Package base plate, package device and manufacturing method thereof

Abstract

The present invention provides a package base plate, a package device, and a manufacturing method thereof. The package base plate includes a metal base plate having an inner base plate surface and an outer base plate surface, and also includes a plurality of first lead posts and a plurality of second lead posts insulated and fixed to the metal base plate; one end of the first lead post extends outward from the inner base plate surface, and the other end of the first lead post extends outward from the outer base plate surface; one end of the second lead post is fixed to the inner base plate surface, and the other end extends outward from the inner base plate surface. The package base plate of the present invention has a first lead post and a second lead post extending inward toward one side of the inner base plate surface. In addition to being used for the transmission of electrical signals, the first lead post and the second lead post can also be used to support and fix the internal circuit board, thereby facilitating the formation of an internal circuit design with a multi-layer spacing structure on one side of the inner base plate surface, which helps to miniaturize the device and reduce the projected area of ​​the device on the board.

Description

Technical Field

[0001] The present invention relates to the technical field of microelectronic device packaging, and in particular to a packaging base plate, a packaging device and a manufacturing method thereof. Background Art

[0002] The packaging of electronic devices plays a significant role in ensuring the performance of the device. Generally speaking, a good packaging structure can ensure the sealing performance of the device, make the device have excellent water and corrosion resistance, and improve the reliability of the device.

[0003] The invention patent document entitled "A packaging structure for high-power and high-current devices and its preparation method" with publication number CN115346952B has disclosed a packaging device structure with a single-layer circuit substrate having a packaging shell. Its internal cavity only uses a single-layer composite ceramic substrate. However, in some special usage scenarios, the layout design of the components inside the device is subject to strict space constraints. The size of the circuit substrate for installing the packaged device is limited, and the corresponding area occupied by the packaged device also needs to be reduced. In this case, the existing single-layer packaged microelectronic devices can no longer meet these requirements. Summary of the Invention

[0004] In order to reduce the area occupied by the existing single-layer packaged microelectronic devices on the circuit substrate, the present invention provides a method for manufacturing a packaged device and a package substrate corresponding to the method for manufacturing the packaged device.

[0005] The present invention provides a packaging base plate, comprising a metal base plate having an inner surface and an outer surface of the base plate, and characterized in that the metal base plate further comprises a plurality of first lead posts and a plurality of second lead posts insulated and fixed to the metal base plate;

[0006] One end of the first lead post extends outward from the inner surface of the bottom plate, and the other end of the first lead post extends outward from the outer surface of the bottom plate;

[0007] One end of the second lead post is fixed to the inner surface of the base plate, and the other end extends out of the inner surface of the base plate.

[0008] Preferably, a through hole is provided on the metal base plate, which passes through the inner surface and the outer surface of the base plate. The first lead post passes through the through hole. The glass insulator is located between the through hole and the first lead post to achieve insulation and fixation.

[0009] Preferably, a countersunk hole is formed on one side of the inner surface of the metal base plate, and one end of the second lead post is insulated and fixed in the countersunk hole.

[0010] Preferably, the second lead post and the countersunk hole are separated by insulating ceramic.

[0011] Preferably, a plurality of steps are formed on one end of the first lead post and / or the second lead post extending out of the inner surface of the base plate, and the steps are used to position and fix the internal circuit board.

[0012] Preferably, it also includes a grounding lead post that is conductively fixed to the metal base plate, one end of the grounding lead post extends out of the inner surface of the base plate, and the other end of the grounding lead post is fixed to the inner surface of the base plate or extends out of the outer surface of the base plate.

[0013] Preferably, a plurality of steps are formed on one end of the first lead post and / or the second lead post and / or the ground lead post extending out from the inner surface of the base plate, and the steps are used to position and fix the internal circuit board.

[0014] Preferably, the steps have different height layers, and there are no less than three steps in the same height layer and the planes are not collinear.

[0015] The present invention further provides a package device, comprising any one of the above-mentioned package base plates, wherein a plurality of layers of spaced and stacked circuit boards are formed on one side of the inner surface of the base plate of the metal base plate, and the circuit boards are electrically connected to the first lead post and the second lead post;

[0016] The package further comprises a cap having a cavity with an opening on one side for accommodating the internal circuit, and an edge of the opening of the cap contacts and seals with an edge of the package base plate.

[0017] Preferably, a plurality of steps are formed on one end of the first lead post and / or the second lead post extending out of the inner surface of the base plate, and the circuit board is positioned and fixed at the steps of the first lead post and / or the second lead post.

[0018] Finally, the present invention provides a method for manufacturing a packaged device, comprising the following steps:

[0019] S1. Assemble the package base plate; insulate and fix a plurality of first lead posts and a plurality of second lead posts to the metal base plate, wherein the first lead posts penetrate the metal base plate to form one end extending toward the inner surface of the base plate and the other end extending toward the outer surface of the base plate; the second lead posts only form one end extending inwardly of the inner surface of the base plate;

[0020] S3, assembling the internal circuit; assembling the internal circuit board in layers and fixing it to the first lead post and / or the second lead post, so that the first lead post and the internal circuit board, and the second lead post and the internal circuit board are electrically connected;

[0021] S5. Overall packaging: Seal the cap and cover it on the packaging base.

[0022] Preferably, in the step of sealing the cap on the packaging base plate, the opening edge of the cap is embedded in the sunken step of the metal base plate and contacts the ribs around the entire circumference of the sunken step. The cap and the metal base plate are pressed and kept in contact with each other at a certain pressure. Under a nitrogen protective atmosphere, the contact points around the cap and the metal base plate are melted and sealed by energy storage welding.

[0023] Preferably, in the step of insulating and fixing the plurality of first lead posts and the plurality of second lead posts to the metal base plate, the assembling steps of the second lead posts are:

[0024] S11, assembling the second lead post and the insulating ceramic; placing the insulating ceramic at one end of the second lead post, aligning the axes, and using an upper layer of solder between the second lead post and the insulating ceramic to weld them into a whole;

[0025] S13, assembling to the metal base plate; placing the end of the second lead column fixed with the insulating ceramic into the countersunk hole of the metal base plate, and using the lower layer of solder to weld between the countersunk hole and the insulating ceramic.

[0026] The packaging base plate of the present invention has a first lead post and a second lead post extending inward toward one side of the inner surface of the base plate. In addition to being used for transmitting electrical signals, the first lead post and the second lead post can also be used to support and fix the internal circuit board, thereby facilitating the formation of an internal circuit design with a multi-layer spacing structure on one side of the inner surface of the base plate, which helps to miniaturize the device and reduce the projected area of ​​the device on the board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of the packaging base plate 1 of the present invention;

[0028] Figure 2 This is a schematic diagram of the assembly of the packaging base plate 1 of the present invention;

[0029] Figure 3 Schematic diagram of the assembly of the second lead post 12 of the present invention;

[0030] Figure 4 Schematic cross-sectional view of the packaging base plate 1 of the present invention;

[0031] Figure 5 Schematic cross-sectional view of the double-layer packaging device 2 of the present invention.

[0032] In the picture:

[0033] 1: Package base plate; 11: First lead pin; 111: Glass insulator; 12: Second lead pin; 121: Insulating ceramic; 122: Solder; 123: Upper solder; 124: Lower solder; 13: Ground lead pin; 131: Conductive solder; 14: Metal base plate; 141: Through hole; 142: Countersunk hole; 143: Mounting hole; 14D: Outer surface of base plate; 14S: Inner surface of base plate; 15: First support step; 16: Second support step; 2: Double-layer package device; 21: Circuit board; 21D: Upper circuit board; 21E: Lower circuit board; 21F: Gasket; 22: Cap. DETAILED DESCRIPTION

[0034] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. In this specification, the dimensions of the drawings do not represent the actual size ratios. The drawings are only used to reflect the relative positional relationship and connection relationship between the various components. Components with the same name or the same number represent similar or identical structures and are only for illustrative purposes.

[0035] Metal casings are commonly used packaging carriers for thick-film module products, and the insulator material is mostly electronic sealing glass. For metal casings used for double-layer thick-film circuits, the length of the inner leads is often increased to meet assembly requirements. There are mainly two ways to electrically connect the upper and lower substrates. Method 1: During the assembly of the thick-film module, a support column structure is added between the upper and lower substrates to fix the distance between the substrates, and a flexible cable passage is added to the upper substrate; Method 2: The metal casing adds a channel with only inner leads, and the lead forms a sealed insulation structure with the bottom plate / disk through a glass insulator. Compared with the present invention, the above two methods have the following disadvantages: Method 1: Increases the assembly density, while increasing the transmission path, increasing the signal delay time, and reducing the function of the device; Method 2: Compared with ceramics, glass insulators are weaker, and the ends of the outer leads are easily exposed. Subsequent board-level installation must avoid problems such as short circuits.

[0036] In order to obtain the double-layer packaged device intended by the present invention, the present invention first provides a package base plate for the double-layer packaged device. Figure 1It is a schematic structural diagram of the package base plate 1 of the present invention. It includes a metal base plate 14, the outer surface 14D of the metal base plate 14 forms part of the outer surface of the device after packaging, and the inner surface 14S of the metal base plate 14 forms part of the internal space of the device after packaging. A number of first lead posts 11 are provided on the metal base plate 14, which pass through the metal base plate 14. The first lead posts 11 extend outward from the inner surface 14S of the base plate to connect to the internal circuit board. The part of the first lead post 11 extending outward from the outer surface 14D of the base plate forms an input / output terminal, which is connected to the external circuit. Since it assumes the input / output function, the first lead post 11 is obviously at least partially formed by a conductive material, such as a metal core (copper core, silver core) or is made entirely of metal material (it can be a single alloy material, such as copper alloy or silver alloy, or it can be made of multiple materials, such as copper-clad silver core material). The first lead post 11 is insulated from the metal base plate 14. A number of lead posts 12 extending toward one side of the inner surface 14S of the base plate are fixed on the inner surface 14S of the base plate. The second lead posts 12 are used to communicate with the internal circuit of the device and support the internal circuit. The material requirements are the same as those of the first lead posts 11. The second lead posts 12 are insulated from the metal base plate 14. The role of the second lead posts 12 requires special explanation. In the device of the present application, the circuit boards in its internal space are arranged as a spaced multi-layer (at least two-layer) structure. The second lead posts 12 are first electrically connected to the multi-layer circuit boards to realize the transmission of electrical signals between the internal multi-layer circuit boards. On the other hand, the second lead posts 12 are fixed to each layer of the circuit board. The second lead posts 12 can be used for positioning between the multi-layer circuit boards and for support in the height direction.

[0037] Figure 2 The figure is a schematic diagram of the assembly of the package base plate 1. The metal base plate 14 is provided with a through hole 141 that passes through the base plate inner surface 14S and the base plate outer surface 14D. The first lead post 11 passes through the through hole 141 and is fixed in the through hole 141. During the assembly process, a glass insulator 111 can be used to fix the glass insulator 111. In this solution, the glass insulator 111 can also be used to fill the gap between the first lead post 11 and the metal base plate 14 to ensure electrical insulation between the two. The welding process is to put the hollow glass insulator 111 on the first lead post 11, and pass the assembly formed by the glass insulator 111 and the first lead post 11 through the through hole 141. A graphite mold is used to complete the positioning between the metal base plate 14 and the first lead post 11. The assembly is then heated at a certain temperature in a protective atmosphere. After the glass insulator 111 melts and solidifies again, the first lead post 11 and the metal base plate 14 are reliably positioned and fixed. At the same time, the glass insulator 111 that melts and solidifies again between the first lead post 11 and the through hole 141 also serves to insulate the first lead post 11 from the metal base plate 14 .

[0038] The fixing method of the second lead post 12 and the metal base plate 14 is different. The second lead post 12 is only used for internal signal transmission of the device. In this case, there is no need to open a through hole on the metal base plate 14 specifically, and only a countersunk hole 142 needs to be reserved accordingly. One end of the second lead post 12 is fixed in the countersunk hole 142. The second lead post 12 is insulated from the metal base plate 14. Insulating ceramic 121 can be used to separate the second lead post 12 and the metal base plate 14 to achieve insulation between the two. Reliable fixation between the second lead post 12 and the metal base plate 14 can be ensured by gluing or welding with solder 122. Specifically, in order to ensure the position accuracy of the second lead post 12 and the insulating ceramic 121. The assembly process of the second lead post 12 is different. In order to accurately align the relative positions of the second lead post 12, the insulating ceramic 121 and the countersunk hole 142. The assembly process between the three is generally separate. Specifically, Figure 3 As shown, first, the insulating ceramic 121 and the second lead column 12 are assembled into a whole, which needs to be completed by brazing. As shown in the figure, the three are assembled into a whole and fixed on the graphite mold, and then the assembled whole is placed in a nitrogen protective atmosphere and heated and brazed. After the brazing is completed, it becomes a whole. The second lead column 12 and the insulating ceramic 121 are aligned with their central axes, and the radial length of the insulating ceramic 121 is generally slightly larger than the radial size of the second lead column 12. After brazing to form a whole, as shown in FIG. Figure 3 As shown on the right side, the edges of the insulating ceramic 121 protrude from the circumference of the second lead post 12. This is mainly to achieve the formation of air gap insulation between the metal base plate 14 and the second lead post 12 after being assembled into the countersunk hole 142. Then, the insulating ceramic 121 at one end of the assembly inserted into the countersunk hole 142 is welded and fixed by the lower layer of solder 124 placed in the countersunk hole 142. Under the step-by-step welding method of this embodiment, the centering accuracy between the countersunk hole 142, the second lead post 12 and the insulating ceramic 121 can be more conveniently controlled to ensure that the air gap around the edge of the countersunk hole 142 and the surface of the second lead post 12 is uniform, thereby ensuring the insulation capacity between the second lead post 12 and the metal base plate 14, avoiding excessive deviation in insulation capacity between different products, and preventing air gap breakdown failure that may occur in the subsequent use of the device. Usually, in step-by-step soldering, the soldering temperature sequence needs to be designed. Since the soldering of the lower layer solder 124 is later than that of the upper layer solder 123, the melting point of the upper layer solder 123 needs to be higher than that of the lower layer solder 124 to ensure that the pre-soldered upper layer solder 123 remains stable when the lower layer solder 124 is melted and soldered.

[0039] Alternatively, as Figure 1As shown, the package base plate 1 is also provided with a grounding lead post 13. The grounding lead post 13 has at least one section extending inward within the base plate inner surface 14S for electrical connection to the internal circuit board of the device. The grounding lead post 13 is electrically connected to the metal base plate 14, that is, the metal base plate 14 as a whole is used as an equivalent grounding point. The grounding lead post 13 can also pass through the metal base plate 14, that is, one end thereof extends to the inside of the base plate inner surface 14S, and the other end thereof extends to the outside of the base plate outer surface 14D. The end extending to the side of the base plate outer surface 14D is usually also used as an external ground port.

[0040] In the preferred technical solution, Figure 1 As shown, support steps 15 can be formed at the ends of several first lead posts 11 and / or several second lead posts 12 that extend toward the inner surface 14S of the base plate. Support steps 15 are formed by reducing the diameter of the first lead posts 11 or second lead posts 12. The support steps 15 formed on the several first lead posts 11 and second lead posts 12 are generally positioned at the same height to support the circuit board in a plane parallel to the inner surface 14S of the base plate. Preferably, the total number of first lead posts 11 and second lead posts 12 with step features in the same plane should be no less than three, and they should not be arranged collinearly to provide stable support for the circuit board.

[0041] like Figure 4 As shown in the cross-sectional schematic diagram, the end of the first lead column 11 and / or the second lead column 12 extending inwardly toward the inner surface 14S of the base plate can optionally form a plurality of steps located at different height planes, and the plurality of steps at each height layer can be used to support circuit boards of different heights. Figure 4 An embodiment is provided having two layers of circuit boards 21 (shown in the figure as an upper circuit board 21D and a lower circuit board 21E, respectively). A first support step 15 formed at a certain height is used to support the upper circuit board 21D. A second support step 16 is also formed on the first lead post 11 and / or the second lead post 12 at a height staggered from the first support step 15. The second support step 16 is used to support the lower circuit board 21E. Similarly, the total number of the first lead post 11 and the second lead post 12 having the second support step 16 is at least three, and preferably they are not arranged in a colinear manner to form a support surface to ensure stable support for the lower circuit board 21E. In a preferred embodiment, the step is provided on the second lead post 12 rather than formed on the first lead post 11, mainly to simplify the design of the first lead post 11 so that the first lead post 11 does not distinguish between the two ends. If there is a grounding lead post 13, a step (not limited to the first support step 15, the second support step 16, etc.) can also be formed on the grounding lead post 13.

[0042] Based on the above-mentioned packaging base plate 1 , the present invention provides a corresponding packaging device. Figure 5The figure is a schematic cross-sectional view of the double-layer package device 2. It includes the aforementioned package base plate 1, and a plurality of layers of spaced and stacked circuit boards are formed on one side of the inner surface 14S of the base plate of the package base plate 1 via a step support, thereby transforming the original single-layer circuit board into a multi-layer three-dimensional form through a reasonable layout. For the double-layer circuit board shown in the figure, a certain spacing is formed between the double-layer circuit boards during the layout, and the electronic components on the circuit board are basically installed on the side facing the spacing, and basically no electronic components are soldered on the other side (basically no soldering means that individual small-volume, low-height, low-heat-power components can be soldered on the side not facing the spacing). By staggering the layout of the electronic components, the layer height of the device can be reduced, thereby reducing the device footprint while compressing the extended height of the device. Generally, the diameter of the first lead post 11 and the second lead post 12 is about 1-2 mm, so the width of the step is only about 0.1-0.3 mm, which is not conducive to directly positioning and supporting the circuit board and the electrical connection with the circuit board. For this reason, a gasket 21F can be inserted into the step, and then the circuit board is placed on the upper layer of the gasket 21F to form an electrical connection between the circuit board and the first lead post 11, and between the circuit board and the second lead post 12. Optionally, an electrical connection is formed between the circuit board 21, the gasket 21F and the corresponding first lead post 11 or second lead post 12 by welding. After the connection between the internal circuit board and the first lead post, the internal circuit board and the second lead post, and optionally the internal circuit board and the ground lead post is completed, the cap 22 is covered on the package base plate 1. The cap 22 has a cavity with an opening on one side. The opening edge of the cap 22 contacts the edge of the package base plate 1, and the cavity is used to accommodate the internal circuit. The cap 22 is sealed and fixed to the package base plate 1 to form a complete device. Specifically, in order to achieve a sealed fixation between the cap 22 and the first lead post 11, a welding process can be used. During the specific welding, in order to form a specific gas environment in the device cavity, it can be carried out under a protective atmosphere, generally a nitrogen protective atmosphere. In order to avoid the impact of the welding of the cap 22 on the first lead post 11, the second lead post 12 and the internal circuit, the welding of the cap 22 generally uses energy storage welding, resistance welding and the like. After welding, the package base plate 1 and the cap 22 are fused and sealed at the contact point, and the interior is in a nitrogen atmosphere. In order to facilitate welding, the peripheral side of the metal base plate 14 is usually formed with a sunken step surface for positioning and docking the cap 22, and a protruding rib is formed on the step surface around the entire circumference, and a line contact is formed between the rib and the cap 22. During energy storage welding, the rib is fused, which can ensure the uniformity of welding of the entire roll during welding, and ensure that the welding between the package base plate 1 and the cap 22 is uniform and airtight. Optionally, a grounding lead post 13 is electrically connected to the metal base plate 14. In this case, the package base plate 1 and the cap 22 are integrated as a whole, so that the metal base plate 14 and the cap 22 are both grounding surfaces. Since the package base plate 1 and the cap 22 completely cover the device, this can isolate electromagnetic interference inside and outside the device and ensure functional stability.

[0043] The present invention also provides a method for manufacturing a packaged device based on the above-mentioned package base plate. The steps are as follows:

[0044] S1. Assemble the package base plate. Insulate and fix a number of first lead posts 11 and a number of second lead posts 12 to the metal base plate 14, wherein the first lead post 11 passes through the metal base plate 14 to form an end extending to the side of the inner surface 14S of the base plate and an end extending to the side of the outer surface 14D of the base plate. The second lead post 12 only forms one end extending to the inner side of the inner surface 14S of the base plate. When the first lead post 11 is fixed to the metal base plate 14, it is preferred to use a glass insulator 111 for insulation welding. At this time, the glass insulator 111 is welded around the first lead post 11 in the through hole 141. The second lead post 12 is insulated from the metal base plate 14 by an insulating member and an air gap, that is, it can be insulated by the insulating ceramic 121 between the fixed end of the first lead post 11 and the metal base plate 14. In order to ensure installation accuracy. The recommended assembly method for the second lead post 12 is two-step welding, and the steps are:

[0045] S11, assembling the second lead post 12 and the insulating ceramic 121. Place the insulating ceramic 121 at one end of the second lead post 12, aligning their axes, and use the upper layer of solder 123 between the second lead post 12 and the insulating ceramic 121 to weld them into a whole.

[0046] S13, assemble to the metal base plate 14. Fix the assembly with the insulating ceramic 121 welded to it into the countersunk hole 142 of the metal base plate 14. Place the end of the second lead column 12 with the insulating ceramic 121 fixed to it into the countersunk hole 142 of the metal base plate 14, and use the lower layer of solder 124 to weld between the countersunk hole 142 and the insulating ceramic 121, so that the assembly and the metal base plate 14 form a whole. In addition to the insulation of the insulating ceramic 121 between the second lead column 12 and the metal base plate 14, there needs to be a certain air gap (about 1mm) between their sides. The air gap is also to ensure the insulation ability between the second lead column 12 and the metal base plate 14. If the air gap is uneven and one side is narrower, there is a possibility of breakdown. This will only happen when the positioning of the second lead column 12 deviates to one side during assembly. In the two-step assembly process, the first step eliminates the obstruction of metal base plate 14, allowing for convenient centering welding between second lead post 12 and insulating ceramic 121. The air gap is ensured by the difference between the radial dimensions of insulating ceramic 121 and second lead post 12. During the second welding step, the dimensions of insulating ceramic 121 generally fit within countersunk hole 142. As long as the countersunk hole 142 is securely positioned and welded, the insulation between second lead post 12 and metal base plate 14 is maintained.

[0047] S3. Assemble the internal circuit. Assemble the internal circuit board layer by layer and fix it to the first lead post 11 and / or the second lead post 12, so that the first lead post 11 and the internal circuit board, and the second lead post 12 and the internal circuit board are electrically connected.

[0048] S5. Complete packaging. Place the cap 22 on the packaging base plate 1, with the open edge of the cap 22 embedded in the sunken step of the metal base plate 14 and in contact with the ribs along the perimeter of the sunken step. Press the cap 22 and the metal base plate 14 tightly together with a certain pressure to maintain contact. Under a nitrogen atmosphere, perform energy storage welding to uniformly weld and seal the cap 22 and the metal base plate 14 around their entire contact point.

[0049] The above content only describes the preferred embodiments of the present invention and does not limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solution of the present invention by ordinary technicians in this field should fall within the scope of protection determined by the claims of the present invention.

Claims

1. A packaging base plate, comprising a metal base plate (14), the metal base plate (14) having a base plate inner surface (14S) and a base plate outer surface (14D), characterized in that: It also includes a plurality of first lead posts (11) and a plurality of second lead posts (12) insulated and fixed to the metal base plate (14); One end of the first lead post (11) extends out of the inner surface (14S) of the bottom plate, and the other end of the first lead post (11) extends out of the outer surface (14D) of the bottom plate; One end of the second lead post (12) is fixed to the inner surface (14S) of the bottom plate, and the other end extends out of the inner surface (14S) of the bottom plate; A countersunk hole (142) is formed on one side of the inner surface (14S) of the metal bottom plate (14), and one end of the second lead post (12) is insulated and fixed in the countersunk hole (142); the second lead post (12) and the countersunk hole (142) are separated by an insulating ceramic (121); the second lead post (12) is stacked above the insulating ceramic (121) in the countersunk hole (142); The second lead post (12) and the insulating ceramic (121) are aligned with their central axes, the radial dimension of the insulating ceramic (121) is larger than the radial dimension of the second lead post (12), and the edges of the insulating ceramic (121) protrude from the circumference of the second lead post (12), so that an air gap insulation is formed between the metal base plate (14) and the second lead post (12) after being assembled into the countersunk hole (142); First, the insulating ceramic and the second lead column are connected as a whole, and then the whole consisting of the insulating ceramic and the second lead column is fixed in the countersunk hole of the metal bottom plate.

2. The packaging base plate according to claim 1, wherein: A through hole (141) is provided on the metal base plate (14) and passes through the base plate inner surface (14S) and the base plate outer surface (14D); the first lead post (11) passes through the through hole (141); and the glass insulator (111) is located between the through hole (141) and the first lead post (11) to achieve insulation and fixation.

3. The packaging base plate according to claim 1, wherein: A plurality of steps are formed on one end of the first lead post (11) and / or the second lead post (12) extending outward from the inner surface (14S) of the bottom plate, and the steps are used to position and fix the internal circuit board.

4. The packaging base plate according to claim 1, wherein: The invention also includes a grounding lead post (13) conductively fixed to the metal base plate (14), one end of the grounding lead post (13) extending out of the inner surface (14S) of the base plate, and the other end of the grounding lead post (13) fixed to the inner surface (14S) of the base plate or extending out of the outer surface (14D) of the base plate.

5. The packaging base plate according to claim 4, wherein: A plurality of steps are formed at one end of the first lead post (11) and / or the second lead post (12) and / or the ground lead post (13) extending outward from the inner surface (14S) of the bottom plate, and the steps are used to position and fix the internal circuit board.

6. The packaging base plate according to any one of claims 3 or 5, wherein: The plurality of steps have different height layers, and there are no less than three steps in the same height layer and the planes thereof are not collinear.

7. A packaged device, characterized in that: A package base plate according to any one of claims 1 to 6, wherein a plurality of layers of spaced and stacked circuit boards are formed on one side of the inner surface (14S) of the metal base plate (14), and the circuit boards are electrically connected to the first lead post (11) and the second lead post (12); The package further comprises a cap (22) having a cavity with an opening on one side for accommodating an internal circuit, and an opening edge of the cap (22) contacts and seals with an edge of a package base plate.

8. The packaged device according to claim 7, wherein: A plurality of steps are formed at one end of the first lead post (11) and / or the second lead post (12) extending outward from the inner surface (14S) of the base plate, and the circuit board is positioned and fixed at the steps of the first lead post (11) and / or the second lead post (12).

9. A method for manufacturing a packaged device, characterized in that: The steps include: S1. Assembling the package base plate; forming a countersunk hole (142) on one side of the base plate inner surface (14S) of the metal base plate (14); one end of the second lead column (12) is insulated and fixed in the countersunk hole (142); the second lead column (12) and the countersunk hole (142) are separated by an insulating ceramic (121); the second lead column (12) is stacked above the insulating ceramic (121) in the countersunk hole (142); The second lead post (12) and the insulating ceramic (121) are aligned with their central axes, the radial dimension of the insulating ceramic (121) is larger than the radial dimension of the second lead post (12), and the edges of the insulating ceramic (121) protrude from the circumference of the second lead post (12), so that an air gap insulation is formed between the metal base plate (14) and the second lead post (12) after being assembled into the countersunk hole (142); A plurality of first lead posts (11) and a plurality of second lead posts (12) are insulated and fixed to a metal base plate (14), wherein the first lead posts (11) penetrate the metal base plate (14) to form one end extending toward the base plate inner surface (14S) and the other end extending toward the base plate outer surface (14D); the second lead posts (12) only form one end extending toward the inner side of the base plate inner surface (14S); First, the insulating ceramic and the second lead column are connected as a whole, and then the whole consisting of the insulating ceramic and the second lead column is fixed in the countersunk hole of the metal base plate; S3, assembling the internal circuit; assembling the internal circuit board in layers and fixing it to the first lead post (11) and / or the second lead post (12), so that the first lead post (11) and the internal circuit board, and the second lead post (12) and the internal circuit board are electrically connected; S5. Overall packaging: sealingly covering the cap (22) on the packaging base plate (1).

10. The method for manufacturing a packaged device according to claim 9, wherein: In the step of sealing and covering the cap (22) on the packaging base plate (1), the opening edge of the cap (22) is embedded in the sunken step of the metal base plate (14) and contacts the ribs around the entire circumference of the sunken step. The cap (22) and the metal base plate (14) are pressed tightly with a certain pressure to maintain contact. Under a nitrogen protective atmosphere, the cap (22) and the metal base plate (14) are welded and sealed around the entire circumference by energy storage welding.

11. The method for manufacturing a packaged device according to claim 9, wherein: In the step of insulating and fixing a plurality of first lead posts (11) and a plurality of second lead posts (12) to a metal base plate (14), the assembly steps of the second lead posts (12) are as follows: S11, assembling the second lead post and the insulating ceramic; placing the insulating ceramic (121) on one end of the second lead post (12), aligning the axes, and using the upper layer of solder (123) between the second lead post (12) and the insulating ceramic (121) to weld them into a whole; S13, assembling to the metal base plate; placing one end of the second lead column (12) fixed with the insulating ceramic (121) in the countersunk hole (142) of the metal base plate (14), and using the lower layer solder (124) to weld between the countersunk hole (142) and the insulating ceramic (121).

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