Device processing quality control method and system based on quartz device processing drawing library

Abstract

The present invention relates to the technical field of quartz device processing, and is a device processing quality control method and system based on a quartz device processing drawing library. The specific method comprises: establishing a library of drawings to be processed of quartz devices; establishing a three-dimensional digital model of the quartz devices according to processing guidance data, searching and matching the library of drawings to be processed of the quartz devices with a library of historical processing drawings of quartz devices in a quartz processing plant; dynamically adjusting and planning a processing route of the quartz devices to be processed; and collecting processing parameters in a manual processing process; importing the processing parameters in the manual processing process into a processing quality verification strategy, and executing a quality correction strategy based on the quality verification data. The present invention solves the problem in the prior art that, during the processing of quartz devices, information lag occurs between various processing steps in the transmission of processing drawings, resulting in many errors and low processing efficiency during the processing.

Description

Technical Field

[0001] The present invention relates to the technical field of drawing management, and is a device processing quality control method and system based on a quartz device processing drawing library. Background Art

[0002] Drawings are very important technical information for manufacturing companies. The processing drawings of quartz processing companies often have the special characteristics of customized drawings, large discrete quantities, and high accuracy. As the starting point of quartz device processing and production, drawings play a guiding role in the planning of quartz processing procedures, the procurement of quartz raw materials, and other business processes. How to take appropriate measures to ensure the accuracy, uniqueness, and security of drawings is an industry challenge currently facing the quartz industry.

[0003] For example, a Chinese patent with publication number CN104268672A discloses a management method for electronic drawings of wood floor processing tools and its classification steps, including a first-level folder, the first-level folder contains a second-level folder, the second-level folder includes board model, process flow chart, assembly drawing, theoretical blade diagram of tool matching, actual blade diagram of tool matching and cutter head diagram folders, the second-level folder contains a third-level folder, the third-level folder includes board model, process flow, assembly drawing, theoretical blade diagram of tool matching, actual blade diagram of tool matching and cutter head diagram sub-folders, the third-level folder contains a fourth-level folder, the fourth-level folder includes board model, process flow, assembly drawing, theoretical blade diagram of tool matching, actual blade diagram of tool matching, which are followed by digital codes respectively, and contains board type information, equipment information, customer information, and cutter head processing drawing information files, and the fourth-level folder contains a fifth-level file.

[0004] In the above patent, as the number of files increases, it becomes difficult to manage and maintain the multi-level folder structure, and the transmission of processing drawings will cause problems such as loss or confusion of processing information among various processing departments. Summary of the Invention

[0005] The technical problem to be solved by the present invention is that in the prior art, during the processing of quartz devices, there is a phenomenon of information lag between the various processing steps in the transmission of processing drawings, which leads to many errors in the processing process. At the same time, the drawings are sent to various departments for processing in a unified order, resulting in low processing efficiency. A device processing quality control method and system based on a quartz device processing drawing library are proposed.

[0006] In order to achieve the above-mentioned object, the technical solution of the device processing quality control method based on the quartz device processing drawing library of the present invention includes the following steps:

[0007] S1: Collect the drawings of the quartz devices to be processed in the project order, extract the processing guidance data in the drawings, and establish a library of the drawings of the quartz devices to be processed;

[0008] S2: Building a three-dimensional digital model of the quartz device based on the processing guidance data, cutting the three-dimensional digital model, and searching and matching the quartz device to-be-processed drawing library with the quartz device historical processing drawing library of the quartz processing plant;

[0009] S3: Importing the search matching data into the minimum machine processing unit similarity calculation strategy to determine the process similarity level of the quartz device to be processed, and dynamically adjusting and planning the processing route of the quartz device to be processed;

[0010] S4: extracting the processing route of the quartz device to be processed after dynamic adjustment planning, and collecting the processing parameters during the manual processing process;

[0011] S5: Import the processing parameters in the manual process into the processing quality verification strategy, and execute the quality correction strategy according to the quality verification data.

[0012] Specifically, in S1, the processing guidance data includes: dimension data, shape data, hole position and aperture data, surface roughness standards, and material specifications; the dimension data includes the length, width, and height of the device; the shape data includes the curve, angle, and chamfer of the quartz device; the hole position and aperture data includes the position, size, and shape of each aperture on the quartz device; the surface roughness standards include the smoothness and roughness of the device surface; the material specifications include the type, strength, and transparency of the quartz material used;

[0013] In S2, the quartz device historical processing drawing library of the quartz processing plant includes: a quartz device machine processing database and a quartz device manual processing database.

[0014] Specifically, S3 includes the following specific steps:

[0015] S31: Obtaining a model component of a three-dimensional digital model of a quartz device to be processed after digital cutting;

[0016] S32: Inputting a minimum processing unit search instruction into the quartz device machining database, and searching for the minimum processing unit constituting the quartz device to be machined and the historical machining process data of each minimum processing unit according to the minimum machining unit similarity calculation strategy;

[0017] S33: extracting the minimum processing unit similarity data, and determining the similarity level of the machine processing process to obtain the process similarity level of the quartz device to be processed;

[0018] S34: dynamically adjusting and planning a processing route of the quartz device to be processed according to the process similarity level of the quartz device to be processed;

[0019] The minimum processing unit includes: basic geometric shapes, local holes and grooves, and specific processing areas.

[0020] Specifically, in S32, the minimum machine processing unit similarity calculation strategy is as follows:

[0021]

[0022] Among them, S1 is the minimum machine processing unit similarity;

[0023] i,j are both subscripts. After digital cutting, the three-dimensional digital model of the quartz device to be processed obtains I model parts. There are J minimum machining units in the quartz device machining database; i≤I, j≤J;

[0024] n i The i-th model component of the three-dimensional digital model of the quartz device to be processed after digital cutting;

[0025] m j is the jth minimum machining unit in the quartz device machining database;

[0026] ∩,∪ are the symbols of intersection and union respectively;

[0027] w[∩] is the number of data in the intersection of the data sets;

[0028] w[∪] is the number of data in the union of the datasets.

[0029] Specifically, the S33 further includes the following specific steps:

[0030] S331: Determine the similarity level of machining processes;

[0031] when When the similarity level of the machine processing technology of the quartz device to be processed is determined to be similar, step S332 is executed;

[0032] when When the similarity level of the machine processing technology of the quartz device to be processed is determined to be dissimilar, step S333 is executed;

[0033] S332: The minimum processing unit of the quartz device to be processed and the historical processing process data of each minimum processing unit are preferentially transmitted to the machine processing line data cloud of the quartz processing plant, so that the machine processing line can perform priority processing according to the historical processing process data;

[0034] S333: Input a minimum processing unit search instruction into the quartz device manual processing database, and calculate the minimum manual processing unit similarity according to the minimum manual processing unit similarity calculation strategy. The minimum manual processing unit similarity calculation strategy is:

[0035]

[0036] Among them, S2 is the minimum manual processing unit similarity;

[0037] q and p are both subscripts. There are Q model parts in the 3D digital model of the quartz device to be processed that are not matched to the minimum machine processing unit. There are P minimum manual processing units in the manual processing database of quartz devices. q≤Q, p≤P.

[0038] X q is the qth model component among the model components that are not matched to the minimum machine processing unit;

[0039] Y p is the pth minimum manual processing unit in the quartz device manual processing database;

[0040] S334: Determine the similarity level of manual processing technology;

[0041] when When the similarity level of the manual processing technology of the quartz device to be processed is determined to be similar, step S335 is executed;

[0042] when When the similarity level of the manual processing technology of the quartz device to be processed is determined to be dissimilar, step S336 is executed;

[0043] S335: The minimum processing unit of the quartz device to be processed and the historical processing data of each minimum processing unit are preferentially transmitted to the data cloud of the manual processing department of the quartz processing plant. At the same time, the minimum processing unit and the historical processing data of each minimum processing unit are preferentially assigned to skilled workers with processing experience of less than or equal to 3 years.

[0044] S336: Model cloning is performed on the model components of the three-dimensional digital models of the Q quartz devices to be processed, and the cloned model components are updated to the quartz device manual processing database of the quartz processing factory. At the same time, the model components of the three-dimensional digital models of the Q quartz devices to be processed are preferentially allocated to technical workers with more than 3 years of processing experience.

[0045] Specifically, in S4, the processing parameters in the manual process include: the usage parameters of the processing equipment used by technical workers during the processing, and the usage parameters of the processing equipment include: the actual processing speed of a single model component, the actual processing temperature of a single model component, the actual processing pressure of a single model component, and the actual cleaning and cooling time of a single model component.

[0046] Specifically, the S5 includes the following specific steps:

[0047] S51: Importing the processing parameters in the manual processing process into the processing quality verification strategy, and calculating the processing quality verification value. The processing quality verification strategy is:

[0048]

[0049] Among them, θ is the processing quality check value;

[0050] R is the number of model components found in the manual processing database of quartz devices, r is the subscript; r≤R;

[0051] v r ,v r ′ are the actual processing speed of a single model component and the historical processing speed in the historical processing data;

[0052] T r ,T r ′ are the actual processing temperature of a single model component and the historical processing temperature in the historical processing data;

[0053] G r ,G r ′ are the actual processing pressure of a single model component and the historical processing pressure in the historical processing data;

[0054] L r ,L r ' are the actual cleaning and cooling time of a single model component and the historical cleaning and cooling time in the historical processing data;

[0055] S52: extracting the processing quality check value, making a processing quality judgment, and executing a quality correction strategy;

[0056] When θ<2.67, it is judged that the technician's processing quality of the quartz device is qualified and the manual processing is completed;

[0057] When θ≥2.67, it is judged that the technician's processing quality of the quartz device is unqualified, and feedback is given to a skilled worker with more than 3 years of processing experience to repeat the processing.

[0058] In addition, the device processing quality control system based on the quartz device processing drawing library of the present invention includes the following modules:

[0059] Module for constructing the drawing library to be processed, module for searching and matching, module for planning the processing route, module for extracting processing parameters, and module for checking processing quality;

[0060] The module for constructing a library of drawings to be processed is used to collect drawings of quartz devices to be processed in project orders, extract processing guidance data from the drawings to be processed, and establish a library of drawings to be processed of quartz devices;

[0061] The search and matching module establishes a three-dimensional digital model of the quartz device according to the processing guidance data, performs cutting processing on the three-dimensional digital model, and searches and matches the quartz device to-be-processed drawing library with the quartz device historical processing drawing library of the quartz processing plant;

[0062] The processing route planning module is used to import the search matching data into the minimum machine processing unit similarity calculation strategy, judge the process similarity level of the quartz device to be processed, and dynamically adjust and plan the processing route of the quartz device to be processed;

[0063] The processing parameter extraction module is used to extract the processing route of the quartz device to be processed after dynamic adjustment planning, and collect the processing parameters during the manual processing process;

[0064] The processing quality check module is used to import the processing parameters in the manual process into the processing quality check strategy, and execute the quality correction strategy according to the quality check data.

[0065] A storage medium stores instructions, and when a computer reads the instructions, the computer is caused to execute the device processing quality control method based on a quartz device processing drawing library.

[0066] An electronic device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the device processing quality control method based on the quartz device processing drawing library is implemented.

[0067] Compared with the prior art, the technical effects of the present invention are as follows:

[0068] 1. The present invention automatically extracts processing guidance data and establishes a three-dimensional digital model, saving labor costs and time and improving work efficiency.

[0069] 2. By matching with the historical drawing library of the quartz processing plant, the present invention can timely understand the similarity level of the processing technology planning, thereby avoiding duplication of work or processing errors.

[0070] 3. The present invention dynamically adjusts the processing route and can flexibly adjust it according to actual conditions to improve processing quality and efficiency.

[0071] 4. The present invention can timely discover and correct processing quality problems by collecting manual process processing parameters and implementing quality correction strategies to ensure controllable product quality.

[0072] 5. The present invention integrates digital technology and manual process experience, which can better combine the advantages of both and improve the precision and stability of quartz device processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0073] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0074] in:

[0075] Figure 1 Schematic diagram of the process of the device processing quality control method based on the quartz device processing drawing library of the present invention;

[0076] Figure 2 It is a structural schematic diagram of the device processing quality control system based on the quartz device processing drawing library of the present invention. DETAILED DESCRIPTION

[0077] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0078] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0079] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive of other embodiments.

[0080] Example 1

[0081] like Figure 1 As shown, the device processing quality control method based on the quartz device processing drawing library according to the embodiment of the present invention includes the following specific steps:

[0082] S1: Collect the drawings of the quartz devices to be processed in the project order, extract the processing guidance data in the drawings, and establish a library of the drawings of the quartz devices to be processed.

[0083] In S1, the processing guidance data includes: dimension data, shape data, hole position and aperture data, surface roughness standards, and material specifications; the dimension data includes the length, width, and height of the device; the shape data includes: the curve, angle, and chamfer of the quartz device; the hole position and aperture data includes the position, size, and shape of each aperture on the quartz device; the surface roughness standards include the smoothness and roughness of the device surface; the material specifications include: the type, strength, and transparency of the quartz material used.

[0084] S2: A three-dimensional digital model of the quartz device is established according to the processing guidance data, and the three-dimensional digital model is cut and processed. The drawing library of the quartz device to be processed is searched and matched with the historical processing drawing library of the quartz device of the quartz processing plant.

[0085] In S2, the quartz device historical processing drawing library of the quartz processing plant includes: a quartz device machine processing database and a quartz device manual processing database.

[0086] S3: Import the search matching data into the minimum machine processing unit similarity calculation strategy to judge the process similarity level of the quartz device to be processed, and dynamically adjust and plan the processing route of the quartz device to be processed.

[0087] S3 includes the following specific steps:

[0088] S31: Obtaining a model component of the three-dimensional digital model of the quartz device to be processed after digital cutting.

[0089] S32: Inputting a minimum processing unit search instruction into the quartz device machining database, and searching for the minimum processing unit constituting the quartz device to be machined and the historical machining process data of each minimum processing unit according to the minimum machining unit similarity calculation strategy.

[0090] S33: Extracting the minimum processing unit similarity data and determining the similarity level of the machine processing technology.

[0091] S34: Dynamically adjust and plan the processing route of the quartz device to be processed according to the process similarity level of the quartz device to be processed.

[0092] The minimum processing unit includes: basic geometric shapes, local holes and grooves, and specific processing areas.

[0093] In S32, the minimum machine processing unit similarity calculation strategy is as follows:

[0094]

[0095] Among them, S1 is the minimum machine processing unit similarity.

[0096] i and j are both subscripts. After digital cutting, the three-dimensional digital model of the quartz device to be processed obtains I model parts in total. There are J minimum machining units in the quartz device machining database, i≤I, j≤J.

[0097] n i is the i-th model component of the three-dimensional digital model of the quartz device to be processed after digital cutting.

[0098] m j is the jth minimum machining unit in the quartz device machining database.

[0099] ∩ and ∪ are the symbols of intersection and union respectively.

[0100] w[∩] is the number of data in the intersection of the data sets;

[0101] w[∪] is the number of data in the union of the datasets.

[0102] The S33 further includes the following specific steps:

[0103] S331: Determine the similarity level of machining processes.

[0104] when When it is determined that the machining process similarity level of the quartz device to be processed is similar, step S332 is executed.

[0105] when When the similarity level of the machine processing technology of the quartz device to be processed is determined to be dissimilar, step S333 is executed.

[0106] S332: The minimum processing unit of the quartz device to be processed and the historical processing process data of each minimum processing unit are preferentially transmitted to the machine processing line data cloud of the quartz processing plant, so that the machine processing line can perform priority processing according to the historical processing process data.

[0107] S333: Input a minimum processing unit search instruction into the quartz device manual processing database, and calculate the minimum manual processing unit similarity according to the minimum manual processing unit similarity calculation strategy. The minimum manual processing unit similarity calculation strategy is:

[0108]

[0109] Among them, S2 is the minimum manual processing unit similarity.

[0110] q and p are both subscripts. There are Q model parts in the three-dimensional digital model of the quartz device to be processed that are not matched to the minimum machine processing unit. There are P minimum manual processing units in the quartz device manual processing database, q≤Q, p≤P.

[0111] X q is the qth model component among the model components that are not matched to the minimum machine processing unit;

[0112] Y p It is the pth minimum manual processing unit in the quartz device manual processing database.

[0113] S334: Determine the similarity level of manual processing technology.

[0114] when When the similarity level of the manual processing technology of the quartz device to be processed is determined to be similar, step S335 is executed.

[0115] when When the similarity level of the manual processing technology of the quartz device to be processed is determined to be dissimilar, step S336 is executed.

[0116] S335: The minimum processing unit of the quartz device to be processed and the historical processing technology data of each minimum processing unit are preferentially transmitted to the data cloud of the manual processing department of the quartz processing plant. At the same time, the minimum processing unit and the historical processing technology data of each minimum processing unit are preferentially allocated to technical workers with processing experience less than or equal to 3 years.

[0117] S336: Model cloning is performed on the model components of the three-dimensional digital models of the Q quartz devices to be processed, and the cloned model components are updated to the quartz device manual processing database of the quartz processing factory. At the same time, the model components of the three-dimensional digital models of the Q quartz devices to be processed are preferentially allocated to technical workers with more than 3 years of processing experience.

[0118] S4: extracting the processing route of the quartz device to be processed after dynamic adjustment planning, and collecting the processing parameters during the manual processing process.

[0119] In S4, the processing parameters in the manual process include: the usage parameters of the processing equipment used by technical workers during the processing, and the usage parameters of the processing equipment include: the actual processing speed of a single model component, the actual processing temperature of a single model component, the actual processing pressure of a single model component, and the actual cleaning and cooling time of a single model component.

[0120] S5: Import the processing parameters in the manual process into the processing quality verification strategy, and execute the quality correction strategy according to the quality verification data.

[0121] The S5 includes the following specific steps:

[0122] S51: Importing the processing parameters in the manual processing process into the processing quality verification strategy, and calculating the processing quality verification value. The processing quality verification strategy is:

[0123]

[0124] Among them, θ is the processing quality check value.

[0125] R is the number of model components found to be matched in the manual processing database of quartz devices, r is the subscript, r≤R.

[0126] v r ,v r ′ are the actual processing speed of a single model component and the historical processing speed in the historical processing data.

[0127] T r ,T r ′ are the actual processing temperature of a single model component and the historical processing temperature in the historical processing data.

[0128] G r ,G r ′ are the actual processing pressure of a single model component and the historical processing pressure in the historical processing data.

[0129] L r ,L r ′ are the actual cleaning and cooling time of a single model component and the historical cleaning and cooling time in the historical processing data.

[0130] S52: Extract the processing quality check value, make a processing quality judgment, and implement a quality correction strategy.

[0131] When θ<2.67, it is determined that the technician's processing quality of the quartz device is qualified and the manual processing is completed.

[0132] When θ≥2.67, it is judged that the technician's processing quality of the quartz device is unqualified, and feedback is given to a technician with more than 3 years of processing experience for reprocessing.

[0133] Example 2

[0134] like Figure 2 As shown, the device processing quality control system based on the quartz device processing drawing library according to the embodiment of the present invention includes the following modules:

[0135] Module for building the library of drawings to be processed, module for searching and matching, module for planning the processing route, module for extracting processing parameters, and module for checking processing quality.

[0136] The to-be-processed drawings library building module is used to collect to-be-processed drawings of quartz devices to be processed in project orders, extract processing guidance data from the to-be-processed drawings, and build a to-be-processed drawings library of quartz devices.

[0137] The search and matching module establishes a three-dimensional digital model of the quartz device according to the processing guidance data, performs cutting processing on the three-dimensional digital model, and searches and matches the quartz device to-be-processed drawing library with the quartz device historical processing drawing library of the quartz processing plant.

[0138] The processing route planning module is used to import the search matching data into the minimum machine processing unit similarity calculation strategy, judge the process similarity level of the quartz device to be processed, and dynamically adjust and plan the processing route of the quartz device to be processed.

[0139] The processing parameter extraction module is used to extract the processing route of the quartz device to be processed after dynamic adjustment planning, and to collect the processing parameters during the manual processing process.

[0140] The processing quality check module is used to import the processing parameters in the manual process into the processing quality check strategy, and execute the quality correction strategy according to the quality check data.

[0141] Example 3

[0142] This embodiment provides an electronic device, including: a processor and a memory, wherein the memory stores a computer program that can be called by the processor;

[0143] The processor executes the above-mentioned device processing quality control method based on the quartz device processing drawing library by calling the computer program stored in the memory.

[0144] The electronic device may have relatively large differences due to different configurations or performances, and may include one or more processors (Central Processing Units, CPU) and one or more memories, wherein the memories store at least one computer program, which is loaded and executed by the processor to implement the device processing quality control method based on the quartz device processing drawing library provided in the above method embodiment. The electronic device may also include other components for realizing the functions of the device. For example, the electronic device may also have components such as a wired or wireless network interface and an input / output interface for data input and output. This embodiment will not be described in detail here.

[0145] Example 4

[0146] This embodiment provides a computer-readable storage medium having a rewritable computer program stored thereon;

[0147] When the computer program is run on a computer device, the computer device is caused to execute the above-mentioned device processing quality control method based on the quartz device processing drawing library.

[0148] For example, computer-readable storage media can be read-only memory (ROM), random access memory (RAM), compact disc read-only memory (CD-ROM), magnetic tape, floppy disk, and optical data storage device.

[0149] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0150] It should be understood that determining B based on A does not mean determining B based solely on A. B can also be determined based on A and / or other information.

[0151] The above embodiments can be implemented in whole or in part through software, hardware, firmware, or any other combination. When implemented using software, the above embodiments can be implemented in whole or in part in the form of a computer program product. A computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer program are loaded or executed on a computer, the processes or functions according to the embodiments of the present invention are generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via a wired network or / and a wireless network. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or data center that contains a collection of one or more available media. The available media can be magnetic media (e.g., floppy disks, hard disks, tapes), optical media (e.g., DVDs), or semiconductor media. The semiconductor media can be a solid-state drive.

[0152] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed in the present invention can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.

[0153] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0154] In the several embodiments provided by the present invention, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of units is only one type. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0155] Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0156] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0157] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0158] In summary, compared with the prior art, the technical effects of the present invention are as follows:

[0159] 1. The present invention automatically extracts processing guidance data and establishes a three-dimensional digital model, saving labor costs and time and improving work efficiency.

[0160] 2. By matching with the historical drawing library of the quartz processing plant, the present invention can timely understand the similarity level of the processing technology planning, thereby avoiding duplication of work or processing errors.

[0161] 3. The present invention dynamically adjusts the processing route and can flexibly adjust it according to actual conditions to improve processing quality and efficiency.

[0162] 4. The present invention can timely discover and correct processing quality problems by collecting manual process processing parameters and implementing quality correction strategies to ensure controllable product quality.

[0163] 5. The present invention integrates digital technology and manual process experience, which can better combine the advantages of both and improve the precision and stability of quartz device processing.

[0164] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A device processing quality control method based on a quartz device processing drawing library, characterized by: The method comprises the following steps: S1: Collect the drawings of the quartz devices to be processed in the project order, extract the processing guidance data in the drawings, and establish a library of the drawings of the quartz devices to be processed; S2: Building a three-dimensional digital model of the quartz device based on the processing guidance data, cutting the three-dimensional digital model, and searching and matching the quartz device to-be-processed drawing library with the quartz device historical processing drawing library of the quartz processing plant; S3: Importing the search matching data into the minimum machine processing unit similarity calculation strategy to determine the process similarity level of the quartz device to be processed, and dynamically adjusting and planning the processing route of the quartz device to be processed; S31: Obtaining a model component of a three-dimensional digital model of a quartz device to be processed after digital cutting; S32: Inputting a minimum processing unit search instruction into the quartz device machining database, and searching for the minimum processing unit constituting the quartz device to be machined and the historical machining process data of each minimum processing unit according to the minimum machining unit similarity calculation strategy; In S32, the minimum machine processing unit similarity calculation strategy is as follows: Among them, S1 is the minimum machine processing unit similarity; i,j are both subscripts. After digital cutting, the three-dimensional digital model of the quartz device to be processed obtains I model parts. There are J minimum machining units in the quartz device machining database; i≤I, j≤J; n i The i-th model component of the three-dimensional digital model of the quartz device to be processed after digital cutting; m j is the jth minimum machining unit in the quartz device machining database; ∩,∪ are the symbols of intersection and union respectively; w[∩] is the number of data in the intersection of the data sets; w[∪] is the number of data in the union of the data sets; S33: extracting the minimum processing unit similarity data, and determining the similarity level of the machine processing process to obtain the process similarity level of the quartz device to be processed; The S33 further includes the following specific steps: S331: Determine the similarity level of machining processes; when When the similarity level of the machine processing technology of the quartz device to be processed is determined to be similar, step S332 is executed; when When the similarity level of the machine processing technology of the quartz device to be processed is determined to be dissimilar, step S333 is executed; S332: The minimum processing unit of the quartz device to be processed and the historical processing process data of each minimum processing unit are preferentially transmitted to the machine processing line data cloud of the quartz processing plant, so that the machine processing line can perform priority processing according to the historical processing process data; S333: Input a minimum processing unit search instruction into the quartz device manual processing database, and calculate the minimum manual processing unit similarity according to the minimum manual processing unit similarity calculation strategy. The minimum manual processing unit similarity calculation strategy is: Among them, S2 is the minimum manual processing unit similarity; q and p are both subscripts. There are Q model parts in the 3D digital model of the quartz device to be processed that are not matched to the minimum machine processing unit. There are P minimum manual processing units in the manual processing database of quartz devices. q≤Q, p≤P. X q is the qth model component among the model components that are not matched to the minimum machine processing unit; Y p is the pth minimum manual processing unit in the quartz device manual processing database; S334: Determine the similarity level of manual processing technology; when When the similarity level of the manual processing technology of the quartz device to be processed is determined to be similar, step S335 is executed; when When the similarity level of the manual processing technology of the quartz device to be processed is determined to be dissimilar, step S336 is executed; S335: The minimum processing unit of the quartz device to be processed and the historical processing data of each minimum processing unit are preferentially transmitted to the data cloud of the manual processing department of the quartz processing plant. At the same time, the minimum processing unit and the historical processing data of each minimum processing unit are preferentially assigned to skilled workers with processing experience of less than or equal to 3 years. S336: Model cloning is performed on the model components of the Q 3D digital models of the quartz devices to be processed, and the cloned model components are updated to the quartz device manual processing database of the quartz processing factory. At the same time, the model components of the Q 3D digital models of the quartz devices to be processed are preferentially assigned to skilled workers with more than three years of processing experience; S34: dynamically adjusting and planning a processing route of the quartz device to be processed according to the process similarity level of the quartz device to be processed; The minimum processing unit includes: basic geometric shapes, local holes and grooves, and specific processing areas; S4: extracting the processing route of the quartz device to be processed after dynamic adjustment planning, and collecting the processing parameters during the manual processing process; S5: Import the processing parameters in the manual process into the processing quality verification strategy, and execute the quality correction strategy according to the quality verification data; The S5 comprises the following steps: S51: Importing the processing parameters in the manual processing process into the processing quality verification strategy, and calculating the processing quality verification value. The processing quality verification strategy is: Among them, θ is the processing quality check value; R is the number of model components found in the manual processing database of quartz devices, r is the subscript; r≤R; v r ,v r ′ are the actual processing speed of a single model component and the historical processing speed in the historical processing data; T r ,T r ′ are the actual processing temperature of a single model component and the historical processing temperature in the historical processing data; G r ,G r ′ are the actual processing pressure of a single model component and the historical processing pressure in the historical processing data; L r ,L r ' are the actual cleaning and cooling time of a single model component and the historical cleaning and cooling time in the historical processing data; S52: extracting the processing quality check value, making a processing quality judgment, and executing a quality correction strategy; When θ<2.67, it is judged that the technician's processing quality of the quartz device is qualified and the manual processing is completed; When θ≥2.67, it is judged that the technician's processing quality of the quartz device is unqualified, and feedback is given to a skilled worker with more than 3 years of processing experience to repeat the processing.

2. The device processing quality control method based on the quartz device processing drawing library according to claim 1 is characterized in that: In S1, the processing guidance data includes: dimension data, shape data, hole position and aperture data, surface roughness standards, and material specifications; the dimension data includes the length, width, and height of the device; the shape data includes the curve, angle, and chamfer of the quartz device; the hole position and aperture data includes the position, size, and shape of each aperture on the quartz device; the surface roughness standards include the smoothness and roughness of the device surface; the material specifications include the type, strength, and transparency of the quartz material used; In S2, the quartz device historical processing drawing library of the quartz processing plant includes: a quartz device machine processing database and a quartz device manual processing database.

3. The device processing quality control method based on the quartz device processing drawing library according to claim 2 is characterized in that: In S4, the processing parameters in the manual processing process include: the parameters used by the skilled worker during the processing of the processing equipment, and the parameters used by the processing equipment include: the actual processing speed of a single model component, the actual processing temperature of a single model component, the actual processing pressure of a single model component, and the actual cleaning and cooling time of a single model component; 4. A device processing quality control system based on a quartz device processing drawing library, which is implemented based on the device processing quality control method based on a quartz device processing drawing library according to any one of claims 1 to 3, characterized in that the system includes the following modules: Module for constructing the drawing library to be processed, module for searching and matching, module for planning the processing route, module for extracting processing parameters, and module for checking processing quality; The module for constructing a library of drawings to be processed is used to collect drawings of quartz devices to be processed in project orders, extract processing guidance data from the drawings to be processed, and establish a library of drawings to be processed of quartz devices; The search and matching module establishes a three-dimensional digital model of the quartz device according to the processing guidance data, performs cutting processing on the three-dimensional digital model, and searches and matches the quartz device to-be-processed drawing library with the quartz device historical processing drawing library of the quartz processing plant; The processing route planning module is used to import the search matching data into the minimum machine processing unit similarity calculation strategy, judge the process similarity level of the quartz device to be processed, and dynamically adjust and plan the processing route of the quartz device to be processed; The processing parameter extraction module is used to extract the processing route of the quartz device to be processed after dynamic adjustment planning, and collect the processing parameters during the manual processing process; The processing quality check module is used to import the processing parameters in the manual process into the processing quality check strategy, and execute the quality correction strategy according to the quality check data.

5. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the device processing quality control method based on the quartz device processing drawing library according to any one of claims 1 to 3 is implemented.

6. An electronic device, characterized in that: include: a memory for storing instructions; The processor is configured to execute the instruction so that the device performs the steps of implementing the device processing quality control method based on the quartz device processing drawing library as described in any one of claims 1 to 3.

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