Printed circuit board de-covering method

Abstract

The present invention discloses a method for removing a cover from a printed circuit board, comprising: providing a first inner core substrate; forming two metal barrier structures and two laser-cut grooves; printing a strippable printing ink on the printed areas inside the two metal barrier structures; placing at least one second inner core substrate on one side of the first inner core substrate and laminating them together via a bonding adhesive layer to form a multi-layer circuit board structure; utilizing two stripping punches of a plate stripping device to align with the positions of the two laser-cut grooves, respectively, and automatically performing a stripping operation from the top surface of the multi-layer circuit board structure toward the two laser-cut grooves; and removing the two stripping punches to form a stripping opening in the multi-layer circuit board structure. This method solves the problem of difficulty in stripping the strippable printing ink and enables automated stripping of multi-layer circuit boards.

Description

Technical Field

[0001] The present invention relates to a method for removing a cover, in particular to a method for removing a cover of a printed circuit board. Background Art

[0002] In the prior art, after the decapping process in multilayer circuit boards, the edges of the decapping openings can become mixed with the pre-cured adhesive, making the strippable ink difficult to remove during cleaning. Furthermore, the angle of the decapping openings is affected by the laser, leading to issues with ink exchange. This results in prolonged stripping time and the risk of residual strippable ink, which can affect the electrical properties of the finished circuit board.

[0003] Furthermore, the prior art often relies on manual operation for de-capping multi-layer printed circuit boards (PCBs). However, manual operation often results in quality control issues during de-capping of PCBs. For example, different operators often use different amounts of force during de-capping of PCBs. Alternatively, the same operator may use different amounts of force during de-capping of PCBs under different physical conditions. Consequently, the prior art has issues with quality control issues or reduced yield (e.g., de-capping residue issues) during de-capping of PCBs.

[0004] Furthermore, the decapping operation based on existing technology mainly relies on manual operation, which makes it difficult to mass-produce and thus difficult to meet customer needs. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a method for removing the cover of a printed circuit board in view of the deficiencies in the prior art.

[0006] In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a method for removing the cover of a printed circuit board, which includes: providing a first inner core substrate; forming two protruding metal barrier structures on one side surface of the first inner core substrate, and forming two laser-cut grooves recessed from the side surface on the first inner core substrate; wherein the inner sides of the two metal barrier structures are surrounded by a printing area on the first inner core substrate, and the two laser-cut grooves are adjacent to the inner sides of the two metal barrier structures; printing a peelable printing ink on the printing area on the inner sides of the two metal barrier structures on the first inner core substrate, and the peelable printing ink can be further filled in the two laser-cut grooves during the printing process; The core substrate is arranged on a side of the first inner core substrate away from the two metal barrier structures and the strippable printing ink, and the at least one second inner core substrate is laminated with the first inner core substrate through a bonding adhesive layer, and a circuit layer addition operation is performed to form a multi-layer circuit board structure; wherein the two metal barrier structures and the strippable printing ink are buried in the multi-layer circuit board structure; two de-covering punches of a plate de-covering device are respectively aligned with the positions of the two laser-cut grooves, and a de-covering operation is automatically performed from the surface of the multi-layer circuit board structure located on the second inner core substrate to the direction of the two laser-cut grooves; and the two de-covering punches are removed so that the multi-layer circuit board structure forms a de-covering opening and also forms a de-covering structure.

[0007] Preferably, the two metal barrier structures are formed by a metal etching process, and the two laser-cut grooves are formed by a laser cutting process.

[0008] Preferably, during the process of blind fishing of the multi-layer circuit board structure by the sheet material de-covering device, the two de-covering punches partially overlap with the two laser-cut grooves respectively, and each of the de-covering punches does not penetrate the multi-layer circuit board structure after the de-covering operation is completed.

[0009] Preferably, the plate decapping device includes a longitudinal guide member and a decapping mold member movably arranged on the longitudinal guide member; wherein the decapping mold member includes two decapping punches, and the decapping mold member can move up and down along a longitudinal direction on the longitudinal guide member to perform the decapping operation.

[0010] Preferably, the decapping mold component includes a mold body, two decapping punches and a fixed plate; wherein, the two decapping punches are spaced and fixedly arranged on the bottom surface of the mold body, and the mold body can be movably set on the longitudinal guide component through the fixed plate, and can move up and down along the longitudinal direction, and the decapping mold component can drive the two decapping punches to move toward the direction of the multi-layer circuit board structure through the drive of the longitudinal guide component to perform the decapping operation.

[0011] Preferably, the decapping mold component further comprises two telescopic pressing plates, which are respectively telescopically arranged on the bottom surface of the mold body and surround the two decapping punches to form a rectangular area.

[0012] Preferably, the uncovering opening is formed by being recessed from the top surface of the multi-layer circuit board structure toward the two metal blocking structures, and the uncovering opening does not cover the two metal blocking structures; wherein, the uncovering structure includes part of the first inner core substrate and part of the second inner core substrate, but does not include the two metal blocking structures.

[0013] Preferably, the method for removing the cover of the printed circuit board further comprises: removing the cover removal structure from the position of the strippable printing ink through the two laser-cut grooves in the multi-layer circuit board structure.

[0014] Preferably, the method for removing the cover of the printed circuit board further comprises: performing a cleaning operation to remove the strippable printing ink remaining at the bottom of the removal opening.

[0015] Preferably, the side wall of each metal barrier structure facing the de-covering opening is defined as a metal barrier side wall, and the side wall of each laser-cut groove facing the de-covering opening is defined as a laser-cut side wall; wherein, the metal barrier side wall and the laser-cut side wall have an angle between 120 degrees and 150 degrees.

[0016] One of the beneficial effects of the present invention is that the method for removing the cover of a printed circuit board provided by the present invention can be achieved by "providing a first inner core substrate; forming two protruding metal barrier structures on one side surface of the first inner core substrate, and forming two laser-cut grooves recessed from the side surface on the first inner core substrate; wherein the inner sides of the two metal barrier structures surround a printing area on the first inner core substrate, and the two laser-cut grooves are adjacent to the inner sides of the two metal barrier structures; printing a strippable printing ink on the printing area inside the two metal barrier structures on the first inner core substrate, and the strippable printing ink can be further filled into the two laser-cut grooves during the printing process; arranging at least one second inner core substrate away from the first inner core substrate On one side of the two metal barrier structures and the strippable printing ink, the at least one second inner core substrate is laminated with the first inner core substrate through a bonding adhesive layer, and a circuit layer addition operation is performed to form a multi-layer circuit board structure; wherein the two metal barrier structures and the strippable printing ink are buried in the multi-layer circuit board structure; two stripping punches of a plate stripping device are respectively aligned with the positions of the two laser-cut grooves, and a stripping operation is performed from the surface of the multi-layer circuit board structure located on the second inner core substrate in the direction of the two laser-cut grooves; and the two stripping punches are removed to form a stripping opening in the multi-layer circuit board structure. This technical solution solves the problem that the strippable printing ink is difficult to strip and can realize the automated stripping operation of the multi-layer circuit board.

[0017] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 FIG. 1 is a schematic diagram of step S110 of a method for removing a cover from a printed circuit board according to an embodiment of the present invention.

[0019] Figure 2 FIG. 1 is a schematic diagram of step S120 of the method for removing the cover of a printed circuit board according to an embodiment of the present invention.

[0020] Figure 3 FIG. 1 is a schematic diagram of step S130 of the method for removing the cover of a printed circuit board according to an embodiment of the present invention.

[0021] Figure 4 FIG. 1 is a schematic diagram of step S140 of the method for removing the cover of a printed circuit board according to an embodiment of the present invention.

[0022] Figure 5FIG. 1 is a schematic diagram of step S150 of the method for removing the cover of a printed circuit board according to an embodiment of the present invention.

[0023] Figure 6 FIG. 1 is a schematic diagram of step S160 of the method for removing the cover of a printed circuit board according to an embodiment of the present invention.

[0024] Figure 7 FIG. 1 is a schematic diagram of step S170 of the method for removing the cover of a printed circuit board according to an embodiment of the present invention.

[0025] Figure 8 FIG. 1 is a schematic diagram of step S180 of the method for removing the cover of a printed circuit board according to an embodiment of the present invention.

[0026] Figure 9 for Figure 8 Schematic diagram of a partial enlargement of area IX.

[0027] Figure 10 Schematic diagram of a plate cover removal device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0028] The following is an explanation of the disclosed embodiments of the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted in actual size. It is stated in advance. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0029] [Printed circuit board cover removal method]

[0030] See also Figures 1 to 8 As shown, an embodiment of the present invention provides a method for decapping a printed circuit board (ade-capping method of a printed circuit board), and in particular, provides a method for decapping a semi-bent printed circuit board, which includes step S110, step S120, step S130, step S140, step S150, step S160, step S170, and step S180. It should be noted that the order of the steps and the actual operation method contained in the embodiment of the present invention can be adjusted according to needs and are not limited to those contained in this embodiment. The decapping method of a printed circuit board in the embodiment of the present invention can provide additional operations before, during, or after each step, and some of the operations described can be replaced, eliminated, or rearranged to realize additional implementation methods of the method. The following is combined with Figures 1 to 8 A method for de-capping a half printed circuit board is described.

[0031] Figure 1 FIG. 1 is a schematic diagram of step S110 of a method for removing a cover from a printed circuit board according to an embodiment of the present invention.

[0032] Step S110 includes providing a first inner core substrate 1 (also called a core substrate). A metal copper foil layer is formed on both side surfaces of the first inner core substrate 1. In this embodiment, a circuit L5 and a circuit L6 are formed on both side surfaces of the first inner core substrate 1, respectively.

[0033] Step S110 further includes providing at least one second inner core substrate 2 and placing it on one side of the first inner core substrate 1. A metal copper foil layer is formed on both side surfaces of the second inner core substrate 2. In this embodiment, a circuit L3 and a circuit L4 are formed on both side surfaces of the second inner core substrate 2, respectively.

[0034] Figure 2 FIG. 1 is a schematic diagram of step S120 of the method for removing the cover of a printed circuit board according to an embodiment of the present invention.

[0035] The step S120 includes performing a metal etching operation to form two protruding metal dam structures D on one surface of the first inner core substrate 1 .

[0036] The step S120 further includes: performing a laser cutting operation to form two laser cut grooves C recessed from the side surface of the first inner core substrate 1 .

[0037] The inner sides of the two metal barrier structures D surround a printed area R on the first inner core substrate 1, and the two laser-cut grooves C are recessed from the side surface of the first inner core substrate 1. The positions of the two laser-cut grooves C correspond to the printed area R and are formed adjacent to the inner sides of the two metal barrier structures D. In other words, the first inner core substrate 1 has a laser-cut groove C formed adjacent to the inner side of each metal barrier structure D.

[0038] It is worth mentioning that in Figure 2 The two metal barrier structures D and the two laser-cut grooves C are shown in a cross-sectional view. When viewed from above, the metal barrier structures D may be, for example, two elongated dams that surround the printing area R. However, the present invention is not limited thereto. The metal barrier structure D may also be, for example, a continuous ring-shaped structure (not shown) that surrounds the printing area R.

[0039] More specifically, the metal etching operation is to etch the metal copper foil layer on the first inner core substrate 1 (such as wet etching or dry etching) to remove part of the metal copper foil layer, thereby forming the two protruding metal barrier structures D on the first inner core substrate 1.

[0040] In some embodiments of the present invention, in each of the metal barrier structures D, the material of the metal barrier structure D is copper metal, and a cross-section of the metal barrier structure D is substantially rectangular (e.g. Figure 2 ) or a trapezoidal shape (not shown). The width of the metal barrier structure D is between 30 μm and 600 μm, preferably between 30 μm and 175 μm, and particularly preferably between 50 μm and 155 μm. The height H of the metal barrier structure D is between 15 μm and 300 μm, and preferably between 17.5 μm and 280 μm.

[0041] In some embodiments of the present invention, the laser cutting operation is performed by using a laser cutting machine (eg, a PCB laser cutting machine) to perform laser cutting on the first inner core substrate 1 to remove a portion of the material of the first inner core substrate 1 .

[0042] As a result, the first inner core substrate 1 can form two concave laser-cut grooves C. In this embodiment, each laser-cut groove C is substantially V-shaped, but the present invention is not limited thereto. In addition, the depth of each laser-cut groove C can be adjusted according to product design requirements.

[0043] Figure 3 FIG. 1 is a schematic diagram of step S130 of the method for removing the cover of a printed circuit board according to an embodiment of the present invention.

[0044] The step S130 includes: performing a printing operation to print a strippable printing ink I on the printing area R inside the two metal barrier structures D on the first inner core substrate 1, and the strippable printing ink I can be further filled into the two laser-cut grooves C during the printing process.

[0045] The method for removing the cover of the printed circuit board in the embodiment of the present invention can avoid the overflow of the strippable printing ink I during the printing process through the design of the metal blocking structure D and the laser cutting groove C, and can also help improve the stripping efficiency and cleaning effect of the strippable printing ink I in subsequent stripping operations.

[0046] In terms of material type, the strippable printing ink I can be, for example, commonly used strippable inks for PCBs, gold finger protection inks, plating resist inks, PI, or PFG, but is not limited to materials that can assist in separation. Furthermore, step S130 includes air-drying or baking the strippable printing ink I to solidify it, facilitating subsequent stripping operations.

[0047] Figure 4 FIG. 1 is a schematic diagram of step S140 of the method for removing the cover of a printed circuit board according to an embodiment of the present invention.

[0048] The step S140 includes: setting the at least one second inner core substrate 2 on the side of the first inner core substrate 1 away from the two metal barrier structures D and the strippable printing ink I, and overlapping the at least one second inner core substrate 2 and the first inner core substrate 1 through a bonding adhesive layer PP (such as Prepreg film).

[0049] The step S140 further includes: through a circuit layer addition operation, two outer layer circuits (such as circuit L2 and circuit L7) are added on both sides of the first inner core substrate 1 and the second inner core substrate 2 to form a multi-layer circuit board structure Z; and the step S140 further includes: forming a through hole TH (through hole) passing through the multi-layer circuit board structure Z.

[0050] The strippable printing ink I is printed on the printing area R inside the two metal barrier structures D on the first inner core substrate 1, and the strippable printing ink I can be further filled into the two laser-cut grooves C during the printing process.

[0051] More specifically, in this embodiment, the two metal barrier structures D and the strippable printing ink I formed on the first inner core substrate 1 are embedded in the multi-layer circuit board structure Z.

[0052] Figure 5 FIG. 1 is a schematic diagram of step S150 of the method for removing the cover of a printed circuit board according to an embodiment of the present invention.

[0053] The step S150 includes: performing an electroplating operation to form an electroplating layer on the inner side wall of the through hole TH, thereby forming the through hole TH into a plated through hole PTH (plating through hole); and additionally performing an outer layer circuit operation to form two outer layer circuits (such as circuit L1 and circuit L8) on both side surfaces of the multi-layer circuit board structure Z, and forming an outer layer metal pad 3 on the outer layer circuits (such as the outer layer metal pad 3 on the bottom surface circuit L8), but the present invention is not limited thereto.

[0054] In this embodiment, the plated through hole PTH passes through the first inner core substrate 1 and the at least one second inner core substrate 2, and is located on one side of the two metal barrier structures D and the strippable printing ink I, but does not pass through or overlap the two metal barrier structures D and the strippable printing ink I.

[0055] Figure 6 FIG. 1 is a schematic diagram of step S160 of the method for removing the cover of a printed circuit board according to an embodiment of the present invention.

[0056] The step S160 includes: utilizing a board cover removal device F to perform a cover removal operation on the multi-layer circuit board structure Z.

[0057] Please also refer to Figure 10 The sheet material decapping device F comprises a longitudinal guide member F1 and a decapping mold member F2 movably disposed on the longitudinal guide member F1. The decapping mold member F2 can move up and down along a longitudinal direction on the longitudinal guide member F1.

[0058] Furthermore, the longitudinal guide member F1 may be, for example, a slide cylinder.

[0059] The decapping mold component F2 includes a mold body F21 and two decapping punches F22. In this embodiment, the decapping mold component F2 further includes two telescopic pressing plates F23 ( Figure 10 Only one retractable pressure plate is shown, and the other is provided at the rear side and is hidden), but the present invention is not limited thereto.

[0060] In this embodiment, the mold body F21 is substantially in the shape of a hexahedron (eg, a cuboid or a cube), but the present invention is not limited thereto.

[0061] The mold body F21 can be movably (slidably) mounted on the longitudinal guide member F1 via a fixing plate F24 and can move up and down along the longitudinal direction. Accordingly, the decapping mold member F2 can be driven by the longitudinal guide member F1 to move toward the multilayer circuit board structure Z.

[0062] The two decapping punches F22 are fixedly arranged at a distance from each other on the bottom surface of the mold body F21, and the two decapping punches F22 are configured to perform decapping operations on the multi-layer circuit board structure Z (such as Figure 6 ).

[0063] More specifically, the plate removing device F drives the removing mold component F2 toward the surface of the multilayer circuit board structure Z located on the second inner core substrate 2 (i.e., the top surface of the multilayer circuit board structure Z) through the longitudinal guiding component F1.

[0064] The two retractable pressing plates F23 are roughly rectangular plate-shaped and are spaced and retractably arranged on the bottom surface of the mold body F21 and located on both sides of the two decapping punches F22, and roughly surround the two decapping punches F22 to form a rectangular area, but the present invention is not limited thereto.

[0065] During the decapping operation, the two decapping punches F22 of the sheet material decapping device F are positioned to align with the positions of the two laser-cut grooves C, and perform blind scooping from the surface of the multilayer circuit board structure Z located on the second inner core substrate 2 toward the two laser-cut grooves C. During the blind scooping process, the two decapping punches F22 partially overlap the two laser-cut grooves C and remove a portion of the strippable printing ink I filled in the laser-cut grooves C. Furthermore, the blind scooping depth of each decapping punch F22 is less than the thickness of the multilayer circuit board structure Z. In other words, after the decapping operation is completed, each decapping punch F22 does not penetrate the multilayer circuit board structure Z.

[0066] Please continue reading Figure 6 As shown, in this embodiment, each decapping punch F22 is not blindly scooped at the center line position of its corresponding laser-cut groove C. Each decapping punch F22 is blindly scooped at a position where the center line of the corresponding laser-cut groove C is slightly deviated from the printing area R to facilitate subsequent decapping operations, but the present invention is not limited to this.

[0067] Furthermore, when the two decapping punches F22 perform decapping operations on the multi-layer circuit board structure Z, the two telescopic pressure plates F23 can be telescopically pressed against the top surface of the multi-layer circuit board structure Z, and press against the portion of the top surface of the multi-layer circuit board structure Z other than the portion to be decapped.

[0068] Figure 7 FIG. 1 is a schematic diagram of step S170 of the method for removing the cover of a printed circuit board according to an embodiment of the present invention.

[0069] Step S170 includes: driving the two decapping punches F22 of the sheet material decapping device F in a direction away from the multi-layer circuit board structure Z by the longitudinal guide member F1, thereby removing the two decapping punches F22 from the multi-layer circuit board structure Z, so that the multi-layer circuit board structure Z can form a decapping opening O and a decapping structure O1.

[0070] More specifically, the cover removal opening O is recessed from the top surface of the multi-layer circuit board structure Z (i.e., the surface located on the second inner core substrate 2) toward the two metal barrier structures D. Furthermore, the cover removal opening O does not extend beyond the two metal barrier structures D.

[0071] In addition, the decapping structure O1 is waste generated after the decapping operation, and the decapping structure O1 includes a portion of the first inner core substrate 1 and a portion of the second inner core substrate 2 , but does not include the two metal barrier structures D.

[0072] Figure 8 FIG. 1 is a schematic diagram of step S180 of the method for removing the cover of a printed circuit board according to an embodiment of the present invention.

[0073] The step S180 includes: removing the uncovered structure O1 from the position of the strippable printing ink I through two laser-cut grooves C in the multi-layer circuit board structure Z.

[0074] The step S180 further includes performing a cleaning operation to remove the residual strippable printing ink I at the bottom of the de-capping opening O.

[0075] In this embodiment, the cleaning operation is to use a chemical agent to clean the residual ink at the bottom of the decapping opening O. The chemical agent may be, for example, a chemical agent containing modified alcohol ether, but the present invention is not limited thereto.

[0076] like Figure 9 As shown, the sidewall of each metal barrier structure D facing the decapping opening O is defined as a metal barrier sidewall D1, and the sidewall of each laser-cut groove C facing the decapping opening O is defined as a laser-cut sidewall C1. An angle α is formed between the metal barrier sidewall D1 and the laser-cut sidewall C1, and the angle α is preferably between 120 degrees and 150 degrees, and more preferably between 130 degrees and 140 degrees. For example, the angle α can be 135 degrees.

[0077] The angle α between the metal barrier sidewall D1 and the laser-cut sidewall C1 forms a flushing space, thereby allowing the chemical agent to fully exchange liquid in the flushing space between the metal barrier sidewall D1 and the laser-cut sidewall C1, thereby fully removing residual ink.

[0078] [Beneficial Effects of Embodiments]

[0079] One of the beneficial effects of the present invention is that the method for removing the cover of a printed circuit board provided by the present invention can be achieved by "providing a first inner core substrate; forming two protruding metal barrier structures on one side surface of the first inner core substrate, and forming two laser-cut grooves recessed from the side surface on the first inner core substrate; wherein the inner sides of the two metal barrier structures surround a printing area on the first inner core substrate, and the two laser-cut grooves are adjacent to the inner sides of the two metal barrier structures; printing a peelable printing ink on the printing area inside the two metal barrier structures on the first inner core substrate, and the peelable printing ink can be further filled in the two laser-cut grooves during the printing process; arranging at least one second inner core substrate on the first inner core substrate away from the two metal barrier structures and the peelable printing ink The invention relates to a method for brushing ink on one side of the multilayer circuit board, and laminating the at least one second inner core substrate and the first inner core substrate together through a bonding adhesive layer, and performing a circuit layer adding operation to form a multilayer circuit board structure; wherein the two metal barrier structures and the strippable printing ink are buried in the multilayer circuit board structure; using two stripping punches of a plate stripping device to align with the positions of the two laser-cut grooves respectively, a stripping operation is performed from the surface of the multilayer circuit board structure located on the second inner core substrate to the direction of the two laser-cut grooves; and removing the two stripping punches to form a stripping opening in the multilayer circuit board structure and to form a stripping structure. The technical solution can solve the problem that the strippable printing ink is difficult to remove after the stripping operation on the multilayer circuit board, reduce the possibility of residual strippable printing ink, and realize the automated stripping operation of the multilayer circuit board.

[0080] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the description and drawings of the present invention are included in the scope of the patent application of the present invention.

Claims

1. A method for removing a cover from a printed circuit board, characterized in that: The printed circuit board de-covering method comprises: Providing a first inner core substrate; Two protruding metal barrier structures are formed on a side surface of the first inner core substrate, and two laser-cut grooves are formed on the first inner core substrate, which are recessed from the side surface; wherein the inner sides of the two metal barrier structures surround a printed area on the first inner core substrate, and the two laser-cut grooves are formed adjacent to the inner sides of the two metal barrier structures; Printing a peelable printing ink on the printing area inside the two metal barrier structures on the first inner core substrate, and the peelable printing ink can further fill the two laser-cut grooves during the printing process; Disposing at least one second inner core substrate on a side of the first inner core substrate away from the two metal barrier structures and the strippable printing ink, laminating the at least one second inner core substrate and the first inner core substrate together via a bonding adhesive layer, and performing a circuit build-up operation to form a multi-layer circuit board structure; wherein the two metal barrier structures and the strippable printing ink are embedded in the multi-layer circuit board structure; Utilizing two decapping punches of a sheet material decapping device to align with the positions of the two laser cut grooves, respectively, to automatically perform a decapping operation from the surface of the second inner core substrate of the multi-layer circuit board structure toward the two laser cut grooves; and The two decapping punches are removed to form a decapping opening in the multilayer circuit board structure and further form a decapping structure.

2. The method for removing the cover of a printed circuit board according to claim 1, wherein: The two metal barrier structures are formed by a metal etching process, and the two laser cutting grooves are formed by a laser cutting process.

3. The method for removing the cover of a printed circuit board according to claim 1, wherein: During the process of blind fishing of the multi-layer circuit board structure by the sheet material decapping device, the two decapping punches partially overlap with the two laser-cut grooves respectively, and each of the decapping punches does not penetrate the multi-layer circuit board structure after the decapping operation is completed.

4. The method for removing the cover of a printed circuit board according to claim 1, wherein: The plate decapping device includes a longitudinal guide component and a decapping mold component movably arranged on the longitudinal guide component; wherein, the decapping mold component includes two decapping punches, and the decapping mold component can move up and down along a longitudinal direction on the longitudinal guide component to perform the decapping operation.

5. The method for removing the cover of a printed circuit board according to claim 4, wherein: The decapping mold component includes a mold body, two decapping punches and a fixed plate; wherein, the two decapping punches are spaced and fixedly arranged on the bottom surface of the mold body, and the mold body can be movably set on the longitudinal guide component through the fixed plate, and can move up and down along the longitudinal direction, and the decapping mold component can drive the two decapping punches to move toward the direction of the multi-layer circuit board structure through the drive of the longitudinal guide component to perform the decapping operation.

6. The method for removing the cover of a printed circuit board according to claim 5, wherein: The decapping mold component further includes two telescopic pressing plates, which are respectively telescopically arranged on the bottom surface of the mold body and surround the two decapping punches to form a rectangular area.

7. The method for removing the cover of a printed circuit board according to claim 5, wherein: The uncovering opening is formed by being recessed from the top surface of the multi-layer circuit board structure toward the two metal blocking structures, and the uncovering opening does not cover the two metal blocking structures; wherein, the uncovering structure includes part of the first inner core substrate and part of the second inner core substrate, but does not include the two metal blocking structures.

8. The method for removing the cover of a printed circuit board according to claim 1, wherein: The printed circuit board de-covering method further comprises: The decapping structure is removed from the location of the strippable printing ink through the two laser cut grooves in the multilayer circuit board structure.

9. The method for removing the cover of a printed circuit board according to claim 8, wherein: The printed circuit board de-covering method further comprises: A cleaning operation is performed to remove the strippable printing ink remaining at the bottom of the decapping opening.

10. The method for removing the cover of a printed circuit board according to claim 9, wherein: The sidewall of each metal barrier structure facing the de-capping opening is defined as a metal barrier sidewall, and the sidewall of each laser-cut groove facing the de-capping opening is defined as a laser-cut sidewall; wherein the metal barrier sidewall and the laser-cut sidewall have an angle between 120 degrees and 150 degrees.

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