A high temperature resistant thick film chip resistor

Abstract

The present invention relates to the field of thick film resistors, and specifically to a high temperature resistant chip thick film resistor, comprising a resistor mechanism, wherein a rotating mechanism is arranged on the outer wall of the resistor mechanism, wherein two pushing mechanisms are arranged inside the rotating mechanism, wherein a wiring mechanism is arranged inside each of the two pushing mechanisms, wherein the resistor mechanism comprises a shell, wherein a resistor is fixedly installed inside the shell, wherein a high temperature resistant sheet is fixedly connected to the lower surface of the shell and the resistor, and a moving block is pulled by a handle, and the moving block drives the electrode to move outward synchronously, and then the electrode can be replaced or the rotating block can be moved, and the movement of the rotating block can drive the electrode to adjust its position, and then the handle is released and a spring will push the electrode to contact the electric connection ring to complete the replacement of the electrode, and at the same time, the position of the electrode that has completed the position adjustment can be fixed, and at this time, the electrode will be fixed in a direction close to the installation position to avoid bending and causing damage to it.

Description

Technical Field

[0001] The invention relates to the field of thick film resistors, in particular to a high temperature resistant chip type thick film resistor. Background Art

[0002] Thick film resistors are a type of resistor that features a thick film resistive layer on a ceramic base. The construction of thick film resistors can be accomplished by applying a screen printed conductive paste onto an insulating substrate. This conductive paste can be fired to form a permanent connection.

[0003] The electrodes of the existing thick film resistors are fixedly connected to the shell and partially exposed. As the installation position changes, the electrodes need to be bent to adjust their angles and positions, and this operation can easily cause damage to the electrodes. The thick film resistors with electrodes fixedly installed on the shell cannot be repaired, so they need to be replaced as a whole. In order to solve the above problems, it is necessary to propose a high temperature resistant chip thick film resistor. Summary of the invention

[0004] In view of the problems in the prior art, the present invention provides a high temperature resistant chip thick film resistor.

[0005] The technical solution adopted by the present invention to solve its technical problem is: a high temperature resistant chip thick film resistor, including a resistor mechanism, a rotating mechanism is arranged on the outer wall of the resistor mechanism, two pushing mechanisms are arranged inside the rotating mechanism, and a wiring mechanism is arranged inside each of the two pushing mechanisms.

[0006] Specifically, the resistor mechanism includes a shell, a resistor is fixedly installed inside the shell, a high temperature resistant sheet is fixedly connected to the lower surface of the shell and the resistor, and an electrical connection ring is fixedly installed on the outer wall of the resistor.

[0007] Specifically, the rotating mechanism includes an annular rotating groove, which is opened on the outer wall of the shell, and four support rods are fixedly connected to the groove wall of the rotating groove, and two support rings are jointly fixed at one end of the four support rods away from the groove wall of the rotating groove, and two rotating blocks are rotatably connected in the rotating groove, and a support hole is penetrated through the two rotating blocks, and the two rotating blocks are slidably connected to the two support rings through the two support holes respectively.

[0008] Specifically, the two pushing mechanisms each include a moving hole, the two moving holes are respectively opened on the two rotating blocks, and a moving block is slidably connected in the two moving holes, an annular groove is opened on the hole wall of the two moving holes, and an annular block is slidably connected in the two annular grooves, the two annular blocks are respectively fixedly sleeved on the outer walls of the two moving blocks, and a spring is sleeved on the outer walls of the two moving blocks, one end of the two springs respectively abuts against the two annular blocks, and the ends of the two springs away from the annular blocks respectively abut against the groove walls of the two annular grooves, one end of the two moving blocks extends through and outside the outer shell, and the ends of the two moving blocks located outside the outer shell are fixedly connected to a handle.

[0009] Specifically, a placement groove is provided on the upper surface of the two moving blocks, a plug hole is provided through the groove wall of the two placement grooves, and a through hole is provided through the groove wall of the two placement grooves away from the plug hole.

[0010] Specifically, the wiring mechanism includes two card blocks and two mounting grooves, the two card blocks are respectively slidably connected in the two placement grooves, and a connector is fixedly connected to the position of the two card blocks corresponding to the two sockets, the ends of the two connectors away from the card blocks respectively penetrate the corresponding sockets and extend into the rotating groove, the two connectors are both abutted against the power connection ring, the ends of the two card blocks away from the connectors are fixedly connected with an electrode connector, the two electrode connectors respectively penetrate the corresponding through holes and extend outside the shell, the two mounting grooves are respectively opened on the upper surfaces of the two rotating blocks, and a rotating shaft is fixedly installed in the two mounting grooves, and a baffle plate is fixedly sleeved on the two rotating shafts.

[0011] Specifically, the upper surface and the lower surface of the two rotating blocks are provided with a plurality of ball grooves, each of which is rollingly connected with a ball, and one end of each of the balls extends through the rotating block and abuts against the groove wall of the rotating groove.

[0012] Specifically, the two installation grooves are respectively connected to the two placement grooves, and the two baffle plates extend through the two placement grooves respectively, and one end of the two baffle plates located in the placement grooves respectively abuts against the upper surfaces of the two card blocks.

[0013] Beneficial effects of the present invention:

[0014] (1) The high temperature resistant chip thick film resistor described in the present invention is provided with a resistor mechanism, a rotating mechanism, a pushing mechanism and a wiring mechanism. When the electrode needs to be replaced, the movable block can be pulled out of the movable hole by the handle, so that the placement slot and the installation slot are exposed. At this time, the baffle plate can be lifted and the limit on the card block can be released. At this time, the card block and the electrode can be taken out and replaced. After that, the handle is released and the spring will push the movable block to reset, and the movable hole will limit the baffle plate, so that the baffle plate descends and closes the placement slot, thereby fixing the card block and the electrode, and the pushing block will push it to abut against the power connection ring, so that the resistor is connected to the external electrode and can be directly replaced when damaged.

[0015] (2) The high temperature resistant chip thick film resistor described in the present invention is provided with a resistance mechanism, a rotating mechanism, a pushing mechanism and a wiring mechanism. When adjustment is needed, the moving block can be pulled by the handle, and the moving block will drive the electrode to move outward synchronously, and the electrode will be released from the contact with the power ring. At this time, the rotating block can be pushed, and the rotating block will move on the supporting ring through the supporting hole, thereby moving the rotating block and the electrode to a place close to the installation position, and then the handle is released and the spring will push the device to reset and use it normally, thereby avoiding damage to the electrode caused by bending in multiple directions. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0017] Figure 1 A schematic diagram of the structure of a high temperature resistant chip thick film resistor provided by the present invention in an installed state;

[0018] Figure 2 A schematic diagram of the structure of an electrode position adjustment state of a high temperature resistant thick film chip resistor provided by the present invention;

[0019] Figure 3 A schematic diagram of the electrode replacement state structure of a high temperature resistant chip thick film resistor provided by the present invention;

[0020] Figure 4 A high temperature resistant thick film resistor provided by the present invention Figure 1 Schematic diagram of the internal structure viewed from above at AA in the middle;

[0021] Figure 5 A high temperature resistant thick film resistor provided by the present invention Figure 1 Schematic diagram of the rotating block structure in ;

[0022] Figure 6 A high temperature resistant thick film resistor provided by the present invention Figure 2 Schematic diagram of the rotating block structure in ;

[0023] Figure 7A high temperature resistant thick film resistor provided by the present invention Figure 3 Schematic diagram of the rotating block structure in .

[0024] In the figure: 1. resistance mechanism; 11. shell; 12. resistor; 13. high temperature resistant sheet; 14. connecting ring; 2. rotating mechanism; 21. rotating groove; 22. support rod; 23. support ring; 24. rotating block; 25. supporting hole; 26. ball groove; 27.; ball 3. pushing mechanism; 31. moving hole; 32. moving block; 33. annular groove; 34. annular block; 35. spring; 36. handle; 37. placement groove; 38. jack; 39. through hole; 4. wiring mechanism; 41. block; 42. mounting groove; 43. joint; 44. electrode joint; 45. rotating shaft; 46. baffle plate. DETAILED DESCRIPTION

[0025] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0026] like Figure 1-Figure 7 As shown, a high temperature resistant chip thick film resistor described in the present invention includes a resistor mechanism 1, a rotating mechanism 2 is arranged on the outer wall of the resistor mechanism 1, two pushing mechanisms 3 are arranged inside the rotating mechanism 2, and a wiring mechanism 4 is arranged inside each of the two pushing mechanisms 3.

[0027] The resistor mechanism 1 includes a housing 11, a resistor 12 is fixedly installed inside the housing 11, a high temperature resistant sheet 13 is fixedly connected to the lower surface of the housing 11 and the resistor 12, and a power connection ring 14 is fixedly installed on the outer wall of the resistor 12. The rotating mechanism 2 includes an annular rotating groove 21, the rotating groove 21 is opened on the outer wall of the housing 11, and four support rods 22 are fixedly connected to the groove wall of the rotating groove 21, and two support rings 23 are fixed to one end of the four support rods 22 away from the groove wall of the rotating groove 21, and two rotating blocks 24 are rotatably connected in the rotating groove 21, and a support hole 25 is opened through the two rotating blocks 24. The two rotating blocks 24 are slidably connected to the two supporting rings 23 through the two supporting holes 25 respectively. The moving block 32 is pulled by the handle 36, and the moving block 32 moves outward in the moving hole 31, and the placement groove 37 and the through hole 39 on the moving block 32 are separated from the moving hole 31, and the moving block 32 drives the card block 41, the connector 43 and the electrode connector 44 to move outward synchronously. When the connector 43 is released from the contact with the power ring 14, the rotating block 24 can be directly moved on the supporting ring 23, and the rotating block 24 drives the electrode connector 44 to move close to the installation position, so as to facilitate the installation of the electrode connector 44 while reducing bending.

[0028] Among them, the two pushing mechanisms 3 each include a moving hole 31, the two moving holes 31 are respectively opened on the two rotating blocks 24, and a moving block 32 is slidably connected in the two moving holes 31, an annular groove 33 is opened on the hole wall of the two moving holes 31, and an annular block 34 is slidably connected in the two annular grooves 33, the two annular blocks 34 are respectively fixedly sleeved on the outer side walls of the two moving blocks 32, and a spring 35 is sleeved on the outer side walls of the two moving blocks 32, one end of the two springs 35 is respectively against the two annular blocks 34, and the ends of the two springs 35 away from the annular blocks 34 are respectively against the groove walls of the two annular grooves 33, one end of the two moving blocks 32 extends through the shell 11, and the two moving The ends of the blocks 32 located outside the housing 11 are fixedly connected with a handle 36, the upper surfaces of the two movable blocks 32 are provided with a placement groove 37, the groove walls of the two placement grooves 37 are penetrated with a plug hole 38, and the groove walls of the two placement grooves 37 away from the plug hole 38 are penetrated with a through hole 39, the wiring mechanism 4 includes two card blocks 41 and two installation grooves 42, the two card blocks 41 are respectively slidably connected in the two placement grooves 37, and the positions of the two card blocks 41 corresponding to the two plug holes 38 are fixedly connected with a connector 43, the ends of the two connectors 43 away from the card blocks 41 respectively penetrate the corresponding plug holes 38 and extend into the rotating groove 21, the two connectors 43 are both against the power ring 14, and the two card blocks 41 away from the connectors 43 One end of each of the two rotating blocks 24 is fixedly connected with an electrode connector 44, and the two electrode connectors 44 respectively penetrate the corresponding through holes 39 and extend to the outside of the housing 11. Two mounting grooves 42 are respectively provided on the upper surfaces of the two rotating blocks 24, and a rotating shaft 45 is fixedly installed in each of the two mounting grooves 42. A baffle plate 46 is fixedly sleeved on each of the two rotating shafts 45. The moving block 32 is pulled by the handle 36, and the moving block 32 will move outward in the moving hole 31, and the placement groove 37 and the through hole 39 on the moving block 32 will be separated from the moving hole 31, and the moving block 32 will drive the card block 41, the connector 43 and the electrode connector 44 to move outward synchronously, and then the baffle plate 46 can be pulled upward, and the baffle plate 46 rotates based on the rotating shaft 45 and opens the placement groove 37 At this time, the card block 41 can be pulled upward, and the card block 41 drives the connector 43 and the electrode connector 44 to move synchronously and be taken out of the placement groove 37, and then the replaced card block 41, connector 43 and electrode connector 44 are placed in the placement groove 36, jack 38 and through hole 39. At this time, the handle 36 can be released, and the spring 35 will push the annular block 34 under the support of the annular groove 33, and the annular block 34 will drive the moving block 32 to move into the moving hole 31, and the baffle plate 46 will be reset under the push of the opening of the moving hole 31 and cover the notch of the placement groove 37, so as to clamp and fix the card block 41 and complete the replacement of the electrode without directly replacing the thick film resistor, and the moving block 32 will push the card block 41 through the groove wall of the placement groove 37,The block 41 pushes the connector 43 against the electrical ring 14, thereby connecting the electrode connector 44 and the resistor 12.

[0029] Among them, the upper surface and the lower surface of the two rotating blocks 24 are both provided with a plurality of ball grooves 26, and a ball 27 is rollingly connected in each of the plurality of ball grooves 26. One end of each of the plurality of balls 27 extends through the rotating block 24 and abuts against the groove wall of the rotating groove 21. The rotating block 24 is supported by the ball 27 when moving, and the ball 27 drives the rotating block 24 to move by rolling in the rotating groove 21, so that the movement of the rotating block 24 is relatively simple and convenient.

[0030] Among them, the two installation grooves 42 are respectively connected to the two placement grooves 37, and the two baffle plates 46 extend through the two placement grooves 37 respectively. One end of the two baffle plates 46 located in the placement groove 37 is respectively against the upper surface of the two blocking blocks 41, so that the baffle plates 46 can be rotated and dropped into the placement groove 37 and close the slot of the placement groove 36.

[0031] When in use, first pull the moving block 32 through the handle 36, and the moving block 32 will move outward in the moving hole 31, and make the placement groove 37 and the through hole 39 on the moving block 32 disengage from the moving hole 31, and the moving block 32 will drive the card block 41, the connector 43 and the electrode connector 44 to move outward synchronously, and when the connector 43 is released from the contact with the power ring 14, the rotating block 24 can be directly moved on the support ring 23, and the rotating block 24 drives the electrode connector 44 to move close to the installation position, so as to facilitate the installation of the electrode connector 44 with reduced bending, and then the baffle plate 46 can be lifted upward, and the baffle plate 46 rotates based on the rotating shaft 45 and opens the placement groove 37, at this time, the card block 41 can be pulled upward, and the card block 41 drives the connector 43 and the electrode connector 44 to move synchronously and be taken out of the placement groove 37, and then Place the replaced card block 41, connector 43 and electrode connector 44 into the placement groove 36, jack 38 and through hole 39. At this time, the handle 36 can be loosened. At this time, the spring 35 will push the annular block 34 under the support of the annular groove 33, and the annular block 34 will drive the moving block 32 to move into the moving hole 31, and the baffle plate 46 will be reset under the push of the opening of the moving hole 31 and cover the slot of the placement groove 37, so as to clamp and fix the card block 41 and complete the replacement of the electrode to avoid directly replacing the thick film resistor, and the moving block 32 will push the card block 41 through the groove wall of the placement groove 37, and the card block 41 will push the connector 43 to resist the power ring 14, so as to connect the electrode connector 44 and the resistor 12, so that the electrode can be fixed in the direction close to the installation position, thereby avoiding damage to the electrode caused by bending in multiple directions.

[0032] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A high temperature resistant chip thick film resistor, comprising a resistor mechanism (1), characterized in that: A rotating mechanism (2) is arranged on the outer wall of the resistance mechanism (1), two pushing mechanisms (3) are arranged inside the rotating mechanism (2), and a wiring mechanism (4) is arranged inside each of the two pushing mechanisms (3); The resistor mechanism (1) comprises a housing (11), and a resistor (12) is fixedly installed inside the housing (11); The rotating mechanism (2) comprises an annular rotating groove (21), and two rotating blocks (24) are rotatably connected in the rotating groove (21); The two pushing mechanisms (3) each include a moving hole (31), the two moving holes (31) are respectively formed through the two rotating blocks (24), and a moving block (32) is slidably connected in the two moving holes (31), an annular groove (33) is formed on the hole wall of the two moving holes (31), and an annular block (34) is slidably connected in the two annular grooves (33), the two annular blocks (34) are respectively fixedly sleeved on the outer side walls of the two moving blocks (32), and a spring (35) is sleeved on the outer side walls of the two moving blocks (32); The wiring mechanism (4) comprises two card blocks (41) and two mounting grooves (42). The two card blocks (41) are respectively slidably connected in the two placement grooves (37), and the two card blocks (41) are fixedly connected to a connector (43) at positions corresponding to the two plug holes (38). The ends of the two connectors (43) away from the card blocks (41) respectively penetrate the corresponding plug holes (38) and extend into the rotating groove (21). The two connectors (43) are both against the power connection ring (14). The ends of the two card blocks (41) away from the connectors (43) are fixedly connected to an electrode connector (44). The two electrode connectors (44) respectively penetrate the corresponding through holes (39) and extend to the outside of the housing (11).

2. The high temperature resistant chip thick film resistor according to claim 1, characterized in that: A high temperature resistant sheet (13) is fixedly connected to the lower surface of the housing (11) and the resistor (12), and an electric connection ring (14) is fixedly mounted on the outer wall of the resistor (12).

3. The high temperature resistant chip thick film resistor according to claim 1, characterized in that: The rotating groove (21) is formed on the outer wall of the housing (11), and four support rods (22) are fixedly connected to the groove wall of the rotating groove (21), and two support rings (23) are fixed to one end of the four support rods (22) away from the groove wall of the rotating groove (21), and a support hole (25) is formed through each of the two rotating blocks (24), and the two rotating blocks (24) are slidably connected to the two support rings (23) through the two support holes (25).

4. The high temperature resistant chip thick film resistor according to claim 1, characterized in that: One end of the two springs (35) respectively abuts against the two annular blocks (34), and one end of the two springs (35) away from the annular blocks (34) respectively abuts against the groove walls of the two annular grooves (33). One end of the two moving blocks (32) extends through the outside of the outer shell (11), and one end of the two moving blocks (32) located outside the outer shell (11) is fixedly connected to a handle (36).

5. The high temperature resistant chip thick film resistor according to claim 1, characterized in that: A placement groove (37) is provided on the upper surface of the two moving blocks (32), a plug hole (38) is provided through the groove wall of the two placement grooves (37), and a through hole (39) is provided through the groove wall of the two placement grooves (37) on the side away from the plug hole (38).

6. The high temperature resistant chip thick film resistor according to claim 1, characterized in that: The two installation grooves (42) are respectively arranged on the upper surfaces of the two rotating blocks (24), and a rotating shaft (45) is fixedly installed in each of the two installation grooves (42). A baffle plate (46) is fixedly sleeved on each of the two rotating shafts (45). The two installation grooves (42) are respectively connected to the two placement grooves (37), and the two baffle plates (46) respectively extend through the two placement grooves (37), and one end of the two baffle plates (46) located in the placement groove (37) respectively abuts against the upper surfaces of the two clamping blocks (41).

7. The high temperature resistant chip thick film resistor according to claim 1, characterized in that: A plurality of ball grooves (26) are provided on the upper surface and the lower surface of the two rotating blocks (24), each of the plurality of ball grooves (26) is rollingly connected with a ball (27), and one end of each of the plurality of balls (27) extends through the rotating block (24) to the outside and abuts against the groove wall of the rotating groove (21).

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