Shielding cover, manufacturing method thereof and electronic device

Abstract

The application discloses a shielding cover and a manufacturing method thereof and an electronic device, and belongs to the technical field of electronics. The shielding cover comprises a shielding cover body, at least one side edge of the shielding cover body is cut to form an exposed area, and a state of the exposed area comprises at least one of a first state and a second state. In the first state, the exposed area is continuous along the length direction of the corresponding side edge, and in the thickness direction of the shielding cover body, the size of the exposed area is smaller than the thickness of the shielding cover body. In the second state, the exposed area is discontinuous along the length direction of the corresponding side edge. A plating layer covers the area of the shielding cover body except the exposed area.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronics, and particularly relates to a shielding cover, a manufacturing method thereof, and an electronic device. BACKGROUND

[0002] Electronic devices usually adopt metal shielding covers to meet the electromagnetic shielding requirements between different built-in modules, and currently, shielding covers are usually made of aluminum alloy materials with low density. The manufacturing process flow is as follows: flattening and feeding of aluminum alloy raw materials - surface nickel plating treatment - stamping and stretching forming - punching and segmentation. In the nickel plating process, the whole aluminum alloy needs to be connected. The current method is to electroplate the whole piece of raw material together.

[0003] However, the metal nickel layer at the cutting part will be damaged during punching and segmentation, the internal aluminum alloy material will leak out and form dense aluminum oxide, which further hinders the soldering on the printed circuit board (PCB), and the solder cannot weld the aluminum oxide and the solder pad together. Therefore, the aluminum alloy shielding cover can only be welded together with the solder pad on the inside, which makes the welding effect poor and prone to false welding problems, thereby causing the shielding cover to fall off. SUMMARY

[0004] The purpose of the embodiments of the present application is to provide a shielding cover, a manufacturing method thereof, and an electronic device, which can solve the problem that the metal nickel layer at the cutting part of the existing shielding cover easily leads to poor welding effect with the solder pad, is prone to false welding problems, and further causes the shielding cover to fall off.

[0005] In a first aspect, the embodiments of the present application provide a shielding cover, comprising:

[0006] A shielding cover body, at least one side edge of the shielding cover body is cut to form an exposed area, the state of the exposed area includes at least one of a first state and a second state, wherein in the first state, the exposed area is continuous along the length direction of the corresponding side edge, and in the thickness direction of the shielding cover body, the size of the exposed area is smaller than the thickness of the shielding cover body; in the second state, the exposed area is discontinuous along the length direction of the corresponding side edge;

[0007] An electroplated layer covering the area of the shielding cover body except the exposed area.

[0008] In a second aspect, the embodiments of the present application provide a shielding cover manufacturing method, comprising:

[0009] cutting the whole piece of metal material according to a pre-designed cutting position to cut the whole piece of metal material into multiple connected metal blocks, the thickness of the metal at the connection position between adjacent metal blocks being less than the thickness of the metal blocks, and / or there being a hollow area at the connection position between adjacent metal blocks;

[0010] electroplating the surface layer of the cut whole piece of metal material;

[0011] stamping and forming the electroplated whole piece of metal material, and cutting from the connection position between adjacent metal blocks to obtain a shielding cover.

[0012] In a third aspect, an electronic device is provided, which includes the shielding cover according to the first aspect, and the shielding cover is connected to a pad on a circuit board of the electronic device through soldering.

[0013] In the embodiments of the present application, the shielding cover includes: a shielding cover body, at least one side edge of the shielding cover body being formed into an exposed area through cutting, the state of the exposed area including at least one of a first state and a second state, wherein in the first state, the exposed area is continuous along the length direction of the corresponding side edge, and in the thickness direction of the shielding cover body, the size of the exposed area is less than the thickness of the shielding cover body; in the second state, the exposed area is discontinuous along the length direction of the corresponding side edge; and an electroplated layer covering the area of the shielding cover body other than the exposed area.

[0014] The method for manufacturing the shielding cover includes: cutting a whole piece of metal material according to a pre-designed cutting position to cut the whole piece of metal material into multiple connected metal blocks, the thickness of the metal at the connection position between adjacent metal blocks being less than the thickness of the metal blocks, and / or there being a hollow area at the connection position between adjacent metal blocks; electroplating the surface layer of the cut whole piece of metal material; stamping and forming the electroplated whole piece of metal material, and cutting from the connection position between adjacent metal blocks to obtain a shielding cover.

[0015] In this way, since the shielding cover is manufactured by cutting in a specific manner first and then electroplating, the exposed area of the side edge of the shielding cover is reduced in the thickness direction or in the length direction compared with the prior art, thereby reducing the proportion of the exposed area of the shielding cover in the whole shielding cover after the shielding cover is cut and formed, and further improving the soldering strength and reliability of the soldering and the shielding cover. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a process flow chart of a single existing aluminum alloy shielding cover;

[0017] Figure 2 is a cross-sectional structure diagram of an existing white copper shielding cover;

[0018] Figure 3 is a process diagram of existing nickel plating on the surface of an aluminum alloy material;

[0019] Figure 4 is a cross-sectional structure diagram of existing aluminum alloy shield cover manufacturing and application;

[0020] Figure 5 is a schematic diagram of an aluminum alloy incoming V-Cut panel and manufacturing provided by an embodiment of the present application;

[0021] Figure 6 is a single cross-sectional view of a V-Cut panel shield cover after forming and cutting provided by an embodiment of the present application;

[0022] Figure 7 is a schematic diagram of an aluminum alloy incoming module bridge panel and manufacturing provided by an embodiment of the present application;

[0023] Figure 8 is a single top view of a bridge panel shield cover after forming and cutting provided by an embodiment of the present application;

[0024] Figure 9 is a flowchart of a shield cover manufacturing method provided by an embodiment of the present application;

[0025] Figure 10 is a schematic diagram of a connection structure of a shield cover and a circuit board in an electronic device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present application.

[0027] The terms “first”, “second”, and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than that illustrated or described herein, and the objects distinguished by “first”, “second”, and the like are generally of a kind and are not limited in number, for example, the first object can be one or more. In addition, “and / or” in the specification and claims means at least one of the connected objects, and the character “ / ” generally represents an “or” relationship between the front and rear associated objects.

[0028] To make the embodiments of the present application clearer, the related technical knowledge involved in the present application will be introduced as follows:

[0029] With the continuous development of information society and the improvement of user demand, the functions of electronic devices such as mobile phones are becoming more and more, in order to provide more and more functions for mobile phones, the number and volume weight of sensors, cameras and other components are also increasing, in order to improve the user experience, the overall lightening and thinning of mobile phones and other electronic devices has become a future development trend. At the same time, since the mobile phone simultaneously carries the functions of electronic high-frequency wireless communication and high-speed signal processing, the electromagnetic shielding requirement between different modules will always exist and will be higher and higher. Among them, the metal shielding cover is the most widely used way, and the most commonly used metal shielding cover material is white copper. For example Figure 2 is a structural schematic diagram of a conventional white copper material shielding cover 104, which is firmly welded on the solder pad 105 of the circuit board 102 through the inner and outer two sides of the solder 101 and 103. The material density of white copper is relatively large, so the weight of the corresponding shielding cover will be relatively heavy. Therefore, a metal material capable of replacing white copper is needed, among which aluminum alloy is the most suitable material that can meet the electromagnetic shielding performance and reduce the weight of the shielding cover.

[0030] Compared with the white copper material shielding cover, the density of the aluminum alloy shielding cover is lower, so the same size specification shielding cover using aluminum alloy material can be made lighter. The manufacturing process flow of the aluminum alloy shielding cover single body is as shown in Figure 1 However, the current technology has the following defects:

[0031] 1) The aluminum alloy material shielding cover has a false welding problem, because compared with white copper material, the solder wetting property of aluminum alloy material is poor, which causes the solder to not adhere well on the aluminum alloy material. Therefore, as shown in Figure 3 Before the shielding cover forming in step S204, for the aluminum alloy material 301, a layer of metal nickel material 302 (nickel has better solder wetting property) is electroplated on the surface of the raw material in step S202 to solve this problem. In this nickel plating process, the whole aluminum alloy needs to be connected, and the current practice is to electroplate the whole piece of raw material together.

[0032] 2) The stamping process used for shielding cover forming will damage the metal nickel layer 402 originally plated on the aluminum alloy shielding cover after the punching and cutting in step S205, leak the internal aluminum alloy material, and form dense aluminum oxide, which will further hinder the ordinary solder from being welded on the printed circuit board (PCB) 405. As shown in Figure 4After the shielding cover 401 in the aluminum alloy shielding cover is cut, the aluminum alloy shielding cover cutting surface has aluminum oxide 403. The solder cannot weld the aluminum oxide and the solder pad together, so the aluminum alloy shielding cover can only be welded to the solder pad through the inside solder 404. Without the outside solder, the welding effect is worse than that of the white copper shielding cover with solder on both sides (as shown in the shielding cover after welding in the prior art). Figure 2

[0033] To solve the above problems, the embodiment of the present application optimizes the design of the aluminum alloy material splicing plate and the corresponding processing and manufacturing. On the basis of maintaining the original general manufacturing process, the generation area of the nickel plating layer damaged and aluminum oxide due to the cutting of the aluminum alloy shielding cover can be reduced, thereby improving the overall welding reliability of the aluminum alloy shielding cover.

[0034] The shielding cover and the manufacturing method thereof provided by the embodiment of the present application will be described in detail below in combination with the drawings, specific embodiments and application scenarios.

[0035] Please refer to Figure 6 and Figure 8 , Figure 6 and Figure 8 The structure diagram of the shielding cover provided by the embodiment of the present application is shown in Figure 6 and Figure 8 The shielding cover includes:

[0036] The shielding cover body 601, at least one side of the shielding cover body 601 is cut to form an exposed area 602, the state of the exposed area 602 includes at least one of a first state and a second state, wherein in the first state, the exposed area 602 is continuous along the length direction of the corresponding side, and in the thickness direction of the shielding cover body 601, the size of the exposed area 602 is smaller than the thickness of the shielding cover body 601; in the second state, the exposed area 602 is discontinuous along the length direction of the corresponding side.

[0037] The electroplated layer 603 covers the area of the shielding cover body 601 except the exposed area 602.

[0038] In the embodiment of the present application, the shielding cover body 601 is made of a metal material, as shown in Figure 6 and Figure 8 At least one side of the shielding cover body 601 has an exposed area 602, and the surface layer of the shielding cover body 601 except the exposed area 602 is covered with an electroplated layer 603, that is, the exposed area 602 is the area not covered with the electroplated layer 603, and the metal material of the shielding cover body 601 is exposed in this area. When the shielding cover body 601 is made of an aluminum alloy material, the exposed area 602 will form aluminum oxide. ​

[0039] The exposed area 602 of the shielding cover body 601 is formed by a certain cutting process of the whole piece of metal material covered with electroplating layer 603, and the state of the exposed area 602 is different depending on the cutting process and cutting method.

[0040] In one case, such as Figure 6 As shown, the exposed area 602 includes a first state in which the exposed area 602 on the side of the shielding cover body 601 is continuous along the length direction of the corresponding side, and in the thickness direction of the shielding cover body 601, the size of the exposed area 602 is smaller than the thickness of the shielding cover body 601, such as... Figure 6 As shown in the cross-sectional view, the exposed area 602 exists only in the middle part of the corresponding side, and the height of the exposed area 602 is less than the height of the side. Thus, compared to... Figure 4 As shown in the shielding cover, the thickness of the aluminum oxide region of the shielding cover in this embodiment of the application is significantly reduced, thereby greatly improving the welding strength and reliability between the solder and the shielding cover.

[0041] In another case, such as Figure 8 As shown, the exposed area 602 includes a second state, in which the exposed area 602 on the side of the shielding cover body 601 is discontinuous along the length of the corresponding side, that is, it includes multiple small, spaced exposed areas, such as... Figure 8 As shown in the top view, each side has multiple small exposed areas, and the total length of the exposed area 602 on one side is less than the length of that side. Thus, compared to... Figure 4 As shown in the shielding cover, the length of the region where the aluminum oxide is formed in the shielding cover in this embodiment of the application is greatly reduced, thereby significantly improving the welding strength and reliability between the solder and the shielding cover.

[0042] In another scenario, the exposed area 602 can simultaneously include both the first and second states. Specifically, the exposed area 602 on the side of the shielding cover body 601 is discontinuous along the length of the corresponding side, meaning the side comprises multiple small exposed areas. Furthermore, in the thickness direction of the shielding cover body 601, the size of each exposed area 602 is smaller than the thickness of the shielding cover body 601. Thus, compared to... Figure 4 As shown in the shielding cover, the area of ​​the region where aluminum oxide is formed in the shielding cover in this embodiment of the application is greatly reduced, thereby significantly improving the welding strength and reliability between the solder and the shielding cover.

[0043] Optionally, at least one side of the shielding cover body 601 is formed by a fixed-depth cutting process to have a cutting edge with a thickness less than that of the shielding cover body 601, and the cutting edge is cut to form the exposed area 602 in the first state.

[0044] In one embodiment, the exposed area 602 on the side of the shielding cover body 601 can be formed by a fixed-depth cutting process, and the thickness of the exposed area 602 after cutting is less than the thickness of the shielding cover body 601.

[0045] In specific implementation, such as Figure 5 As shown, a single sheet of metal material can be cut according to the actual dimensions of the shielding cover module. The connection area between modules is designed as a V-Cut, meaning the V-Cut cutting positions are pre-designed on the entire sheet of metal material. Then, a metal fixed-depth cutting process is used to cut the cutting positions at a fixed depth, that is, a certain thickness of metal is cut from both the top and bottom of the cutting positions on the entire sheet of metal material. After cutting, it forms a shape like... Figure 5 The V-Cut groove shown in the mid-section view is the cut edge 503 formed by the cutting. After cutting, the thickness of the connection area between the shielding cover modules is less than the thickness of the shielding cover module. After completing the V-Cut fabrication of the panel, the desired result is obtained. Figure 5 The cross-sectional view shows a partially stepped metal material 501. Based on this, a common electroplating process, such as nickel plating, is applied to plate a layer of nickel metal 502 onto the surface of the metal material 501, including the stepped area of ​​the V-Cut. Finally, the nickel-plated metal material is shaped and cut into individual shielding cover units. Specifically, it is cut from the V-Cut, i.e., the connection point of each shielding cover module, to obtain the improved shielding cover unit. Cutting from the cutting edge 503 results in a shape resembling... Figure 6 The exposed area 602 shown without electroplating is adopted. Figure 5 The thickness of the exposed area 602 of the shielding cover body 601 formed by the process shown is greatly reduced, which can significantly improve the welding strength and reliability of the solder and the shielding cover.

[0046] Optionally, at least one side of the shielding cover body 601 is formed by a milling process to have intermittent cut bridges, which are cut to form the exposed area 602 in the second state.

[0047] In one embodiment, the exposed area 602 on the side of the shielding cover body 601 can be formed by milling. After cutting, the side of the shielding cover body 601 forms multiple small exposed areas, and the length of the exposed area 602 on one side is less than the length of the side.

[0048] In specific implementation, such as Figure 7 As shown, a single sheet of metal material can be cut according to the actual dimensions of the shielding cover module. The connection areas between modules are designed as bridges, while the non-bridged areas are hollowed out. Specifically, milling can be used to achieve the bridging structure between modules. After completing the bridging fabrication of the panels, the desired result is... Figure 7The metal material 701 shown in the middle top view is partially hollowed out, and the bridge structure between the cut modules is the cut bridge 704. On this basis, a general electroplating process, such as a nickel plating process, can be applied to electroplate a layer of nickel metal 702 on the surface layer of the metal material, including the partially hollowed-out area. Finally, after forming and cutting the shielding cover monomer of the metal material that has completed the nickel plating process, the improved shielding cover monomer can be obtained. After cutting from the cut bridge 704, the exposed area 602 without an electroplated layer is formed as shown in Figure 8 The length-width area of the exposed area 602 of the shielding cover body 601 formed by the process shown in Figure 7 is greatly reduced, thereby greatly improving the soldering strength and reliability of the soldering and the shielding cover.

[0049] Optionally, in the second state, the size of the exposed area 602 in the thickness direction of the shielding cover body 601 is less than or equal to the thickness of the shielding cover body 601.

[0050] In some embodiments, the exposed area 602 of the side edge of the shielding cover body 601 is discontinuous along the length direction of the corresponding side edge, and the size of the exposed area 602 in the thickness direction of the shielding cover body 601 is less than or equal to the thickness of the shielding cover body 601. Specifically, the shielding cover shown in Figure 7 can be formed by the manufacturing process shown in Figure 8 , that is, the exposed area 602 of the side edge of the shielding cover body 601 is discontinuous along the length direction of the corresponding side edge, and the size of the exposed area 602 in the thickness direction of the shielding cover body 601 is equal to the thickness of the shielding cover body 601.

[0051] In some embodiments, the depth-cutting process shown in Figure 5 can also be used to depth-cut the whole piece of metal material, so that the thickness of the metal at the cutting position is less than the thickness of the shielding cover body 601, and the milling process shown in Figure 7 is further used to cut off part of the area at the cutting position to form a bridging structure. Finally, after electroplating and cutting processes, the shielding cover body 601 with the exposed area 602 in the second state is formed, and the size of the exposed area 602 in the thickness direction of the shielding cover body 601 is less than the thickness of the shielding cover body 601.

[0052] In this way, by combining the cutting processes shown in Figure 5 and Figure 7 , the effect of a metal material with both bridging and V-Cut splicing can be achieved, so that there is a nickel plating layer on the surface of the bridging step in the hollowed-out area, thereby further reducing the proportion of the exposed area of the shielding cover formed after forming and cutting in the whole shielding cover monomer, and improving the bonding area and soldering reliability of the soldering and the shielding cover body.

[0053] Optionally, the shielding cover body 601 is made of aluminum metal, and the electroplated layer 603 includes a nickel metal layer.

[0054] In some embodiments, the shielding cover body 601 can be made of aluminum metal. The aluminum alloy shielding cover has a lower density, so that the shielding cover made of aluminum alloy material can have a lighter weight with the same size specification. In addition, due to the poor solder wettability of the aluminum alloy material, the solder cannot be well attached to the aluminum alloy material, so that in order to improve the solder wettability, a layer of nickel metal material can be electroplated on the surface layer of the shielding cover body 601 of the aluminum alloy material to form a nickel metal layer. In this way, the shielding cover can not only have a lighter weight, but also have better solder wettability, so as to ensure that the shielding cover is easier to connect with the solder.

[0055] Optionally, as shown in Figure 10 , the edge block area of the shielding cover body 601 is connected to the solder pad 200 on the circuit board 100 through the solder 300, and the edge block area is an area within a preset range of the exposed area 602.

[0056] As shown in Figure 10 , the edge block area at both ends of the shielding cover body 601 can be welded to the solder pad 200 on the circuit board 100 of the electronic device through the solder 300. Since the edge block area only has a small part of the exposed area 602, the shielding cover can be connected to the solder pad 200 through the solder 300 of the outer nickel-plated part in addition to being welded to the solder pad 200 through the inner solder 300, that is, the soldering strength and reliability of the solder and the shielding cover can be improved.

[0057] The shielding cover in the embodiments of the present application includes: a shielding cover body, at least one side edge of the shielding cover body is cut to form an exposed area, a state of the exposed area includes at least one of a first state and a second state, wherein in the first state, the exposed area is continuous along the length direction of the corresponding side edge, and in the thickness direction of the shielding cover body, the size of the exposed area is smaller than the thickness of the shielding cover body; in the second state, the exposed area is discontinuous along the length direction of the corresponding side edge; an electroplated layer covers the area of the shielding cover body except the exposed area. In this way, since the exposed area of the side edge of the shielding cover is reduced in the thickness direction or in the length, the proportion of the exposed area of the shielding cover formed after cutting in the whole shielding cover is reduced, and the soldering strength and reliability of the solder and the shielding cover can be greatly improved.

[0058] Please refer to Figure 9 , Figure 9 the flowchart of the shielding cover manufacturing method provided by the embodiments of the present application, as shown in Figure 9 , the method includes the following steps:

[0059] Step 901, cutting the whole piece of metal material according to the pre-designed cutting position to cut the whole piece of metal material into multiple connected metal blocks, the thickness of the metal at the connecting position between adjacent metal blocks is less than the thickness of the metal block, and / or there is a hollow area at the connecting position between adjacent metal blocks.

[0060] In the embodiments of the present application, by optimizing the design of the metal material and the corresponding processing and manufacturing process, the damage to the nickel plating layer and the area of the exposed area caused by the forming and cutting are reduced, and the shielding cover shown in Figure 6 or Figure 8 is obtained.

[0061] In specific implementation, first, the cutting position of the whole piece of metal material can be designed, and specifically, the cutting position of the whole piece of metal material can be designed according to the required shielding cover size to ensure that the size of the module after cutting is the size of the shielding cover. To obtain multiple shielding cover modules of the same size, the cutting position of the whole piece of metal material can be designed according to the required shielding cover size to ensure that the size of each shielding cover module after cutting is the same.

[0062] Then, the whole piece of metal material can be cut according to the pre-designed cutting position to cut the whole piece of metal material into multiple connected metal blocks, and according to different cutting processes, the size or structure of the metal at the connecting position between the metal blocks after cutting is different. Specifically, in one cutting method, the cutting position can be cut to a certain depth to remove the metal at the cutting position to a certain depth, so that the thickness of the metal at the connecting position between adjacent metal blocks is less than the thickness of the metal block. In another cutting method, the cutting position can be milled to remove a certain area of the metal at the cutting position, so that there is a hollow area at the connecting position between adjacent metal blocks, and a bridge structure is formed between the metal blocks.

[0063] Step 902, electroplating treatment is performed on the surface layer of the cut whole piece of metal material.

[0064] After the cutting process in step 901, electroplating treatment can be performed on the surface layer of the cut whole piece of metal material to plate a layer of electroplating layer on the surface layer of the cut whole piece of metal material to ensure the solder immersion effect. In specific implementation, the two ends of the cut whole piece of metal material can be connected to positive and negative electrodes respectively to conduct the whole piece of metal material, and then electroplating treatment is performed.

[0065] In some embodiments, the whole piece of metal material can be an aluminum alloy material, and the aluminum alloy shielding cover has a lower density, so that the shielding cover has a lighter weight. In addition, the solder wettability of the aluminum alloy material is poor, which causes the solder to not be well attached to the aluminum alloy material. Therefore, in order to improve the solder wettability, a layer of metal nickel material can be electroplated on the surface of the whole piece of aluminum alloy material, that is, the whole piece of aluminum alloy material is subjected to nickel electroplating treatment to form a nickel metal layer on the surface of the whole piece of aluminum alloy material. In this way, the shielding cover has a lighter weight and better solder wettability, so that the shielding cover is more easily connected with the solder.

[0066] Step 903: The electroplated whole piece of metal material is subjected to stamping forming, and is cut at the connection positions between adjacent metal blocks to obtain the shielding cover.

[0067] Finally, the electroplated whole piece of metal material can be subjected to stamping and stretching forming, and is cut at the connection positions between adjacent metal blocks to obtain a plurality of shielding cover monomers. Each shielding cover monomer is a shielding cover as shown in Figure 6 or Figure 8 the embodiments.

[0068] Optionally, the cutting positions include spaced-apart depth-cutting lines and / or spaced-apart target cutting regions.

[0069] As shown in Figure 5 some embodiments, the whole piece of metal material 501 can be designed with spaced-apart depth-cutting lines 504, so that the depth cutting is performed at the positions indicated by the depth-cutting lines 504; or, as shown in Figure 7 some other embodiments, the whole piece of metal material 701 can be designed with spaced-apart target cutting regions 703, so that the milling cutting is performed at the positions indicated by the target cutting regions 703, and the target cutting regions 703 are cut off, so that the hollow regions are formed at the cutting positions, and the bridge structures are formed between the adjacent metal blocks. In this way, the size of the connection regions between the metal blocks after cutting can be reduced, and the size of the exposed region of the shielding cover after final cutting can be reduced.

[0070] Optionally, the step 901 includes:

[0071] The depth-cutting process is used to cut the whole piece of metal material at the pre-designed cutting positions to thin the metal thickness at the cutting positions.

[0072] In one embodiment, the depth-cutting process is used to cut the whole piece of metal material at the pre-designed cutting positions to thin the metal thickness at the cutting positions, so that the metal thickness at the connection positions between the adjacent metal blocks is less than the thickness of the metal blocks.

[0073] The specific implementation process can be as follows: Figure 5 As shown, a single sheet of metal material is first cut according to the actual dimensions of the shielding cover module. The connection area between modules is designed as a V-Cut, meaning the entire sheet of metal material is designed as a V-Cut. The V-Cut can be achieved using various common metal depth-removal processes, such as laser depth-removal cutting or depth-removal etching. Specifically, the cutting method involves cutting a certain thickness of metal from both the top and bottom of the cutting position on the entire sheet of metal material, resulting in a shape like... Figure 5 The V-Cut groove shown in the mid-section view has a connection area between the shielding cover modules with a thickness less than the thickness of the shielding cover module itself. After completing the V-Cut fabrication of the panel, the desired result is... Figure 5 The mid-section view shows a localized stepped metallic material 501.

[0074] Then, by applying a common electroplating process, such as nickel plating, a layer of nickel metal 502 can be electroplated onto the surface of the metal material 501, including the stepped area of ​​the V-Cut.

[0075] Finally, the metal material that has undergone the nickel plating process is shaped and cut into individual shielding cover units. Specifically, the cutting is done at the V-Cut, i.e., the connection point of each shielding cover module. After cutting, the improved shielding cover unit is obtained. (Details follow...) Figure 6 As shown, the thickness of the exposed area 602 of the shielding cover body 601 is significantly reduced, which can greatly improve the welding strength and reliability of the solder and the shielding cover.

[0076] Optionally, step 901 includes:

[0077] The entire sheet of metal material is cut at pre-designed cutting positions using a milling process to remove the metal at the cutting positions and form a hollow area.

[0078] In another embodiment, the entire sheet of metal material can be cut into pre-designed cutting areas using a milling process to remove the metal in the cutting areas, so that the connection structure between adjacent metal blocks is a bridge.

[0079] The specific implementation process can be as follows: Figure 7 As shown, a single sheet of metal material is first cut into sections according to the actual dimensions of the shielding cover module. The connection areas between modules are designed as bridges, while the non-bridged areas are hollowed out. The bridging can be achieved using common milling processes, such as CNC milling, waterjet cutting, wire cutting, and laser cutting. After completing the bridging fabrication of the panel, the desired result is obtained as shown... Figure 7 The partially hollowed-out metal material 701 is shown in the top-middle view.

[0080] Then, a general electroplating process, such as a nickel plating process, is applied to electroplate a layer of nickel metal 702 on the surface of the metal material, including the partially hollowed-out area.

[0081] Finally, after the metal material that has completed the nickel plating process is subjected to the forming and cutting of the shield cover monomer, the improved shield cover monomer is obtained. As shown in Figure 8 The length and width area of the exposed area 602 of the shield cover body 601 is greatly reduced, thereby greatly improving the soldering strength and reliability of the soldering and the shield cover.

[0082] Optionally, the step 901 includes:

[0083] The whole piece of metal material is cut at the pre-designed cutting position by using a depth-cutting process to thin the metal thickness at the cutting position, and the target cutting area at the cutting position is removed by using a milling process to form a hollowed-out area.

[0084] In some embodiments, the whole piece of metal material can be subjected to depth cutting and milling in combination with the cutting processes shown in Figure 5 and Figure 7 to thin the metal thickness at the cutting position and remove the specific cutting area at the cutting position, so that the metal thickness at the connection position between adjacent metal blocks is less than the thickness of the metal blocks, and the connection structure between adjacent metal blocks is a bridge connection.

[0085] In particular implementation, the depth-cutting process shown in Figure 5 can be used to depth-cut the whole piece of metal material so that the metal thickness at the cutting position is less than the thickness of the metal blocks, and the milling process shown in Figure 7 is further used to remove part of the area at the cutting position to form a bridge connection structure. Finally, after the electroplating and cutting processes, the improved shield cover is obtained, the side edges of the shield cover body 601 form a plurality of small exposed areas 602, and in the thickness direction of the shield cover body 601, the size of the exposed area 602 is less than the thickness of the shield cover body 601.

[0086] In this way, by combining the cutting processes shown in Figure 5 and Figure 7 , the effect of a metal material with a bridge connection and a V-Cut spliced board can be achieved, so that there is a nickel plating layer on the surface of the bridge connection step at the hollowed-out area, thereby further reducing the proportion of the exposed area in the whole shield cover monomer after the forming and cutting of the shield cover, and improving the bonding area and soldering reliability of the soldering and the shield cover body.

[0087] It should be noted that when cutting a whole sheet of metal material and designing the connection areas between modules as bridges, milling can be done not only laterally to create bridges in the horizontal direction, but also longitudinally to create bridges in the vertical direction. Therefore, after nickel plating and cutting, the following can be obtained: Figure 8 The shielding cover structure shown has small exposed areas on all four sides.

[0088] The shielding cover manufacturing method in this application involves cutting a whole sheet of metal material at pre-designed cutting positions to divide it into multiple connected metal blocks. The metal thickness at the connection points between adjacent metal blocks is less than the thickness of the metal blocks themselves, and / or there are open areas at the connection points between adjacent metal blocks. The surface of the cut whole sheet of metal material is then electroplated. The electroplated whole sheet of metal material is then stamped and cut from the connection points between adjacent metal blocks to obtain the shielding cover. By using a method of cutting in a specific way followed by electroplating to manufacture the shielding cover, the exposed area on the side of the shielding cover is reduced in thickness or length compared to existing technologies. This reduces the proportion of the exposed area formed after the shielding cover is cut within the entire shielding cover, thereby significantly improving the soldering strength and reliability between the solder and the shielding cover.

[0089] This application also provides an electronic device, including the shielding cover provided in the foregoing embodiments, wherein the shielding cover is connected to the pads on the circuit board of the electronic device by solder.

[0090] like Figure 10 As shown, the two ends of the shielding cover can be soldered to the pads 200 on the circuit board 100 of the electronic device by solder 300. Since only a part of the outer side of the shielding cover is exposed 602, the shielding cover can be connected to the pads 200 by solder 300 on the inner side and by solder 300 on the outer nickel-plated part of the outer side, which can improve the soldering strength and reliability between the solder and the shielding cover.

[0091] The electronic device in this application embodiment can achieve the same technical effect as the one in the foregoing embodiment.

[0092] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0093] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method.

[0094] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A shielding cover, characterized in that, include: A shielding cover body, wherein at least one side of the shielding cover body is cut to form an exposed area extending along the thickness direction of the side, the exposed area being in at least one of a first state and a second state, wherein, in the first state, the exposed area is continuous along the length direction of the corresponding side, and the size of the exposed area is smaller than the thickness of the shielding cover body in the thickness direction; in the second state, the exposed area is discontinuous along the length direction of the corresponding side. An electroplated layer that covers the area of ​​the shielding cover body other than the exposed area.

2. The shielding cover according to claim 1, characterized in that, At least one side of the shielding cover body is formed by a fixed-depth cutting process to have a cutting edge with a thickness smaller than that of the shielding cover body, and the cutting edge is cut to form the exposed area in the first state.

3. The shielding cover according to claim 1, characterized in that, At least one side of the shielding cover body is formed by a milling process to have intermittent cutting bridges, and the cutting bridges are cut to form the exposed area in the second state.

4. The shielding cover according to claim 1 or 3, characterized in that, In the second state, in the thickness direction of the shielding cover body, the size of the exposed area is less than or equal to the thickness of the shielding cover body.

5. The shielding cover according to any one of claims 1 to 3, characterized in that, The shielding cover body is made of aluminum metal, and the electroplated layer includes a nickel metal layer.

6. The shielding cover according to any one of claims 1 to 3, characterized in that, The edge area of ​​the shielding cover body is connected to the pads on the circuit board by solder, and the edge area is the area within a preset range of the exposed area.

7. A method for manufacturing a shielding cover, characterized in that, include: The entire sheet of metal material is cut at pre-designed cutting positions to cut the entire sheet of metal material into multiple connected metal blocks. The metal thickness at the connection position between adjacent metal blocks is less than the thickness of the metal block, and / or there is a hollow area at the connection position between adjacent metal blocks. Electroplating is performed on the surface of the cut sheet of metal. The electroplated sheet of metal is stamped and cut from the connection point between adjacent metal blocks to obtain the shielding cover.

8. The method according to claim 7, characterized in that, The cutting positions include spaced, fixed-depth cutting lines and / or spaced target cutting areas.

9. The method according to claim 7 or 8, characterized in that, The process of cutting the entire sheet of metal material according to pre-designed cutting positions includes: The entire sheet of metal material is cut at a pre-designed cutting position using a fixed-depth cutting process to reduce the metal thickness at the cutting position.

10. The method according to claim 7 or 8, characterized in that, The process of cutting the entire sheet of metal material according to pre-designed cutting positions includes: The entire sheet of metal material is cut at pre-designed cutting positions using a milling process to remove the metal at the cutting positions and form a hollow area.

11. The method according to claim 7 or 8, characterized in that, The process of cutting the entire sheet of metal material according to pre-designed cutting positions includes: The entire sheet of metal material is cut at a pre-designed cutting position using a fixed-depth cutting process to reduce the metal thickness at the cutting position. A milling process is then used to remove the target cutting area at the cutting position to form a hollow area.

12. An electronic device, characterized in that, The shielding cover includes any one of claims 1 to 6, wherein the shielding cover is connected to pads on the circuit board of the electronic device by solder.

Images