A mip encapsulation method

Abstract

The application discloses a Mip packaging method, and a discrete device detection and packaging procedure comprises the following steps: after the discrete device is bonded on a UV tape, heat pressing is performed; the discrete device is separated from the first high-temperature tape; the UV tape is debonded; after the discrete device is bonded on a first blue film, heat pressing is performed; the discrete device is separated from the UV tape; the pin surface of the discrete device is point-tested to detect qualified devices and unqualified devices; the unqualified devices are removed from the discrete device; the qualified devices are bonded on a second blue film, and then heat pressing is performed; the qualified devices are separated from the first blue film; and release paper is attached to the side of the qualified devices away from the second blue film. The application has the advantages of simplified technological process, higher reliability, less heavy asset investment, lower auxiliary material cost, simplified Mip packaging process, reduced Mip packaging cost and improved Mip packaging reliability.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a Mip packaging method. Background Technology

[0002] In MLED display applications, COB and Mip technologies emerged approximately 10 years apart. However, since 2023, Mip has established itself as a major player alongside COB. From a fundamental technological perspective, COB is a chip-level packaging technology where LED crystals are packaged into cell structures with hundreds or even more pixels. Mip technology, on the other hand, tends to focus on individual RGB pixel packaging, or even individual packaging structures with only a few dozen RGB pixels.

[0003] Currently, MiP products excel in display performance, but they do not offer significant advantages over COB in terms of cost and manufacturing process. Existing MiP packaging methods mainly include the following steps: soldering (applying solder paste to the pads on the PCB substrate) → SPI inspection (solder paste printing inspection) → die bonding (mounting the LED onto the PCB substrate) → reflow soldering (soldering the LED to the PCB substrate) → AOI inspection (automatic optical inspection) → die rejection (removing defective chips) → cleaning (removing flux) → dehumidification → PLSMA cleaning (plasma cleaning) → molding (encapsulating a transparent layer on the light-emitting side of the LED to form a packaging module) → overmolding and cutting (applying a first high-temperature tape to the light-emitting surface of the packaging module and performing hot pressing, then using a utility knife to cut the finished material into sheets). → Attaching (making the enamel plate, attaching the non-adhesive side of the first high-temperature tape to the second high-temperature tape of the enamel plate, flipping the enamel plate over, and scraping it with a rubber soft board on an anti-static workbench) → Cutting (dividing the packaged module into multiple discrete components) → Separating the first and second high-temperature tapes → Dehumidification → Visual inspection → Stripping (removing the discrete components from the first high-temperature tape) → Cleaning (cleaning the discrete components with a mixture of alcohol and anti-static liquid) → Air drying (air drying the discrete components with an ionizer) → Dehumidification → Spectroscopy (rapidly testing the photoelectric parameters of the discrete components, performing spectroscopic and colorimetric analysis) → Mixing → Dehumidification → Tape winding (encapsulating the discrete components on a tape carrier) → Dehumidification → Packaging (placing the reels containing the discrete components into aluminum foil bags, two reels per bag, and vacuum sealing). The steps from tinning to molding belong to the packaging process, from lamination to visual inspection belong to the cutting process, and from stripping to packaging belong to the inspection and packaging process.

[0004] The above detection packaging process has the following defects: ① complex process flow: too many processes, long flow time, and difficult to implement automation; ② high risk of air tightness: multiple immersions in liquid, incomplete drying, or insufficient process control, which can cause material to absorb moisture and lead to air tightness problems; in addition, too many times of drying affect the reliability and brightness of the material; ③ low efficiency of sorting and large investment in assets: about 20W of a group of devices for light splitting and tape coding, light splitting UPH is about 20K / H, and tape coding UPH is about 30K / H, basically 3 light splitting machines are matched with 2 tape coding machines, and 1000KK of monthly production capacity requires about 77 light splitting machines and about 50 tape coding machines, and the cost of post-stage equipment is about 1200W after investment; ④ high cost of auxiliary materials: cover film, carrier tape, turntable, aluminum foil bag, etc., the cost of materials is about 0.5 yuan / K.

[0005] How to simplify the Mip packaging process, reduce the Mip packaging cost and improve the Mip packaging reliability is a problem that those skilled in the art need to solve. SUMMARY

[0006] To this end, the technical problem to be solved by the present application is to provide a Mip packaging method, which simplifies the Mip packaging process, reduces the Mip packaging cost and improves the Mip packaging reliability.

[0007] In order to solve the above technical problems, the present application provides a Mip packaging method, comprising the following processes in sequence:

[0008] The first process is to make a packaging module, which comprises a PCB substrate, a plurality of light emitting chips and a packaging layer, the light emitting chips are mounted on the front surface of the PCB substrate, the packaging layer is arranged on the side of the light emitting chips away from the PCB substrate, the back surface of the PCB substrate is a pin surface, and the surface of the packaging layer away from the light emitting chips is a light emitting surface;

[0009] The second process is to cut the packaging module into a plurality of discrete devices, and the light emitting surface of the discrete device formed by the same packaging module is connected in close contact with the adhesive surface of the first high-temperature tape;

[0010] The third process is to detect and package the discrete devices, and the third process comprises the following steps:

[0011] (303) After the discrete devices are bonded on the UV tape, heat pressing is performed, and the pin surface of the discrete device is in close contact with the adhesive surface of the UV tape;

[0012] (304) The discrete device is separated from the first high-temperature tape;

[0013] (303) The UV tape is debonded;

[0014] (304) after bonding the discrete device on the first blue film, heat pressing, the light emitting surface of the discrete device is attached to the bonding surface of the first blue film;

[0015] (305) separating the discrete device from the UV tape;

[0016] (306) point testing the pin surface of the discrete device, detecting qualified devices and unqualified devices;

[0017] (307) removing unqualified devices from the discrete device;

[0018] (308) after bonding the qualified device on the second blue film, heat pressing, the pin surface of the qualified device is attached to the bonding surface of the second blue film;

[0019] (309) separating the qualified device from the first blue film;

[0020] (310) attaching release paper to the side of the qualified device away from the second blue film, the bonding surface of the second blue film is attached to the edge of the release paper.

[0021] Further, in step (301), the bonding surface of the UV tape is placed upward on the loading table, then the pin surface of the discrete device is attached to the bonding surface of the UV tape downward, and then the discrete device and the UV tape are heat pressed together by the plastic molding machine.

[0022] Further, in step (303), the UV tape is disbonded by the UV disbonding machine, and a light transmission pressing plate is pressed on the non-bonding surface of the UV tape during disbonding.

[0023] Further, in step (304), the bonding surface of the first blue film is placed upward on the loading disc, and then the discrete device is attached to the bonding surface of the first blue film, and then the discrete device and the first blue film are heat pressed together by the film turning machine.

[0024] Further, in step (306), the pin surface of the discrete device is automatically positioned and scanned by the point testing equipment, then the optical and electrical parameters are tested to mark qualified devices and unqualified devices, and the coordinates of the qualified devices and unqualified devices are output.

[0025] Further, in step (307), the discrete device is first positioned and scanned by a gluing device, UV glue is dotted on the unqualified device according to the coordinates of the unqualified device, the carrier disc is then placed on a light transmission carrier, the light transmission carrier is then pressed on the pin surface of the discrete device, the UV glue is then irradiated and cured by a UV glue dissolving machine, the light transmission carrier is then removed and the unqualified device adhered to the light transmission carrier is taken away, and finally the unqualified device on the light transmission carrier is removed.

[0026] Further, in step (308), the second blue film is first placed on the carrier disc with the adhesive surface facing upwards, the pin surface of the qualified device is then attached to the adhesive surface of the second blue film, and the discrete device and the second blue film are then hot-pressed together by a film turning machine.

[0027] Further, the first process comprises the following steps:

[0028] (101) printing tin paste on the pad position on the front surface of the PCB substrate;

[0029] (102) detecting the tin paste on the PCB substrate;

[0030] (103) transferring the light-emitting chip to the corresponding pad to form a substrate-chip assembly;

[0031] (104) welding the substrate-chip assembly;

[0032] (105) detecting the welding quality of the substrate-chip assembly to detect qualified chips and unqualified chips;

[0033] (106) removing the unqualified chips from the substrate-chip assembly;

[0034] (107) cleaning the substrate-chip assembly with a flux cleaner to remove the flux, and then rinsing the cleaner with deionized water;

[0035] (108) drying the substrate-chip assembly;

[0036] (109) dehumidifying the substrate-chip assembly;

[0037] (110) plasma cleaning the substrate-chip assembly;

[0038] (111) molding the substrate-chip assembly to form a packaging layer to obtain the packaging module.

[0039] Further, the second process comprises the following steps:

[0040] (201) bonding multiple encapsulation modules on the same first high-temperature adhesive tape, the light-emitting surface of the encapsulation module being attached to the bonding surface of the first high-temperature adhesive tape;

[0041] (202) cutting the first high-temperature adhesive tape between different encapsulation modules to form multiple bonding assemblies;

[0042] (203) bonding the multiple bonding assemblies on the second high-temperature adhesive tape of the enamel disc, wherein the non-bonding surface of the first high-temperature adhesive tape is attached to the bonding surface of the second high-temperature adhesive tape of the enamel disc;

[0043] (204) dividing each encapsulation module into multiple discrete devices while the first high-temperature adhesive tape is not cut;

[0044] (205) separating the first high-temperature adhesive tape from the second high-temperature adhesive tape;

[0045] (206) dehumidifying the discrete devices;

[0046] (207) appearance detection of the discrete devices.

[0047] Further, in step (201), the encapsulation modules are sequentially bonded on the first high-temperature adhesive tape along the length direction of the first high-temperature adhesive tape, and then the encapsulation modules and the edges of the first high-temperature adhesive tape are hot-pressed together by a plastic molding machine; in step (203), the enamel disc is first made, then multiple bonding assemblies are arrayed and bonded on the bonding surface of the second high-temperature adhesive tape of the enamel disc, and then the enamel disc is turned over and scraped by a rubber soft plate on an anti-static workbench to make the bonding assemblies adhere to the second high-temperature adhesive tape.

[0048] The above technical solutions of the present application have the following advantages compared with the prior art: (1) simplified process flow: reduced process and fast flow time, which is conducive to automation; (2) more reliable: reduced material soaking and dehumidifying times, reduced influence on material properties, reduced risk of material failure and service life; (3) less investment in heavy assets: point measurement equipment efficiency is about 80K / H, single-head point measurement equipment is about 40K / H (with about 1%-3% of defective products), and 1000KK of monthly production capacity requires 20 point measurement machines and 2 point measurement devices, with an investment of about 370W in post-stage equipment; (4) low cost of auxiliary materials: UV film, blue film, release paper, etc., with a cost of about 0.2 yuan / K on the material. BRIEF DESCRIPTION OF DRAWINGS

[0049] In order to make the content of the present application more easily understood, the present application will be further described in detail below according to specific embodiments of the present application and in conjunction with the accompanying drawings.

[0050] Figure 1 A schematic diagram of the packaging module in step (11) of the present application;

[0051] Figure 2 A schematic diagram of the connection of the plurality of packaging modules and the first high-temperature adhesive tape in step (12) of the present application;

[0052] Figure 3 A schematic diagram of the connection of the plurality of adhesive components and the second high-temperature adhesive tape in step (14) of the present application;

[0053] Figure 4 A schematic diagram of the packaging module after cutting in step (15) of the present application;

[0054] Figure 5 A schematic diagram of the connection of the plurality of discrete devices and the UV adhesive tape in step (19) of the present application;

[0055] Figure 6 A schematic diagram of the connection of the plurality of discrete devices and the first blue film in step (22) of the present application;

[0056] Figure 7 A schematic diagram of the connection of the plurality of discrete devices and the second blue film in step (26) of the present application;

[0057] Figure 8 A schematic diagram of the connection of the plurality of discrete devices, the second blue film, and the release paper in step (28) of the present application.

[0058] Description of the figures in the specification: A, packaging module; B, discrete device; 1, PCB substrate; 2, light-emitting chip; 3, packaging layer; 4, first high-temperature adhesive tape; 5, second high-temperature adhesive tape; 6, UV adhesive tape; 7, first blue film; 8, second blue film; 9, release paper. DETAILED DESCRIPTION

[0059] The present application will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present application and implement it.

[0060] Example 1

[0061] Referring to Figures 1 to 8 the present application, an embodiment of the Mip packaging method is shown.

[0062] The above-mentioned Mip packaging method comprises the following steps performed in sequence:

[0063] (1) printing solder paste on the pad position of the front surface of the PCB substrate 1; specifically, the solder paste is evenly printed on the PCB substrate 1, providing the basis for the subsequent assembly process. The quality of the solder paste printing directly affects the welding quality of the subsequent assembly. Poor solder paste printing may cause serious problems such as poor soldering and short circuit;

[0064] (2) detecting the solder paste on the PCB substrate 1; specifically, through the detection of the SPI system, the amount, shape, position and other key parameters of the solder paste printed on the PCB substrate 1 (printed circuit board) can be accurately measured and analyzed;

[0065] (3) transferring the light-emitting chip 2 to the corresponding pad to obtain a substrate-chip assembly; specifically, the RGB chip is fixed on the corresponding pad according to the polarity;

[0066] (4) reflow soldering the substrate-chip assembly; specifically, the substrate-chip assembly is placed in a reflow soldering device for welding. The reflow soldering device has a heating circuit inside. After the air or nitrogen is heated to a high enough temperature, it is blown onto the chip assembly that has been die-bonded, so that the solder on both sides of the chip corresponding to the polarity melts and bonds with the mainboard;

[0067] (5) detecting the welding quality of the substrate-chip assembly to detect qualified chips and unqualified chips; specifically, the substrate-chip assembly is detected by automatic optical detection. Automatic optical detection is a device based on optical principles to detect common defects encountered in welding production. When automatic detection is performed, the machine automatically scans through the camera, collects images, compares the tested solder joints with the qualified parameters in the database, checks the defects on the PCB through image processing, and displays / indicates the defects through the display or automatic markers for the die-bonding machine to remove or laser spot to burn off;

[0068] (6) removing the unqualified chips from the substrate-chip assembly;

[0069] (7) cleaning the substrate-chip assembly with a flux cleaner to remove the flux, and then rinsing the cleaner with deionized water;

[0070] (8) drying the substrate-chip assembly by using a drying machine to dry the moisture on the surface of the substrate-chip assembly;

[0071] (9) baking the substrate-chip assembly by using an oven to remove moisture from the substrate-chip assembly, so that the moisture in the substrate-chip assembly is completely removed;

[0072] (10) the substrate-chip assembly is subjected to plasma cleaning; specifically, the substrate-chip assembly is subjected to plasma cleaning by a plasma cleaning machine; the principle of the plasma cleaning machine is that, in a vacuum or specific gas environment, gas molecules are ionized by a high-frequency electromagnetic field to form plasma. These plasma reacts with the surface of the material, which can remove the contaminants on the surface and also can introduce active groups on the surface to improve the adhesion of the material and the adhesion of the coating;

[0073] (11) the substrate-chip assembly is subjected to molding, the light-emitting chip 2 is encapsulated between the PCB substrate 1 and the encapsulation layer 3 to obtain an encapsulation module A, wherein the back surface of the PCB substrate is the pin surface 11, and the outer surface of the encapsulation layer 3 is the light-out surface 31; specifically, a layer of epoxy resin is molded on the side of the light-emitting chip 2 away from the PCB substrate, and the epoxy resin after curing is the encapsulation layer 3;

[0074] (12) a plurality of the encapsulation module A are bonded to the same first high-temperature adhesive tape 4 and then subjected to hot pressing, the light-out surface of the encapsulation module A is attached to the bonding surface of the first high-temperature adhesive tape 4; the plurality of encapsulation modules A are arranged in sequence along the length direction of the first high-temperature adhesive tape 4, and then the encapsulation modules A are placed on the rolling edge of a plasticizer (temperature 110℃), and the material is tightly attached to the high-temperature adhesive by automatic plasticizing; the first high-temperature adhesive tape has a large viscosity and a large toughness, so that the plurality of encapsulation modules are connected as a whole, which is convenient for subsequent hot pressing and can ensure the positioning of the encapsulation modules during subsequent cutting and prevent the first high-temperature adhesive tape from being easily cut off;

[0075] (13) the first high-temperature adhesive tape 4 between different encapsulation modules A is cut off to form a plurality of bonding assemblies; specifically, the first high-temperature adhesive tape 4 between the adjacent two encapsulation modules A is cut off by a cutting tool;

[0076] (14) the plurality of bonding assemblies are bonded to the second high-temperature adhesive tape 5 of the enamel disc, and the non-bonding surface of the first high-temperature adhesive tape 4 is attached to the bonding surface of the second high-temperature adhesive tape 5 of the enamel disc; specifically, the enamel disc is first prepared, the enamel disc holder is fixed on a film laminating machine, the second high-temperature adhesive tape is pulled to tightly attach the second high-temperature adhesive tape to the edge of the enamel disc, the second high-temperature adhesive tape is cut off by pressing the cutter, and the second high-temperature adhesive tape is tightly attached to the enamel disc by dragging the roller 2-3 times); the obtained bonding assemblies are arrayed on the second high-temperature adhesive tape 5 of the enamel disc; the second high-temperature adhesive tape of the enamel disc has a large viscosity and a large toughness, so that the plurality of bonding assemblies are connected as a whole, then the enamel disc is turned over, and the bonding assemblies are fixed on the enamel disc by scraping with a rubber soft plate on an anti-static workbench, which can ensure the positioning of the bonding assemblies during subsequent cutting and prevent the second high-temperature adhesive tape from being easily cut off, avoiding material flying or cutting deviation, and cutter jumping during cutting;

[0077] (15) the packaging module A is cut into a plurality of discrete devices B, and the first high-temperature adhesive tape 4 is not cut; specifically, the packaging module A is cut, and each discrete device includes a substrate part formed by cutting the PCB substrate, a packaging part formed by cutting the packaging layer, and a light-emitting part including at least one group of light-emitting chips and being packaged between the substrate part and the packaging part;

[0078] (16) the first high-temperature adhesive tape 4 is separated from the second high-temperature adhesive tape 5 on the enamel disc;

[0079] (17) the discrete devices are dehumidified; specifically, the discrete devices are placed in an oven for dehumidification, the temperature is 110°C, and the time is 0.5H to remove water vapor on the surface of the material;

[0080] (18) the discrete devices are detected for appearance; specifically, it is checked whether the cutting position and shape meet the requirements;

[0081] (19) the discrete devices are bonded to the UV adhesive tape 6 and then hot-pressed, and the pin surface of the discrete device B is attached to the bonding surface of the UV adhesive tape 6; specifically, the bonding surface of the UV adhesive tape 6 is placed on a support with the bonding surface facing upward, and then the pin surface of the discrete device B is attached to the bonding surface of the UV adhesive tape 6 with the pin surface facing downward, and then the discrete device and the UV adhesive tape 6 are hot-pressed together by a plastic molding machine; after the UV adhesive tape 6 is hot-pressed, the viscosity increases, which ensures that the discrete device can be separated from the first high-temperature adhesive tape, and the hot-pressing temperature is 80-100°C;

[0082] (20) the discrete devices are separated from the first high-temperature adhesive tape 4;

[0083] (21) the UV adhesive tape 6 is debonded; specifically, the UV adhesive tape 6 is debonded by a UV debonding machine, and after the UV adhesive tape is debonded, the viscosity decreases, which facilitates the separation of the UV adhesive tape from the discrete device; when debonding, a transparent glass pressing plate is pressed on the non-bonding surface of the UV adhesive tape 6 to prevent the UV adhesive tape from shrinking and deforming, and the UV light is irradiated for 1-2 min / 1A (the time and current are adjusted according to the characteristics of the UV film);

[0084] (22) the discrete devices are bonded to the first blue film 7 and then hot-pressed, and the light-emitting surface of the discrete device B is attached to the bonding surface of the first blue film 7; specifically, the bonding surface of the first blue film 7 is placed on a support with the bonding surface facing upward, and then the discrete device B is attached to the bonding surface of the first blue film 7, and then the discrete device and the first blue film 7 are hot-pressed together by a film turning machine.

[0085] The center area of the bearing disc is hollowed out, which facilitates hot pressing of the discrete device and the first blue film. The uncured material is attached to the center position in the direction of the notch. The notch in the hollow hole serves as a foolproof mark. The viscosity of the first blue film is low, which facilitates separation of the discrete device and the first blue film. The hot pressing temperature is 50-65°C, the hot pressing time is 30s, and the hot pressing pressure is 300Kg.

[0086] (23) Separate the discrete device from the UV tape 6.

[0087] (24) Point test the pin surface of the discrete device B to detect qualified devices and unqualified devices. The pin surface of the discrete device B is automatically positioned and scanned by the point test equipment, then the photoelectric parameters are tested to mark qualified devices and unqualified devices, and the coordinates of the qualified devices and unqualified devices are output.

[0088] (25) Remove the unqualified devices from the discrete device. First, the discrete device B is automatically positioned and scanned by the glue coating equipment, then UV glue is applied to the unqualified devices according to the coordinates of the unqualified devices. Then, place the bearing disc on the light transmission carrier, and then press the light transmission pressing plate on the pin surface of the discrete device. Then, irradiate the UV glue with ultraviolet light by the UV uncuring machine, and the irradiation time is 30S-1min / 100-500mA. Then, remove the unqualified devices from the light transmission carrier and the unqualified devices adhered to the light transmission carrier. Finally, remove the unqualified devices on the light transmission carrier; they can be directly wiped off or wiped off with alcohol.

[0089] (26) Hot press the qualified devices after bonding them to the second blue film 8. The pin surface of the qualified devices is attached to the bonding surface of the second blue film 8. First, place the bonding surface of the second blue film 8 upward in the bearing disc, then attach the pin surface of the qualified devices to the bonding surface of the second blue film 8 with the pin surface downward. Then, hot press the discrete device and the second blue film 8 together by the film turning machine. Finally, tear off the first blue film 7.

[0090] (27) Separate the qualified devices from the first blue film 7.

[0091] (28) Attach release paper 9 to the side of the qualified devices away from the second blue film 8. The bonding surface of the second blue film 8 is attached to the edge of the release paper 9.

[0092] The PCB substrate 1 has a length and width of 40-100 mm*40-100 mm (the length and width can be designed according to the wafer workbench stroke of the terminal customer for testing the die bonding equipment, generally, a 6-inch ring is used, and the maximum stroke is 120 mm), for example, the designed size is 50 mm*92 mm, and the arrangement is 75*79*2=11850 pcs. The width of the UV tape is 52 mm. The first blue film is an SPV-224 film (0.8 N / 20 mm) with a diameter of 185 mm and a thickness of 0.08 mm. The bearing disc is a stainless steel carrier with a diameter of 200 mm and a thickness of 10 mm, and the center is hollow (a circular hole with a diameter of 100 mm and a notch). The lower light transmission glass carrier is a cylinder with a diameter of 100 mm and a height of 100 mm, and the upper light transmission carrier is a T-shaped body (including an upper cylinder and a lower cylinder, the upper cylinder has a diameter of 150 mm and a height of 30 mm, and the lower cylinder has a diameter of 100 mm and a height of 70 mm). The second blue film is an SPV-225 film (0.95 N / 20 mm) with a diameter of 185 mm and a thickness of 0.08 mm, and the release paper has a diameter of 200 mm.

[0093] Example Two

[0094] The rest is the same as example one, except that the sorting equipment (which must be able to identify the coordinate data output by the point measurement equipment) is further included, and the material after point measurement is directly transferred and arranged on another blue film by the sorting machine according to a certain interval and pattern, the good products are subjected to secondary film pouring, so that the colloid faces upward, and finally the release paper is attached to form a finished product. The point measurement efficiency is about 80 K / H, and the sorting efficiency is about 35 K / H, that is, according to the monthly production capacity of 1000 KK, about 20 point measurement devices and about 44 sorting devices need to be purchased, and the overall equipment cost is about 600 W, but the scheme is not optimal.

[0095] Obviously, the above examples are only examples for the sake of clarity, and are not limitations on the embodiments. Based on the above description, other different forms of changes or variations can be made by those of ordinary skill in the art. Here, it is not necessary and impossible to exhaust all the embodiments. The obvious changes or variations derived therefrom are still within the protection scope of the present application.

Claims

1. A method of Mip encapsulation, characterized by, The method comprises the following steps in sequence: A first step of manufacturing a packaging module, the packaging module comprising a PCB substrate, a plurality of groups of light emitting chips, and a packaging layer, the light emitting chips being mounted on the front surface of the PCB substrate, the packaging layer being arranged on the side of the light emitting chips away from the PCB substrate, the back surface of the PCB substrate being a pin surface, and the surface of the packaging layer away from the light emitting chips being a light emitting surface; A second step of cutting the packaging module into a plurality of discrete devices, the light emitting surfaces of the discrete devices formed by the same packaging module being connected to the adhesive surface of a first high-temperature adhesive tape; A third step of detecting and packaging the discrete devices, the third step comprising the following steps: (301) After the discrete devices are adhered to a UV adhesive tape, heat pressing is performed, and the pin surface of the discrete devices is attached to the adhesive surface of the UV adhesive tape; (302) The discrete devices are separated from the first high-temperature adhesive tape; (303) The UV adhesive tape is debonded; (304) After the discrete devices are adhered to a first blue film, heat pressing is performed, and the light emitting surface of the discrete devices is attached to the adhesive surface of the first blue film; (305) The discrete devices are separated from the UV adhesive tape; (306) The pin surface of the discrete devices is point-tested to detect qualified devices and unqualified devices; (307) The unqualified devices are removed from the discrete devices; (308) After the qualified devices are adhered to a second blue film, heat pressing is performed, and the pin surface of the qualified devices is attached to the adhesive surface of the second blue film; (309) The qualified devices are separated from the first blue film; (310) A release paper is attached to the side of the qualified devices away from the second blue film, and the adhesive surface of the second blue film is attached to the edge of the release paper.

2. The Mip encapsulation method of claim 1, wherein, In step (301), the adhesive surface of the UV adhesive tape is placed upward on a loading platform, the pin surface of the discrete devices is attached downward to the adhesive surface of the UV adhesive tape, and then the discrete devices and the UV adhesive tape are heat pressed together by a plastic molding machine.

3. The Mip encapsulation method of claim 1, wherein, In step (303), the UV adhesive tape is debonded by a UV debonding machine, and a light-transmitting pressing plate is pressed on the non-adhesive surface of the UV adhesive tape during debonding.

4. The Mip encapsulation method of claim 1, wherein, In step (304), the adhesive surface of the first blue film is placed upward on a loading disc, the discrete devices are attached to the adhesive surface of the first blue film, and then the discrete devices and the first blue film are heat pressed together by a film turning machine.

5. The Mip encapsulation method of claim 4, wherein, In step (306), the pin surface of the discrete devices is automatically positioned and scanned by a point-testing device, and then the photoelectric parameters are tested to mark the qualified devices and the unqualified devices, and the coordinates of the qualified devices and the unqualified devices are output.

6. The Mip encapsulation method of claim 5, wherein, In step (307), the discrete device is first positioned and scanned by a gluing device, and then the unqualified device coordinates are coated with UV glue. Then, the carrier disc is placed on a light transmission carrier, and then the light transmission carrier is pressed on the pin surface of the discrete device. Then, the UV glue is irradiated and cured by a UV debonding machine. Then, the light transmission carrier is removed and the unqualified device bonded with the light transmission carrier is taken away. Finally, the unqualified device on the light transmission carrier is removed.

7. The Mip encapsulation method of claim 1, wherein, In step (308), the second blue film is placed on the carrier disc with the bonding surface facing up, and then the pin surface of the qualified device is attached to the bonding surface of the second blue film. Then, the discrete device and the second blue film are hot-pressed together by a film turning machine.

8. The Mip encapsulation method of claim 1, wherein, The first process includes the following steps: (101) Print tin paste on the pad position of the PCB substrate front surface; (102) Detect the tin paste on the PCB substrate; (103) Transfer the light emitting chip to the corresponding pad to form a substrate chip assembly; (104) Weld the substrate chip assembly; (105) Detect the welding quality of the substrate chip assembly to detect qualified chips and unqualified chips; (106) Remove the unqualified chips from the substrate chip assembly; (107) Clean the substrate chip assembly with a flux cleaner to remove the flux, and then rinse the cleaner with deionized water; (108) Dry the substrate chip assembly; (109) Dehumidify the substrate chip assembly; (110) Plasma clean the substrate chip assembly; (111) Mold the substrate chip assembly to form a packaging layer and obtain the packaging module.

9. The Mip encapsulation method of claim 1, wherein, The second process includes the following steps: (201) Bond a plurality of packaging modules on the same first high-temperature adhesive tape, and the light emitting surface of the packaging module is attached to the bonding surface of the first high-temperature adhesive tape; (202) Cut the first high-temperature adhesive tape between different packaging modules to form a plurality of bonding assemblies; (203) Bond the plurality of bonding assemblies on the second high-temperature adhesive tape of the enamel disc, wherein the non-bonding surface of the first high-temperature adhesive tape is attached to the bonding surface of the second high-temperature adhesive tape of the enamel disc; (204) Divide each packaging module into a plurality of discrete devices, and the first high-temperature adhesive tape is not cut; (205) Separate the first high-temperature adhesive tape from the second high-temperature adhesive tape; (206) Dehumidify the discrete device; (207) Appearance detection of the discrete device.

10. The Mip encapsulation method of claim 9, wherein, In step (201), the packaging modules are sequentially bonded on the first high-temperature adhesive tape along the length direction of the first high-temperature adhesive tape, and then the packaging modules and the edges of the first high-temperature adhesive tape are hot-pressed together by a plasticizer. In step (203), the enamel disc is first made, and then a plurality of bonding assemblies are arrayed and bonded on the second high-temperature adhesive tape of the enamel disc. Then, the enamel disc is turned over and scraped with a rubber soft plate on an anti-static workbench to bond on the second high-temperature adhesive tape.

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