Multi-wafer automated continuous cleaning equipment and cleaning method thereof

Abstract

The present invention discloses a multi-wafer automated continuous cleaning device and a cleaning method thereof, which relates to the field of wafer cleaning technology. The device comprises a base, a working platform is provided on the base, a motor is provided in the base, a rotating shaft is connected to the output end of the motor, a cleaning disc is provided on the rotating shaft, a vertical frame is provided on the top of the vertical frame, a driving platform is provided on the bottom end of the driving platform, a lifting platform is provided on the sliding side of the driving platform, a supporting frame is provided on the working platform, a fixed ring is provided on the supporting frame above the cleaning disc, the fixed ring is connected to the cleaning disc through a sealing ring embedded in the cleaning disc, a notch is provided on one side of the fixed ring, a lifting door is provided on the sliding side of the notch, a plurality of lower brush bars in a circular array are provided on the cleaning disc, a mounting frame is provided on the driving platform, and an upper brush bar is provided on the mounting frame. The present invention has a simple structure, can clean multiple wafers at the same time, has low requirements for the placement of the wafers in the cleaning area, is convenient for removing the wafers after cleaning, has a high degree of automation, is applicable to wafers of different thicknesses and sizes, and is suitable for promotion.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer cleaning, and in particular relates to a multi-wafer automatic continuous cleaning device and a cleaning method thereof. Background Art

[0002] A wafer refers to a silicon wafer used to make silicon semiconductor circuits. Its starting material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer. Wafer cleaning is a key step in the semiconductor manufacturing process, aimed at removing contaminants generated by the wafer's contact with various organic matter, particles, and metals during processing, forming, and polishing. Cleaning methods include wet and dry methods, of which wet cleaning is the mainstream technical route, and uses cleaning fluid and brushes to clean the wafer surface.

[0003] Existing wafer cleaning mechanisms require manual placement of wafers at the cleaning location, resulting in low work efficiency and low adaptability of the cleaning tank to wafers of different shapes and sizes. Summary of the Invention

[0004] The purpose of the present invention is to provide a multi-wafer automated continuous cleaning equipment and a cleaning method thereof, which has a simple structure, can clean multiple wafers at the same time, has low requirements for placing the wafers at the cleaning area, is easy to take out the wafers after cleaning, has a high degree of automation, and is suitable for wafers of different thicknesses and sizes, and is suitable for promotion.

[0005] The present invention provides the following technical solution: an automated continuous cleaning device for multiple wafers, comprising a base, a work platform fixedly provided on the base, a sleeve fixedly provided in the middle of the work platform, a motor fixedly provided in the base, a rotating shaft connected to the output end of the motor, the rotating shaft passing through the sleeve and having a cleaning disc fixedly provided on the top, the sleeve supported on the bottom of the cleaning disc and slidably connected thereto;

[0006] A vertical frame is fixedly provided at the rear end of the working platform, a driving platform is fixedly provided at the top of the vertical frame, a lifting platform is slidably provided at the lower end of the driving platform, a lifting rail is provided on the side of the vertical frame facing the lifting platform, the lifting platform is slidably connected to the lifting rail through a bracket, an electric telescopic rod is provided in the lifting platform, the output end of the electric telescopic rod is located in the lifting rail and is fixedly connected to the bracket of the lifting platform;

[0007] The working platform is located on one side of the cleaning disk and is fixed with a support frame extending upward. The top of the support frame is fixed with a fixing ring located above the cleaning disk. The lower end of the fixing ring is fixed with a sealing ring. The sealing ring is buried at the edge of the cleaning disk and is slidably connected to it.

[0008] A notch is provided on one side of the fixing ring, and side rails are fixed on both sides of the notch. A lifting door is slidably provided on the side rails. The side rails extend upward from the fixing ring and are fixed with a mounting plate. An electric telescopic rod is fixed on the mounting plate. The output end of the electric telescopic rod is downward and fixedly connected to the upper end of the lifting door through a connecting frame.

[0009] The upper surface of the cleaning disc is provided with a plurality of lower brush strips in a circumferential array on the inner periphery of the fixed ring, and the lower brush strips extend to the fixed ring;

[0010] An infusion tube is connected to the driving platform, a nozzle is fixedly provided on the side of the lifting platform facing the cleaning disk, the infusion tube is communicated with the nozzle, an extension frame is fixedly provided on the lifting platform in the middle of the two rows of nozzles, a mounting frame is fixedly provided at the lower end of the extension frame, and an upper brush bar is fixedly provided below the mounting frame.

[0011] Preferably, an inclined slide is fixedly provided on the outside of the fixing ring at the notch, and the inclined slide is at the same height as the upper surface of the cleaning disc.

[0012] Preferably, the lifting door is in the shape of an arc with the same center as the fixing ring, and both sides of the lifting door are flush with the inner ring of the fixing ring.

[0013] Preferably, the extension frame is aligned with the center line of the cleaning disc. When the extension frame is lowered into the fixed ring along with the lifting platform, both sides of the extension frame are slidably connected to the inner wall of the fixed ring, and the upper brush strip extends to both ends of the extension frame.

[0014] Preferably, a display screen and a control console are provided at the front end of the base, and the control console is connected to the display screen and the electric telescopic rod, the driving platform, and the motor through circuit signals.

[0015] Preferably, the inclined slide slopes downward from the cleaning disk and extends to the container for collecting wafers. Upward blocking plates are provided on both sides of the inclined slide. A wafer delivery mechanism is provided on one side of the base, and its delivery end is located above the cleaning disk.

[0016] In order to solve the above technical problems, the present invention also provides a cleaning method for a multi-wafer automated continuous cleaning device, comprising the following steps:

[0017] Step 1: After multiple wafers are placed on the cleaning plate, the lifting platform is pressed down to push the mounting frame and the upper brush bar on it into the ring of the fixed ring. According to the specific thickness of each wafer, the brushing gap between the upper and lower brush bars is adjusted to be smaller than the thickness of the wafer;

[0018] Step 2: The motor drives the cleaning disc to rotate. During the rotation of the cleaning disc, the stacked wafers are driven to rotate. When the wafers pass through the upper brush bar and the mounting rack, the stacked wafers are wiped off and laid on a layer of the cleaning disc.

[0019] Step 3: The motor drives the cleaning disc to rotate faster, and the nozzle sprays cleaning liquid. The wafer is moved to the fixed ring under the action of centrifugal force. Under the action of the lower brush bar on the cleaning disc, the lower surface of the wafer is scrubbed by the lower brush bar. The lower brush bar rotates under the action of the lower brush bar, and the upper surface of the wafer is scrubbed by the upper brush bar.

[0020] Step 4: After the wafer is cleaned, the electric telescopic rod drives the lifting door to lift up, the gap opens, and when the wafer moves to the gap, it passes through the gap under the action of centrifugal force and slides from the inclined slide into the container for collecting wafers.

[0021] The beneficial effects of the present invention are as follows: the structure is simple, multiple wafers can be cleaned at the same time, the requirements for placing the wafers in the cleaning area are low, the wafers can be easily taken out after cleaning, the degree of automation is high, and it is applicable to wafers of different thicknesses and sizes. The specific effects are as follows:

[0022] (1) The present invention is provided with a cleaning disc and a fixed ring. The cleaning disc and the fixed ring constitute a cleaning tank for wafers. When multiple wafers are placed on the cleaning disc at one time, the cleaning disc rotates, and the wafers in the cleaning tank move accordingly. The mounting frame above the cleaning disc is in a fixed state. The brushing gap between the upper brush bar and the lower brush bar on it is smaller than the thickness of the wafer, so that it can sweep down the stacked wafers. When each wafer moves with the cleaning disc, both the upper and lower sides will be brushed by the brush bar, thereby cleaning multiple wafers at the same time. Moreover, by adjusting the size of the brushing gap, wafers of different sizes and shapes can be cleaned.

[0023] (2) The present invention is provided with a gap. After the wafer is cleaned, the electric telescopic rod drives the lifting door to lift up, and the gap is opened. When the wafer moves to the gap, it passes through the gap under the action of centrifugal force and slides from the inclined slide to the container for collecting wafers, which is convenient for collecting the cleaned wafers. Similarly, when the wafers are placed, the wafers can be placed on both sides of the cleaning plate on the upper brush bar. There are few restrictions on the placement position and quantity. The existing automatic placement mechanism is easy to implement, and can realize automatic placement, cleaning and collection of wafers. The degree of automation is high and the device cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0025] Figure 1 It is an overall schematic diagram of the present invention;

[0026] Figure 2 is a cross-sectional view of the present invention;

[0027] Figure 3 It is an enlarged view of point A of the present invention;

[0028] Figure 4 It is a cross-sectional view of the cleaning disk of the present invention;

[0029] Figure 5 is a flow chart of the method of the present invention;

[0030] The markings in the figure are: 1. Base; 2. Working platform; 3. Stand; 4. Driving platform; 5. Sleeve; 6. Cleaning tray; 7. Fixing ring; 8. Support frame; 9. Lower brush bar; 10. Infusion tube; 11. Lifting platform; 12. Lifting rail; 13. Mounting frame; 14. Display screen; 15. Control panel; 16. Inclined slide; 17. Electric telescopic rod; 18. Side rail; 19. Mounting plate; 20. Lifting door; 21. Connecting frame; 22. Motor; 23. Rotating shaft; 24. Sealed ring; 25. Nozzle; 26. Extension frame; 27. Upper brush bar; 28. Brushing gap; 29. ​​Gap. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting the present invention.

[0033] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "mounted / connected," and "connected" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention in specific circumstances.

[0034] The structural features of the present invention will now be described in detail with reference to the accompanying drawings.

[0035] See also Figure 1 、 24. A multi-wafer automated continuous cleaning equipment includes a base 1, a working platform 2 is fixed on the base 1, a sleeve 5 is fixed in the middle of the working platform 2, a motor 22 is fixed in the base 1, the output end of the motor 22 is connected to a rotating shaft 23, the rotating shaft 23 passes through the sleeve 5 and a cleaning disk 6 is fixed on the top, the sleeve 5 is supported on the bottom of the cleaning disk 6 and is slidably connected thereto, so that the motor 22 drives the cleaning disk 6 to remain stable when rotating, the working platform 2 is located on one side of the cleaning disk 6 and is fixed with an upwardly extending support frame 8, the top of the support frame 8 is fixed with a fixed ring 7 located above the cleaning disk 6, the fixed ring 7 does not rotate with the cleaning disk 6, so that the discharge mechanism connected to the fixed ring 7 remains fixed, and a sealed ring 24 is fixed at the lower end of the fixed ring 7, which is buried at the edge of the cleaning disk 6 and is slidably connected thereto, and the sealed ring 24 prevents leakage of the cleaning liquid.

[0036] See also Figure 1-3 A notch 29 is provided on one side of the fixed ring 7, and the cleaned wafers are discharged from the notch 29. Side rails 18 are fixed on both sides of the notch 29. A lifting door 20 is slidably provided on the side rails 18. The lifting door 20 is an arc with the same center as the fixed ring 7. Both sides of the lifting door 20 are flush with the inner ring of the fixed ring 7, so that the lifting door 20 remains flat. The side rail 18 extends upward from the fixed ring 7 and is fixed with a mounting plate 19. An electric telescopic rod 17 is fixed on the mounting plate 19. The output end of the electric telescopic rod 17 is downward and is connected to the lifting frame 21 through the connecting frame The upper end of the door 20 is fixedly connected, and the lifting door 20 is driven to rise and fall by an electric telescopic rod 17. An inclined slide 16 is fixedly provided at the notch 29 on the outside of the fixed ring 7. The inclined slide 16 is at the same height as the upper surface of the cleaning tray 6. After the wafer is thrown out from the notch 29, it enters the inclined slide 16. The inclined slide 16 tilts downward from the cleaning tray 6 and extends to the container for collecting wafers. Upward blocking plates are provided on both sides of the inclined slide 16 to prevent the wafer from being thrown out from the side of the inclined slide 16. A wafer delivery mechanism is provided on one side of the base 1, and its delivery end is located above the cleaning tray 6 to automatically deliver the wafer.

[0037] See also Figure 1 、 2, 4. A stand 3 is fixed to the rear end of the working platform 2, a driving platform 4 is fixed to the top of the stand 3, a lifting platform 11 is slidably provided at the lower end of the driving platform 4, a lifting rail 12 is provided on the side of the stand 3 facing the lifting platform 11, the lifting platform 11 is slidably connected to the lifting rail 12 through a bracket, an electric telescopic rod is provided in the lifting platform 11, the output end of the electric telescopic rod is located in the lifting rail 12 and is fixedly connected to the bracket of the lifting platform 11, the lifting platform 11 is pushed up and down by the electric telescopic rod inside the driving platform 4, and the connecting mechanism that drives the lifting platform 11 to rise and fall is located on the stand 3, so that the internal structure of the driving platform 4 is not affected, the upper surface of the cleaning disk 6 is located at the inner periphery of the fixed ring 7 and is provided with a plurality of lower brush strips 9 in a circumferential array, the lower brush strips 9 extend to the fixed ring 7, and the wafer is driven to move through the lower brush strips 9, and when the wafer moves, it will be in contact with the wafer due to the effect of its own gravity. The cleaning disc 6 undergoes relative displacement, and the cleaning disc 6 brushes the lower surface of the wafer. An infusion tube 10 is connected to the driving platform 4. A nozzle 25 is fixedly provided on the lifting platform 11 facing one side of the cleaning disc 6. The infusion tube 10 is connected to the nozzle 25, and the nozzle 25 sprays cleaning liquid. The lifting platform 11 is located in the middle of the two rows of nozzles 25 and is fixed with an extension frame 26. A mounting frame 13 is fixed at the lower end of the extension frame 26, and an upper brush bar 27 is fixed below the mounting frame 13. The upper brush bar 27 is used to brush the upper surface of the wafer when the wafer moves under it with the cleaning disc 6. The extension frame 26 is aligned with the center line of the cleaning disc 6. When the extension frame 26 is lowered into the fixed ring 7 with the lifting platform 11, its two sides are slidably connected to the inner wall of the fixed ring 7, and the upper brush bar 27 extends to both ends of the extension frame 26, so that the upper brush bar 27 can brush the wafer that is thrown to the fixed ring 7 and slides.

[0038] See also Figure 1 A display screen 14 and a control panel 15 are provided at the front end of the base 1. The control panel 15 is connected to the display screen 14 and the electric telescopic rod 17, the driving platform 4, and the motor 22 through circuit signals. Each driving mechanism is controlled by the control panel 15.

[0039] See also Figure 1-5 A cleaning method for a multi-wafer automated continuous cleaning device comprises the following steps:

[0040] Step 1: After multiple wafers are placed on the cleaning plate 6, the lifting platform 11 is pressed down, pushing the mounting frame 13 and the upper brush bar 27 thereon into the ring of the fixed ring 7. According to the specific thickness of each wafer, the brushing gap 28 between the upper brush bar 27 and the lower brush bar 9 is adjusted to be smaller than the thickness of the wafer. When the wafer passes through the brushing gap 28, its upper surface can be brushed by the upper brush bar 27;

[0041] Step 2: The motor 22 drives the cleaning plate 6 to rotate. During the rotation of the cleaning plate 6, the stacked wafers are driven to rotate. When the wafers pass through the upper brush bar 27 and the mounting rack 13, the stacked wafers are wiped off and laid on a layer of the cleaning plate 6.

[0042] Step 3: The motor 22 drives the cleaning disc 6 to rotate faster, and the nozzle 25 sprays cleaning liquid. The wafer moves to the fixed ring 7 under the action of centrifugal force. Under the action of the friction force of the lower brush bar 9 on the cleaning disc 6, the wafer moves with the cleaning disc 6. Under the action of its own gravity, there is a relative displacement between the wafer and the cleaning disc 6, so that the lower surface of the wafer is brushed by the lower brush bar 9. The lower brush bar 9 rotates under the action of the lower brush bar 9, and the lower brush bar 9 can provide greater friction. When the wafer moves relative to the upper brush bar 27, the upper surface of the wafer is brushed by the upper brush bar 27;

[0043] Step 4: After the wafer is cleaned, the electric telescopic rod 17 drives the lifting door 20 to lift up, and the gap 29 opens. When the wafer moves to the gap 29, it passes through the gap 29 under the action of centrifugal force and slides from the inclined slide 16 to the container for collecting wafers.

[0044] The multi-wafer automated continuous cleaning equipment and cleaning method of the present invention have a simple structure, can clean multiple wafers at the same time, have low requirements for placing the wafers at the cleaning area, are easy to take out the wafers after cleaning, have a high degree of automation, and are applicable to wafers of different thicknesses and sizes, making them suitable for promotion.

[0045] When using it specifically, refer to Figure 1-4 The cleaning disc 6 is rotated and the wafers in the cleaning tank move accordingly. The mounting frame 13 above the cleaning disc 6 is fixed, and the brushing gap 28 between the upper brush bar 27 and the lower brush bar 9 is smaller than the thickness of the wafer, so that the stacked wafers are swept down and the upper and lower sides of each wafer are brushed by the brush bar when the cleaning disc 6 moves. Thus, multiple wafers are cleaned at the same time, and the size of the brushing gap 28 can be adjusted to clean wafers of different sizes and shapes. After the wafers are cleaned, the electric telescopic rod 17 drives the lifting door 20 to lift and the gap 29 is opened. When the wafer moves to the gap 29, it passes through the gap 29 under the action of centrifugal force and slides from the inclined slide 16 to the container for collecting wafers. The cleaned wafers are collected and the feeding mechanism feeds the wafers again for the next round of cleaning.

[0046] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A multi-wafer automated continuous cleaning device, comprising a base (1), characterized in that: A working platform (2) is fixedly provided on the base (1), a sleeve (5) is fixedly provided in the middle of the working platform (2), a motor (22) is fixedly provided in the base (1), an output end of the motor (22) is connected to a rotating shaft (23), the rotating shaft (23) passes through the sleeve (5) and a cleaning disc (6) is fixedly provided on the top, the sleeve (5) is supported on the bottom of the cleaning disc (6) and is slidably connected thereto; A stand (3) is fixedly provided at the rear end of the working platform (2), a driving platform (4) is fixedly provided at the top of the stand (3), a lifting platform (11) is slidably provided at the lower end of the driving platform (4), a lifting rail (12) is provided on the side of the stand (3) facing the lifting platform (11), the lifting platform (11) is slidably connected to the lifting rail (12) through a bracket, an electric telescopic rod is provided in the lifting platform (11), and the output end of the electric telescopic rod is located in the lifting rail (12) and is fixedly connected to the bracket of the lifting platform (11); The working platform (2) is located on one side of the cleaning disk (6) and is fixed with a support frame (8) extending upward. The top of the support frame (8) is fixed with a fixing ring (7) located above the cleaning disk (6). The lower end of the fixing ring (7) is fixed with a sealing ring (24). The sealing ring (24) is embedded in the edge of the cleaning disk (6) and is slidably connected thereto. A notch (29) is provided on one side of the fixing ring (7), and side rails (18) are fixedly provided on both sides of the notch (29). A lifting door (20) is slidably provided on the side rails (18). The side rails (18) extend upward from the fixing ring (7) and are fixedly provided with a mounting plate (19). An electric telescopic rod (17) is fixedly provided on the mounting plate (19). The output end of the electric telescopic rod (17) is downwardly directed and fixedly connected to the upper end of the lifting door (20) via a connecting frame (21); The upper surface of the cleaning disc (6) is provided with a plurality of lower brush strips (9) arranged in a circumferential array on the inner periphery of the fixed ring (7), and the lower brush strips (9) extend to the fixed ring (7); The driving platform (4) is connected to a liquid infusion tube (10), a nozzle (25) is fixedly provided on the side of the lifting platform (11) facing the cleaning disk (6), the liquid infusion tube (10) is connected to the nozzle (25), and an extension frame (26) is fixedly provided on the lifting platform (11) in the middle of the two rows of nozzles (25), a mounting frame (13) is fixedly provided at the lower end of the extension frame (26), and an upper brush bar (27) is fixedly provided below the mounting frame (13).

2. The multi-wafer automated continuous cleaning equipment according to claim 1, characterized in that: An inclined slideway (16) is fixedly provided on the outside of the fixing ring (7) at the notch (29), and the inclined slideway (16) is at the same height as the upper surface of the cleaning disc (6).

3. The multi-wafer automated continuous cleaning equipment according to claim 1, characterized in that: The lifting door (20) is in the shape of an arc with the same center as the fixed ring (7), and both sides of the lifting door (20) are flush with the inner ring of the fixed ring (7).

4. The multi-wafer automated continuous cleaning equipment according to claim 1, characterized in that: The extension frame (26) is aligned with the center line of the cleaning plate (6). When the extension frame (26) is lowered into the fixed ring (7) along with the lifting platform (11), both sides of the extension frame are slidably connected to the inner wall of the fixed ring (7), and the upper brush strip (27) extends to both ends of the extension frame (26).

5. The multi-wafer automated continuous cleaning equipment according to claim 1, characterized in that: A display screen (14) and a control panel (15) are provided at the front end of the base (1), and the control panel (15) is connected to the display screen (14), the electric telescopic rod (17), the driving platform (4), and the motor (22) via circuit signals.

6. The multi-wafer automated continuous cleaning equipment according to claim 2, characterized in that: The inclined slide (16) is inclined downward from the cleaning tray (6) and extends to the container for collecting wafers. Upward blocking plates are provided on both sides of the inclined slide (16). A wafer delivery mechanism is provided on one side of the base (1), and its delivery end is located above the cleaning tray (6).

7. A cleaning method for a multi-wafer automated continuous cleaning device according to any one of claims 1 to 6, characterized in that: The following steps are involved: Step 1: After a plurality of wafers are placed on the cleaning plate (6), the lifting platform (11) is pressed downward to push the mounting frame (13) and the upper brush bar (27) thereon into the ring of the fixed ring (7), and according to the specific thickness of a single wafer, the brushing gap (28) between the upper brush bar (27) and the lower brush bar (9) is adjusted to be smaller than the thickness of the wafer; Step 2: The motor (22) drives the cleaning disc (6) to rotate. During the rotation of the cleaning disc (6), the stacked wafers are driven to rotate. When the wafers pass through the upper brush bar (27) and the mounting frame (13), the stacked wafers are wiped off and laid on a layer of the cleaning disc (6); Step 3: The motor (22) drives the cleaning disk (6) to rotate faster, and the nozzle (25) sprays the cleaning liquid. The wafer moves to the fixed ring (7) under the action of centrifugal force. Under the action of the friction force of the lower brush bar (9) on the cleaning disk (6), the lower surface of the wafer is brushed by the lower brush bar (9), and the upper surface of the wafer is brushed by the upper brush bar (27) as the lower brush bar (9) rotates under the action of the lower brush bar (9). Step 4: After the wafer is cleaned, the electric telescopic rod (17) drives the lifting door (20) to lift up, and the gap (29) opens. When the wafer moves to the gap (29), it passes through the gap (29) under the action of centrifugal force and slides from the inclined slide (16) into the container for collecting wafers.

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