Electronic devices

Abstract

The present application relates to an electronic device, which comprises: a housing, a heat spreader and a circuit board; the housing comprises an upper housing and a lower housing, the lower housing, the heat spreader, the circuit board and the upper housing are arranged in sequence along a first direction; the projection of the heat spreader along the first direction at least covers a target area of ​​the circuit board. The circuit board can be cooled and the manufacturing cost can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of hardware heat dissipation, and in particular to an electronic device. Background Art

[0002] The power converter can convert DC power into AC power. The DC end (input) of the power converter is connected to the DC source (photovoltaic module), and the AC end (output) of the power converter can be connected to the AC grid and the load. In the power converter, the components on the circuit board will generate a lot of heat when working. If the heat cannot be dissipated in time, the components on the circuit board will be damaged, which will cause the entire power converter to malfunction. Summary of the invention

[0003] Based on this, it is necessary to provide an electronic device that can dissipate heat for a circuit board in order to solve the heat dissipation problem.

[0004] An electronic device, comprising:

[0005] The housing, a vapor chamber and circuit board;

[0006] The housing comprises an upper housing and a lower housing, wherein the lower housing, the heat sink, the circuit board and the upper housing are sequentially arranged along a first direction;

[0007] The projection of the vapor chamber along the first direction at least covers a target area of ​​the circuit board.

[0008] In one of the embodiments, the target area includes a first area on the circuit board where the power consumption of components is greater than a first preset threshold.

[0009] In one of the embodiments, the target area includes: a primary side area on the circuit board, and a second area in the secondary side area where the power consumption of the device is greater than a second preset threshold.

[0010] In one embodiment, the target area does not include an EMI filter circuit area in a secondary side area of ​​the circuit board.

[0011] In one of the embodiments, a transformer is disposed in the target area, and the transformer is connected across the primary area and the secondary area.

[0012] In one of the embodiments, a first group of through holes is disposed on the heat spreader, a projection of the first group of through holes along the first direction is located within the primary edge region, and the first group of through holes is used for insulation.

[0013] In one embodiment, the first group of through holes includes: at least one of a first type of through hole, a second type of through hole, a third type of through hole, a fourth type of through hole, and a fifth type of through hole;

[0014] The projection of the first type of through hole along the first direction corresponds to the pin of the power line communication PLC communication transformer;

[0015] The projection of the second type through hole along the first direction corresponds to the capacitor pin;

[0016] The projection of the third type through hole along the first direction corresponds to a connector;

[0017] The projection of the fourth type through hole along the first direction corresponds to the primary area pin of the transformer;

[0018] The projection of the fifth type through hole along the first direction corresponds to a sampling pin of a current transformer CT.

[0019] In one of the embodiments, a second group of through holes is disposed on the vapor chamber, a projection of the second group of through holes along the first direction is located in the secondary side region, and the second group of through holes corresponds to device pins in the secondary side region.

[0020] In one embodiment, the second group of through holes includes a sixth type of through holes, and a projection of the sixth type of through holes along the first direction corresponds to a pin in a secondary region of the transformer.

[0021] In one of the embodiments, the heat spreader includes a thermally conductive adhesive coating area, and a projection of the thermally conductive adhesive coating area along the first direction coincides with a high power consumption device area.

[0022] In one of the embodiments, the thermal conductive adhesive application area includes: a first application area and a second application area;

[0023] The projection of the first smearing area along the first direction coincides with the high power consumption device area in the original edge area;

[0024] The projection of the second smearing area along the first direction coincides with the high power consumption device area in the secondary side area.

[0025] In one of the embodiments, a first protrusion and a second protrusion are disposed on the heat spreader, the first coating area is disposed on the first protrusion, and the second coating area is disposed on the second protrusion.

[0026] In one of the embodiments, a protrusion is provided on the heat spreader, and a projection of the protrusion along the first direction coincides with a high power consumption device region.

[0027] In one embodiment, the thickness of the heat spreader is greater than or equal to 2 mm.

[0028] In one embodiment, the heat spreader is made of metal.

[0029] In one of the embodiments, a first positioning column extending along the first direction is provided on one side of the lower shell body close to the heat spreader, a first positioning hole is provided on the heat spreader, a limiting hole is provided on the circuit board, and the first positioning column passes through the first positioning hole and the limiting hole in sequence.

[0030] In one embodiment, the first positioning column includes a support platform, the circuit board is carried on the support platform, and the height of the support platform is greater than the thickness of the heat sink.

[0031] In one of the embodiments, a second positioning column is provided on the lower shell, a second positioning hole is provided on the heat spreader, the second positioning column is passed through the second positioning hole, and the height of the second positioning column is the same as the thickness of the heat spreader.

[0032] The electronic device comprises: a housing, a vapor chamber and an assembled printed circuit board; the housing comprises an upper housing and a lower housing, and the lower housing, the vapor chamber, the circuit board and the upper housing are arranged in sequence along a first direction; the projection of the vapor chamber along the first direction at least covers the target area of ​​the circuit board. In this solution, a vapor chamber is arranged in the electronic device, and the projection of the vapor chamber along the first direction at least covers the target area of ​​the circuit board, so that the vapor chamber can achieve heat dissipation for the circuit board, and compared with the solution of setting multiple vapor chambers, the manufacturing cost can be reduced and the manufacturing process can be simplified.

[0033] In the above embodiment, the projection of the vapor chamber along the first direction at least covers the target area of ​​the circuit board. In this case, the vapor chamber can serve as a shielding cover for electromagnetic interference (EMI) generated by the circuit board, thereby achieving an EMI shielding effect.

[0034] In the above embodiment, the vapor chamber, the circuit board, and the parasitic capacitance between the vapor chamber and the circuit board form a loop, and the electromagnetic interference generated by the circuit board is confined in the loop, which can reduce the electromagnetic waves emitted outward, thereby suppressing the electromagnetic interference.

[0035] In the above embodiment, the heat spreader is a continuous whole heat spreader. In the plane formed by the heat spreader, the EMI generated by the circuit board can circle in the plane, reducing the electromagnetic waves emitted outward, thereby suppressing electromagnetic interference. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of the structure of an electronic device;

[0037] Figure 2A A schematic diagram of a circuit board 12 and a heat spreader 11 Figure 1 ;

[0038] Figure 2B A schematic diagram of a configuration between a heat spreader 11 and an EMI filter circuit;

[0039] Figure 3 Schematic diagram 2 of a circuit board 12 and a heat spreader 11;

[0040] Figure 4 It is a schematic diagram of the structure of a part of an electronic device;

[0041] Figure 5A is a schematic diagram of a fixing structure between a lower housing 14 and a heat spreader 11;

[0042] Figure 5B For a Figure 5A A partial enlarged view of the M in the middle;

[0043] Figure 5C For a Figure 5A A local enlarged view of the N position in the middle;

[0044] Figure 5D For a Figure 5A A partial enlarged view of the S in the middle;

[0045] Figure 6 Schematic diagram of the structure of a positioning member 56.

[0046] The above-mentioned drawings include: a heat sink 11, a circuit board 12, an upper shell 13, a lower shell 14, a first direction X, a first dotted line area 121, a second dotted line area 122, a third dotted line area 123, a first type of through hole 31, a second type of through hole 32, a third type of through hole 33, a fourth type of through hole 34, a sixth type of through hole 35, a fifth type of through hole 36, a glue leakage hole 37, a first smearing area 421, a second smearing area 422, a high power consumption device area 431 in the primary side area, a high power consumption device area 432 in the secondary side area, a first protrusion 441, a second protrusion 442, an EMI filter circuit area 45, a first positioning column 51, a first positioning hole 52, a limiting hole 53, a second positioning column 54, a second positioning hole 55, a positioning member 56, a supporting portion 561, and abutting portion 562. DETAILED DESCRIPTION

[0047] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0048] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0049] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0050] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0051] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0052] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0053] Power converters are power conversion devices used to convert electrical energy from one form to another to achieve energy transmission and control under different power requirements. Power converters can be micro inverters, energy storage converters, etc. For example, micro inverters can convert DC direct current into AC alternating current. The DC end (input) of the micro inverter is connected to a DC source (photovoltaic module), and the AC end (output) of the power converter can be connected to an AC grid and an AC device.

[0054] For example, in a micro inverter, the components on the circuit board will generate a large amount of heat when working. If the heat cannot be dissipated in time, the components on the circuit board will be damaged, thereby causing the entire micro inverter to malfunction.

[0055] In the present application, the electronic device may be the above-mentioned power converter, for example, a micro inverter, an energy storage converter, etc. In the embodiment of the present application, a heat spreader is provided in the electronic device, so that the heat spreader can dissipate heat for the circuit board in time.

[0056] It should be noted that the heat spreader in the embodiment of the present application can also be applied to any electronic device provided with a circuit board except the above-mentioned power converter.

[0057] See also Figure 1 , Figure 1 The electronic device in one embodiment of the present application is a schematic diagram of the structure of the electronic device, which includes: a housing, a heat spreader 11 and a circuit board 12; the housing includes an upper housing 13 and a lower housing 14, and the lower housing 14, the heat spreader 11, the circuit board 12 and the upper housing 13 are arranged along a first direction X (such as Figure 1 wherein, the projection of the heat spreader 11 along the first direction X at least covers the target area of ​​the circuit board 12.

[0058] like Figure 1As shown, a heat spreader 11 is provided in the electronic device, and the projection of the heat spreader 11 along the first direction X at least covers the target area of ​​the circuit board 12, so that the heat spreader 11 can dissipate heat for the circuit board 12, and compared with the solution of providing multiple heat spreaders, the manufacturing cost can be reduced.

[0059] In some embodiments, the circuit board 12 may be a printed circuit board assembly (PCBA). The target area may be the entire area or a partial area of ​​the circuit board 12. When the target area is a partial area of ​​the circuit board 12, the projection of the heat spreader 11 along the first direction X may cover a partial area of ​​the circuit board 12, thereby achieving heat dissipation of a partial area on the circuit board. Compared with covering the entire area of ​​the circuit board 12, the size of the heat spreader 11 may be reduced, the manufacturing cost may be reduced, and the manufacturing process may be simplified.

[0060] In the above embodiment, the projection of the heat spreader 11 along the first direction X at least covers the target area of ​​the circuit board 12. The heat spreader 11, the circuit board 12 and the parasitic capacitance between the circuit boards 12 form a loop. The electromagnetic interference generated by the circuit board 12 is confined in the loop, which can reduce the electromagnetic waves emitted outward, thereby suppressing the electromagnetic interference. In addition, the heat spreader 11 is a continuous whole heat spreader. In the plane formed by the heat spreader 11, the electromagnetic interference (EMI) EMI generated by the circuit board 12 can be confined in the plane, reducing the electromagnetic waves emitted outward, thereby suppressing the electromagnetic interference. At this time, the heat spreader 11 can be regarded as a shielding cover for the EMI generated by the circuit board 12, which has a shielding effect on the EMI.

[0061] Embodiment 1:

[0062] The target area includes a first area on the circuit board 12 where the power consumption of the device is greater than the first preset threshold. The device on the circuit board 12 where the power consumption of the device is greater than the first preset threshold has a large power consumption, so the device generates a lot of heat. The temperature of the first area will be relatively high, and its heat dissipation requirement is also relatively high. The projection of the heat spreader 11 along the first direction covers the first area, which can make the heat dissipation effect of the first area better, thereby ensuring the normal operation of the device in the first area and extending the working life of the working device.

[0063] Devices on the circuit board 12 whose device power consumption is greater than the first preset threshold value can be defined as high-power devices, such as metal oxide semiconductor field effect transistors (MOSFET). The first preset threshold value can be set according to the relationship between the device power consumption and the heat generated in practice, and the need for heat dissipation in the embodiment of the present application, and is not limited in the embodiment of the present application.

[0064] It should be noted that the projection of the above-mentioned heat spreader 11 along the first direction X at least covers the target area of ​​the circuit board 12, which can be understood as: in the above-mentioned embodiment one, the projection of the heat spreader 11 along the first direction X not only covers the first area on the circuit board 12, but also may include some other areas on the circuit board 12.

[0065] Embodiment 2:

[0066] The circuit board 12 includes a primary region and a secondary region, wherein the primary region is the region where the DC circuit is located in the circuit board 12, and the secondary region is the region where the AC circuit is located in the circuit board 12.

[0067] For example, Figure 2A A schematic diagram of a circuit board 12 and a heat spreader 11 Figure 1 .like Figure 2A As shown in FIG. 1 , the area within the first dotted line area 121 on the circuit board 12 is the secondary side area, and the area within the second dotted line area 122 on the circuit board 12 is the primary side area. The target area includes: the primary side area on the circuit board 12, and the second area in the secondary side area on the circuit board 12 where the device power consumption is greater than the second preset threshold, and the second area can be Figure 2A The area on the middle circuit board 12 is within the first dotted area 121 and is covered by the projection of the heat spreader 11 .

[0068] It should be noted that the first dotted line area 121 and the second dotted line area 122 are exemplary area divisions. The first dotted line area 121 is not a strict boundary of the secondary side area, and the second dotted line area 122 is not a strict boundary of the primary side area. The first dotted line area 121 is only an exemplary area that the secondary side area may fall into, and the second dotted line area 122 is only an exemplary area that the primary side area may fall into.

[0069] In some embodiments, the target area includes a second area in the secondary side area on the circuit board 12 where the device power consumption is greater than the second preset threshold. The device in the second area on the circuit board 12 where the device power consumption is greater than the second preset threshold generates more heat due to the large power consumption. The temperature of the second area will be relatively high, and its heat dissipation requirement is also relatively high. The projection of the heat spreader 11 along the first direction covers the second area, which can make the heat dissipation effect of the second area better, thereby ensuring the normal operation of the device in the second area and extending the working life of the working device.

[0070] Among them, the above-mentioned second preset threshold can be set according to the relationship between the power consumption of the device and the heat generated in practice, as well as the demand for heat dissipation in the embodiment of the present application, and the embodiment of the present application is not limited.

[0071] Embodiment three:

[0072] like Figure 2A As shown, the above target area does not include the EMI filter circuit area in the secondary side area of ​​the circuit board. The EMI filter circuit area is Figure 2A The EMI filter circuit area can be located in the first dotted line area 121 on the circuit board 12 and not covered by the projection of the heat spreader 11. Figure 2A Within the third dotted line area 123 shown.

[0073] It should be noted that the third dotted area 123 is an exemplary area division, wherein the third dotted area 123 does not indicate a strict boundary of the EMI filter circuit area, but is merely an exemplary area into which the EMI filter circuit area may fall.

[0074] In some embodiments, for example, Figure 2B As shown in FIG. 1 , it is a schematic diagram of a configuration method between a heat spreader 11 and an EMI filter circuit. Figure 2B As shown, the heat spreader 11 covers the circuits in the primary side area and the secondary side area of ​​the circuit board 12, and the heat spreader 11 does not extend to the area where the EMI filter circuit is located (such as Figure 4 In this way, the EMI filter circuit is prevented from being bypassed by the heat spreader 11, thereby improving the EMI suppression effect.

[0075] if Figure 2BThe heat spreader 11 in the circuit board 12 extends to the projection covering the EMI filter circuit area. At this time, due to the parasitic capacitance between the heat spreader 11 and the circuit board 12, a low-impedance channel will be formed between the parasitic capacitance and the heat spreader 11. In this way, the EMI generated in the secondary side area will be directly emitted through the low-impedance channel without passing through the EMI filter circuit, making it impossible for the EMI filter circuit to achieve filtering, resulting in poor effect in suppressing EMI noise. Based on this consideration, the heat spreader 11 is set in this application to not cover the EMI filter circuit area in the secondary side area to improve the effect of suppressing EMI.

[0076] if Figure 2A The heat spreader 11 in the embodiment extends to the projection area covering the EMI filter circuit area. Figure 2A As shown in the figure, there are many device pins 22 in the EMI filter circuit area on the circuit board 12. In order to meet the safety requirements, it is necessary to set densely packed pin openings on the heat spreader 11 at the position corresponding to the above EMI filter circuit area to avoid a large number of device pins 22. These pin openings will bring additional process costs. Therefore, in this application, the heat spreader 11 is set to not cover the EMI filter circuit area in the secondary side area, so as to reduce the process cost and ensure a good heat dissipation effect.

[0077] Embodiment 4:

[0078] The target area may also be provided with a transformer, which is connected across the primary area and the secondary area.

[0079] In the above embodiment, a portion of the heat spreader 11 extends to under the magnetic core of the above transformer, and bridges the primary pin and the secondary pin of the transformer, while covering the circuit in the primary area and the circuit in the secondary area, thereby forming an electromagnetic shielding layer inside the electronic device, which can effectively suppress EMC noise.

[0080] It should be noted that the circuit board in this application is a circuit board assembly formed by installing various electronic components, such as resistors, capacitors, inductors, diodes, transistors, integrated circuits, etc. on a printed circuit board (PCB) through surface mount technology (SMT) or plug-in technology, and performing a series of processes such as welding, cleaning, and testing.

[0081] In some embodiments, a first group of through holes is disposed on the above-mentioned heat spreader 11 , and the projection of the first group of through holes along the first direction X is located in the primary edge region, and the first group of through holes is used for insulation.

[0082] In some embodiments, a second group of through holes is disposed on the heat spreader 11 , and projections of the second group of through holes along the first direction X are located in the secondary side region, and the second group of through holes correspond to device pins in the secondary side region.

[0083] In some embodiments, the second set of through holes can be used to meet safety requirements, and these holes can be used to avoid device pins in the secondary side area of ​​the circuit board 12 .

[0084] In this application, the projection of the vapor chamber 11 along the first direction covers the circuit in the primary area, so the vapor chamber 11 can be regarded as a part of the circuit in the primary area. Safety standards require that the devices in the primary area and the secondary area on the circuit board 12 must be separated by a certain distance (for example, 6.3 mm). In order to meet this safety requirement, holes are opened at positions on the vapor chamber 11 corresponding to the device pins in the secondary area, so that the vapor chamber 11 (including the devices in the primary area) and the devices in the secondary area are separated by a safe distance.

[0085] If the heat spreader 11 is regarded as part of the circuit in the secondary area, then in order to meet the requirements, it is necessary to open holes on the heat spreader 11 at positions corresponding to the device pins in the primary area. If more holes are set in the primary area, the primary area cannot form a large continuous area for heat dissipation, so the heat dissipation effect is poor and the manufacturing complexity is high. Therefore, this application does not adopt such a setting method, but adopts the above method to regard the heat spreader 11 as part of the circuit in the primary area, and open holes on the heat spreader 11 at positions corresponding to the device pins in the secondary area.

[0086] For example, Figure 3 FIG2 is a schematic diagram of a circuit board 12 and a heat spreader 11. Figure 3 As shown, the first group of through holes includes at least one of a first type through hole 31, a second type through hole 32, a third type through hole 33, a fourth type through hole 34 and a fifth type through hole 36. The projection of the first type through hole 31 along the first direction X corresponds to a power line communication (PLC) communication transformer pin; the projection of the second type through hole 32 along the first direction X corresponds to a capacitor pin; the projection of the third type through hole 33 along the first direction X corresponds to a connector; the projection of the fourth type through hole 34 along the first direction X corresponds to a primary side region pin of the transformer, and the fifth type through hole 36, the projection of the fifth type through hole 36 along the first direction X corresponds to a current transformer CT sampling pin.

[0087] For example, Figure 3 As shown, a second group of through holes is provided on the heat spreader 11, and the second group of through holes includes a sixth type of through hole 35. The projection of the sixth type of through hole 35 along the first direction X corresponds to the secondary side region pin of the transformer.

[0088] It should be noted that the above Figure 3The through holes and the pins of the device shown in the figure are all exemplary descriptions. The specific positions and numbers of the through holes set on the heat spreader 11 are not limited in the embodiment of the present application, and the specific positions and numbers of the pins on the circuit board 12 are not limited, and can be set according to actual needs.

[0089] In the present application, the above-mentioned heat spreader 11 can be connected to the above-mentioned circuit board 12 through a thermal conductive adhesive to fill the gap between the heat spreader 11 and the circuit board 12.

[0090] Exemplarily, the material of the thermal conductive adhesive may be silica gel, and the thermal conductive adhesive may have good thermal conductivity to quickly conduct the heat of the circuit board 12 to the heat spreader 11 to achieve good heat dissipation.

[0091] Exemplarily, the heat spreader 11 in the electronic device includes a thermal conductive adhesive coating area, and a projection of the thermal conductive adhesive coating area along the first direction X coincides with a high power consumption device area.

[0092] The high power consumption device region may be the first region and / or the second region. The high power consumption device region is provided with high power consumption devices. Exemplarily, the devices in the high power consumption device region may be MOSFETs.

[0093] For example, Figure 4 It is a schematic diagram of the structure of a part of an electronic device. Figure 4 As shown, the heat spreader 11 in the electronic device includes a thermal conductive adhesive coating area, and the thermal conductive adhesive coating area includes: a first coating area 421 and a second coating area 422; the projection of the first coating area 421 along the first direction X coincides with the high power consumption device area 431 in the primary edge area; the projection of the second coating area 422 along the first direction X coincides with the high power consumption device area 432 in the secondary edge area.

[0094] The high power consumption device area 431 in the primary area and the high power consumption device area 432 in the secondary area are the main high heat generation areas. Thermal conductive adhesive is set in these two areas accordingly, which can not only save the amount of thermal conductive adhesive, but also prevent the heat from the high heat generation area from being transferred to other low heat generation areas, thereby preventing the damage to the devices in other low heat generation areas.

[0095] In some embodiments, Figure 4 As shown, the heat spreader 11 is provided with a first protrusion 441 and a second protrusion 442, the first smearing area 421 is provided on the first protrusion 441, and the second smearing area 422 is provided on the second protrusion 442. The first protrusion 441 and the second protrusion 442 are protrusion structures integrally formed in the heat spreader 11.

[0096] In some embodiments, the heat spreader 11 may not be provided with a coating area, but only with a protrusion, and the projection of the protrusion along the first direction X coincides with the high power consumption device area. Figure 4 The first protrusion 441 and / or the second protrusion 442 shown in FIG. 4 may be a high power consumption device region. Figure 4 The high power consumption device area 431 in the primary side area and / or the high power consumption device area 432 in the secondary side area are shown in FIG. Wherein, the above-mentioned protrusions may not be coated with thermal conductive glue.

[0097] In the above embodiment, a protrusion (such as the above-mentioned first protrusion 441, and / or the second protrusion 442) is provided on the heat spreader 11, so that the protrusion and the circuit board 12 (or the high-power consumption device area on the circuit board 12, such as the high-power consumption device area 431 in the primary side area, and / or the high-power consumption device area 432 in the secondary side area) can better contact and conduct the heat of the circuit board 12, increase the heat conduction volume of the heat spreader 11, and thus play a better heat dissipation effect.

[0098] In some embodiments, the thickness of the vapor chamber 11 is greater than or equal to 0.5 mm.

[0099] The thickness of the heat spreader 11 is set relatively large (ie, greater than 0.5 mm), so that the heat dissipation effect can be better.

[0100] In some embodiments, the above-mentioned heat spreader 11 is made of metal. The heat spreader 11 can be a whole piece of metal material. The manufacturing process using a whole piece of metal plate is simpler and can save manufacturing costs. Among them, the heat spreader 11 can be an aluminum plate or a copper plate. Since metal materials have good thermal conductivity, the above-mentioned heat spreader 11 made of metal material can better dissipate heat for the circuit board; since metal materials also have good electrical conductivity, the above-mentioned heat spreader 11 made of metal material can form a closed loop of EMI (electromagnetic waves) on the heat spreader 11, reducing the electromagnetic waves emitted outward, thereby improving the EMI effect.

[0101] For example, Figure 5A Schematic diagram of a fixing structure between the lower housing 14 and the heat spreader 11. Figure 5A As shown, a first positioning column 51 extending along the first direction X is provided on one side of the lower shell 14 close to the heat spreader 11, a first positioning hole 52 is provided on the heat spreader 11, and a limiting hole 53 is provided on the circuit board 11. The first positioning column 51 passes through the first positioning hole 52 and the limiting hole 53 in sequence.

[0102] In some embodiments, the first positioning column 51 includes a support platform 511 , the circuit board 12 is carried on the support platform 511 , and the height of the support platform 511 is greater than the thickness of the vapor chamber 11 .

[0103] Exemplarily, the support platform 511 may be cross-shaped, and the support platform 511 may be used not only to position the vapor chamber 11 , but also to position the circuit board 12 .

[0104] Exemplarily, the height of the support platform 511 above the vapor chamber 11 may be 1 mm, so that the distance between the vapor chamber 11 and the circuit board 12 is 1 mm, which is used for coating the thermal conductive adhesive.

[0105] In the above embodiment, the first positioning column 51 can fix the heat sink 11 , support the circuit board 12 , and limit the lateral movement of the circuit board 12 .

[0106] In some embodiments, a second positioning column 54 is provided on the lower shell 14 , a second positioning hole 55 is provided on the heat spreader 11 , the second positioning column 54 passes through the second positioning hole 55 , and the height of the second positioning column 54 is the same as the thickness of the heat spreader 11 .

[0107] In the above embodiment, the second positioning column 54 can be used to limit the lateral movement of the vapor chamber 11 .

[0108] In some embodiments, Figure 5A As shown, the lower housing 14 is further provided with a plurality of positioning members 56 arranged around the edge of the heat spreader 11 .

[0109] Figure 5B For a Figure 5A A partial enlarged view of the M in the middle. Figure 5C For a Figure 5A The local enlarged view of the N position in the figure, Figure 5D For a Figure 5A A partial enlarged view of the S in the middle. Figure 5D It can be seen from the figure that the positioning member 56 may include an abutment portion 562, which is used to abut against the outer wall of the heat spreader 11. Figure 5A , Figure 5B , Figure 5C and Figure 5D The fixing structure between the lower housing 14 and the circuit board 11 can be seen.

[0110] For example, Figure 6 FIG. 5 is a schematic diagram of the structure of a positioning member 56. Figure 6 As shown, the positioning member 56 may include a supporting portion 561 and an abutting portion 562 connected to each other, the vapor chamber 11 is supported on the supporting portion 561 , and the outer wall of the vapor chamber 11 abuts against the abutting portion 562 .

[0111] The supporting portion 561 is used to support the vapor chamber 11. The abutting portion 562 is used to abut against the edge of the vapor chamber 11 to limit the lateral movement of the vapor chamber 11.

[0112] In some embodiments, the height of the abutting portion 562 is greater than the thickness of the vapor chamber 11 to limit the lateral movement of the vapor chamber 11 .

[0113] In some embodiments, the above-mentioned heat plate 11 may also be provided with Figure 3 The leaking hole 37 shown in Figure 3 6 leakage holes are shown as an example, and in practice, the number of the leakage holes 37 can be set according to the needs. The leakage holes 37 are used to allow the glue to flow through the heat plate 11 quickly.

[0114] The glue is used to seal all components between the upper shell 13 and the lower shell 14 to prevent moisture from affecting the components. The glue leakage holes 37 can allow the glue to pass quickly when the glue flows to the heat spreader 11, ensuring that the glue flows to all positions, so that the glue can be more evenly distributed in the shell without generating bubbles.

[0115] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0116] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An electronic device, characterized in that: The electronic device comprises: The housing, a vapor chamber and circuit board; The housing comprises an upper housing and a lower housing, wherein the lower housing, the heat sink, the circuit board and the upper housing are sequentially arranged along a first direction; The projection of the vapor chamber along the first direction at least covers a target area of ​​the circuit board, and the circuit board includes a primary side area and a secondary side area; A first group of through holes is provided on the heat spreader, and the projection of the first group of through holes along the first direction is located in the primary area, and the first group of through holes is used for insulation; the first group of through holes includes: at least one of a first type of through hole, a second type of through hole, a third type of through hole, a fourth type of through hole and a fifth type of through hole; the projection of the first type of through hole along the first direction corresponds to a power line communication PLC communication transformer pin; the projection of the second type of through hole along the first direction corresponds to a capacitor pin; the projection of the third type of through hole along the first direction corresponds to a connector; the projection of the fourth type of through hole along the first direction corresponds to a primary area pin of the transformer; the projection of the fifth type of through hole along the first direction corresponds to a current transformer CT sampling pin; A second group of through holes is provided on the vapor chamber, the projection of the second group of through holes along the first direction is located in the secondary side region, and the second group of through holes corresponds to the device pins in the secondary side region; The second group of through holes includes a sixth type of through holes, and a projection of the sixth type of through holes along the first direction corresponds to a pin in a secondary region of the transformer.

2. The electronic device according to claim 1, characterized in that: The target area includes a first area on the circuit board where the power consumption of components is greater than a first preset threshold.

3. The electronic device according to claim 1, characterized in that: The target area includes: the primary side area on the circuit board, and a second area in the secondary side area where the power consumption of the device is greater than a second preset threshold.

4. The electronic device according to any one of claims 1 to 3, characterized in that: The target area does not include an electromagnetic interference (EMI) filter circuit area in the secondary side area on the circuit board.

5. The electronic device according to any one of claims 1 to 3, characterized in that: The target area is provided with the transformer, and the transformer is connected across the primary area and the secondary area.

6. The electronic device according to claim 2 or 3, characterized in that: The heat spreader includes a thermal conductive adhesive coating area, and a projection of the thermal conductive adhesive coating area along the first direction coincides with a high power consumption device area.

7. The electronic device according to claim 6, characterized in that: The thermal conductive adhesive application area includes: a first application area and a second application area; The projection of the first smearing area along the first direction coincides with the high power consumption device area in the original edge area; The projection of the second smearing area along the first direction coincides with the high power consumption device area in the secondary edge area.

8. The electronic device according to claim 7, characterized in that: The heat spreader is provided with a first protrusion and a second protrusion, the first smearing area is provided on the first protrusion, and the second smearing area is provided on the second protrusion.

9. The electronic device according to claim 1, characterized in that: The vapor chamber is provided with a protrusion, and a projection of the protrusion along the first direction coincides with a high power consumption device region.

10. The electronic device according to claim 1, characterized in that: The thickness of the heat spreader is greater than or equal to 2 mm.

11. The electronic device according to claim 1, characterized in that: The heat spreader is made of metal.

12. The electronic device according to claim 1, characterized in that: A first positioning column extending along the first direction is arranged on one side of the lower shell body close to the heat spreader, a first positioning hole is arranged on the heat spreader, a limiting hole is arranged on the circuit board, and the first positioning column passes through the first positioning hole and the limiting hole in sequence.

13. The electronic device according to claim 12, characterized in that: The first positioning column includes a support platform, the circuit board is carried on the support platform, and the height of the support platform is greater than the thickness of the heat spreader.

14. The electronic device according to claim 1, characterized in that: The lower shell is provided with a second positioning column, the heat spreader is provided with a second positioning hole, the second positioning column is passed through the second positioning hole, and the height of the second positioning column is the same as the thickness of the heat spreader.

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