Fully automatic bonding machine

Abstract

The present invention provides a fully automatic bonding machine, which includes a first feeding mechanism, a second feeding mechanism, an ACF attaching mechanism, a pre-pressing mechanism, a main pressing mechanism and a transport system arranged on a base. The first feeding mechanism is used to feed panel products, and the second feeding mechanism is used to feed chip products. A docking groove for connecting to the punching feeding mechanism of COF products is provided on one side of the base. The pre-pressing robot of the pre-pressing mechanism includes a suction block, which is provided with a first suction hole and a second suction hole. The first suction hole is a circular hole for sucking COF products, and the second suction hole is a long hole for sucking chips. The fully automatic bonding machine of the present invention realizes the loading of chip products or COF products by providing the first feeding structure and the docking groove. At the same time, the pre-pressing robot is provided with the first suction hole and the second suction hole that are compatible with grabbing chip products or COF products. The equipment has high compatibility, low cost and high efficiency.

Description

Technical Field

[0001] The present invention relates to the field of screen processing equipment, and in particular to a full-automatic bonding machine. Background Art

[0002] Display screens are a common information dissemination tool in modern society. With advancements in technology and the development of manufacturing automation, more and more displays are being produced using automated equipment. During the display screen production process, a press-bonding process is used. Some processes involve press-bonding chips to panels, while others involve press-bonding COF (Chip On Flex, or Chip On Film, a die-on-film technology that secures integrated circuits (ICs) to flexible circuit boards) to panels. Existing press-bonding equipment can only perform one fixed press-bonding process, resulting in poor compatibility, low precision, and high rejection rates. This results in high equipment costs and poor efficiency.

[0003] Therefore, it is necessary to provide a fully automatic bonding machine to solve the above technical problems. Summary of the Invention

[0004] The present invention provides a full-automatic bonding machine to solve the problems of high cost and poor efficiency of the crimping bonding equipment in the prior art.

[0005] To solve the above technical problems, the technical solution of the present invention is: a fully automatic bonding machine, comprising: a first feeding mechanism, a second feeding mechanism, an ACF attaching mechanism, a pre-pressing mechanism, a main pressing mechanism, and a handling system, wherein the first feeding mechanism, the ACF attaching mechanism, the pre-pressing mechanism, and the main pressing mechanism are sequentially arranged on one side of the top of a base, the second feeding mechanism is arranged on the other side of the top of the base, and the second feeding mechanism is arranged close to the pre-pressing mechanism. The first feeding mechanism is used to load panel products, and the second feeding mechanism is used to load chip products. A docking groove for connecting to the punching feeding mechanism of COF products is provided on one side of the base close to the second feeding structure.

[0006] The transport system includes a first manipulator movable between the first feeding mechanism and the ACF attaching mechanism, a second manipulator movable between the ACF attaching mechanism and the pre-pressing mechanism, and a third manipulator movable between the pre-pressing mechanism and the main pressing mechanism;

[0007] The pre-pressing mechanism includes a pre-pressing manipulator, which includes a suction block for grabbing incoming materials. The suction block is provided with a first suction hole and a second suction hole. The first suction hole and the second suction hole are each connected to a corresponding independent airway. The first suction hole is used to suck COF products, and the second suction hole is a long hole for sucking chips. Multiple first suction holes are distributed on the bottom surface of the suction block, and multiple second suction holes are arranged in the middle of one side of the bottom surface of the suction block.

[0008] In the present invention, the first suction holes are circular holes, and a plurality of the first suction holes are arranged in a matrix to form a suction hole group. Each suction hole group is connected to a corresponding independent airway, and a plurality of the suction hole groups are distributed along the length direction of the bottom surface of the suction block.

[0009] The pre-pressing manipulator further comprises a first adapter block, a connecting pipe and a second adapter block, the first adapter comprises a main airway, the main airway comprises a first input port and a plurality of first output ports, and the first input port is connected to the vacuum device;

[0010] The second adapter block is provided with multiple air distribution channels, which include multiple second input ports located on the vertical side of the second adapter block, and multiple second output ports located on the bottom surface of the second adapter block. Each second input port is connected to a corresponding one of the first output ports through the connecting pipe. The suction block is connected to the bottom surface of the second adapter block, and each of the suction hole group and the second suction hole is connected to the corresponding second output port.

[0011] Furthermore, the pre-pressing manipulator further includes a first movable plate, a second movable plate, a screw drive assembly, a pre-pressing cylinder and an auxiliary adsorption member, wherein the first movable plate is connected to the output end of the screw drive assembly, the pre-pressing cylinder is arranged on the first movable plate, and the second movable plate is connected to the output end of the pre-pressing cylinder;

[0012] The second adapter block is connected to the second movable plate, and the auxiliary adsorption component includes a first connecting rod, and a second connecting rod and a third connecting rod rotatably connected to both ends of the first connecting rod. The end of the second connecting rod away from the first connecting rod is connected to the second adapter block, and the end of the third connecting rod away from the first connecting rod is provided with a suction nozzle.

[0013] Furthermore, the pre-pressing manipulator further includes a first limit plate, a first fine motion block, a second limit plate, and a second fine motion block;

[0014] The first fine motion block includes a vertical portion and a transverse portion connected to one end of the vertical portion, the vertical portion and the transverse portion are connected to form a T-shaped structure, two first limiting plates are fixedly arranged on the second movable plate, the vertical portion is connected between the two first limiting plates, a first connecting rod passes through the first limiting plate and the vertical portion to form a rotational connection, two fine motion long strip holes are provided on the first limiting plate, the first connecting rod is located between the two fine motion long strip holes, and the second connecting rod passes through the fine motion long strip hole and the vertical portion to form a rotational limit fit;

[0015] The two sides of the second fine-motion block are respectively connected to the transverse part through a second limiting plate, and the third connecting rod passes through the second limiting plate and is connected to the second fine-motion block, forming a movable limit for the second fine-motion block and the second limiting plate. The two third connecting rods are located at both ends of the second fine-motion block, and the fourth connecting rod passes through the second limiting plate and is connected to the transverse part, forming a movable limit for the transverse part and the second limiting plate. The two third connecting rods are located at both ends of the transverse part, and a rotation guide shaft is provided between the second fine-motion block and the transverse part. The axial direction of the rotation guide shaft is perpendicular to the axial direction of the first connecting rod, and the axial direction of the rotation guide shaft and the axial direction of the first connecting rod are both parallel to the bottom surface of the suction block, and the rotation guide shaft is located between the two third connecting rods.

[0016] In the present invention, the ACF attaching mechanism and the pre-pressing mechanism both include a first platform plate for carrying panel products, a first fine-tuning platform mechanism, and a first positioning camera, the first positioning camera is located above the first platform plate and shoots toward the first platform plate, the first fine-tuning platform mechanism includes a first rotating module and a first height adjustment module arranged at the output end of the first rotating module, the first height adjustment module includes a first fixed seat and a first movable seat that are slidably connected to each other, a first spring is connected between the first fixed seat and the first movable seat, an adjusting screw is rotatably provided on the first fixed seat, a height adjustment rod is rotatably provided in the first fixed seat, one end of the adjusting screw is in contact with the height adjustment rod, and the adjusting screw drives the height adjustment rod to rotate to squeeze the first movable seat to slide, and the first platform plate is connected to the first movable seat;

[0017] The pressing mechanisms include a second platform plate for carrying panel products, a second fine-tuning platform mechanism, and a second positioning camera. The second positioning camera is located above the second platform plate and shoots toward the second platform plate. The second fine-tuning platform mechanism includes a second rotating module and a second height adjustment module arranged at the output end of the second rotating module. The second height adjustment module is a second fixed seat and a movable seat that are slidably connected to each other. A second spring is connected between the second fixed seat and the second movable seat. An adjusting rod is provided on the second fixed seat for rotation. A height adjustment cam is fixedly connected to the adjusting rod. The adjusting rod is connected to the height adjustment motor in a transmission manner. A pressure wheel in contact with the height adjustment cam is provided in the second movable seat. The height adjustment cam causes the second movable seat to slide by squeezing the pressure wheel. The second platform plate is connected to the second movable seat.

[0018] The first movable seat is connected to a first platform stabilizing block, and the side of the first platform plate is in sliding contact with the first platform stabilizing block; the second movable seat is connected to a second platform stabilizing block, and the side of the second platform plate is in sliding contact with the second platform stabilizing block.

[0019] In the present invention, the main pressing mechanism includes a lifting and lowering main pressing block and a buffer material feeding mechanism. The buffer material feeding device includes a buffer material unloading reel, a buffer material receiving reel, a guide roller, and a buffer material belt. The buffer material belt sequentially passes around the buffer material unloading reel, multiple guide rollers, and the buffer material receiving reel and forms a straight strip segment below the main pressing block. The extension direction of the buffer material belt of the straight strip segment is perpendicular to the conveying direction of the third robot.

[0020] In the present invention, the structure of the second feeding mechanism includes a throwing trough, a feeding trough, a baffle plate, and a pushing block. The baffle plate is lifted and lowered between the throwing trough and the feeding trough, and the pushing block is slidably set in the feeding trough. The pushing block pushes the material tray on the feeding trough toward the direction of the baffle plate by moving.

[0021] In the present invention, a transfer conveying platform is provided between the second loading mechanism and the pre-pressing mechanism. The second loading mechanism includes a transfer robot for grabbing and conveying the chip products or punched COF products on the second loading mechanism to the transfer conveying platform, and a loading camera for photographing and locating the products grabbed by the transfer robot.

[0022] Compared with the prior art, the present invention has the following beneficial effects: the fully automatic bonding machine of the present invention realizes loading chip products or COF products by setting a first loading structure and a docking groove, and at the same time, the pre-pressing robot is provided with a first suction hole and a second suction hole that are compatible with grabbing chip products or COF products. The equipment has high compatibility, low cost and high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. The drawings described below are only drawings corresponding to some embodiments of the present invention.

[0024] Figure 1 It is a schematic structural diagram of one side of the fully automatic bonding machine of the present invention.

[0025] Figure 2 It is a partial structural diagram of the other side of the fully automatic bonding machine of the present invention.

[0026] Figure 3 for Figure 2 A magnified view of the local structure at point X in the middle.

[0027] Figure 4 It is a structural schematic diagram of the pre-pressing mechanism of the fully automatic bonding machine of the present invention.

[0028] Figure 5 This is a partial structural exploded view of the pre-pressing mechanism of the fully automatic bonding machine of the present invention.

[0029] Figure 6 It is a structural schematic diagram of the suction block and the second adapter block of the fully automatic bonding machine of the present invention.

[0030] Figure 7 It is a structural schematic diagram of the ACF attaching mechanism of the fully automatic bonding machine of the present invention.

[0031] Figure 8 It is a structural schematic diagram of the first fine-tuning platform mechanism of the fully automatic bonding machine of the present invention.

[0032] Figure 9 It is a structural schematic diagram of the pressing mechanism of the fully automatic bonding machine of the present invention.

[0033] Figure 10 It is a partial structural diagram of the second fine-tuning platform mechanism of the fully automatic bonding machine of the present invention. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0035] Directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", "top" and "bottom", are only used with reference to the directions of the drawings. The directional terms used are used to illustrate and understand the present invention, and are not used to limit the present invention.

[0036] The terms "first" and "second" in the present invention are used for descriptive purposes only and should not be understood as indicating or implying relative importance, and should not be used as a limitation on the order of precedence.

[0037] In the present invention, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, connection can be a detachable connection or an integral structural connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be internal communication between two components or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0038] The existing crimp bonding equipment can only implement one fixed crimp bonding process, and has poor compatibility. In addition, the crimp bonding precision is low and the failure rate is high, which leads to high equipment cost and poor efficiency.

[0039] The following is a preferred embodiment of a fully automatic bonding machine provided by the present invention that can solve the above technical problems.

[0040] Please refer to Figure 1 ,in Figure 1 It is a schematic structural diagram of one side of the fully automatic bonding machine of the present invention.

[0041] In the figures, structurally similar elements are denoted by the same reference numerals.

[0042] The present invention provides a fully automatic bonding machine, comprising: a first loading mechanism 12, a second loading mechanism 13, an ACF attaching mechanism 14, a pre-pressing mechanism 15, a main pressing mechanism 16, and a handling system. The first loading mechanism 12, the ACF attaching mechanism 14, the pre-pressing mechanism 15, and the main pressing mechanism 16 are sequentially arranged on one side of the top of a base 11. The second loading mechanism 13 is arranged on the other side of the top of the base 11, adjacent to the pre-pressing mechanism 15. The first loading mechanism 12 is used to load panel products, while the second loading mechanism 13 is used to load chip products. A docking groove 111 for connecting to the punched loading mechanism of the COF product is provided on the side of the base 11 adjacent to the second loading mechanism.

[0043] Depending on the work requirements, the second loading mechanism 13 can be used to load chip products for bonding to panel products, or the second loading mechanism 13 can be docked with the COF product punching and loading mechanism through the docking groove 111. The punching and loading mechanism will punch the COF products, and then the transfer robot 1A will grab the COF products from the output platform of the punching and loading mechanism and load them toward the pre-pressing mechanism 15. This device has high compatibility, low cost, and high efficiency.

[0044] The handling system includes a first manipulator 181 that moves between the first loading mechanism 12 and the ACF attaching mechanism 14, a second manipulator 182 that moves between the ACF attaching mechanism 14 and the pre-pressing mechanism 15, and a third manipulator 183 that moves between the pre-pressing mechanism 15 and the main pressing mechanism 16, so as to grab and transport the products between the various mechanisms.

[0045] Please refer to Figure 4 and Figure 5 The pre-pressing mechanism 15 includes a pre-pressing manipulator, which includes a suction block 151 for grasping incoming materials. The suction block 151 is provided with a first suction hole 1511 and a second suction hole 1512, each connected to a corresponding independent airway. The first suction hole 1511 is used to absorb COF products, and the second suction hole 1512 is a long hole for sucking chips. Multiple first suction holes 1511 are distributed on the bottom surface of the suction block 151, and multiple second suction holes 1512 are located in the middle of one side of the bottom surface of the suction block 151. Chip products are thin and narrow, so they require suitable long holes for stable grasping. COF products are large sheet structures, which require more points to form a large and stable grasping area.

[0046] Please refer to Figure 5 and Figure 6In this embodiment, the first suction holes 1511 are circular holes. Multiple first suction holes 1511 are arranged in a matrix to form suction hole groups 1513. Each suction hole group 1513 is connected to a corresponding independent airway. Multiple suction hole groups 1513 are distributed along the length of the bottom surface of the suction block 151. This allows for different numbers of suction hole groups 1513 to be activated to accommodate different COF product sizes, ensuring high compatibility and saving energy costs.

[0047] Specifically, the pre-pressing manipulator further includes a first adapter block 152, a connecting pipe 154 and a second adapter block 153. The first adapter block 152 includes a main airway, which includes a first input port and multiple first output ports. The first input port is connected to the vacuum device.

[0048] The second adapter block 153 is provided with a plurality of air distribution channels 1531, which include a plurality of second input ports located on the vertical side of the second adapter block 153, and a plurality of second output ports located on the bottom surface of the second adapter block 153. Each second input port is connected to a corresponding first output port through a connecting pipe 154. The suction block 151 is connected to the bottom surface of the second adapter block 153, and each suction hole group 1513 and the second suction hole 1512 is connected to the corresponding second output port.

[0049] The pre-pressing robot in this embodiment also includes a first movable plate 155, a second movable plate 156, a screw drive assembly 158, a pre-pressing cylinder 157, and an auxiliary suction member 159. The first movable plate 155 is connected to the output end of the screw drive assembly 158, the pre-pressing cylinder 157 is arranged on the first movable plate 155, the second movable plate 156 is connected to the output end of the pre-pressing cylinder 157, and the second adapter block 153 is connected to the second movable plate 156. The first movable plate 155 can be driven to rise and fall quickly, driving the pre-pressing cylinder 157 and the suction block 151 to rise and fall. The second movable plate 156 is driven by the pre-pressing cylinder 157 to press down at a set pressure, bonding the chip product and COF product to the panel product, with a large lifting stroke and high efficiency.

[0050] Auxiliary suction member 159 includes a first connecting rod 1591, and a second connecting rod 1592 and a third connecting rod 1593 rotatably connected to the ends of first connecting rod 1591. The end of second connecting rod 1592 away from first connecting rod 1591 is connected to second adapter block 153, and the end of third connecting rod 1593 away from first connecting rod 1591 is provided with a suction nozzle 1594. Auxiliary suction member 159 can assist in the suction of longer COF products, allowing for precise and stable downward pressure bonding.

[0051] Please refer to Figure 4 and Figure 5In this embodiment, the pre-pressing manipulator further includes a first limiting plate 15A, a first fine motion block 15B, a second limiting plate 15C, and a second fine motion block 15D.

[0052] The first fine motion block 15B includes a vertical portion and a transverse portion connected to one end of the vertical portion. The vertical and transverse portions are connected to form a T-shaped structure. Two first limiting plates 15A are fixedly mounted on the second movable plate 156. The vertical portion is connected between the two first limiting plates 15A. A first connecting shaft 15B1 passes through the first limiting plates 15A and forms a rotational connection with the vertical portion. Two fine motion elongated holes 15A1 are provided in the first limiting plates 15A. The first connecting shaft 15B1 is located between the two fine motion elongated holes 15A1. The second connecting shaft passes through the fine motion elongated holes 15A1 and forms a rotational limit engagement with the vertical portion. This allows the first fine motion block 15B to rotate a certain angle about the first connecting shaft 15B1.

[0053] The second fine motion block 15D is connected to the transverse portion on both sides via a second limiting plate 15C. A third connecting shaft passes through the second limiting plate 15C and connects the second fine motion block 15D, forming a movable limit for the second fine motion block 15D and the second limiting plate 15C. Two third connecting shafts are located at both ends of the second fine motion block 15D. A fourth connecting shaft passes through the second limiting plate 15C and connects the transverse portion, forming a movable limit for the transverse portion and the second limiting plate 15C. The two third connecting shafts are located at both ends of the transverse portion. A rotation guide shaft 15B2 is provided between the second fine motion block 15D and the transverse portion. The axial direction of the rotation guide shaft 15B2 is perpendicular to the axial direction of the first connecting shaft 15B1, and the axial directions of the rotation guide shaft 15B2 and the first connecting shaft 15B1 are both parallel to the bottom surface of the suction block 151. The rotation guide shaft 15B2 is located between the two third connecting shafts, allowing the second fine motion block 15D to rotate around the rotation guide shaft 15B2 by a certain angle.

[0054] Finally, the suction block 151 can perform adaptive micro-adjustment on the top plane of the product when pressing the product, which is less likely to cause damage to the product and at the same time improves the quality of the pressed and bonded product.

[0055] Please refer to Figure 7 and Figure 8 In this embodiment, the ACF attaching mechanism 14 and the pre-pressing mechanism 15 both include a first platform plate 141 for carrying the panel product, a first fine-tuning platform mechanism, and a first positioning camera. Therefore, the structures of the first platform plate of the ACF attaching mechanism 14 and the pre-pressing mechanism 15 can refer to Figure 7 and Figure 8 .

[0056] When processing products of different thicknesses, the height position of the first platform plate 141 can be fine-tuned through the first fine-tuning platform mechanism. The first positioning camera is located above the first platform plate 141 and shoots toward the first platform plate 141. The control end can analyze the photos taken by the first positioning camera and control the rotation of the first platform plate 141 to adjust the orientation of the product.

[0057] The first fine-tuning platform mechanism includes a first rotating module 142 and a first height adjustment module 143 disposed at an output end of the first rotating module 142 .

[0058] The first height adjustment module 143 includes a first fixed seat 1431 and a first movable seat 1432 which are slidably connected to each other. A first spring is connected between the first fixed seat 1431 and the first movable seat 1432 (the first spring is not shown in the figure, so please refer to the following figure). Figure 9 (The connection structure of the second spring in the middle is shown in FIG1 ). An adjustment screw 1433 is rotatably provided on the first fixed seat 1431. A height adjustment rod 1434 is rotatably provided within the first fixed seat 1431. One end of the adjustment screw 1433 contacts the height adjustment rod 1434. The adjustment screw 1433 drives the height adjustment rod 1434 to rotate, thereby squeezing the first movable seat 1432 to move up and down. The first platform 141 is connected to the first movable seat 1432. The adjustment screw 1433 may have a screw structure similar to a micrometer screw, with a scale dimension to facilitate precise adjustment of the height of the first platform 141.

[0059] Please refer to Figure 9 The pressing mechanism 16 includes a second platform plate 161 for carrying the panel product, a second fine-tuning platform mechanism, and a second positioning camera. The second positioning camera is located above the second platform plate 161 and shoots toward the second platform plate 161.

[0060] The second fine-tuning platform mechanism includes a second rotating module 162 and a second height adjustment module 163 disposed at an output end of the second rotating module 162 .

[0061] Please refer to Figure 10The second height adjustment module 163 comprises a second fixed seat 1631 and a second movable seat 1632 which are slidably connected to each other. A second spring 164 is connected between the second fixed seat 1631 and the second movable seat 1632. An adjustment rod 1633 is rotatably provided on the second fixed seat 1631. A height adjustment cam 1634 is fixedly connected to the adjustment rod 1633. The adjustment rod 1633 is in transmission connection with a height adjustment motor 1636. During this pressure operation, the height position of the second platform plate 161 requires a higher precision, and the frequency and efficiency of adjustment are required to be higher. Therefore, a height adjustment motor 1636 is used for adjustment control. A pressure wheel 1635 is provided in the second movable seat 1632, which contacts the height adjustment cam 1634. The height adjustment cam 1634 presses the pressure wheel 1635 to cause the second movable seat 1632 to rise and fall. The second platform plate 161 is connected to the second movable seat 1632.

[0062] In this embodiment, the first movable seat 1432 is connected to a first platform stabilizing block 144. The side of the first platform plate 141 slides in contact with the first platform stabilizing block 144, further stabilizing the first platform plate 141. The second movable seat 1632 is connected to a second platform stabilizing block 165. The side of the second platform plate 161 slides in contact with the second platform stabilizing block 165, further stabilizing the second platform plate 161. The second platform stabilizing block 165 can also be used to support the product to receive downward pressure from the pressing mechanism 16.

[0063] In this embodiment, the ACF attaching mechanism 14 conveys ACF glue through a roll assembly and forms a straight strip of ACF glue above the first platform plate 141 of the ACF attaching mechanism 14. A cutter is then provided to half-cut the ACF glue as required. The downward pressing structure of the ACF attaching mechanism 14 attaches the cut ACF glue to the product.

[0064] Please refer to Figure 1 In this embodiment, the pressing mechanism 16 includes a lifting pressing block and a buffer material feeding mechanism 17. The buffer material feeding device includes a buffer material unwinding reel, a buffer material take-up reel, guide rollers, and a buffer material belt. The buffer material belt sequentially passes through the buffer material unwinding reel, multiple guide rollers, and the buffer material take-up reel to form a straight strip below the pressing block. The extension direction of the buffer material belt in the straight strip is perpendicular to the conveying direction of the third robot 183. Compared to the conventional straight strip of buffer material extending parallel to the conveying direction of the third robot 183, this allows for greater utilization of the widthwise areas of the buffer material, thereby conserving more buffer material, saving costs, and achieving higher efficiency.

[0065] Please refer to Figure 2 and Figure 3In this embodiment, the structure of the second feeding mechanism 13 includes a throwing trough, a feeding trough 121, a baffle plate 122, and a pushing block 123. The baffle plate 122 is raised and lowered between the throwing trough and the feeding trough 121, and the pushing block 123 is slidably set in the feeding trough 121. The pushing block 123 pushes the material tray on the feeding trough 121 toward the baffle plate 122 by moving, so that the operator can load the material without stopping the machine, which is highly efficient.

[0066] In addition, a transfer conveying platform 19 is provided between the second loading mechanism 13 and the pre-pressing mechanism 15. The second loading mechanism 13 includes a transfer robot 1A for grabbing and conveying the chip products or punched COF products on the second loading mechanism 13 to the transfer conveying platform 19, and a loading camera for photographing and locating the products grabbed by the transfer robot 1A. After the transfer robot 1A grabs the products on the second loading mechanism 13, the control end controls the rotation position and movement of the transfer robot 1A through the photos taken by the loading camera, so as to place the products accurately in the required position on the transfer conveying platform 19. The transfer conveying platform 19 then conveys the products to the bottom of the pre-pressing mechanism 15 to be grabbed by the suction block 151 for pre-pressing.

[0067] The working principle of the present invention is as follows: the first loading mechanism 12 loads panel products, and the second loading mechanism 13 loads chip products. Depending on work requirements, the second loading mechanism 13 can also stop loading, and then dock with the punching and loading mechanism of the COF product through the docking groove 111 to load the COF product. The transfer robot 1A grabs the chip product on the second loading mechanism 13 or the COF product on the punching and loading mechanism. The control end controls the rotation and movement of the transfer robot 1A based on the photos taken by the loading camera to accurately place the product on the transfer conveying platform 19 in the required orientation. The transfer conveying platform 19 then conveys the product to the bottom of the pre-pressing mechanism 15, where it is grabbed by the suction block 151 for pre-pressing.

[0068] The handling system can complete the grabbing and transportation of products between the first feeding mechanism 12 and the ACF attaching mechanism 14, between the ACF attaching mechanism 14 and the pre-pressing mechanism 15, and between the pre-pressing mechanism 15 and the main pressing mechanism 16, and complete the ACF attaching, pre-pressing and main pressing operations in sequence.

[0069] The fully automatic bonding machine of this preferred embodiment realizes loading chip products or COF products by setting a first loading structure and a docking groove. At the same time, the pre-pressing robot is provided with a first suction hole and a second suction hole that are compatible with grabbing chip products or COF products. The equipment has high compatibility, low cost and high efficiency.

[0070] In summary, although the present invention has been disclosed above with reference to preferred embodiments, the above preferred embodiments are not intended to limit the present invention. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. A fully automatic bonding machine, characterized in that: include: A first loading mechanism, a second loading mechanism, an ACF attaching mechanism, a pre-pressing mechanism, a main pressing mechanism, and a transport system, wherein the first loading mechanism, the ACF attaching mechanism, the pre-pressing mechanism, and the main pressing mechanism are sequentially arranged on one side of the top of the base, the second loading mechanism is arranged on the other side of the top of the base, and the second loading mechanism is arranged close to the pre-pressing mechanism. The first loading mechanism is used to load panel products, and the second loading mechanism is used to load chip products. A docking groove for connecting to the punching loading mechanism of COF products is provided on one side of the base close to the second loading mechanism; The transport system includes a first manipulator movable between the first feeding mechanism and the ACF attaching mechanism, a second manipulator movable between the ACF attaching mechanism and the pre-pressing mechanism, and a third manipulator movable between the pre-pressing mechanism and the main pressing mechanism; The pre-pressing mechanism includes a pre-pressing manipulator, which includes a suction block for grabbing incoming materials. The suction block is provided with a first suction hole and a second suction hole, each of which is connected to a corresponding independent airway. The first suction hole is used to suck COF products, and the second suction hole is a long hole for sucking chips. A plurality of the first suction holes are distributed on the bottom surface of the suction block, and a plurality of the second suction holes are provided in the middle of one side of the bottom surface of the suction block. The pre-pressing manipulator further includes a first movable plate, a second movable plate, a screw drive assembly, a pre-pressing cylinder, and an auxiliary adsorption member, wherein the first movable plate is connected to the output end of the screw drive assembly, the pre-pressing cylinder is arranged on the first movable plate, and the second movable plate is connected to the output end of the pre-pressing cylinder; The pre-pressing manipulator further includes a first limit plate, a first fine motion block, a second limit plate, and a second fine motion block; The first fine motion block includes a vertical portion and a transverse portion connected to one end of the vertical portion, the vertical portion and the transverse portion are connected to form a T-shaped structure, two first limiting plates are fixedly arranged on the second movable plate, the vertical portion is connected between the two first limiting plates, a first connecting shaft passes through the first limiting plate and the vertical portion to form a rotational connection, two fine motion long strip holes are provided on the first limiting plate, the first connecting shaft is located between the two fine motion long strip holes, and the second connecting shaft passes through the fine motion long strip hole and the vertical portion to form a rotational limit fit; The two sides of the second fine motion block are respectively connected to the transverse part through a second limiting plate, and the third connecting shaft passes through the second limiting plate and is connected to the second fine motion block, forming a movable limit for the second fine motion block and the second limiting plate. The two third connecting shafts are located at both ends of the second fine motion block, and the fourth connecting shaft passes through the second limiting plate and is connected to the transverse part, forming a movable limit for the transverse part and the second limiting plate. The two third connecting shafts are located at both ends of the transverse part, and a rotation guide shaft is provided between the second fine motion block and the transverse part. The axial direction of the rotation guide shaft is perpendicular to the axial direction of the first connecting shaft, and the axial direction of the rotation guide shaft and the axial direction of the first connecting shaft are both parallel to the bottom surface of the suction block, and the rotation guide shaft is located between the two third connecting shafts.

2. The fully automatic bonding machine according to claim 1, characterized in that: The first suction holes are circular holes, and a plurality of the first suction holes are arranged in a matrix to form a suction hole group. Each suction hole group is connected to a corresponding independent airway, and a plurality of the suction hole groups are distributed along the length direction of the bottom surface of the suction block.

3. The fully automatic bonding machine according to claim 2, characterized in that: The pre-pressing manipulator further includes a first adapter block, a connecting pipe, and a second adapter block, wherein the first adapter block includes a main airway, the main airway includes a first input port and a plurality of first output ports, and the first input port is connected to the vacuum device; The second adapter block is provided with multiple air distribution channels, which include multiple second input ports located on the vertical side of the second adapter block, and multiple second output ports located on the bottom surface of the second adapter block. Each second input port is connected to a corresponding one of the first output ports through the connecting pipe. The suction block is connected to the bottom surface of the second adapter block, and each of the suction hole group and the second suction hole is connected to the corresponding second output port.

4. The fully automatic bonding machine according to claim 3, characterized in that: The second adapter block is connected to the second movable plate, and the auxiliary adsorption component includes a first connecting rod, and a second connecting rod and a third connecting rod rotatably connected to both ends of the first connecting rod. The end of the second connecting rod away from the first connecting rod is connected to the second adapter block, and the end of the third connecting rod away from the first connecting rod is provided with a suction nozzle.

5. The fully automatic bonding machine according to claim 1, characterized in that: The ACF attaching mechanism and the pre-pressing mechanism both include a first platform plate for carrying panel products, a first fine-tuning platform mechanism, and a first positioning camera, the first positioning camera is located above the first platform plate and shoots toward the first platform plate, the first fine-tuning platform mechanism includes a first rotating module and a first height adjustment module arranged at the output end of the first rotating module, the first height adjustment module includes a first fixed seat and a first movable seat slidably connected to each other, a first spring is connected between the first fixed seat and the first movable seat, an adjusting screw is rotatably provided on the first fixed seat, a height adjustment rod is rotatably provided in the first fixed seat, one end of the adjusting screw is in contact with the height adjustment rod, and the adjusting screw drives the height adjustment rod to rotate to squeeze the first movable seat to slide, and the first platform plate is connected to the first movable seat; The pressing mechanisms include a second platform plate for carrying panel products, a second fine-tuning platform mechanism, and a second positioning camera. The second positioning camera is located above the second platform plate and shoots toward the second platform plate. The second fine-tuning platform mechanism includes a second rotating module and a second height adjustment module arranged at the output end of the second rotating module. The second height adjustment module is a second fixed seat and a movable seat that are slidably connected to each other. A second spring is connected between the second fixed seat and the second movable seat. An adjusting rod is provided on the second fixed seat for rotation. A height adjustment cam is fixedly connected to the adjusting rod. The adjusting rod is connected to the height adjustment motor in a transmission manner. A pressure wheel in contact with the height adjustment cam is provided in the second movable seat. The height adjustment cam causes the second movable seat to slide by squeezing the pressure wheel. The second platform plate is connected to the second movable seat.

6. The fully automatic bonding machine according to claim 5, characterized in that: The first movable seat is connected to a first platform stabilizing block, and the side of the first platform plate is in sliding contact with the first platform stabilizing block. The second movable seat is connected to a second platform stabilizing block, and the side of the second platform plate is in sliding contact with the second platform stabilizing block.

7. The fully automatic bonding machine according to claim 1, characterized in that: The main pressing mechanism includes a main pressing block that is set to be lifted and lowered, and a buffer material feeding mechanism. The buffer material feeding mechanism includes a buffer material unloading reel, a buffer material receiving reel, a guide roller, and a buffer material belt. The buffer material belt sequentially passes around the buffer material unloading reel, multiple guide rollers, and the buffer material receiving reel and forms a straight strip segment below the main pressing block. The extension direction of the buffer material belt of the straight strip segment is perpendicular to the conveying direction of the third robot.

8. The fully automatic bonding machine according to claim 1, characterized in that: The structure of the second feeding mechanism includes a throwing trough, a feeding trough, a baffle plate, and a pushing block. The baffle plate is lifted and lowered between the throwing trough and the feeding trough. The pushing block is slidably set in the feeding trough. The pushing block pushes the material tray on the feeding trough toward the direction of the baffle plate by moving.

9. The fully automatic bonding machine according to claim 8, characterized in that: A transfer conveying platform is arranged between the second loading mechanism and the pre-pressing mechanism. The second loading mechanism includes a transfer robot for grabbing and conveying the chip products on the second loading mechanism or the COF products punched by the punching loading mechanism to the transfer conveying platform, and a loading camera for photographing and locating the products grabbed by the transfer robot.

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