An IGBT chip

Abstract

The present invention discloses an IGBT chip, which relates to the field of chip technology, and comprises a chip body arranged on a DCB substrate, wherein the side wall of the chip body is fixedly connected with a first hollow cover, and the top of the first hollow cover is fixedly connected with a second hollow cover, the first hollow cover and the second hollow cover are filled with cooling liquid, and the side wall of the first hollow cover is inserted with a plurality of swing tubes arranged in an array. After the bonding is completed, this kind of IGBT chip can reciprocately knock and vibrate the bonding wire, which is not only convenient for eliminating the internal stress, but also can test the strength of its bonding to ensure the quality of the bonding. At the same time, it can detect the quality of the bonding wire after bonding, and when a bonding leak occurs, it can also be detected to ensure the quality of the bonding, and it can have a good cooling effect on the chip body and the bonding wire to ensure its use effect and life.

Description

Technical Field

[0001] The present invention relates to the technical field of chips, in particular to an IGBT chip. Background Art

[0002] IGBT chip, that is, insulated gate bipolar transistor, is a composite fully controlled voltage-driven power semiconductor device. It combines the advantages of high input impedance of MOSFET (metal oxide semiconductor field effect transistor) and low on-state voltage drop of GTR (thyristor). It has the advantages of high input impedance, low driving power, simple control circuit, fast switching speed, high operating frequency, good thermal stability, wide safe working area, and high current and voltage carrying capacity. It has been more and more widely used in modern power electronics technology and power electronics technology. The IGBT chip is installed and fixed on the DCB substrate. After installation, the IGBT chip and the DCB substrate are bonded and connected by a bonding machine. After the bonding is completed, the IGBT chip and the DCB substrate need to be packaged.

[0003] However, when the existing IGBT chip is in use, after the bonding is completed, the bonding wire has inherent stress, which affects the effect and stability of its connection, and further affects the use effect and life of the IGBT chip. At the same time, when the bonding wire falls off or the bonding is missed, it is not easy to be discovered, which will also affect the use effect and life of the IGBT chip. Moreover, after the packaging is completed, the heat dissipation effect of the IGBT chip and the bonding wire is poor, which will also affect the use effect and life of the IGBT chip.

[0004] To this end, we propose an IGBT chip. Summary of the invention

[0005] The object of the present invention is to provide an IGBT chip to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an IGBT chip, comprising a chip body arranged on a DCB substrate, the side wall of the chip body is fixedly connected to a first hollow cover, and the top of the first hollow cover is fixedly connected to a second hollow cover, the first hollow cover and the second hollow cover are filled with coolant, and the side wall of the first hollow cover is inserted with a plurality of swing tubes arranged in an array, each of the swing tubes is rotationally connected to the side wall of the first hollow cover through a first rotating mechanism, and one end of each swing tube away from the first hollow cover is fixedly connected to a third hollow cover, the top of the third hollow cover is provided with an inclined surface, and the side wall of the third hollow cover is fixedly inserted with a hollow conical tube, each of the swing tubes is connected to the inner side wall of the first hollow cover through a first reset mechanism, and the swinging of the swing tube is pushed by a first pushing mechanism, and the side wall of the first hollow cover is provided with a plurality of detection mechanisms for detecting the welding quality of the bonding wire.

[0007] Preferably, the detection mechanism comprises a plurality of circular holes arranged in an array and opened on the side wall of the first hollow cover, wherein a marking rod is inserted into the circular hole, and the movement of the marking rod is driven by the second driving mechanism.

[0008] Preferably, the first reset mechanism comprises a fixing ring fixedly sleeved on the side wall of the swing tube, the side wall of the swing tube is sleeved with a first spring, and two ends of the first spring are respectively fixed to the fixing ring and the first hollow cover.

[0009] Preferably, the first pushing mechanism includes a fixing rod fixedly connected to the top of the fixing ring, and the upper end of the fixing rod is connected to the pushing rod through the second rotating mechanism, the inner side wall of the first hollow cover is fixedly connected to a plurality of pushing plates arranged in an array, and a strip opening is provided on the top of the pushing plate, a first slide groove is provided at one end of the strip opening, and an inclined groove is provided at the other end of the first slide groove, the pushing rod can slide in the inclined groove, the first slide groove and the strip opening, two opposite side walls of the strip opening are fixedly connected to a plurality of first triangular blocks and a second triangular blocks arranged in an array, and the pushing rod can slide on the side walls of the first triangular block and the second triangular block.

[0010] Preferably, the second rotating mechanism includes two symmetrically arranged fixed blocks fixedly connected to the upper end of the fixed rod, and the side walls of the fixed blocks are rotatably connected to the rotating blocks via a rotating shaft, the rotating blocks are fixed to the lower end of the push rod, and the rotation of the rotating shaft is driven by a driving mechanism.

[0011] Preferably, the driving mechanism comprises a gear fixedly sleeved on the side wall of the rotating shaft, the side wall of the fixed block is connected with a rack through a second reset mechanism, and the rack is meshed with the gear.

[0012] Preferably, the second reset mechanism includes two symmetrically arranged connecting blocks fixedly connected to the side walls of the fixed block, and the opposite side walls of the two connecting blocks are fixedly connected to two symmetrically arranged guide rods, the side wall of each guide rod is sleeved with a slider, the slider is fixed to the side wall of the rack, and the side wall of each guide rod is sleeved with a second spring.

[0013] Preferably, the first rotating mechanism comprises a plurality of mounting holes arranged in an array and opened on the side wall of the first hollow cover, a rubber ring is fixedly inserted in the mounting hole, and the swing tube is fixedly inserted in the rubber ring.

[0014] Preferably, the second pushing mechanism includes a pushing pin fixedly connected to the side wall of the identification rod, and the side wall of the identification rod is sleeved with a third spring, the two ends of the third spring are respectively fixed to the first hollow cover and the side wall of the pushing pin, and a rotating plate is rotatably connected in the first hollow cover through multiple third rotating mechanisms, a second sliding groove is opened on the top of the rotating plate, and the pushing pin is inserted in the second sliding groove.

[0015] Preferably, each of the third rotating mechanisms comprises a support block fixedly connected to the inner side wall of the first hollow cover, and the rotating plate is rotatably connected to the side wall of the support block via a rotating pin.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention sets a first pushing mechanism, etc., and after the chip body and the DCB substrate are fixed, it is necessary to perform a bonding operation on them and the DCB substrate. During the bonding, a bonding machine is required to perform the bonding operation. When the bonding head abuts against the inclined surface, the third hollow cover is pushed to move in a direction close to the first hollow cover. At the same time, the first spring is compressed, and the pushing rod is driven to move synchronously by the fixed rod and the second rotating mechanism, so that the pushing rod can be pushed to gradually slide from the inclined groove into the first sliding groove, and the swing tube and the third hollow cover can be rotated to a state parallel to the pushing plate, and then slide along the strip opening. At the same time, when the pushing rod slides in the strip opening, the pushing rod abuts against the side walls of the first triangular block and the second triangular block in turn, pushing the pushing rod to rotate clockwise along the rotating shaft. The rotation of the rotating shaft drives the rotation of the gear and pushes the rack to move along the guide rod. The second spring is compressed. At this time, the fixed rod will not be pushed to move. When the pushing rod passes over the first triangular block and the second triangular block When the locking cam is in a state of being moved downwardly along the side wall of the conical tube, the third hollow cover and the swing tube are pushed to swing away from the locking cam. At the same time, the pushing rod can move in the strip-shaped opening and make the locking cam move to the locking position to realize the locking operation. After the locking cam is completed, when the locking cam is gradually separated from the conical tube and the third hollow cover, the swing tube can move and reset under the action of the first spring, and drive the fixing ring and the fixing rod to move synchronously. At the same time, the pushing rod is driven by the second rotating mechanism to slide on the side walls of the second triangular block and the first triangular block in turn. At this time, since the rack abuts against the side wall of the connecting block, the pushing rod is ensured not to rotate counterclockwise along the rotating shaft, thereby pushing the swing tube to swing back and forth along the rubber ring, and driving the third hollow cover and the conical tube to swing back and forth, so that the conical tube can reciprocately knock and vibrate the bonding line after bonding, which is not only convenient for eliminating the internal stress, but also can test the bonding strength to ensure the bonding quality.

[0018] The present invention is provided with a detection mechanism and a second pushing mechanism, etc., so that after the bonding is completed and the bonding wire is knocked and vibrated, the pushing rod can be pushed to slide along the first slide groove into the inclined groove, at which time, the swing tube can be driven to rotate and tilt, and the third hollow cover and the conical tube can be driven to tilt. If the bonding wire does not fall off after the knocking and vibration, the conical tube will abut against the side wall of the bonding wire, so that the swing tube cannot rotate and tilt, and the pushing rod cannot slide into the inclined groove. If the bonding is missed or the bonding wire falls off after the knocking and vibration, the pushing rod can When the rotating plate rotates, the pushing pin slides along the second slide groove and pushes the marking rod to move outward along the circular hole. The third spring is compressed. At this time, the extended state of the marking rod can be detected by the visual sensor arranged on the bonding head, so as to detect the quality of the bonding wire after bonding, and when a missing bond occurs, it can also be detected to ensure the quality of bonding.

[0019] The present invention provides a first hollow cover and an oscillating tube, etc., and after bonding is completed, a packaging operation needs to be performed on a DCB substrate and a chip body. After packaging is completed, the upper end of the second hollow cover is exposed to the outside, and cooling liquid is filled in the second hollow cover, the first hollow cover, the oscillating tube, the third hollow cover and the tapered tube. Moreover, the second hollow cover, the first hollow cover, the oscillating tube, the third hollow cover and the tapered tube are made of a material with strong thermal conductivity but insulation, such as thermal conductive silica gel, etc., to ensure the thermal conductivity effect while ensuring the insulation effect, so that a good cooling effect can be achieved on the chip body and the bonding wire, thereby ensuring the use effect and life of the chip body and the bonding wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the use state of the present invention;

[0021] Figure 2 It is a partial cross-sectional structural schematic diagram of the first hollow cover in the present invention;

[0022] Figure 3 It is a schematic diagram of the position of the detection mechanism in the present invention;

[0023] Figure 4 for Figure 1 Enlarged view of point A in the middle;

[0024] Figure 5 for Figure 2 Enlarged view of point B in the middle;

[0025] Figure 6 for Figure 3 Enlarged view of point C in the middle;

[0026] Figure 7 for Figure 4 Enlarged view of point D in the middle;

[0027] Figure 8 for Figure 5 Enlarged view of point E in the middle;

[0028] Fig. 9 for Figure 6 Enlarged view of point F in the middle;

[0029] Fig.10 for Figure 8 Enlarged view of point G in the middle;

[0030] Fig.11 for Figure 8 Enlarged view of point H in the middle.

[0031] In the figure: 1, DCB substrate; 2, first reset mechanism; 201, fixed ring; 202, first spring; 3, first push mechanism; 301, fixed rod; 302, push rod; 303, push plate; 304, strip opening; 305, inclined groove; 306, first slide groove; 307, first triangular block; 308, second triangular block; 4, second rotating mechanism; 401, fixed block; 402, rotating shaft; 403, rotating block; 5, driving mechanism; 501, gear; 502, rack; 6, second reset mechanism; 601, connecting block; 602, guide rod; 60 3. Slider; 604. Second spring; 7. First rotating mechanism; 701. Mounting hole; 702. Rubber ring; 8. Detection mechanism; 801. Round hole; 802. Marking rod; 9. Second pushing mechanism; 901. Third spring; 902. Rotating plate; 903. Second slide groove; 904. Push pin; 10. Third rotating mechanism; 1001. Support block; 1002. Rotating pin; 11. Chip body; 12. First hollow cover; 13. Swinging tube; 14. Third hollow cover; 1401. Inclined surface; 15. Conical tube; 16. Bonding wire; 17. Second hollow cover. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] See also Figure 1-Figure 11An IGBT chip shown in the figure includes a chip body 11 arranged on a DCB substrate 1, a first hollow cover 12 is fixedly connected to the side wall of the chip body 11, and a second hollow cover 17 is fixedly connected to the top of the first hollow cover 12, the first hollow cover 12 and the second hollow cover 17 are filled with cooling liquid, and a plurality of array-arranged swing tubes 13 are inserted into the side wall of the first hollow cover 12, each swing tube 13 is rotationally connected to the side wall of the first hollow cover 12 through a first rotating mechanism 7, and an end of each swing tube 13 away from the first hollow cover 12 is fixedly connected to a third hollow cover 14, a slope 1401 is arranged on the top of the third hollow cover 14, and a hollow conical tube 1 is fixedly inserted into the side wall of the third hollow cover 14 5. Each swing tube 13 is connected to the inner wall of the first hollow cover 12 through the first reset mechanism 2, and the swing of the swing tube 13 is driven by the first driving mechanism 3. The side wall of the first hollow cover 12 is provided with a plurality of detection mechanisms 8 for detecting the welding quality of the bonding wire 16. After the bonding is completed, the bonding wire 16 can be reciprocated and vibrated, which is not only convenient for eliminating the internal stress, but also can test the bonding strength to ensure the bonding quality. At the same time, the quality of the bonding wire 16 after bonding can be detected, and when a missing bond occurs, it can also be detected to ensure the bonding quality. In addition, it can have a good cooling effect on the chip body 11 and the bonding wire 16 to ensure its use effect and life.

[0034] The detection mechanism 8 includes a plurality of circular holes 801 arranged in an array on the side wall of the first hollow cover 12, an identification rod 802 is inserted in the circular hole 801, and the movement of the identification rod 802 is driven by the second driving mechanism 9. If the bonding wire 16 falls off due to missed bonding or knocking or vibration, the identification rod 802 will be pushed outward along the circular hole 801 by the second driving mechanism 9. At this time, the extended state of the identification rod 802 can be detected by the visual sensor arranged on the bonding head, so as to detect the quality of the bonding wire 16 after bonding, and when missed bonding occurs, it can also be detected to ensure the quality of bonding.

[0035] The first reset mechanism 2 includes a fixed ring 201 fixedly mounted on the side wall of the swing tube 13. The side wall of the swing tube 13 is sleeved with a first spring 202, and both ends of the first spring 202 are respectively fixed to the fixed ring 201 and the first hollow cover 12, so as to reset the movement and swing of the swing tube 13.

[0036] The first pushing mechanism 3 includes a fixing rod 301 fixedly connected to the top of the fixing ring 201, and the upper end of the fixing rod 301 is connected to the pushing rod 302 through the second rotating mechanism 4, and the inner side wall of the first hollow cover 12 is fixedly connected to a plurality of pushing plates 303 arranged in an array, and a strip opening 304 is provided on the top of the pushing plate 303, a first slide groove 306 is provided at one end of the strip opening 304, and an inclined groove 305 is provided at the other end of the first slide groove 306, and the pushing rod 302 can slide in the inclined groove 305, the first slide groove 306 and the strip opening 304, and the two opposite side walls of the strip opening 304 are fixedly connected to a plurality of The first triangular block 307 and the second triangular block 308 are arranged in an array, and the push rod 302 can slide on the side walls of the first triangular block 307 and the second triangular block 308. When bonding, a bonding machine is required to perform the bonding operation. When the bonding head abuts against the inclined surface 1401, the third hollow cover 14 is pushed to move in the direction close to the first hollow cover 12. At the same time, the first spring 202 is compressed, and the push rod 302 is driven to move synchronously through the fixed rod 301 and the second rotating mechanism 4, so that the push rod 302 can be pushed to gradually slide from the inclined groove 305 to the first sliding groove 306. When the swing tube 13 and the third hollow cover 14 can be rotated to a state parallel to the push plate 303, and then slides along the strip opening 304. At the same time, when the push rod 302 slides in the strip opening 304, the push rod 302 is abutted against the side walls of the first triangular block 307 and the second triangular block 308 in turn. At this time, under the action of the second rotating mechanism 4, the push rod 302 is pushed to rotate clockwise along the rotating shaft 402. At this time, the fixed rod 301 will not be pushed to move. After the bonding is completed, when the bonding head gradually separates from the conical tube 15 and the third hollow cover 14, the swing tube 13 can be moved back and forth under the action of the first spring 202. The second rotating mechanism 4 drives the push rod 302 to slide on the side walls of the second triangular block 308 and the first triangular block 307 in turn. At this time, the push rod 302 will not rotate counterclockwise along the rotating shaft 402, thereby pushing the swing tube 13 to swing back and forth along the rubber ring 702, and driving the third hollow cover 14 and the conical tube 15 to swing back and forth, so that the conical tube 15 can reciprocate and knock and vibrate the bonded bonding wire 16, which is not only convenient for eliminating the internal stress, but also can test the bonding strength to ensure the bonding quality.

[0037] The second rotating mechanism 4 includes two symmetrically arranged fixed blocks 401 fixedly connected to the upper end of the fixed rod 301, and the side walls of the fixed blocks 401 are rotatably connected to the rotating blocks 403 via the rotating shaft 402. The rotating blocks 403 are fixed to the lower end of the pushing rod 302, and the rotation of the rotating shaft 402 is driven by the driving mechanism 5 to ensure that the pushing rod 302 can rotate at the upper end of the fixed rod 301.

[0038] The driving mechanism 5 includes a gear 501 fixedly mounted on the side wall of the rotating shaft 402. The side wall of the fixed block 401 is connected to a rack 502 through a second reset mechanism 6, and the rack 502 is meshed with the gear 501. When the rotating shaft 402 rotates clockwise, the rotation drives the gear 501 to rotate and pushes the rack 502 to move on the second reset mechanism 6. Moreover, under the action of the second reset mechanism 6, the rotating shaft 402 cannot rotate counterclockwise.

[0039] The second reset mechanism 6 includes two symmetrically arranged connecting blocks 601 fixedly connected to the side walls of the fixed block 401, and the opposite side walls of the two connecting blocks 601 are fixedly connected to two symmetrically arranged guide rods 602, and the side wall of each guide rod 602 is sleeved with a slider 603, and the slider 603 is fixed to the side wall of the rack 502, and the side wall of each guide rod 602 is sleeved with a second spring 604, which guides and resets the movement of the rack 502 and can limit the movement of the rack 502.

[0040] The first rotating mechanism 7 includes a plurality of mounting holes 701 arranged in an array on the side wall of the first hollow cover 12 . A rubber ring 702 is fixedly inserted in the mounting hole 701 , and the swing tube 13 is fixedly inserted in the rubber ring 702 to ensure the normal swing of the swing tube 13 .

[0041] The second pushing mechanism 9 includes a pushing pin 904 fixedly connected to the side wall of the identification rod 802, and the side wall of the identification rod 802 is sleeved with a third spring 901, and the two ends of the third spring 901 are respectively fixed to the first hollow cover 12 and the side wall of the pushing pin 904, and the first hollow cover 12 is rotatably connected with a rotating plate 902 through a plurality of third rotating mechanisms 10, and a second slide groove 903 is provided on the top of the rotating plate 902, and the pushing pin 904 is inserted in the second slide groove 903. After the bonding is completed, after the knocking and vibration of the bonding wire 16 is completed, the pushing rod 302 can be pushed to slide along the first slide groove 306 into the inclined groove 305. At this time, the swing tube 13 can be driven to rotate and tilt, and the third hollow cover 14 and the conical tube 15 can be driven to tilt. If the bonding wire 16 does not fall off after the knocking and vibration, at this time, the conical tube 15 will abut against the side wall of the bonding wire 16, so that The swing tube 13 cannot rotate and tilt, and the push rod 302 cannot slide into the inclined groove 305. If the bonding is missed or the bonding wire 16 falls off after being knocked and vibrated, the push rod 302 can slide into the inclined groove 305, so that the swing tube 13 rotates and tilts. At the same time, the fixed rod 301 can abut against the side wall of the rotating plate 902, thereby pushing the rotating plate 902 to rotate along the third rotating mechanism 10. When the rotating plate 902 rotates, the push pin 904 slides along the second slide groove 903 and pushes the identification rod 802 to move outward along the circular hole 801. The third spring 901 is compressed. At this time, the extended state of the identification rod 802 can be detected by the visual sensor arranged on the bonding head, so as to detect the quality of the bonding wire 16 after bonding, and when a missed bonding occurs, it can also be detected to ensure the quality of the bonding.

[0042] Each third rotating mechanism 10 includes a support block 1001 fixedly connected to the inner wall of the first hollow cover 12, and the rotating plate 902 is rotatably connected to the side wall of the support block 1001 through a rotating pin 1002, which guides and resets the rotation of the rotating plate 902.

[0043] Working principle: When in use, after the chip body 11 is fixed to the DCB substrate 1, it is necessary to perform a bonding operation on it and the DCB substrate 1. During bonding, a bonding machine is required to perform the bonding operation. When the bonding head abuts against the inclined surface 1401, the third hollow cover 14 is pushed to move in the direction close to the first hollow cover 12. At the same time, the first spring 202 is compressed, and the push rod 302 is driven to move synchronously through the fixing rod 301 and the second rotating mechanism 4, so that the push rod 302 can be pushed to gradually slide from the inclined groove 305 to the first sliding groove 306. The swing tube 13 and the third hollow cover 14 can be rotated to a state parallel to the push plate 303, and then slide along the strip opening 304. At the same time, when the push rod 302 slides in the strip opening 304, The push rod 302 abuts against the side walls of the first triangular block 307 and the second triangular block 308 in turn, pushing the push rod 302 to rotate clockwise along the rotating shaft 402. The rotation of the rotating shaft 402 drives the rotation of the gear 501 and pushes the rack 502 to move along the guide rod 602. The second spring 604 is compressed. At this time, the fixed rod 301 will not be pushed to move. After the push rod 302 passes over the first triangular block 307 and the second triangular block 308, it can be rotated and reset under the action of the slider 603. When the bonding head can move downward along the side wall of the tapered tube 15, the third hollow cover 14 and the swing tube 13 are pushed to swing away from the bonding head. At the same time, the push rod 302 can move in the strip opening 304 and move the bonding head to the bonding position to achieve the bonding operation.

[0044] After the bonding is completed, when the bonding head gradually separates from the tapered tube 15 and the third hollow cover 14, the swing tube 13 can move and reset under the action of the first spring 202, and drive the fixed ring 201 and the fixed rod 301 to move synchronously. At the same time, the second rotating mechanism 4 drives the push rod 302 to slide on the side walls of the second triangular block 308 and the first triangular block 307 in turn. At this time, since the rack 502 abuts against the side wall of the connecting block 601, it is ensured that the push rod 302 will not rotate counterclockwise along the rotating shaft 402, thereby pushing the swing tube 13 to swing back and forth along the rubber ring 702, and driving the third hollow cover 14 and the tapered tube 15 to swing back and forth, so that the tapered tube 15 can reciprocate and knock and vibrate the bonded bonding line 16, which is not only convenient for eliminating the internal stress, but also can test the bonding strength to ensure the bonding quality;

[0045] After the bonding is completed, when the bonding wire 16 is struck and vibrated, the push rod 302 can be pushed to slide along the first slide groove 306 into the inclined groove 305. At this time, the swing tube 13 can be driven to rotate and tilt, and the third hollow cover 14 and the tapered tube 15 can be driven to tilt. If the bonding wire 16 does not fall off after the striking and vibration, the tapered tube 15 will abut against the side wall of the bonding wire 16, so that the swing tube 13 cannot rotate and tilt, and the push rod 302 cannot slide into the inclined groove 305.

[0046] If the bonding wire 16 is missing or falls off after being knocked and vibrated, the push rod 302 can slide into the inclined groove 305, so that the swing tube 13 rotates and tilts. At the same time, the fixed rod 301 can abut against the side wall of the rotating plate 902, thereby pushing the rotating plate 902 to rotate along the rotating pin 1002. When the rotating plate 902 rotates, the push pin 904 slides along the second sliding groove 903 and pushes the identification rod 802 to move outward along the circular hole 801. The third spring 901 is compressed. At this time, the extended state of the identification rod 802 can be detected by the visual sensor set on the bonding head, so as to detect the quality of the bonding wire 16 after bonding. In addition, when a missing bond occurs, it can also be detected to ensure the quality of the bonding.

[0047] Moreover, after the bonding is completed, the DCB substrate 1 and the chip body 11 need to be packaged. After the packaging is completed, the upper end of the second hollow cover 17 is exposed to the outside, and the second hollow cover 17, the first hollow cover 12, the swing tube 13, the third hollow cover 14 and the tapered tube 15 are filled with coolant. Moreover, the second hollow cover 17, the first hollow cover 12, the swing tube 13, the third hollow cover 14 and the tapered tube 15 are made of materials with strong thermal conductivity but insulation, such as thermal conductive silicone, etc., to ensure the thermal conductivity effect while ensuring the insulation effect, so that the chip body 11 and the bonding wire 16 can be well cooled, thereby ensuring its use effect and life.

[0048] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0049] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An IGBT chip, comprising a chip body (11) arranged on a DCB substrate (1), characterized in that: The side wall of the chip body (11) is fixedly connected to a first hollow cover (12), and the top of the first hollow cover (12) is fixedly connected to a second hollow cover (17), the first hollow cover (12) and the second hollow cover (17) are filled with cooling liquid, and the side wall of the first hollow cover (12) is inserted with a plurality of swing tubes (13) arranged in an array, each of the swing tubes (13) is rotatably connected to the side wall of the first hollow cover (12) through a first rotating mechanism (7), and one end of each swing tube (13) away from the first hollow cover (12) is fixedly connected to the side wall of the first hollow cover (12). A third hollow cover (14) is fixedly connected, the top of the third hollow cover (14) is provided with an inclined surface (1401), and a hollow conical tube (15) is fixedly inserted into the side wall of the third hollow cover (14), each of the swing tubes (13) is connected to the inner side wall of the first hollow cover (12) through a first reset mechanism (2), and the swing of the swing tube (13) is driven by a first driving mechanism (3), and a plurality of detection mechanisms (8) for detecting the welding quality of the bonding wire (16) are provided on the side wall of the first hollow cover (12); The detection mechanism (8) comprises a plurality of circular holes (801) arranged in an array and opened on the side wall of the first hollow cover (12); a marking rod (802) is inserted into the circular hole (801); and the movement of the marking rod (802) is driven by a second driving mechanism (9); The first reset mechanism (2) comprises a fixed ring (201) fixedly sleeved on the side wall of the swing tube (13); the side wall of the swing tube (13) is sleeved with a first spring (202), and two ends of the first spring (202) are respectively fixed to the fixed ring (201) and the first hollow cover (12); The first pushing mechanism (3) comprises a fixing rod (301) fixedly connected to the top of the fixing ring (201), and the upper end of the fixing rod (301) is connected to a pushing rod (302) via a second rotating mechanism (4); the inner side wall of the first hollow cover (12) is fixedly connected to a plurality of pushing plates (303) arranged in an array, and a strip opening (304) is provided at the top of the pushing plate (303), and a first sliding groove (306) is provided at one end of the strip opening (304). , and the other end of the first slide groove (306) is provided with an inclined groove (305), the pushing rod (302) can slide in the inclined groove (305), the first slide groove (306) and the strip opening (304), and the two opposite side walls of the strip opening (304) are fixedly connected with a plurality of first triangular blocks (307) and second triangular blocks (308) arranged in an array, and the pushing rod (302) can slide on the side walls of the first triangular block (307) and the second triangular block (308).

2. An IGBT chip according to claim 1, characterized in that: The second rotating mechanism (4) comprises two symmetrically arranged fixed blocks (401) fixedly connected to the upper end of the fixed rod (301), and the side wall of the fixed block (401) is rotatably connected to a rotating block (403) via a rotating shaft (402), the rotating block (403) is fixed to the lower end of the push rod (302), and the rotation of the rotating shaft (402) is driven by a driving mechanism (5).

3. An IGBT chip according to claim 2, characterized in that: The driving mechanism (5) comprises a gear (501) fixedly sleeved on the side wall of the rotating shaft (402); the side wall of the fixed block (401) is connected to a rack (502) via a second reset mechanism (6), and the rack (502) is meshed with the gear (501).

4. An IGBT chip according to claim 3, characterized in that: The second reset mechanism (6) comprises two symmetrically arranged connecting blocks (601) fixedly connected to the side walls of the fixed block (401), and the opposite side walls of the two connecting blocks (601) are fixedly connected to two symmetrically arranged guide rods (602), the side wall of each guide rod (602) is sleeved with a slider (603), the slider (603) is fixed to the side wall of the rack (502), and the side wall of each guide rod (602) is sleeved with a second spring (604).

5. The IGBT chip according to claim 1, characterized in that: The first rotating mechanism (7) comprises a plurality of mounting holes (701) arranged in an array on the side wall of the first hollow cover (12), a rubber ring (702) being fixedly inserted in the mounting hole (701), and the swing tube (13) being fixedly inserted in the rubber ring (702).

6. The IGBT chip according to claim 1, characterized in that: The second pushing mechanism (9) includes a pushing pin (904) fixedly connected to the side wall of the identification rod (802), and the side wall of the identification rod (802) is sleeved with a third spring (901), the two ends of the third spring (901) are respectively fixed to the first hollow cover (12) and the side wall of the pushing pin (904), and a rotating plate (902) is rotatably connected in the first hollow cover (12) through a plurality of third rotating mechanisms (10), a second sliding groove (903) is opened on the top of the rotating plate (902), and the pushing pin (904) is inserted into the second sliding groove (903).

7. An IGBT chip according to claim 6, characterized in that: Each of the third rotating mechanisms (10) comprises a support block (1001) fixedly connected to the inner wall of the first hollow cover (12), and the rotating plate (902) is rotatably connected to the side wall of the support block (1001) via a rotating pin (1002).

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