A display panel, a display device and a preparation method thereof

Abstract

Embodiments of the present application disclose a display panel, a display device and a preparation method thereof. The preparation method comprises the following steps: firstly, a plurality of first bonding electrodes are prepared on one side surface of an array substrate; wherein, the first bonding electrode comprises a first bottom surface facing the array substrate and a first cross section parallel to the first bottom surface, and the area of the first bottom surface is smaller than that of the first cross section, and the orthographic projection of the first bottom surface on the array substrate is located in the orthographic projection of the first cross section on the array substrate; then, a light emitting unit is bonded on the first bonding electrode respectively, so that the second bonding electrode on the light emitting unit is electrically connected with the first bonding electrode one by one; wherein, the area of the first bottom surface of the first bonding electrode after bonding is larger than that of the first bonding electrode before bonding. By using the above method, the situation that the adjacent first bonding electrodes in a molten state are contacted and short-circuited / short-connected due to the influence of gravity during bonding is effectively avoided, and the normal display of the display panel is ensured.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display panel, a display device, and a method for manufacturing the same. Background Technology

[0002] Currently, display technology has permeated all aspects of people's daily lives, and correspondingly, more and more materials and technologies are being used in displays. Among them, micro light-emitting diode (Micro-LED) displays are considered the next generation of display technology due to their physical characteristics such as ultra-high brightness, high contrast, fast response time, good durability, and high transparency.

[0003] In existing technologies, the fabrication of Micro-LED display panels generally requires bonding micro-light-emitting diodes (LEDs) to an array substrate. Specifically, a first bonding electrode is disposed on the surface of the array substrate, and a second bonding electrode is disposed on the surface of the LED. During bonding, the array substrate is heated to bond and fix the molten first bonding electrode to the corresponding second bonding electrode. However, during bonding, the first bonding electrode becomes molten due to the high temperature, and under the influence of gravity, it flows towards the surface of the array substrate. If the distance between the first bonding electrodes is too small, contact between adjacent first bonding electrodes can cause short circuits, thus affecting the normal display of the Micro-LED display panel. Summary of the Invention

[0004] This invention provides a display panel, a display device, and a method for manufacturing the same, to avoid short circuits / short connections caused by the influence of gravity on adjacent first bonding electrodes in the molten state during bonding.

[0005] In a first aspect, embodiments of the present invention provide a method for manufacturing a display panel, comprising:

[0006] A plurality of first bonding electrodes are formed on one side surface of an array substrate; wherein, the first bonding electrode includes a first bottom surface facing the array substrate and a first cross section parallel to the first bottom surface, and the area of ​​the first bottom surface is smaller than the area of ​​the first cross section, and the orthographic projection of the first bottom surface on the array substrate is located in the orthographic projection of the first cross section on the array substrate.

[0007] Light-emitting units are bonded to the first bonding electrode respectively, so that the second bonding electrode on the light-emitting unit is electrically connected to the first bonding electrode in a one-to-one correspondence; wherein, the area of ​​the first bottom surface of the first bonding electrode after bonding is larger than the area of ​​the first bottom surface of the first bonding electrode before bonding.

[0008] Secondly, embodiments of the present invention also provide a display panel, which is manufactured using the display panel manufacturing method described in any one of the first aspects.

[0009] Thirdly, embodiments of the present invention also provide a display device, including a display panel as described in the second aspect.

[0010] This invention provides a display panel, a display device, and a method for fabricating the same. The method first fabricates a plurality of first bonding electrodes on one side surface of an array substrate. Each first bonding electrode includes a first bottom surface facing the array substrate and a first cross-section parallel to the first bottom surface. The area of ​​the first bottom surface is smaller than the area of ​​the first cross-section. The orthographic projection of the first bottom surface onto the array substrate is located within the orthographic projection of the first cross-section onto the array substrate. Then, light-emitting units are bonded to the first bonding electrodes, so that second bonding electrodes on the light-emitting units are electrically connected to the first bonding electrodes in a one-to-one correspondence. The area of ​​the first bottom surface of the first bonding electrode after bonding is larger than the area of ​​the first bottom surface of the first bonding electrode before bonding. Using the above method, before bonding, the area of ​​the first bottom surface of the first bonding electrode facing the array substrate is smaller than the area of ​​the first cross-section of the first bonding electrode. The orthographic projection of the first bottom surface on the array substrate is located in the orthographic projection of the first cross-section on the array substrate. Therefore, during bonding, the first bonding electrode in the molten state is affected by gravity and will flow in a direction perpendicular to the surface of the array substrate. The flowing first bonding electrode will preferentially fill the projection area of ​​the first cross-section on the array substrate other than the orthographic projection of the first bottom surface, reducing the probability of the first bonding electrode flowing in a direction parallel to the surface of the array substrate. The extension distance of the first bonding electrode flowing in a direction parallel to the surface of the array substrate is small, thereby effectively avoiding the contact and short circuit / short-circuit of adjacent first bonding electrodes in the molten state due to gravity during bonding. This ensures the normal display of the display panel, improves the product yield of the display panel, improves the mass transfer yield of the light-emitting unit to the array substrate, and is conducive to realizing the design of high PPI (pixels per inch) of the display panel. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;

[0013] Figure 2 yes Figure 1 The diagram shows the structural flow of the method for manufacturing the display panel.

[0014] Figure 3 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention;

[0015] Figure 4 This is a schematic diagram of another display panel structure provided in an embodiment of the present invention;

[0016] Figure 5 This is a schematic flowchart of another method for manufacturing a display panel provided in an embodiment of the present invention;

[0017] Figure 6 yes Figure 5 The diagram shows the structural flow of the method for manufacturing the display panel.

[0018] Figure 7 This is a schematic diagram of the vapor deposition process of a first bonding electrode provided in an embodiment of the present invention;

[0019] Figure 8 yes Figure 7 A magnified schematic diagram of region M during the vapor deposition process of the first bonding electrode;

[0020] Figure 9 This is a schematic flowchart of another method for manufacturing a display panel provided in an embodiment of the present invention;

[0021] Figure 10 yes Figure 9 The diagram shows the structural flow of the method for manufacturing the display panel.

[0022] Figure 11 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention. Detailed Implementation

[0023] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0024] The terminology used in the embodiments of this invention is for the purpose of describing specific embodiments only and is not intended to limit the invention. It should be noted that directional terms such as "upper," "lower," "left," and "right" described in the embodiments of this invention are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this invention. Furthermore, in the context, it should be understood that when referring to an element being formed "on" or "below" another element, it can be formed not only directly on or below the other element, but also indirectly on or below it through intermediate elements. The terms "first," "second," etc., are used for descriptive purposes only and do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0025] The term "comprising" and its variations as used in this invention are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment".

[0026] It should be noted that the concepts of "first" and "second" mentioned in this invention are only used to distinguish the corresponding contents and are not used to limit the order or interdependence.

[0027] It should be noted that the terms "a" and "a plurality of" used in this invention are illustrative rather than restrictive. Those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0028] Figure 1 This is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present invention. Figure 2 yes Figure 1 The diagram shown is a structural flowchart of the method for fabricating the display panel. Figure 3 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention. Figure 4 This is a schematic diagram of another display panel structure provided in an embodiment of the present invention, such as... Figures 1-4 As shown, the method for manufacturing the display panel includes:

[0029] S110. A plurality of first bonding electrodes are prepared on one side surface of the array substrate; wherein, the first bonding electrode includes a first bottom surface facing the array substrate and a first cross section parallel to the first bottom surface, and the area of ​​the first bottom surface is smaller than the area of ​​the first cross section, and the orthographic projection of the first bottom surface on the array substrate is located in the orthographic projection of the first cross section on the array substrate.

[0030] Specifically, refer to Figure 2As shown in Figure a), a plurality of first bonding electrodes 20 are fabricated on one side surface of the array substrate 10. Exemplarily, the array substrate 10 may also have a printed circuit (e.g., a pixel driving circuit) or a similar structure, or the array substrate 10 may be a substrate with an internally integrated circuit structure (e.g., a pixel driving circuit). Thus, after the array substrate 10 is bonded to the light-emitting unit, the pixel driving circuit can drive the corresponding light-emitting unit to emit light through the first bonding electrodes 20. Exemplarily, the material of the first bonding electrodes 20 may be a low-temperature metal material such as a low-melting-point eutectic alloy.

[0031] The first bonding electrode 20 includes a first bottom surface 21 facing the array substrate 10 and a first cross section 22 parallel to the first bottom surface 21. The area of ​​the first bottom surface 21 is smaller than the area of ​​the first cross section 22, and the orthographic projection of the first bottom surface 21 onto the array substrate 10 is located within the orthographic projection of the first cross section 22 onto the array substrate 10. Thus, during subsequent bonding, the molten first bonding electrode 20, under the influence of gravity, will flow in a direction perpendicular to the surface of the array substrate 10. The flowing first bonding electrode 20 will preferentially fill the projection area of ​​the first cross section 22 onto the array substrate 10, excluding the orthographic projection of the first bottom surface 21, reducing the probability of the first bonding electrode 20 flowing in a direction parallel to the surface of the array substrate 10. The extension distance of the first bonding electrode 20 flowing in the direction parallel to the surface of the array substrate 10 is smaller, effectively preventing adjacent molten first bonding electrodes 20 from contacting and causing short circuits / short-circuit during bonding due to gravity. It should be noted that this embodiment does not specifically limit or require the shape of the first bonding electrode 20 before bonding. For example, the shape of the first bonding electrode 20 before bonding can be frustum-shaped (the smaller bottom surface of the frustum-shaped electrode is set as the first bottom surface 21 facing the side surface of the array substrate 10), truncated pyramidal shape (the smaller bottom surface of the truncated pyramidal shape is set as the first bottom surface 21 facing the side surface of the array substrate 10), and a combination of frustum-shaped and truncated pyramidal shapes stacked on top of each other, a combination of frustum-shaped and truncated pyramidal shapes stacked on top of each other, or a combination of truncated pyramidal shapes stacked on top of each other (the combined shape must ensure that there is a first cross section 22 parallel to the first bottom surface 21, and the area of ​​the first cross section 22 is larger than the area of ​​the first bottom surface 21).

[0032] S120. Light-emitting units are bonded to the first bonding electrode respectively, so that the second bonding electrode on the light-emitting unit is electrically connected to the first bonding electrode in a one-to-one correspondence; wherein, the area of ​​the first bottom surface of the first bonding electrode after bonding is larger than the area of ​​the first bottom surface of the first bonding electrode before bonding.

[0033] Specifically, refer to Figure 2 Figure b) Figure 3 and Figure 4 This step is essentially the alignment and bonding process between the array substrate 10 and the light-emitting unit 30. Exemplarily, the light-emitting unit 30 can be a red, green, or blue light-emitting unit. Of course, the light-emitting color of the light-emitting unit 30 can also be other colors; this embodiment will not provide specific examples. Exemplarily, the light-emitting unit 30 can be a Micro-LED, which has advantages such as good display performance, small size, and low power consumption, and has broad application prospects. Other light-emitting devices can also be used for the light-emitting unit 30; this embodiment is not limited to these. The array substrate 10 may also include other module structures for realizing the display function of the light-emitting unit 30; those skilled in the art can configure them according to actual needs. The light-emitting units 30 are bonded to the first bonding electrode 20 respectively, so that the second bonding electrode 40 on the light-emitting unit 30 is electrically connected to the first bonding electrode 20 in a one-to-one correspondence. For example, taking a Micro-LED as an example of a light-emitting unit 30, a mass transfer method can be used to fabricate multiple light-emitting units 30 individually on a growth substrate. Then, a transfer device uses van der Waals forces to adhere these multiple light-emitting units 30 and simultaneously press them onto the array substrate 10. By heating the array substrate 10, the first bonding electrode 20 is brought to a molten state, thereby making the first bonding electrode 20 electrically connected to the second bonding electrode 40 on the light-emitting unit 30 in a one-to-one correspondence. For example, the number of second bonding electrodes 40 on the light-emitting unit 30 can vary depending on the structure of the light-emitting unit 30 (upright, inverted, or vertical, etc.), with one or two second bonding electrodes 40 provided. This embodiment uses two second bonding electrodes 40 on the light-emitting unit 30 as an example for illustration and explanation. For example, the two second bonding electrodes 40 can be an anode and a cathode, respectively.

[0034] Furthermore, when the second bonding electrode 40 and the first bonding electrode 20 are bonded and electrically connected in a one-to-one correspondence, due to the requirements of the first bottom surface 21 and the first cross section 22 in the first bonding electrode 20, the first bonding electrode 20 in the molten state is affected by gravity, and the first bonding electrode 20 will flow in a direction perpendicular to the surface of the array substrate 10. The flowing first bonding electrode 20 will preferentially fill the projection area of ​​the first cross section 22 on the array substrate 10 except for the projection of the first bottom surface 21 on the array substrate 10, reducing the probability of the first bonding electrode 20 flowing in a direction parallel to the surface of the array substrate 10. The extension distance of the first bonding electrode 20 flowing in a direction parallel to the surface of the array substrate 10 is small, thereby effectively avoiding the situation where adjacent first bonding electrodes 20 in the molten state come into contact and cause short circuits / short-circuit during bonding due to the influence of gravity. It is understandable that the flow of the first bonding electrode 20 causes a change in the area of ​​the first bottom surface 21 of the first bonding electrode 20. The area of ​​the first bottom surface 21 of the first bonding electrode 20 after bonding is larger than the area of ​​the first bottom surface 21 of the first bonding electrode 20 before bonding. The extension distance of the flow of the first bonding electrode 20 in the direction parallel to the surface of the array substrate 10 is small. Adjacent first bonding electrodes 20 will not come into contact due to this flow change, thus preventing short circuits / short-circuit situations, and consequently preventing short circuits / short-circuit situations between the second bonding electrodes 40 of the light-emitting unit 30. It should be noted that this embodiment does not specifically limit or have special requirements on the shape of the first bonding electrode 20 after bonding. For example, the shape of the first bonding electrode 20 after bonding can be frustum-shaped, truncated pyramidal, and truncated pyramidal (the truncated pyramidal shape has protruding or recessed structures on its sides, and the overall shape is biased towards a frustum-shaped), or truncated pyramidal (the truncated pyramidal shape has protruding or recessed structures on its sides, and the overall shape is biased towards a truncated pyramidal). For example, Figure 3 The first bonding electrode 20 shown after bonding is in the shape of a frustum or a pyramid. Figure 4 The first bonding electrode 20 shown after bonding is shaped like a frustum or a pyramid. In one specific embodiment, Figure 4 This can also be understood as the shape of the intermediate state of the first bonding electrode 20 at a certain moment in the bonding process. Figure 3 This can be understood as the final shape of the first bonded electrode 20 after bonding. It can be understood that the shape of the final state after bonding caused by the flow of the molten first bonded electrode 20 is related to the size of the first bonded electrode 20, the spacing between adjacent first bonded electrodes 20, etc., and the shape of the first bonded electrode 20 after bonding is not limited to these.

[0035] In the technical solution of this invention embodiment, the fabrication method first prepares a plurality of first bonding electrodes on one side surface of an array substrate; wherein, the first bonding electrode includes a first bottom surface facing the array substrate and a first cross section parallel to the first bottom surface, and the area of ​​the first bottom surface is smaller than the area of ​​the first cross section, and the orthographic projection of the first bottom surface on the array substrate is located in the orthographic projection of the first cross section on the array substrate, and then light-emitting units are bonded to the first bonding electrodes respectively, so that the second bonding electrodes on the light-emitting units are electrically connected to the first bonding electrodes in a one-to-one correspondence; wherein, the area of ​​the first bottom surface of the first bonding electrode after bonding is larger than the area of ​​the first bottom surface of the first bonding electrode before bonding. Using the above method, before bonding, the area of ​​the first bottom surface of the first bonding electrode facing the array substrate is smaller than the area of ​​the first cross-section of the first bonding electrode. The orthographic projection of the first bottom surface on the array substrate is located in the orthographic projection of the first cross-section on the array substrate. Therefore, during bonding, the first bonding electrode in the molten state is affected by gravity and will flow in a direction perpendicular to the surface of the array substrate. The flowing first bonding electrode will preferentially fill the projection area of ​​the first cross-section on the array substrate other than the orthographic projection of the first bottom surface, reducing the probability of the first bonding electrode flowing in a direction parallel to the surface of the array substrate. The extension distance of the first bonding electrode flowing in a direction parallel to the surface of the array substrate is small, thereby effectively avoiding the contact and short circuit / short-circuit of adjacent first bonding electrodes in the molten state due to gravity during bonding. This ensures the normal display of the display panel, improves the product yield of the display panel, improves the mass transfer yield of the light-emitting unit to the array substrate, and is conducive to realizing the design of high PPI (pixels per inch) of the display panel.

[0036] Optionally, continue to refer to Figure 2 As shown in Figure a), the first bonding electrode 20 further includes a second bottom surface 23 facing away from the array substrate 10, and the area of ​​the second bottom surface 23 is smaller than the area of ​​the first cross section 22. The orthographic projection of the second bottom surface 23 on the array substrate 10 is located in the orthographic projection of the first cross section 22 on the array substrate 10. In the first direction X, the area of ​​the cross section between the first bottom surface 21 and the first cross section 22 gradually increases, and the area of ​​the cross section between the first cross section 22 and the second bottom surface 23 gradually decreases. The first direction X is parallel to the thickness direction of the array substrate 10.

[0037] Specifically, the first bonding electrode 20 includes a first bottom surface 21 facing the array substrate 10, a second bottom surface 23 facing away from the array substrate 10, and a first cross-section 22 parallel to the first bottom surface 21. The area of ​​the second bottom surface 23 is smaller than the area of ​​the first cross-section 22, and the orthographic projection of the second bottom surface 23 onto the array substrate 10 lies within the orthographic projection of the first cross-section 22 onto the array substrate 10. The area of ​​the first cross-section 22 is larger than the area of ​​the first bottom surface 21, and in the first direction X, the area of ​​the cross-section between the first bottom surface 21 and the first cross-section 22 gradually increases. The area of ​​the first cross-section 22 is larger than the area of ​​the second bottom surface 23, and in the first direction X, the area of ​​the cross-section between the second bottom surface 23 and the first cross-section 22 gradually increases. Thus, during subsequent bonding, the first bonding electrode 20 in the molten state is affected by gravity, and will flow in a direction perpendicular to the surface of the array substrate 10. The flowing first bonding electrode 20 will preferentially fill the projection area of ​​the first cross section 22 on the array substrate 10, excluding the projection of the first bottom surface 21 on the array substrate 10. Also, the flowing first bonding electrode 20 will preferentially fill the projection area of ​​the first cross section 22 on the array substrate 10, excluding the projection of the second bottom surface 23 on the array substrate 10. This effectively reduces the probability of the first bonding electrode 20 flowing in a direction parallel to the surface of the array substrate 10. The extension distance of the first bonding electrode 20 flowing in a direction parallel to the surface of the array substrate 10 is small, thereby effectively avoiding the situation where adjacent first bonding electrodes 20 in the molten state come into contact and cause short circuits / short-circuit during bonding due to the influence of gravity. It is understandable that if the area of ​​the first cross section 22 is smaller than the area of ​​the first bottom surface 21, or if the area of ​​the first cross section 22 is smaller than the area of ​​the second bottom surface 23, then during subsequent bonding, the first bonding electrode 20 in the molten state will be affected by gravity and will flow in a direction perpendicular to the surface of the array substrate 10. The first bonding electrode 20 will flow in the area on the surface of the array substrate 10 except for the orthographic projection of the first bottom surface 21 on the array substrate 10. Adjacent first bonding electrodes 20 are very likely to come into contact during the flow process, resulting in short circuits / short connections. Furthermore, based on the changes in the area of ​​the cross section between the first bottom surface 21 and the first cross section 22, and the changes in the area of ​​the cross section between the first cross section 22 and the second bottom surface 23, the shape and size of the first bonding electrode 20 before bonding can be further optimized. Under the premise of ensuring subsequent bonding requirements, the size of the first bonding electrode 20 before bonding can be effectively reduced, and the distance between adjacent first bonding electrodes 20 can be reduced, so that more first bonding electrodes 20 can be arranged on one side surface of the same array substrate 10, which is beneficial to achieving a high PPI (pixels per inch) design for the display panel.Furthermore, it should be noted that this embodiment does not limit the size relationship between the area of ​​the first bottom surface 21 and the area of ​​the second bottom surface 23. For example, the area of ​​the first bottom surface 21 can be equal to the area of ​​the second bottom surface 23, the area of ​​the first bottom surface 21 can be less than the area of ​​the second bottom surface 23, and the area of ​​the first bottom surface 21 can be greater than the area of ​​the second bottom surface 23.

[0038] Figure 5 This is a schematic flowchart of another method for manufacturing a display panel provided in an embodiment of the present invention. Figure 6 yes Figure 5 The flowchart illustrating the fabrication method of the display panel is shown in this embodiment, which is an optimization based on the above embodiment. Optionally, a plurality of first bonding electrodes are fabricated on one side surface of the array substrate, including:

[0039] Multiple mask structures are formed on one side surface of the array substrate;

[0040] Based on the mask structure, a first bonding electrode is formed by vapor deposition between adjacent mask structures;

[0041] Remove the mask structure.

[0042] For details not covered in this embodiment, please refer to the above embodiments. Figure 5 and Figure 6 As shown, the preparation method includes:

[0043] S210. Multiple mask structures are formed on one side surface of the array substrate.

[0044] Optionally, multiple mask structures are formed on one side surface of the array substrate, including: sequentially forming a first adhesive layer and a second adhesive layer on one side surface of the array substrate; wherein the first adhesive layer is a release adhesive and the second adhesive layer is a photoresist; exposing and developing the first adhesive layer and the second adhesive layer to form multiple mask structures on one side surface of the array substrate; wherein the mask structure includes a first part and a second part, and in the thickness direction of the array substrate, the second part is located on the side of the first part away from the array substrate, the first part is prepared by the first adhesive layer, the second part is prepared by the second adhesive layer, and both the first part and the second part are platform-shaped protrusions, the first part includes a first surface and a second surface that are opposite to each other, the first surface is a surface of the first part close to the array substrate, and the area of ​​the first surface is larger than the area of ​​the second surface, the second part includes a third surface and a fourth surface that are opposite to each other, the third surface is a surface of the second part close to the array substrate, and the area of ​​the third surface is larger than the area of ​​the fourth surface, and the area of ​​the third surface is larger than the area of ​​the second surface.

[0045] Specifically, refer to Figure 6As shown in Figure a), this step essentially involves fabricating the mask structure 50 using a double-layer photoresist process. First, a first photoresist layer and a second photoresist layer are sequentially formed on one side surface of the array substrate 10; that is, the second photoresist layer is located on the side surface of the first photoresist layer away from the array substrate 10. The first photoresist layer is a release sizing agent. This release sizing agent does not contain photosensitive materials and has non-photosensitive properties; it simply dissolves in the developer over time, meaning it is easily developed. For example, this release sizing agent can be a LOR (also known as LOL) photoresist. The second photoresist layer is a photoresist. For example, this photoresist can be a positive photoresist or a negative photoresist, and it can be an ultraviolet photoresist.

[0046] Subsequently, the first and second adhesive layers can be simultaneously exposed and developed to form multiple mask structures 50 on one side surface of the array substrate 10. It should be noted that, in order to obtain the desired mask structure 50, the types of the first and second adhesive layers should be matched with the developing solution, and the development time must be strictly controlled to avoid fabrication failures such as mask structure 50 collapse. That is, this embodiment performs two adhesive layer fabrication processes and one exposure and development process, which can effectively shorten the fabrication time of the mask structure 50 and improve the fabrication efficiency of the mask structure 50.

[0047] The mask structure 50 includes a first part 51 and a second part 52. In the thickness direction of the array substrate 10, the second part 52 is located on the side of the first part 51 away from the array substrate 10. The first part 51 is prepared by a first adhesive layer, and the second part 52 is prepared by a second adhesive layer. That is, after the first adhesive layer is exposed and developed, multiple first parts 51 are obtained, and after the second adhesive layer is exposed and developed, multiple second parts 52 are obtained. The first parts 51 and the second parts 52 are correspondingly contacted and arranged one-to-one. Furthermore, the second part 52 includes a third surface and a fourth surface that are opposite to each other. The third surface is a surface of the second part 52 that is close to the array substrate 10, and the fourth surface is a surface of the second part 52 that is far away from the array substrate 10. It should be noted that the material of the second part 52 can be photoresist. Since the exposure depth of the second adhesive layer at different thicknesses is different, the sidewalls of the second part 52 obtained after development of the second adhesive layer at different thicknesses are not vertical, but have a certain tilt angle. That is, the second part 52 can be a frustum-shaped protrusion. For example, the second part 52 can be a frustum-shaped protrusion or a truncated pyramid-shaped protrusion. The first part 51 includes a first surface and a second surface that are opposite to each other. The first surface is the surface of the first part 51 that is close to the array substrate 10, and the second surface is the surface of the first part 51 that is away from the array substrate 10. It should be noted that the material of the first part 51 can be a release adhesive. Due to its isotropic nature in the developer environment, the sidewalls of the first part 51 obtained after development of the first adhesive layer at different thicknesses are not vertical, but have a certain tilt angle. That is, the second part 52 can be a frustum-shaped protrusion. For example, the first part 51 can be a frustum-shaped protrusion or a truncated pyramid-shaped protrusion. Further, the area of ​​the first surface of the first part 51 that is close to the array substrate 10 is larger than the area of ​​the second surface that is away from the array substrate 10, the area of ​​the third surface of the second part 52 that is close to the array substrate 10 is larger than the area of ​​the fourth surface that is away from the array substrate 10, and the area of ​​the third surface of the second part 52 is larger than the area of ​​the second surface of the first part 51. That is, in the first direction X, the overall cross-sectional structure of the first part 51 and the second part 52 in the mask structure 50 can be a "T" shape. The first direction X is parallel to the thickness direction of the array substrate 10.

[0048] It is understandable that forming a mask structure 50 on one side surface of the array substrate 10 facilitates precise and pre-positioning for determining the location of the first bonding electrode 20 to be fabricated subsequently. The shape and size of the mask structure 50 can also be used to control the shape and size of the first bonding electrode 20 formed between adjacent mask structures 50.

[0049] S220. According to the mask structure, a first bonding electrode is formed by vapor deposition between adjacent mask structures.

[0050] Optionally, according to the mask structure, the first bonding electrode is formed by vapor deposition between adjacent mask structures, including: according to the size parameters of the first part and the second part of the mask structure, and the angle between the extension direction of the vapor deposition ray and the first direction, the first bonding electrode is formed by vapor deposition between adjacent first parts; wherein, the first direction is parallel to the thickness direction of the array substrate.

[0051] Specifically, Figure 7 This is a schematic diagram of the vapor deposition process of a first bonding electrode according to an embodiment of the present invention. Figure 8 yes Figure 7 The diagram shows an enlarged view of region M during the evaporation process of the first bonding electrode, for reference. Figure 6 Figure b) Figure 7 and Figure 8 According to the mask structure 50, a first bonding electrode 20 is deposited between adjacent mask structures 50. It is understood that the shape and size of the formed first bonding electrode 20 are related not only to the dimensional parameters of the first portion 51 and the second portion 52 in the mask structure 50, but also to the angle between the extension direction of the evaporation ray 61 during the evaporation process and the first direction X parallel to the thickness direction of the array substrate 10. Thus, based on the dimensional parameters of the first portion 51 and the second portion 52 of the mask structure 50, and the angle between the extension direction of the evaporation ray 61 and the first direction X, the first bonding electrode 20 can be deposited between adjacent first portions 51.

[0052] Furthermore, it is understood that during the vapor deposition formation of the first bonding electrode 20, the array substrate 10 is inverted, and the vapor deposition rays 61 are emitted from below the array substrate 10 onto its surface. During this process, it is also necessary to maintain relative rotation between the array substrate 10 and the vapor deposition rays 61 to ensure that the first bonding electrodes 20 formed at each location are uniform. Exemplarily, the array substrate 10 can be controlled to rotate uniformly around a central axis 62, which is parallel to the first direction X. Also, the number of vapor deposition rays 61 is large. Figure 7 and Figure 8 The number of vapor deposition rays 61 in the figure is merely an example and is not limited here.

[0053] Further, based on the dimensional parameters of the first and second parts of the mask structure, and the angle between the extension direction of the evaporation ray and the first direction, a first bonding electrode is deposited between adjacent first parts, including: satisfying the formula At that time, the first bonding electrode is formed by vapor deposition between adjacent first parts; wherein, α is the angle between the extension direction of the vapor deposition ray and the first direction, D is the distance between the first edge of the second surface and the first edge of the third surface in the second direction, the first edge of the second surface is an edge of the second surface close to the vapor deposition ray, the first edge of the third surface is an edge of the third surface close to the vapor deposition ray, L1 is the thickness of the first part in the first direction, γ is the angle between the first side surface of the first part and the first surface, the first side surface of the first part is a side surface connecting the first surface and the second surface of the first part, and the first side surface of the first part is a side surface of the first part close to the vapor deposition ray, and the second direction is perpendicular to the thickness direction of the array substrate.

[0054] Furthermore, in satisfying the formula When, after the formation of the first bonding electrode by vapor deposition between adjacent first parts begins, the process further includes: satisfying the formula At that time, the deposition of the first bonding electrode between adjacent first parts is stopped; wherein, L2 is the thickness of the first bonding electrode in the first direction.

[0055] Specifically, please refer to Figure 7 and Figure 8 Based on the dimensional parameters of the first part 51 of the mask structure 50, the thickness L1 of the first part 51 in the first direction X can be determined. Based on the dimensional parameters of the first part 51 and the second part 52 of the mask structure 50, the distance D between the first edge of the first part 51 away from the second surface of the array substrate 10 and the first edge of the second part 52 near the third surface of the array substrate 10 in the second direction Y can also be determined, wherein the first edge of the second surface is an edge of the second surface near the evaporation ray 61, and the first edge of the third surface is an edge of the third surface near the evaporation ray 61. Based on the dimensional parameters of the first part 51 and the second part 52 of the mask structure 50, the included angle γ between the first side surface of the first part 51 and the first surface can also be determined, wherein the first side surface of the first part 51 is a side surface connecting the first surface and the second surface of the first part 51, and the first side surface of the first part 51 is a side surface of the first part 51 near the evaporation ray 61. Furthermore, by reasonably adjusting the relative position between the mask structure 50 and the evaporation rays 61, the angle α between the extension direction of the evaporation rays 61 incident on adjacent first parts 51 and the first direction X can be adjusted. Thus, through a pre-adjustment process, the values ​​of at least one of the angles α, γ, distance D, and thickness L1 can be reasonably changed so that the values ​​of these angles satisfy the formula... This allows the deposition of the first bonding electrode 20 between adjacent first parts 51. Furthermore, it should be noted that the values ​​of the included angle α, included angle γ, distance D, and thickness L1 satisfy the formula... At that time, the angle α between the extension of the evaporation ray 61 incident between adjacent first parts 51 and the first direction X is close to 0, and the first bonding electrode 20 with the required shape cannot be evaporated between adjacent first parts 51 (the requirements of the first bonding electrode 20 are: the area of ​​the first bottom surface 21 of the first bonding electrode 20 is smaller than the area of ​​the first cross section 22, and further includes: the area of ​​the second bottom surface 23 of the first bonding electrode 20 is smaller than the area of ​​the first cross section 22).

[0056] The values ​​of included angle α, included angle γ, distance D, and thickness L1 satisfy the formula During this process, vapor deposition can be performed between adjacent first parts 51 to form the first bonding electrode 20 with the required shape. As the vapor deposition process time increases, the thickness L2 of the first bonding electrode 20 in the first direction X also gradually increases. Then, when the formula is satisfied... When the deposition of the first bonding electrode 20 between adjacent first parts 51 is stopped, it indicates that the first bonding electrode 20 with the required shape has been prepared (the requirements for the first bonding electrode 20 are: the area of ​​the first bottom surface 21 of the first bonding electrode 20 is smaller than the area of ​​the first cross-section 22; further, it also includes: the area of ​​the second bottom surface 23 of the first bonding electrode 20 is smaller than the area of ​​the first cross-section 22). In addition, it should be noted that, when the formula is satisfied... If the area of ​​the first bottom surface 21 of the first bonding electrode 20 is smaller than the area of ​​the first cross section 22, and the area of ​​the second bottom surface 23 of the first bonding electrode 20 is equal to the area of ​​the first cross section 22, then vapor deposition needs to continue until the area of ​​the second bottom surface 23 of the first bonding electrode 20 is smaller than the area of ​​the first cross section 22.

[0057] S230, Remove mask structure.

[0058] Specifically, refer to Figure 6 As shown in Figure c), after the first bonding electrode 20 is fabricated, the mask structure 50 can be removed. Exemplarily, the mask structure 50 can be removed by mechanical peeling or by dissolving it with a resist remover. Furthermore, it is understood that during the removal of the mask structure 50, excess vapor-deposited material 53 on the surface of the second portion 52 of the mask structure 50 away from the array substrate 10 can also be removed. After removing the mask structure 50, only the required plurality of first bonding electrodes 20 remain on one side surface of the array substrate 10.

[0059] S240. Light-emitting units are bonded to the first bonding electrode respectively, so that the second bonding electrode on the light-emitting unit is electrically connected to the first bonding electrode in a one-to-one correspondence; wherein, the area of ​​the first bottom surface of the first bonding electrode after bonding is larger than the area of ​​the first bottom surface of the first bonding electrode before bonding.

[0060] Figure 9 This is a schematic flowchart of another method for manufacturing a display panel provided in an embodiment of the present invention. Figure 10 yes Figure 9 The structural flowchart of the display panel fabrication method shown is an optimization based on the above embodiment. Optionally, light-emitting units are bonded to the first bonding electrode respectively, so that the second bonding electrode on the light-emitting unit is electrically connected to the first bonding electrode in a one-to-one correspondence, including:

[0061] In the thickness direction of the array substrate, the first bonding electrode and the second bonding electrode are placed one-to-one; wherein the orthographic projections of the first bonding electrode and the second bonding electrode on the array substrate at least partially overlap.

[0062] The array substrate is heated so that the first bonding electrode is in a molten state, so that the first bonding electrode and the second bonding electrode are electrically connected in a one-to-one correspondence.

[0063] For details not covered in this embodiment, please refer to the above embodiments. Figure 9 and Figure 10 As shown, the preparation method includes:

[0064] S310. A plurality of first bonding electrodes are prepared on one side surface of the array substrate; wherein, the first bonding electrode includes a first bottom surface facing the array substrate and a first cross section parallel to the first bottom surface, and the area of ​​the first bottom surface is smaller than the area of ​​the first cross section, and the orthographic projection of the first bottom surface on the array substrate is located in the orthographic projection of the first cross section on the array substrate.

[0065] S320. In the thickness direction of the array substrate, the first bonding electrode and the second bonding electrode are placed one-to-one; wherein the orthographic projections of the first bonding electrode and the second bonding electrode on the array substrate at least partially overlap.

[0066] Specifically, refer to Figure 10 As shown in Figure b), this step is essentially the alignment process between the array substrate 10 and the light-emitting unit 30. In the thickness direction of the array substrate 10, the first bonding electrode 20 and the second bonding electrode 40 are placed one-to-one; wherein the orthographic projections of the first bonding electrode 20 and the second bonding electrode 40 on the array substrate 10 at least partially overlap. For example, the light-emitting unit 30 can be grasped by an instrument, and the side surface of the light-emitting unit 30 with the second bonding electrode 40 is positioned opposite the side surface of the array substrate 10 with the first bonding electrode 20, so that the plurality of first bonding electrodes 20 and the plurality of second bonding electrodes 40 correspond one-to-one in the thickness direction of the array substrate 10. This lays the foundation for bonding accuracy in the subsequent bonding process between the array substrate 10 and the light-emitting unit 30.

[0067] S330, Heating the array substrate so that the first bonding electrode is in a molten state, so that the first bonding electrode and the second bonding electrode are electrically connected in a one-to-one correspondence.

[0068] Specifically, refer to Figure 10 In Figure c), the array substrate 10 is heated so that the first bonding electrode 20 is in a molten state, thereby forming a eutectic structure with the second bonding electrode 40 in a one-to-one correspondence, which also results in the first bonding electrode 20 and the second bonding electrode 40 being electrically connected in a one-to-one correspondence. Furthermore, after bonding, the pixel driving circuit at the array substrate 10 can sequentially drive the corresponding light-emitting unit 30 to emit light through the first bonding electrode 20 and the second bonding electrode 40.

[0069] Based on the same inventive concept, embodiments of the present invention also provide a display panel. (Continue to refer to...) Figure 3 and Figure 4 The display panel is manufactured using the display panel manufacturing method provided in any one of the embodiments of the present invention.

[0070] Based on the same inventive concept, embodiments of the present invention also provide a display device. Figure 11 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention, such as... Figure 11 As shown, the display device includes a display panel 1 provided in any one of the embodiments of the present invention. Therefore, the display device provided in the embodiments of the present invention has the corresponding beneficial effects of the display panel 1 provided in the embodiments of the present invention, which will not be described again here. Exemplarily, the display device can be an electronic device such as a mobile phone, computer, smart wearable device (e.g., smartwatch), and in-vehicle display device, and the embodiments of the present invention do not limit it in this regard.

[0071] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method for manufacturing a display panel, characterized in that, include: A plurality of first bonding electrodes are formed on one side surface of an array substrate; wherein, the first bonding electrode includes a first bottom surface facing the array substrate and a first cross section parallel to the first bottom surface, and the area of ​​the first bottom surface is smaller than the area of ​​the first cross section, and the orthographic projection of the first bottom surface on the array substrate is located in the orthographic projection of the first cross section on the array substrate. Light-emitting units are bonded to the first bonding electrode respectively, so that the second bonding electrode on the light-emitting unit is electrically connected to the first bonding electrode in a one-to-one correspondence; wherein, the area of ​​the first bottom surface of the first bonding electrode after bonding is larger than the area of ​​the first bottom surface of the first bonding electrode before bonding; The first bonding electrode further includes a second bottom surface facing away from the array substrate, and the area of ​​the second bottom surface is smaller than the area of ​​the first cross section. The orthographic projection of the second bottom surface on the array substrate is located in the orthographic projection of the first cross section on the array substrate. In a first direction, the area of ​​the cross section between the first bottom surface and the first cross section gradually increases, and the area of ​​the cross section between the first cross section and the second bottom surface gradually decreases; wherein, the first direction is parallel to the thickness direction of the array substrate.

2. The preparation method according to claim 1, characterized in that, Multiple first bonding electrodes are fabricated on one side surface of the array substrate, including: Multiple mask structures are formed on one side surface of the array substrate; According to the mask structure, the first bonding electrode is deposited between adjacent mask structures by vapor deposition; Remove the mask structure.

3. The preparation method according to claim 2, characterized in that, Multiple mask structures are formed on one side surface of the array substrate, including: A first adhesive layer and a second adhesive layer are sequentially formed on one side surface of the array substrate; wherein, the first adhesive layer is a release adhesive and the second adhesive layer is a photoresist; The first adhesive layer and the second adhesive layer are exposed and developed to form a plurality of mask structures on one side surface of the array substrate; wherein, the mask structure includes a first part and a second part, and in the thickness direction of the array substrate, the second part is located on the side of the first part away from the array substrate. The first part is prepared by the first adhesive layer, and the second part is prepared by the second adhesive layer. Both the first part and the second part are platform-shaped protrusions. The first part includes a first surface and a second surface that are opposite to each other. The first surface is a surface of the first part that is close to the array substrate, and the area of ​​the first surface is larger than the area of ​​the second surface. The second part includes a third surface and a fourth surface that are opposite to each other. The third surface is a surface of the second part that is close to the array substrate, and the area of ​​the third surface is larger than the area of ​​the fourth surface. The area of ​​the third surface is larger than the area of ​​the second surface.

4. The preparation method according to claim 3, characterized in that, According to the mask structure, the first bonding electrode is formed by vapor deposition between adjacent mask structures, including: Based on the dimensional parameters of the first and second portions of the mask structure, and the angle between the extension direction of the evaporation ray and the first direction, the first bonding electrode is formed by evaporation between adjacent first portions; wherein the first direction is parallel to the thickness direction of the array substrate.

5. The preparation method according to claim 4, characterized in that, Based on the dimensional parameters of the first and second portions of the mask structure, and the angle between the extension direction of the evaporation ray and the first direction, the first bonding electrode is formed by evaporation between adjacent first portions, including: In satisfying the formula At that time, the first bonding electrode is formed by vapor deposition between adjacent first portions; wherein, α is the angle between the extension direction of the vapor deposition ray and the first direction, D is the distance between the first edge of the second surface and the first edge of the third surface in the second direction, the first edge of the second surface is an edge of the second surface near the vapor deposition ray, the first edge of the third surface is an edge of the third surface near the vapor deposition ray, L1 is the thickness of the first portion in the first direction, γ is the angle between the first side surface of the first portion and the first surface, the first side surface of the first portion is a side surface connecting the first surface and the second surface of the first portion, and the first side surface of the first portion is a side surface of the first portion near the vapor deposition ray, and the second direction is perpendicular to the thickness direction of the array substrate.

6. The preparation method according to claim 5, characterized in that, In satisfying the formula When, after the first bonding electrode is formed by vapor deposition between adjacent first portions, the process further includes: In satisfying the formula At that time, the deposition of the first bonding electrode between adjacent first portions is stopped; wherein, L2 is the thickness of the first bonding electrode in the first direction.

7. The preparation method according to claim 1, characterized in that, Light-emitting units are bonded to the first bonding electrode respectively, so that the second bonding electrodes on the light-emitting units are electrically connected to the first bonding electrodes in a one-to-one correspondence, including: In the thickness direction of the array substrate, the first bonding electrode and the second bonding electrode are placed in a one-to-one correspondence; wherein the orthographic projections of the first bonding electrode and the second bonding electrode on the array substrate at least partially overlap. The array substrate is heated so that the first bonding electrode is in a molten state, so that the first bonding electrode and the second bonding electrode are electrically connected in a one-to-one correspondence.

8. A display panel, characterized in that, It is manufactured using the method for manufacturing a display panel as described in any one of claims 1-7.

9. A display device, characterized in that, Includes the display panel as described in claim 8.

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