Chip bonding micro force control device and chip loading equipment

Abstract

The present application relates to a chip bonding micro-force control device and a chip loading equipment, including a bottom angle adjustment structure and a chip bonding micro-force control structure arranged on the bottom angle adjustment structure; the chip bonding micro-force control structure includes a bottom base connection unit, a micro-rotating power drive unit, a rotating upper and lower driven unit and a micro-force control drive unit; wherein the rotating upper and lower driven unit is provided with a chip suction nozzle; the bottom base connection unit is arranged on the bottom angle adjustment structure for adjusting its own parallelism; the micro-rotating power drive unit is respectively connected to the bottom base connection unit and the rotating upper and lower driven unit for sensing and correcting the angle of the chip suction nozzle; the rotating upper and lower driven units are respectively connected to the bottom base connection unit and the micro-force control drive unit for adjusting the position of the chip suction nozzle; the micro-force control drive unit is connected to the bottom base connection unit for adjusting the position of the rotating upper and lower driven units to control the downward pressure of the chip suction nozzle.

Description

Technical Field

[0001] The present application relates to the field of chip production, and in particular to a chip bonding micro-force control device and a chip loading equipment. Background Art

[0002] When processing incoming optical communication chip wafers, the traditional spring preload control method is usually used. This method is relatively simple and easy to debug, but in terms of the force control range, the minimum downforce of the current transmission method is limited by the instruments and equipment. For example, a certain instrument can only measure 20g and cannot be reduced. It is very difficult to modify these instruments and equipment, which is not only costly, but also may require process adjustments.

[0003] In addition, when the optical communication chip is sucked and loaded on the blue film plate, the ejector lifts the bottom of the chip, and the chip is separated from the blue film. At the same time, the head presses down to contact the chip and then sucks it. Since the chip is very small, a tiny communication head is required for suction. When chips of different specifications require different head pressures, the transmission head structure needs to be recalibrated to meet the process requirements. If it is not calibrated, the chip will be indented during the suction process, and in severe cases, it will be cracked.

[0004] Therefore, different specifications of chips have different bonding pressure requirements. For example, for ultra-thin and slender optical communication chips, the suction pressure needs to be controlled within ±1g, but the traditional bonding head structure cannot meet such high pressure requirements. For example, the chip size is between 0.100-0.300mm, the chip is small and fragile, and the traditional bonding head structure can only be ±5g at most. Excessive suction pressure may cause the chip to break or damage. Summary of the invention

[0005] Based on this, it is necessary to provide a chip bonding micro-force control device and a chip loading equipment.

[0006] In one embodiment, a chip bonding micro-force control device includes a bottom angle adjustment structure and a chip bonding micro-force control structure disposed on the bottom angle adjustment structure;

[0007] The chip bonding micro-force control structure comprises a bottom base connection unit, a micro-rotating power driving unit, a rotating upper and lower driven unit and a micro-force control driving unit; wherein the rotating upper and lower driven unit is provided with a chip suction nozzle;

[0008] The bottom base connection unit is arranged on the bottom angle adjustment structure for adjusting its own parallelism;

[0009] The micro-rotation power driving unit is respectively connected to the bottom base connection unit and the rotation upper and lower driven units for sensing and correcting the angle of the chip suction nozzle;

[0010] The rotating upper and lower driven units are respectively connected to the bottom base connection unit and the micro force control drive unit for adjusting the position of the chip suction nozzle;

[0011] The micro force control driving unit is connected to the bottom base connecting unit and is used to adjust the position of the rotating upper and lower driven unit to control the downward pressure of the chip suction nozzle.

[0012] The above-mentioned chip bonding micro-force control device, through the cooperation of a micro-rotating power drive unit, a rotating up and down driven unit and a micro-force control drive unit, can, on the one hand, realize precise force control of the chip's suction downward pressure in the bonding process, and is particularly suitable for the bonding process requirements of optical communication chips, greatly reducing the indentation and cracking in the suction process, thereby ensuring the product yield; on the other hand, it has the advantages of being simple, easy to debug and easy to use. In the application, the parameters of the micro-force control drive unit can be set to meet the requirements of the adsorption downward pressure in the production and manufacturing of optical communication chips of different specifications, thereby realizing precise force control and meeting any force control requirements within a certain range.

[0013] Exemplarily, in one of the embodiments, the bottom angle adjustment structure includes a bottom plate, a stopper, and a rotation positioning pin;

[0014] The stopper and the rotation positioning pin are both arranged on the bottom plate;

[0015] The bottom base connection unit or its base is rotatably connected to the rotation positioning pin, and the rotation range of the bottom base connection unit or its base is limited by the stopper.

[0016] Exemplarily, in one of the embodiments, the micro rotary power drive unit includes a photoelectric fixing frame, an induction flange, a motor flange, a micro rotary motor, a high torque synchronous toothed belt, a synchronous pulley and a photoelectric switch;

[0017] The photoelectric switch is arranged on the photoelectric fixing frame, and the induction flange is arranged on the micro-rotating motor and is located in the detection position of the photoelectric switch;

[0018] The micro rotating motor is arranged on the bottom base connection unit or its mounting seat through the motor flange;

[0019] The synchronous belt wheel is arranged in the bottom base connection unit or its mounting seat, and the output end of the micro rotary motor is drivingly connected to the synchronous belt wheel;

[0020] The synchronous pulley is connected to the rotating upper and lower driven unit or its spline seat through the high-torque synchronous toothed belt.

[0021] Exemplarily, in one of the embodiments, the micro rotary motor is provided with a bar-shaped hole for adjusting the synchronous belt pulley through the bar-shaped hole to adjust the tightness of the high-torque synchronous toothed belt.

[0022] In one embodiment, the micro force control driving unit includes a micro voice coil motor, and the micro voice coil motor includes a micro voice coil mover and a micro voice coil stator;

[0023] One of the miniature voice coil mover and the miniature voice coil stator is connected to the bottom base connection unit, and the other is connected to the rotating up and down driven unit.

[0024] In one of the embodiments, the micro force control drive unit further includes a mover fixing seat, a micro guide rail and a bearing assembly;

[0025] The miniature voice coil stator is arranged on the bottom base connection unit or its mounting seat, and the miniature voice coil mover is fixedly connected to the mover fixing seat;

[0026] The bearing assembly is arranged on the mover fixing seat and is fixedly connected to the rotating upper and lower driven unit;

[0027] The mover fixing seat is slidably arranged on the micro guide rail, and the micro guide rail is arranged on the bottom base connecting unit or its mounting seat.

[0028] For example, in one embodiment, the bearing assembly is fixed between a fixing ring of the rotating upper and lower driven unit and a spline adapter of the rotating upper and lower driven unit, and the fixing ring and the spline adapter jointly clamp the bearing assembly.

[0029] In one of the embodiments, the micro force control drive unit further includes a micro reading head, which is disposed on the bottom base connection unit or its mounting seat and is used to measure the movement distance of the micro voice coil mover or the bearing assembly.

[0030] In one of the embodiments, the rotating upper and lower driven unit is further provided with a spline assembly and a nozzle adapter;

[0031] The chip suction nozzle is arranged under the suction nozzle adapter;

[0032] The nozzle adapter is arranged under the spline assembly;

[0033] The spline assembly is respectively connected to the bottom base connection unit, the micro rotary power drive unit and the micro force control drive unit.

[0034] In one of the embodiments, the rotating upper and lower driven unit is further provided with a high-speed rotating joint and a spline adapter;

[0035] The spline assembly includes a spline seat and a spline shaft, wherein the spline seat is arranged under the spline adapter and is respectively connected to the bottom base connection unit, the micro rotary power drive unit and the micro force control drive unit;

[0036] The spline shaft passes through the spline seat, one end of the spline shaft is connected to the high-speed rotary joint through the spline adapter, and the other end is protruded outside the spline seat and connected to the nozzle adapter;

[0037] The high-speed rotary joint is used to access an external vacuum pipeline.

[0038] In one of the embodiments, the rotating upper and lower driven unit is further provided with a top flange, a bottom flange, a fixing ring and a pressure ring;

[0039] One end of the spline seat is positioned and connected to the bottom base connection unit or its mounting seat through the bottom flange, and the other end passes through the pressure ring and is connected to the top flange;

[0040] The spline adapter is arranged between the fixing ring and the high-speed rotary joint, and the fixing ring is used to fix the spline adapter to one end of the spline shaft.

[0041] In one of the embodiments, the rotating upper and lower driven unit is further provided with a fixing seat and a fixing clamp;

[0042] The fixing seat is arranged on the bottom base connection unit or its mounting seat;

[0043] The fixing clamp is arranged on the fixing seat and is used for clamping external cables and vacuum pipelines.

[0044] In one of the embodiments, the bottom base connection unit includes a base, a positioning pin and a mounting seat;

[0045] The base is rotatably connected to the bottom angle adjustment structure or its bottom plate;

[0046] The mounting seat is connected to the base via the positioning pin.

[0047] In one of the embodiments, a chip loading device includes a conveying device, a lifting device and a chip bonding micro-force control device as described in any embodiment;

[0048] The conveying device is used to convey the chips to be loaded;

[0049] The lifting device is used to lift the chip to be loaded from below;

[0050] The chip bonding micro-force control device is located above the lifting device and is used to absorb the chip to be loaded. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0052] Figure 1 This is a schematic structural diagram of an embodiment of a micro-force control device for chip bonding described in this application.

[0053] Figure 2 for Figure 1 A schematic diagram of the structural breakdown of the illustrated embodiment.

[0054] Figure 3 for Figure 2 Schematic diagram of the structural decomposition of the chip bonding micro-force control structure shown.

[0055] Figure 4 for Figure 3 A schematic diagram of the first part of the structure of the illustrated embodiment.

[0056] Figure 5 for Figure 3 A schematic diagram of the structure of the second part of the illustrated embodiment.

[0057] Figure 6 for Figure 3 A schematic structural diagram of the third part of the illustrated embodiment.

[0058] Figure 7 for Figure 3 A schematic structural diagram of the fourth part of the illustrated embodiment.

[0059] Figure 8 for Figure 3 A schematic diagram of the structure of the fifth part of the illustrated embodiment.

[0060] Reference numerals: chip bonding micro-force control device 100, bottom angle adjustment structure 200, chip bonding micro-force control structure 300, bottom base connection unit 310, micro-rotation power drive unit 320, rotation up and down driven unit 330, micro-force control drive unit 340, bottom plate 101, photoelectric fixing frame 102, induction flange 103, stopper 104, base 105, top flange 106, mounting seat 107, spline adapter 108, mover fixing seat 109, nozzle adapter 110, motor flange 111, bottom flange 112, fixed Fixed seat 113, fixing ring 114, fixing clamp 115, pressing ring 116, miniature voice coil mover 117, miniature guide rail 118, bearing assembly 119, high torque synchronous toothed belt 120, positioning pin 121, rotating positioning pin 122, high-speed rotating joint 123, synchronous pulley 124, miniature rotating motor 125, strip hole 126, chip suction nozzle 127, first sealing ring 128, limiting groove 129, second sealing ring 130, photoelectric switch 131, spline seat 132, miniature reading head 133, spline shaft 134, miniature voice coil stator 135. DETAILED DESCRIPTION

[0061] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0062] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0063] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0064] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are in contact indirectly through an intermediate medium. Moreover, a first feature being “above”, “above”, or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0065] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0066] The present application discloses a chip bonding micro-force control device and a chip loading equipment, which include some or all of the technical features of the following embodiments; that is, the chip bonding micro-force control device and the chip loading equipment include some or all of the following structures. In one embodiment of the present application, a chip bonding micro-force control device includes a bottom angle adjustment structure and a chip bonding micro-force control structure arranged on the bottom angle adjustment structure; the chip bonding micro-force control structure includes a bottom base connection unit, a micro-rotational power drive unit, a rotating upper and lower driven unit and a micro-force control drive unit; wherein the rotating upper and lower driven unit is provided with a chip suction nozzle; the bottom base connection unit is arranged on the bottom angle adjustment structure for adjusting its own parallelism; the micro-rotational power drive unit is respectively connected to the bottom base connection unit and the rotating upper and lower driven unit for sensing and correcting the angle of the chip suction nozzle; the rotating upper and lower driven units are respectively connected to the bottom base connection unit and the micro-force control drive unit for adjusting the position of the chip suction nozzle; the micro-force control drive unit is connected to the bottom base connection unit for adjusting the position of the rotating upper and lower driven units to control the downward pressure of the chip suction nozzle. The above-mentioned chip bonding micro-force control device, through the cooperation of a micro-rotating power drive unit, a rotating up and down driven unit and a micro-force control drive unit, can, on the one hand, realize precise force control of the chip's suction downward pressure during the bonding process, and is particularly suitable for the bonding process requirements of optical communication chips, greatly reducing the indentation and fracturing in the suction process, thereby ensuring the product yield; on the other hand, it has the advantages of being simple, easy to debug and easy to use. In the application, the parameters of the micro-force control drive unit can be set to meet the requirements of the suction downward pressure in the production and manufacturing of optical communication chips of different specifications, and precise force control can be achieved, which can meet any force control requirements within a certain range. The following is combined with Figures 1 to 8 , the chip bonding micro-force control device and chip loading equipment are described in detail.

[0067] In one embodiment, a chip bonding micro-force control device 100 is as follows: Figure 1 As shown, it includes a bottom angle adjustment structure 200 and a chip bonding micro-force control structure 300 disposed on the bottom angle adjustment structure 200; the chip bonding micro-force control structure 300 can adjust its own parallelism, that is, horizontality, on the bottom angle adjustment structure 200, so that the chip bonding micro-force control structure 300 can accurately cooperate with the feeding to realize chip suction. The chip bonding micro-force control structure 300 is the core structure of the micro-force control part of the optical communication chip bonding process. Its mechanism can automatically adjust different force control parameters according to the specification parameter settings of the manufacturing process chip, and can be compatible with the force control requirements of ultra-thin optical communication chips, ensuring that the chip will not be crushed or have the risk of indentation.

[0068] For example, in one embodiment, Figure 2 As shown, the bottom angle adjustment structure 200 includes a bottom plate 101, a stopper 104 and a rotation positioning pin 122; the stopper 104 and the rotation positioning pin 122 are both arranged on the bottom plate 101; the bottom base connection unit 310 or its base 105 is rotatably connected to the rotation positioning pin 122, and the rotation range of the bottom base connection unit 310 or its base 105 is limited by the stopper 104. That is, the bottom base connection unit 310 or its base 105 can rotate relative to the rotation positioning pin 122, and the bottom base connection unit 310 or its base 105 cannot be separated from the rotation positioning pin 122 during use, and its position is limited by the rotation positioning pin 122; and the rotation range is limited by the stopper 104, and can only rotate within a pre-set range, thereby avoiding the occurrence of problems such as improper suction or defective products due to excessive rotation.

[0069] In one embodiment, if Figure 2 As shown, the chip bonding micro-force control structure 300 includes a bottom base connection unit 310, a micro-rotational power drive unit 320, a rotational up and down driven unit 330 and a micro-force control drive unit 340; wherein, the rotational up and down driven unit 330 is provided with a chip suction nozzle 127; the bottom base connection unit 310 is arranged on the bottom angle adjustment structure 200 for adjusting its own parallelism; that is, by adjusting the position of the bottom base connection unit 310 relative to the bottom angle adjustment structure 200, the parallelism of the bottom base connection unit 310 itself is adjusted, thereby adjusting the parallelism of the chip bonding micro-force control structure 300, which can also be understood as adjusting the parallelism of the chip bonding micro-force control structure 300 relative to the bottom angle adjustment structure 200, or relative to the horizontal plane, so the parallelism can also be called horizontality or horizontal degree, etc.

[0070] Combination Figure 3 and Figure 4In one embodiment, the bottom base connection unit 310 includes a base 105, a positioning pin 121 and a mounting seat 107; the base 105 is rotatably connected to the bottom angle adjustment structure 200 or its bottom plate 101; the mounting seat 107 is connected to the base 105 through the positioning pin 121. Exemplarily, in this embodiment, the bottom base connection unit 310 forms a limiting groove 129 on the base 105, and the shape of the limiting groove 129 is similar to or matched with the shape of the stopper 104 of the bottom angle adjustment structure 200, so that the base 105 can rotate relative to the rotating positioning pin 122, and the range of rotation is limited by the stopper 104, that is, it can only rotate within a pre-set range, thereby avoiding the occurrence of problems such as improper suction or defective products due to excessive rotation. This is because the horizontality or parallelism that needs to be adjusted is usually relatively small, and the accuracy requirement is relatively low. It is only necessary to meet the requirements of accurately correcting the angle of the chip suction nozzle 127 as described in other embodiments, thereby further realizing the precise force control of the suction pressure of the chip in the bonding process, which is particularly suitable for the bonding process requirements of optical communication chips, greatly reducing the indentation and cracking in the suction process, thereby ensuring the product yield.

[0071] In one embodiment, if Figure 2 As shown, the micro-rotational power drive unit 320 is respectively connected to the bottom base connection unit 310 and the rotating up and down driven unit 330, and is used to sense and correct the angle of the chip suction nozzle 127; exemplarily, the micro-rotational power drive unit 320 senses the position of the rotating up and down driven unit 330, and corrects the angle of the chip suction nozzle 127 by correcting the position of the rotating up and down driven unit 330. As an example, the micro-rotational power drive unit 320 corrects the angle of the chip suction nozzle 127 so that the chip suction nozzle 127 is perpendicular to the surface of the chip to be processed, or it can be understood as being perpendicular to the surface or horizontal plane of the conveying device or the lifting device.

[0072] For example, in one embodiment, Figure 2 and Figure 3 As shown, the micro-rotational power drive unit 320 includes a photoelectric fixing frame 102, an induction flange 103, a motor flange 111, a micro-rotational motor 125, a high-torque synchronous toothed belt 120, a synchronous pulley 124 and a photoelectric switch 131; Figure 5 , Figure 6 and Figure 7The photoelectric switch 131 is arranged on the photoelectric fixing frame 102, the induction flange 103 is arranged on the micro rotary motor 125, and is located in the detection position of the photoelectric switch 131; the micro rotary motor 125 is arranged on the bottom base connection unit 310 or its mounting seat 107 through the motor flange 111; the synchronous pulley 124 is arranged in the bottom base connection unit 310 or its mounting seat 107, and the output end of the micro rotary motor 125 is driven and connected to the synchronous pulley 124; the synchronous pulley 124 is connected to the rotating upper and lower driven unit 330 or its spline seat 132 through the high-torque synchronous toothed belt 120. Exemplarily, the photoelectric fixing frame 102 can be set on an external frame, or on the bottom angle adjustment structure 200 or its bottom plate 101, to ensure the detection position of the photoelectric switch 131, thereby ensuring the horizontality of the photoelectric switch 131; the sensing flange 103 cooperates with the photoelectric switch 131, and through the micro-rotating motor 125, the synchronous pulley 124, the high-torque synchronous toothed belt 120 and the rotating upper and lower driven unit 330, the position of the chip suction nozzle 127 is chain-limited, thereby realizing the sensing and correction of the angle of the chip suction nozzle 127.

[0073] For example, in one embodiment, Figure 6 As shown, the micro rotary motor 125 is provided with a strip hole 126, which is used to adjust the synchronous pulley 124 through the strip hole 126 to adjust the tightness of the high torque synchronous toothed belt 120. In this way, the tightness of the high torque synchronous toothed belt 120 can be conveniently adjusted without disassembly.

[0074] In one embodiment, if Figure 2 As shown, the rotating upper and lower driven unit 330 is respectively connected to the bottom base connection unit 310 and the micro force control driving unit 340 to adjust the position of the chip suction nozzle 127; the micro force control driving unit 340 is connected to the bottom base connection unit 310 to adjust the position of the rotating upper and lower driven unit 330 to control the downward force of the chip suction nozzle 127. Such a design, through the cooperation of the micro rotating power driving unit 320, the rotating upper and lower driven unit 330 and the micro force control driving unit 340, has the advantages of being simple, easy to debug and easy to apply. In the application, the parameters of the micro force control driving unit 340 can be set to meet the requirements of the adsorption downward force in the production and manufacturing of optical communication chips of different specifications, and accurate force control can be achieved, which can meet any force control requirements within a certain range.

[0075] In one embodiment, if Figure 3As shown, the rotating upper and lower driven unit 330 is also provided with a spline assembly and a nozzle adapter 110; the chip nozzle 127 is arranged under the nozzle adapter 110; the nozzle adapter 110 is arranged under the spline assembly; the spline assembly is respectively connected to the bottom base connection unit 310, the micro rotating power drive unit 320 and the micro force control drive unit 340. In one embodiment, combined with Figure 6 , Figure 7 and Figure 8 The rotating upper and lower driven unit 330 is also provided with a high-speed rotating joint 123 and a spline adapter 108; the spline assembly includes a spline seat 132 and a spline shaft 134, the spline seat 132 is arranged under the spline adapter 108, and is respectively connected to the bottom base connection unit 310, the micro rotating power drive unit 320 and the micro force control drive unit 340; the spline shaft 134 passes through the spline seat 132, one end of the spline shaft 134 is connected to the high-speed rotating joint 123 through the spline adapter 108, and the other end is protruding outside the spline seat 132 and connected to the nozzle adapter 110; the high-speed rotating joint 123 is used to access an external vacuum pipeline.

[0076] In one embodiment, if Figure 6 , Figure 7 and Figure 8 As shown, the rotating up and down driven unit 330 is also provided with a top flange 106, a bottom flange 112, a fixing ring 114 and a pressing ring 116; one end of the spline seat 132 is positioned and connected to the bottom base connection unit 310 or its mounting seat 107 through the bottom flange 112, and the other end passes through the pressing ring 116 and is connected to the top flange 106; the spline adapter 108 is arranged between the fixing ring 114 and the high-speed rotating joint 123, and the fixing ring 114 is used to fix the spline adapter 108 to one end of the spline shaft 134. In this embodiment, the rotating up and down driven unit 330 is also provided with a fixing seat 113 and a fixing clamp 115; the fixing seat 113 is arranged on the bottom base connection unit 310 or its mounting seat 107; the fixing clamp 115 is arranged on the fixing seat 113, and is used to clamp external cables and vacuum pipelines. This structural design further realizes the precise force control of the chip's suction pressure during the bonding process, reduces indentations and cracks in the suction process, and helps ensure the product's yield.

[0077] The micro force control driving unit 340 is one of the important invention points of the present application. In one embodiment, Figure 3 and Figure 8As shown, the miniature force control driving unit 340 includes a miniature voice coil motor, and the miniature voice coil motor includes a miniature voice coil mover 117 and a miniature voice coil stator 135; one of the miniature voice coil mover 117 and the miniature voice coil stator 135 is connected to the bottom base connection unit 310, and the other is connected to the rotating up and down driven unit 330. In this embodiment, the miniature force-controlled driving unit 340 also includes a mover fixing seat 109, a miniature guide rail 118 and a bearing assembly 119; the miniature voice coil stator 135 is arranged on the bottom base connection unit 310 or its mounting seat 107, and the miniature voice coil mover 117 is fixedly connected to the mover fixing seat 109; the bearing assembly 119 is arranged on the mover fixing seat 109 and is fixedly connected to the rotating up and down driven unit 330; the mover fixing seat 109 is slidably arranged on the miniature guide rail 118, and the miniature guide rail 118 is arranged on the bottom base connection unit 310 or its mounting seat 107.

[0078] For example, for optical communication chips that require precise force control of the suction downward pressure during the bonding process, a miniature voice coil motor can be used in conjunction with a bonding mechanism to set the force control pressure according to process requirements to meet actual production and manufacturing needs. Specifically, the miniature voice coil mover 117 and the miniature voice coil stator 135 drive the bearing assembly 119 to move up and down in the direction shown in the figure through the cooperation of the miniature guide rail 118 and the mover fixing seat 109, thereby driving the rotating up and down driven unit 330 or its chip suction nozzle 127 to move up and down, thereby accurately controlling the downward pressure of the chip suction nozzle 127 on the chip to be processed. It should be noted that the chip bonding micro-force control device 100 or its chip bonding micro-force control structure 300 moves up and down along the direction shown in the figure, which is driven by an external structural part. For example, the bottom angle adjustment structure 200 is driven up and down by an external structural part, thereby driving the chip bonding micro-force control structure 300 to move up and down along the direction shown in the figure; the main invention point of the chip bonding micro-force control device 100 described in each embodiment of the present application is to realize chip bonding micro-force control, which can realize micro-force control in the optical communication chip bonding process, and therefore can be used for tiny communication head suction, especially for chips with a size between 0.100mm and 0.300mm. These chips are small and brittle, and excessive suction pressure may cause the chip to break or be damaged. When chips of different specifications have high requirements for bonding pressure, the parameters of the required bonding pressure can be set according to the process requirements to ensure that the chip is not broken during suction.

[0079] For example, in one embodiment, the bearing assembly 119 is fixed between the fixing ring 114 of the rotating up and down driven unit 330 and the spline adapter 108 of the rotating up and down driven unit 330, and the fixing ring 114 and the spline adapter 108 jointly clamp the bearing assembly 119. In one embodiment, the micro force control driving unit 340 also includes a micro reading head 133, which is arranged on the bottom base connection unit 310 or its mounting seat 107, and is used to measure the moving distance of the micro voice coil mover 117 or the bearing assembly 119. In this way, position control can be achieved more accurately, thereby ensuring the precise force control of the suction down force of the chip in the bonding process, which is particularly suitable for the bonding process requirements of optical communication chips.

[0080] Next, continue to combine Figures 1 to 8 The chip bonding micro-force control device 100 is illustrated by way of example. In one embodiment, the chip bonding micro-force control device 100 for an optical communication chip includes two parts, namely a bottom angle adjustment structure 200 and a chip bonding micro-force control structure 300. During the debugging and installation process, these two parts can ensure the parallelism between the bonding mechanism and the chip surface by rotating the rotating positioning pin 122 and other operations.

[0081] The optical communication chip bonding process has high requirements for the parallelism between the bonding mechanism and the chip. During the debugging and installation process, the parallelism between the bonding mechanism and the chip surface can be ensured by rotating the rotating positioning pin 122. The bottom angle adjustment structure 200 includes a bottom plate 101, a stopper 104 and a rotating positioning pin 122. The bottom plate 101 is used to be fixed on the other functional components; the stopper 104 is used to fine-tune the rotation of the screw to achieve the parallelism required by the process; the rotating positioning pin 122 is used for the angle rotation adjustment of the chip bonding micro-force control structure 300.

[0082] The chip bonding micro-force control structure 300 is the core structure of the micro-force control part of the optical communication chip bonding process. Its mechanism can automatically adjust different force control parameters according to the specification parameter settings of the manufacturing process chip, and can be compatible with the force control requirements of ultra-thin optical communication chips, ensuring that the chip will not be crushed or there is a risk of indentation, thereby meeting the manufacturing process requirements of slender optical communication chips. Specifically, the chip bonding micro-force control structure 300 includes a bottom angle adjustment structure 200 and a chip bonding micro-force control structure 300 arranged on the bottom angle adjustment structure 200.

[0083] The bottom base connection unit 310 includes a base 105 and a positioning pin 121, which is used to achieve connection with the bottom angle adjustment structure 200 to meet the needs of fine adjustment of parallelism.

[0084] The micro-rotary power drive unit 320 includes a photoelectric fixing frame 102, an induction flange 103, a motor flange 111, a micro-rotary motor 125, a high-torque synchronous toothed belt 120, a synchronous pulley 124 and a photoelectric switch 131; the micro-rotary motor 125 is connected to the mounting base 107 through the motor flange 111, and the tension of the high-torque synchronous toothed belt 120 on the bottom synchronous pulley 124 is adjusted through the strip hole 126 above, and when the induction flange 103 on the top rotates, the angle of the chip suction nozzle 127 is judged through the photoelectric switch 131 to achieve the angle correction of the chip.

[0085] The rotating up and down driven unit 330 is provided with a chip suction nozzle 127, a spline assembly and a suction nozzle adapter 110. The rotating up and down driven unit 330 is mainly realized by the cooperation of a high-precision spline shaft 134 and a spline seat 132. The spline shaft 134 is installed in the spline seat 132 to realize that the up and down movement and rotation do not affect each other. The spline seat 132 is installed in the mounting seat 107 after being covered with a high-torque synchronous toothed belt 120. The bottom of the spline seat 132 is installed and positioned by the bottom flange 112. After the pressure ring 116 is placed, it is fixed by the top flange 106. After placing a sealing ring on the top of the spline shaft 134, fix the spline adapter 108, and then put on the fixing ring 114. The top of the spline adapter 108 is connected to the high-speed rotating joint 123 and connected to the external vacuum tube to realize vacuum adsorption. After the second sealing ring 130 is placed between the bottom of the spline shaft 134 and the suction nozzle adapter 110, the first sealing ring 128 is also placed between the suction nozzle adapter 110 and the chip suction nozzle 127 to realize the sealing of the entire vacuum air passage.

[0086] Combination Figure 3 and Figure 7 The top of the spline shaft 134 is sealed and connected to the spline adapter 108 through the first sealing ring 128, and the nozzle adapter 110 is sealed and connected to the chip nozzle 127 through the second sealing ring 130 to ensure the vacuum degree of the vacuum pipeline, thereby ensuring the vacuum adsorption force for the chip to be processed.

[0087] The micro force control drive unit 340 is the core mechanism for realizing micro force control. The micro voice coil, i.e., the micro voice coil motor, is formed by the micro voice coil stator 135 and the micro voice coil mover 117 to provide micro force control. The voice coil motor is the Voice Coil Motor. The principle is that a power-carrying coil placed in a magnetic field will generate a force, and the magnitude of the force is proportional to the current applied to the coil. It has the advantages of simple structure, small size, high speed, high acceleration, and fast response. The micro voice coil stator 135 is fixed on the mounting seat 107. The micro voice coil mover 117 is connected to the mover fixing seat 109 on the micro guide rail 118 to achieve up and down movement in the Z direction, driving the bearing assembly 119 to move up and down, so as to drive the up and down movement of the rotating up and down driven unit 330. In the actual optical communication chip production and manufacturing process, during the suction and handling process, the micro force control drive unit 340 only provides the required downward force control, and the displacement control is the independent Z-axis movement.

[0088] This design, through the parameter setting of the micro force control unit, can meet the requirements of adsorption downward pressure in the production and manufacturing of optical communication chips of different specifications, and realize precise force control of ±1g. This method is obviously simple and easy to debug, and can meet any force control requirements of 0-20g. For example, during the incoming material process of optical communication chips, the downward pressure force during adsorption also needs to be precisely controlled through the cooperation of the ejector pin. The micro force control unit can meet this process requirement, which can reduce the indentation and fracturing in the process.

[0089] In one embodiment, a chip loading device includes a conveying device, a lifting device, and a chip bonding micro-force control device 100 described in any embodiment; the conveying device is used to transport the chip to be loaded; the lifting device is used to lift the chip to be loaded from below; the chip bonding micro-force control device 100 is located above the lifting device and is used to absorb the chip to be loaded. In one embodiment, the lifting device is arranged under the conveying device, and the chip bonding micro-force control device 100 is arranged on the conveying device. Such a design, through the cooperation of the micro-rotating power drive unit 320, the rotating up and down driven unit 330 and the micro-force control drive unit 340, can, on the one hand, realize precise force control of the suction downward pressure of the chip in the bonding process, which is particularly suitable for the bonding process requirements of optical communication chips, greatly reducing the indentation and cracking in the suction process, thereby ensuring the yield rate of the product; on the other hand, it has the advantages of being simple, easy to debug and easy to apply. In the application, the parameters of the micro-force control drive unit 340 can be set to meet the requirements of the adsorption downward pressure in the production and manufacturing of optical communication chips of different specifications, thereby realizing precise force control and meeting any force control requirements within a certain range.

[0090] As an example, the chip loading equipment includes a conveying device, a lifting device and a chip bonding micro-force control device 100, the chip bonding micro-force control device 100 includes a bottom angle adjustment structure 200 and a chip bonding micro-force control structure 300 arranged on the bottom angle adjustment structure 200; the chip bonding micro-force control structure 300 includes a bottom base connection unit 310, a micro-rotational power drive unit 320, a rotating up and down driven unit 330 and a micro-force control drive unit 340; wherein, the rotating up and down driven unit 330 is provided with a chip suction nozzle 127; the bottom base connection unit 310 is arranged on the bottom angle adjustment structure The micro-rotational power drive unit 320 is connected to the bottom base connection unit 310 and the rotating upper and lower driven unit 330, respectively, for sensing and correcting the angle of the chip suction nozzle 127; the rotating upper and lower driven unit 330 is connected to the bottom base connection unit 310 and the micro-force control drive unit 340, respectively, for adjusting the position of the chip suction nozzle 127; the micro-force control drive unit 340 is connected to the bottom base connection unit 310, for adjusting the position of the rotating upper and lower driven unit 330 to control the downward pressure of the chip suction nozzle 127. The remaining embodiments are similar and will not be elaborated. It can be understood that since the chip loading equipment includes the chip bonding micro-force control device 100 described in any embodiment, it also has the advantages of each chip bonding micro-force control device 100, which will not be elaborated here.

[0091] It should be noted that other embodiments of the present application also include a chip bonding micro-force control device and a chip loading equipment that can be implemented by combining the technical features in the above embodiments.

[0092] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0093] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A chip bonding micro-force control device (100), characterized in that: It comprises a bottom angle adjustment structure (200) and a chip bonding micro-force control structure (300) arranged on the bottom angle adjustment structure (200); The chip bonding micro force control structure (300) comprises a bottom base connection unit (310), a micro rotating power drive unit (320), a rotating upper and lower driven unit (330) and a micro force control drive unit (340); wherein the rotating upper and lower driven unit (330) is provided with a chip suction nozzle (127); The bottom base connection unit (310) is arranged on the bottom angle adjustment structure (200) and is used for adjusting its own parallelism; The micro-rotational power driving unit (320) is respectively connected to the bottom base connection unit (310) and the rotation upper and lower driven unit (330) and is used to sense and correct the angle of the chip suction nozzle (127); The rotating upper and lower driven units (330) are respectively connected to the bottom base connection unit (310) and the micro force control drive unit (340) and are used to adjust the position of the chip suction nozzle (127); The micro force control driving unit (340) is connected to the bottom base connection unit (310) and is used to adjust the position of the rotating up and down driven unit (330) to control the downward pressure of the chip suction nozzle (127); The bottom angle adjustment structure (200) comprises a bottom plate (101), a stopper (104) and a rotational positioning pin (122); the stopper (104) and the rotational positioning pin (122) are both arranged on the bottom plate (101); the bottom base connection unit (310) is rotatably connected to the rotational positioning pin (122), and the rotational range of the bottom base connection unit (310) is limited by the stopper (104).

2. The chip bonding micro-force control device (100) according to claim 1, characterized in that: The miniature force control driving unit (340) comprises a miniature voice coil motor, and the miniature voice coil motor comprises a miniature voice coil mover (117) and a miniature voice coil stator (135); One of the miniature voice coil mover (117) and the miniature voice coil stator (135) is connected to the bottom base connection unit (310), and the other is connected to the rotating up and down driven unit (330).

3. The chip bonding micro-force control device (100) according to claim 2, characterized in that: The micro force control drive unit (340) further comprises a mover fixing seat (109), a micro guide rail (118) and a bearing assembly (119); The miniature voice coil stator (135) is arranged on the bottom base connection unit (310) or its mounting seat (107), and the miniature voice coil mover (117) is fixedly connected to the mover fixing seat (109); The bearing assembly (119) is arranged on the mover fixing seat (109) and is fixedly connected to the rotating up and down driven unit (330); The mover fixing seat (109) is slidably arranged on the micro guide rail (118), and the micro guide rail (118) is arranged on the bottom base connection unit (310) or its mounting seat (107).

4. The chip bonding micro-force control device (100) according to claim 3, characterized in that: The micro force control drive unit (340) further comprises a micro reading head (133), wherein the micro reading head (133) is arranged on the bottom base connection unit (310) or its mounting seat (107) and is used to measure the moving distance of the micro voice coil mover (117) or the bearing assembly (119).

5. The chip bonding micro-force control device (100) according to claim 1, characterized in that: The rotating upper and lower driven unit (330) is also provided with a spline assembly and a suction nozzle adapter (110); The chip suction nozzle (127) is arranged under the suction nozzle adapter (110); The nozzle adapter (110) is arranged under the spline component; The spline assembly is respectively connected to the bottom base connection unit (310), the micro rotary power drive unit (320) and the micro force control drive unit (340).

6. The chip bonding micro-force control device (100) according to claim 5, characterized in that: The rotating upper and lower driven unit (330) is also provided with a high-speed rotating joint (123) and a spline adapter (108); The spline assembly comprises a spline seat (132) and a spline shaft (134); the spline seat (132) is arranged under the spline adapter (108) and is respectively connected to the bottom base connection unit (310), the micro rotary power drive unit (320) and the micro force control drive unit (340); The spline shaft (134) passes through the spline seat (132); one end of the spline shaft (134) is connected to the high-speed rotary joint (123) via the spline adapter (108); and the other end is protruded outside the spline seat (132) and connected to the suction nozzle adapter (110); The high-speed rotary joint (123) is used to connect to an external vacuum pipeline.

7. The chip bonding micro-force control device (100) according to claim 6, characterized in that: The rotating upper and lower driven unit (330) is further provided with a top flange (106), a bottom flange (112), a fixing ring (114) and a pressure ring (116); One end of the spline seat (132) is positioned and connected to the bottom base connection unit (310) or its mounting seat (107) through the bottom flange (112), and the other end passes through the pressure ring (116) and is connected to the top flange (106); The spline adapter (108) is arranged between the fixing ring (114) and the high-speed rotary joint (123), and the fixing ring (114) is used to fix the spline adapter (108) to one end of the spline shaft (134).

8. The chip bonding micro-force control device (100) according to claim 7, characterized in that: The rotating up and down driven unit (330) is also provided with a fixing seat (113) and a fixing clamp (115); The fixing seat (113) is arranged on the bottom base connection unit (310) or its mounting seat (107); The fixing clamp (115) is arranged on the fixing seat (113) and is used for clamping external cables and vacuum pipelines.

9. The chip bonding micro-force control device (100) according to any one of claims 1 to 8, characterized in that: The bottom base connection unit (310) comprises a base (105), a positioning pin (121) and a mounting seat (107); The base (105) is rotatably connected to the bottom angle adjustment structure (200) or its bottom plate (101); The mounting seat (107) is connected to the base (105) via the positioning pin (121).

10. A chip loading device, characterized in that: It comprises a conveying device, a lifting device and a chip bonding micro-force control device (100) as claimed in any one of claims 1 to 9; The conveying device is used to convey the chips to be loaded; The lifting device is used to lift the chip to be loaded from below; The chip bonding micro-force control device (100) is located above the lifting device and is used to absorb the chip to be loaded.

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