A method for polishing magnesium alloy thin plate surface

By constructing the data sequence during the electrolytic polishing process of magnesium alloy thin plates, the degree of electrolytic offset is calculated, and the problem of low electrolytic polishing effect caused by electrolytic parameter offset is solved, and the polishing effect of magnesium alloy thin plates is improved.

CN118792725BActive Publication Date: 2025-04-29LIN YI SHU GUANG ZHU ZAO YOU XIAN GONG SI
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Patent Information

Application Number
CN202411280599.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-09-13
Publication Date
2025-04-29
Estimated Expiration
2044-09-13

AI Technical Summary

Technical Problem

During the electrolytic polishing process of magnesium alloy thin plates, the deviation of parameters such as electrolytic temperature, polishing voltage and polishing current will lead to a low electrolytic polishing effect, affecting production quality.

Method used

By obtaining the temperature, voltage and current data of magnesium alloy thin plates during electrolytic polishing, a thin plate polishing characteristic sequence and polishing state sequence were constructed, and a trend detection algorithm and sampling method were used to calculate the trend difference value and distortion trend value of the thin plate polishing, determine the degree of electrolytic offset, and detect the offset of the electrolytic polishing conditions.

Benefits of technology

The accuracy of analyzing whether the electrolytic conditions of magnesium alloy thin plates are offset during electrolytic polishing, the polishing treatment effect is enhanced, and the efficient electrolytic polishing of magnesium alloy thin plates is ensured.

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Abstract

The present application relates to the technical field of electrolytic polishing, and specifically to a method for surface polishing of magnesium alloy thin plates, the method comprising: obtaining temperature, voltage and current data of magnesium alloy thin plates at each acquisition moment during the electrolytic polishing process, and constructing each thin plate polishing feature sequence; obtaining each thin plate polishing feature sampling sequence of each thin plate polishing feature sequence; obtaining trend check values ​​and trend check statistics of each thin plate polishing feature sequence and each thin plate polishing feature sampling sequence; determining the thin plate polishing trend difference value between any two thin plate polishing feature sampling sequences of each thin plate polishing feature sequence; determining the thin plate polishing distortion trend value of each thin plate polishing feature sequence; obtaining each thin plate polishing state sequence, determining the electrolytic deviation degree of magnesium alloy thin plates, and detecting the deviation of electrolytic polishing conditions on the surface polishing production line of magnesium alloy thin plates. The present application aims to improve the accuracy of the analysis of the deviation of electrolytic polishing conditions.
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Citation Information

Patent Citations

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