Ultraviolet detector based on GaN chip and preparation method thereof

By setting up a pad between the GaN probe head and the circuit socket, and using glue sealing and positioning structure, the problems of pin offset and assembly deviation of the UV detector during assembly are solved, and the stability and service life of the detector are improved.

CN118748212BActive Publication Date: 2025-04-08ANHUI PAVEL INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202410941269.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-07-15
Publication Date
2025-04-08
Estimated Expiration
2044-07-15

AI Technical Summary

Technical Problem

Existing UV detectors based on GaN chips are prone to pin offsets and assembly deviations during assembly, resulting in reduced structural stability and sealing, affecting service life and stability.

Method used

By providing a pad between the GaN probe head and the circuit socket, the pad is guided by a straight pin, and by combining the filling-formed rubber seal and the positioning cylinder and the end cap, the assembly stability and sealability are improved.

Benefits of technology

It effectively avoids pin collisions and offsets, improves assembly convenience and stability, and enhances the service life and stability of the detector.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a GaN chip-based ultraviolet detector, including a sleeve, wherein the bottom surface of the sleeve is penetrated and connected with an external terminal, a storage tube is inserted inside the sleeve, a detection component is penetrated and connected inside the storage tube, the bottom end of the detection component is inserted inside the external terminal, a positioning tube is sleeved on the outer wall of the detection component, a first fixing bolt is penetrated and connected on the outer wall of the sleeve, one end of the first fixing bolt is connected to the inside of the positioning tube, an end cap is inserted inside the top of the sleeve, and the end cap is attached to the top surface of the positioning tube; S1, detection assembly; S2, glue encapsulation; S3, end capping; S4, wiring detection. The present invention sets a pad between the GaN detection head and the circuit socket, so that when assembling the ultraviolet detector, the pad is used to first straighten the pins passing through, and then the pin guides are inserted into the circuit socket for electrical connection, which effectively avoids the pins of the GaN detection head from colliding and skewing, and improves the convenience and stability of the assembly operation.
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Description

Technical Field

[0001] The present invention relates to the technical field of ultraviolet detectors, and in particular to an ultraviolet detector based on a GaN chip and a preparation method thereof. Background Art

[0002] UV detectors, also known as UV detectors or UV sensors, are devices used to detect and measure UV radiation. They are widely used in scientific research, industry, environmental monitoring, medical diagnosis, and safety protection. The working principle of UV detectors is based on the photoelectric effect. When UV radiation hits the sensitive element of the detector, it excites electrons to escape from atoms or molecules, forming an electric current that can be detected by electronic devices and converted into a readable signal to quantify the intensity of UV light. GaN UV detectors take advantage of the unique physical and chemical properties of GaN, enabling it to exhibit excellent performance in the field of UV detection.

[0003] GaN chip UV detectors, with their superior photoelectric performance and semiconductor material properties, have brought new possibilities to the field of UV detection. Currently, UV detectors based on GaN chips have greatly improved the accuracy of detecting UV light. When assembling the GaN detector head of the GaN chip, the pins on the GaN detector head need to be welded to the circuit and then assembled into an integrated structure. However, this type of UV detector has the following problems:

[0004] 1. The pins on the GaN detector head are prone to collision during transportation and assembly, causing the pins to shift, thus affecting the connection between the pins and the circuit structure;

[0005] 2. Although the GaN detector head of the GaN chip has a high monitoring accuracy, this type of GaN detector head is prone to assembly deviation when assembled with the fixing and protection structure, resulting in reduced stability and sealing of the structure, thereby reducing the service life and stability of the detector.

[0006] In summary, there is a need for an ultraviolet detector that is stable in structure and easy to assemble. Summary of the invention

[0007] In view of the deficiencies in the prior art, the present invention provides an ultraviolet detector based on a GaN chip and a preparation method thereof, which solves the problems mentioned in the background technology.

[0008] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0009] An ultraviolet detector based on a GaN chip comprises a sleeve, wherein an external terminal is connected through the bottom surface of the sleeve, a storage cylinder is inserted inside the sleeve, a detection component is connected through the storage cylinder, the bottom end of the detection component is inserted into the external terminal, a positioning cylinder is sleeved on the outer wall of the detection component, a first fixing bolt is connected through the outer wall of the sleeve, one end of the first fixing bolt is connected to the inside of the positioning cylinder, an end seal is inserted inside the top end of the sleeve, the end seal is attached to the top surface of the positioning cylinder, a second fixing bolt is connected through the inside of the end seal, the bottom end of the second fixing bolt is connected to the inside of the positioning cylinder, a glass window is arranged inside the end seal, an annular cavity is formed between the outer wall of the detection component and the inner wall of the sleeve, a rubber seal is filled and formed inside the annular cavity, and the rubber seal is arranged on the bottom surface of the positioning cylinder;

[0010] The detection component includes a circuit socket, a pad and a GaN detection head. The circuit socket is plugged into the storage tube. The bottom surface of the circuit socket is connected to an internal terminal. The bottom end of the internal terminal is plugged into the external terminal. The top surface of the circuit socket is attached to the pad. The top surface of the pad is attached to the GaN detection head. The bottom surface of the GaN detection head is connected to a plurality of pins. The circuit socket is provided with a plurality of first sockets. The pad is provided with a plurality of second sockets. The pins pass through the first sockets and the second sockets. The bottom ends of the pins are connected to the bottom surface of the circuit socket. A solder joint is welded between the bottom end of the pin and the bottom surface of the circuit socket.

[0011] Furthermore, an insert block is fixed on the top surface of the circuit socket, a card protrusion is fixed on the side wall of the insert block, a positioning groove is opened on the side wall of the GaN detection head, a card plate is fixed on the side wall of the pad, and a column is fixed on the top surface of the pad. The insert block is inserted into the card plate, the card protrusion is inserted into the positioning groove, and the column is inserted into the bottom surface of the circuit socket.

[0012] Furthermore, a slot is provided on the inner wall of the sleeve, the top of the slot is a through structure, a first limit strip is fixed on the outer wall of the positioning tube, a second limit strip is fixed on the outer wall of the end cover, and both the first limit strip and the second limit strip are plugged into the slot.

[0013] A method for preparing a GaN chip-based ultraviolet detector, the method comprising the following steps:

[0014] S1, detection assembly;

[0015] Place the GaN detection head and circuit socket with the insert into the detection welding device for transportation;

[0016] The detection welding device comprises a bottom plate, a conveying mechanism, a turning mechanism and a welding assembly. The top surface of the bottom plate is provided with the conveying mechanism, the turning mechanism and the welding assembly in sequence along the conveying direction. The conveying mechanism is a double-layer conveying structure.

[0017] The conveying mechanism synchronously conveys the GaN detection head and the circuit socket, the flipping mechanism clamps and assembles the GaN detection head, the pad and the circuit socket into one body to form a detection assembly, the flipping mechanism flips the detection assembly to the top of the welding assembly, and the welding assembly electrically connects the circuit socket and the GaN detection head through welding points;

[0018] S2, glue filling and packaging;

[0019] Insert the welded detection assembly into the sleeve, insert the bottom of the circuit socket into the storage tube, insert the internal terminal into the external terminal, and use the external glue filling device to fill the gap between the GaN detection head and the sleeve with silicone until the silicone cools and forms a rubber seal ring;

[0020] S3, end capping;

[0021] The positioning tube is mounted on the outer wall of the GaN detection head, the positioning tube is inserted into the sleeve, the first fixing bolt is turned to fix the positioning tube inside the sleeve, the end cover is inserted into the sleeve, and the second fixing bolt is turned to fix the end cover on the positioning tube;

[0022] S4, wiring detection;

[0023] Connect the external terminal to the UV signal display device, aim the GaN detection head at the UV light source, and confirm that the UV detection signal is normal.

[0024] Further, the conveying mechanism includes a first support plate, a first support plate, a first conveyor belt, a first bracket, a second support plate and a pushing assembly, the first support plate is fixed to the top surface of the bottom plate, two first support plates are mirrored about the vertical center line of the bottom plate, the first support plates are fixed to adjacent sides of the two first support plates, the first conveyor belt is arranged on the top surface of the first support plate, a first shell is arranged outside the first conveyor belt, the first shell is fixed to the top surface of the first support plate, two first brackets are fixed to the top surface of the first support plate, a second support plate is connected between the two first brackets, two second support plates are mirrored, a pushing assembly is slidably connected between the two second support plates, and one side of the pushing assembly is connected to the top surface of the first bracket;

[0025] The circuit socket is placed on two first pallets and transported by the first conveyor belt. At the same time, the GaN detection head with a pad is placed on two second pallets on top of the circuit socket and pushed by a pushing assembly to achieve double-layer synchronous transportation, so that the circuit socket and the pad can be clamped and installed synchronously later, thereby improving assembly efficiency.

[0026] Furthermore, the pushing assembly includes a first motor, a screw, a second bracket, a slider, a first connecting plate and a pushing block. The screw is arranged horizontally on the top surfaces of the two first brackets, one end of the screw is connected to the first motor, the first motor is fixed to the top surface of the first bracket, the second bracket is sleeved on the outer wall of the screw, the slider is fixed on the bottom surface of the second bracket, the slider is slidably sleeved on the side wall of the second support plate, the first connecting plate is fixed on one side of the slider, two sliders are arranged in a mirror image about the vertical center line of the first connecting plate, and a pushing block is fixed on the top surface of the connecting plate.

[0027] Furthermore, the flipping mechanism includes a second support plate, a second motor, a third support plate, a first tooth plate, a third motor, a first gear, a first pneumatic rod, a lifting plate and a clamping assembly, the second support plate is fixed to the top surface of the bottom plate, two second support plates are provided, the third support plate is rotatably connected between the two second support plates, the second motor is provided on the side wall of the second support plate, the rotating end of the second motor passes through the second support plate and is connected to the side wall of the third support plate, a guide plate is fixed to the top surface of the third support plate, the first tooth plate is inserted inside the guide plate, the second motor is provided on the top surface of the guide plate, the rotating end of the second motor is connected to the first gear, the bottom of the first gear is meshed with the top surface of the first tooth plate, a first pneumatic rod is provided on the top surface of one side of the first tooth plate, the telescopic bottom end of the first pneumatic rod passes through and is connected to the bottom of the first tooth plate, the telescopic bottom end of the first pneumatic rod is connected to the lifting plate, and a clamping assembly is connected to one side of the lifting plate.

[0028] Furthermore, the clamping assembly includes a fourth motor, a support and a side clamping part. The support is connected to the side wall of the lifting plate, a side clamping part is inserted into one side of the support, two groups of side clamping parts are arranged for rotating 180° about the circumferential direction of the support, a fourth motor is arranged on the top surface of the support, a second gear is connected to the inside of the support for rotation, the second gear is meshed and connected between the two groups of side clamping parts, the rotating bottom end of the fourth motor passes through and is connected to the inside of the support, and the second gear is fixed to the rotating bottom end of the fourth motor.

[0029] Furthermore, the side clamping component includes a fixed block, a clamping plate, a second tooth plate, a second pneumatic rod, a third pneumatic rod, a clamping ring, a fourth support plate and a clamping block. The second tooth plate is fixed on the top surface of the fixed block, the second tooth plate is inserted into the inside of the support, one side of the second tooth plate is meshed with the second gear, and the second tooth plate is meshed through the second gear to transmit the fixed block to translate. A clamping plate is inserted into the inside of the fixed block, the clamping plate penetrates and is inserted into the inside of the support, and the clamping plate is used to clamp the GaN detection head inserted into the inside of the support. The top surface of the fixed block is provided with a second pneumatic rod and a third pneumatic rod, the telescopic bottom end of the second pneumatic rod is connected with a clamping ring, the clamping ring is translated and clamped to the side wall of the circuit socket through the second pneumatic rod, the telescopic bottom end of the third pneumatic rod is connected with the fourth support plate, the top surface of the fourth support plate is fixed with a clamping block, the fourth support plate is translated and adhered to the bottom surface of the pad through the third pneumatic rod, and the clamping block is translated and clamped to the side wall of the pad through the third pneumatic rod.

[0030] Furthermore, the welding assembly includes a third support plate, a fifth motor, a second connecting plate, a second conveyor belt, a rotating shaft, a turning frame and a welding gun. The third support plate is fixed to the top surface of the base plate. Two third support plates are mirrored about the vertical center line of the base plate. The second connecting plate is fixed to the top surface of the third support plate. A second outer shell is fixed to one side of the second connecting plate. A second conveyor belt is arranged inside the second outer shell. A rotating shaft is rotatably connected between the two third support plates. A turning frame is sleeved on the outer wall of the rotating shaft. A welding gun is arranged on one side of the turning frame. The fifth motor is arranged on the side wall of the third support plate, and the rotating end of the fifth motor is fixedly connected to one end of the rotating shaft.

[0031] The present invention provides a GaN chip-based ultraviolet detector and a preparation method thereof. Compared with the prior art, the present invention has the following beneficial effects:

[0032] 1. By setting a pad between the GaN detector head and the circuit socket, when assembling the UV detector, the pad can be used to straighten the pins passing through, and then the pins are inserted into the circuit socket for electrical connection, which effectively avoids the pins of the GaN detector head from colliding and tilting, and improves the convenience and stability of the assembly operation;

[0033] 2. After the detection component is assembled into the sleeve, it is sealed and positioned by the molded rubber seal ring, and then stopped and positioned by the positioning tube and the end cover, which further improves the sealing and stability of the GaN detection head, thereby ensuring the stability of the UV detector;

[0034] 3. The two sets of side clamping parts are driven to translate simultaneously by the second gear, so that the clamping plate, clamping block and clamping ring respectively clamp the GaN detection head, pad and circuit socket synchronously, and then the third pneumatic rod is started to push the fourth plate, so that the pad clamped by the clamping block is lowered first, and the pad guides the penetrating pins to correct the vertical direction, and then the second pneumatic rod is started to pull up the clamping ring, and the clamping ring drives the circuit socket to rise, so that the pins are inserted into the circuit socket in a directional manner, and finally the fourth support plate and the clamping ring are synchronously raised to completely assemble the detection assembly together, ensuring the positioning accuracy of the pin insertion, thereby improving the assembly accuracy and stability of the detector. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 An exploded view of the structure of the GaN chip-based ultraviolet detector of the present invention is shown;

[0037] Figure 2 A schematic diagram of the circuit socket structure of the present invention is shown;

[0038] Figure 3 A schematic diagram of the backing plate structure of the present invention is shown;

[0039] Figure 4 The schematic diagram of the overall assembly structure of the GaN chip-based ultraviolet detector of the present invention is shown;

[0040] Figure 5 The figure shows the internal structure cross-section of the overall assembly of the GaN chip-based ultraviolet detector of the present invention;

[0041] Figure 6 The schematic diagram of the structure of the detection welding device of the present invention is shown;

[0042] Figure 7 A schematic diagram of the structure of the conveying mechanism of the present invention is shown;

[0043] Figure 8 A schematic diagram of the structure of the flipping mechanism of the present invention is shown;

[0044] Fig. 9 A schematic diagram of the structure of the clamping assembly of the present invention is shown;

[0045] Fig.10 A cross-sectional view of the meshing connection structure of the second gear and the second tooth plate of the present invention is shown;

[0046] Fig.11 A schematic diagram of the welding assembly structure of the present invention is shown;

[0047] Fig.12 A structural schematic diagram showing the state of a welding detection assembly of a welding assembly of the present invention;

[0048] As shown in the figure: 1. sleeve; 11. external terminal; 12. first fixing bolt; 13. slot; 14. rubber seal; 2. storage tube; 3. detection assembly; 31. circuit socket; 311. internal terminal; 312. first jack; 313. plug block; 314. card convex block; 32. pad; 321. plug column; 322. second jack; 323. card position plate; 33. GaN detection head; 331. pin; 332. fixed Positioning slot; 333, welding point; 4, positioning cylinder; 41, first limiting strip; 5, end cover; 51, second limiting strip; 52, glass window; 53, second fixing bolt; 6, bottom plate; 7, conveying mechanism; 71, first supporting plate; 72, first supporting plate; 73, first conveyor belt; 731, first housing; 74, first bracket; 75, second supporting plate; 76, pushing assembly; 761, first motor; 762, screw; 763, second bracket; 764, slider; 765, first connecting plate; 766, push block; 8, flip mechanism; 81, second support plate; 82, second motor; 83, third support plate; 831, guide plate; 84, first tooth plate; 85, third motor; 86, first gear; 87, first pneumatic rod; 88, lifting plate; 89, clamping assembly; 891, fourth motor; 892, support; 893, side clamping component; 8931, fixed Fixed block; 8932, clamping plate; 8933, second gear plate; 8934, second pneumatic rod; 8935, third pneumatic rod; 8936, clamping ring; 8937, fourth support plate; 8938, clamping block; 894, second gear; 9, welding assembly; 91, third support plate; 92, fifth motor; 93, second connecting plate; 94, second conveyor belt; 941, second shell; 95, rotating shaft; 96, turning frame; 97, welding gun. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example

[0050] In order to solve the technical problems in the background technology, the following GaN chip-based ultraviolet detector and its preparation method are provided:

[0051] Combination Figure 1-Figure 5As shown, the GaN chip-based ultraviolet detector provided by the present invention comprises a sleeve 1, wherein the bottom surface of the sleeve 1 is penetrated and connected with an external terminal 11, a storage tube 2 is inserted inside the sleeve 1, a detection component 3 is penetrated and connected inside the storage tube 2, the bottom end of the detection component 3 is inserted into the external terminal 11, a positioning tube 4 is sleeved on the outer wall of the detection component 3, a first fixing bolt 12 is penetrated and connected on the outer wall of the sleeve 1, one end of the first fixing bolt 12 is connected to the inside of the positioning tube 4, an end seal 5 is inserted inside the top end of the sleeve 1, the end seal 5 is attached to the top surface of the positioning tube 4, a second fixing bolt 53 is penetrated and connected inside the end seal 5, the bottom end of the second fixing bolt 53 is connected to the inside of the positioning tube 4, a glass window 52 is penetrated inside the end seal 5, an annular cavity is formed between the outer wall of the detection component 3 and the inner wall of the sleeve 1, a rubber seal 14 is filled and formed inside the annular cavity, and the rubber seal 14 is arranged on the bottom surface of the positioning tube 4;

[0052] The detection component 3 includes a circuit socket 31, a pad 32 and a GaN detection head 33. The circuit socket 31 is inserted into the storage tube 2. The bottom surface of the circuit socket 31 is connected to an internal terminal 311. The bottom end of the internal terminal 311 is inserted into the external terminal 11. The top surface of the circuit socket 31 is attached to the pad 32. The top surface of the pad 32 is attached to the GaN detection head 33. The bottom surface of the GaN detection head 33 is connected to a plurality of pins 331. A plurality of first jacks 312 are provided inside the circuit socket 31. A plurality of second jacks 322 are provided inside the pad 32. The pins 331 pass through the first jacks 312 and the second jacks 322. The bottom end of the pins 331 is connected to the bottom surface of the circuit socket 31. A solder joint 333 is welded between the bottom end of the pin 331 and the bottom surface of the circuit socket 31.

[0053] According to the above structure, the following effects can be achieved:

[0054] 1. By arranging a pad 32 between the GaN detection head 33 and the circuit socket 31, when assembling the ultraviolet detector, the pad 32 can be used to first straighten the pins 331 passing through, and then the pins 331 are guided and inserted into the circuit socket 31 for electrical connection, which effectively avoids the pins 331 of the GaN detection head 33 from collision and deflection, thereby improving the convenience and stability of the assembly operation;

[0055] 2. After the detection assembly 3 is assembled as a whole into the sleeve 1, it is sealed and positioned by the molded rubber seal ring 14, and then stopped and positioned by the positioning tube 4 and the end cover 5, which further improves the sealing and stability of the GaN detection head 33, thereby ensuring the stability of the ultraviolet detector.

[0056] In this embodiment, a plug block 313 is fixed to the top surface of the circuit socket 31, a card protrusion 314 is fixed to the side wall of the plug block 313, a positioning groove 332 is opened on the side wall of the GaN detection head 33, a card plate 323 is fixed to the side wall of the pad 32, a plug column 321 is fixed to the top surface of the pad 32, the plug block 313 penetrates and is inserted into the inside of the card plate 323, the card protrusion 314 is inserted into the inside of the positioning groove 332, and the plug column 321 is inserted into the bottom surface of the circuit socket 31;

[0057] When assembling the ultraviolet detector, the insert block 313 is plugged into the positioning plate 323, and the locking protrusion 314 is plugged into the positioning groove 332, so that the internal structure of the detector can be positioned and assembled, further improving the stability of the internal structure of the detector.

[0058] In this embodiment, a slot 13 is provided on the inner wall of the sleeve 1, the top of the slot 13 is a through structure, a first limiting strip 41 is fixed on the outer wall of the positioning cylinder 4, and a second limiting strip 51 is fixed on the outer wall of the end cover 5, and the first limiting strip 41 and the second limiting strip 51 are both inserted into the slot 13 in cooperation;

[0059] The slot 13 structure on the sleeve 1 is used to cooperate with the first limiting strip 41 and the second limiting strip 51 to enable the positioning tube 4 and the end cover 5 to be positioned and assembled, thereby improving the convenience of assembling the detector. Example

[0060] In order to solve the technical problems in the background technology, the following method for preparing a GaN chip-based ultraviolet detector is provided:

[0061] like Figure 6-Figure 12 As shown, based on the above embodiment, this embodiment further provides the following contents:

[0062] The preparation method comprises the following steps:

[0063] S1, detection assembly;

[0064] The GaN detection head 33 and the circuit socket 31 with the inserting pad 32 are placed in the detection welding device for transportation;

[0065] The detection welding device comprises a bottom plate 6, a conveying mechanism 7, a turning mechanism 8 and a welding assembly 9. The top surface of the bottom plate 6 is provided with the conveying mechanism 7, the turning mechanism 8 and the welding assembly 9 in sequence along the conveying direction. The conveying mechanism 7 is a double-layer conveying structure.

[0066] The conveying mechanism 7 synchronously conveys the GaN detection head 33 and the circuit socket 31, and the flipping mechanism 8 clamps and assembles the GaN detection head 33, the pad 32 and the circuit socket 31 into one body to form a detection assembly 3. The flipping mechanism 8 flips the detection assembly 3 to the top of the welding assembly 9, and the welding assembly 9 electrically connects the circuit socket 31 and the GaN detection head 33 through the welding solder joints 333;

[0067] The above steps are specifically as follows: placing the circuit socket 31 on the two first pallets 72, placing the GaN detection head 33 with the pad 32 on the two second pallets 75, starting the first conveyor belt 73 and the first motor 761, inserting the push block 766 into the inside of the clamping plate 323, and synchronously conveying the circuit socket 31 and the GaN detection head 33 to move toward the clamping assembly 89;

[0068] Then, the third motor 85 is started to drive the first tooth plate 84 to translate inside the guide plate 831, and the clamping assembly 89 is inserted between the GaN detection head 33 and the circuit socket 31 as a whole. Then, the first pneumatic rod 87 is started to push the lifting plate 88 downward, so that the support 892 is buckled on the top of the GaN detection head 33, the top surface of the fourth support plate 8937 is flush with the bottom surface of the pad 32, and the clamp ring 8936 is attached to the top surface of the circuit socket 31;

[0069] Then, the fourth motor 891 is started to drive the two fixing blocks 8931 to move toward the support 892, so that the clamping plate 8932 extends into the support 892 to clamp the outer wall of the GaN detection head 33, the fourth support plate 8937 is translated and attached to the bottom surface of the backing plate 32, the clamping block 8938 is clamped on the side wall of the backing plate 32, and the clamping ring 8936 is clamped on the side wall of the circuit socket 31;

[0070] Then, the third motor 85 is started to drive the first tooth plate 84 to translate in the opposite direction, so that the clamping assembly 89 drives the circuit socket 31 and the GaN detection head 33 to translate and separate from the second support plate 75, and the third pneumatic rod 8935 is started to push the fourth support plate 8937, so that the pad 32 clamped by the clamp block 8938 is first lowered, and the pad 32 guides and corrects the penetrating pin 331 to a vertical direction, and then the second pneumatic rod 8934 is started to pull up the clamp ring 8936, and the clamp ring 8936 drives the circuit socket 31 to rise, so that the pin 331 is inserted into the circuit socket 31 in a directional manner, and finally the fourth support plate 8937 and the clamp ring 8936 are synchronously raised to completely assemble the detection assembly 3 together, so that the end of the pin 331 extends out of the bottom surface of the circuit socket 31;

[0071] The second motor 82 is started again to start the third support plate 83 to flip, and the assembled detection assembly 3 is flipped close to the two second conveyor belts 94, so that the bottom surface of the circuit socket 31 and the end of the pin 331 extending outward face upward, and the third motor 85 is started again to drive the first tooth plate 84 to translate, so that the assembled detection assembly 3 is attached to the second housing 941, and the fourth motor 891 is started to separate the two sets of side clamping parts 893, thereby releasing the clamping of the detection assembly 3;

[0072] Start the fifth motor 92, flip the welding gun 97 to the top of the circuit socket 31, and connect the welding spot 333 between the pin 331 and the circuit socket 31, so that the GaN detection head 33 and the circuit socket 31 are electrically connected. After welding one pin 331, start the two second conveyor belts 94 by differential speed, so that the two second conveyor belts 94 cooperate to drive the detection component 3 to rotate as a whole, and rotate another pin 331 to the bottom end position of the welding gun 97, until each pin 331 is welded and fixed on the circuit socket 31;

[0073] Finally, the fifth motor 92 is started to turn the welding gun 97 downward, and the worker takes out the welded detection assembly 3 for the next step of assembly;

[0074] S2, glue filling and packaging;

[0075] Insert the welded detection assembly 3 into the sleeve 1, insert the bottom of the circuit socket 31 into the storage tube 2, plug the internal terminal 311 into the external terminal 11, and inject silica gel between the GaN detection head 33 and the sleeve 1 by the external glue injection device until the silica gel is cooled and formed into a glue seal ring 14;

[0076] S3, end capping;

[0077] The positioning tube 4 is mounted on the outer wall of the GaN detection head 33, and the positioning tube 4 is inserted into the sleeve 1. The first fixing bolt 12 is rotated to fix the positioning tube 4 inside the sleeve 1, and the end cover 5 is inserted into the sleeve 1. The second fixing bolt 53 is rotated to fix the end cover 5 on the positioning tube 4;

[0078] S4, wiring detection;

[0079] The external terminal 11 is connected to the ultraviolet signal display device, and the GaN detection head 33 is aimed at the ultraviolet light source to confirm that the ultraviolet detection signal is normal.

[0080] In this embodiment, the conveying mechanism 7 includes a first support plate 71, a first support plate 72, a first conveyor belt 73, a first bracket 74, a second support plate 75 and a pushing assembly 76. The first support plate 71 is fixed to the top surface of the bottom plate 6. Two first support plates 71 are mirror-imaged about the vertical center line of the bottom plate 6. The first support plates 72 are fixed to the adjacent sides of the two first support plates 71. The first conveyor belt 73 is arranged on the top surface of the first support plate 72. The first outer shell 731 is arranged outside the first conveyor belt 73. The first outer shell 731 is fixed to the top surface of the first support plate 72. Two first brackets 74 are fixed to the top surface of the first support plate 71. A second support plate 75 is connected between the two first brackets 74. Two second support plates 75 are mirror-imaged. A pushing assembly 76 is slidably connected between the two second support plates 75. One side of the pushing assembly 76 is connected to the top surface of the first bracket 74.

[0081] The circuit socket 31 is placed on two first pallets 72 and transported by the first conveyor belt 73. At the same time, the GaN detection head 33 with the pad 32 is placed on the two second pallets 75 on the top of the circuit socket 31 and pushed by the pushing assembly 76 to achieve double-layer synchronous transportation, so that the circuit socket 31 and the pad 32 can be clamped synchronously later, thereby improving the assembly efficiency.

[0082] In this embodiment, the pushing assembly 76 includes a first motor 761, a screw 762, a second bracket 763, a slider 764, a first connecting plate 765 and a pushing block 766. The screw 762 is arranged across the top surfaces of the two first brackets 74. One end of the screw 762 is connected to the first motor 761, and the first motor is fixed to the top surface of the first bracket 74. The outer wall of the screw 762 is sleeved with the second bracket 763, and the slider 764 is fixed to the bottom surface of the second bracket 763. The slider 764 is slidably sleeved on the side wall of the second support plate 75, and the first connecting plate 765 is fixed to one side of the slider 764. Two sliders 764 are arranged in a mirror image about the vertical center line of the first connecting plate 765, and a pushing block 766 is fixed to the top surface of the connecting plate. Example

[0083] like Figure 8-Figure 12 As shown, based on the above embodiment, this embodiment further provides the following contents:

[0084] In order to achieve the above effect, the following structure is adopted;

[0085] The flipping mechanism 8 includes a second support plate 81, a second motor 82, a third support plate 83, a first gear plate 84, a third motor 85, a first gear 86, a first pneumatic rod 87, a lifting plate 88 and a clamping assembly 89. The second support plate 81 is fixed to the top surface of the bottom plate 6. Two second support plates 81 are provided. The third support plate 83 is rotatably connected between the two second support plates 81. The side wall of the second support plate 81 is provided with a second motor 82. The rotating end of the second motor 82 passes through the second support plate 81 and is connected to the side wall of the third support plate 83. A guide plate 831 is fixed on the top surface of the support plate 83, a first tooth plate 84 is inserted inside the guide plate 831, a second motor 82 is arranged on the top surface of the guide plate 831, a first gear 86 is connected to the rotating end of the second motor 82, the bottom of the first gear 86 is meshed and connected with the top surface of the first tooth plate 84, a first pneumatic rod 87 is arranged on the top surface of one side of the first tooth plate 84, the telescopic bottom end of the first pneumatic rod 87 penetrates and is connected to the bottom of the first tooth plate 84, a lifting plate 88 is connected to the telescopic bottom end of the first pneumatic rod 87, and a clamping assembly 89 is connected to one side of the lifting plate 88;

[0086] By using the first tooth plate 84 to connect the clamping assembly 89, the clamping assembly 89 can be translated to the top of the conveying mechanism 7 to receive the conveyed GaN detection head 33 and the circuit socket 31. After receiving and clamping, the GaN detection head 33 and the circuit socket 31 are translated to separate from the conveying mechanism 7, and after being assembled and flipped to the top of the welding assembly 9 through the clamping assembly 89, the first tooth plate 84 is driven to place the detection assembly 3 clamped by the clamping assembly 89 on the welding assembly 9 for welding, thereby improving the convenience of processing operations.

[0087] In this embodiment, the clamping assembly 89 includes a fourth motor 891, a support 892 and a side clamping part 893. The support 892 is connected to the side wall of the lifting plate 88. A side clamping part 893 is inserted into one side of the support 892. Two groups of side clamping parts 893 are arranged to rotate 180° about the circumferential direction of the support 892. A fourth motor 891 is arranged on the top surface of the support 892. A second gear 894 is rotatably connected inside the support 892. The second gear 894 is meshed and connected between the two groups of side clamping parts 893. The rotating bottom end of the fourth motor 891 passes through and is connected to the inside of the support 892. The second gear 894 is fixed to the rotating bottom end of the fourth motor 891.

[0088] In this embodiment, the side clamping component 893 includes a fixed block 8931, a clamping plate 8932, a second tooth plate 8933, a second pneumatic rod 8934, a third pneumatic rod 8935, a clamping ring 8936, a fourth support plate 8937 and a clamping block 8938. The second tooth plate 8933 is fixed to the top surface of the fixed block 8931. The second tooth plate 8933 is plugged into the inside of the support 892. One side of the second tooth plate 8933 is meshed and connected with the second gear 894. The second tooth plate 8933 is meshed and driven by the second gear 894 to make the fixed block 8931 translate. The clamping plate 8932 is plugged into the inside of the fixed block 8931. The clamping plate 8932 penetrates and is plugged into the inside of the support 892. The clamping plate 8932 is used to clamp the GaN detection head 33 inserted in the support 892. The top surface of the fixed block 8931 is provided with a second pneumatic rod 8934 and a third pneumatic rod 8935. The telescopic bottom end of the second pneumatic rod 8934 is connected with a clamping ring 8936. The clamping ring 8936 is translated and clamped to the side wall of the circuit socket 31 through the second pneumatic rod 8934. The telescopic bottom end of the third pneumatic rod 8935 is connected with a fourth supporting plate 8937. The top surface of the fourth supporting plate 8937 is fixed with a clamping block 8938. The fourth supporting plate 8937 is translated and attached to the bottom surface of the pad 32 through the third pneumatic rod 8935. The clamping block 8938 is translated and clamped to the side wall of the pad 32 through the third pneumatic rod 8935.

[0089] The two sets of side clamping parts 893 are driven to translate simultaneously by the second gear 894, so that the clamping plate 8932, the clamping block 8938 and the clamping ring 8936 respectively clamp the GaN detection head 33, the pad 32 and the circuit socket 31 synchronously, and then the third pneumatic rod 8935 is started to push the fourth support plate 8937, so that the pad 32 clamped by the clamping block 8938 is first lowered, and the pad 32 guides and corrects the penetrating pin 331 to the vertical direction, and then the second pneumatic rod 8934 is started to pull up the clamping ring 8936, and the clamping ring 8936 drives the circuit socket 31 to rise, so that the pin 331 is inserted into the circuit socket 31 in a directional manner, and finally the fourth support plate 8937 and the clamping ring 8936 are synchronously raised to completely assemble the detection component 3 together, ensuring the positioning accuracy of the pin 331 insertion, thereby improving the assembly accuracy and stability of the detector.

[0090] In this embodiment, the welding assembly 9 includes a third support plate 91, a fifth motor 92, a second connecting plate 93, a second conveyor belt 94, a rotating shaft 95, a flip frame 96 and a welding gun 97. The third support plate 91 is fixed to the top surface of the bottom plate 6. Two third support plates 91 are mirrored about the vertical center line of the bottom plate 6. The second connecting plate 93 is fixed to the top surface of the third support plate 91. A second shell 941 is fixed to one side of the second connecting plate 93. A second conveyor belt 94 is arranged inside the second shell 941. A rotating shaft 95 is rotatably connected between the two third support plates 91. A flip frame 96 is sleeved on the outer wall of the rotating shaft 95. A welding gun 97 is arranged on one side of the flip frame 96. The fifth motor 92 is arranged on the side wall of the third support plate 91. The rotating end of the fifth motor 92 is fixedly connected to one end of the rotating shaft 95.

[0091] The assembled detection assembly 3 is placed on two second conveyor belts 94 by flipping and translating, the welding gun 97 is flipped to the top of the circuit socket 31, and the inserted pins 331 and the circuit socket 31 are welded together, so that the GaN detection head 33 and the circuit socket 31 are electrically connected together, and the assembly and fixation of the detection assembly 3 are completed;

[0092] When the pins 331 are welded by the welding gun 97 , the conveying speed of the two second conveyor belts 94 can be adjusted to control the rotation of the detection assembly 3 , thereby welding the circuit socket 31 one by one in the circumferential direction, thereby improving the convenience of welding the pins 331 .

[0093] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0094] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. The ultraviolet detector based on GaN chip is characterized by: The sleeve comprises a sleeve, wherein the bottom surface of the sleeve is penetrated and connected with an external terminal, a storage cylinder is inserted in the sleeve, a detection component is penetrated and connected in the storage cylinder, the bottom end of the detection component is inserted in the external terminal, a positioning cylinder is sleeved on the outer wall of the detection component, a first fixing bolt is penetrated and connected in the outer wall of the sleeve, one end of the first fixing bolt is connected to the inside of the positioning cylinder, an end sealing cover is inserted in the top end of the sleeve, the end sealing cover is attached to the top surface of the positioning cylinder, a second fixing bolt is penetrated and connected in the end sealing cover, the bottom end of the second fixing bolt is connected to the inside of the positioning cylinder, a glass window is penetrated in the end sealing cover, an annular cavity is formed between the outer wall of the detection component and the inner wall of the sleeve, a rubber sealing ring is filled and formed in the annular cavity, and the rubber sealing ring is arranged on the bottom surface of the positioning cylinder; The detection component includes a circuit socket, a pad and a GaN detection head. The circuit socket is plugged into the storage tube. The bottom surface of the circuit socket is connected to an internal terminal. The bottom end of the internal terminal is plugged into the external terminal. The top surface of the circuit socket is attached to the pad. The top surface of the pad is attached to the GaN detection head. The bottom surface of the GaN detection head is connected to a plurality of pins. The circuit socket is provided with a plurality of first sockets. The pad is provided with a plurality of second sockets. The pins pass through the first sockets and the second sockets. The bottom ends of the pins are connected to the bottom surface of the circuit socket. A solder joint is welded between the bottom end of the pin and the bottom surface of the circuit socket.

2. The GaN chip-based ultraviolet detector according to claim 1, characterized in that: The top surface of the circuit socket is fixed with an insert block, the side wall of the insert block is fixed with a card protrusion, the side wall of the GaN detection head is provided with a positioning groove, the side wall of the pad is fixed with a card positioning plate, the top surface of the pad is fixed with a plug, the insert block penetrates and is inserted into the card positioning plate, the card protrusion is inserted into the positioning groove, and the plug post is inserted into the bottom surface of the circuit socket.

3. The GaN chip-based ultraviolet detector according to claim 2, characterized in that: A slot is provided on the inner wall of the sleeve, the top of the slot is a through structure, a first limiting strip is fixed on the outer wall of the positioning tube, and a second limiting strip is fixed on the outer wall of the end cover, and both the first limiting strip and the second limiting strip are plugged into the slot.

4. The method for preparing a GaN chip-based ultraviolet detector according to claim 3, characterized in that: The preparation method comprises the following steps: S1, detection assembly; Place the GaN detection head and circuit socket with the insert into the detection welding device for transportation; The detection welding device comprises a bottom plate, a conveying mechanism, a turning mechanism and a welding assembly. The top surface of the bottom plate is provided with the conveying mechanism, the turning mechanism and the welding assembly in sequence along the conveying direction. The conveying mechanism is a double-layer conveying structure. The conveying mechanism synchronously conveys the GaN detection head and the circuit socket, the flipping mechanism clamps and assembles the GaN detection head, the pad and the circuit socket into one body to form a detection assembly, the flipping mechanism flips the detection assembly to the top of the welding assembly, and the welding assembly electrically connects the circuit socket and the GaN detection head through welding points; S2, glue filling and packaging; Insert the welded detection assembly into the sleeve, insert the bottom of the circuit socket into the storage tube, insert the internal terminal into the external terminal, and use the external glue filling device to fill the gap between the GaN detection head and the sleeve with silicone until the silicone cools and forms a rubber seal ring; S3, end capping; The positioning tube is mounted on the outer wall of the GaN detection head, the positioning tube is inserted into the sleeve, the first fixing bolt is turned to fix the positioning tube inside the sleeve, the end cover is inserted into the sleeve, and the second fixing bolt is turned to fix the end cover on the positioning tube; S4, wiring detection; Connect the external terminal to the UV signal display device, aim the GaN detection head at the UV light source, and confirm that the UV detection signal is normal.

5. The method for preparing a GaN chip-based ultraviolet detector according to claim 4, characterized in that: The conveying mechanism includes a first support plate, a first support plate, a first conveyor belt, a first bracket, a second support plate and a pushing assembly, wherein the first support plate is fixed to the top surface of the bottom plate, two first support plates are arranged in a mirror image about the vertical center line of the bottom plate, first support plates are fixed to adjacent sides of the two first support plates, a first conveyor belt is arranged on the top surface of the first support plate, a first shell is arranged outside the first conveyor belt, the first shell is fixed to the top surface of the first support plate, two first brackets are fixed to the top surface of the first support plate, a second support plate is connected between the two first brackets, two second support plates are arranged in a mirror image, a pushing assembly is slidably connected between the two second support plates, and one side of the pushing assembly is connected to the top surface of the first bracket; The circuit socket is placed on two first pallets and transported by the first conveyor belt. At the same time, the GaN detection head with a pad is placed on two second pallets on top of the circuit socket and pushed by a pushing assembly to achieve double-layer synchronous transportation, so that the circuit socket and the pad can be clamped and installed synchronously later, thereby improving assembly efficiency.

6. The method for preparing a GaN chip-based ultraviolet detector according to claim 5, characterized in that: The pushing assembly includes a first motor, a screw, a second bracket, a slider, a first connecting plate and a pushing block. The screw is arranged across the top surfaces of the two first brackets, one end of the screw is connected to the first motor, the first motor is fixed to the top surface of the first bracket, the second bracket is sleeved on the outer wall of the screw, a slider is fixed on the bottom surface of the second bracket, the slider is slidably sleeved on the side wall of the second support plate, the first connecting plate is fixed on one side of the slider, two sliders are arranged in a mirror image about the vertical center line of the first connecting plate, and a pushing block is fixed on the top surface of the connecting plate.

7. The method for preparing a GaN chip-based ultraviolet detector according to claim 4, characterized in that: The flipping mechanism includes a second support plate, a second motor, a third support plate, a first tooth plate, a third motor, a first gear, a first pneumatic rod, a lifting plate and a clamping assembly, wherein the second support plate is fixed to the top surface of the bottom plate, two second support plates are provided, and the third support plate is rotatably connected between the two second support plates, a second motor is provided on the side wall of the second support plate, a rotating end of the second motor passes through the second support plate and is connected to the side wall of the third support plate, a guide plate is fixed to the top surface of the third support plate, a first tooth plate is inserted into the inside of the guide plate, a second motor is provided on the top surface of the guide plate, the rotating end of the second motor is connected to the first gear, the bottom of the first gear is meshed with the top surface of the first tooth plate, a first pneumatic rod is provided on the top surface of one side of the first tooth plate, the telescopic bottom end of the first pneumatic rod passes through and is connected to the bottom of the first tooth plate, the telescopic bottom end of the first pneumatic rod is connected to the lifting plate, and a clamping assembly is connected to one side of the lifting plate.

8. The method for preparing a GaN chip-based ultraviolet detector according to claim 7, characterized in that: The clamping assembly includes a fourth motor, a support and a side clamping part. The support is connected to the side wall of the lifting plate. A side clamping part is inserted into one side of the support. Two groups of side clamping parts are arranged to rotate 180° about the circumferential direction of the support. A fourth motor is arranged on the top surface of the support. A second gear is connected to the inside of the support for rotation. The second gear is meshed and connected between the two groups of side clamping parts. The rotating bottom end of the fourth motor passes through and is connected to the inside of the support. The second gear is fixed to the rotating bottom end of the fourth motor.

9. The method for preparing a GaN chip-based ultraviolet detector according to claim 8, characterized in that: The side clamping component includes a fixed block, a clamping plate, a second tooth plate, a second pneumatic rod, a third pneumatic rod, a clamping ring, a fourth support plate and a clamping block. The second tooth plate is fixed on the top surface of the fixed block, the second tooth plate is inserted into the support, one side of the second tooth plate is meshed with the second gear, and the second tooth plate is meshed with the second gear to enable the fixed block to translate. A clamping plate is inserted into the fixed block, the clamping plate penetrates and is inserted into the support, and the clamping plate is used to clamp the GaN detection head inserted into the support. The top surface of the fixed block is provided with a second pneumatic rod and a third pneumatic rod, the telescopic bottom end of the second pneumatic rod is connected with a clamping ring, and the clamping ring is translated and clamped to the side wall of the circuit socket through the second pneumatic rod, the telescopic bottom end of the third pneumatic rod is connected with the fourth support plate, the top surface of the fourth support plate is fixed with a clamping block, the fourth support plate is translated and adhered to the bottom surface of the pad through the third pneumatic rod, and the clamping block is translated and clamped to the side wall of the pad through the third pneumatic rod.

10. The method for preparing a GaN chip-based ultraviolet detector according to claim 4, characterized in that: The welding assembly includes a third support plate, a fifth motor, a second connecting plate, a second conveyor belt, a rotating shaft, a turning frame and a welding gun. The third support plate is fixed to the top surface of the base plate. Two third support plates are mirrored about the vertical center line of the base plate. The second connecting plate is fixed to the top surface of the third support plate. A second outer shell is fixed to one side of the second connecting plate. A second conveyor belt is arranged inside the second outer shell. A rotating shaft is rotatably connected between the two third support plates. A turning frame is sleeved on the outer wall of the rotating shaft. A welding gun is arranged on one side of the turning frame. The fifth motor is arranged on the side wall of the third support plate. The rotating end of the fifth motor is fixedly connected to one end of the rotating shaft.

Citation Information

Patent Citations

  • Novel gallium nitride ultraviolet detector

    CN106783832A

  • Buried-electrode GaN ultraviolet photoelectric sensor and application circuit module thereof

    CN107546283A