A method for removing glue from Teflon material

Abstract

The present invention provides a Teflon material degumming method, comprising the following steps: S1: The production of PCBs first undergoes a browning process, in which a uniform brown oxide layer is formed on the inner copper surface of the board to enhance the bonding force between the inner copper foil and the prepreg. The present invention provides a Teflon material degumming method, which uses an optimized PCB process: browning-pressing-X-RAY-Plasma+horizontal degumming-drilling-PTH-post-process, etc., and uses a chemical degumming method to replace mechanical grinding to remove resin powder solidified on the board surface after pressing, thereby avoiding pressure damage. The innovative chemical degumming method of Plasma+horizontal degumming can significantly improve the production quality and efficiency of PCBs, provide a chemical degumming method to replace mechanical grinding to solve the problem of prepreg dust adhering to the board surface after pressing, reduce the problem of pits and depressions of Teflon materials in PCB process processing, and improve the process processing qualification rate of the material.

Description

Technical Field

[0001] The invention relates to the field of Teflon material processing, in particular to a Teflon material degumming method. Background Art

[0002] With the development of the industry, the client's requirements for the frequency band of the product are getting higher and higher. The upstream raw materials of PCB have also made corresponding countermeasures. A Teflon material is specially produced for high-frequency products. It is a polymer compound made of tetrafluoroethylene through polymerization. Its structural formula is -[-CF2-CF2-]n-. It has excellent chemical stability and corrosion resistance (PTFE or F4, abbreviated as PTFE, is one of the most corrosion-resistant materials in the world today. "Plastic King" is the common name for PTFE. It is a plastic with the best corrosion resistance. It is not It is corroded by known acids, alkalis, salts, and oxidants, and even aqua regia is helpless against it, hence the name "Plastic King". It is resistant to all chemicals except molten sodium metal and liquid fluorine. It is widely used in various applications that require resistance to acids, alkalis, and organic solvents, sealing, high lubricity and non-stickiness, electrical insulation, good anti-aging endurance, and excellent temperature resistance (it can operate for a long time at temperatures of +250°C to -180°C). However, due to the characteristics of the Teflon material itself, it is prone to defects such as crushing, pitting, and depressions in the PCB process, resulting in signal loss of microstrip antennas.

[0003] Teflon material has a certain degree of cold flow, which may cause slight changes in the shape and size of the material in certain applications. Processing difficulty: Due to the special properties of Teflon PCB, such as high lubricity and non-adhesion, its processing difficulty is relatively high. During the PCB wiring and drilling process, it is easy to cause problems such as gouging or tearing. High cost: Compared with traditional FR-4 material, the cost of Teflon PCB is significantly higher.

[0004] The conventional PCB process includes browning, lamination, X-ray, ceramic grinding, drilling, PTH, and post-processing. After lamination, cured resin powder will inevitably adhere to the board surface. Traditional physical and mechanical grinding can easily cause damage to the PCB surface. Mechanical grinding can also damage the Teflon material, creating pits and depressions that lead to signal loss in the microstrip antenna.

[0005] Therefore, it is necessary to provide a Teflon material degumming method to solve the above technical problems. Summary of the Invention

[0006] The present invention provides a Teflon material debonding method, which solves the problem that in a conventional PCB process comprising browning-pressing-X-RAY-ceramic grinding-drilling-PTH-post-process, solidified resin powder will inevitably adhere to the board surface after pressing, traditional physical and mechanical grinding can easily cause pressure damage to the PCB board surface, and mechanical grinding can cause pressure damage to the Teflon material, resulting in pits and depressions that lead to signal loss of the microstrip antenna.

[0007] In order to solve the above technical problems, the present invention provides a Teflon material degumming method, comprising the following steps:

[0008] S1: The production of PCBs first goes through the browning process. The browning process forms a uniform brown oxide layer on the inner copper surface of the board to enhance the bonding strength between the inner copper foil and the prepreg.

[0009] S2: Next is the lamination step. During this process, the inner layer board and the prepreg are tightly pressed together under high temperature and high pressure to form the PCB structure. After lamination, solidified resin powder will inevitably adhere to the board surface.

[0010] S3: Then comes the X-RAY step, where the internal structure of the PCB can be inspected through X-ray irradiation to check for potential defects and problems.

[0011] S4: Next comes the critical Plasma+ horizontal debonding step. This step uses chemical debonding to replace traditional physical mechanical grinding. Chemical debonding removes the resin powder that solidifies on the board surface after lamination.

[0012] S5: After the glue removal is completed, the drilling stage begins. High-precision drilling equipment is used to drill the required holes on the PCB board to prepare for subsequent circuit connection and component installation.

[0013] S6: After drilling, the PTH process is carried out. A thin layer of metal is deposited on the hole wall through chemical plating to achieve electrical connection between the layers.

[0014] S7: After completing the above main processes, the PCB will continue to undergo a series of subsequent processing steps, such as circuit pattern transfer, etching, solder mask, surface treatment, etc., and finally become a complete PCB circuit board that meets the design requirements.

[0015] Preferably, a PCB board clamping bed is required to be used in the drilling process in step S5 of the Teflon material debonding method, and the PCB board clamping bed includes: a mounting seat;

[0016] A connecting groove is provided in the middle of one side of the mounting seat, a collecting groove is provided in the middle of the top of the mounting seat, a debris collecting box is slidably installed inside the connecting groove, and the debris collecting box includes a collecting box, a groove and a pull rod;

[0017] A movable groove, wherein the two movable grooves are respectively opened in the middle of both sides of the outer surface of the mounting seat, wherein a limit rod is fixedly installed inside one of the movable grooves, and a reciprocating screw rod is rotatably installed inside the other movable groove, and an adjustment block is fixedly installed at one end of the reciprocating screw rod;

[0018] Mounting devices, wherein the two mounting devices are slidably mounted on both sides of the top of the mounting seat, and the mounting devices include a mounting block, a placement slot, a threaded hole, a connecting block, a threaded block and a limit block;

[0019] The two limiting devices are respectively threadedly engaged with the two sides of the interior of the mounting block, and the limiting devices include a threaded rod, a clamping plate, a buffer pad and an adjustment block.

[0020] Preferably, the mounting block is slidably mounted on the surface of the mounting seat, the placement groove is opened in the middle of one side of the surface of the mounting block, the two threaded holes are respectively opened on both sides of the outer surface of the mounting block, and the two connecting blocks are respectively fixedly mounted on both sides of the bottom of the mounting block, the threaded block is fixedly mounted on one side of one of the connecting blocks, and the limit block is fixedly mounted on one side of the other connecting block.

[0021] Preferably, the collecting box is slidably mounted inside the communicating groove, the opening groove is opened in the middle of the top of the collecting box, and the pull rod is fixedly mounted on one side of the outer surface of the collecting box.

[0022] Preferably, the threaded rod is threadably engaged with the inside of the threaded hole, the clamping plate is rotatably mounted on one end of the threaded rod, the buffer pad is fixedly connected to one side of the clamping plate, and the adjustment block is fixedly mounted on the other end of the threaded rod.

[0023] Preferably, the buffer pad is made of rubber.

[0024] Preferably, the threaded block is threadably engaged with the outer surface of the reciprocating screw.

[0025] Preferably, the limiting block is sleeved on the outer surface of the limiting rod.

[0026] Preferably, a magnet sheet is fixedly installed on one side of the interior of the collecting tank.

[0027] Preferably, the collection box is made of metal.

[0028] Compared with the related art, the Teflon material degumming method provided by the present invention has the following beneficial effects:

[0029] The present invention provides a Teflon material debonding method. Through an optimized PCB process including browning-pressing-X-RAY-Plasma+horizontal debonding-drilling-PTH-post-process, etc., chemical debonding is used instead of mechanical grinding to remove resin powder solidified on the board surface after pressing, thereby avoiding pressure damage. The innovative chemical debonding method of Plasma+horizontal debonding can significantly improve the production quality and efficiency of PCBs. A chemical debonding method is provided to replace mechanical grinding to solve the problem of prepreg dust adhering to the board surface after pressing, reduce the problem of pits and depressions caused by Teflon materials in PCB processing, and improve the processing qualification rate of the material. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic structural diagram of a Teflon material debonding method provided by the present invention;

[0031] Figure 2 for Figure 1 An enlarged schematic diagram of point A is shown;

[0032] Figure 3 for Figure 1 A schematic side view of the mounting base shown;

[0033] Figure 4 for Figure 3 An enlarged schematic diagram of point B is shown.

[0034] Numbers in the figure: 1. Mounting seat, 2. Collection slot, 3. Debris collection box, 31. Collection box, 32. Opening slot, 33. Pull rod, 4. Connecting slot, 5. Moving slot, 6. Mounting device, 61. Mounting block, 62. Placement slot, 63. Threaded hole, 64. Connecting block, 65. Threaded block, 66. Limit block, 7. Limit device, 71. Threaded rod, 72. Clamping plate, 73. Buffer pad, 74. Adjustment block, 8. Reciprocating screw, 9. Adjustment block, 10. Limit rod. DETAILED DESCRIPTION

[0035] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0036] First embodiment

[0037] A method for removing glue from Teflon material, comprising the following steps:

[0038] S1: The production of PCBs first goes through the browning process. The browning process forms a uniform brown oxide layer on the inner copper surface of the board to enhance the bonding strength between the inner copper foil and the prepreg.

[0039] S2: Next is the lamination step. During this process, the inner layer board and the prepreg are tightly pressed together under high temperature and high pressure to form the PCB structure. After lamination, solidified resin powder will inevitably adhere to the board surface.

[0040] S3: Then comes the X-RAY step, where the internal structure of the PCB can be inspected through X-ray irradiation to check for potential defects and problems.

[0041] S4: Next comes the critical Plasma+ horizontal debonding step. This step uses chemical debonding to replace traditional physical mechanical grinding. Chemical debonding removes the resin powder that solidifies on the board surface after lamination.

[0042] S5: After the glue removal is completed, the drilling stage begins. High-precision drilling equipment is used to drill the required holes on the PCB board to prepare for subsequent circuit connection and component installation.

[0043] S6: After drilling, the PTH process is carried out. A thin layer of metal is deposited on the hole wall through chemical plating to achieve electrical connection between the layers.

[0044] S7: After completing the above main processes, the PCB will continue to undergo a series of subsequent processing steps, such as circuit pattern transfer, etching, solder mask, surface treatment, etc., and finally become a complete PCB circuit board that meets the design requirements.

[0045] The working principle of the Teflon material degumming method provided by the present invention is as follows:

[0046] During work, the production of PCB will first go through the browning process. The browning process is to form a uniform brown oxide layer on the inner copper surface of the board to enhance the bonding strength between the inner copper foil and the prepreg.

[0047] Next comes the lamination step, during which the multi-layer inner layer boards and prepregs are tightly pressed together under high temperature and high pressure to form a multi-layer PCB structure. However, after lamination, some cured resin powder will inevitably adhere to the board surface.

[0048] Then comes the X-RAY step, which uses X-rays to inspect the internal structure of the PCB to check for potential defects or problems.

[0049] Next comes the critical Plasma+ horizontal debonding step. This step uses chemical debonding to replace traditional physical mechanical grinding. In the previous mechanical grinding process, it is easy to cause pressure damage to the PCB surface. Chemical debonding can effectively remove the resin powder that solidifies on the board surface after lamination. This method is gentler and more precise, avoiding physical damage, thereby ensuring the integrity and quality of the PCB surface.

[0050] After the glue removal is completed, the drilling stage begins. High-precision drilling equipment is used to drill the required holes on the PCB board to prepare for subsequent circuit connection and component installation.

[0051] After drilling comes the PTH (plated through hole) process, in which a thin layer of metal is deposited on the wall of the drilled hole through chemical plating to achieve electrical connection between the layers.

[0052] After completing the above main processes, the PCB will continue to undergo a series of subsequent processing steps, such as circuit pattern transfer, etching, solder mask, surface treatment, etc., and finally become a complete PCB circuit board that meets the design requirements.

[0053] Compared with the related art, the Teflon material degumming method provided by the present invention has the following beneficial effects:

[0054] The present invention provides a Teflon material debonding method. Through an optimized PCB process including browning-pressing-X-RAY-Plasma+horizontal debonding-drilling-PTH-post-process, etc., chemical debonding is used instead of mechanical grinding to remove resin powder solidified on the board surface after pressing, thereby avoiding pressure damage. The innovative chemical debonding method of Plasma+horizontal debonding can significantly improve the production quality and efficiency of PCBs. A chemical debonding method is provided to replace mechanical grinding to solve the problem of prepreg dust adhering to the board surface after pressing, reduce the problem of pits and depressions caused by Teflon materials in PCB processing, and improve the processing qualification rate of the material.

[0055] Second embodiment

[0056] Please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 Based on the method for removing adhesive from Teflon materials provided in the first embodiment of this application, the second embodiment of this application provides another method for removing adhesive from Teflon materials. The second embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0057] Specifically, the difference of the Teflon material degumming method provided in the second embodiment of the present application is that, in the Teflon material degumming method, a PCB board clamping bed is required during the drilling process in step S5 of the Teflon material degumming method, and the PCB board clamping bed includes: a mounting seat 1;

[0058] A connecting groove 4 is provided in the middle of one side of the mounting base 1, a collecting groove 2 is provided in the middle of the top of the mounting base 1, a debris collecting box 3 is slidably installed inside the connecting groove 4, and the debris collecting box 3 includes a collecting box 31, a slot 32 and a pull rod 33;

[0059] The two movable grooves 5 are respectively opened in the middle of the two sides of the outer surface of the mounting base 1, wherein a limit rod 10 is fixedly installed inside one of the movable grooves 5, and a reciprocating screw 8 is rotatably installed inside the other movable groove 5, and an adjustment block 9 is fixedly installed at one end of the reciprocating screw 8;

[0060] Mounting device 6, two mounting devices 6 are slidably mounted on both sides of the top of the mounting base 1, and the mounting device 6 includes a mounting block 61, a placement slot 62, a threaded hole 63, a connecting block 64, a threaded block 65 and a limit block 66;

[0061] The two limiting devices 7 are respectively threadedly engaged with the two sides of the interior of the mounting block 61 . The limiting devices 7 include a threaded rod 71 , a clamping plate 72 , a buffer pad 73 and an adjustment block 74 .

[0062] The mounting block 61 is slidably mounted on the surface of the mounting base 1, the placement groove 62 is opened in the middle of one side of the surface of the mounting block 61, the two threaded holes 63 are respectively opened on both sides of the outer surface of the mounting block 61, and the two connecting blocks 64 are respectively fixedly mounted on both sides of the bottom of the mounting block 61, the threaded block 65 is fixedly mounted on one side of one of the connecting blocks 64, and the limit block 66 is fixedly mounted on one side of the other connecting block 64.

[0063] The collecting box 31 is slidably mounted inside the communicating groove 4 , the opening groove 32 is opened in the middle of the top of the collecting box 31 , and the pull rod 33 is fixedly mounted on one side of the outer surface of the collecting box 31 .

[0064] The threaded rod 71 is threadedly engaged with the inside of the threaded hole 63, the clamping plate 72 is rotatably mounted on one end of the threaded rod 71, the buffer pad 73 is fixedly connected to one side of the clamping plate 72, and the adjustment block 74 is fixedly mounted on the other end of the threaded rod 71.

[0065] The buffer pad 73 is made of rubber.

[0066] The threaded block 65 is threadedly engaged with the outer surface of the reciprocating screw 8 .

[0067] The limiting block 66 is sleeved on the outer surface of the limiting rod 10 .

[0068] A magnet sheet is fixedly installed on one side of the collecting tank 2.

[0069] The collecting box 31 is made of metal.

[0070] The working principle of the Teflon material degumming method provided by the present invention is as follows:

[0071] During operation, the user first installs the mounting base 1 on the surface of the drilling machine, rotates the adjustment block 9 to drive the reciprocating screw 8 to rotate, and the reciprocating screw 8 is threadedly engaged with the threaded blocks 65 on both sides of the outer surface, and the length between the two mounting blocks 61 is adjusted to adapt to the PCB board. The user places the PCB board inside the placement groove 62 on the surface of the two mounting blocks 61, and then rotates the threaded rods 71 ​​on both sides to threadably engage the threaded holes 63 to move, pushing the clamping plate 72 to slide inside the placement groove 62, so that the two clamping plates 72 clamp the PCB board.

[0072] After drilling, the user holds the pull rod 33 to remove the collection box 31 from the inside of the communication groove 4 and cleans the debris collected in the opening groove 32 of the collection box 31.

[0073] Compared with the related art, the Teflon material degumming method provided by the present invention has the following beneficial effects:

[0074] The present invention provides a method for removing glue from Teflon materials. The distance between two mounting devices 6 is moved to adapt to the sizes of PCB boards of different lengths. At the same time, the two limit devices 7 can be adjusted to clamp the PCB board, so that PCB boards of different lengths and widths can be installed on the surface of the clamping bed for drilling. A debris collection box 3 is installed in the middle of the interior of the mounting seat 1 to collect debris dropped during drilling. The user holds the pull rod 33 to remove the collection box 31 from the interior of the collection tank 2 to clean the debris. The device has a simple structure and strong practicality. PCB boards of different lengths and widths can be installed on the surface of the clamping bed for drilling. During the drilling process, debris dropped during drilling can be collected, and the collected debris can be conveniently cleaned, thereby improving the practicality and flexibility of the device.

[0075] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for removing glue from Teflon material, characterized in that: The following steps are involved: S1: The production of PCBs first goes through the browning process. The browning process forms a uniform brown oxide layer on the inner copper surface of the board to enhance the bonding strength between the inner copper foil and the prepreg. S2: Next is the lamination step, during which the inner layer board and the prepreg are tightly pressed together to form the PCB structure. After lamination, solidified resin powder will inevitably adhere to the board surface; S3: Then comes the X-RAY step, where the internal structure of the PCB can be inspected through X-ray irradiation to check for potential defects and problems. S4: Next comes the critical Plasma+ horizontal debonding step. This step uses chemical debonding to replace traditional physical mechanical grinding. Chemical debonding removes the resin powder that solidifies on the board surface after lamination. S5: After the glue removal is completed, the drilling stage begins. High-precision drilling equipment is used to drill the required holes on the PCB board to prepare for subsequent circuit connection and component installation. S6: After drilling, the PTH process is carried out. A thin layer of metal is deposited on the hole wall through chemical plating to achieve electrical connection between the layers. In step S5 of the Teflon material debonding method, a PCB board clamping bed is required during the drilling process. The PCB board clamping bed includes: a mounting seat; A connecting groove is provided in the middle of one side of the mounting seat, a collecting groove is provided in the middle of the top of the mounting seat, a debris collecting box is slidably installed inside the connecting groove, and the debris collecting box includes a collecting box, a groove and a pull rod; A movable groove, wherein the two movable grooves are respectively opened in the middle of both sides of the outer surface of the mounting seat, wherein a limit rod is fixedly installed inside one of the movable grooves, and a reciprocating screw rod is rotatably installed inside the other movable groove, and an adjustment block is fixedly installed at one end of the reciprocating screw rod; Mounting devices, wherein the two mounting devices are slidably mounted on both sides of the top of the mounting seat, and the mounting devices include a mounting block, a placement slot, a threaded hole, a connecting block, a threaded block and a limit block; The two limiting devices are respectively threadedly engaged with the two sides of the interior of the mounting block, and the limiting devices include a threaded rod, a clamping plate, a buffer pad and an adjustment block.

2. A Teflon material degumming method according to claim 1, characterized in that: The mounting block is slidably mounted on the surface of the mounting seat, the placement groove is opened in the middle of one side of the surface of the mounting block, the two threaded holes are respectively opened on both sides of the outer surface of the mounting block, and the two connecting blocks are respectively fixedly mounted on both sides of the bottom of the mounting block, the threaded block is fixedly mounted on one side of one of the connecting blocks, and the limit block is fixedly mounted on one side of the other connecting block.

3. The method for removing glue from Teflon material according to claim 1, characterized in that: The collecting box is slidably mounted inside the communicating groove, the opening groove is opened in the middle of the top of the collecting box, and the pull rod is fixedly mounted on one side of the outer surface of the collecting box.

4. The method for removing glue from Teflon material according to claim 1, characterized in that: The threaded rod is threadedly engaged with the inside of the threaded hole, the clamping plate is rotatably mounted on one end of the threaded rod, the buffer pad is fixedly connected to one side of the clamping plate, and the adjustment block is fixedly mounted on the other end of the threaded rod.

5. The method for removing glue from Teflon material according to claim 1, characterized in that: The buffer pad is made of rubber.

6. The method for removing glue from Teflon material according to claim 1, characterized in that: The threaded block is threadably engaged with the outer surface of the reciprocating screw.

7. The method for removing glue from Teflon material according to claim 1, characterized in that: The limiting block is sleeved on the outer surface of the limiting rod.

8. The method for removing glue from Teflon material according to claim 1, characterized in that: A magnet sheet is fixedly installed on one side of the collecting tank.

9. The method for removing glue from Teflon material according to claim 1, characterized in that: The collection box is made of metal.

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