Laser-based insulator cleaning method and apparatus

Abstract

The application provides a laser-based insulator cleaning method and device, the method comprising: emitting laser to clean each to-be-cleaned area of the insulator according to preset initial laser cleaning process parameters; collecting light information and laser angle information of each cleaned area, determining laser parameter factors of each cleaned area based on the light information and the laser angle information; obtaining laser average parameter factors of each cleaned area based on the laser parameter factors; if the laser average parameter factors are greater than preset initial laser parameter factors, determining a cleaned area with a laser parameter factor greater than the laser average parameter factors as a target cleaning area; analyzing and processing the light information of the target cleaning area to obtain impurity components of the target cleaning area; obtaining target laser cleaning process parameters of the target cleaning area based on the laser parameter factors and the impurity components of the target cleaning area; and controlling a laser emitter to emit laser to clean the target cleaning area according to the target laser cleaning process parameters.

Description

Technical Field

[0001] This invention relates to the field of insulator cleaning technology, and in particular to a laser-based insulator cleaning method and apparatus. Background Technology

[0002] Insulators are crucial insulation devices in power systems. Due to prolonged exposure to the natural environment, insulator surfaces accumulate dust and impurities, becoming contaminated. This can range from affecting insulator performance to causing line flashovers, paralyzing the entire power system, and leading to large-scale power outages for many users.

[0003] Currently, insulators can generally be cleaned manually, with high-pressure water jets, or using chemical cleaning agents. However, manual cleaning is inefficient, high-pressure water jets pose safety risks, and chemical cleaning is complex and costly. Therefore, existing methods for cleaning insulators cannot meet operational requirements. Summary of the Invention

[0004] This invention provides a laser-based insulator cleaning method and apparatus to solve the technical problem that existing technologies cannot efficiently and safely clean insulators.

[0005] On one hand, the present invention provides a laser-based insulator cleaning method, which is applied to an insulator cleaning system. The insulator cleaning system includes an optical signal factor collection component, a laser angle collection component, a laser emission component, an optical signal processing component, and a control component. The control component is signal-connected to the laser angle collection component, the laser emission component, and the optical signal processing component, respectively. The optical signal processing component is signal-connected to the optical signal factor collection component. The laser emission component includes a laser emitter and a laser positioning device. The method includes:

[0006] The control component controls the laser emitter to emit lasers according to preset initial laser cleaning process parameters to clean each area of ​​the insulator to be cleaned one by one, and controls the laser positioning device to record the cleaning completed areas reached by the laser in each area to be cleaned.

[0007] The control component controls the optical signal factor collection component to collect optical information of each of the cleaning completed areas and the laser angle collection component to collect laser angle information of each of the cleaning completed areas, and determines the laser parameter factor of each of the cleaning completed areas based on the optical information and the laser angle information.

[0008] The control component obtains the average laser parameter factor of each of the cleaned areas based on the laser parameter factor of each of the cleaned areas.

[0009] If the laser average parameter factor is greater than the preset initial laser parameter factor, the cleaning completed area where the laser parameter factor is greater than the laser average parameter factor is determined as the target cleaning area.

[0010] The control component controls the optical signal processing component to analyze and process the optical information of the target cleaning area to obtain the impurity composition of the target cleaning area.

[0011] Based on the laser parameter factor of the target cleaning area and the impurity composition, the initial laser cleaning process parameters corresponding to the target cleaning area are adjusted to obtain the adjusted target laser cleaning process parameters.

[0012] The control component controls the laser emitter to emit laser light to clean the target cleaning area according to the target laser cleaning process parameters.

[0013] According to a laser-based insulator cleaning method provided by the present invention, the optical signal factor collection component includes a first robotic arm, a substrate, an optical sensor, a temperature sensor, and a laser rangefinder. The first robotic arm is spherically connected to one side of the substrate. The optical sensor, the temperature sensor, and the laser rangefinder are respectively connected to the other side of the substrate via brackets. The laser angle collection component includes a second robotic arm and a laser goniometer, with the laser goniometer mounted on the second robotic arm. The method involves controlling the optical signal factor collection component to collect optical information from each cleaned area and the laser angle collection component to collect laser angle information from each cleaned area, and determining the laser parameter factor of each cleaned area based on the optical information and the laser angle information, including:

[0014] The control component controls the second robotic arm to drive the laser goniometer to measure the angle of incidence and the angle of reflection between the laser emitted by the laser emitter and the cleaning area reached by the laser.

[0015] The control component controls the first robotic arm to drive the light sensor, the temperature sensor, and the laser rangefinder to measure the light signal and temperature of the reflection angle region between the laser and the area reached by the laser, as well as the distance between the laser rangefinder and the area reached by the laser.

[0016] The laser parameter factors of the cleaned area are determined based on the incident angle, the reflection angle, the optical signal, the temperature, and the distance.

[0017] According to a laser-based insulator cleaning method provided by the present invention, the laser emitting assembly further includes a third robotic arm, a laser cleaning head, and a laser positioning groove. The third robotic arm is threadedly connected to the laser cleaning head and the laser positioning groove, respectively. The laser emitter is signal-connected to the laser cleaning head, and the laser positioning device is located in the laser positioning groove. The method involves controlling the laser emitter to emit laser light according to preset initial laser cleaning process parameters to clean each area of ​​the insulator to be cleaned, and controlling the laser positioning device to record the cleaned areas reached by the laser in each area to be cleaned.

[0018] The control component controls the laser emitter to emit laser according to the preset initial laser cleaning process parameters, and controls the third robotic arm to move the laser cleaning head and the laser positioning device to clean each area of ​​the insulator to be cleaned one by one, and records the area of ​​each area to be cleaned that has been reached by the laser.

[0019] According to a laser-based insulator cleaning method provided by the present invention, the optical signal processing component includes a light wavelength analysis module. The control component controls the optical signal processing component to analyze and process the light information of the target cleaning area to obtain the impurity composition of the target cleaning area, including:

[0020] The control component controls the light wavelength analysis module to decompose the light signal in the light information of the target cleaning area into light components of different wavelengths.

[0021] The impurity composition of the target cleaning area is obtained based on the light components of different wavelengths.

[0022] According to a laser-based insulator cleaning method provided by the present invention, the optical signal processing component further includes a signal amplification module, which is signal-connected to the light wavelength analysis module. Before determining the target laser cleaning process parameters for the target cleaning region based on the laser parameter factor of the target cleaning region and the impurity composition, the method further includes:

[0023] The signal amplification module is controlled to amplify the optical signal and the impurity component in the optical information to obtain an amplified signal, and the amplified signal is output to the control component.

[0024] According to a laser-based insulator cleaning method provided by the present invention, the signal amplification module includes an optical fiber amplifier and a photodetector. The optical fiber amplifier is signal-connected to the photodetector. The method of controlling the signal amplification module to amplify the optical signal and the impurity component in the optical information to obtain an amplified signal, and outputting the amplified signal to the control component, includes:

[0025] The fiber amplifier is controlled to amplify the optical signal and the impurity components in the optical information to obtain an amplified signal.

[0026] The photodetector is controlled to convert the amplified signal into an electrical signal, and the electrical signal is output to the control component.

[0027] According to a laser-based insulator cleaning method provided by the present invention, the step of determining the target laser cleaning process parameters of the target cleaning region based on the laser parameter factor of the target cleaning region and the impurity composition includes:

[0028] The laser parameter factors and impurity components of the target cleaning area are matched with a preset cleaning process parameter comparison table; wherein the cleaning process parameter comparison table includes the correspondence between each laser cleaning process parameter and the laser parameter factors and impurity components.

[0029] The laser cleaning process parameters corresponding to the same laser parameter factors and impurity components as the target cleaning area are found in the cleaning process parameter comparison table and are used as the target laser cleaning process parameters.

[0030] According to a laser-based insulator cleaning method provided by the present invention, if the average laser parameter factor is less than or equal to a preset initial laser parameter factor, the control component controls the laser emitting component to stop emitting laser.

[0031] According to the present invention, a laser-based insulator cleaning method is provided, wherein the light wavelength analysis module includes a spectrometer.

[0032] On the other hand, the present invention also provides an insulator cleaning device based on optical signal factor. The device is applied to an insulator cleaning system, which includes an optical signal factor collection component, a laser angle collection component, a laser emission component, an optical signal processing component, and a control component. The control component is signal-connected to the laser angle collection component, the laser emission component, and the optical signal processing component, respectively. The optical signal processing component is signal-connected to the optical signal factor collection component. The laser emission component includes a laser emitter and a laser positioning device. The device includes:

[0033] The laser cleaning module is used to control the laser emitter to emit lasers according to preset initial laser cleaning process parameters to clean each area of ​​the insulator to be cleaned one by one, and to control the laser positioning device to record the cleaning completed areas reached by the laser in each area to be cleaned.

[0034] The parameter factor collection module is used to control the optical signal factor collection component to collect optical information of each of the cleaning completed areas and the laser angle collection component to collect laser angle information of each of the cleaning completed areas through the control component, and to determine the laser parameter factor of each of the cleaning completed areas based on the optical information and the laser angle information.

[0035] The parameter factor calculation module is used to obtain the average laser parameter factor of each of the cleaned areas based on the laser parameter factor of each of the cleaned areas through the control component.

[0036] The parameter factor determination module is used to determine the cleaning completed area where the laser parameter factor is greater than the laser average parameter factor as the target cleaning area if the laser average parameter factor is greater than the preset initial laser parameter factor.

[0037] The contamination analysis module is used to control the optical signal processing component to analyze and process the optical information of the target cleaning area through the control component, so as to obtain the impurity composition of the target cleaning area;

[0038] The cleaning process parameter determination module is used to adjust the initial laser cleaning process parameters corresponding to the target cleaning area based on the laser parameter factor of the target cleaning area and the impurity composition feedback, so as to obtain the adjusted target laser cleaning process parameters.

[0039] The laser cleaning module is further configured to control the laser emitter to emit laser light to clean the target cleaning area according to the target laser cleaning process parameters via the control component.

[0040] On the other hand, the present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the laser-based insulator cleaning method as described above.

[0041] The laser-based insulator cleaning method and apparatus provided by this invention uses a control component to control a laser emitter to emit laser light according to preset initial laser cleaning process parameters, cleaning each area of ​​the insulator to be cleaned one by one. Compared with manual cleaning, this method saves manpower and has high cleaning efficiency. Compared with high-pressure water gun cleaning, laser is easier to control, less likely to damage the insulator, and has high safety. Compared with chemical cleaning agents, it is also simpler. If the average laser parameter factor is greater than the preset initial laser parameter factor, a target cleaning area with a laser parameter factor greater than the average laser parameter factor is identified in each cleaning area. The control component controls an optical signal processing component to analyze the laser parameter factor of the target cleaning area to obtain the impurity composition of the target cleaning area. Based on the laser parameter factor and impurity composition of the target cleaning area, the target laser cleaning process parameters for the target cleaning area are determined. The control component then controls the laser emitter to emit laser light according to the target laser cleaning process parameters to clean the target cleaning area. The above method only re-cleans the target cleaning areas where the laser parameter factor is greater than the average laser parameter factor in each cleaned area, rather than re-cleaning the entire insulator. The cleaning target is more targeted, greatly reducing the scope of re-cleaning and improving cleaning efficiency. Furthermore, the target laser cleaning process parameters for the target cleaning area are determined based on the laser parameter factor and impurity composition of the target cleaning area. In other words, the corresponding cleaning process parameters are determined according to the actual situation of the target cleaning area. That is, the cleaning process parameters are variable and adjustable, rather than using a fixed cleaning parameter for re-cleaning. The cleaning method in this embodiment is more reasonable and can achieve thorough cleaning of the insulator without damaging it. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0043] Figure 1 This is a schematic flowchart of the laser-based insulator cleaning method provided in an embodiment of the present invention;

[0044] Figure 2 This is a schematic diagram of the insulator cleaning system provided in an embodiment of the present invention;

[0045] Figure 3 This is a partial structural schematic diagram of the optical signal factor collection component of the insulator cleaning system provided in an embodiment of the present invention;

[0046] Figure 4This is a partial structural schematic diagram of the laser emitting component of the insulator cleaning system provided in an embodiment of the present invention;

[0047] Figure 5 This is a schematic diagram of the structure of the insulator cleaning device based on optical signal factors provided in an embodiment of the present invention;

[0048] Figure 6 This is a schematic diagram of the structure of the electronic device provided in an embodiment of the present invention. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0050] Figure 1 This is a schematic flowchart of a laser-based insulator cleaning method provided in an embodiment of the present invention. The method can be applied to an insulator cleaning system, which includes an optical signal factor collection component, a laser angle collection component, a laser emission component, an optical signal processing component, and a control component. The control component is signal-connected to the laser angle collection component, the laser emission component, and the optical signal processing component. The optical signal processing component is signal-connected to the optical signal factor collection component. The laser emission component includes a laser emitter and a laser positioning device.

[0051] like Figure 1 As shown in the embodiment of the present invention, the laser-based insulator cleaning method can be executed by a computer, mobile phone, or smart wearable device, and the method mainly includes the following steps:

[0052] 101. The control component controls the laser emitter to emit lasers according to the preset initial laser cleaning process parameters to clean each area of ​​the insulator to be cleaned one by one, and controls the laser positioning device to record the area that the laser has reached in each area to be cleaned and the area that has been cleaned.

[0053] In this step, the insulator can be divided into multiple areas to be cleaned. For example, an insulator typically includes many rings, each of which can be considered a cleaning area. That is, the shape of the cleaning area can be ring-shaped; of course, other shapes are also possible, and this embodiment does not impose specific limitations. When the cleaning area is ring-shaped, it can be divided into multiple curved surface regions. The laser is controlled to move circumferentially within these curved surface regions to perform circumferential cleaning. Circumferential cleaning is more suitable for the ring structure of the insulator, reducing the possibility of missed areas. The portion of the cleaning area that the laser has reached or traversed can be considered the cleaned area. Initial laser cleaning process parameters are generally sufficient to clean the insulator's cleaning areas thoroughly. These parameters typically include the laser frequency and power, the laser type (e.g., point laser or line laser), and the laser pulse width, wavelength, etc.

[0054] 102. The control component controls the optical signal factor collection component to collect the optical information of each cleaning completed area and the laser angle collection component to collect the laser angle information of each cleaning completed area, and determines the laser parameter factor of each cleaning completed area based on the optical information and laser angle information.

[0055] In this step, the laser parameter factors of each cleaned area can be correlated with the cleaned areas that have been reached by the laser in each area to be cleaned, as recorded above, thereby recording the laser parameter factors of each cleaned area.

[0056] 103. The average laser parameter factor of each cleaned area is obtained by controlling the laser parameter factor of each cleaned area.

[0057] In this step, it can be understood that the laser parameter factors of each cleaned area are summed and then divided by the total number of cleaned areas, which is the average laser parameter factor.

[0058] 104. If the average laser parameter factor is greater than the preset initial laser parameter factor, the cleaning completed area where the laser parameter factor is greater than the average laser parameter factor is determined as the target cleaning area.

[0059] In this step, the initial laser parameter factor corresponds to the initial laser cleaning process parameters. If the average laser parameter factor is greater than the preset initial laser parameter factor, it indicates that the insulator cleaning is not thorough enough. If the laser parameter factor in the cleaned area is greater than the average laser parameter factor, then that area can be considered the target cleaning area.

[0060] 105. The optical signal processing component is controlled by the control component to analyze and process the optical information of the target cleaning area to obtain the impurity composition of the target cleaning area.

[0061] In this step, it can be understood that when an insulator is exposed to air for a long time, the composition of impurities in different locations of the insulator may be different.

[0062] 106. Based on the feedback of the laser parameter factor and impurity composition of the target cleaning area, the initial laser cleaning process parameters corresponding to the target cleaning area are adjusted to obtain the adjusted target laser cleaning process parameters.

[0063] In this step, the laser parameter factors and impurity components of the target cleaning area were quantitatively analyzed to obtain suitable target laser cleaning process parameters, rather than using a fixed cleaning process parameter, which has a strong cleaning targeting.

[0064] 107. The control component controls the laser emitter to emit laser to clean the target cleaning area according to the target laser cleaning process parameters.

[0065] In this step, under normal circumstances, after the laser is emitted to clean the target cleaning area according to the target laser cleaning process parameters, the target cleaning area can be thoroughly cleaned without damaging the surface of the insulator. There is no need to return to step 102 to repeat the process after cleaning is completed.

[0066] In this embodiment, a control component controls a laser emitter to emit laser light according to preset initial laser cleaning process parameters, cleaning each area of ​​the insulator to be cleaned one by one. Compared to manual cleaning, this saves manpower and has high cleaning efficiency. Compared to high-pressure water gun cleaning, laser is easier to control, less likely to damage the insulator, and has high safety. Compared to chemical cleaning agents, it is also simpler. If the average laser parameter factor is greater than the preset initial laser parameter factor, a target cleaning area with a laser parameter factor greater than the average laser parameter factor is identified in each cleaning completed area. The control component controls an optical signal processing component to analyze and process the laser parameter factor of the target cleaning area to obtain the impurity composition of the target cleaning area. Based on the laser parameter factor and impurity composition of the target cleaning area, the target laser cleaning process parameters for the target cleaning area are determined. The control component then controls the laser emitter to emit laser light according to the target laser cleaning process parameters to clean the target cleaning area. The above method only re-cleans the target cleaning areas where the laser parameter factor is greater than the average laser parameter factor in each cleaned area, rather than re-cleaning the entire insulator. The cleaning target is more targeted, greatly reducing the scope of re-cleaning and improving cleaning efficiency. Furthermore, the target laser cleaning process parameters for the target cleaning area are determined based on the laser parameter factor and impurity composition of the target cleaning area. In other words, the corresponding cleaning process parameters are determined according to the actual situation of the target cleaning area. That is, the cleaning process parameters are variable and adjustable, rather than using a fixed cleaning parameter for re-cleaning. The cleaning method in this embodiment is more reasonable and can achieve thorough cleaning of the insulator without damaging it.

[0067] In one embodiment of this specification, the optical signal factor collection component includes a first robotic arm, a substrate, an optical sensor, a temperature sensor, and a laser rangefinder. The first robotic arm is spherically connected to one side of the substrate. The optical sensor, temperature sensor, and laser rangefinder are respectively connected to the other side of the substrate via brackets. The laser angle collection component includes a second robotic arm and a laser goniometer. The laser goniometer is mounted on the second robotic arm. The optical signal factor collection component is controlled by a control component to collect optical information from each cleaned area, and the laser angle collection component is controlled to collect laser angle information from each cleaned area, which serves as the laser parameter factor for each cleaned area, including:

[0068] The control unit moves the second robotic arm, which in turn drives a laser goniometer to measure the angle of incidence and the angle of reflection between the laser emitted by the laser emitter and the cleaned area reached by the laser. The angle of incidence and the angle of reflection are the laser angle information.

[0069] The control unit moves the first robotic arm, which in turn drives a light sensor, a temperature sensor, and a laser rangefinder to measure the light signal, temperature, and distance between the laser and the area reached by the laser at the reflection angle between the laser and the cleaned area. The light signal, temperature, and distance constitute the light information.

[0070] The laser parameter factors of the cleaned area are determined based on the incident angle, reflection angle, light signal, temperature, and distance.

[0071] In this embodiment, after the laser goniometer measures the angle of incidence between the laser and the cleaned area reached by the laser, the reflection angle can be obtained from the angle of incidence, and thus the reflection angle region can be obtained. Those skilled in the art will understand the concept of the reflection angle region, which will not be elaborated here. The light signal, temperature, and distance obtained from the reflection angle region better reflect the cleaning result of the area reached by the laser. Therefore, the angle of incidence... Reflection angle , optical signal ,temperature and distance Laser parameter factors in the cleaned area This allows for a more accurate reflection of the cleaning results at the laser's reach, facilitating the acquisition of more precise target laser cleaning process parameters in subsequent steps. Specifically, this can be achieved through formulas. The laser parameter factors are obtained. Among them, Indicates the laser parameter factor, Indicates temperature factor, Indicates light factor, Represents the distance factor. Represents the incident angle factor. This represents the reflection angle factor. The laser parameter factor is calculated from 0 to 1, and the calculation result is rounded to the nearest tenth. , , , , These can be understood as their respective temperatures. , optical signal ,distance , angle of fire Reflection angle The result after normalization. Normalization can be understood as f(x). norm = (x - min(x)) / (max(x) - min(x)), where x represents the original data, max(x) and min(x) represent the maximum and minimum values ​​of the original data, respectively, and f(x) normThis is expressed as a normalized factor. Laser parameter factors can be graded according to their calculation range; for example, the first grade is 0 to 0.1, the second grade is 0.1 to 0.3, the third grade is 0.3 to 0.6, and the fourth grade is 0.6 to 1.0. The smaller the value of the laser parameter factor, the cleaner the cleaning. Initial laser cleaning process parameters generally correspond to the second grade, for example, 0.2 in the second grade. Typically, after the insulator has completed its first cleaning pass, the laser parameter factor for the cleaned area of ​​the entire insulator is determined based on the incident angle, reflection angle, light signal, temperature, and distance.

[0072] It is understandable that the position of the insulator can be known in advance. Therefore, based on the position of the insulator, the first and second robotic arms can be controlled to move to the desired positions. The first robotic arm is spherically connected to one side of the substrate, thereby controlling the substrate to rotate within a certain angle range. This facilitates the collection of light signals by the light sensor, the temperature sensor to collect temperature, and the laser rangefinder to collect distance on the substrate. Anti-slip pads are fixed between the light sensor, temperature sensor, and laser rangefinder and their respective connected brackets, thus preventing direct contact with their brackets and protecting the light sensor, temperature sensor, and laser rangefinder. The brackets can be motorized. The distance between the laser rangefinder and the area reached by the laser after cleaning can be calculated using the formula... The result is given, where l represents the distance between the laser rangefinder and the area reached by the laser, and x represents the baseline distance of the laser rangefinder. This indicates the angle between the position reached by the laser on the insulator (the area after cleaning) and the baseline.

[0073] In one embodiment of this specification, the laser emitting assembly further includes a third robotic arm, a laser cleaning head, and a laser positioning groove. The third robotic arm is threadedly connected to the laser cleaning head and the laser positioning groove, respectively. The laser emitter is signal-connected to the laser cleaning head. The laser positioning device is located in the laser positioning groove. A control component controls the laser emitter to emit laser light according to preset initial laser cleaning process parameters to clean each area of ​​the insulator to be cleaned, and controls the laser positioning device to record the cleaned areas reached by the laser in each area to be cleaned, including:

[0074] The control component controls the laser emitter to emit laser according to the preset initial laser cleaning process parameters, and controls the third robotic arm to move the laser cleaning head and laser positioning device to clean each area of ​​the insulator to be cleaned one by one, and records the area of ​​each area to be cleaned that has been cleaned by the laser.

[0075] In this embodiment, both the laser positioning device and the laser cleaning head can face the same direction, facilitating the laser positioning device's positioning of the laser output from the laser cleaning head. The third robotic arm can be controlled to move to the desired position based on the insulator's location, thereby cleaning the insulator. The cleaned areas reached by the laser in each area to be cleaned are recorded, which can also be understood as recording the laser's position. The control component controls the laser emitter to emit lasers according to preset initial laser cleaning process parameters, and controls the third robotic arm to move the laser cleaning head and laser positioning device, cleaning each area of ​​the insulator one by one and recording the cleaned areas reached by the laser in each area. This saves manpower and is very simple and efficient.

[0076] In one embodiment of this specification, the optical signal processing component includes a light wavelength analysis module. A control component controls the optical signal processing component to analyze and process the light information of the target cleaning area to obtain the impurity composition of the target cleaning area, including:

[0077] The control component controls the light wavelength analysis module to decompose the light signal in the light information of the target cleaning area into light components of different wavelengths;

[0078] The impurity composition of the target cleaning area is obtained based on the light composition of different wavelengths.

[0079] In this embodiment, a control component controls a light wavelength analysis module to decompose the light signal in the target cleaning area into light components of different wavelengths. Based on these different wavelength components, the impurity components of the target cleaning area are obtained, making the obtained impurity components more accurate. The light wavelength analysis module includes a spectrometer. The type of spectrometer can include a dispersive spectrometer, an interferometric spectrometer, and a grating spectrometer, etc. The impurity components can include the severity of contamination (such as the thickness or coverage area of ​​the contamination), the type of contamination (what specific substance the contaminant is), etc.

[0080] In one embodiment of this specification, the optical signal processing component further includes a signal amplification module, which is signal-connected to the light wavelength analysis module. Before determining the target laser cleaning process parameters of the target cleaning area based on the laser parameter factor and impurity composition of the target cleaning area, the component further includes:

[0081] The control signal amplification module amplifies the optical signal and impurity components in the optical information to obtain an amplified signal, and then outputs the amplified signal to the control component.

[0082] In this embodiment, the control signal amplification module amplifies the optical signals from the impurity components and the optical information to obtain an amplified signal, which is then output to the control component. This avoids directly using weak optical signals and impurity component signals for calculation, thus preventing inaccurate calculation results due to weak signals. Alternatively, the signal amplification module may only amplify the optical signal or only amplify the impurity component signal.

[0083] In one embodiment of this specification, the signal amplification module includes an optical fiber amplifier and a photodetector. The optical fiber amplifier is signal-connected to the photodetector. The control signal amplification module amplifies the optical signal and impurity components in the optical information to obtain an amplified signal, and outputs the amplified signal to the control component, including:

[0084] The fiber optic amplifier is controlled to amplify the optical signal and impurity components in the optical information to obtain an amplified signal.

[0085] The photodetector is controlled to convert the amplified signal into an electrical signal, and then outputs the electrical signal to the control component.

[0086] In this embodiment, the fiber optic amplifier provides high gain and a wide gain bandwidth, making it well-suited for long-distance and high-speed fiber optic communication systems. The photodetector features high sensitivity and fast response. Therefore, controlling the fiber optic amplifier to amplify the optical signal and impurity components in the laser parameter factors to obtain an amplified signal, and then controlling the photodetector to convert the amplified signal into an electrical signal and outputting the electrical signal to the control component, also contributes to the accuracy of the processing results.

[0087] In one embodiment of this specification, the target laser cleaning process parameters for the target cleaning area are determined based on the laser parameter factor and impurity composition of the target cleaning area, including:

[0088] The laser parameter factors and impurity components of the target cleaning area are matched with a preset cleaning process parameter comparison table; the cleaning process parameter comparison table includes the correspondence between each laser cleaning process parameter, laser parameter factor, and impurity component.

[0089] Find the laser cleaning process parameters that are the same as the laser parameter factors and impurity components of the target cleaning area in the cleaning process parameter comparison table, and use them as the target laser cleaning process parameters.

[0090] In this embodiment, the cleaning process parameter lookup table can be stored in a database, memory, or hard disk. The laser parameter factors and impurity components of the target cleaning area are matched with the preset cleaning process parameter lookup table. This matching process is also a lookup process, eliminating the need for repeated analysis and calculations, and allowing for faster determination of the target laser cleaning process parameters, thus improving processing efficiency.

[0091] In one embodiment of this specification, if the average laser parameter factor is less than or equal to a preset initial laser parameter factor, the laser emitting component is controlled by the control component to stop emitting laser.

[0092] In this embodiment, once the laser emitting component stops emitting laser light, it indicates that the cleaning of the insulator is complete. Then, the first, second, and third robotic arms can be controlled to return to their initial positions before cleaning.

[0093] The insulator cleaning system is illustrated below with a specific example. (See also...) Figure 2 , Figure 3 as well as Figure 4 The insulator cleaning system includes a light signal factor collection component, a laser angle collection component, a laser emission component, a light signal processing component, and a control component. The control component is connected to the laser emission component, laser angle collection component, and light signal processing component via wires. The light signal processing component and light signal factor collection component are also connected via wires.

[0094] The optical signal factor collection component includes a first robotic arm 13, a substrate 12, multiple supports 14, anti-slip pads 18, a light sensor 16, a temperature sensor 15, and a laser rangefinder 17. The first robotic arm 13 is spherically connected to the substrate 12, allowing the substrate 12 to rotate within a certain angle range, typically up to 120 degrees or even 150 degrees. The substrate 12 is magnetically connected to the supports 14. The number of anti-slip pads 18 is the same as the number of supports 14, and each anti-slip pad 18 is mounted on a motorized support 14. The light sensor 16, temperature sensor 15, and laser rangefinder 17 are located on the anti-slip pads 18 of the supports 14, preventing direct contact between these sensors and the supports 14 and providing protection. The supports 14 can be motorized. The laser emitted by the laser rangefinder 17 is perpendicular to the surface of the insulator it reaches, facilitating accurate distance measurement.

[0095] The laser angle collection assembly includes a second robotic arm 24 and a laser goniometer 23. The laser goniometer 23 is mounted on the second robotic arm 24.

[0096] The laser emitting assembly includes a third robotic arm 7, a laser emitter 5, a laser cleaning head 8, a laser positioning groove 10, and a laser positioning device 9. The third robotic arm 7, the laser cleaning head 8, and the laser positioning groove 10 are connected by threads. The laser emitter 5 and the laser cleaning head 8 are connected by a first dedicated cable 6. The laser positioning device 9 is located in the laser positioning groove 10. The laser cleaning head 8 is either a CHST series laser cleaning head or a BN101-GS laser cleaning head.

[0097] The optical signal processing component includes a light wavelength analysis module 19, an optical fiber amplifier 21, and a photodetector 22. The light wavelength analysis module 19 and the optical sensor 16 are connected via a second dedicated cable 60. The light wavelength analysis module 19 and the optical fiber amplifier 21 are connected via a first signal cable 20. The photodetector 22 and the optical fiber amplifier 21 are connected via a second signal cable 200.

[0098] The control components include a computer 1, a main controller 3, and sub-controllers 25. Computer 1 and main controller 3 are connected via a network cable 2. Computer 1 is connected to a temperature sensor 15 and a laser rangefinder 17 via signal connections. Main controller 3 is connected to laser emitter 5, sub-controllers 25, laser angle measuring instrument 23, and photodetector 22 via a first transmission fiber 4, a second transmission fiber 40, a third transmission fiber 41, and a fourth transmission fiber 42, respectively. Sub-controller 25 is connected to the first robotic arm 13, the third robotic arm 7, and the second robotic arm 24 via a second cable 260, a first cable 26, and a third cable 261, respectively.

[0099] The control process of the insulator cleaning system is shown below.

[0100] Step 1: The main controller 3 sends a work command to the sub-controller 25 and the laser emitter 5. The sub-controller 25 controls the third robot arm 7 to reach the initial position set based on the position of the insulator. The laser emitter 5 emits laser through the laser cleaning head 8 to scan and clean the dirt on the insulator 11 according to the initial laser cleaning process parameters. The laser positioning device 9 records the position information of the laser cleaning point on the insulator 11.

[0101] Step 2: During the cleaning process of insulator 11, the sub-controller 25 controls the first robotic arm 13 to move to the laser reflection area and controls the second robotic arm 24 to move to the area to be laser cleaned, and controls the laser goniometer 23 to start measuring the incident angle during laser cleaning. And calculate the laser reflection angle. The control board 12 rotates around the insulator to control the temperature sensor 15 to collect the temperature after laser reflection. The optical sensor 16 collects the light signal after the laser is reflected. The laser rangefinder 17 measured the distance to the cleaning point of insulator 11. .

[0102] Step 3: The light wavelength analysis module 19 receives the light signal and quantitatively analyzes the impurity composition information on the surface of the insulator 11. The fiber optic amplifier 21 amplifies the light signal and impurity composition information and transmits them to the photodetector 22. The photodetector 22 converts the light signal into an electrical signal and transmits it to the computer 1.

[0103] Step 4: Computer 1 uses the received angle of attack. Reflection angle ,temperature , optical signal ,distance The laser parameter factor is calculated, and it is determined whether the laser parameter factor is less than the set laser parameter factor. If it is less, proceed directly to step five. If it is greater, computer 1 will save the position information corresponding to the laser parameter factor being greater than the set laser parameter factor transmitted by laser positioning device 9, the impurity component information transmitted by fiber amplifier 21, and the calculated laser parameter factor. Computer 1 can convert electrical signals into digital signals for calculation and analysis.

[0104] Step 5: Computer 1 will assess the level based on the laser parameter factors.

[0105] Step Six: After cleaning one area (the area to be cleaned) of the insulator surface is completed, the main controller 3 issues a command to clean the next area (the area to be cleaned) of the insulator surface. Steps One, Two, Three, and Four are repeated until the first cleaning task of the insulator 11 is completed. Then, the main controller 3 issues a command to the sub-controller 25, which controls the first robotic arm 13 and the second robotic arm 24 to return to their initial positions and stop working. The computer 1 will locate the laser cleaning head 8 according to the recorded position information, and select the best laser cleaning process parameters from the laser cleaning process parameter database according to the recorded laser parameter factors and impurity composition information to control the third robotic arm 7 to drive the laser cleaning head 8 for a second deep cleaning.

[0106] Step 7: After completing the second deep cleaning of insulator 11, the main controller 3 sends a command to the sub-controller 25, which controls the third robotic arm 7 to return to its initial position and stop working.

[0107] Based on the same general inventive concept, this invention also protects an insulator cleaning device based on optical signal factors. Figure 5This is a schematic diagram of the insulator cleaning device based on optical signal factors provided in an embodiment of the present invention. The insulator cleaning device based on optical signal factors provided by the present invention will be described below. The insulator cleaning device based on optical signal factors described below can be referred to in conjunction with the insulator cleaning method based on optical signal factors described above. The device is applied to an insulator cleaning system. The device includes a laser cleaning module 501, a parameter factor collection module 502, a parameter factor calculation module 503, a parameter factor judgment module 504, a contamination analysis module 505, and a cleaning process parameter determination module 506.

[0108] The laser cleaning module 501 is used to control the laser emitter to emit lasers according to the preset initial laser cleaning process parameters through the control component to clean each area of ​​the insulator to be cleaned one by one, and to control the laser positioning device to record the area that the laser has reached in each area to be cleaned and the area that has been cleaned.

[0109] The parameter factor collection module 502 is used to control the optical signal factor collection component to collect the optical information of each cleaning completed area and the laser angle collection component to collect the laser angle information of each cleaning completed area, as the laser parameter factor of each cleaning completed area.

[0110] The parameter factor calculation module 503 is used to obtain the average laser parameter factor of each cleaned area based on the laser parameter factor of each cleaned area by the control component.

[0111] The parameter factor judgment module 504 is used to determine the portion of each cleaning completed area where the laser parameter factor is greater than the laser average parameter factor as the target cleaning area if the laser average parameter factor is greater than the preset initial laser parameter factor.

[0112] The contamination analysis module 505 is used to control the optical signal processing component to analyze and process the optical information of the target cleaning area through the control component, so as to obtain the impurity composition of the target cleaning area;

[0113] The cleaning process parameter determination module 506 is used to determine the target laser cleaning process parameters of the target cleaning area based on the laser parameter factor and impurity composition of the target cleaning area.

[0114] The laser cleaning module 501 is also used to control the laser emitter to emit laser to clean the target cleaning area according to the target laser cleaning process parameters through the control component.

[0115] Figure 6 This is a schematic diagram of the structure of the electronic device provided in an embodiment of the present invention.

[0116] like Figure 6As shown, the electronic device may include a processor 610, a communications interface 620, a memory 630, and a communication bus 640. The processor 610, communications interface 620, and memory 630 communicate with each other via the communication bus 640. The processor 610 can call logic instructions from the memory 630 to execute a laser-based insulator cleaning method.

[0117] Furthermore, the logical instructions in the aforementioned memory 630 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0118] On the other hand, the present invention also provides a computer program product, which includes a computer program that can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer is able to execute the laser-based insulator cleaning method provided by the above methods.

[0119] In another aspect, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to perform the laser-based insulator cleaning methods provided by the above methods.

[0120] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0121] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0122] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser-based insulator cleaning method, characterized in that, The method is applied to an insulator cleaning system, which includes an optical signal factor collection component, a laser angle collection component, a laser emission component, an optical signal processing component, and a control component. The control component is signal-connected to the laser angle collection component, the laser emission component, and the optical signal processing component. The optical signal processing component is signal-connected to the optical signal factor collection component. The laser emission component includes a laser emitter and a laser locator. The method includes: The control component controls the laser emitter to emit lasers according to preset initial laser cleaning process parameters to clean each area of ​​the insulator to be cleaned one by one, and controls the laser positioning device to record the cleaning completed areas reached by the laser in each area to be cleaned. The control component controls the optical signal factor collection component to collect optical information of each of the cleaning completed areas and the laser angle collection component to collect laser angle information of each of the cleaning completed areas, and determines the laser parameter factor of each of the cleaning completed areas based on the optical information and the laser angle information. The control component obtains the average laser parameter factor of each of the cleaned areas based on the laser parameter factor of each of the cleaned areas. If the laser average parameter factor is greater than the preset initial laser parameter factor, the cleaning completed area where the laser parameter factor is greater than the laser average parameter factor is determined as the target cleaning area. The control component controls the optical signal processing component to analyze and process the optical information of the target cleaning area to obtain the impurity composition of the target cleaning area. Based on the laser parameter factor of the target cleaning area and the impurity composition, the initial laser cleaning process parameters corresponding to the target cleaning area are adjusted to obtain the adjusted target laser cleaning process parameters. The control component controls the laser emitter to emit laser light to clean the target cleaning area according to the target laser cleaning process parameters. The optical signal factor collection component includes a first robotic arm, a substrate, an optical sensor, a temperature sensor, and a laser rangefinder. The first robotic arm is spherically connected to one side of the substrate. The optical sensor, the temperature sensor, and the laser rangefinder are respectively connected to the other side of the substrate via brackets. The laser angle collection component includes a second robotic arm and a laser goniometer. The laser goniometer is mounted on the second robotic arm. The control component controls the optical signal factor collection component to collect optical information from each of the cleaned areas, and the laser angle collection component to collect laser angle information from each of the cleaned areas. Based on the optical information and the laser angle information, the laser parameter factor of each of the cleaned areas is determined, including: The control component controls the second robotic arm to drive the laser goniometer to measure the angle of incidence and the angle of reflection between the laser emitted by the laser emitter and the cleaning area reached by the laser. The control component controls the first robotic arm to drive the light sensor, the temperature sensor, and the laser rangefinder to measure the light signal and temperature of the reflection angle region between the laser and the area reached by the laser, as well as the distance between the laser rangefinder and the area reached by the laser. The laser parameter factors of the cleaned area are determined based on the incident angle, the reflection angle, the optical signal, the temperature, and the distance. The formula f(i) = f(t) * f(g) is used. * The laser parameter factors are obtained by calculating f(l)*f(θ1)*f(θ2); where f(i) represents the laser parameter factor, f(t) represents the temperature factor, f(g) represents the light factor, f(l) represents the distance factor, f(θ1) represents the incident angle factor, and f(θ2) represents the reflection angle factor. The laser parameter factors are calculated from 0 to 1, and the results are rounded to the nearest tenth. f(t), f(g), f(l), f(θ1), and f(θ2) are the results after normalizing their respective temperatures t, light signals g, distance l, incident angle θ1, and reflection angle θ2; the normalization process is f(x). norm = (x - min(x)) / (max(x) - min(x)), where x represents the original data, max(x) and min(x) represent the maximum and minimum values ​​of the original data, respectively, and f(x) norm It is represented as the normalized factor.

2. The laser-based insulator cleaning method according to claim 1, characterized in that, The laser emitting assembly further includes a third robotic arm, a laser cleaning head, and a laser positioning slot. The third robotic arm is threadedly connected to the laser cleaning head and the laser positioning slot, respectively. The laser emitter is signal-connected to the laser cleaning head. The laser positioning device is located in the laser positioning slot. The control assembly controls the laser emitter to emit lasers according to preset initial laser cleaning process parameters to clean each area of ​​the insulator to be cleaned, and controls the laser positioning device to record the cleaned areas reached by the laser in each area to be cleaned, including: The control component controls the laser emitter to emit laser according to the preset initial laser cleaning process parameters, and controls the third robotic arm to move the laser cleaning head and the laser positioning device to clean each area of ​​the insulator to be cleaned one by one, and records the area of ​​each area to be cleaned that has been reached by the laser.

3. The laser-based insulator cleaning method according to claim 1, characterized in that, The optical signal processing component includes a light wavelength analysis module. The control component controls the optical signal processing component to analyze and process the light information of the target cleaning area to obtain the impurity composition of the target cleaning area, including: The control component controls the light wavelength analysis module to decompose the light signal in the light information of the target cleaning area into light components of different wavelengths. The impurity composition of the target cleaning area is obtained based on the light components of different wavelengths.

4. The laser-based insulator cleaning method according to claim 3, characterized in that, The optical signal processing component further includes a signal amplification module, which is signal-connected to the light wavelength analysis module. Before determining the target laser cleaning process parameters for the target cleaning area based on the laser parameter factor of the target cleaning area and the impurity composition, the component further includes: The signal amplification module is controlled to amplify the optical signal and the impurity component in the optical information to obtain an amplified signal, and the amplified signal is output to the control component.

5. The laser-based insulator cleaning method according to claim 4, characterized in that, The signal amplification module includes an optical fiber amplifier and a photodetector. The optical fiber amplifier is signal-connected to the photodetector. Controlling the signal amplification module to amplify the optical signal and impurity components in the optical information to obtain an amplified signal, and outputting the amplified signal to the control component, includes: The fiber amplifier is controlled to amplify the optical signal and the impurity components in the optical information to obtain an amplified signal. The photodetector is controlled to convert the amplified signal into an electrical signal, and the electrical signal is output to the control component.

6. The laser-based insulator cleaning method according to claim 1, characterized in that, The determination of the target laser cleaning process parameters for the target cleaning area based on the laser parameter factor of the target cleaning area and the impurity composition includes: The laser parameter factors and impurity components of the target cleaning area are matched with a preset cleaning process parameter comparison table; wherein the cleaning process parameter comparison table includes the correspondence between each laser cleaning process parameter and the laser parameter factors and impurity components. The laser cleaning process parameters corresponding to the same laser parameter factors and impurity components as the target cleaning area are found in the cleaning process parameter comparison table and are used as the target laser cleaning process parameters.

7. The laser-based insulator cleaning method according to claim 1, characterized in that, If the average laser parameter factor is less than or equal to the preset initial laser parameter factor, the control component controls the laser emitting component to stop emitting laser.

8. The laser-based insulator cleaning method according to claim 3, characterized in that, The light wavelength analysis module includes a spectrometer.

9. An insulator cleaning device based on optical signal factor, characterized in that, The apparatus uses the laser-based insulator cleaning method according to any one of claims 1 to 8. The apparatus is applied to an insulator cleaning system, which includes an optical signal factor collection component, a laser angle collection component, a laser emission component, an optical signal processing component, and a control component. The control component is signal-connected to the laser angle collection component, the laser emission component, and the optical signal processing component. The optical signal processing component is signal-connected to the optical signal factor collection component. The laser emission component includes a laser emitter and a laser locator. The apparatus includes: The laser cleaning module is used to control the laser emitter to emit lasers according to preset initial laser cleaning process parameters to clean each area of ​​the insulator to be cleaned one by one, and to control the laser positioning device to record the cleaning completed areas reached by the laser in each area to be cleaned. The parameter factor collection module is used to control the optical signal factor collection component to collect optical information of each of the cleaning completed areas and the laser angle collection component to collect laser angle information of each of the cleaning completed areas through the control component, and to determine the laser parameter factor of each of the cleaning completed areas based on the optical information and the laser angle information. The parameter factor calculation module is used to obtain the average laser parameter factor of each of the cleaned areas based on the laser parameter factor of each of the cleaned areas through the control component. The parameter factor determination module is used to determine the cleaning completed area where the laser parameter factor is greater than the laser average parameter factor as the target cleaning area if the laser average parameter factor is greater than the preset initial laser parameter factor. The contamination analysis module is used to control the optical signal processing component to analyze and process the optical information of the target cleaning area through the control component, so as to obtain the impurity composition of the target cleaning area; The cleaning process parameter determination module is used to adjust the initial laser cleaning process parameters corresponding to the target cleaning area based on the laser parameter factor of the target cleaning area and the impurity composition feedback, so as to obtain the adjusted target laser cleaning process parameters. The laser cleaning module is further configured to control the laser emitter to emit laser light to clean the target cleaning area according to the target laser cleaning process parameters via the control component.

Images