Circuit board etching processing equipment and processing method for optimizing etching efficiency

Abstract

The invention relates to the technical field related to circuit board etching, and discloses a circuit board etching processing equipment and a processing method for optimizing etching efficiency. The processing equipment comprises a box body, an end cover and a plurality of etching plates, wherein the etching plates are arranged at intervals in the box body, and an etching gap for accommodating the circuit board is formed between two adjacent etching plates. A movable groove is provided in the middle of the etching plate, and two movable plates that can approach or move away from each other are arranged in the movable groove. A liquid spray nozzle and a liquid suction port are arranged on the movable plate. An elastic support body is arranged on the surface of the etching plate, and a driving guide rail is also arranged. A top block is carried on the driving guide rail, and the top block abuts against the elastic support body so that a part of the elastic support body protrudes toward the direction of the circuit board, so as to change the angle of the circuit board relative to the etching plate, reduce the hindering effect of the pool wall on the flow of liquid, enhance the liquid fluidity, improve the uniformity of etching, and thus improve the etching effect.

Description

Technical Field

[0001] The present invention belongs to the technical field related to circuit board etching, and more specifically, particularly relates to a circuit board etching processing equipment and a processing method for optimizing etching efficiency. Background Art

[0002] Circuit boards are a common type of electronic component in daily life. They usually require multiple processing steps before they are put into use. Etching is a relatively important step. First, a layer of lead-tin anti-corrosion layer is pre-plated on the copper foil part of the outer layer of the board that needs to be retained, that is, the graphic part of the circuit. Then, the remaining copper foil is corroded chemically. This process is called etching.

[0003] There are usually two types of etching processes at present, one is spray type and the other is immersion type. For the spray type etching process, a spray head is used to spray the circuit board forward to form the required circuit diagram. The existing technology has the following defects for cleaning belts:

[0004] The current etching process still has problems with the upper surface water pool effect and the lower surface water film effect.

[0005] The water film effect refers to the fact that during spray etching, due to the surface tension of the liquid, the etching liquid on the lower surface of the circuit board will form a layer of water film with a downward protrusion in the middle under the influence of gravity. The etching liquid at different positions has different concentrations, the uniformity of the etching liquid is affected, and the etching effect is uneven.

[0006] The pool effect refers to the situation that when the etchant etches the upper surface of the circuit, as the chemical reaction occurs, the circuit board sinks at a specified position to form a pool to hold the etching liquid. Due to the existence of the pool, the etching liquid is hindered, especially affecting the fluidity of the etching liquid in the center of the circuit board, making the center of the upper surface of the circuit board more difficult to etch.

[0007] Therefore, in view of this, the existing structure and defects are studied and improved, and a circuit board etching processing equipment and processing method with optimized etching efficiency are provided, in order to achieve a more practical purpose. Summary of the invention

[0008] The present invention provides a circuit board etching processing equipment and a processing method for optimizing etching efficiency, which are used to overcome the above-mentioned defects in the prior art.

[0009] The purpose and effect of the circuit board etching processing equipment and processing method for optimizing etching efficiency of the present invention are achieved by the following specific technical means:

[0010] A circuit board etching processing equipment for optimizing etching efficiency comprises a box body, an end cover and a plurality of etching plates, wherein the etching plates are arranged at intervals in the box body, an etching gap for accommodating the circuit board is formed between two adjacent etching plates, a movable groove penetrating therein is provided in the middle of the etching plate, two movable plates which can approach or move away from each other are arranged in the movable groove, a liquid spraying nozzle and a liquid suction port are arranged on the movable plate, a telescopic device is arranged in the two movable plates, the telescopic device is respectively connected to the two movable plates, an elastic support body is arranged on the surface of the etching plate, the elastic support body protrudes from the surface of the etching plate and directly abuts against the circuit board so that the circuit board is suspended between the two etching plates, the surface of the etching plate connected to the elastic support body is concave to form a height adjustment groove, a driving guide rail is arranged inside the height adjustment groove, a top block is carried on the driving guide rail, and the top block abuts against the elastic support body so that a part of the elastic support body protrudes toward the direction of the circuit board.

[0011] A further technical solution is that the two side surfaces of the etching plate are respectively defined as the front side and the back side, no driving guide rail is arranged on the front side of the etching plate, the elastic support body is fixedly connected to the front side of the etching plate, a driving guide rail is arranged on the back side of the etching plate, the elastic support body is fixedly connected to the back side of the etching plate, the driving guide rail abuts against the elastic support body through a top block, one side of the circuit board faces the front side of the etching plate, and the other side of the circuit board faces the back side of the etching plate; and / or, the elastic support body is a long elastic strip, the etching plate is a rectangle corresponding to the shape of the circuit board, four elastic strips are distributed on the four edges of the etching plate, and the four driving guide rails abut against the four elastic strips through the top blocks respectively.

[0012] According to a further technical solution, the two movable plates and the inner wall of the movable groove are combined to form a liquid recovery chamber, an elastic reset member is arranged between the two movable plates, the liquid suction port is connected to the liquid recovery chamber, and a one-way liquid inlet device is arranged in the liquid suction port.

[0013] A further technical solution is that the one-way liquid inlet device includes a threaded cylinder connected to the liquid suction port, the center of the threaded cylinder is connected to a central cylinder, a liquid flow channel is formed between the central cylinder and the threaded cylinder, a valve core is connected to the central cylinder, and an elastic membrane is arranged at the end of the valve core to seal the liquid suction port.

[0014] A further technical solution is that the box body includes a first cylinder and a second cylinder which are nested with each other, the diameter of the first cylinder is smaller than the diameter of the second cylinder, a liquid recovery gap is formed between the first cylinder and the second cylinder, a recovery groove is provided on the inner wall of the first cylinder, the recovery groove is connected to the liquid recovery gap, and the liquid recovery gap is connected to a recovery pump through a pipeline.

[0015] A further technical solution also includes a base and a centrifugal motor, the centrifugal motor is installed on the base, the shaft of the centrifugal motor is connected to the box body, the end cover is arranged at the opening of the box body, and a limit device is arranged between the end cover and the base, and the limit device is used to limit the distance between the end cover and the box body.

[0016] According to a further technical solution, the limiting device comprises a limiting telescopic rod, a limiting ear is arranged around the end cover, the limiting ear has a limiting hole, the upper end of the limiting telescopic rod passes through the limiting hole and is provided with a limiting ring, and a pressure spring is arranged between the limiting ring and the limiting ear.

[0017] A further technical solution is that a limit block is provided on the inner wall of the end cover, and a plurality of limit blocks are distributed along the circumference of the end cover, the limit blocks protrude toward the box body, an elastic limit protrusion that abuts against the limit block is provided on the side of the movable plate toward the end cover, and the side of the limit block toward the box body is a wavy surface with uneven surfaces.

[0018] A further technical solution is to open a plurality of circumferentially distributed through holes on the etching plate, open a liquid channel connected to the movable groove on the side wall of the through hole, set a liquid supply pipe that slides up and down in the through hole, and open a through hole in the liquid supply pipe that is connected to the liquid channel.

[0019] A circuit board etching processing method, comprising the above-mentioned circuit board etching processing equipment for optimizing etching efficiency, comprises the following steps:

[0020] S1: Coating a conductive material on the surface of the circuit board and curing it to form a metal coating;

[0021] S2: coating a photosensitive layer on the metal coating and performing an exposure process;

[0022] S3: placing the circuit board in the box, and etching the circuit boards simultaneously with multiple etching plates to form a circuit diagram;

[0023] S4: Cleaning the etched circuit board to obtain a final circuit board.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] In a circuit board etching processing equipment for optimizing etching efficiency of the present invention, a plurality of etching plates are arranged, and elastic support bodies are arranged on the etching plates, and the circuit boards to be etched and the etching plates are placed alternately in a box body in sequence, and each two etching plates clamp a circuit board, and the elastic support bodies on the two circuit boards abut against the two sides of the circuit board, so that the circuit board is suspended between the two etching plates, and the driving guide rail drives the top block to move along a specified path, so that the top block abuts against the elastic support body, and the abutted part of the elastic support body is deformed and protrudes toward the circuit board. The circuit board changes its normal angle due to the deformation of the elastic support body, and the liquid spray nozzle on the movable plate sprays etching liquid toward the circuit board. As the top block moves, the normal direction of the circuit board changes accordingly, and the angle between the liquid spray and the circuit board changes, thereby reducing the hindering effect of the pool wall on the flow of liquid, enhancing the fluidity of the liquid, and improving the uniformity of etching, thereby improving the etching effect, etching multiple layers of circuit boards at the same time, greatly improving the etching efficiency, making full use of the equipment space, and enhancing the etching efficiency of the circuit board.

[0026] In the circuit board etching processing equipment for optimizing etching efficiency of the present invention, a telescopic device and two movable plates are arranged. The telescopic device drives the two movable plates on the upper and lower surfaces of the circuit board to approach each other. At this time, the liquid spray nozzle is close to the circuit board, the spray force is increased, the liquid fluidity is enhanced, and the uniformity of the etching liquid is improved. The liquid suction port absorbs the water film attached to the surface of the circuit board, thereby absorbing the old etching liquid in a short-distance and direct manner to overcome the surface tension of the water film. The liquid spray nozzle sprays new etching liquid to maintain the effectiveness of the etching liquid. The telescopic device drives the two movable plates on the upper and lower surfaces of the circuit board to move away from each other, and the liquid spray nozzle is away from the circuit board, the spray range is increased, and the spraying is uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 is a front view of the present invention;

[0029] Figure 3 is a disassembly diagram of the present invention;

[0030] Figure 4 It is a schematic diagram of the structure inside the end cover 11 of the present invention;

[0031] Figure 5 It is a structural schematic diagram of the combination of the etching plate 12 and the movable plate 15 of the present invention;

[0032] Figure 6 It is a schematic diagram of the structure of the etching plate 12 of the present invention;

[0033] Figure 7 It is a structural schematic diagram of the movable plate 15 of the present invention;

[0034] Figure 8 is a cross-sectional view of the combination of the etching plate 12 and the movable plate 15 of the present invention;

[0035] Fig. 9 It is a schematic diagram of the external structure of the box body 10 of the present invention;

[0036] Fig.10 It is a schematic diagram of the internal structure of the box body 10 of the present invention;

[0037] Fig.11 It is a structural schematic diagram of the one-way liquid inlet device of the present invention;

[0038] Fig.12 is a schematic structural diagram of the elastic limiting protrusion 31 of the present invention;

[0039] Fig.13 2 is a schematic diagram of the structure of the limiting device 28 of the present invention.

[0040] Description of reference numerals:

[0041] 10 box body, 11 end cover, 12 etching plate, 13 elastic support body, 14 movable groove, 15 movable plate, 16 liquid spray nozzle, 17 liquid suction port, 18 liquid recovery chamber, 19 elastic reset member, 20 threaded cylinder, 21 center cylinder, 22 liquid flow channel, 23 valve core, 24 elastic membrane, 25 recovery groove, 26 base, 27 centrifugal motor, 28 limit device, 29 limit block, 30 wave surface, 31 elastic limit protrusion, 32 shell, 33 sliding shaft, 34 spherical contact head, 35 limit telescopic rod, 36 limit ear, 37 through hole, 38 limit ring, 39 pressure spring, 41 liquid supply pipeline. DETAILED DESCRIPTION

[0042] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0043] In the description of the present invention, unless otherwise specified, "plurality" means two or more than two; the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0044] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] Example: Figure 1-13As shown, a circuit board etching processing equipment for optimizing etching efficiency includes a box body 10, an end cover 11 and a plurality of etching plates 12. The etching plates 12 are arranged at intervals in the box body 10, and an etching gap for accommodating the circuit board is formed between two adjacent etching plates 12. The etching plate 12 has a movable groove 14 penetrating the middle, and two movable plates 15 that can approach or move away from each other are arranged in the movable groove 14. A liquid spray nozzle 16 and a liquid suction port 17 are arranged on the movable plate 15. A telescopic device is arranged in the two movable plates 15, and the telescopic device is respectively connected to the two movable plates 15. In this embodiment, the telescopic device is a hydraulic telescopic rod connected between the two movable plates 15.

[0046] An elastic support body 13 is arranged on the surface of the etching plate 12. The elastic support body 13 protrudes from the surface of the etching plate 12 and directly abuts against the circuit board so that the circuit board is suspended between the two etching plates 12. The surface where the etching plate 12 and the elastic support body 13 meet is concave to form a height adjustment groove. A driving guide rail is arranged inside the height adjustment groove. A top block is carried on the driving guide rail. The top block abuts against the elastic support body 13 so that a part of the elastic support body 13 protrudes toward the direction of the circuit board.

[0047] In a specific implementation, the driving guide rail is an electric guide rail, and an anti-corrosion sealant is provided on the outside of the electric guide rail. The elastic support body 13 covers the opening of the height adjustment groove, and the connection between the elastic support body 13 and the etching plate 12 is sealed by an anti-corrosion sealant to prevent the electric guide rail in the height adjustment groove from being corroded.

[0048] The top block is connected to the slider of the electric guide rail. The top block itself has a spherical groove in which a ball is embedded. The ball is against the elastic support body 13. As the top block moves, the ball rolls on the surface of the elastic support body 13 to reduce friction.

[0049] Preferably, the two side surfaces of the etching plate 12 are respectively defined as the front side and the back side, no driving guide rail is arranged on the front side of the etching plate 12, the elastic support body 13 is fixedly connected to the front side of the etching plate 12, a driving guide rail is arranged on the back side of the etching plate 12, the elastic support body 13 is fixedly connected to the back side of the etching plate 12, the driving guide rail is supported against the elastic support body 13 through a top block, one side of the circuit board faces the front side of the etching plate 12, and the other side of the circuit board faces the back side of the etching plate 12.

[0050] In this embodiment, the box body 10 and the corresponding accessories are circular in shape, which is suitable for circular circuit boards. The etching plate 12 is circular in shape, and the elastic support body 13 is a plurality of strips, which are distributed around the center of the etching plate 12 at intervals. Each strip is abutted by the top block to form a raised portion, and the plurality of raised portions are all on the same plane to establish the normal direction of the circuit board.

[0051] In this embodiment, when using this device, a plurality of etching plates 12 are first taken out, and the circuit board to be etched and the etching plates 12 are placed alternately in the box body 10 in sequence, with each two etching plates 12 clamping a circuit board, and the elastic support bodies 13 on the two etching plates 12 abut against the two sides of the circuit board. Since the elastic support bodies 13 protrude from the surface of the etching plates 12, a gap is formed between the etching plates 12 and the circuit board.

[0052] Since the angle of the movable plate 15 remains unchanged, the fixed angle of the liquid spray nozzle 16 on the movable plate 15 remains unchanged, and the four driving guide rails are started according to the set program to drive the top block to move. The top block abuts against the elastic strip to cause a part of the elastic strip to bulge. The four bulges of the four elastic strips form a surface, and the four bulges abut against the circuit board respectively to establish the normal angle of the circuit board. According to the program setting, the normal angle of the circuit board is periodically changed, and the angle between the liquid spray and the circuit board changes, thereby reducing the obstruction effect of the pool wall on the liquid flow, enhancing the liquid fluidity, and improving the uniformity of etching, thereby improving the etching effect.

[0053] During the spraying process of the liquid spray nozzle 16, the telescopic device repeatedly extends and retracts to drive the two movable plates 15 to approach each other. At this time, the liquid spray nozzle is close to the circuit board, the spraying force is increased, the liquid fluidity is enhanced, and the suction port absorbs the water film attached to the surface of the circuit board, thereby absorbing the old etching liquid in a short-distance and direct manner to overcome the surface tension of the water film; the telescopic device drives the two movable plates on the upper and lower surfaces of the circuit board to move away from each other, and the liquid spray nozzle is away from the circuit board, the spraying range is increased, and the spraying is more uniform.

[0054] It should be noted that the present application does not limit the shapes of the box body 10 and the etching plate 12. For example, the shapes of the box body 10 and the etching plate 12 can also be a rectangle that matches the circuit board, and the size of the rectangle can be adaptively designed according to actual conditions.

[0055] Corresponding to the above example, the elastic support body 13 is a long elastic strip, the etching plate 12 is a rectangle corresponding to the shape of the circuit board, four elastic strips are distributed on the four edges of the etching plate 12, and the four driving guide rails respectively abut against the four elastic strips through the top blocks.

[0056] like Figure 8 As shown, preferably, the two movable plates 15 and the inner wall of the movable groove 14 are combined to form a liquid recovery chamber 18, an elastic reset member 19 is arranged between the two movable plates 15, the liquid suction port 17 is connected to the liquid recovery chamber 18, and a one-way liquid inlet device is arranged in the liquid suction port 17.

[0057] like Fig.11As shown, preferably, the one-way liquid inlet device includes a threaded cylinder 20 connected to the liquid suction port 17, the center of the threaded cylinder 20 is connected to a center cylinder 21, a liquid flow channel 22 is formed between the center cylinder 21 and the threaded cylinder 20, a valve core 23 is connected to the center cylinder 21, and an elastic membrane 24 is provided at the end of the valve core 23 to seal the liquid suction port 17.

[0058] In a specific implementation, the elastic film 24 is tapered, and the tapered elastic film 24 covers the liquid suction port 17 .

[0059] In this embodiment, when the two movable plates 15 move away from each other, the volume of the liquid recovery chamber 18 increases, a negative pressure is formed inside, and the external etching liquid is absorbed through the liquid suction port 17. In order to reduce the leakage of the etching liquid and the mixing with the new etching liquid, after the etching liquid passes through the liquid suction port 17, the internal liquid is blocked by the elastic membrane 24 to achieve a one-way flow effect.

[0060] like Figure 6 and Figure 8 As shown, preferably, a plurality of circumferentially distributed through holes 37 are provided on the etching plate 12, a liquid channel connected to the movable groove 14 is provided on the side wall of the through hole 37, a liquid supply pipe 41 which slides up and down is provided in the through hole 37, and the liquid supply pipe 41 has a through hole connected to the liquid channel.

[0061] In this embodiment, a liquid supply system is also included, which includes a liquid supply pump, a liquid storage chamber and a liquid discharge chamber. The liquid supply pump is connected to the liquid storage chamber, and the liquid supply pump is connected to the liquid supply pipe 41. As the liquid supply pump is started, the liquid passes through the liquid supply pipe 41 and enters the liquid channel, and finally the liquid is sprayed out through the liquid spray nozzle 16.

[0062] Preferably, Figure 9-10 As shown, the box body 10 includes a first cylinder and a second cylinder which are nested with each other, the diameter of the first cylinder is smaller than the diameter of the second cylinder, a liquid recovery gap is formed between the first cylinder and the second cylinder, a recovery groove 25 is provided on the inner wall of the first cylinder, the recovery groove 25 is connected to the liquid recovery gap, and the liquid recovery gap is connected to a recovery pump through a pipeline.

[0063] In a specific implementation, the recovery groove 25 is in a long strip shape, and a plurality of recovery grooves 25 are distributed circumferentially around the axis of the first barrel, and the recovery grooves 25 extend along the axis of the first barrel.

[0064] like Figure 3 As shown, preferably, it also includes a base 26 and a centrifugal motor 27, the centrifugal motor 27 is installed on the base 26, the shaft of the centrifugal motor 27 is connected to the box body 10, the end cover 11 is arranged at the opening of the box body 10, and a limiting device 28 is arranged between the end cover 11 and the base 26, and the limiting device 28 is used to limit the distance between the end cover 11 and the box body 10.

[0065] In this embodiment, the centrifugal motor 27 is started, driving the box body 10 and the etching plate 12 inside to rotate together. The circuit board rotates, and the water film on its surface overcomes the tension of the water film under the action of centrifugal force. The etching liquid flows around and finally passes through the recovery tank 25 into the liquid recovery gap. The recovery pump recovers the etching liquid through the pipeline.

[0066] The above embodiment proposes to use a hydraulic telescopic rod to drive the distance between the two movable plates 15, but since the distance between the movable plates is small and the device requires several hydraulic telescopic rods to drive the movable plates, this setting is relatively complicated. Therefore, in other embodiments of the present application, a more concise structure is proposed, which can also realize the function of the hydraulic telescopic rod in embodiment 1, and the specific features are as follows:

[0067] A limit block 29 is provided on the inner wall of the end cover 11, and a plurality of limit blocks 29 are distributed along the circumference of the end cover 11. The limit blocks 29 protrude toward the box body 10. An elastic limit protrusion 31 that abuts against the limit block 29 is provided on the side of the movable plate 15 facing the end cover 11, and the side of the limit block 29 facing the box body 10 is a wavy surface 30 with uneven surfaces.

[0068] In this embodiment, as the box body 10 rotates relative to the end cover 11, the box body 10 rotates and the cover body does not rotate. The box body 10 drives the elastic limiting protrusion 31 to rotate, and the elastic limiting protrusion 31 abuts against the wave surface 30. The wave surface 30 provides a periodically changing downward pressure for the etching plate 12. When multiple etching plates 12 are squeezed by the elastic support body 13 under pressure, the gap between the etching plate 12 and the circuit board is reduced, and the movable plate 15 is moved by the hydraulic action to reduce the distance between the two movable plates 15. Conversely, the distance between the two movable plates 15 increases.

[0069] like Fig.12 As shown, in a specific implementation, the elastic limiting protrusion 31 includes a shell 32, a sliding shaft 33 is slidably arranged in the shell 32, a spherical contact head 34 is arranged at the outer end of the sliding shaft 33, and an elastic member is arranged between the sliding shaft 33 and the bottom wall of the shell 32, and the elastic member is a spring.

[0070] like Fig.13 As shown, preferably, the limiting device 28 includes a limiting telescopic rod 35, a limiting ear 36 is arranged around the end cover 11, the limiting ear 36 has a limiting hole, the upper end of the limiting telescopic rod 35 passes through the limiting hole and is provided with a limiting ring 38, and a pressure spring 39 is arranged between the limiting ring 38 and the limiting ear 36.

[0071] In this embodiment, when the limiting telescopic rod 35 is extended, the end cover 11 is driven away from the box body 10, thereby opening the opening of the box body 10, and it is convenient to place the circuit board in the box body 10. The limiting telescopic plate is shortened to drive the end cover 11 to cover the opening of the box body 10. As the box body 10 rotates relative to the end cover 11, the end cover 11 itself is squeezed by the elastic limiting protrusion 31, and the pressure spring 39 is compressed, which has a buffering effect.

[0072] A circuit board etching processing method, comprising the above-mentioned circuit board etching processing equipment for optimizing etching efficiency, comprising the following steps:

[0073] S1: Coating a conductive material on the surface of the circuit board and curing it to form a metal coating;

[0074] S2: coating a photosensitive layer on the metal coating and performing an exposure process;

[0075] S3: placing the circuit board in the box body 10, and etching the circuit boards simultaneously with the multiple etching plates 12 to form a circuit diagram;

[0076] S4: Cleaning the etched circuit board to obtain a final circuit board.

[0077] Specific use of the present invention:

[0078] Conductive material is coated on the surface of the circuit board and cured to form a metal coating; a photosensitive layer is coated on the metal coating and exposed; the circuit board is placed in the box body 10, and multiple etching plates 12 simultaneously etch multiple circuit boards to form a circuit diagram.

[0079] During the etching process, when the limiting telescopic rod 35 is extended, the end cover 11 is driven away from the box body 10, the opening of the box body 10 is opened, and the multiple etching plates 12 are first taken out of the box body 10, and the circuit boards to be etched and the etching plates 12 are placed in the box body 10 alternately in sequence, with every two etching plates 12 clamping one circuit board, and the elastic support bodies 13 on the two etching plates abutting against the two sides of the circuit board.

[0080] The limiting telescopic rod 35 is shortened to drive the end cover 11 to cover the opening of the box body 10. The end cover 11 presses the multiple etching plates 12 into the box body 10 and clamps the multiple circuit boards.

[0081] The centrifugal motor 27 starts, driving the box body 10 and the etching plate 12 inside to rotate together. The circuit board rotates, and the water film on its surface overcomes the tension of the water film under the action of centrifugal force. The etching liquid flows around and finally passes through the recovery tank 25 into the liquid recovery gap. The recovery pump recovers the etching liquid through the pipeline.

[0082] As the box body 10 rotates relative to the end cover 11, the box body 10 rotates, and the cover body does not rotate. The box body 10 drives the elastic limiting protrusion 31 to rotate, and the elastic limiting protrusion 31 abuts against the wave surface 30. The wave surface 30 provides a periodically changing downward pressure for the etching plate 12. When multiple etching plates 12 are pressed by pressure to squeeze the elastic support body 13, the gap between the etching plate 12 and the circuit board is reduced, and the movable plate 15 is moved by the hydraulic pressure to reduce the distance between the two movable plates 15. Conversely, the distance between the two movable plates 15 increases.

[0083] When the distance between the two movable plates 15 decreases, the two movable plates 15 approach each other, the liquid spray nozzle approaches the circuit board, the spray force increases, the liquid fluidity is enhanced, and the liquid suction port absorbs the water film attached to the surface of the circuit board, thereby absorbing the old etching liquid in a short distance and directly, overcoming the surface tension of the water film; when the two movable plates move away from each other, the liquid spray nozzle moves away from the circuit board, the spray range increases, and the spraying is more uniform.

[0084] The four driving guide rails are started according to the set program to drive the top block to move. The top block presses against the elastic strip to make the elastic strip partially bulge. The four bulges of the four elastic strips respectively press against the circuit board to establish the normal angle of the circuit board. The angle between the spray and the circuit board changes, reducing the obstruction effect of the pool wall on the liquid flow, enhancing the liquid fluidity, and improving the uniformity of etching, thereby improving the etching effect.

[0085] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A circuit board etching processing equipment for optimizing etching efficiency, characterized in that: It comprises a box body, an end cover and a plurality of etching plates, wherein the etching plates are arranged in the box body at intervals, and an etching gap for accommodating a circuit board is formed between two adjacent etching plates, and a movable groove is provided in the middle of the etching plate, and two movable plates that can approach or move away from each other are arranged in the movable groove, and a liquid spraying nozzle and a liquid suction port are arranged on the movable plate, and a telescopic device is arranged in the two movable plates, and the telescopic device is respectively connected to the two movable plates, and an elastic support body is arranged on the surface of the etching plate, and the elastic support body protrudes from the surface of the etching plate and directly abuts against the circuit board so that the circuit board is suspended between the two etching plates, and the surface of the etching plate connected to the elastic support body is concave to form a height adjustment groove, and a driving guide rail is arranged inside the height adjustment groove, and a top block is carried on the driving guide rail, The top block presses against the elastic support body so that a part of the elastic support body protrudes toward the direction of the circuit board; the two side surfaces of the etching plate are respectively defined as the front side and the back side, the driving guide rail is not arranged on the front side of the etching plate, the elastic support body is fixedly connected to the front side of the etching plate, the driving guide rail is arranged on the back side of the etching plate, the elastic support body is fixedly connected to the back side of the etching plate, the driving guide rail presses against the elastic support body through the top block, one side of the circuit board faces the front side of the etching board, and the other side of the circuit board faces the back side of the etching board; the elastic support body is a long elastic strip, the etching plate is a rectangle corresponding to the shape of the circuit board, four elastic strips are distributed on the four edges of the etching plate, and the four driving guide rails respectively press against the four elastic strips through the top block.

2. The circuit board etching processing equipment for optimizing etching efficiency according to claim 1, characterized in that: The two movable plates and the inner wall of the movable groove are combined to form a liquid recovery chamber, an elastic reset member is arranged between the two movable plates, the liquid suction port is connected to the liquid recovery chamber, and a one-way liquid inlet device is arranged in the liquid suction port.

3. The circuit board etching processing equipment for optimizing etching efficiency according to claim 2, characterized in that: The one-way liquid inlet device includes a threaded cylinder connected to the liquid suction port, the center of the threaded cylinder is connected to a central cylinder, a liquid flow channel is formed between the central cylinder and the threaded cylinder, a valve core is connected to the central cylinder, and an elastic membrane is provided at the end of the valve core to seal the liquid suction port.

4. The circuit board etching processing equipment for optimizing etching efficiency according to claim 1, characterized in that: The box body includes a first cylinder and a second cylinder which are nested with each other. The diameter of the first cylinder is smaller than the diameter of the second cylinder. A liquid recovery gap is formed between the first cylinder and the second cylinder. A recovery groove is provided on the inner wall of the first cylinder. The recovery groove is connected to the liquid recovery gap. The liquid recovery gap is connected to a recovery pump through a pipeline.

5. The circuit board etching processing equipment for optimizing etching efficiency according to claim 1, characterized in that: It also includes a base and a centrifugal motor, the centrifugal motor is installed on the base, the shaft of the centrifugal motor is connected to the box body, the end cover is arranged at the opening of the box body, and a limiting device is arranged between the end cover and the base, and the limiting device is used to limit the distance between the end cover and the box body.

6. The circuit board etching processing equipment for optimizing etching efficiency according to claim 5, characterized in that: The limiting device comprises a limiting telescopic rod, a limiting ear is arranged around the end cover, the limiting ear has a limiting hole, the upper end of the limiting telescopic rod passes through the limiting hole and is provided with a limiting ring, and a pressure spring is arranged between the limiting ring and the limiting ear.

7. The circuit board etching processing equipment for optimizing etching efficiency according to claim 6, characterized in that: A limit block is arranged on the inner wall of the end cover, and a plurality of the limit blocks are distributed along the circumference of the end cover. The limit blocks protrude toward the box body, and an elastic limit protrusion that abuts against the limit block is arranged on the side of the movable plate toward the end cover, and a side of the limit block toward the box body is a wavy surface with uneven surfaces.

8. The circuit board etching processing equipment for optimizing etching efficiency according to claim 1, characterized in that: The etching plate is provided with a plurality of circumferentially distributed through holes, the side walls of the through holes are provided with liquid channels connected to the movable grooves, and the through holes are provided with liquid supply pipes that slide up and down, and the liquid supply pipes are provided with through holes connected to the liquid channels.

9. A circuit board etching method, comprising the circuit board etching equipment for optimizing etching efficiency according to any one of claims 1 to 8, characterized in that: It includes the following steps: S1: Coating a conductive material on the surface of the circuit board and curing it to form a metal coating; S2: coating a photosensitive layer on the metal coating and performing an exposure process; S3: placing the circuit board in the box, and etching the circuit boards simultaneously with multiple etching plates to form a circuit diagram; S4: Cleaning the etched circuit board to obtain a final circuit board.

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