Liquid-cooled cold plate apparatus and server system

Abstract

The application relates to the field of servers, and provides a liquid cooling cold plate device and a server system, the liquid cooling cold plate device comprising a heat conduction material base, a cover plate and a liquid cooling cold plate; the liquid cooling cold plate is arranged between the heat conduction material base and the cover plate; a fixing assembly is arranged on the inner side wall of the heat conduction material base and used for fixing the liquid cooling cold plate between the base and the cover plate; a connecting part is arranged on the heat conduction material base and used for connecting the cover plate and the server, so that the heat conduction material base is attached to the heat generating element of the server. Through the technical scheme provided by the application, different manufacturers' liquid cooling cold plates and servers are coupled.

Description

Technical Field

[0001] This invention relates to the field of server technology, and in particular to a liquid-cooled cold plate device and a server system. Background Technology

[0002] With the continuous development of high-performance computing technology, server power is constantly increasing, leading to a surge in heat generation. Consequently, research into heat dissipation technologies is deepening. Previously common air-cooling technologies in data centers are increasingly inadequate for heat dissipation requirements, while liquid cooling technology is gaining popularity. Liquid cooling can effectively reduce the Power Usage Effectiveness (PUE) of server rooms and meet the massive heat dissipation demands of servers. Currently, the mainstream liquid cooling technologies include cold plate liquid cooling and immersion liquid cooling. Liquid cooling refers to using a liquid with a high specific heat capacity as a transfer medium to remove heat generated by IT (Information Technology) equipment or servers, thus cooling them.

[0003] Current cold-plate liquid cooling technology cools the main heat-generating components in a server by covering them with a liquid cooling plate. Low-temperature coolant circulates through the cold plate, carrying away heat from the heat-generating components. However, to secure the cold plate to the heat-generating components, several positioning holes are required on each plate and component. Because the positions of these positioning holes vary between manufacturers, it's difficult to couple servers with cold plates from multiple manufacturers. Summary of the Invention

[0004] This invention provides a liquid-cooled cold plate device and a server system to solve the problem that liquid-cooled cold plates manufactured by different manufacturers cannot be coupled with servers in the prior art, and to realize the coupling of liquid-cooled cold plates manufactured by different manufacturers with servers.

[0005] This invention provides a liquid-cooled cold plate device, including a heat-conducting material base, a cover plate, and a liquid-cooled cold plate;

[0006] The liquid cooling plate is disposed between the heat-conducting material base and the cover plate. A fixing component is provided on the inner side wall of the heat-conducting material base for fixing the liquid cooling plate between the base and the cover plate.

[0007] The heat-conducting material base is provided with a connection part for connecting with the cover plate and the server, so that the heat-conducting material base is in contact with the heating element of the server.

[0008] According to a liquid-cooled cold plate device provided by the present invention, the liquid-cooled cold plate includes: a coolant inlet pipe, a coolant outlet pipe, and a channel for coolant to flow through, wherein the coolant inlet pipe and the coolant outlet pipe are respectively connected to the channel.

[0009] According to a liquid-cooled cold plate device provided by the present invention, the side of the liquid-cooled cold plate near the coolant inlet pipe is in contact with the heat-conducting material base.

[0010] According to a liquid-cooled cold plate device provided by the present invention, the fixing component includes four elastic components, which are respectively disposed on the four inner sidewalls of the heat-conducting material base.

[0011] According to a liquid-cooled cold plate device provided by the present invention, the heat-conducting material base is detachably connected to the cover plate, and the heat-conducting material base is detachably connected to the server.

[0012] According to a liquid-cooled cold plate device provided by the present invention, the connecting part includes a connecting component and at least one first mounting hole provided on the heat-conducting material base, and the cover plate is provided with a second mounting hole opposite to the first mounting hole;

[0013] The connecting component is connected to the server through the first mounting hole and the second mounting hole, so that the heat-conducting material base is detachably connected to the cover plate and the heat-conducting material base is detachably connected to the server.

[0014] According to a liquid-cooled cold plate device provided by the present invention, the liquid-cooled cold plate device further includes a circulation component, which is connected to the coolant inlet pipe and the coolant outlet pipe respectively.

[0015] According to a liquid-cooled cold plate device provided by the present invention, the circulation assembly includes a heat exchange unit, which is connected to the coolant inlet pipe and the coolant outlet pipe respectively.

[0016] According to a liquid-cooled cold plate device provided by the present invention, the circulation assembly further includes a water distribution manifold, which is connected to the heat exchange unit, the coolant inlet pipe and the coolant outlet pipe respectively.

[0017] The present invention also provides a server system, the server system comprising at least one server and a liquid-cooled cold plate device as described in any of the preceding claims;

[0018] The server is equipped with at least one heating element;

[0019] The liquid-cooled cold plate device is installed inside the server;

[0020] The heating element corresponds one-to-one with the liquid cooling plate device. The heat conduction material base of the liquid cooling plate device is connected to the server through a connection part, and the heat conduction material base is in contact with the heating element.

[0021] This invention provides a liquid-cooled cold plate device and server system. A connection point is provided on a heat-conducting material base, connecting the base to the server. The base is in contact with the heat-generating element. When the server starts, the liquid-cooled cold plate operates. The heat generated by the heat-generating element is first transferred to the heat-conducting material base, then to the liquid-cooled cold plate. The coolant flowing in the cold plate carries away the heat transferred to it, thus dissipating heat from the heat-generating element. The heat-conducting material base is connected to the server via the connection point. The server only needs to have connections corresponding to these points. Liquid-cooled cold plates from different manufacturers can be fixed in the heat-conducting material base with the help of a cover plate and fixing components. The heat-conducting material base has good thermal conductivity, allowing the heat generated by the heat-generating element to be effectively conducted to the liquid-cooled cold plate. The coolant then dissipates the heat from the heat-generating element. Using the heat-conducting material base and cover plate provided in this embodiment allows for the coupling of liquid-cooled cold plates from different manufacturers to the server, solving the problem of strong bonding between the server and the liquid-cooled cold plate. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is one of the structural schematic diagrams of the liquid-cooled cold plate device provided by the present invention;

[0024] Figure 2 This is the second structural schematic diagram of the liquid-cooled cold plate device provided by the present invention;

[0025] Figure 3 This is a top view of the heat-conducting material base provided by the present invention;

[0026] Figure 4 This is a top view of the cover plate provided by the present invention;

[0027] Figure 5 This is the third schematic diagram of the liquid-cooled cold plate device provided by the present invention;

[0028] Figure 6 This is the fourth structural schematic diagram of the liquid-cooled cold plate device provided by the present invention;

[0029] Figure 7 This is a schematic diagram of the server system provided by the present invention.

[0030] Figure label:

[0031] 100: Liquid-cooled cold plate device; 110: Heat-conducting material base; 120: Cover plate; 130: Liquid-cooled cold plate; 140: Fixing component; 150: Circulation component; 111: First mounting hole; 112: Connecting component; 121: Second mounting hole; 131: Coolant inlet pipe; 132: Coolant outlet pipe; 151: Heat exchange unit; 152: Water distributor; 210: Heating element. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0033] The following is combined with Figures 1-6 The liquid-cooled cold plate device 100 of the present invention is described.

[0034] Please see Figure 1 , Figure 1 This is a schematic diagram of a liquid-cooled cold plate device 100 provided for an exemplary embodiment of the present invention. The liquid-cooled cold plate device 100 includes a heat-conducting material base 110, a cover plate 120 and a liquid-cooled cold plate 130.

[0035] The liquid cooling plate 130 is disposed between the heat conduction material base 110 and the cover plate 120. A fixing component 140 is provided on the inner side wall of the heat conduction material base 110 for fixing the liquid cooling plate 130 between the base and the cover plate 120.

[0036] The heat-conducting material base 110 is provided with a connection part for connecting with the cover plate 120 and the server, so that the heat-conducting material base 110 is in contact with the heating element 210 of the server.

[0037] In this embodiment of the invention, the heat-conducting material base 110 is made of a material with good thermal conductivity, which facilitates the conduction of heat generated by the heating element 210 to the liquid-cooled plate 130. The liquid-cooled plate 130 is placed between the heat-conducting material base 110 and the cover plate 120. When the heat-conducting material base 110 and the cover plate 120 are connected, the liquid-cooled plate 130 is fixed between the heat-conducting material base 110 and the cover plate 120. At the same time, a fixing component 140 is provided on the inner side wall of the heat-conducting material base 110. The fixing component 140 fixes the liquid-cooled plate 130 between the heat-conducting material base 110 and the cover plate 120, so that the liquid-cooled plate 130 will not move between the heat-conducting material base 110 and the cover plate 120.

[0038] A connection point is provided on the heat-conducting material base 110, through which the heat-conducting material base 110 is connected to the server. Specifically, the heat-conducting material base 110 can be rectangular. When the heat-conducting material base 110 is connected to the server, it covers the heating element 210 and is tightly connected to the heating element 210. When the server starts up, the liquid cooling plate 130 immediately starts working. The heat generated by the heating element 210 is first transferred to the heat-conducting material base 110, and then to the liquid cooling plate 130. The coolant flowing in the liquid cooling plate 130 carries away the heat transferred to the liquid cooling plate 130, thereby achieving heat dissipation for the heating element 210. At the same time, by covering the heating element 210 with the heat-conducting material base 110, the heat exchange area between the liquid cooling plate 130 and the heating element 210 can be increased, so as to better transfer heat.

[0039] In this embodiment of the invention, the heat-conducting material base 110 is connected to the server via a connecting portion. The server only needs to have a connection corresponding to the connecting portion. Liquid cooling plates 130 from different manufacturers can be fixed within the heat-conducting material base 110 by the cover plate 120 and the fixing component 140. The heat-conducting material base 110 has good thermal conductivity, allowing the heat generated by the heating element 210 to be effectively conducted to the liquid cooling plate. Under the action of the coolant, heat dissipation of the heating element 210 is achieved. Using the heat-conducting material base 110 and cover plate 120 provided in this embodiment of the invention, liquid cooling plates 130 from different manufacturers can be coupled to the server, solving the problem of strong bonding between the server and the liquid cooling plate 130.

[0040] In an exemplary embodiment of the present invention, please refer to Figure 2 The liquid-cooled plate 130 includes: a coolant inlet pipe 131, a coolant outlet pipe 132, and a channel for coolant to flow through. The coolant inlet pipe 131 and the coolant outlet pipe 132 are respectively connected to the channel.

[0041] In this embodiment of the invention, the liquid-cooled plate 130 has a channel inside, which can hold a certain amount of coolant. The liquid-cooled plate 130 is connected to a coolant inlet pipe 131 and a coolant outlet pipe 132. The coolant can enter the channel through the coolant inlet pipe 131. The coolant flowing in the channel exchanges heat with the heating element 210, carrying away the heat generated by the heating element 210, and then flows out through the coolant outlet pipe 132.

[0042] In this embodiment of the invention, the liquid-cooled cold plate 130 can be composed of a cold plate base and a cold plate cover. The cold plate base and the cold plate cover are sealed together to form a closed liquid-cooled cold plate. The cavity formed after the cold plate base and the cold plate cover are fastened together serves as a channel for the flow of coolant. The cold plate base is then attached to the heat-conducting material base 110. Alternatively, the liquid-cooled cold plate can be an open cold plate shell, which is not closed itself. The open part of the cold plate shell is sealed and connected to the heat-conducting material base 110, becoming a closed cavity that serves as a channel for the flow of coolant.

[0043] In an exemplary embodiment of the present invention, please refer to Figure 2 The side of the liquid-cooled plate 130 near the coolant inlet pipe 131 is in contact with the heat-conducting material base 110.

[0044] In this embodiment of the invention, the side of the liquid cooling plate 130 near the coolant inlet pipe 131 is in contact with the heat conduction material base 110. As a result, the coolant that has not yet undergone heat exchange will first exchange heat with the heat conducted by the heat conduction material base 110, thereby improving the heat dissipation effect on the heat-generating element 210.

[0045] In this embodiment of the invention, Figure 2 The coolant inlet pipe 131 and coolant outlet pipe 132 shown have a certain height difference, but this is not intended to limit the arrangement of the coolant inlet pipe 131 and coolant outlet pipe 132 in the embodiments of the present invention, that is, by Figure 2 Looking at the liquid-cooled cold plate device 100 from the perspective shown, the coolant inlet pipe 131 and the coolant outlet pipe 132 may or may not be located on the same horizontal plane.

[0046] In an exemplary embodiment of the present invention, please refer to Figure 3 , Figure 3 This is a top view of the heat conduction material base 110 of a liquid cooling plate device 100 provided in an embodiment of the present invention; the fixing component 140 includes four elastic components, which are respectively disposed on the four inner sidewalls of the heat conduction material base 110.

[0047] In this embodiment of the invention, the heat-conducting material base 110 includes four sidewalls, and an elastic component is disposed on each inner sidewall. After the liquid-cooled plate 130 is placed on the heat-conducting material base 110, the elastic components on the inner sidewalls press the liquid-cooled plate 130 down from all sides, thereby fixing the liquid-cooled plate 130 to the heat-conducting material base 110. Specifically, the elastic component may include springs, elastic rubber, or other elastic components.

[0048] In an exemplary embodiment of the present invention, the heat-conducting material base 110 is detachably connected to the cover plate 120, and the heat-conducting material base 110 is detachably connected to the server.

[0049] In this embodiment of the invention, the heat conduction material base 110 and the cover plate 120 are detachably connected. At the same time, the heat conduction material base 110 is detachably connected to the server, so that the heat conduction material base 110 and the cover plate 120, as well as the heat conduction material base 110 and the server, can be quickly assembled and disassembled. In addition, if the heat conduction material base 110, the cover plate, or the liquid cooling plate 130 is damaged, it can be quickly and conveniently replaced.

[0050] In an exemplary embodiment of the present invention, please refer to Figure 3 and Figure 4 The connection part includes a connecting component 112 and at least one first mounting hole 111 provided on the heat-conducting material base 110, and the cover plate is provided with a second mounting hole 121 opposite to the first mounting hole 111;

[0051] The connecting component 112 passes through the first mounting hole 111 and the second mounting hole 121 to connect to the server, so that the heat-conducting material base 110 is detachably connected to the cover plate 120 and the heat-conducting material base 110 is detachably connected to the server.

[0052] In this embodiment of the invention, the heat-conducting material base 110 and the cover plate 120 are respectively provided with a first mounting hole 111 and a second mounting hole 121. The connecting component 112 passes through the first mounting hole 111 and the second mounting hole 121 to achieve a detachable connection between the heat-conducting material base 110 and the cover plate 120. Simultaneously, a third mounting hole corresponding to the connecting component 112 can be provided on the server. The connecting component 112, while passing through the first mounting hole 111 and the second mounting hole 121, is inserted into the third mounting hole to achieve a detachable connection between the heat-conducting material base 110 and the server.

[0053] Specifically, the connecting component 112 includes positioning pins, bolts, screws, rope loops, etc. The connecting component 112 presses the cover plate 120 tightly against the liquid cooling plate 130, thereby fixing the liquid cooling plate 130 between the cover plate 120 and the heat conduction material base 110.

[0054] In another embodiment of the present invention, the connection part further includes a snap-fit ​​assembly, which detachably connects the heat-conducting material base 110 to the server.

[0055] In an exemplary embodiment of the present invention, please refer to Figure 5 The liquid-cooled cold plate device 100 further includes a circulation component 150, which is connected to the coolant inlet pipe 131 and the coolant outlet pipe 132 respectively.

[0056] In this embodiment of the invention, the liquid-cooled cold plate device 100 further includes a circulation component 150, which is connected to the coolant inlet pipe 131 and the coolant outlet pipe 132 respectively. Through the circulation component 150, the coolant that has exchanged heat with the heating element 210 in the liquid-cooled cold plate 130 can be extracted, and then a coolant with a lower temperature can be introduced into the liquid-cooled cold plate 130, so that a coolant with a lower temperature is continuously introduced into the liquid-cooled cold plate 130 for heat dissipation.

[0057] In an exemplary embodiment of the present invention, please refer to Figure 6 The circulation component 150 includes a heat exchange unit 151, which is connected to the coolant inlet pipe 131 and the coolant outlet pipe 132 respectively.

[0058] In this embodiment of the invention, the circulation component 150 includes a heat exchange unit 151 (Cooling Distribute Unit, CDU), which is connected to a coolant inlet pipe 131 and a coolant outlet pipe 132. In the cold plate liquid cooling system, the heat-generating element 210 in the server is cooled by the liquid cooling plate 130. The low-temperature coolant flows out from the heat exchange unit 151 and enters the liquid cooling plate 130 through the coolant inlet pipe 131. After the heat-generating element 210 is cooled by the liquid cooling plate 130, the heated coolant flows back to the heat exchange unit 151 through the coolant outlet pipe 132. The heat exchange unit 151 exchanges heat with the heated coolant, turning it into a low-temperature coolant, which then flows back to the liquid cooling plate 130, forming a circulation.

[0059] In an exemplary embodiment of the present invention, please refer to Figure 6 The circulation component 150 also includes a water distribution manifold 152, which is connected to the heat exchange unit 151, the coolant inlet pipe 131 and the coolant outlet pipe 132 respectively.

[0060] In this embodiment of the invention, a manifold 152 is connected between the heat exchange unit 151 and the liquid-cooled plate 130. The manifold 152 includes a main supply pipe, a main return pipe, a branch supply pipe, and a branch return pipe. The manifold is connected to the heat exchange unit 151 through the main supply pipe and the main return pipe; the manifold 152 is connected to the coolant inlet pipe 131 of the liquid-cooled plate 130 through the branch supply pipe, and then connected to the coolant outlet pipe 132 of the liquid-cooled plate 130 through the branch return pipe. The manifold 152 can be connected to multiple liquid-cooled plates 130 simultaneously.

[0061] After heat exchange in heat exchange unit 151, the low-temperature coolant enters the main supply pipe of manifold 152. Manifold 152 then feeds the low-temperature coolant into liquid-cooled plate 130 through supply branch pipes. The coolant exchanges heat with heating element 210, becoming high-temperature coolant. It then enters the return pipe of manifold 152 through return branch pipes, and then enters heat exchange unit 151 for heat exchange, becoming low-temperature coolant.

[0062] Please see Figure 7 , Figure 7 This is a schematic diagram of a server system provided for an exemplary embodiment of the present invention. The server system includes at least one server and a liquid-cooled cold plate device 100 as described in any of the preceding claims.

[0063] The server is equipped with at least one heating element 210;

[0064] The liquid-cooled cold plate device 100 is disposed inside the server;

[0065] The heating element 210 corresponds one-to-one with the liquid cooling plate device 100. The heat conduction material base 110 of the liquid cooling plate device 100 is connected to the server through a connection part, and the heat conduction material base 110 is in contact with the heating element 210.

[0066] In this embodiment of the invention, the server system includes at least one server, and each server is provided with at least one heat-generating element 210. The heat-generating element 210 includes a central processing unit (CPU), memory, hard disk, etc.

[0067] like Figure 7As shown, multiple servers are configured, each server has multiple heat-generating elements 210, and each heat-generating element 210 can be equipped with a corresponding liquid-cooled cold plate device 100. The liquid-cooled cold plate 130 in each liquid-cooled cold plate device 100 is connected to a circulation component 150. In this embodiment, at least one circulation component 150 can be provided to dissipate heat from all servers in the server system. In this embodiment, some heat-generating elements 210 in the servers can be selected to be equipped with corresponding liquid-cooled cold plate devices 100, while the remaining unselected heat-generating elements 210 in the servers can be equipped with other heat dissipation methods, such as air cooling.

[0068] Each heating element 210 may be equipped with a liquid-cooled cold plate device 100. A connection point is provided on the heat-conducting material base 110 of the liquid-cooled cold plate device 100, connecting the heat-conducting material base 110 to the server. When the heat-conducting material base 110 is connected to the server, it covers and tightly adheres to the heating element 210. When the server starts, the liquid-cooled cold plate 130 immediately operates. The heat generated by the heating element 210 is first transferred to the heat-conducting material base 110, and then to the liquid-cooled cold plate 130. The coolant flowing in the liquid-cooled cold plate 130 carries away the heat transferred to it, thus dissipating heat from the heating element 210. Simultaneously, by covering the heating element 210 with the heat-conducting material base 110, the heat exchange area between the liquid-cooled cold plate 130 and the heating element 210 is increased, facilitating better heat dissipation.

[0069] The heat-conducting material base 110 is connected to the server via a connecting part. Only the server needs to be configured with connections corresponding to these connecting parts. Liquid cooling plates 130 from different manufacturers can be fixed within the heat-conducting material base 110 by the cover plate 120 and the fixing component 140. The heat-conducting material base 110 has good thermal conductivity, allowing the heat generated by the heating element 210 to be effectively conducted to the liquid cooling plate. Under the action of the coolant, heat dissipation is achieved for the heating element 210. Using the heat-conducting material base 110 and cover plate 120 provided in this embodiment of the invention, liquid cooling plates 130 from different manufacturers can be coupled to the server, solving the problem of strong bonding between the server and the liquid cooling plate 130.

[0070] In other embodiments of the present invention, the heating element 210 can be divided into a primary heating element and a secondary heating element. The primary heating element is the heating element 210 within the server cabinet whose heat generation exceeds a preset threshold, and the secondary heating element is the heating element 210 within the server cabinet whose heat generation is below the preset threshold. Optionally, the central processing unit (CPU) can be designated as the primary heating element, and memory, hard disk, etc., can be designated as secondary heating elements. The liquid cooling plate device 100 can be positioned above the primary heating element, while the liquid cooling plate device 100 is not positioned above the secondary heating elements.

[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A liquid-cooled cold plate device, characterized in that, Includes a heat-conducting material base, cover plate, and liquid-cooled plate; The liquid cooling plate is disposed between the heat-conducting material base and the cover plate. A fixing component is provided on the inner side wall of the heat-conducting material base for fixing the liquid cooling plate between the base and the cover plate. The heat-conducting material base is provided with a connection part for connecting with the cover plate and the server, so that the heat-conducting material base is in contact with the heating element of the server; The fixing component includes four elastic components, which are respectively disposed on the four inner sidewalls of the heat-conducting material base; The connection portion includes a connecting component and at least one first mounting hole provided on the heat-conducting material base, and the cover plate is provided with a second mounting hole provided opposite to the first mounting hole; The connecting component passes through the first mounting hole and the second mounting hole, and at the same time, the connecting component is inserted into the third mounting hole corresponding to the connecting component provided on the server, so that the heat conduction material base is detachably connected to the cover plate, and the heat conduction material base is detachably connected to the server; The liquid-cooled cold plate device also includes a circulation component, which includes a heat exchange unit and a water distribution manifold.

2. The liquid-cooled cold plate device according to claim 1, characterized in that, The liquid-cooled plate includes a coolant inlet pipe, a coolant outlet pipe, and a channel for coolant flow, wherein the coolant inlet pipe and the coolant outlet pipe are respectively connected to the channel.

3. The liquid-cooled cold plate device according to claim 2, characterized in that, The side of the liquid-cooled plate closest to the coolant inlet pipe is in contact with the heat-conducting material base.

4. The liquid-cooled cold plate device according to claim 2, characterized in that, The circulation component is connected to the coolant inlet pipe and the coolant outlet pipe, respectively.

5. The liquid-cooled cold plate device according to claim 4, characterized in that, The heat exchange unit is connected to the coolant inlet pipe and the coolant outlet pipe, respectively.

6. The liquid-cooled cold plate device according to claim 5, characterized in that, The water distribution manifold is connected to the heat exchange unit, the coolant inlet pipe, and the coolant outlet pipe, respectively.

7. A server system, characterized in that, The server system includes at least one server and a liquid-cooled cold plate device as described in any one of claims 1 to 6; The server is equipped with at least one heating element; The liquid-cooled cold plate device is installed inside the server; The heating element corresponds one-to-one with the liquid cooling plate device. The heat conduction material base of the liquid cooling plate device is connected to the server through a connection part, and the heat conduction material base is in contact with the heating element.

Images