Inp ingot cutting device and working method thereof
The Inp crystal ingot cutting device addresses inefficiencies in graphite plate fitting by using a limiting mechanism with repair sliders to fill and coat depressions, ensuring precise and efficient cutting.
Patent Information
- Application Number
- CN202411157295.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-22
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2044-08-22
AI Technical Summary
Existing wire cutting machines for crystal ingots require frequent replacement and processing of graphite plates to fit the surface contour of crystal columns, leading to inefficiency.
An Inp crystal ingot cutting device with a limiting mechanism featuring an upper and lower jacket, cutting slits, and repair sliders that fill depressions with graphite slurry and coat with resin glue to maintain cutting accuracy.
The device allows for setting cutting seams according to requirements, preventing depressions from affecting cutting thickness by filling and coating the crystal column surface, thus enhancing cutting precision and efficiency.
Smart Images
Figure CN118789686B_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of materials for processing wafers, and specifically relates to wafers processed with non-rotating tools, and more particularly to an Inp crystal ingot cutting device and a working method thereof. Background Art
[0002] The production process of chips is generally to use a wire cutting machine to first cut the crystal column into ingots, and then cut the ingots into chips; during the cutting process of the wire cutting machine, when there is a depression on the surface of the crystal column to be cut to form an inclined surface, it will cause the cutting line to be offset, and finally cause the cut thickness to deviate.
[0003] In order to solve the above problems, in the related art, such as Figure 1 As shown, a graphite plate is used, and one side of the graphite plate is processed so that the contour produced can fit the surface of the crystal column, and then cutting is started from the plane on the other side of the graphite plate to avoid deviation.
[0004] However, in the process of implementing the above solution, a new graphite plate needs to be replaced each time and processed to form a contour that can fit the surface of the crystal column, which is very inefficient.
[0005] Therefore, how to avoid processing a new graphite plate before each cutting is a technical problem that those skilled in the art need to solve urgently.
[0006] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention
[0007] The embodiments of the present disclosure at least provide an Inp ingot cutting device and a working method thereof.
[0008] In the first aspect, the embodiment of the present disclosure provides an Inp crystal ingot cutting device, comprising: a limiting mechanism, which includes: an upper jacket and a lower jacket, the upper jacket and the lower jacket are fitted to limit the crystal column; a plurality of cutting slits, each of the cutting slits vertically passing through the upper jacket and the lower jacket; an upper chamber is opened inside the upper jacket at the corresponding cutting slit, and the cutting slit passes through the middle of the upper chamber and exposes the limited crystal column surface, and a plurality of lower chambers corresponding to the upper chamber are opened in the lower jacket; wherein a repair slider is arranged in each of the upper chambers, and a coating groove is opened on the lower surface of each of the sliders; during the movement of the slider from one side of the cutting slit to the other side, when there is a depression on the exposed crystal column surface, the graphite slurry in the slider flows out to fill the depression, and at the same time, the movement of the slider squeezes the resin glue in the lower chamber to make it enter the coating groove; and during the reset movement of the slider, the resin glue in the coating groove coats the filled graphite slurry surface.
[0009] In one of the embodiments, arc grooves are respectively provided on the opposite surfaces of the upper jacket and the lower jacket; the middle part of the lower surface of the upper chamber is an arc surface, which is adapted to the arc groove; wherein the cutting seam is arranged along the radial direction of the crystal column; the lower surface of the slider is arc-shaped, fits with the lower surface of the upper chamber, and moves along the axial direction of the crystal column.
[0010] In one of the embodiments, a first material storage chamber is opened inside the slider; a discharge port is opened on the bottom surface of the first material storage chamber, and the opening direction of the discharge port is the same as the cutting seam; wherein when the slider moves from one side of the cutting seam to the other side, when the discharge port coincides with the cutting seam, the graphite slurry in the first material storage chamber flows out from the discharge port to fill the depression.
[0011] In one embodiment, the upper chamber is divided into a left chamber and a right chamber by a cutting seam; the slider is arranged in the right chamber, and the bottom surface of the left chamber is provided with a first through hole and a second through hole connected to the corresponding lower chamber; wherein when the slider slides from the right chamber to the left chamber, the gas in the left chamber is squeezed into the lower chamber through the first through hole.
[0012] In one embodiment, a movable partition is provided in the lower chamber to separate the lower chamber into an extrusion chamber and a second material storage chamber; wherein the first through hole is connected to the extrusion chamber; and the slider pressurizes the extrusion chamber through the first through hole during movement.
[0013] In one embodiment, the second through hole is connected to the second material storage cavity; when the slider moves to the threshold, the coating groove is connected to the second through hole to receive the resin glue.
[0014] In one embodiment, the first through hole is located on the left side of the second through hole.
[0015] In one embodiment, the sliders are connected in series via a connecting rod; and the outermost slider is connected to a driver.
[0016] In the second aspect, the embodiment of the present disclosure also provides a working method of an Inp crystal ingot cutting device, which includes: limiting the crystal column by the upper jacket and the lower jacket of the limiting mechanism; by setting a cutting slit at the required cutting position on the limiting mechanism; by opening an upper chamber at the cutting slit of the upper jacket, and making the cutting slit pass through the middle of the upper chamber and expose the limited crystal column surface; by moving the slider in the upper chamber from one side to the other side of the cutting slit, when there is a depression on the exposed crystal column surface, the graphite slurry in the slider flows out to fill the depression, and at the same time, the movement of the slider squeezes the resin glue in the lower chamber to make it enter the coating groove; and by the slider during the resetting movement, the resin glue in the coating groove is coated on the filled graphite slurry surface.
[0017] In one embodiment, the cutting seam is arranged along the radial direction of the crystal column; and the slider moves along the axial direction of the crystal column.
[0018] The beneficial effect of the present invention is that the position of the cutting seam in the Inp crystal ingot cutting device and its working method can be set according to the cutting requirements. By opening an upper chamber and a lower chamber at the cutting seam, the slider in the upper chamber can reciprocate to fill the depression on the surface of the crystal column and coat the solidified material, thereby preventing the depression from affecting the cutting thickness.
[0019] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.
[0020] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 A schematic diagram of a scheme for adopting existing technologies;
[0023] Figure 2 A schematic diagram of the three-dimensional structure of an Inp ingot cutting device provided in an embodiment of the present disclosure;
[0024] Figure 3 A schematic diagram of a three-dimensional cross-sectional structure of a limiting mechanism provided in an embodiment of the present disclosure;
[0025] Figure 4 A schematic diagram of a side cross-sectional structure of a limiting mechanism provided in an embodiment of the present disclosure;
[0026] Figure 5 for Figure 4 Schematic diagram of the structure of the upper chamber and the lower chamber at A in the middle;
[0027] Figure 6 for Figure 4 Structural diagram of the initial position of the slider at A in the middle;
[0028] Figure 7 for Figure 4The schematic diagram of the structure when the discharge port of the slider at A coincides with the cutting seam;
[0029] Figure 8 for Figure 4 A schematic diagram of the structure of the coating groove of the slider at A receiving the resin glue in the second storage cavity;
[0030] Fig. 9 A schematic structural diagram of a slider provided in an embodiment of the present disclosure.
[0031] In the figure:
[0032] Upper jacket 1, upper chamber 11, left chamber 111, right chamber 112, first through hole 113, second through hole 114, slider 12, coating groove 121, first material storage chamber 122, discharge port 123, arc groove 13;
[0033] Lower jacket 2, lower chamber 21, partition 211, extrusion chamber 212, second material storage chamber 213;
[0034] Cut the seam 3. DETAILED DESCRIPTION
[0035] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0036] In this article, when it is mentioned that the first component is located on the second component, this may mean that the first component may be directly formed on the second component, or the third component may be interposed between the first component and the second component. In addition, in the drawings, in order to effectively describe the technical content, the thickness of the component may be exaggerated or reduced.
[0037] In this article, when an element or layer is referred to as being "located on," "engaged to," "connected to," "attached to," or "coupled to" another element or layer, it may be directly located on, engaged, connected, attached to, or coupled to another element or layer, or there may be intermediate elements or layers. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," "directly attached to," or "directly coupled to" another element or layer, there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.
[0038] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.
[0039] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limited. As used herein, the singular articles "one", "an" and "the" may also be intended to include plural forms, unless it is clearly indicated above that this is not the case. The terms "comprise", "include" and "have" are inclusive, and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.
[0040] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.
[0041] The production process of chips is generally to use a wire cutting machine to first cut the crystal column into ingots, and then cut the ingots into chips; during the cutting process of the wire cutting machine, when there is a depression on the surface of the crystal column to be cut to form an inclined surface, it will cause the cutting line to be offset, and finally cause the cut thickness to deviate.
[0042] In order to solve the above problems, in the related art, such as Figure 1 As shown, a graphite plate is used, and one side of the graphite plate is processed so that the contour produced can fit the surface of the crystal column, and then cutting is started from the plane on the other side of the graphite plate to avoid deviation.
[0043] However, in the process of implementing the above solution, a new graphite plate needs to be replaced each time and processed to form a contour that can fit the surface of the crystal column, which is very inefficient.
[0044] The defects existing in the above solutions are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present invention in this article for the above problems should be the contributions made by the inventor to the present invention during the disclosure process.
[0045] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0046] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0047] like Figures 1 to 3 As shown, the embodiment of the present disclosure provides an Inp crystal ingot cutting device, comprising: a limiting mechanism, which comprises: an upper jacket 1 and a lower jacket 2, the upper jacket 1 and the lower jacket 2 are fitted together to limit the crystal column; a plurality of cutting seams 3, each of the cutting seams 3 vertically passes through the upper jacket 1 and the lower jacket 2; an upper chamber 11 is opened inside the upper jacket 1 at the corresponding cutting seam 3, and the cutting seam 3 passes through the middle of the upper chamber 11 and exposes the surface of the limited crystal column, and a plurality of lower chambers 21 corresponding to the upper chamber 11 are opened in the lower jacket 2; A repairing slider 12 is provided in each of the upper chambers 11, and a coating groove 121 is opened on the lower surface of each of the sliders 12; when the slider 12 moves from one side to the other side of the cutting seam 3, when there is a depression on the exposed surface of the crystal column, the graphite slurry in the slider 12 flows out to fill the depression, and at the same time, the movement of the slider 12 squeezes the resin glue in the lower chamber 21 to make it enter the coating groove 121; and during the reset movement of the slider 12, the resin glue in the coating groove 121 coats the filled graphite slurry surface.
[0048] In this embodiment, the position of the cutting seam 3 can be set according to the cutting requirements. The set cutting seam 3 vertically penetrates the upper jacket 1 and the lower jacket 2, so that the surface of the crystal column to be cut is exposed in the cutting seam 3, and then the cutting line of the wire cutting machine cuts the limited crystal column along the cutting seam 3.
[0049] Since there may be depressions on the surface of the crystal column exposed in the cutting seam 3, the depressions will form an inclined surface, causing the cutting line to be offset, thereby affecting the cut thickness. In order to avoid this situation, the present embodiment opens an upper chamber 11 at the cutting seam 3 of the upper jacket 1, and arranges a repair slider 12 in the upper chamber 11. Before cutting, the slider 12 is driven by a driver to move from one side of the cutting seam 3 to the other side. When passing through the depression, the repair material in the slider 12 will flow out through the corresponding outlet to fill the depression; wherein, the repair material in the slider 12 is graphite slurry, and the filled graphite slurry can be adhered to the surface of the crystal column by drying and curing.
[0050] After the graphite slurry is dried and solidified, its surface will have granular bumps due to the evaporation of water. In order to make the surface smoother, in this embodiment, a layer of resin glue is applied to the surface of the graphite slurry after heat curing; specifically, a lower chamber 21 corresponding to the upper chamber 11 is opened in the lower jacket 2, and the lower chamber 21 is pressurized by the movement of the slider 12 so that the resin glue in the lower chamber 21 is squeezed into the coating groove 121 of the slider 12. When the slider 12 is reset and moved, the coating groove 121 can be coated when passing through the cutting seam 3; wherein, the repair material in the slider 12 does not use resin glue because the resin glue adheres to the surface of the crystal column and is difficult to clean.
[0051] like Figure 3 As shown, in some embodiments, arc grooves 13 are respectively provided on the opposite surfaces of the upper jacket 1 and the lower jacket 2, and the two arc grooves 13 can be combined to limit the position of the crystal column.
[0052] In some embodiments, the middle portion of the lower surface of the upper chamber 11 is an arc surface, and the lower surface of the slider 12 is also arc-shaped to fit the lower surface of the upper chamber 11; wherein the cutting seam 3 is arranged along the radial direction of the crystal column, and the slider 12 moves along the axial direction of the crystal column.
[0053] like Figure 4 , Figure 5 As shown, in some embodiments, the upper chamber 11 is divided into a left chamber 111 and a right chamber 112 by a cutting seam 3, and a movable partition 211 is provided in the lower chamber 21 to separate the lower chamber 21 into an extrusion chamber 212 and a second storage chamber 213; wherein, a first through hole 113 communicating with the extrusion chamber 212, and a second through hole 114 communicating with the second storage chamber 213 are provided on the bottom surface of the left chamber 111.
[0054] In this embodiment, the cutting line is cut along the cutting seam 3 , so the upper chambers 11 need to be distributed on both sides of the cutting seam 3 to facilitate the movement of the slider 12 .
[0055] like Figure 6 , Figure 7As shown, in some embodiments, the slider 12 is arranged in the right chamber 112 and moves from the right chamber 112 to the left chamber 111 along the direction F; wherein, a first storage chamber 122 is opened inside the slider 12, and a discharge port 123 is opened on the bottom surface of the first storage chamber 122, and the opening direction of the discharge port 123 is the same as the cutting seam 3; when the discharge port 123 coincides with the cutting seam 3, if there is a depression on the surface of the crystal column, the graphite slurry in the first storage chamber 122 will flow out from the discharge port 123 to fill the depression.
[0056] like Figure 7 , Figure 8 As shown, in some embodiments, when the front end of the slider 12 enters the left chamber 111, its movement will squeeze the air in the left chamber 111, so that the air in the left chamber 111 enters the extrusion chamber 212 of the lower chamber 21 through the first through hole 113, thereby increasing the pressure in the extrusion chamber 212, and then pushing the partition 211 to squeeze the resin glue in the second storage chamber 213. Since the first through hole 113 is located on the left side of the second through hole 114, the second through hole 114 is blocked at this time. When the slider 12 moves to the threshold, the position of the coating groove 121 is just connected to the second through hole 114, and the coating groove 121 is filled with resin glue.
[0057] In this embodiment, the first material storage chamber 122 and the second material storage chamber 213 are respectively arranged in the upper chamber 11 and the lower chamber 21, so that the slider 12 can first fill the internal graphite slurry into the depression on the surface of the crystal column during movement, and then receive the resin glue through the coating groove 121 to apply the resin glue during the resetting movement.
[0058] like Fig. 9 As shown, in some embodiments, the discharge port 123 and the coating groove 121 of the slider 12 are both located on the lower surface of the slider 12 .
[0059] In some embodiments, the sliders 12 are connected in series via a connecting rod, and the outermost slider 12 is connected to a driver, that is, the sliders 12 can be driven to move synchronously by a driver; wherein the driver can be but is not limited to a servo motor.
[0060] The specific working process is as follows: the crystal column is limited by a limiting mechanism with a cutting seam 3, wherein the upper jacket 1 is divided into several submodules by the cutting seam 3, and each submodule can be connected to the lower jacket 2 by bolts to achieve fixation; in order to repair the surface depression of the crystal column, an upper chamber 11 is opened at the cutting seam 3 of the upper jacket 1, so that the cutting seam 3 passes through the middle of the upper chamber 11, and then a repairing slider 12 is set in the right chamber 112 of the upper chamber 11. When repairing, the slider 12 is driven by a driver to move from the right chamber 112 to the left chamber 111. When the discharge port 123 of the slider 12 coincides with the cutting seam 3, it stops for a certain period of time, so that the graphite slurry in the slider 12 flows out to fill the depression; at the same time, When the end of the slider 12 enters the left chamber 111, the gas in the left chamber 111 will be squeezed, causing it to enter the extrusion chamber 212 of the lower jacket 2 through the first through hole 113, causing the pressure in the extrusion chamber 212 to increase, thereby pushing the partition 211 to squeeze the second storage chamber 213. When the slider 12 moves to the threshold, that is, when it moves to the head, the coating groove 121 on the lower surface of the slider 12 is connected to the second through hole 114. At this time, the pressurized resin glue in the second storage chamber 213 will be squeezed into the coating groove 121, and the graphite slurry at the cutting seam 3 will be thermoset by the thermosetting equipment; then the slider 12 resets and moves, and when the coating groove 121 passes through the cutting seam 3 again, the resin glue will be coated on the surface of the graphite slurry.
[0061] The disclosed embodiment also provides a working method of an Inp crystal ingot cutting device, which comprises: limiting the crystal column by the upper jacket 1 and the lower jacket 2 of the limiting mechanism; setting a cutting slit 3 at the required cutting position on the limiting mechanism; opening an upper chamber 11 at the cutting slit 3 of the upper jacket 1, and making the cutting slit 3 pass through the middle of the upper chamber 11 and expose the limited crystal column surface; moving the slider 12 in the upper chamber 11 from one side of the cutting slit 3 to the other side, when there is a depression on the exposed crystal column surface, the graphite slurry in the slider 12 flows out to fill the depression, and at the same time, the movement of the slider 12 squeezes the resin glue in the lower chamber 21 to make it enter the coating groove 121; and the resin glue in the coating groove 121 is coated on the filled graphite slurry surface during the reset movement of the slider 12.
[0062] In some embodiments, the cutting seam 3 is arranged along the radial direction of the crystal column; and the slider 12 moves along the axial direction of the crystal column.
[0063] To sum up, the position of the cutting seam 3 in the Inp crystal ingot cutting device and its working method can be set according to the cutting requirements. By opening the upper chamber 11 and the lower chamber 21 at the cutting seam 3, the slider 12 in the upper chamber 11 can fill the depression on the surface of the crystal column and coat the solidified material through reciprocating movement, thereby preventing the depression from affecting the cutting thickness.
[0064] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0065] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used in this document unless explicitly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.
[0066] Spatially relative terms, such as "inside", "outside", "below", "below", "down", "above", "on", etc., may be used herein to facilitate description of the relationship of one element or feature to another element or feature as illustrated in the figure. In addition to the orientation depicted in the figure, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements described as "below" or "below" other elements or features will be oriented to be "above" other elements or features. Therefore, the example term "below" can cover the orientation above and below. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.
[0067] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.
Claims
1. An Inp ingot cutting device, characterized in that: include: The limiting mechanism comprises: an upper jacket (1) and a lower jacket (2), wherein the upper jacket (1) and the lower jacket (2) fit together to limit the position of the crystal column; A plurality of cutting seams (3), each of the cutting seams (3) vertically penetrating the upper jacket (1) and the lower jacket (2); The upper jacket (1) has an upper chamber (11) formed inside at a corresponding cutting seam (3), and the cutting seam (3) passes through the middle of the upper chamber (11) and exposes the surface of the limited crystal column, and the lower jacket (2) has a plurality of lower chambers (21) formed inside corresponding to the upper chamber (11); wherein A repairing slider (12) is disposed in each of the upper chambers (11), and a coating groove (121) is provided on the lower surface of each of the sliders (12); When the slider (12) moves from one side of the cutting seam (3) to the other side, when a depression exists on the surface of the exposed crystal column, the graphite slurry in the slider (12) flows out to fill the depression, and at the same time, the movement of the slider (12) squeezes the resin glue in the lower chamber (21) to make it enter the coating groove (121); and During the reset movement of the slider (12), the resin glue in the coating groove (121) coats the surface of the filled graphite slurry; The upper jacket (1) and the lower jacket (2) are respectively provided with arc-shaped grooves (13) on their opposing surfaces; The middle portion of the lower surface of the upper chamber (11) is an arc surface, adapted to fit the arc groove (13); wherein The cutting seam (3) is arranged along the radial direction of the crystal column; The lower surface of the slider (12) is arc-shaped, fits the lower surface of the upper chamber (11), and moves along the axial direction of the crystal column; A first material storage cavity (122) is provided inside the sliding block (12); The bottom surface of the first material storage cavity (122) is provided with a material discharge port (123), and the opening direction of the material discharge port (123) is the same as that of the cutting seam (3); wherein When the slider (12) moves from one side of the cutting slit (3) to the other side, when the discharge port (123) overlaps with the cutting slit (3), the graphite slurry in the first storage chamber (122) flows out from the discharge port (123) to fill the depression; The upper chamber (11) is divided into a left chamber (111) and a right chamber (112) by a cutting seam (3); The slider (12) is arranged in the right chamber (112), and the bottom surface of the left chamber (111) is provided with a first through hole (113) and a second through hole (114) which are in communication with the corresponding lower chamber (21); When the slider (12) slides from the right chamber (112) to the left chamber (111), the gas in the left chamber (111) is squeezed into the lower chamber (21) through the first through hole (113); A movable partition (211) is provided in the lower chamber (21) to separate the lower chamber (21) into an extrusion chamber (212) and a second material storage chamber (213); wherein The first through hole (113) is in communication with the extrusion cavity (212); The slider (12) applies pressure to the extrusion cavity (212) through the first through hole (113) during the movement; The second through hole (114) is in communication with the second material storage cavity (213); When the slider (12) moves to the threshold value, the coating groove (121) is connected to the second through hole (114) to receive the resin glue.
2. The Inp ingot cutting device according to claim 1, characterized in that: The first through hole (113) is located on the left side of the second through hole (114).
3. The Inp ingot cutting device according to claim 1, characterized in that: The sliders (12) are connected in series via a connecting rod; The outermost slider (12) is connected to a driver.
4. A method for operating the Inp ingot cutting device according to claim 1, characterized in that: include: The crystal column is limited by an upper clamping sleeve (1) and a lower clamping sleeve (2) of the limiting mechanism; By setting a cutting seam (3) at a desired cutting position on the limiting mechanism; An upper chamber (11) is opened at a cutting seam (3) of the upper jacket (1), and the cutting seam (3) passes through the middle of the upper chamber (11) and exposes the surface of the limited crystal column; The slider (12) in the upper chamber (11) moves from one side of the cutting seam (3) to the other side. When a depression exists on the surface of the exposed crystal column, the graphite slurry in the slider (12) flows out to fill the depression. At the same time, the movement of the slider (12) squeezes the resin glue in the lower chamber (21) to make it enter the coating groove (121). During the reset movement of the slider (12), the resin glue in the coating groove (121) is coated on the surface of the filled graphite slurry.
5. The working method of the Inp ingot cutting device according to claim 4, characterized in that: The cutting seam (3) is arranged along the radial direction of the crystal column; The slider (12) moves along the axial direction of the crystal column.