Method and equipment for planning path of polishing tools in CNC polishing

Abstract

The present invention discloses a method and device for planning the path of a polishing tool in CNC polishing. The method provides a supporting force for a workpiece to be processed by a reset force generated by the rotation of a rotary cylinder. The reset force is equal to the pressure applied by the grinding head to the workpiece to be processed. The reset force is controlled by controlling the angle of rotation of the rotary cylinder, thereby controlling the pressure between the grinding head and the workpiece and obtaining an effective processing path. That is, the present invention detects the pressure between the grinding head and the workpiece by the displacement of the workpiece to be processed. It only needs to ensure that the grinding head is within the processing area to control the uniformity of the pressure between the grinding head and the workpiece, thereby avoiding the sudden change of the polishing pressure in the existing polishing equipment. Due to data delay, insufficient sensitivity and response speed, the path of the polishing tool is not changed in time, the uniformity of the polishing pressure is reduced, and the processing accuracy is reduced. The present invention not only improves the processing accuracy but also improves the degree of automation of the polishing equipment by presetting the moving route of the grinding head.

Description

Technical Field

[0001] The present invention relates to the technical field of grinding and polishing path planning, and in particular to a grinding and polishing tool path planning method and equipment in numerical control grinding and polishing. Background Art

[0002] CNC grinding and polishing is a machining process to obtain high-precision surface quality, in which the path control and planning of the grinding and polishing tool is a key technology in the entire machining process. The path of the grinding and polishing tool is mainly composed of two parts: the effective machining path and the feed and retract path of the grinding and polishing tool. The effective machining path is the path to achieve deterministic material removal. In the effective machining path, in order to achieve material removal, the grinding and polishing tool needs to apply a certain amount of pressure to the workpiece surface in some way, and the magnitude of this pressure directly affects the machining accuracy. Uniform and appropriate pressure can improve machining efficiency and workpiece surface quality, while excessive pressure will cause defects on the workpiece surface, such as scratches, cracks and dents; too little pressure will lead to a reduction in the burr removal rate on the workpiece surface, reduce the smoothness of the workpiece, and thus affect the machining accuracy. After the existing polishing equipment fixes the workpiece, it uses a pressure sensor to detect the pressure between the polishing tool and the workpiece in real time, and controls the pressure between the polishing tool and the workpiece through an automatic control system, a precision positioning platform and adjusting the feed speed. That is, in the effective processing path, the path of the polishing tool changes according to the pressure change between the polishing tool and the workpiece, and when the pressure sensor detects a sudden change in the pressure between the polishing tool and the workpiece, it transmits the data to the automatic control system to adjust the feed speed and feed distance. This process may have insufficient sensitivity and response speed, resulting in untimely changes in the path of the polishing tool, making the pressure between the polishing tool and the workpiece uneven during the polishing process, thereby reducing the processing accuracy of the workpiece. Therefore, a polishing tool path planning method and equipment in CNC polishing are proposed. Summary of the Invention

[0003] The purpose of the present invention is to provide a method and device for planning the path of a polishing tool in CNC polishing to solve the above problems.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] A method for planning a polishing tool path in numerical control polishing, comprising:

[0006] Providing an experimental workpiece and a rotary cylinder, wherein the experimental workpiece can drive the rotary cylinder to rotate when subjected to force; obtaining the maximum angle of rotation of the rotary cylinder driven by the maximum safe pressure applied to the experimental workpiece during polishing, thereby obtaining a maximum safe rotation angle;

[0007] Establishing a coordinate system based on the workbench, fixing the workpiece to be processed on a fixed plate, and obtaining appearance data of the workpiece to be processed to obtain initial coordinate data of the workpiece to be processed;

[0008] Acquiring maximum safety coordinate data of the workpiece to be processed through a data processing module, wherein the maximum safety coordinate data is coordinate data of the workpiece to be processed when the rotary cylinder rotates to the maximum safety rotation angle;

[0009] Preset minimum processing coordinate data, wherein the minimum processing coordinate data and the maximum safety coordinate data together form a processing area, and the minimum processing coordinate data is located between the initial coordinate data and the maximum safety coordinate data;

[0010] A grinding head moving route is preset, and the grinding head is driven to move along the grinding head moving route and grind and polish the workpiece to be processed; the grinding head moving route passes through the processing area.

[0011] Optionally, providing an experimental workpiece and a rotary cylinder, wherein the experimental workpiece can drive the rotary cylinder to rotate when subjected to force; obtaining a maximum angle of rotation of the rotary cylinder driven by the maximum safety pressure applied to the experimental workpiece during polishing, so as to obtain a maximum safe rotation angle; specifically includes:

[0012] Providing multiple experimental artifacts, and evenly dividing the experimental artifacts into multiple experimental artifact groups;

[0013] Presetting a plurality of experimental rotation angles of the rotary cylinders at equal angles, wherein the number of the experimental rotation angles is the same as the number of the experimental workpiece groups;

[0014] driving the grinding head to apply pressure to the experimental workpieces of each experimental workpiece group and to grind and polish the experimental workpieces, and making the angle of rotation of the rotary cylinder driven by the experimental workpieces of each experimental workpiece group correspond to a different experimental rotation angle;

[0015] The experimental workpieces of each group of the experimental workpieces after the grinding and polishing process are analyzed to obtain the experimental rotation angle corresponding to the experimental workpiece group with defects in the machined surface, thereby obtaining the maximum safe rotation angle.

[0016] Optionally, the process of establishing a coordinate system based on a workbench, fixing the workpiece to be processed on a fixed plate, and obtaining appearance data of the workpiece to be processed to obtain initial coordinate data of the workpiece to be processed may specifically include:

[0017] Setting a base point on the upper end surface of the workbench and establishing a three-dimensional rectangular coordinate system with the base point as the origin;

[0018] After fixing the workpiece to be processed on a fixed plate, scanning the workpiece to be processed with a laser scanner to obtain appearance feature data of the workpiece to be processed;

[0019] Processing the appearance feature data of the workpiece to be processed by an image processing module to enhance the appearance feature data of the workpiece to be processed;

[0020] A coordinate data conversion module is used to convert the appearance feature data of the workpiece to be processed into data in a rectangular coordinate system to generate initial coordinate data of the workpiece to be processed.

[0021] Optionally, the step of obtaining the maximum safety coordinate data of the workpiece to be processed by a data processing module specifically includes:

[0022] Obtain the length of the rotary isobar, and in combination with the maximum safe rotation angle, calculate and obtain the maximum movement distance of the fixed plate through the data processing module;

[0023] The coordinate data of the fixed plate when it is located at the maximum moving distance is acquired through a data processing module to generate maximum safety coordinate data.

[0024] Optionally, the grinding head movement route includes a first reference point, a second reference point, a third reference point and a fourth reference point, the first reference point and the fourth reference point are located at the two ends of the side of the initial coordinate data away from the maximum safety coordinate data, and the second reference point and the third reference point are located at the two ends within the processing area; the grinding head movement route passes through the first reference point, the second reference point, the third reference point and the fourth reference point in sequence.

[0025] Optionally, the polishing tool path planning method in the CNC polishing further includes:

[0026] When the grinding head moves to the warning coordinate, the workpiece to be processed is driven to move in a direction away from another warning coordinate by the first X-axis moving platform to prevent the grinding head from deviating from the processing area during grinding and polishing.

[0027] Optionally, when the grinding head moves to the warning coordinate, the workpiece to be processed is driven to move in a direction away from another warning coordinate by the first X-axis moving platform; specifically comprising:

[0028] Presetting a maximum warning coordinate and a minimum warning coordinate, wherein the warning coordinates include the maximum warning coordinate and the minimum warning coordinate, and the maximum warning coordinate and the minimum warning coordinate are located in the processing area;

[0029] When the grinding head moves to the maximum warning coordinate, the workpiece to be processed is driven to move in a direction away from the minimum warning coordinate by the first X-direction moving platform; when the grinding head moves to the minimum warning coordinate, the workpiece to be processed is driven to move in a direction away from the maximum warning coordinate by the first X-direction moving platform.

[0030] The present invention also provides a polishing device, which is applied to the polishing tool path planning method in the above-mentioned CNC polishing, wherein the polishing device includes a main body and an isobaric device;

[0031] The body comprises:

[0032] A workbench, used to carry workpieces;

[0033] A grinding head, used for grinding workpieces;

[0034] A driving mechanism, used for driving the grinding head;

[0035] A laser scanner is used to scan the workpiece to be processed to obtain appearance feature data of the workpiece to be processed;

[0036] An image processing module, used to process and enhance the appearance feature data of the workpiece to be processed;

[0037] A coordinate data conversion module, used to convert the appearance feature data of the workpiece to be processed into coordinate data;

[0038] A data processing module is used to process the coordinate data of the workpiece to be processed after it moves;

[0039] The isobaric device comprises:

[0040] A first X-axis movable platform is fixedly arranged on the workbench;

[0041] a second X-axis movable platform, slidably connected to the first X-axis movable platform;

[0042] a fixed plate, slidably connected to the second X-axis movable platform, the fixed plate being used to fix the workpiece to be processed, and having a through hole;

[0043] A rotary cylinder is fixedly arranged on the second X-direction movable platform, a rotary isobar block is fixedly arranged on the rotating shaft of the rotary cylinder, and rotary isobar rods are arranged on both sides of the rotary isobar block;

[0044] The rotary isobar is embedded in the through hole. When the fixed plate moves on the second X-direction moving platform, the fixed plate drives the rotating shaft of the rotary cylinder to rotate through the rotary isobar.

[0045] Optionally, a linear motor is provided on the first X-axis movable platform, and the second X-axis movable platform is provided on the output shaft of the linear motor; a guide rail is provided on the second X-axis movable platform, and a slider is provided on the lower end surface of the fixed plate, and the slider is slidably connected to the guide rail.

[0046] Optionally, the rotary cylinder is equipped with a built-in torque spring.

[0047] Compared with the prior art, the present invention has the following beneficial effects: by applying different polishing pressures to an experimental workpiece (the experimental workpiece has the same material and shape as the workpiece to be processed), the maximum polishing pressure that the experimental workpiece can withstand is obtained (under this polishing pressure, no defects will be generated on the workpiece surface), thereby detecting the maximum angle of rotation of the rotary cylinder under the maximum polishing pressure, that is, the maximum safe rotation angle; by establishing a coordinate system on the workbench, the initial coordinate data of the workpiece to be processed (that is, the coordinate data when the workpiece to be processed is not subjected to pressure) and the maximum safe coordinate data are obtained; by presetting the minimum processing coordinate data (the rotation angle of the rotary cylinder is greater than 0 but less than the maximum safe rotation angle), a processing area is established; the path of the polishing tool is preset, and the effective processing path covers the processing area. During polishing, it is only necessary to make the moving route of the grinding head pass through the processing area, so that the workpiece can be polished with uniform pressure (the pressure between the grinding head and the workpiece), avoiding defects on the workpiece surface or reducing the burr removal rate on the workpiece surface due to excessive or insufficient pressure, thereby improving the processing accuracy of the workpiece. Compared with the existing grinding and polishing equipment which uses a pressure sensor to detect the pressure between the grinding and polishing tool and the workpiece in real time to control the path of the grinding and polishing tool, the present invention provides a supporting force for the workpiece to be processed by the reset force generated by the rotation of the rotary cylinder. The reset force is equal to the pressure applied by the grinding head to the workpiece to be processed. The reset force is controlled by controlling the rotation angle of the rotary cylinder, thereby controlling the pressure between the grinding head and the workpiece and obtaining an effective processing path. That is, the present invention detects the pressure between the grinding head and the workpiece by the displacement of the workpiece to be processed. It only needs to ensure that the grinding head is in the processing area to control the uniformity of the pressure between the grinding head and the workpiece, thereby avoiding the grinding and polishing pressure in the existing grinding and polishing equipment. When the force suddenly changes, the data delay, sensitivity and response speed are insufficient, which leads to untimely changes in the path of the grinding and polishing tool, resulting in uneven pressure between the grinding and polishing tool and the workpiece during the grinding and polishing process, thereby reducing the processing accuracy; at the same time, the reset force of the rotary cylinder is a flexible force. When the pressure between the grinding head and the workpiece suddenly changes, the rotary cylinder realizes a linear change in pressure by increasing or decreasing the rotation angle, thereby improving the uniformity of the pressure and further improving the processing accuracy; in addition, the present invention presets the moving route of the grinding head, and only needs to drive the grinding head to move according to the moving route to realize the grinding and polishing of the workpiece to be processed, which can greatly improve the degree of automation of the grinding and polishing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0049] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not intended to limit the conditions under which the present invention can be implemented and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and objectives that can be achieved by the present invention.

[0050] Figure 1 Schematic diagram of the overall process of the polishing tool path planning method in CNC polishing of the first embodiment;

[0051] Figure 2 Schematic diagram of the process of step S10 of the polishing tool path planning method in the numerical control polishing of the first embodiment;

[0052] Figure 3 Schematic diagram of the process of step S20 of the polishing tool path planning method in the CNC polishing of the first embodiment;

[0053] Figure 4 Schematic diagram of the process of step S30 of the polishing tool path planning method in the CNC polishing of the first embodiment;

[0054] Figure 5 This is a schematic structural diagram of the equal pressure device of the second embodiment.

[0055] Illustration: 10. Isobaric device; 11. First X-axis movable platform; 12. Second X-axis movable platform; 13. Fixed plate; 14. Rotary cylinder; 15. Through hole; 16. Rotary isobaric block; 17. Rotary isobaric rod. DETAILED DESCRIPTION

[0056] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0057] In the description of the present invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally located component.

[0058] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0059] Example 1:

[0060] Combine Figures 1 to 4 The embodiment of the present invention provides a method for planning a polishing tool path in numerical control polishing, comprising:

[0061] S10, providing a test workpiece and a rotary cylinder, wherein the test workpiece can drive the rotary cylinder to rotate when subjected to force; obtaining the maximum angle of rotation of the rotary cylinder 14 driven by the maximum safe pressure applied to the test workpiece during polishing, to obtain the maximum safe rotation angle;

[0062] The test workpiece is made of the same material and shape as the workpiece to be machined. By grinding and polishing the test workpiece, the maximum safe pressure the test workpiece can withstand is determined, thereby determining the maximum safe pressure the workpiece to be machined can withstand, providing a benchmark for determining the machining area in subsequent steps. The maximum safe pressure is the pressure at which surface defects will not form when polishing. If this pressure is exceeded, surface defects will appear.

[0063] When the workpiece is subjected to polishing pressure, the workpiece will be displaced, thereby driving the rotary cylinder 14 to rotate; when the workpiece is subjected to the maximum safety pressure, the displacement of the workpiece drives the rotary cylinder 14 to rotate at an angle that is the maximum safety rotation angle.

[0064] It should be noted that, in this method, the restoring force generated by the rotation of the rotary cylinder 14 provides a supporting force for the workpiece, and the restoring force is equal to the pressure applied by the grinding head to the workpiece.

[0065] S20, establishing a coordinate system based on the workbench, fixing the workpiece to be processed on the fixing plate 13, and obtaining appearance data of the workpiece to be processed to obtain initial coordinate data of the workpiece to be processed;

[0066] By establishing a coordinate system and using it as a reference, the coordinate data of the workpiece before it is subjected to pressure, i.e., the initial coordinate data, is obtained. This coordinate system allows for precise determination of the workpiece's displacement during polishing.

[0067] S30, obtaining the maximum safe coordinate data of the workpiece to be processed through the data processing module, the maximum safe coordinate data being the coordinate data of the workpiece to be processed when the rotary cylinder 14 rotates to the maximum safe rotation angle;

[0068] By calculating the coordinate data of the workpiece to be processed at the maximum safe rotation angle, the maximum safe coordinate data is obtained. This provides workpiece position data within the safe range for the polishing process, preventing the workpiece from exceeding the safe range during the polishing process, thereby ensuring processing safety and workpiece integrity.

[0069] S40, presetting minimum processing coordinate data, the minimum processing coordinate data and the maximum safety coordinate data enclose a processing area, and the minimum processing coordinate data is located between the initial coordinate data and the maximum safety coordinate data;

[0070] The minimum processing coordinate data is that the reset force generated by the rotation of the rotary cylinder 14 driven by the workpiece to be processed at this coordinate position is equal to the minimum polishing pressure. If the workpiece is polished with a pressure less than the minimum polishing pressure, the burr removal rate on the workpiece surface cannot meet the processing requirements.

[0071] The minimum processing coordinate data is determined so that it is combined with the maximum safety coordinate data to form a processing area. The grinding head processes the workpiece within this processing area. The workpiece will not have surface defects due to excessive force, nor will the burr removal rate fail to meet the processing requirements due to insufficient force.

[0072] S50, preset a grinding head moving route, drive the grinding head to move along the grinding head moving route and grind and polish the workpiece to be processed; the grinding head moving route passes through the processing area.

[0073] The movement route of the grinding head is designed so that it moves and polishes along a predetermined path, and the processing path covers the entire processing area, effectively improving the efficiency and quality of the polishing process and ensuring uniform polishing of the workpiece surface.

[0074] The working principle of the present invention is as follows: by applying different polishing pressures to the experimental workpiece, the maximum polishing pressure that the experimental workpiece can withstand is obtained, thereby detecting the maximum rotation angle of the rotary cylinder 14 under the maximum polishing pressure, that is, the maximum safe rotation angle; by establishing a coordinate system on the workbench, the initial coordinate data and the maximum safe coordinate data of the workpiece to be processed are obtained; by presetting the minimum processing coordinate data, a processing area is established; the path of the polishing tool is preset, and the effective processing path covers the processing area. During polishing, it is only necessary to make the moving route of the grinding head pass through the processing area, so that the workpiece can be polished with uniform pressure, avoiding defects on the workpiece surface or reducing the burr removal rate on the workpiece surface due to excessive or insufficient pressure, thereby improving the processing accuracy of the workpiece. Compared with the existing polishing equipment that uses a pressure sensor to detect the pressure between the polishing tool and the workpiece in real time to control the path of the polishing tool, the present invention provides support force for the workpiece to be processed through the reset force generated by the rotation of the rotary cylinder 14. The reset force is equal to the pressure applied by the grinding head to the workpiece to be processed. The reset force is controlled by controlling the rotation angle of the rotary cylinder 14, thereby controlling the pressure between the grinding head and the workpiece and obtaining an effective processing path. That is, the present invention detects the pressure between the grinding head and the workpiece by the displacement of the workpiece to be processed. It only needs to ensure that the grinding head is in the processing area to control the uniformity of the pressure between the grinding head and the workpiece, avoiding the problem of the polishing pressure in the existing polishing equipment. When the force suddenly changes, the data delay, sensitivity and response speed are insufficient, which leads to untimely changes in the path of the polishing tool, resulting in uneven pressure between the polishing tool and the workpiece during the polishing process and reduced processing accuracy; at the same time, the reset force of the rotary cylinder 14 is a flexible force. When the pressure between the grinding head and the workpiece suddenly changes, the rotary cylinder 14 realizes a linear change in pressure by increasing or decreasing the rotation angle, thereby improving the uniformity of pressure and further improving processing accuracy; in addition, the present invention presets the moving route of the grinding head, and only needs to drive the grinding head to move according to the moving route to realize the polishing processing of the workpiece to be processed, which can greatly improve the degree of automation of the polishing processing.

[0075] In this embodiment, combined with Figure 2 As shown, step S10 specifically includes:

[0076] S11. providing a plurality of experimental artifacts, and evenly dividing the experimental artifacts into a plurality of experimental artifact groups;

[0077] S12, presetting multiple experimental rotation angles of the rotary cylinder 14 at equal angles, where the number of the experimental rotation angles is the same as the number of the experimental workpiece groups;

[0078] S13, driving the grinding head to apply pressure to the experimental workpieces of each experimental workpiece group and to grind and polish the experimental workpieces, and making the angle of rotation of the rotary cylinder 14 driven by the experimental workpieces of each experimental workpiece group correspond to a different experimental rotation angle;

[0079] S14. Analyze the experimental workpieces of each group of experimental workpieces after grinding and polishing, and obtain the experimental rotation angle corresponding to the experimental workpiece group with defects in the machined surface, so as to obtain the maximum safe rotation angle.

[0080] Step S10 indirectly determines the maximum safe pressure that the workpiece can withstand through experimentation. Therefore, in step S11, by dividing the experimental workpieces into multiple groups, each including multiple experimental workpieces, multiple sets of data are obtained after the experiment, improving the credibility of the experimental results and effectively reducing the impact of errors caused by a single experimental workpiece. In step S12, by presetting different experimental rotation angles, different polishing pressures can be simulated, thereby accurately finding the maximum safe rotation angle of the workpiece and improving the safety of the polishing process. In steps S13 and S14, through actual polishing experiments and analysis of the experimental workpieces after polishing, it is possible to determine which angles will cause defects on the workpiece surface, thereby obtaining the maximum safe rotation angle, providing a benchmark for subsequent actual polishing processes.

[0081] In this embodiment, combined with Figure 3 As shown, step S20 specifically includes:

[0082] S21. Setting a base point on the upper end surface of the workbench and establishing a three-dimensional rectangular coordinate system with the base point as the origin;

[0083] By establishing a triangular coordinate system, a unified reference system is provided to ensure the accuracy of data analysis and polishing processes, and to achieve standardized positioning of workpieces, facilitating data processing and mechanical operations.

[0084] S22, after fixing the workpiece to be processed on the fixing plate 13, scanning the workpiece to be processed with a laser scanner to obtain appearance feature data of the workpiece to be processed;

[0085] After fixing the workpiece, scan it to obtain accurate appearance feature data of the workpiece, providing a reliable basis for subsequent grinding and polishing. At the same time, scanning the appearance feature data of the workpiece with a laser scanner can improve the efficiency and accuracy of data collection.

[0086] S23, using an image processing module to process the appearance feature data of the workpiece to be processed to enhance the appearance feature data of the workpiece to be processed;

[0087] The original scan data may contain noise or incomplete data. Processing through the image processing module can improve the data quality. At the same time, the enhanced data can more clearly reflect the characteristics of the workpiece, facilitating subsequent coordinate transformation and the formulation of processing strategies.

[0088] S24 , using a coordinate data conversion module to convert the appearance feature data of the workpiece to be processed into data in a rectangular coordinate system to generate initial coordinate data of the workpiece to be processed.

[0089] The enhanced appearance feature data is converted into coordinate data in a rectangular coordinate system to facilitate precise positioning and movement during the grinding and polishing process; at the same time, the data in the rectangular coordinate system provides an accurate numerical basis for subsequent grinding and polishing operations, ensuring precise processing.

[0090] Comprehensive analysis shows that the subdivision steps of step S20 ensure the high precision and high reliability of each data processing node by gradually acquiring and processing the appearance feature data of the workpiece, thereby ensuring the precise positioning and movement of the workpiece in the subsequent grinding and polishing process. This not only significantly improves the accuracy and quality of the processing, but also reduces the processing deviation caused by inaccurate data or noise interference.

[0091] In this embodiment, combined with Figure 4 As shown, step S30 specifically includes:

[0092] S31, obtaining the length of the rotary isobar 17, combining it with the maximum safe rotation angle, and calculating and obtaining the maximum movement distance of the fixed plate 13 through the data processing module;

[0093] The fixed plate 13 moves in the X-axis direction. The maximum movement distance of the fixed plate 13 can be calculated and obtained based on the length of the rotating isobar 17, the maximum safe rotation angle (the angle of rotation of the rotating isobar 17), and the angle between the initial position of the rotating isobar 17 and the X-axis.

[0094] S32. Obtain the coordinate data of the fixed plate 13 when it is at the maximum moving distance through the data processing module to generate maximum safety coordinate data.

[0095] The specific coordinate data of the fixed plate 13 at the maximum moving distance is obtained to form a safety boundary to ensure the safety of the polishing process, that is, to ensure that the fixed plate 13 does not exceed the safety range during the entire polishing process, thereby improving the processing quality and safety.

[0096] In step S50, the grinding head movement route includes a first reference point, a second reference point, a third reference point and a fourth reference point, the first reference point and the fourth reference point are located at the two ends of the side where the initial coordinate data is away from the maximum safety coordinate data, and the second reference point and the third reference point are located at the two ends within the processing area; the grinding head movement route passes through the first reference point, the second reference point, the third reference point and the fourth reference point in sequence.

[0097] Specifically, it should be noted that the first reference point is the starting point for the grinding head to enter the processing area, and is located at one of the two ends of the side where the initial coordinate data is away from the maximum safety coordinate data; the second reference point is a key point of the grinding head in the processing area, and is located at one end point of the processing area; the third reference point is another key point of the grinding head in the processing area, and is located at the other end point of the processing area; the fourth reference point is the end point where the grinding head leaves the processing area after completing grinding and polishing, and is located at the other end of the side where the initial coordinate data is away from the maximum safety coordinate data.

[0098] The specific route is: the grinding head moves from a place far away from the workpiece to be processed to the first reference point, enters the processing area through the first reference point, passes through the second reference point and the third reference point in sequence, and the route between the second reference point and the third reference point covers the entire processing area to meet the grinding and polishing needs; after the grinding and polishing process is completed, the grinding head reaches the fourth reference point through the third reference point and leaves the processing area.

[0099] It should be noted that the route from the first reference point to the fourth reference point is a fixed route. The initial position of the grinding head is the grinding head reset point, and the route from the grinding head reset point to the first reference point and the route from the fourth reference point to the grinding head reset point change according to the initial position of the grinding head.

[0100] In this embodiment, combined with Figure 1 As shown, the polishing tool path planning method in CNC polishing also includes: S60, when the grinding head moves to the warning coordinate, the workpiece to be processed is driven to move away from another warning coordinate through the first X-axis moving platform 11 to avoid the grinding head deviating from the processing area during polishing.

[0101] Step S60 specifically includes:

[0102] S61. Preset the maximum warning coordinate and the minimum warning coordinate, where the warning coordinates include the maximum warning coordinate and the minimum warning coordinate, and the maximum warning coordinate and the minimum warning coordinate are located within the processing area;

[0103] S62. When the grinding head moves to the maximum warning coordinate, the workpiece to be processed is driven to move in a direction away from the minimum warning coordinate by the first X-axis moving platform 11; when the grinding head moves to the minimum warning coordinate, the workpiece to be processed is driven to move in a direction away from the maximum warning coordinate by the first X-axis moving platform 11.

[0104] During the isobaric polishing process, the grinding head may encounter external interference or unexpected events while polishing the workpiece surface. These can include mechanical failure, sudden changes in workpiece surface hardness, or environmental factors (such as vibration or operator error), causing sudden force fluctuations on the grinding head. These sudden force fluctuations can affect the stability of the polishing process and the uniformity of the polishing pressure, potentially causing sudden increases or decreases in polishing pressure, affecting the polishing quality of the workpiece surface and even damaging the workpiece.

[0105] In order to avoid this situation, the polishing tool path planning method in CNC polishing of the present invention issues an early warning by presetting the maximum warning coordinates and the minimum warning coordinates, thereby reducing the impact of sudden changes in force on the polishing quality. Specifically, within the processing area, the maximum warning coordinates and the minimum warning coordinates are pre-set. These two coordinates are used to monitor the position of the grinding head. Once the grinding head reaches these warning points, the corresponding adjustment operation will be triggered. That is, when the grinding head moves to the maximum warning coordinates, the workpiece to be processed is moved in the direction away from the minimum warning coordinates through the first X-axis moving platform 11; when the grinding head moves to the minimum warning coordinates, the workpiece to be processed is moved in the direction away from the maximum warning coordinates through the first X-axis moving platform 11, thereby driving the grinding head to move deeper into the processing area to prevent the grinding head from deviating outside the processing area.

[0106] The present invention's polishing tool path planning method for CNC polishing enables rapid response and handling of emergencies through early warning coordinates and workpiece position adjustment, ensuring the stability and safety of the polishing process. When encountering sudden changes in the grinding head force, timely adjustment of the workpiece position effectively reduces the impact of sudden forces on the polishing pressure, ensuring workpiece polishing quality and the proper operation of the equipment. This method not only improves the reliability of the polishing process but also enhances the flexibility and adaptability of the entire system.

[0107] Example 2:

[0108] Combine Figure 4 As shown, the present invention also provides a polishing device, which is applied to the polishing tool path planning method in the above-mentioned CNC polishing. The polishing device includes a body (not shown) and an isobaric device 10;

[0109] The ontology includes:

[0110] A workbench, used to carry workpieces;

[0111] A grinding head, used for grinding workpieces;

[0112] A driving mechanism for driving the grinding head;

[0113] A laser scanner is used to scan the workpiece to be processed to obtain appearance feature data of the workpiece to be processed;

[0114] An image processing module, used to process and enhance the appearance feature data of the workpiece to be processed;

[0115] A coordinate data conversion module, used to convert the appearance feature data of the workpiece to be processed into coordinate data;

[0116] A data processing module is used to process the coordinate data of the workpiece to be processed after it moves;

[0117] The isobaric device 10 comprises:

[0118] The first X-axis movable platform 11 is fixedly mounted on the workbench;

[0119] The second X-axis movable platform 12 is slidably connected to the first X-axis movable platform 11;

[0120] A fixed plate 13 is slidably connected to the second X-axis movable platform 12. The fixed plate 13 is used to fix the workpiece to be processed. A through hole 15 is provided on the fixed plate 13.

[0121] The rotary cylinder 14 is fixedly mounted on the second X-axis movable platform 12 . A rotary isobaric block 16 is fixedly mounted on the rotating shaft of the rotary cylinder 14 . Rotary isobaric rods 17 are mounted on both sides of the rotary isobaric block 16 .

[0122] The rotary isobar 17 is embedded in the through-hole 15. When the fixed plate 13 moves on the second X-moving platform 12, the fixed plate 13 drives the rotating shaft of the rotary cylinder 14 to rotate via the rotary isobar 17. Specifically, during polishing, when the grinding head applies force in the X-axis direction to the workpiece, the workpiece moves along the X-axis, thereby driving the rotating shaft of the rotary cylinder 14 to rotate via the fixed plate 13 and the rotary isobar 17.

[0123] It should be noted that when the rotary cylinder 14 is not subject to external forces, the rotary isobar 17 is not parallel to the X-axis. When the rotary cylinder 14 is rotated to its maximum safe rotation angle, the rotary isobar 17 rotates to its maximum rotation angle. The rotary isobar 17 is not parallel to the X-axis at any angle from 0° to the maximum rotation angle. The rotary cylinder 14 is equipped with a built-in torque spring. When the rotary cylinder 14's shaft rotates due to external forces, the torque spring generates a restoring force on the shaft.

[0124] Furthermore, a linear motor is mounted on the first X-axis movable platform 11, and a second X-axis movable platform 12 is mounted on the output shaft of the linear motor. The main body also includes a motor control module, to which the linear motor is electrically connected. When the grinding head moves to the warning coordinate, the motor control module controls the linear motor to drive the second X-axis movable platform 12, thereby moving the workpiece to be processed.

[0125] A guide rail is provided on the second X-direction movable platform 12 , and a slider is provided on the lower end surface of the fixed plate 13 , and the slider is slidably connected to the guide rail.

[0126] It should be noted that this embodiment is suitable for products that require polishing pressure to be applied to the workpiece in the X-axis direction, such as the side surfaces of the workpiece and the side walls of the groove, such as 3D products with grooves, and products made of glass, ceramics, sapphire, semiconductor-grade brittle materials and metals.

[0127] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for planning a polishing tool path in CNC polishing, characterized in that: include: Providing an experimental workpiece and a rotary cylinder, wherein the experimental workpiece can drive the rotary cylinder to rotate when subjected to force; obtaining the maximum angle of rotation of the rotary cylinder driven by the maximum safe pressure applied to the experimental workpiece during polishing, thereby obtaining a maximum safe rotation angle; Establishing a coordinate system based on the workbench, fixing the workpiece to be processed on a fixed plate, and obtaining appearance data of the workpiece to be processed to obtain initial coordinate data of the workpiece to be processed; Acquiring maximum safety coordinate data of the workpiece to be processed through a data processing module, wherein the maximum safety coordinate data is coordinate data of the workpiece to be processed when the rotary cylinder rotates to the maximum safety rotation angle; Preset minimum processing coordinate data, wherein the minimum processing coordinate data and the maximum safety coordinate data together form a processing area, and the minimum processing coordinate data is located between the initial coordinate data and the maximum safety coordinate data; Preset the grinding head movement route, drive the grinding head to move along the grinding head movement route and grind and polish the workpiece to be processed; The grinding head moving route passes through the processing area.

2. The method for planning a polishing tool path in CNC polishing according to claim 1, characterized in that: The method comprises providing an experimental workpiece and a rotary cylinder, wherein the experimental workpiece can drive the rotary cylinder to rotate when subjected to force; obtaining a maximum angle of rotation of the rotary cylinder driven by the maximum safety pressure applied to the experimental workpiece during polishing, so as to obtain a maximum safe rotation angle; specifically comprising: Providing multiple experimental artifacts, and evenly dividing the experimental artifacts into multiple experimental artifact groups; Presetting a plurality of experimental rotation angles of the rotary cylinders at equal angles, wherein the number of the experimental rotation angles is the same as the number of the experimental workpiece groups; driving the grinding head to apply pressure to the experimental workpieces of each experimental workpiece group and to grind and polish the experimental workpieces, and making the angle of rotation of the rotary cylinder driven by the experimental workpieces of each experimental workpiece group correspond to a different experimental rotation angle; The experimental workpieces of each group of the experimental workpieces after the grinding and polishing process are analyzed to obtain the experimental rotation angle corresponding to the experimental workpiece group with defects in the machined surface, thereby obtaining the maximum safe rotation angle.

3. The method for planning a polishing tool path in CNC polishing according to claim 1, wherein: The coordinate system is established based on the workbench, the workpiece to be processed is fixed on the fixed plate, and the appearance data of the workpiece to be processed is obtained to obtain the initial coordinate data of the workpiece to be processed; Specifically include: Setting a base point on the upper end surface of the workbench and establishing a three-dimensional rectangular coordinate system with the base point as the origin; After fixing the workpiece to be processed on a fixed plate, scanning the workpiece to be processed with a laser scanner to obtain appearance feature data of the workpiece to be processed; Processing the appearance feature data of the workpiece to be processed by an image processing module to enhance the appearance feature data of the workpiece to be processed; A coordinate data conversion module is used to convert the appearance feature data of the workpiece to be processed into data in a rectangular coordinate system to generate initial coordinate data of the workpiece to be processed.

4. The method for planning a polishing tool path in CNC polishing according to claim 1, wherein: The method of obtaining the maximum safety coordinate data of the workpiece to be processed by the data processing module specifically includes: Obtain the length of the rotary isobar, and in combination with the maximum safe rotation angle, calculate and obtain the maximum movement distance of the fixed plate through the data processing module; The coordinate data of the fixed plate when it is located at the maximum moving distance is acquired through a data processing module to generate maximum safety coordinate data.

5. The method for planning a polishing tool path in CNC polishing according to claim 1, wherein: The grinding head movement route includes a first reference point, a second reference point, a third reference point and a fourth reference point. The first reference point and the fourth reference point are located at the two ends of the side of the initial coordinate data away from the maximum safety coordinate data, and the second reference point and the third reference point are located at the two ends within the processing area; the grinding head movement route passes through the first reference point, the second reference point, the third reference point and the fourth reference point in sequence.

6. The method for planning a polishing tool path in CNC polishing according to claim 1, wherein: Also includes: When the grinding head moves to the warning coordinate, the workpiece to be processed is driven to move in a direction away from another warning coordinate by the first X-axis moving platform to prevent the grinding head from deviating from the processing area during grinding and polishing.

7. The method for planning a polishing tool path in CNC polishing according to claim 6, wherein: When the grinding head moves to the warning coordinate, the workpiece to be processed is driven to move in a direction away from another warning coordinate by the first X-axis moving platform; specifically comprising: Presetting a maximum warning coordinate and a minimum warning coordinate, wherein the warning coordinates include the maximum warning coordinate and the minimum warning coordinate, and the maximum warning coordinate and the minimum warning coordinate are located in the processing area; When the grinding head moves to the maximum warning coordinate, the workpiece to be processed is driven to move in a direction away from the minimum warning coordinate by the first X-direction moving platform; when the grinding head moves to the minimum warning coordinate, the workpiece to be processed is driven to move in a direction away from the maximum warning coordinate by the first X-direction moving platform.

8. A polishing device, characterized in that: A method for planning a path for a polishing tool in CNC polishing as claimed in any one of claims 1 to 7, wherein the polishing device comprises a main body and an isobaric device; The body comprises: A workbench, used to carry workpieces; A grinding head, used for grinding workpieces; A driving mechanism, used for driving the grinding head; A laser scanner is used to scan the workpiece to be processed to obtain appearance feature data of the workpiece to be processed; An image processing module, used to process and enhance the appearance feature data of the workpiece to be processed; A coordinate data conversion module, used to convert the appearance feature data of the workpiece to be processed into coordinate data; A data processing module is used to process the coordinate data of the workpiece to be processed after it moves; The isobaric device comprises: A first X-axis movable platform is fixedly arranged on the workbench; a second X-axis movable platform, slidably connected to the first X-axis movable platform; a fixed plate, slidably connected to the second X-axis movable platform, the fixed plate being used to fix the workpiece to be processed, and having a through hole; A rotary cylinder is fixedly arranged on the second X-direction movable platform, a rotary isobar block is fixedly arranged on the rotating shaft of the rotary cylinder, and rotary isobar rods are arranged on both sides of the rotary isobar block; The rotary isobar is embedded in the through hole. When the fixed plate moves on the second X-direction moving platform, the fixed plate drives the rotating shaft of the rotary cylinder to rotate through the rotary isobar.

9. The polishing device according to claim 8, characterized in that: A linear motor is provided on the first X-direction movable platform, and the second X-direction movable platform is provided on the output shaft of the linear motor; a guide rail is provided on the second X-direction movable platform, and a slider is provided on the lower end surface of the fixed plate, and the slider is slidably connected to the guide rail.

10. The polishing equipment according to claim 8, characterized in that: The rotary cylinder is equipped with a torque spring.

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