Method for preparing a multifunctional network socket connector

Abstract

The present invention discloses a preparation method of a multifunctional network socket connector, comprising a socket body, wherein a first plug interface and a second plug interface are provided on the socket body, a first tongue is provided in the first plug interface, a first front end PIN needle assembly is fixedly provided on the first tongue, a first rear end PIN needle assembly electrically connected to the first front end PIN needle assembly is fixedly provided at the rear end of the first tongue, a second tongue is provided in the second plug interface, a second front end PIN needle assembly is fixedly provided on the second tongue, and a second rear end PIN needle assembly electrically connected to the second front end PIN needle assembly is fixedly provided at the rear end of the second tongue. The present invention performs multi-dimensional detection of the PIN pins on the socket through the coordination of three-dimensional point cloud map comparison and resistance detection, thereby greatly improving the detection accuracy. Not only can defective products be screened out based on appearance, but defective products with defects inside or at bends can also be screened out. The screening effect is more comprehensive, and production quality detection can be carried out in a targeted manner, with higher detection efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial vision systems, and in particular to a method for preparing a multifunctional network socket connector. Background Art

[0002] As described in the published patent "A Terminal Visual Inspection Device" with publication number CN210358124U (Comparative Document 1), the terminals of electronic components are small and produced at a fast speed, so they cannot be inspected manually one by one. This will result in some defective products in the packaged finished products, and the quality of the finished products cannot be guaranteed. In the present invention, a main visual inspection head and an auxiliary visual inspection head are used to achieve multi-directional inspection of the terminals, thereby ensuring the accuracy of the inspection results.

[0003] As described in the published patent "A Machine Vision Method for Quality Inspection of Micro Terminal Blocks" with publication number CN107895362B (Reference 2), with the miniaturization of electronic devices, the demand for and quality requirements for micro terminal blocks are increasing. The shape and contour of micro terminal blocks, the arrangement and color of the plug wires, and the contact performance of the plug wires determine their quality. The overall size of micro terminal blocks is approximately 10 mm, with the diameter of a single terminal being around 1 mm. Furthermore, the complex shape of the plug-in terminals and the diverse variations in insertion position and post-insertion form make quality inspection of micro terminals a highly precise and challenging task.

[0004] Current terminal block quality inspections typically rely on human observation from various angles. This requires not only extensive experience but also constant focus. For workers working continuously on the assembly line, visual fatigue can easily occur, leading to decreased inspection efficiency and accuracy, and inevitably leading to false detections and missed detections. Therefore, manual inspection methods are unable to meet the current demands of high-speed, precise, and automated production. Consequently, improving the level of automation, enhancing the production quality, and reducing production costs in the electronic components industry are pressing challenges.

[0005] The present invention collects images of micro-connecting terminals through an image acquisition module, and a server analyzes the images of the terminals; extracts the wire shape and wire insertion features, and compares them with the terminal outer contour features, wire shape features, and wire insertion image features preset in a standard template image, thereby detecting whether the quality of the micro-connecting terminals is qualified; compared with traditional manual methods, the present invention is more intelligent, more efficient, and has a more stable and accurate detection accuracy; therefore, the present invention effectively overcomes the various shortcomings of the existing technology and has high industrial utilization value.

[0006] As described in the published patent application "An Imaging Area Detection Mechanism and Terminal Visual Inspection Device" with publication number CN212808099U (Reference 3), dimensional inspection of terminals in electronic devices before shipment is essential. This inspection can be performed in a variety of ways, primarily manual and machine. However, due to the large number of areas requiring inspection, traditional manual visual inspection is inefficient. To meet the requirements for rapid and efficient inspection of large quantities of workpieces, camera-based automatic visual inspection equipment is becoming increasingly popular. These advanced devices use cameras to collect image information of terminal products, enabling fully automated visual inspection.

[0007] In summary, in the existing terminal (connector or socket) production process, cameras are generally used to capture images of the terminals. These images are then compared and analyzed to perform appearance quality inspections, which then allow unqualified terminals to be screened for defects. However, in actual production, as in the terminal socket structure shown in the published patent application CN205248484U, the PIN pins within the terminal sockets undergo multiple bending processes during processing. During these bending processes, cracks are likely to form within the PIN pins at the bends. However, cracked PIN pins are difficult to detect based on appearance. If the terminal sockets are inspected solely based on their appearance, internal defects within the PIN pins cannot be inspected for compliance, resulting in limited accuracy in the terminal socket quality determination results. Summary of the Invention

[0008] In order to overcome the above-mentioned shortcomings, the present invention aims to provide a method for preparing a multifunctional network socket connector, which can solve the above-mentioned technical problems.

[0009] To achieve the above object, the present invention provides the following technical solutions:

[0010] A method for preparing a multifunctional network socket connector includes a socket body provided with a first plug interface and a second plug interface;

[0011] A first tongue is provided in the first plug interface, a first front PIN needle assembly is fixedly provided on the first tongue, a first rear PIN needle assembly is fixedly provided at the rear end of the first tongue and is electrically connected to the first front PIN needle assembly, the first front PIN needle assembly includes a plurality of first front PIN needle members arranged in parallel, and the first rear PIN needle assembly includes a plurality of first rear PIN needle members arranged in parallel;

[0012] A second tongue is provided in the second plug interface, a second front PIN needle assembly is fixedly provided on the second tongue, a second rear PIN needle assembly is fixedly provided at the rear end of the second tongue and is electrically connected to the second front PIN needle assembly, the second front PIN needle assembly includes a plurality of second front PIN needle members arranged in parallel, and the second rear PIN needle assembly includes a plurality of second rear PIN needle members arranged in parallel;

[0013] The preparation process of the first plug interface and the second plug interface includes the following steps:

[0014] S110: Sequentially obtain a 3D point cloud image of each first front-end PIN needle component in the first front-end PIN needle assembly and store them as P11, P12, P13, ..., P1n, respectively; obtain diameter values ​​of P11, P12, P13, ..., P1n and store them as D11, D12, D13, ..., D1n, respectively; compare D11, D12, D13, ..., D1n with target values, and proceed to step S120 only if the matching rate reaches the target qualified rate;

[0015] S120: Sequentially obtain a three-dimensional point cloud image of each first rear-end PIN needle component in the first rear-end PIN needle assembly and store them as P11', P12', P13', ..., P1n', respectively; obtain diameter values ​​of P11', P12', P13', ..., P1n' and store them as D11', D12', D13', ..., D1n', respectively; compare D11', D12', D13', ..., D1n' with target values, and proceed to step S130 if and only if the matching rate reaches the target qualified rate;

[0016] S130: Obtain the resistance value of each first front-end PIN pin in the first front-end PIN pin assembly in sequence and store them as R11, R12, R13, ..., R1n, respectively. Compare R11, R12, R13, ..., R1n with the target values, respectively. If and only if the matching rate reaches the target qualified rate, proceed to step S140;

[0017] S140: Obtain the resistance value of each first rear-end PIN pin in the first rear-end PIN pin assembly in sequence and store them as R11', R12', R13', ..., R1n', respectively. Compare R11', R12', R13', ..., R1n' with the target values, respectively. If and only if the matching rate reaches the target qualified rate, proceed to step S150;

[0018] S150: Sequentially obtaining the overall resistance value of each electrically connected first front-end PIN pin component and first back-end PIN pin component in the first front-end PIN pin assembly and the first back-end PIN pin assembly, and storing them as R01, R02, R03, ..., R0n, respectively. R01, R02, R03, ..., R0n are respectively compared with target values. If and only if the matching rate reaches the target pass rate, proceeding to step S210;

[0019] S210: Sequentially obtain a 3D point cloud image of each second front-end PIN needle component in the second front-end PIN needle assembly and store them as P21, P22, P23, ..., P2n, respectively; obtain diameter values ​​of P21, P22, P23, ..., P2n and store them as D21, D22, D23, ..., D2n, respectively; compare D21, D22, D23, ..., D2n with target values, and proceed to step S220 only if the matching rate reaches the target qualified rate;

[0020] S220: Sequentially obtain a three-dimensional point cloud image of each second rear-end PIN needle component in the second rear-end PIN needle assembly and store them as P21', P22', P23', ..., P2n', respectively; obtain diameter values ​​of P21', P22', P23', ..., P2n' and store them as D21', D22', D23', ..., D2n', respectively; compare D21', D22', D23', ..., D2n' with target values, and proceed to step S230 only if the matching rate reaches the target qualified rate;

[0021] S230: Obtain the resistance value of each first front-end PIN pin in the first front-end PIN pin assembly in sequence and store them as R21, R22, R23, ..., R2n, respectively. Compare R21, R22, R23, ..., R2n with the target values, respectively. If and only if the matching rate reaches the target qualified rate, proceed to step S240;

[0022] S240: Obtain the resistance value of each first rear-end PIN pin in the first rear-end PIN pin assembly in sequence and store them as R21', R22', R23', ..., R2n', respectively. Compare R21', R22', R23', ..., R2n' with the target values, respectively. If and only if the matching rate reaches the target qualified rate, proceed to step S250;

[0023] S250: Obtain the overall resistance value of each electrically connected second front-end PIN needle component and second rear-end PIN needle component in the second front-end PIN needle assembly and the second rear-end PIN needle assembly in sequence, and store them as R001, R002, R003, ..., R00n, respectively, and compare R001, R002, R003, ..., R00n with the target values ​​respectively. If and only if the matching rate reaches the target qualified rate, proceed to the subsequent production steps.

[0024] As a further solution of the present invention, step S110 includes the following steps:

[0025] S111: Establish an upper reference plane S, project P11, P12, P13, ..., P1n onto the upper reference plane S, and store the projections as S11, S12, S13, ..., S1n respectively;

[0026] S112: Establishing a target outline Ts in the upward reference plane S, where the target outline Ts includes a first target area T1, a second target area T2, and a third target area T3, where the levels of T1, T2, and T3 are first-level, second-level, and third-level areas, respectively;

[0027] S113: Compare S11 with the target profile Ts, where the target matching rate of T1 > the target matching rate of T2 > the target matching rate of T3. If and only if the matching degrees of T1, T2 and T3 are respectively greater than the target matching rates, proceed to step S114.

[0028] S114: Compare S12 with the target profile Ts, where the target matching rate of T1 > the target matching rate of T2 > the target matching rate of T3. If and only if the matching degrees of T1, T2 and T3 are respectively greater than the target matching rates, proceed to the subsequent steps, and so on, until the comparison of S13, ..., S1n with the target profile Ts is completed.

[0029] As a further solution of the present invention, step S110 further includes the following steps:

[0030] S115: Establish a right-view reference plane Y, project P11, P12, P13, ..., P1n onto the right-view reference plane Y, and store the projections as Y11, Y12, Y13, ..., Y1n respectively;

[0031] S116: Establish a target profile Ty in the right-view reference plane Y, where the target profile Ty includes a first target corner G1, a second target corner G2, and a third target corner G3, wherein G1 includes a first target height H1 and a first target curvature Q1, G2 includes a second target height H2 and a second target curvature Q2, and G3 includes a third target height H3 and a third target curvature Q3;

[0032] S117: Compare Y11 with the target profile Ty, where the target matching rate of H1 is greater than the target matching rate of Q1, the target matching rate of Q2 is greater than the target matching rate of H2, and the target matching rate of Q3 is equal to the target matching rate of H3. If and only if the matching degrees of H1, H2, H3, Q1, Q2 and Q3 are respectively greater than the target matching rates, proceed to step S118.

[0033] S118: Compare Y12 with the target profile Ys. If and only if the matching degrees of H1, H2, H3, Q1, Q2 and Q3 are respectively greater than the target matching rate, proceed to the subsequent steps, and so on, until the comparison of Y13, ..., Y1n with the target profile Ts is completed.

[0034] As a further solution of the present invention, step S120 includes the following steps:

[0035] S121: Project P11', P12', P13', ..., P1n' onto the right-view reference plane Y and store the projections as Y11', Y12', Y13', ..., S1n' respectively;

[0036] S122: Establish a vertical reference line Ly in the right-view reference plane Y, obtain the coordinates of the upper, middle, and lower points of Ly, and store them as Lu, Lm, and Ld, respectively, where Lu includes (Xu, Yu), Lm includes (Xm, Ym), and Ld includes (Xd, Yd).

[0037] S123: Compare Y11′ with the vertical reference line Ly, where if and only if the tolerance between Ld and the target reference point is within the target range and the difference between Xu, Xm and Xd is within the target tolerance range, proceed to step S114.

[0038] S124: Compare Y12' with the vertical reference line Ly, and so on, until the comparison of Y13', ..., Y1n' with the vertical reference line Ly is completed.

[0039] As a further solution of the present invention, step S130 includes the following steps:

[0040] S131: Obtain points O1, O2, ..., On on the first front PIN needle from front to back, where points O1, O2, ..., On are endpoints of a straight line portion on the first front PIN needle;

[0041] S132: After the bending process m is completed, the resistance values ​​of the front and rear ends of the m-th bending section are measured.

[0042] As a further solution of the present invention, step S140 includes the following steps:

[0043] S141: Obtain points O1', O2', ..., On' from top to bottom on the first rear PIN needle component, where points O1', O2', ..., On' are end points of portions of different diameters on the first rear PIN needle component;

[0044] S142: After the punching process of the first rear-end PIN pin is completed, the resistance values ​​of points O1' to O2', O2' to O3', ..., On-1 to On' of the first rear-end PIN pin are measured.

[0045] As a further solution of the present invention, step S150 includes the following steps:

[0046] S151: in the first PIN pin assembly of the previous socket component, taking an average resistance value of the first PIN pin components that meet the target qualification rate;

[0047] S152: in the first PIN pin assembly of the next socket component, taking an average resistance value of the first PIN pin components that meet the target qualification rate;

[0048] S152: Compare the two average values, obtain the difference between them and store it, and so on until all socket components are completed;

[0049] S153: Organize the above differences into an array.

[0050] As a further solution of the present invention: the socket body also includes a shell member, the first plug interface and the second plug interface are installed in the shell member, the shell member includes a first mounting groove provided at the corner of the front end face and the lower end face and a second mounting groove connecting the front end face and the lower end face, the second mounting groove includes a horizontal mounting groove and a longitudinal mounting groove connected to each other, the first plug interface is installed in the first mounting groove, and the second plug interface is installed in the second mounting groove.

[0051] Compared with the prior art, the present invention has the following beneficial effects:

[0052] The present invention performs multi-dimensional detection of the PIN needles on the socket through the coordination of three-dimensional point cloud image comparison and resistance detection, which greatly improves the detection accuracy. It can not only screen out defective products based on appearance, but also screen out defective products with defects inside or at bends. The screening effect is more comprehensive and the screening data is more comprehensive, which can carry out targeted production quality inspection and has higher detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 This is a structural perspective diagram of an embodiment of the present invention;

[0054] Figure 2 is a structural perspective diagram of a PIN needle member in one embodiment of the present invention;

[0055] Figure 3 It is a top view of the PIN needle and a structural schematic diagram of the target reference profile TS;

[0056] Figure 4 It is a right view of the PIN needle and a structural schematic diagram of the target reference profile Ty;

[0057] Figure 5 is a front view of an embodiment of the present invention;

[0058] Figure 6 yes Figure 5 Cross-sectional view along JJ direction;

[0059] Figure 7 yes Figure 6 Partial view at K in the middle;

[0060] Figure 8 This is a right side view of the first rear end PIN needle member;

[0061] Figure 9 This is the right side view of the PIN pin;

[0062] Figure 10 It is a flow chart of steps S110-S150 in the present invention;

[0063] Figure 11 It is a flow chart of steps S210-S250 in the present invention;

[0064] Figure 12 It is a flow chart of steps S111-S114 in the present invention;

[0065] Figure 13 It is a flow chart of steps S115-S118 in the present invention;

[0066] Figure 14 It is a flow chart of steps S121-S124 in the present invention;

[0067] The reference numerals and names in the figures are as follows:

[0068] Shell component-1, first plug interface-2, second plug interface-3, first installation slot-4, second installation slot-5, horizontal installation slot-6, longitudinal installation slot-7. DETAILED DESCRIPTION

[0069] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0070] See also Figure 1-14 , a method for preparing a multifunctional network socket connector, comprising a socket body, the socket body being provided with a first plug interface and a second plug interface;

[0071] A first tongue is provided in the first plug interface, a first front PIN needle assembly is fixedly provided on the first tongue, a first rear PIN needle assembly is fixedly provided at the rear end of the first tongue and is electrically connected to the first front PIN needle assembly, the first front PIN needle assembly includes a plurality of first front PIN needle members arranged in parallel, and the first rear PIN needle assembly includes a plurality of first rear PIN needle members arranged in parallel;

[0072] A second tongue is provided in the second plug interface, a second front PIN needle assembly is fixedly provided on the second tongue, a second rear PIN needle assembly is fixedly provided at the rear end of the second tongue and is electrically connected to the second front PIN needle assembly, the second front PIN needle assembly includes a plurality of second front PIN needle members arranged in parallel, and the second rear PIN needle assembly includes a plurality of second rear PIN needle members arranged in parallel;

[0073] The preparation process of the first plug interface and the second plug interface includes the following steps:

[0074] S110: Sequentially obtain a 3D point cloud image of each first front-end PIN needle component in the first front-end PIN needle assembly and store them as P11, P12, P13, ..., P1n, respectively; obtain diameter values ​​of P11, P12, P13, ..., P1n and store them as D11, D12, D13, ..., D1n, respectively; compare D11, D12, D13, ..., D1n with target values, and proceed to step S120 only if the matching rate reaches the target qualified rate;

[0075] S120: Sequentially obtain a three-dimensional point cloud image of each first rear-end PIN needle component in the first rear-end PIN needle assembly and store them as P11', P12', P13', ..., P1n', respectively; obtain diameter values ​​of P11', P12', P13', ..., P1n' and store them as D11', D12', D13', ..., D1n', respectively; compare D11', D12', D13', ..., D1n' with target values, and proceed to step S130 if and only if the matching rate reaches the target qualified rate;

[0076] S130: Obtain the resistance value of each first front-end PIN pin in the first front-end PIN pin assembly in sequence and store them as R11, R12, R13, ..., R1n, respectively. Compare R11, R12, R13, ..., R1n with the target values, respectively. If and only if the matching rate reaches the target qualified rate, proceed to step S140;

[0077] S140: Obtain the resistance value of each first rear-end PIN pin in the first rear-end PIN pin assembly in sequence and store them as R11', R12', R13', ..., R1n', respectively. Compare R11', R12', R13', ..., R1n' with the target values, respectively. If and only if the matching rate reaches the target qualified rate, proceed to step S150;

[0078] S150: Sequentially obtaining the overall resistance value of each electrically connected first front-end PIN pin component and first back-end PIN pin component in the first front-end PIN pin assembly and the first back-end PIN pin assembly, and storing them as R01, R02, R03, ..., R0n, respectively. R01, R02, R03, ..., R0n are respectively compared with target values. If and only if the matching rate reaches the target pass rate, proceeding to step S210;

[0079] S210: Sequentially obtain a 3D point cloud image of each second front-end PIN needle component in the second front-end PIN needle assembly and store them as P21, P22, P23, ..., P2n, respectively; obtain diameter values ​​of P21, P22, P23, ..., P2n and store them as D21, D22, D23, ..., D2n, respectively; compare D21, D22, D23, ..., D2n with target values, and proceed to step S220 only if the matching rate reaches the target qualified rate;

[0080] S220: Sequentially obtain a three-dimensional point cloud image of each second rear-end PIN needle component in the second rear-end PIN needle assembly and store them as P21', P22', P23', ..., P2n', respectively; obtain diameter values ​​of P21', P22', P23', ..., P2n' and store them as D21', D22', D23', ..., D2n', respectively; compare D21', D22', D23', ..., D2n' with target values, and proceed to step S230 only if the matching rate reaches the target qualified rate;

[0081] S230: Obtain the resistance value of each first front-end PIN pin in the first front-end PIN pin assembly in sequence and store them as R21, R22, R23, ..., R2n, respectively. Compare R21, R22, R23, ..., R2n with the target values, respectively. If and only if the matching rate reaches the target qualified rate, proceed to step S240;

[0082] S240: Obtain the resistance value of each first rear-end PIN pin in the first rear-end PIN pin assembly in sequence and store them as R21', R22', R23', ..., R2n', respectively. Compare R21', R22', R23', ..., R2n' with the target values, respectively. If and only if the matching rate reaches the target qualified rate, proceed to step S250;

[0083] S250: Sequentially obtain the overall resistance value of each second front-end PIN pin component and second back-end PIN pin component electrically connected to each other in the second front-end PIN pin assembly and store them as R001, R002, R003, ..., R00n, respectively. R001, R002, R003, ..., R00n are compared with target values, and subsequent production steps are performed only when the matching rate reaches the target qualified rate.

[0084] In the production practice, single-hole sockets are relatively easy to inspect for quality due to their relatively simple structure. In addition, single-hole sockets have relatively low production costs due to the small amount of materials used and more mature production processes. During the production process of single-hole sockets, the accuracy of inspection has little impact on the production cost. However, for multi-hole sockets, due to their more complex structure, more materials used, longer production processes and more procedures, the production cost is higher, the quality inspection is difficult, and the yield rate will greatly affect the production cost. Therefore, multi-hole sockets require more sophisticated quality inspection during the production process.

[0085] In the preparation method of the multifunctional socket of the present invention, a first plug interface and a second plug interface are provided on the socket body, wherein the first plug interface and the second plug interface include but are not limited to the same type of plug interfaces or different types of plug interfaces, such as Figure 1 As shown in , the first plug interface includes an RJ45 socket interface, and the second plug interface includes a USB socket interface;

[0086] During the preparation of the USB socket interface, the USB socket interface is generally inserted into the USB housing. Therefore, the acquisition of the three-dimensional point cloud images of the first front PIN pin component, the first rear PIN pin component, the second front PIN pin component, and the second rear PIN pin component needs to be completed before the USB housing is assembled.

[0087] In S110, the diameter values ​​of P11, P12, P13, ..., P1n are obtained and stored as D11, D12, D13, ..., D1n respectively. The three-dimensional point cloud image contains the appearance size information of the first front end PIN needle component, but only the diameter value is obtained here. On the one hand, it can reduce the amount of calculation and shorten the calculation time. On the other hand, if the length of the first front end PIN needle component does not meet the production requirements, the first front end PIN needle component cannot be assembled on the first tongue piece. Therefore, the length is relatively easy to screen, and no additional separate detection of the length is required here. Since the PIN needle component is relatively precise and has a small diameter During the production and processing of PIN pins, the diameter of the PIN pins may be deformed during the extrusion / stretching or bending process. A small deformation of the diameter will not affect the subsequent assembly, so the deformation of the diameter of the PIN pins is not easy to detect. However, the deformation of the diameter will affect the plugging effect of the socket and the plug. If the diameter of a PIN pin is too small, it will cause poor contact between the socket and the plug. If the diameter of the PIN pin is too large, the socket and the plug will be too tightly abutted. During the plugging process of the plug and the socket, excessive wear will occur between the PIN pin and the plug, resulting in a shortened service life. Therefore, it is particularly important to detect the diameter of the PIN pins.

[0088] In S110, D11, D12, D13, ..., D1n are respectively compared with the target values. If and only if the matching rate reaches the target qualified rate, step S120 is performed. The target value is the standard production size. For example, if the matching rate of the value of D11 and the standard production size reaches the target qualified rate, it means that in the first front-end PIN needle assembly, the first front-end PIN needle component with serial number 1 meets the production requirements in terms of appearance and size. By comparing the three-dimensional point cloud image, the comparison time can be greatly shortened, and the comparison accuracy and efficiency can be improved. If the matching rate of the value of D11 and the standard production size exceeds the allowable error range, it means that the first front-end PIN needle component with serial number 1 does not meet the production requirements in terms of appearance and size, indicating that the quality of the socket does not meet the production requirements and needs to be repaired or scrapped. Similarly, each first front-end PIN needle component in the first front-end PIN needle assembly is quality inspected, thereby completing the quality inspection of the first front-end PIN needle assembly;

[0089] Similarly, in S120, for the first rear-end PIN needle assembly, D11', D12', D13', ..., D1n' are respectively compared with the target values. If and only if the matching rate reaches the target qualified rate, step S130 is performed. After completing S110 and S120, it is determined that the first front-end PIN needle assembly and the first rear-end PIN needle assembly meet the production requirements in terms of appearance and size. Those that do not meet the production requirements are rejected.

[0090] In S130 and S140, the resistance value of each first front-end PIN needle component in the first front-end PIN needle assembly is sequentially obtained and stored as R11, R12, R13, ..., R1n, respectively. The resistance value of each first rear-end PIN needle component in the first rear-end PIN needle assembly is sequentially obtained and stored as R11', R12', R13', ..., R1n', respectively. The resistance values ​​of the PIN needle components are detected by probes at the front and rear ends of the first front-end PIN needle components and the first rear-end PIN needle components.

[0091] In S130, R11, R12, R13, ..., R1n are respectively compared with target values. If and only if the matching rate reaches the target qualified rate, step S140 is performed. The target value is a standard resistance value. For example, if the matching rate between the value of R11 and the standard resistance value reaches the target qualified rate, it means that in the first front-end PIN needle assembly, the first front-end PIN needle component numbered 1 meets the production requirements in terms of conductivity. By detecting the resistance value, first front-end PIN needle components with internal defects can be more accurately screened out. If the matching rate between the value of R11 and the standard resistance value exceeds the allowable error range, it means that the first front-end PIN needle component numbered 1 has an internal defect, resulting in the conductivity effect not meeting the production requirements. This indicates that the quality of the socket does not meet the production requirements and needs to be repaired or scrapped. Similarly, the resistance value of each first front-end PIN needle component in the first front-end PIN needle assembly is tested, thereby completing further quality testing of the first front-end PIN needle assembly.

[0092] Similarly, in S140, R11', R12', R13', ..., R1n' are respectively compared with the target values. If and only if the matching rate reaches the target qualified rate, step S150 is performed. After completing S130 and S140, it is indicated that the first front-end PIN needle assembly and the first rear-end PIN needle assembly meet the production requirements in terms of conductivity. Those that do not meet the production requirements are rejected.

[0093] In S150, the overall resistance value of each electrically connected first front PIN needle component and first rear PIN needle component in the first front PIN needle assembly and the first rear PIN needle assembly is obtained in sequence and stored as R01, R02, R03, ..., R0n, respectively. The resistance values ​​of the electrically connected first front PIN needle components and first rear PIN needle components are tested to obtain the overall resistance value. For example, for the first front PIN needle component with a serial number of 1 and the first rear PIN needle component with a serial number of 1, theoretically R11+R11'=R01; otherwise, it means that there is a fracture defect at the bent connection between the first front PIN needle component and the first rear PIN needle component. By performing a separate appearance inspection on the first front PIN needle component or the first rear PIN needle component, the appearance qualification rate during the processing of the first front PIN needle component or the first rear PIN needle component can be detected, so that appearance non-conforming components can be conveniently identified. By testing the resistance value of the first front-end PIN needle component or the first rear-end PIN needle component individually, the qualified rate of the resistance value in the processing of the first front-end PIN needle component or the first rear-end PIN needle component can be tested individually; by testing the overall resistance value of the first front-end PIN needle component and the first rear-end PIN needle component as a whole, the qualified rate of the resistance value in the processing of the first front-end PIN needle component and the first rear-end PIN needle component as a whole can be tested, so that the PIN needle components with defects in the bending connection can be screened out, thereby more finely testing the production quality data of each production process. When a certain process produces abnormal data, the production of each process can be better adjusted according to the feedback data. For example, when the yield rate of R11', R12', R13', ..., R1n' is too low, it can be determined that there is an abnormality in the processing process of the first rear-end PIN needle component, and timely targeted adjustments can be made;

[0094] In S210-S250, the operation steps are the same as S110-S150 and will not be repeated here;

[0095] The present invention performs multi-dimensional detection of the PIN needles on the socket through the coordination of three-dimensional point cloud image comparison and resistance detection, which greatly improves the detection accuracy. It can not only screen out defective products based on appearance, but also screen out defective products with defects inside or at bends. The screening effect is more comprehensive and the screening data is more comprehensive, which can carry out targeted production quality inspection and has higher detection efficiency.

[0096] In the embodiment of the present invention, step S110 includes the following steps:

[0097] S111: Establish an upper reference plane S, project P11, P12, P13, ..., P1n onto the upper reference plane S, and store the projections as S11, S12, S13, ..., S1n respectively;

[0098] S112: Establishing a target outline Ts in the upward reference plane S, where the target outline Ts includes a first target area T1, a second target area T2, and a third target area T3, where the levels of T1, T2, and T3 are first-level, second-level, and third-level areas, respectively;

[0099] S113: Compare S11 with the target profile Ts, where the target matching rate of T1 > the target matching rate of T2 > the target matching rate of T3. If and only if the matching degrees of T1, T2 and T3 are respectively greater than the target matching rates, proceed to step S114.

[0100] S114: Compare S12 with the target profile Ts, where the target matching rate of T1 > the target matching rate of T2 > the target matching rate of T3. If and only if the matching rates of T1, T2, and T3 are respectively greater than the target matching rates, proceed to the subsequent steps, and so on, until the comparisons of S13, ..., S1n with the target profile Ts are completed;

[0101] like Figure 2 and Figure 3 As shown in the figure, some socket interfaces have special-shaped PIN pins. The overall diameter of the special-shaped PIN pins varies in multiple stages. A single diameter test cannot meet the appearance inspection requirements of special-shaped PIN pins. Therefore, a more detailed appearance comparison of the PIN pins is required.

[0102] In S111, an upper reference plane S is established, and P11, P12, P13, ..., P1n are projected onto the upper reference plane S and the projections are stored as S11, S12, S13, ..., S1n, respectively. By establishing the upper reference plane S, the three-dimensional point cloud images P11, P12, P13, ..., P1n are converted into two-dimensional plane images, thereby reducing the amount of data and improving data processing efficiency.

[0103] In S112, a target outline Ts is established in the upper reference plane S, and the front ends of S11, S12, S13, ..., and S1n are aligned with the front end of the target outline Ts respectively. Then, S11, S12, S13, ..., and S1n are moved closer to the target outline Ts from top to bottom or from bottom to top until they overlap, so as to test the matching rate. The target outline Ts includes a first target area T1, a second target area T2, and a third target area T3, wherein the levels of T1, T2, and T3 are first-level area, second-level target area, and third-level area, respectively. Figure 3As shown, the PIN pin of the special-shaped structural component includes multiple structures of different diameters, and the projection S11 includes multiple areas of different diameters. In the process of comparing the projection S11 with the target contour Ts, in order to improve the comparison accuracy and efficiency, the target contour Ts is divided into a first target area T1, a second target area T2, and a third target area T3. In the PIN pin, some areas are electrically abutted with the plug component. The accuracy of this part directly affects the performance of the socket, so the quality of this part is particularly important. Correspondingly, in the PIN pin, some areas do not electrically abut with the plug component and are only used to provide an elastic connection. Appropriate relaxation of the accuracy of this part will not affect the performance of the socket. At the same time, relaxing the accuracy of this part can reduce production costs and improve production efficiency. In addition, some structures are only used for transition connections. Relaxing the accuracy of this part can also reduce production costs and improve production efficiency. Therefore, T1, T2, and T3 are divided into a primary area, a secondary target area, and a tertiary area according to their priority levels.

[0104] In S113, S11 is compared with the target profile Ts, where the target matching rate of T1 is greater than the target matching rate of T2 and greater than the target matching rate of T3. If and only if the matching degrees of T1, T2 and T3 are respectively greater than the target matching rates, step S114 is performed to divide S11 into regions S01, S02 and S03 corresponding to T1, T2 and T3 respectively. T1 is a first-level region, indicating that in the projection S11, S01 is an important electrical connection part of the PIN pin component. The region of the PIN pin component corresponding to S01 is directly electrically abutted with the plug component. Therefore, the matching accuracy of T1 and S01 needs to be improved accordingly, and the target matching rate of T1 and S01 needs to be improved accordingly. 2 is a secondary area, indicating that in projection S11, S02 is the part where the PIN pin acts as an elastic connection. The area of ​​the PIN pin corresponding to S02 does not directly electrically cooperate with the plug component and is only used to provide an elastic connection. Therefore, the matching accuracy between T2 and S02 can be appropriately reduced, and the target matching rate between T2 and S02 can be correspondingly reduced. Similarly, S03 is the part where the PIN pin acts as a transition connection. The area of ​​the PIN pin corresponding to S03 only acts as a transition connection. Therefore, the matching accuracy between T3 and S03 can be appropriately reduced, and the target matching rate between T3 and S03 can be correspondingly reduced, and products with unsuccessful matching can be rejected accordingly.

[0105] In S114, similarly, S13, ..., S1n are sequentially compared with the target profile Ts;

[0106] By grading the target matching rates of T1, T2, and T3, the projections S11, S12, S13, ..., S1n can be compared with the target profile Ts in different areas, thereby enabling focused comparison of key areas. This ensures the electrical connection performance of the socket structure of the present invention while reducing production costs and improving production efficiency. Furthermore, it is convenient to separately detect the production quality of different areas on the PIN pin, thereby better monitoring the production of different processes.

[0107] In the embodiment of the present invention, step S110 further includes the following steps:

[0108] S115: Establish a right-view reference plane Y, project P11, P12, P13, ..., P1n onto the right-view reference plane Y, and store the projections as Y11, Y12, Y13, ..., Y1n respectively;

[0109] S116: Establish a target profile Ty in the right-view reference plane Y, where the target profile Ty includes a first target corner G1, a second target corner G2, and a third target corner G3, wherein G1 includes a first target height H1 and a first target curvature Q1, G2 includes a second target height H2 and a second target curvature Q2, and G3 includes a third target height H3 and a third target curvature Q3;

[0110] S117: Compare Y11 with the target profile Ty, where the target matching rate of H1 is greater than the target matching rate of Q1, the target matching rate of Q2 is greater than the target matching rate of H2, and the target matching rate of Q3 is equal to the target matching rate of H3. If and only if the matching degrees of H1, H2, H3, Q1, Q2 and Q3 are respectively greater than the target matching rates, proceed to step S118.

[0111] S118: Compare Y12 with the target profile Ys. If and only if the matching degrees of H1, H2, H3, Q1, Q2, and Q3 are respectively greater than the target matching rate, proceed to the subsequent steps, and so on, until the comparison of Y13, ..., Y1n with the target profile Ts is completed;

[0112] like Figure 4 As shown, some PIN pins have a multi-segment bending structure. Referring to the published patent with publication number CN205248484U, during the assembly process of a multi-segment PIN pin, the function and structural characteristics of each bending segment need to be considered;

[0113] In S115, a right-view reference plane Y is established, and P11, P12, P13, ..., P1n are projected onto the right-view reference plane Y and the projections are stored as Y11, Y12, Y13, ..., Y1n, respectively. By establishing the right-view reference plane Y, the three-dimensional point cloud images P11, P12, P13, ..., P1n are converted into two-dimensional plane images, thereby reducing the amount of data and improving data processing efficiency.

[0114] In S116, a target profile Ty is established in the right-view reference plane Y. The target profile Ty includes a first target corner G1, a second target corner G2, and a third target corner G3. G1 includes a first target height H1 and a first target curvature Q1, G2 includes a second target height H2 and a second target curvature Q2, and G3 includes a third target height H3 and a third target curvature Q3. Figure 4 and Figure 7 As shown, the PIN pin includes multiple bending structures, and the projection Y11 includes multiple bending structures. In the process of comparing the projection Y11 with the target profile Ys, in order to improve the comparison accuracy and efficiency, the first target corner G1, the second target corner G2, and the third target corner G3 in the target profile Ys are captured. In the PIN pin, the portion corresponding to G1 is electrically abutted against the plug, and one end of the portion corresponding to G2 is plugged into the insertion groove 55 on the shell. The portion corresponding to G2 plays the role of elastic connection, providing an elastic abutment effect for the portion corresponding to G1. The portion corresponding to G3 abuts against the shell, playing a transitional role in stabilizing the overall position of the PIN pin. Therefore, comparing G1, G2, and G3 can intuitively detect the production quality of the PIN pin.

[0115] In S117, Y11 is compared with the target profile Ty, where the target matching rate of H1 is greater than the target matching rate of Q1, the target matching rate of Q2 is greater than the target matching rate of H2, and the target matching rate of Q3 is equal to the target matching rate of H3. If and only if the matching degrees of H1, H2, H3, Q1, Q2 and Q3 are respectively greater than the target matching rates, step S118 is performed. The corners Y01, Y02 and Y03 corresponding to G1, G2 and G3 respectively are captured from Y11. The lower end surface of the PIN pin part corresponding to Y01 is directly in electrical contact with the plug part, so the height of the PIN pin part corresponding to Y01 is particularly important. The accuracy of H1 determines the PI The conductive performance of the contacts during the plug-in matching process of the N pin member and the plug member, the accuracy of H1 will directly affect the use effect of the socket of the present invention, so the target matching rate of H1 is particularly important. Correspondingly, Q1 will affect the deformation effect of the contacts during the plug-in matching process of the PIN pin member and the plug member, and the target matching rate of Q1 will affect the stability of the PIN pin member and the plug member after plug-in matching. However, in the actual production process, there will be a tolerance between the curvature of Q1 and Y01 and there will be a slight discrepancy in the matching rate of Q1, which will not have a significant impact on the use effect of the PIN pin member. However, the height of H1 will greatly affect the electrical contact effect of the PIN pin member. The target matching rate of H1 is greater than that of Q1. The target matching rate is beneficial to the key control of important parameters in the production process of PIN needle parts, reducing costs and increasing efficiency while ensuring the quality of the products of the present invention. Similarly, the part of the PIN needle part corresponding to Y02 provides elastic abutment effect support for the contacts of the PIN needle part, and a plug-in slot 55 is provided on the shell. One end of the part of the PIN needle part corresponding to Y02 is plugged into the plug-in slot 55. The curvature of Y02 directly affects the elasticity of Y01, and the height of Y02 has little effect on Y01. The target matching rate of Q2 is greater than the target matching rate of H2, so that the important production parameters of Y02 can be better monitored, and the restrictions on other production parameters are correspondingly relaxed, which is beneficial to reducing Production cost. Under certain production conditions, when some PIN needles reach the target matching rate relative to H1 and Q2 but the matching rate of Q1 and H2 is lower than that of H1 and Q2, these PIN needles can still be put into use without reducing product quality. The number of PIN needles in the production process is huge. While ensuring production quality, relaxing the inspection standards is conducive to saving costs and increasing efficiency. Similarly, the part of the PIN needle corresponding to Y03 abuts against the shell, which stabilizes the overall position of the PIN needle. Therefore, the target matching rate of Q3 = the target matching rate of H3. Correspondingly, the matching degree of Q3 and H3 is reduced, which is further conducive to reducing costs and increasing efficiency.

[0116] In the embodiment of the present invention, step S120 includes the following steps:

[0117] S121: Project P11', P12', P13', ..., P1n' onto the right-view reference plane Y and store the projections as Y11', Y12', Y13', ..., S1n' respectively;

[0118] S122: Establish a vertical reference line Ly in the right-view reference plane Y, obtain the coordinates of the upper, middle, and lower points of Ly, and store them as Lu, Lm, and Ld, respectively, where Lu includes (Xu, Yu), Lm includes (Xm, Ym), and Ld includes (Xd, Yd).

[0119] S123: Compare Y11′ with the vertical reference line Ly, where if and only if the tolerance between Ld and the target reference point is within the target range and the difference between Xu, Xm and Xd is within the target tolerance range, proceed to step S114.

[0120] S124: Compare Y12' with the vertical reference line Ly, and so on, until the comparison of Y13', ..., Y1n' with the vertical reference line Ly is completed;

[0121] like Figure 8 As shown, the upper end of the first rear PIN needle is electrically connected to the first front PIN needle, and the lower end of the first rear PIN needle is connected to the PCBA board. The main production parameters of the first rear PIN needle include two parts. The first part includes the vertical straightness of the first rear PIN needle, such as Figure 6 As shown, the first rear PIN needle component is inserted and fixed in the housing. The straightness of the first rear PIN needle component affects the difficulty of the installation process and the stability after installation. The second part includes the coordinate position of Ld (Xd, Yd). Because Ld (Xd, Yd) needs to be soldered to the predetermined solder point on the PCBA board, the coordinate of Ld (Xd, Yd) affects the soldering effect of the first rear PIN needle component and directly affects the electrical connection effect of the socket of the present invention.

[0122] Compare Y11' with the vertical reference line Ly. If and only if the tolerance between Ld and the target reference point is within the target range, and the difference between Xu, Xm, and Xd is within the target tolerance range, proceed to step S114. Because Ld (Xd, Yd) needs to be soldered to a predetermined solder joint on the PCBA board, the coordinates of (Xd, Yd) must be within the target tolerance range with the target reference point for the first rear-end PIN component to function. Therefore, a straightness comparison must be performed while ensuring that the tolerance between Ld and the target reference point is within the target range. Xu, Xm, and Xd are the horizontal coordinates of the top, middle, and bottom points on Y11', respectively. Therefore, by comparing the difference between Xu, Xm, and Xd, the straightness of Y11' can be intuitively determined. This process is repeated until Y13', ..., Y1n', are compared with the vertical reference line Ly, completing the appearance inspection of all first rear-end PIN components.

[0123] like Figure 2 As shown, during the production process of the first rear end PIN needle component, the first rear end PIN needle component is formed by stamping from front to back. During the stamping process, the first rear end PIN needle component is prone to bending and deformation in the front-to-back direction, but not prone to bending and deformation in the left-to-right direction. Therefore, by projecting on the right-view reference plane Y, the quality of the first rear end PIN needle component can be targetedly inspected, and the inspection effect is more accurate. At the same time, other unnecessary steps can be reduced, thereby improving work efficiency.

[0124] In the embodiment of the present invention, step S130 includes the following steps:

[0125] S131: Obtain points O1, O2, ..., On on the first front PIN needle from front to back, where points O1, O2, ..., On are endpoints of a straight line portion on the first front PIN needle;

[0126] S132: After the bending process m is completed, the resistance values ​​of the front and rear ends of the m-th bending section are measured;

[0127] like Figure 9 As shown, in the prior art, the first front PIN pin is provided with a multi-section bent structure. Therefore, in order to perform a more refined test on each section, points O1, O2, ..., On are sequentially obtained from the front to the back of the first front PIN pin. Then, the resistance values ​​from O1 to O2, O1 to O3, ..., and O1 to On are measured respectively. O1 to O2 is the first straight line segment on the first front PIN pin, and O1 to O3 is the first straight line segment and the first bend on the first front PIN pin. And so on. Thus, the test of the first front PIN pin is converted into a progressive segmented test.

[0128] In actual production, the bends on the first front PIN pin component require multiple passes of stamping with different dies or multiple sections of stamping with a continuous die. In one embodiment, the first bend on the first front PIN pin component from back to front is the first bend, and the second bend from back to front is the second bend. The order for measuring the resistance of the first front PIN pin component is as follows: after completing the first bend, the resistance values ​​of O1 to O9 and O1 to O8 are measured (the resistance value of O1-On is R11 / R12 / ... / R1n), thereby measuring the resistance of the first bend and the first straight segment. After completing the second bend, the resistance values ​​of O1 to O7 and O1 to O6 are measured, thereby measuring the resistance of the second bend and the second straight segment. This sequence is repeated to complete all bending and measurement operations.

[0129] Through segmented inspection, defective PIN needles can be discovered and removed in time, especially in the processing of high-value PIN needles. Defective PIN needles can be removed in time so that they do not participate in subsequent processing operations, which can save processing stations, improve processing efficiency and save processing costs.

[0130] In the embodiment of the present invention, step S140 includes the following steps:

[0131] S141: Obtain points O1', O2', ..., On' from top to bottom on the first rear PIN needle component, where points O1', O2', ..., On' are end points of portions of different diameters on the first rear PIN needle component;

[0132] S142: After the punching process of the first rear PIN pin is completed, the resistance values ​​of points O1' to O2', O2' to O3', ..., On-1 to On' of the first rear PIN pin are measured;

[0133] like Figure 2 As shown, the upper half of the first rear PIN pin component needs to be plugged into the socket housing, and the lower half of the first rear PIN pin component needs to be soldered to the PCBA board. Therefore, the upper half of the first rear PIN pin component generally has a larger diameter to facilitate stable plugging and force reception with the housing, while the lower half of the first rear PIN pin component has a smaller diameter to facilitate soldering to the solder joints on the PCBA board. Therefore, the first rear PIN pin component includes multiple segments with different diameters.

[0134] After the punching process of the first rear-end PIN needle component is completed, the resistance values ​​of the first rear-end PIN needle component points O1', O2', ..., On' are measured, so that the resistance values ​​of different segments can be finely compared, so that the processing quality of the first rear-end PIN needle component can be better detected, which facilitates fine quality control. In one embodiment, when the resistance value of O2' to O3' is compared with the target value and an abnormality is found, the stamping die head of this part can be replaced in time, or the probe structure of this part can be inspected, so as to carry out targeted quality monitoring.

[0135] In the embodiment of the present invention, step S150 includes the following steps:

[0136] S151: in the first PIN pin assembly of the previous socket component, taking an average resistance value of the first PIN pin components that meet the target qualification rate;

[0137] S152: in the first PIN pin assembly of the next socket component, taking an average resistance value of the first PIN pin components that meet the target qualification rate;

[0138] S152: Compare the two average values, obtain the difference between them and store it, and so on until all socket components are completed;

[0139] S153: assemble the above differences into an array;

[0140] During the actual assembly line processing, product quality will fluctuate. By organizing the above differences into an array, we can intuitively understand the fluctuation of product quality as production time progresses, which is conducive to operators to better understand the production rules of the products and better carry out production and maintenance planning.

[0141] In the embodiment of the present invention, the socket body further includes a shell member 1, in which the first plug interface and the second plug interface are installed. The shell member includes a first mounting groove 4 provided at the corner of the front end face and the lower end face and a second mounting groove 5 communicating with the front end face and the lower end face. The second mounting groove includes a transverse mounting groove 6 and a longitudinal mounting groove 7 communicating with each other. The first plug interface is installed in the first mounting groove 4, and the second plug interface is installed in the second mounting groove 5.

[0142] like Figure 6As shown, the first PIN needle assembly and the first tongue piece are installed in the first plug interface 2, and the second PIN needle piece and the second tongue piece are installed in the second plug interface 3. In the process of assembling the first plug interface and the second plug interface, in order to facilitate plugging, the first plug interface and the second plug interface need to be arranged on the front end face of the outer shell. In order to solder the socket body on the PCBA board, the PIN needle pieces in the first plug interface and the second plug interface need to be extended to the lower end face of the outer shell, so the arrangement of the first plug interface and the second plug interface needs to be arranged. By setting the first mounting groove and the second mounting groove, the assembly of the socket of the present invention is more convenient. In one embodiment, the upper end face and the rear end face of the outer shell are provided with a cover plate to facilitate the installation of the second plug interface in the second mounting groove.

[0143] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A method for preparing a multifunctional network socket connector, characterized in that: The socket body comprises a first plug interface and a second plug interface. A first tongue is provided in the first plug interface, a first front PIN needle assembly is fixedly provided on the first tongue, a first rear PIN needle assembly is fixedly provided at the rear end of the first tongue and is electrically connected to the first front PIN needle assembly, the first front PIN needle assembly includes a plurality of first front PIN needle members arranged in parallel, and the first rear PIN needle assembly includes a plurality of first rear PIN needle members arranged in parallel; A second tongue is provided in the second plug interface, a second front PIN needle assembly is fixedly provided on the second tongue, a second rear PIN needle assembly is fixedly provided at the rear end of the second tongue and is electrically connected to the second front PIN needle assembly, the second front PIN needle assembly includes a plurality of second front PIN needle members arranged in parallel, and the second rear PIN needle assembly includes a plurality of second rear PIN needle members arranged in parallel; The preparation process of the first plug interface and the second plug interface includes the following steps: S110: Sequentially obtain a 3D point cloud image of each first front-end PIN needle component in the first front-end PIN needle assembly and store them as P11, P12, P13, ..., P1n, respectively; obtain diameter values ​​of P11, P12, P13, ..., P1n and store them as D11, D12, D13, ..., D1n, respectively; compare D11, D12, D13, ..., D1n with target values, and proceed to step S120 only if the matching rate reaches the target qualified rate; S120: sequentially obtaining a three-dimensional point cloud image of each first rear-end PIN needle component in the first rear-end PIN needle assembly and storing them as P11', P12', P13', ..., P1n', respectively; obtaining diameter values ​​of P11', P12', P13', ..., P1n' and storing them as D11', D12', D13', ..., D1n', respectively; comparing D11', D12', D13', ..., D1n' with target values, and proceeding to step S130 if and only if the matching rate reaches the target qualified rate; S130: Obtain the resistance value of each first front-end PIN pin in the first front-end PIN pin assembly in sequence and store them as R11, R12, R13, ..., R1n, respectively. Compare R11, R12, R13, ..., R1n with the target values, respectively. If and only if the matching rate reaches the target qualified rate, proceed to step S140; S140: Obtain the resistance value of each first rear-end PIN pin in the first rear-end PIN pin assembly in sequence and store them as R11', R12', R13', ..., R1n', respectively. Compare R11', R12', R13', ..., R1n' with the target values, respectively. If and only if the matching rate reaches the target qualified rate, proceed to step S150; S150: Sequentially obtaining the overall resistance value of each electrically connected first front-end PIN pin component and first back-end PIN pin component in the first front-end PIN pin assembly and the first back-end PIN pin assembly, and storing them as R01, R02, R03, ..., R0n, respectively. R01, R02, R03, ..., R0n are respectively compared with target values. If and only if the matching rate reaches the target pass rate, proceeding to step S210; S210: Sequentially obtain a 3D point cloud image of each second front-end PIN needle component in the second front-end PIN needle assembly and store them as P21, P22, P23, ..., P2n, respectively; obtain diameter values ​​of P21, P22, P23, ..., P2n and store them as D21, D22, D23, ..., D2n, respectively; compare D21, D22, D23, ..., D2n with target values, and proceed to step S220 only if the matching rate reaches the target qualified rate; S220: Sequentially obtain a three-dimensional point cloud image of each second rear-end PIN needle component in the second rear-end PIN needle assembly and store them as P21', P22', P23', ..., P2n', respectively; obtain diameter values ​​of P21', P22', P23', ..., P2n' and store them as D21', D22', D23', ..., D2n', respectively; compare D21', D22', D23', ..., D2n' with target values, and proceed to step S230 only if the matching rate reaches the target qualified rate; S230: Obtain the resistance value of each first front-end PIN pin in the first front-end PIN pin assembly in sequence and store them as R21, R22, R23, ..., R2n, respectively. Compare R21, R22, R23, ..., R2n with the target values, respectively. If and only if the matching rate reaches the target qualified rate, proceed to step S240; S240: Obtain the resistance value of each first rear-end PIN pin in the first rear-end PIN pin assembly in sequence and store them as R21', R22', R23', ..., R2n', respectively. Compare R21', R22', R23', ..., R2n' with the target values, respectively. If and only if the matching rate reaches the target qualified rate, proceed to step S250; S250: Obtain the overall resistance value of each electrically connected second front-end PIN needle component and second rear-end PIN needle component in the second front-end PIN needle assembly and the second rear-end PIN needle assembly in sequence, and store them as R001, R002, R003, ..., R00n, respectively, and compare R001, R002, R003, ..., R00n with the target values ​​respectively. If and only if the matching rate reaches the target qualified rate, proceed to the subsequent production steps.

2. The method for preparing a multifunctional network socket connector according to claim 1, characterized in that: Step S110 includes the following steps: S111: Establish an upper reference plane S, project P11, P12, P13, ..., P1n onto the upper reference plane S, and store the projections as S11, S12, S13, ..., S1n respectively; S112: Establishing a target outline Ts in the upward reference plane S, where the target outline Ts includes a first target area T1, a second target area T2, and a third target area T3, where the levels of T1, T2, and T3 are first-level, second-level, and third-level areas, respectively; S113: Compare S11 with the target profile Ts, where the target matching rate of T1 > the target matching rate of T2 > the target matching rate of T3. If and only if the matching rates of T1, T2 and T3 are respectively greater than the target matching rates, proceed to step S114; S114: Compare S12 with the target profile Ts, where the target matching rate of T1 > the target matching rate of T2 > the target matching rate of T3. If and only if the matching degrees of T1, T2 and T3 are respectively greater than the target matching rates, proceed to the subsequent steps, and so on, until the comparison of S13, ..., S1n with the target profile Ts is completed.

3. The method for preparing a multifunctional network socket connector according to claim 2, characterized in that: Step S110 also includes the following steps: S115: Establish a right-view reference plane Y, project P11, P12, P13, ..., P1n onto the right-view reference plane Y, and store the projections as Y11, Y12, Y13, ..., Y1n respectively; S116: Establish a target profile Ty in the right-view reference plane Y, where the target profile Ty includes a first target corner G1, a second target corner G2, and a third target corner G3, wherein G1 includes a first target height H1 and a first target curvature Q1, G2 includes a second target height H2 and a second target curvature Q2, and G3 includes a third target height H3 and a third target curvature Q3; S117: Compare Y11 with the target profile Ty, where the target matching rate of H1 is greater than the target matching rate of Q1, the target matching rate of Q2 is greater than the target matching rate of H2, and the target matching rate of Q3 is equal to the target matching rate of H3. If and only if the matching degrees of H1, H2, H3, Q1, Q2, and Q3 are greater than the target matching rates respectively, proceed to step S118; S118: Compare Y12 with the target profile Ys. If and only if the matching degrees of H1, H2, H3, Q1, Q2 and Q3 are respectively greater than the target matching rate, proceed to the subsequent steps, and so on, until the comparison of Y13, ..., Y1n with the target profile Ts is completed.

4. The method for preparing a multifunctional network socket connector according to claim 1, characterized in that: Step S120 includes the following steps: S121: Project P11', P12', P13', ..., P1n' onto the right-view reference plane Y and store the projections as Y11', Y12', Y13', ..., S1n' respectively; S122: Establish a vertical reference line Ly in the right-view reference plane Y, obtain the coordinates of the upper, middle, and lower points of Ly, and store them as Lu, Lm, and Ld, respectively, where Lu includes (Xu, Yu), Lm includes (Xm, Ym), and Ld includes (Xd, Yd). S123: Compare Y11′ with the vertical reference line Ly, wherein if and only if the tolerance between Ld and the target reference point is within the target range, and the difference between Xu, Xm, and Xd is within the target tolerance range, proceed to step S114; S124: Compare Y12' with the vertical reference line Ly, and so on, until the comparison of Y13', ..., Y1n' with the vertical reference line Ly is completed.

5. The method for preparing a multifunctional network socket connector according to claim 1, characterized in that: Step S130 includes the following steps: S131: Obtain points O1, O2, ..., On on the first front PIN needle from front to back, where points O1, O2, ..., On are endpoints of a straight line portion on the first front PIN needle; S132: After the bending process m is completed, the resistance values ​​of the front and rear ends of the m-th bending section are measured.

6. The method for preparing a multifunctional network socket connector according to claim 1, characterized in that: Step S140 includes the following steps: S141: Obtain points O1', O2', ..., On' from top to bottom on the first rear PIN needle component, where points O1', O2', ..., On' are end points of portions of different diameters on the first rear PIN needle component; S142: After the punching process of the first rear-end PIN pin is completed, the resistance values ​​of points O1' to O2', O2' to O3', ..., On-1 to On' of the first rear-end PIN pin are measured.

7. The method for preparing a multifunctional network socket connector according to claim 1, characterized in that: Step S150 includes the following steps: S151: in the first PIN pin assembly of the previous socket component, taking an average resistance value of the first PIN pin components that meet the target qualification rate; S152: in the first PIN pin assembly of the next socket component, taking an average resistance value of the first PIN pin components that meet the target qualification rate; S152: Compare the two average values, obtain the difference between them and store it, and so on until all the socket components are completed; S153: Organize the above differences into an array.

8. A method for preparing a multifunctional network socket connector according to any one of claims 1 to 7, characterized in that: The socket body also includes a shell member, in which a first plug interface and a second plug interface are installed. The shell member includes a first mounting groove provided at the corner of the front end face and the lower end face and a second mounting groove connecting the front end face and the lower end face. The second mounting groove includes a transverse mounting groove and a longitudinal mounting groove connected to each other. The first plug interface is installed in the first mounting groove, and the second plug interface is installed in the second mounting groove.

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