spring is less than or equal to a preset tolerance, and the repeated positioning accuracy of the compression stroke is less than or equal to a preset accuracy.

5. The system according to claim 1, wherein The sequential combined curing mode of the glue curing unit includes: The UV curing device triggers a photoinitiation reaction. After the curing degree reaches a preset range, the precision temperature-controlled heating platform starts a thermal curing program to form a UV-thermal two-stage curing.

6. The system according to claim 1, wherein The gap between the hoop and the support frame is a dynamic buffer gap of 0-0.5mm, and the inner wall of the hoop is provided with a polyurethane damping layer.

7. The system according to claim 1, characterized in that The microbeads in the microbead gap control structure are glass microbeads or ceramic microbeads, and are embedded in the surface of the lens holder in an array form.

8. The system according to claim 1, wherein The real-time solution of the analysis module specifically includes: calculating the curing shrinkage rate according to the initial spot coordinates and real-time coordinates based on the spot centroid drift algorithm corresponding to the reflection spot coordinate time series data; and calculating the peak-to-peak fluctuation amount of the spot position before and after curing through a standard deviation analyzer.

9. The test system according to claim 8, characterized in that, Calculating the curing shrinkage rate according to the initial spot coordinates and real-time coordinates based on the spot centroid drift algorithm corresponding to the reflection spot coordinate time series data, includes: Performing noise reduction and edge enhancement on the initial spot coordinates and real-time coordinates, and extracting the spot contour features; Input the spot profile features and the time series corresponding to the coordinate time series of the reflected spots into an encoding model constructed based on a 3D convolutional neural network and a long short-term memory network, which is used to encode the spot profile features and the time series and output a feature vector including the dynamic changes during the curing process; Generate the curing shrinkage rate according to the feature vector; wherein, the training process of the encoding model introduces a physical constraint loss function based on the glue curing kinetics model, and the constraint conditions include the theoretical relational expression between the change in the volume of the glue layer and the spot offset, and the theoretical relational expression is generated by the shrinkage amount of the glue layer volume, the offset of the centroid coordinates of the spot, the optical path from the mirror to the CCD, and the change in the mirror tilt angle.

10. A method for testing the shrinkage stability of glue curing in a laser machine optical system, characterized in that, Applied to the glue curing shrinkage stability test system of the laser optical machine system according to any one of claims 1-9, the method includes: Through the spring, pull rod, pin gauge, pressing piece and fixing block of the pressing and fixing device, rotate the head of the pull rod to switch the position of the pin gauge between the inner surface and the outer surface of the fixing block, so as to realize the pressing and fixing of the lens holder and the mirror in the optical machine adhesive unit; Utilize the UV curing device, precision temperature control heating platform and moisture curing environment generator of the glue curing unit, execute the sequential combined curing mode of UV curing and thermal curing through the precision temperature control heating platform, and directly contact the temperature sensor probe with the dispensing surface of the lens holder for thermal coupling to monitor the temperature during the curing process; Start the laser light source of the light source unit, fix the light source through the stable support structure with a clearance fit clamp, and project the laser beam onto the mirror of the optical machine adhesive unit; Adjust the position of the CCD sensor of the data acquisition unit through the three-dimensional adjustable fixing device for real-time acquisition of the coordinate time series data of the reflected spots; According to the analysis module, perform real-time calculation on the collected spot coordinate time series data, generate multi-dimensional stability indicators including the curing shrinkage rate, directivity offset and stress relaxation coefficient, and complete the glue curing shrinkage stability test.

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