A polishing solution replenishment apparatus, method, and device

Abstract

The application provides a polishing liquid supplementing device, method and apparatus. The device comprises a storage tank for recycling and storing polishing liquid and providing polishing liquid for a polishing device connected with the storage tank; a data analysis apparatus for determining a first speed of supplementing the storage tank according to a stored target model and sending the first speed as a supplementing speed to a control apparatus; and the control apparatus connected with the data analysis apparatus for controlling the speed of a supplementing system supplementing the storage tank according to the supplementing speed sent by the data analysis apparatus. According to the application, the polishing liquid consumption of a polishing device is determined according to the operating parameters of the polishing device and the wear condition of a polishing pad, so as to determine the first speed of supplementing the storage tank, to realize automatic supplementing of the polishing liquid, to improve the polishing efficiency and to avoid the problem of wafer scrapping caused by untimely supplementing.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a polishing liquid replenishing device, method and apparatus. Background Art

[0002] In the double-sided polishing process of silicon wafers, polishing slurry plays a vital role in ensuring the flatness and smoothness of the polished surface. During actual operations, the polishing slurry evaporates or is lost as the operation progresses, and the amount is continuously reduced during the recovery process. This can lead to insufficient polishing slurry in the polishing equipment during operation, which in turn affects the polishing quality of the silicon wafers and may even cause the produced wafers to fail to meet quality requirements and be scrapped. Currently, manual refilling is commonly used during the silicon wafer polishing process. This method is not only inefficient but also easily leads to wafer scrapping due to untimely refilling. Summary of the Invention

[0003] The embodiments of the present invention provide a polishing liquid replenishing device, method and apparatus for solving the problem that manual replenishing is commonly used in the prior art during the polishing of silicon wafers, which is not only inefficient but also easily causes wafer scrapping due to untimely replenishment.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] In a first aspect, an embodiment of the present invention provides a polishing liquid replenishing device, comprising:

[0006] A storage tank for recovering and storing polishing liquid and providing polishing liquid to a polishing device connected to the storage tank;

[0007] A data analysis device is configured to determine a first speed for replenishing the storage tank based on a stored target model, and transmit the first speed as the replenishing speed to a control device; the output of the target model is the first speed for replenishing the storage tank, and the input of the target model includes: operating parameters of the polishing device and wear of a polishing pad in the polishing device; the operating parameters of the polishing device include: pressure applied by the polishing disk to the workpiece to be polished and a rotational speed of the polishing disk;

[0008] The control device connected to the data analysis device is used to control the speed at which the fluid replenishment system replenishes the storage tank according to the fluid replenishment speed sent by the data analysis device.

[0009] Furthermore, the device further comprises: a monitoring device;

[0010] The monitoring device is arranged near the storage tank and is used to monitor a first parameter of the polishing liquid in the storage tank; the first parameter includes at least one of the following: liquid level, temperature and pressure.

[0011] Furthermore, the data analysis device is also used for:

[0012] Obtaining a current first liquid level height of the polishing liquid in the storage tank;

[0013] Determining a second speed for replenishing the storage tank according to the first liquid level and second parameters, wherein the second parameters include: a target liquid level of the polishing liquid in the storage tank, a preset replenishment time, and a target volume of the polishing liquid per unit liquid level;

[0014] determining a sum of the first speed and the second speed as a target speed;

[0015] The target speed is sent to the control device as the fluid replenishment speed.

[0016] Furthermore, the monitoring device is further configured to: send an early warning message to the control device when the first liquid level is lower than a preset threshold;

[0017] The control device is further configured to control the fluid replenishing system to replenish the storage tank at a third speed based on the received warning information;

[0018] The third speed is greater than or equal to the target speed.

[0019] In a second aspect, an embodiment of the present invention provides a polishing liquid replenishing method, which is applied to the polishing liquid replenishing device as described above, comprising:

[0020] A prediction model is constructed, wherein the output of the prediction model is a first speed for replenishing the storage tank, and the input of the prediction model includes: operating parameters of the polishing device and wear of the polishing pad in the polishing device; the operating parameters of the polishing device include: pressure applied by the polishing disk to the workpiece to be polished and the rotational speed of the polishing disk;

[0021] Acquiring historical data of the operating parameters, and performing model training on the prediction model using the historical data to obtain a target model;

[0022] Acquire a first current operating parameter of the polishing device and a first current wear condition of the polishing pad;

[0023] determining a first speed for replenishing the storage tank according to the target model, the first operating parameter, and the first wear condition;

[0024] The storage tank is replenished with liquid using the first speed as the liquid replenishing speed.

[0025] Furthermore, the method further comprises:

[0026] Obtaining a current first liquid level height of the polishing liquid in the storage tank;

[0027] Determining a second speed for replenishing the storage tank according to the first liquid level and second parameters, wherein the second parameters include: a target liquid level of the polishing liquid in the storage tank, a preset replenishment time, and a target volume of the polishing liquid per unit liquid level;

[0028] determining a sum of the first speed and the second speed as a target speed for replenishing the storage tank;

[0029] The storage tank is replenished with fluid using the target speed as the fluid replenishment speed.

[0030] Furthermore, determining a second speed for replenishing the storage tank according to the first liquid level and the second parameter includes:

[0031] determining a replenishing volume of the polishing liquid for replenishing the storage tank according to a liquid level difference between the target liquid level and the first liquid level and the target volume;

[0032] The second speed is determined according to the fluid replenishment volume and the preset fluid replenishment time.

[0033] Furthermore, the method further comprises:

[0034] When the first liquid level is lower than a preset threshold, the storage tank is replenished with liquid at a third speed;

[0035] The third speed is greater than or equal to the target speed.

[0036] In a third aspect, an embodiment of the present invention provides a polishing liquid replenishing device, which is applied to the polishing liquid replenishing equipment described above, comprising:

[0037] A construction module is configured to construct a prediction model, wherein the output of the prediction model is a first speed for replenishing the storage tank, and the input of the prediction model includes: operating parameters of the polishing device and wear of the polishing pad in the polishing device; the operating parameters of the polishing device include: pressure applied by the polishing disk to the workpiece to be polished and the rotational speed of the polishing disk;

[0038] A first acquisition module is used to acquire historical data of the operating parameters and perform model training on the prediction model using the historical data to obtain a target model;

[0039] a second acquisition module, configured to acquire a current first operating parameter of the polishing device and a current first wear condition of the polishing pad;

[0040] a determination module, configured to determine a first speed for replenishing the storage tank according to the target model, the first operating parameter, and the first wear condition;

[0041] The liquid replenishing module is used to replenish the storage tank with liquid using the first speed as the liquid replenishing speed.

[0042] In a fourth aspect, an embodiment of the present invention provides a polishing liquid replenishing device, comprising: a transceiver, a memory, a processor, and a computer program stored in the memory and runnable on the processor. When the processor executes the computer program, the steps of the polishing liquid replenishing method as described above are implemented.

[0043] The beneficial effects of the present invention are:

[0044] The polishing liquid replenishing device of the embodiment of the present invention can determine the consumption of polishing liquid by the polishing device based on the operating parameters of the polishing device, including the pressure applied by the polishing disk on the workpiece to be polished and the rotational speed of the polishing disk, as well as the wear of the polishing pad in the polishing device, through a data analysis device, thereby determining a first speed for replenishing the storage tank, ensuring that the polishing liquid in the storage tank does not continue to decrease as the polishing device operates; and based on the first liquid level height and the second parameter, determining a second speed for replenishing the polishing liquid corresponding to the volume difference between the storage volume of the polishing liquid in the storage tank and the target storage volume, thereby replenishing the polishing liquid in the storage tank to the target storage volume. The polishing liquid replenishing device of the embodiment of the present invention realizes automatic replenishment of the polishing liquid, improves the efficiency of the polishing process, and avoids the problem of wafer scrapping due to untimely replenishment. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A schematic diagram showing a polishing liquid replenishing device according to an embodiment of the present invention;

[0046] Figure 2 A schematic diagram showing the steps of a polishing liquid replenishing method according to an embodiment of the present invention;

[0047] Figure 3 A schematic diagram showing a module of a polishing liquid replenishing device according to an embodiment of the present invention;

[0048] Figure 4 A schematic diagram of a module of a polishing liquid replenishing device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0049] To make the technical problems, technical solutions, and advantages to be solved by the present invention more apparent, a detailed description will be given below with reference to the accompanying drawings and specific embodiments. In the following description, specific details such as specific configurations and components are provided solely to facilitate a comprehensive understanding of the embodiments of the present invention. Therefore, it should be clear to those skilled in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present invention. In addition, for the sake of clarity and brevity, descriptions of known functions and configurations have been omitted.

[0050] It should be understood that references throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic associated with the embodiment is included in at least one embodiment of the present invention. Therefore, the appearances of "in one embodiment" or "in an embodiment" throughout this specification do not necessarily refer to the same embodiment. Furthermore, these particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0051] The present invention aims to provide a polishing liquid replenishing device, method and apparatus to address the problem that manual liquid replenishing is commonly used in the prior art during the silicon wafer polishing process, which is not only inefficient but also easily causes wafer scrapping due to untimely liquid replenishment.

[0052] like Figure 1 As shown, an embodiment of the present invention provides a polishing liquid replenishing device, comprising:

[0053] A storage tank 1 is used to recover and store polishing liquid and provide polishing liquid to a polishing device 2 connected to the storage tank 1;

[0054] The data analysis device 3 is configured to determine a first speed for replenishing the storage tank 1 based on the stored target model, and transmit the first speed as the replenishing speed to the control device 4; the output of the target model is the first speed for replenishing the storage tank 1, and the input of the target model includes: operating parameters of the polishing device 2 and wear of the polishing pad in the polishing device 2; the operating parameters of the polishing device 2 include: pressure applied by the polishing disk to the workpiece to be polished and the rotational speed of the polishing disk;

[0055] The control device 4 connected to the data analysis device 3 is used to control the speed at which the liquid replenishing system 5 replenishes the storage tank 1 according to the liquid replenishing speed sent by the data analysis device 3.

[0056] It should be noted that the data analysis device obtains the current operating parameters of the polishing equipment and the wear status of the polishing pad, and achieves the following through the target model: calculates the amount of polishing fluid consumed by the polishing equipment, and then determines the first speed based on the size of the fluid replenishment pipeline set between the storage tank and the polishing equipment (for example, the diameter or radius of the pipeline).

[0057] It should be noted that the target model is a model obtained by learning and training based on the operating parameters of the polishing equipment and the historical data of the wear state of the polishing pad.

[0058] Optionally, the wear condition of the polishing pad is the thickness of the polishing pad that is worn away.

[0059] Optionally, if the polishing device is a single-side polishing device, the pressure applied to the workpiece to be polished is the pressure applied by the polishing disc and the supporting platform supporting the workpiece to be polished;

[0060] If the polishing device is a double-sided polishing device, the pressure applied to the workpiece to be polished is the pressure applied between the two polishing discs.

[0061] It should be noted that, the greater the pressure applied by the polishing disc to the workpiece to be polished, the greater the amount of polishing liquid consumed during the polishing process; the greater the rotation speed of the polishing disc, the greater the amount of polishing liquid consumed during the polishing process.

[0062] Optionally, the control device may be a flow rate control valve;

[0063] The flow rate of the polishing liquid in the liquid replenishing pipeline is controlled by the control device.

[0064] The polishing liquid replenishing device of an embodiment of the present invention uses a data analysis device to determine the polishing liquid consumption of the polishing device based on the operating parameters of the polishing device, including the pressure applied by the polishing disk on the workpiece to be polished and the rotational speed of the polishing disk, as well as the wear of the polishing pad in the polishing device. This determines the first rate at which the storage tank is replenished, ensuring that the polishing liquid in the storage tank does not continue to decrease as the polishing device operates. The polishing liquid replenishing device of an embodiment of the present invention achieves automatic replenishment of the polishing liquid, improving the efficiency of the polishing process while avoiding the problem of wafer scrapping due to untimely replenishment.

[0065] Optionally, the device further comprises: 6 monitoring device;

[0066] The monitoring device 6 is disposed near the storage tank 1 and is used to monitor a first parameter of the polishing liquid in the storage tank 1 ; the first parameter includes at least one of the following: liquid level, temperature, and pressure.

[0067] Optionally, the pressure of the polishing liquid in the storage tank is the pressure brought by the polishing liquid on the bottom of the storage tank.

[0068] In the embodiment of the present invention, the first parameter is the liquid level height;

[0069] The liquid level height can be used to quickly determine the remaining amount of polishing liquid in the storage tank, thereby performing real-time monitoring of the polishing liquid in the storage tank, thereby avoiding the problem of too little polishing liquid in the storage tank to meet the needs of the polishing equipment, resulting in scrapped wafers.

[0070] In an embodiment of the present invention, the first parameter is pressure; based on the pressure, the remaining amount of polishing liquid in the storage tank can be determined, thereby performing real-time monitoring of the polishing liquid in the storage tank to avoid the problem of wafer scrapping caused by too little polishing liquid in the storage tank to meet the needs of the polishing equipment.

[0071] In the embodiment of the present invention, the first parameter is the liquid level and temperature of the polishing liquid in the storage tank;

[0072] The remaining amount of the polishing liquid in the storage tank can be quickly determined by the liquid level height, thereby achieving real-time monitoring of the polishing liquid in the storage tank;

[0073] By monitoring the temperature of the polishing liquid in the storage tank, when the temperature of the polishing liquid is higher than a first preset threshold, an instruction message is sent to the control device; when the storage tank is replenished, the storage tank is instructing to replenish the storage tank with polishing liquid at a first target temperature, or to cool the polishing liquid, thereby reducing the temperature of the polishing liquid in the storage tank; when the temperature of the polishing liquid is lower than a second preset threshold, an instruction message is sent to the control device, instructing to replenish the storage tank with polishing liquid at a second target temperature, or to heat the polishing liquid, thereby increasing the temperature of the polishing liquid in the storage tank.

[0074] In the embodiment of the present invention, the first parameter is the pressure and temperature of the polishing liquid in the storage tank;

[0075] The remaining amount of the polishing liquid in the storage tank can be determined by the pressure, thereby achieving real-time monitoring of the polishing liquid in the storage tank;

[0076] By monitoring the temperature of the polishing liquid in the storage tank, when the temperature of the polishing liquid is higher than a first preset threshold, an instruction message is sent to the control device; when the storage tank is replenished, the storage tank is instructing to replenish the storage tank with polishing liquid at a first target temperature, or to cool the polishing liquid, thereby reducing the temperature of the polishing liquid in the storage tank; when the temperature of the polishing liquid is lower than a second preset threshold, an instruction message is sent to the control device, instructing to replenish the storage tank with polishing liquid at a second target temperature, or to heat the polishing liquid, thereby increasing the temperature of the polishing liquid in the storage tank.

[0077] The polishing liquid replenishing equipment of the embodiment of the present invention monitors the liquid level height or pressure in the storage tank through a monitoring device, can determine the remaining amount of polishing liquid in the storage tank, and can control the temperature of the polishing liquid by monitoring the temperature of the polishing liquid in the storage tank, thereby avoiding the polishing liquid temperature being too high or too low, resulting in the scrapping of the polished wafers.

[0078] Optionally, the data analysis device 3 is further configured to:

[0079] Obtaining a current first liquid level height of the polishing liquid in the storage tank 1;

[0080] determining a second speed for replenishing the storage tank 1 based on the first liquid level and second parameters, wherein the second parameters include: a target liquid level of the polishing liquid in the storage tank 1, a preset replenishment time, and a target volume of the polishing liquid per unit liquid level; and determining the sum of the first speed and the second speed as the target speed;

[0081] The target speed is sent to the control device 4 as the fluid replenishment speed.

[0082] Optionally, the first speed and the second speed are volumes of polishing liquid replenished to the storage tank per unit time.

[0083] It should be noted that replenishing the storage tank at the first speed can ensure that the replenishing speed is equal to the consumption speed of the polishing liquid by the polishing equipment, so that the polishing liquid in the storage tank is at a stable liquid level.

[0084] Based on the first liquid level height and the second parameter, the volume difference between the storage amount of the polishing liquid in the storage tank and the target storage amount can be determined, and then based on the volume difference, the second speed for replenishing the storage tank can be determined, so that the polishing liquid in the storage tank can be quickly replenished to the target storage amount.

[0085] Optionally, the second speed is the quotient of the first product and the preset fluid infusion time;

[0086] Wherein, the first product is the product of the liquid level difference and the target volume;

[0087] The liquid level difference is the liquid level difference between the target liquid level and the first liquid level.

[0088] It should be noted that the first product is the volume difference between the remaining amount of the polishing liquid in the storage tank and the target storage amount;

[0089] The second speed is determined by the quotient of the volume difference and the preset fluid replenishment time.

[0090] In the embodiment of the present application, the preset replenishment time is 5-10 minutes; the preset replenishment time is determined according to the preparation time of each polishing process;

[0091] After each polishing process, the first liquid level is obtained; during the preparation period (for example, during the wafer placement) of the next polishing process, the storage tank is replenished at the second speed; or,

[0092] After each polishing process, the first liquid level is obtained; after starting polishing, the storage tank is replenished at the target speed.

[0093] The polishing liquid replenishment equipment of the embodiment of the present application can determine the second speed of the polishing liquid for replenishing the volume difference between the storage amount and the target storage amount of the polishing liquid in the storage tank according to the first liquid level and the second parameter, so that the polishing liquid in the storage tank can be quickly replenished to the target storage amount; the target speed determined according to the first speed and the second speed can ensure the consumption of the polishing liquid of the polishing equipment while replenishing the liquid level of the polishing liquid in the storage tank to the target liquid level within the preset replenishment time.

[0094] Optionally, the monitoring device 6 is further used for: in the case that the first liquid level is lower than a preset threshold, sending a warning information to the control device 4;

[0095] The control device 4 is further used for controlling the replenishment system 5 to replenish the storage tank 1 at a third speed according to the received warning information;

[0096] The third speed is greater than or equal to the target speed.

[0097] Optionally, the first liquid level is lower than a preset threshold, that is, the polishing liquid in the storage tank has been consumed or the remaining amount has failed to meet the working requirements of the polishing equipment, and if not replenished in time, it will cause the wafer to be scrapped during the wafer polishing process.

[0098] As shown in FIG. 1, Figure 2 The embodiment of the present application provides a polishing liquid replenishment method, which is applied to the polishing liquid replenishment equipment as described above, and includes the following steps:

[0099] Step 201, a prediction model is constructed, the output of the prediction model is a first speed of replenishing the storage tank, and the input of the prediction model includes: operating parameters of the polishing equipment and wear conditions of a polishing pad in the polishing equipment; the operating parameters of the polishing equipment include: a pressure applied by a polishing disc to a workpiece to be polished and a rotating speed of the polishing disc;

[0100] Step 202: Obtain historical data of the operating parameters, and perform model training on the prediction model using the historical data to obtain a target model;

[0101] Step 203, obtaining a first current operating parameter of the polishing device and a first current wear condition of the polishing pad;

[0102] Step 204: determining a first speed for replenishing the storage tank according to the target model, the first operating parameter, and the first wear condition;

[0103] Step 205: Replenish the liquid in the storage tank using the first speed as the liquid replenishment speed.

[0104] The polishing liquid replenishment method of an embodiment of the present invention predicts the consumption of polishing liquid under the current operating parameters of the polishing equipment, including the pressure applied by the polishing disk to the workpiece to be polished and the rotational speed of the polishing disk, using the target model. The method thus replenishes the polishing liquid in the storage tank at the first rate, ensuring that the polishing liquid in the storage tank does not continue to decrease as the polishing equipment operates. The polishing liquid replenishment method of an embodiment of the present invention achieves automatic replenishment of the polishing liquid, improving the efficiency of the polishing process while avoiding the problem of wafer scrapping due to untimely replenishment.

[0105] Optionally, the method further includes:

[0106] Obtaining a current first liquid level height of the polishing liquid in the storage tank;

[0107] Determining a second speed for replenishing the storage tank according to the first liquid level and second parameters, wherein the second parameters include: a target liquid level of the polishing liquid in the storage tank, a preset replenishment time, and a target volume of the polishing liquid per unit liquid level;

[0108] determining a sum of the first speed and the second speed as a target speed for replenishing the storage tank;

[0109] The storage tank is replenished with fluid using the target speed as the fluid replenishment speed.

[0110] The polishing liquid replenishment method of the embodiment of the present invention can determine the second speed for replenishing the polishing liquid corresponding to the volume difference between the storage amount of the polishing liquid in the storage tank and the target storage amount based on the first liquid level height and the second parameter, so that the polishing liquid in the storage tank can be quickly replenished to the target storage amount; by determining the target speed based on the first speed and the second speed, the liquid level of the polishing liquid in the storage tank can be replenished to the target liquid level height within the preset replenishment time while ensuring the consumption of the polishing liquid of the polishing equipment.

[0111] Optionally, determining a second speed for replenishing the storage tank according to the first liquid level and a second parameter includes:

[0112] determining a replenishment volume of the polishing liquid for replenishing the storage tank according to a liquid level difference between the target liquid level and the first liquid level and the target volume;

[0113] The second speed is determined according to the fluid replenishment volume and the preset fluid replenishment time.

[0114] Optionally, the second speed is the quotient of the first product and the preset fluid infusion time;

[0115] Wherein, the first product is the product of the liquid level difference and the target volume;

[0116] The liquid level difference is the liquid level difference between the target liquid level and the first liquid level.

[0117] Optionally, the method further includes:

[0118] When the first liquid level is lower than a preset threshold, the storage tank is replenished with liquid at a third speed;

[0119] The third speed is greater than or equal to the target speed.

[0120] like Figure 3 As shown, an embodiment of the present invention provides a polishing liquid replenishing device 300, which is applied to the polishing liquid replenishing equipment described above, including:

[0121] A construction module 301 is configured to construct a prediction model, wherein the output of the prediction model is a first rate of replenishing the storage tank. The input of the prediction model includes: operating parameters of the polishing device and wear of the polishing pad in the polishing device; the operating parameters of the polishing device include: pressure applied by the polishing disk to the workpiece to be polished and the rotational speed of the polishing disk;

[0122] A first acquisition module 302 is configured to acquire historical data of the operating parameters and perform model training on the prediction model using the historical data to obtain a target model;

[0123] A second acquisition module 303 is used to acquire a current first operating parameter of the polishing device and a current first wear condition of the polishing pad;

[0124] a determination module 304, configured to determine a first speed for replenishing the storage tank according to the target model, the first operating parameter, and the first wear condition;

[0125] The liquid replenishing module 305 is configured to replenish the storage tank with liquid using the first speed as the liquid replenishing speed.

[0126] like Figure 4 As shown, an embodiment of the present invention provides a product sorting device 400, which is applied to the sorting device described above, and includes: a processor 401 and a transceiver 402;

[0127] The processor 401 is configured to construct a prediction model, wherein the output of the prediction model is a first speed for replenishing the storage tank, and the input of the prediction model includes: operating parameters of the polishing device and wear of the polishing pad in the polishing device; the operating parameters of the polishing device include: pressure applied by the polishing disk to the workpiece to be polished and the rotational speed of the polishing disk;

[0128] The transceiver 402 is configured to obtain historical data of the operating parameters and perform model training on the prediction model using the historical data to obtain a target model;

[0129] Acquire a first current operating parameter of the polishing device and a first current wear condition of the polishing pad;

[0130] The processor 401 is further configured to determine a first speed for replenishing the storage tank according to the target model, the first operating parameter, and the first wear condition;

[0131] The storage tank is replenished with liquid using the first speed as the liquid replenishing speed.

[0132] The present application also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the various processes of the polishing liquid replenishment method described above and achieves the same technical effects. To avoid repetition, the details are not described here. The computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0133] An embodiment of the present application also provides a computer program product, including computer instructions. When the computer instructions are executed by a processor, the various processes of the above-mentioned polishing liquid replenishment method embodiment are implemented and can achieve the same technical effect. To avoid repetition, they will not be repeated here.

[0134] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary personnel in this technical field, several improvements and modifications can be made without departing from the principles described in the present invention. These improvements and modifications are also within the scope of protection of the present invention.

Claims

1. A polishing liquid replenishing device, characterized in that: include: A storage tank for recovering and storing polishing liquid and providing polishing liquid to a polishing device connected to the storage tank; a data analysis device, configured to determine a first speed for replenishing the storage tank according to the stored target model, and send the first speed as the replenishing speed to the control device; The output of the target model is a first speed for replenishing the storage tank, and the input of the target model includes: operating parameters of the polishing equipment and wear of the polishing pad in the polishing equipment; the operating parameters of the polishing equipment include: the pressure applied by the polishing disk to the workpiece to be polished and the rotation speed of the polishing disk; The control device connected to the data analysis device is used to control the speed at which the fluid replenishment system replenishes the storage tank according to the fluid replenishment speed sent by the data analysis device; Wherein, the device further comprises: a monitoring device; The monitoring device is disposed near the storage tank and is used to monitor a first parameter of the polishing liquid in the storage tank; the first parameter includes a liquid level; The data analysis device is also used for: Obtaining a current first liquid level height of the polishing liquid in the storage tank; Determining a second speed for replenishing the storage tank according to the first liquid level and second parameters, wherein the second parameters include: a target liquid level of the polishing liquid in the storage tank, a preset replenishment time, and a target volume of the polishing liquid per unit liquid level; determining a sum of the first speed and the second speed as a target speed; The target speed is sent to the control device as the fluid replenishment speed.

2. The polishing liquid replenishing device according to claim 1, characterized in that: The first parameter also includes at least one of the following: temperature and pressure.

3. The polishing liquid replenishing device according to claim 1, characterized in that: The monitoring device is further configured to: send an early warning message to the control device when the first liquid level is lower than a preset threshold; The control device is further configured to control the fluid replenishing system to replenish the storage tank at a third speed based on the received warning information; The third speed is greater than or equal to the target speed.

4. A polishing liquid replenishing method, applied to the polishing liquid replenishing device according to any one of claims 1 to 3, characterized in that: include: A prediction model is constructed, wherein the output of the prediction model is a first speed for replenishing the storage tank, and the input of the prediction model includes: operating parameters of the polishing device and wear of the polishing pad in the polishing device; the operating parameters of the polishing device include: pressure applied by the polishing disk to the workpiece to be polished and the rotational speed of the polishing disk; Acquiring historical data of the operating parameters, and performing model training on the prediction model using the historical data to obtain a target model; Acquire a current first operating parameter of the polishing device and a current first wear condition of the polishing pad; determining a first speed for replenishing the storage tank according to the target model, the first operating parameter, and the first wear condition; The storage tank is replenished with liquid using the first speed as the liquid replenishing speed.

5. The polishing liquid replenishing method according to claim 4, characterized in that: The method further comprises: Obtaining a current first liquid level height of the polishing liquid in the storage tank; Determining a second speed for replenishing the storage tank according to the first liquid level and second parameters, wherein the second parameters include: a target liquid level of the polishing liquid in the storage tank, a preset replenishment time, and a target volume of the polishing liquid per unit liquid level; determining a sum of the first speed and the second speed as a target speed for replenishing the storage tank; The storage tank is replenished with fluid using the target speed as the fluid replenishment speed.

6. The polishing liquid replenishing method according to claim 5, characterized in that: Determining a second speed for replenishing the storage tank according to the first liquid level and the second parameter includes: determining a replenishment volume of the polishing liquid for replenishing the storage tank according to a liquid level difference between the target liquid level and the first liquid level and the target volume; The second speed is determined according to the fluid replenishment volume and the preset fluid replenishment time.

7. The polishing liquid replenishing method according to claim 5, characterized in that: The method further comprises: When the first liquid level is lower than a preset threshold, the storage tank is replenished with liquid at a third speed; The third speed is greater than or equal to the target speed.

8. A polishing liquid replenishing device, applied to the polishing liquid replenishing equipment according to any one of claims 1 to 3, characterized in that: include: A construction module is configured to construct a prediction model, wherein the output of the prediction model is a first speed for replenishing the storage tank, and the input of the prediction model includes: operating parameters of the polishing device and wear of the polishing pad in the polishing device; the operating parameters of the polishing device include: pressure applied by the polishing disk to the workpiece to be polished and the rotational speed of the polishing disk; A first acquisition module is used to acquire historical data of the operating parameters and perform model training on the prediction model using the historical data to obtain a target model; a second acquisition module, configured to acquire a current first operating parameter of the polishing device and a current first wear condition of the polishing pad; a determination module, configured to determine a first speed for replenishing the storage tank according to the target model, the first operating parameter, and the first wear condition; The liquid replenishing module is used to replenish the storage tank with liquid using the first speed as the liquid replenishing speed.

9. A polishing liquid replenishing device, comprising: A transceiver, a memory, a processor, and a computer program stored in the memory and runnable on the processor, characterized in that when the processor executes the computer program, the steps of the polishing liquid replenishment method as described in any one of claims 4 to 7 are implemented.

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