Surface mount process for memory socket

Abstract

Embodiments of the present disclosure provide a surface mounting process of a memory slot. The surface mounting process of the memory slot comprises printing solder paste on pads of a PCB, mounting other devices except the memory slot to the PCB, mounting the memory slot to the PCB manually, reflow soldering the memory slot and the other devices to the PCB, and detecting soldering quality of the memory slot and the other devices. The surface mounting process of the memory slot can manually mount the memory slot on the PCB, and the man-hour of manually mounting the memory slot is less than that of automatically mounting the memory slot including multiple material changing, so that the mounting efficiency of the memory slot can be improved. In addition, the memory slot material disc does not need to be cut, and the risk of deformation of the memory slot pin caused by cutting the memory slot material disc can be reduced, so that the yield of the product can be improved.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to the field of semiconductor technology, and particularly to a surface mounting process of a memory slot. BACKGROUND

[0002] Surface Mount Technology (SMT) is a process of directly mounting electronic components on the surface of a Printed Circuit Board (PCB). Compared with the traditional pin assembly method, SMT has higher assembly density, smaller product volume and lighter weight. At the same time, since the components are directly mounted on the surface of the PCB, the use of connectors is reduced, thereby improving the reliability of the product.

[0003] The existing SMT equipment cannot place the memory slot tray in a position with sufficient size, and the position for placing the memory slot tray can be changed. After changing the position for placing the memory slot tray, the angle of the memory slot cannot be adjusted due to the interference of the sensor in the SMT equipment, and thus the direction of the PCB needs to be adjusted. However, after adjusting the direction of the PCB, the PCB exceeds the maximum support size of the track of the SMT equipment, and thus the production requirement cannot be met. Therefore, the memory slot tray can be cut into two parts. However, after cutting the memory slot tray into two parts, the memory slot needs to be replaced frequently during automatic mounting, which increases the working hours for mounting the memory slot and reduces the mounting efficiency of the memory slot. SUMMARY

[0004] Embodiments of the present disclosure provide a surface mounting process of a memory slot, which can improve the mounting efficiency of the memory slot.

[0005] The present disclosure provides a surface mounting process of a memory slot, which comprises:

[0006] printing solder paste on pads of a printed circuit board; mounting other devices, including at least one of a resistor, a capacitor and a ball grid array chip, to the printed circuit board except for the memory slot; manually mounting the memory slot to the printed circuit board; reflow soldering the memory slot and the other devices to the printed circuit board; and detecting the soldering quality of the memory slot and the other devices.

[0007] In some embodiments of the present disclosure, a first surface of the memory slot is provided with a first positioning member, a second positioning member and a third positioning member, the first positioning member and the second positioning member are located on opposite sides of the first surface, and the third positioning member is located between the first positioning member and the second positioning member. A surface of the printed circuit board is provided with a first positioning hole, a second positioning hole and a third positioning hole.

[0008] The manually mounting the memory slot to the printed circuit board comprises:

[0009] inserting the first positioning member into the first positioning hole, inserting the third positioning member into the third positioning hole, and inserting the second positioning member into the second positioning hole; and pressing a second surface of the memory slot, the second surface being opposite to the first surface.

[0010] In some embodiments of the present disclosure, before the inserting the first positioning member into the first positioning hole, the inserting the third positioning member into the third positioning hole, and the inserting the second positioning member into the second positioning hole, the method further comprises:

[0011] The side surface of the printed circuit board printed with the tin paste faces away from the tray, and the printed circuit board is fixed on the tray.

[0012] In some embodiments of the present disclosure, the pressing the second surface of the memory slot comprises:

[0013] The pressing jig is fixedly installed on the tray, so that the pressing jig presses the second surface.

[0014] In some embodiments of the present disclosure, the reflow soldering the memory slot and the other devices to the printed circuit board comprises:

[0015] The tray on which the printed circuit board and the pressing jig are fixed is sent into a reflow furnace, so that the memory slot and the other devices are soldered to the printed circuit board.

[0016] In some embodiments of the present disclosure, before the detecting the soldering quality of the memory slot and the other devices, the method further comprises:

[0017] The pressing jig is removed, and the printed circuit board is removed from the tray.

[0018] In some embodiments of the present disclosure, the detecting the soldering quality of the memory slot and the other devices comprises:

[0019] Based on a multi-angle camera, a soldering image of a pin of the memory slot and the other devices is acquired, and the soldering quality is determined according to the soldering image and a corresponding soldering standard image.

[0020] In some embodiments of the present disclosure, before the reflow soldering the memory slot and the other devices to the printed circuit board, the method further comprises:

[0021] Based on a multi-angle camera, a mounting image of the memory slot and the pins of the other device is acquired; according to the mounting image and a corresponding mounting standard image, mounting quality of the memory slot and the other device is determined; and the printed circuit board on which the mounting quality of the memory slot and the other device is all qualified is sent into a reflow oven.

[0022] In some embodiments of the present disclosure, the surface mounting process of the memory slot further includes:

[0023] The memory slot with unqualified welding quality is removed from the printed circuit board; the tin paste remaining on the solder pad from which the memory slot is removed is removed; tin paste is printed on all pins of the removed memory slot; and the removed memory slot is welded to the corresponding printed circuit board.

[0024] In some embodiments of the present disclosure, before the other device other than the memory slot is mounted to the printed circuit board, the method further includes:

[0025] The tin paste printing quality of the printed circuit board is detected.

[0026] In the technical solution of the embodiments of the present disclosure, by printing tin paste on the solder pad of the PCB, mounting the other device other than the memory slot to the PCB, manually mounting the memory slot to the PCB, and reflow welding the memory slot and the other device to the PCB, and detecting the welding quality of the memory slot and the other device, the memory slot can be manually mounted on the PCB, and the working hours of manually mounting the memory slot are less than the working hours of automatically mounting the memory slot including multiple material changes, so that the mounting efficiency of the memory slot can be improved. In addition, the memory slot material disc does not need to be cut, and the risk of deformation of the memory slot pins caused by cutting the memory slot material disc can be reduced, so that the yield of the product can be improved.

[0027] The above description is only a summary of the technical solutions of the embodiments of the present application, in order to more clearly understand the technical means of the embodiments of the present application, the embodiments of the present application can be implemented according to the content of the specification, and in order to make the above and other purposes, characteristics and advantages of the embodiments of the present application more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creating any creative labor.

[0029] Figure 1 A structural schematic diagram of a memory slot material disc is provided for the embodiments of the present disclosure.

[0030] Figure 2 A memory slot mounting direction diagram is provided for the embodiments of the present disclosure.

[0031] Figure 3 A flow chart of a surface mounting process of a memory slot is provided for the embodiments of the present disclosure.

[0032] Figure 4 A structure diagram of a memory slot is provided for the embodiments of the present disclosure.

[0033] Figure 5 A structure diagram of a PCB is provided for the embodiments of the present disclosure.

[0034] Figure 6 A flow chart of another surface mounting process of a memory slot is provided for the embodiments of the present disclosure.

[0035] Figure 7 A flow chart of still another surface mounting process of a memory slot is provided for the embodiments of the present disclosure. DETAILED DESCRIPTION

[0036] In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without any inventive effort fall within the scope of protection of the present disclosure.

[0037] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this present subject matter belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the specification and relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. As used herein, the statement that two or more parts are "electrically connected" together shall mean that the parts are either directly connected to one another or connected to one another through one or more intermediary parts.

[0038] Reference in the specification to "an embodiment" or "the embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in an embodiment" or "in the embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily all directed to the same embodiment, or to a single alternative embodiment. It is expressly understood that any of the embodiments described herein can be combined with any of the other embodiments unless specifically noted otherwise.

[0039] In addition, the terms "first", "second", and the like in the description and claims of the present disclosure or the above drawings are used to distinguish different objects, and are not used to describe a specific order, and can explicitly or implicitly include one or more of the features.

[0040] The term "and / or" in the present disclosure is only used to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent three cases of existence of A, existence of A and B, and existence of B. In addition, the character " / " herein generally represents an "or" relationship between the front and rear associated objects.

[0041] In the description of the present disclosure, unless otherwise specified, the meanings of "multiple" and "at least two" are two or more (including two), and similarly, "multiple groups" and "at least two groups" mean two or more groups (including two groups).

[0042] In order for those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings.

[0043] Figure 1 A structural schematic diagram of a memory slot tray provided by an embodiment of the present disclosure is shown in Figure 1 The size of the memory slot tray is 310mmx150mm.

[0044] The size of the incoming material placement area of the existing SMT device is 238mmx210mm, which is obviously not enough to place the memory slot tray. In order to solve this problem, the specific position of the incoming material placement area of the SMT device can be considered to be changed, and there is an area with a size of 370mmx400mm in the current SMT device, which can be set as the incoming material placement area to place the memory slot tray.

[0045] Figure 2 A memory slot mounting direction schematic diagram provided by an embodiment of the present disclosure is shown in Figure 2 As shown in (a), after the PCB enters the track of the SMT device, the memory slot mounting position on the PCB extends in the X direction, therefore, the memory slot mounting direction required by the PCB is the X direction. In fact, after the PCB enters the track of the SMT device, the mounting direction of the SMT device is the Y direction, therefore, the direction of the PCB or the memory slot needs to be adjusted to make the mounting direction of the SMT device and the memory slot mounting direction required by the PCB the same.

[0046] If the 370mmx400mm area is used to place the memory slot tray, the direction of the memory slot cannot be adjusted due to the interference of the sensor, that is, only the direction of the PCB can be adjusted. As shown in Figure 2(b) as shown, the PCB can be rotated by 90° so that the mounting direction of the SMT equipment and the mounting direction of the memory slot required by the PCB are both Y directions. However, in actual production, the size of the PCB of model A is 420 mm x 280 mm, the maximum supportable size of the track of the SMT equipment is 600 x 370 mm, and the size of the PCB after being rotated by 90° is 280 mm x 420 mm, which obviously exceeds the maximum supportable size of the track of the SMT equipment, and cannot meet the production requirements.

[0047] In this way, the incoming placement area of the SMT equipment can be considered not to be changed, and the memory slot magazine can be cut into two parts so that the incoming placement area can place the cut memory slot magazine. However, if the cut memory slot magazine is used, the magazine is replaced relatively frequently during the memory slot mounting process, and each replacement of the magazine increases the working hours by 80 s, thereby increasing the mounting working hours of the memory slot and resulting in a relatively low mounting efficiency of the memory slot. In addition, during the process of cutting the memory slot magazine, the memory slot pin may be deformed.

[0048] Therefore, the present disclosure provides a surface mounting process of a memory slot. By printing solder paste on the pads of a PCB, mounting other devices except the memory slot to the PCB, manually mounting the memory slot to the PCB, and reflow soldering the memory slot and the other devices to the PCB, the welding quality of the memory slot and the other devices is detected. The mounting working hours of the memory slot manually mounted on the PCB are less than the mounting working hours of the memory slot automatically mounted including multiple replacements of the magazine, thereby improving the mounting efficiency of the memory slot. In addition, the memory slot magazine does not need to be cut, and the risk of deformation of the memory slot pin caused by cutting the memory slot magazine can be reduced, thereby improving the yield of the product.

[0049] The technical solutions of the present disclosure will be described in detail below with several specific embodiments.

[0050] Figure 3 A flowchart of a surface mounting process of a memory slot provided by an embodiment of the present disclosure is shown in Figure 3 As shown, the surface mounting process of the memory slot includes:

[0051] S101, printing solder paste on the pads of a PCB.

[0052] For example, the PCB can be transmitted to a screen printer. The screen printer includes a steel screen, the steel screen is placed on the surface of the PCB, the position of the steel screen is adjusted so that the hollow part of the steel screen fully exposes all the pads required for mounting the PCB, and the steel screen is fixed. For example, the size of the hollow part of the steel screen is 1 mm outwardly expanded from the size of the pad, and the thickness of the steel screen is 0.12 mm.

[0053] The screen printer further includes a squeegee by which the solder paste is spread on the apertures of the screen to print the solder paste on all the pads required for mounting on the PCB. After the solder paste is printed on the pads, the screen is removed and the PCB is transferred to the next station.

[0054] S102, mounting other components than the memory slot on the PCB.

[0055] For example, the components to be mounted include the memory slot and other components than the memory slot, and the other components include at least one of a resistor, a capacitor and a Ball Grid Array (BGA) chip. The BGA is a high-density surface-mount packaging technology in which the pins on the bottom of the package are formed into balls and arranged in a pattern similar to a grid.

[0056] In some embodiments, the other components include the resistor, the capacitor or the BGA chip. If the components to be mounted include the BGA chip, the PCB is transferred to a first Chip Mounter, and the first Chip Mounter can mount the BGA chip on the corresponding BGA chip mounting position on the PCB. The first Chip Mounter is used to mount components with pins on the bottom, such as the BGA chip.

[0057] If the components to be mounted include the resistor, the PCB is transferred to a second Chip Mounter, and the second Chip Mounter can mount the resistor on the corresponding resistor mounting position on the PCB. If the components to be mounted include the capacitor, the PCB is transferred to the second Chip Mounter, and the second Chip Mounter can mount the capacitor on the corresponding capacitor mounting position on the PCB. The second Chip Mounter is used to mount components with pins on the side, such as the resistor and the capacitor.

[0058] In other embodiments, the other components include any two of the resistor, the capacitor and the BGA chip. If the components to be mounted include the resistor and the capacitor, the PCB is transferred to the second Chip Mounter, and the second Chip Mounter can mount the resistor on the corresponding resistor mounting position on the PCB and the capacitor on the corresponding capacitor mounting position on the PCB.

[0059] If the components to be mounted include BGA chips and capacitors, the PCB can be first transmitted to the first Chip Mounter, the first Chip Mounter mounts the BGA chips on the corresponding BGA chip mounting positions on the PCB, and then the PCB is transmitted to the second Chip Mounter, the second Chip Mounter mounts the capacitors on the corresponding capacitor mounting positions on the PCB. Alternatively, the PCB can be first transmitted to the second Chip Mounter, the second Chip Mounter mounts the capacitors on the corresponding capacitor mounting positions on the PCB, and then the PCB is transmitted to the first Chip Mounter, the first Chip Mounter mounts the BGA chips on the corresponding BGA chip mounting positions on the PCB.

[0060] If the components to be mounted include BGA chips and resistors, the PCB can be first transmitted to the first Chip Mounter, the first Chip Mounter mounts the BGA chips on the corresponding BGA chip mounting positions on the PCB, and then the PCB is transmitted to the second Chip Mounter, the second Chip Mounter mounts the resistors on the corresponding resistor mounting positions on the PCB. Alternatively, the PCB can be first transmitted to the second Chip Mounter, the second Chip Mounter mounts the resistors on the corresponding resistor mounting positions on the PCB, and then the PCB is transmitted to the first Chip Mounter, the first Chip Mounter mounts the BGA chips on the corresponding BGA chip mounting positions on the PCB.

[0061] In yet other embodiments, the other components include resistors, capacitors and BGA chips. The PCB can be first transmitted to the first Chip Mounter, the first Chip Mounter mounts the BGA chips on the corresponding BGA chip mounting positions on the PCB, and then the PCB is transmitted to the second Chip Mounter, the second Chip Mounter mounts the resistors on the corresponding resistor mounting positions on the PCB and the capacitors on the corresponding capacitor mounting positions on the PCB. Alternatively, the PCB can be first transmitted to the second Chip Mounter, the second Chip Mounter mounts the resistors on the corresponding resistor mounting positions on the PCB and the capacitors on the corresponding capacitor mounting positions on the PCB, and then the PCB is transmitted to the first Chip Mounter, the first Chip Mounter mounts the BGA chips on the corresponding BGA chip mounting positions on the PCB.

[0062] S103, manually mount the memory slot to the PCB.

[0063] Exemplary, Figure 4This is a schematic diagram of a memory slot provided in an embodiment of the present disclosure, such as... Figure 4 As shown, the memory slot includes a first surface 10a and a second surface 10b opposite to each other. The first surface 10a is provided with a first positioning member 11, a second positioning member 12 and a third positioning member 13.

[0064] The first positioning element 11 and the second positioning element 12 are located on opposite sides of the first surface 10a, and the third positioning element 13 is located between the first positioning element 11 and the second positioning element 12. For example, the first positioning element 11, the second positioning element 12 and the third positioning element 13 are all harpoon feet.

[0065] Figure 5 This is a schematic diagram of a PCB structure provided in an embodiment of the present disclosure, such as... Figure 5 As shown, the surface of the PCB is provided with a first positioning hole 21, a second positioning hole 22 and a third positioning hole 23.

[0066] For example, such as Figure 5 As shown, the PCB surface has eight memory slot mounting positions, from left to right: first memory slot mounting position, second memory slot mounting position, third memory slot mounting position, fourth memory slot mounting position, fifth memory slot mounting position, sixth memory slot mounting position, seventh memory slot mounting position, and eighth memory slot mounting position. Each memory slot mounting position includes a first positioning hole 21, a second positioning hole 22, and a third positioning hole 23.

[0067] It should be noted that, Figure 5 This example only illustrates that the number of memory slot mounting positions on the PCB surface is eight. In practical applications, the number of memory slot mounting positions on the PCB surface can be any integer less than or greater than eight, and this disclosure does not impose any specific limitations on this.

[0068] For example, after all other components except the memory slots are mounted on the PCB, the PCB is transferred to the memory slot manual placement station. At the memory slot manual placement station, the memory slots can be manually mounted onto the PCB. The time required for manual memory slot mounting is less than that required for automated memory slot mounting, which includes multiple component changes, thereby improving the mounting efficiency of the memory slots.

[0069] In addition, manually mounting memory slots eliminates the need to cut memory slot trays, reducing the risk of memory slot pin deformation caused by cutting memory slot trays and thus improving product yield.

[0070] Figure 6 This is another surface mount process for memory slots provided in embodiments of the present disclosure. Figure 6 for Figure 3 Based on the illustrated embodiment, a specific description of a possible implementation of S103 is as follows:

[0071] S201, inserting the first positioning member into the first positioning hole, inserting the third positioning member into the third positioning hole, and inserting the second positioning member into the second positioning hole.

[0072] For example, continuing to refer to Figure 4 and Figure 5 , the first positioning member 11 of the first memory slot is inserted into the first positioning hole 21 of the first memory slot mounting position, the third positioning member 13 of the first memory slot is inserted into the third positioning hole 23 of the first memory slot mounting position, and the second positioning member 12 of the first memory slot is inserted into the second positioning hole 22 of the first memory slot mounting position, so as to manually mount the first memory slot to the first memory slot mounting position.

[0073] In order, the second memory slot is manually mounted to the second memory slot mounting position, the third memory slot is manually mounted to the third memory slot mounting position, the fourth memory slot is manually mounted to the fourth memory slot mounting position, the fifth memory slot is manually mounted to the fifth memory slot mounting position, the sixth memory slot is manually mounted to the sixth memory slot mounting position, the seventh memory slot is manually mounted to the seventh memory slot mounting position, and the eighth memory slot is manually mounted to the eighth memory slot mounting position.

[0074] In other embodiments, the first positioning member 11 of the first memory slot can be inserted into the first positioning hole 21 of the eighth memory slot mounting position, the third positioning member 13 of the first memory slot can be inserted into the third positioning hole 23 of the eighth memory slot mounting position, and the second positioning member 12 of the first memory slot can be inserted into the second positioning hole 22 of the eighth memory slot mounting position, so as to manually mount the first memory slot to the eighth memory slot mounting position.

[0075] In order, the second memory slot is manually mounted to the seventh memory slot mounting position, the third memory slot is manually mounted to the sixth memory slot mounting position, the fourth memory slot is manually mounted to the fifth memory slot mounting position, the fifth memory slot is manually mounted to the fourth memory slot mounting position, the sixth memory slot is manually mounted to the third memory slot mounting position, the seventh memory slot is manually mounted to the second memory slot mounting position, and the eighth memory slot is manually mounted to the first memory slot mounting position.

[0076] S202, pressing the second surface of the memory slot.

[0077] For example, continuing to refer to Figure 4The memory slot further comprises a plurality of memory slot pins 14, and the memory slot pins 14 are located in the region between the first positioning member 11 and the second positioning member 12. After all the memory slots are attached to the memory slot attachment positions on the PCB, the second surfaces 10b of all the memory slots can be pressed at the same time to make the memory slot pins 14 of all the memory slots fully contact the corresponding solder paste and pads. Alternatively, after each memory slot is attached to the memory slot attachment position, the second surface 10b of the memory slot on the memory slot attachment position can be pressed to make the memory slot pins 14 of the memory slot fully contact the corresponding solder paste and pads, until the second surface 10b of the memory slot on the last memory slot attachment position is pressed after the last memory slot is attached to the last memory slot attachment position to make the memory slot pins 14 of the last memory slot fully contact the corresponding solder paste and pads.

[0078] S104, reflow soldering the memory slots and other devices to the PCB.

[0079] For example, the PCB on which all the other devices and the memory slots are attached is transmitted to a reflow oven. After the PCB is baked by the high temperature of the reflow oven, the memory slots and the other devices can be soldered to the PCB after cooling.

[0080] S105, detecting the soldering quality of the memory slots and the other devices.

[0081] For example, the PCB on which the memory slots and the other devices are soldered is transmitted to an automatic optical inspection (AOI) device. Since the memory slot pins 14 are located at the bottom of the memory slot, the BGA chip pins are located at the bottom of the BGA chip, the capacitor pins are located at the side of the capacitor, and the resistance pins are located at the side of the resistance, the AOI device comprises a multi-angle camera to obtain soldering images of the pins in different directions. For example, the AOI device comprises at least two side cameras.

[0082] Figure 7 Another surface mounting process of a memory slot provided by an embodiment of the present disclosure, Figure 7 For Figure 3 Based on the embodiment shown, a specific description of a possible implementation manner of S105 is as follows:

[0083] S301, based on the multi-angle camera, obtaining soldering images of the pins of the memory slots and the other devices.

[0084] For example, all the memory slot pins of each memory slot are distributed into two rows, which can be referred to as the first row of memory slot pins and the second row of memory slot pins.

[0085] In some embodiments, the AOI device comprises a first side camera, a second side camera, and a top camera.

[0086] For example, if the PCB has memory slots and resistors soldered thereon, the first side camera can capture soldering images of the pins of the first row of memory slots, the second side camera can capture soldering images of the pins of the second row of memory slots, and the top camera can capture soldering images of the pins of the resistors. If the PCB has memory slots and capacitors soldered thereon, the first side camera can capture soldering images of the pins of the first row of memory slots, the second side camera can capture soldering images of the pins of the second row of memory slots, and the top camera can capture soldering images of the pins of the capacitors. If the PCB has memory slots, resistors, and capacitors soldered thereon, the first side camera can capture soldering images of the pins of the first row of memory slots, the second side camera can capture soldering images of the pins of the second row of memory slots, and the top camera can capture soldering images of the pins of the resistors and the pins of the capacitors.

[0087] In other embodiments, the AOI apparatus includes a first side camera, a second side camera, a third side camera, and a fourth side camera.

[0088] For example, if the PCB has memory slots and BGA chips soldered thereon, the first side camera can capture soldering images of the pins of the first row of memory slots, the second side camera can capture soldering images of the pins of the second row of memory slots, and the first side camera, the second side camera, the third side camera, and the fourth side camera can capture soldering images of the pins of the BGA chips at different orientations.

[0089] In yet other embodiments, the AOI apparatus includes a top camera, a first side camera, a second side camera, a third side camera, and a fourth side camera.

[0090] For example, if the PCB has memory slots, BGA chips, and resistors soldered thereon, the first side camera can capture soldering images of the pins of the first row of memory slots, the second side camera can capture soldering images of the pins of the second row of memory slots, the top camera can capture soldering images of the pins of the resistors, and the first side camera, the second side camera, the third side camera, and the fourth side camera can capture soldering images of the pins of the BGA chips at different orientations. If the PCB has memory slots, BGA chips, and capacitors soldered thereon, the first side camera can capture soldering images of the pins of the first row of memory slots, the second side camera can capture soldering images of the pins of the second row of memory slots, the top camera can capture soldering images of the pins of the capacitors, and the first side camera, the second side camera, the third side camera, and the fourth side camera can capture soldering images of the pins of the BGA chips at different orientations. If the PCB has memory slots, BGA chips, resistors, and capacitors soldered thereon, the first side camera can capture soldering images of the pins of the first row of memory slots, the second side camera can capture soldering images of the pins of the second row of memory slots, the top camera can capture soldering images of the pins of the resistors and the pins of the capacitors, and the first side camera, the second side camera, the third side camera, and the fourth side camera can capture soldering images of the pins of the BGA chips at different orientations.

[0091] Thus, the multiple side cameras of the AOI device can acquire soldering images of the multiple memory slot pins, and the top camera and / or the multiple side cameras of the AOI device can acquire soldering images of the pins of other devices.

[0092] S302, determine the soldering quality according to the soldering image and the corresponding soldering standard image.

[0093] For example, the first side camera corresponds to a first soldering standard image, the second side camera corresponds to a second soldering standard image, the third side camera corresponds to a third soldering standard image, the fourth side camera corresponds to a fourth soldering standard image, and the top camera corresponds to a fifth soldering standard image.

[0094] For example, when there is at least one memory slot pin in the first row of memory slot pins that is missing, false, short, or shorted, it is determined that the first row of memory slot pins has missing, false, short, and shorted pins, i.e., the soldering quality of the first row of memory slot pins is unqualified. When there is no memory slot pin in the first row of memory slot pins that is missing, false, short, or shorted, it is determined that the first row of memory slot pins has no missing, false, short, and shorted pins, i.e., the soldering quality of the first row of memory slot pins is qualified.

[0095] For example, when there is at least one memory slot pin in the second row of memory slot pins that is missing, false, short, or shorted, it is determined that the second row of memory slot pins has missing, false, short, and shorted pins, i.e., the soldering quality of the second row of memory slot pins is unqualified. When there is no memory slot pin in the second row of memory slot pins that is missing, false, short, or shorted, it is determined that the second row of memory slot pins has no missing, false, short, and shorted pins, i.e., the soldering quality of the second row of memory slot pins is qualified.

[0096] According to the soldering quality of the first row of memory slot pins and the soldering quality of the second row of memory slot pins, the soldering quality of the memory slot is determined. For example, when the soldering quality of the first row of memory slot pins or the second row of memory slot pins is unqualified, it is determined that the soldering quality of the corresponding memory slot is unqualified. When the soldering quality of the first row of memory slot pins and the second row of memory slot pins is qualified, it is determined that the soldering quality of the corresponding memory slot is qualified.

[0097] In this way, by comparing the soldering images of all memory slot pins of the same memory slot with their corresponding soldering standard images, the soldering quality of the memory slot can be determined.

[0098] Each resistance pin in the soldering image of the resistance pin is compared with the fifth soldering standard image to determine the soldering quality of each resistance pin. For example, when a resistance pin is loose, false, short of tin, or continuous tin, the soldering quality of the resistance pin is determined to be unqualified.

[0099] Then, according to the soldering quality of all resistance pins of the same resistance, the soldering quality of the resistance is determined. For example, when the soldering quality of at least one resistance pin of the same resistance is unqualified, the soldering quality of the resistance is determined to be unqualified, and when the soldering quality of all resistance pins of the same resistance is qualified, the soldering quality of the resistance is determined to be qualified.

[0100] Each capacitor pin in the soldering image of the capacitor pin is compared with the fifth soldering standard image to determine the soldering quality of each capacitor pin. For example, when a capacitor pin is loose, false, short of tin, or continuous tin, the soldering quality of the capacitor pin is determined to be unqualified.

[0101] Then, according to the soldering quality of all capacitor pins of the same capacitor, the soldering quality of the capacitor is determined. For example, when the soldering quality of at least one capacitor pin of the same capacitor is unqualified, the soldering quality of the capacitor is determined to be unqualified, and when the soldering quality of all capacitor pins of the same capacitor is qualified, the soldering quality of the capacitor is determined to be qualified.

[0102] Each BGA chip pin in the soldering image of the BGA chip pin captured by the first side camera is compared with the first soldering standard image, each BGA chip pin in the soldering image of the BGA chip pin captured by the second side camera is compared with the second soldering standard image, each BGA chip pin in the soldering image of the BGA chip pin captured by the third side camera is compared with the third soldering standard image, and each BGA chip pin in the soldering image of the BGA chip pin captured by the fourth side camera is compared with the fourth soldering standard image to determine the soldering quality of each BGA chip pin. For example, when a BGA chip pin is loose, false, short of tin, or continuous tin, the soldering quality of the BGA chip pin is determined to be unqualified.

[0103] Then, the soldering quality of the BGA chip is determined according to the soldering quality of all the BGA chip pins of the same BGA chip. For example, when the soldering quality of at least one BGA chip pin of the same BGA chip is unqualified, it is determined that the soldering quality of the BGA chip is unqualified, and when the soldering quality of all the BGA chip pins of the same BGA chip is qualified, it is determined that the soldering quality of the BGA chip is qualified.

[0104] In this way, by comparing the soldering images of all the pins of the same other device with the corresponding soldering standard images, the soldering quality of the other device can be determined.

[0105] It should be noted that the embodiments of the present disclosure only give a specific implementation of detecting the soldering quality of the BGA chip, the capacitor, the resistor and the memory slot by the AOI device. In actual production lines, the soldering quality of the capacitor, the resistor and the memory slot can also be detected by the AOI device, and the soldering quality of the BGA chip can be detected by the X-RAY device.

[0106] In some embodiments, the memory slot manual mounting station includes a tray arranged on a horizontal plane. Before S201 is performed, the side surface of the PCB printed with the solder paste faces away from the tray, and the PCB is fixed on the tray so that the PCB cannot move on the horizontal plane, facilitating subsequent mounting of the memory slot.

[0107] In some embodiments, the memory slot manual mounting station further includes a pressing jig. As a specific description of one possible implementation manner of performing S202, the following is given:

[0108] The pressing jig is fixedly installed on the tray so that the pressing jig presses the second surface.

[0109] For example, the pressing jig can be fixed above the tray by a fixing member, or the pressing jig can be removed from the tray by removing the fixing member. After the PCB is fixed on the tray, all the memory slots on the PCB are mounted on the memory slot mounting positions, and then the pressing jig is fixed above the tray.

[0110] At this time, part of the pressing jig abuts against the second surface of the memory slot and applies a certain pressure to the second surface, so that the memory slot pins of all the memory slots are in full contact with the corresponding solder paste and pads, which can improve the soldering quality of the memory slot and other devices, thereby improving the yield of the product.

[0111] On the basis of the above-mentioned embodiments, as a specific description of one possible implementation manner of performing S104, the following is given:

[0112] The tray with the PCB and the pressing jig fixed thereon is sent into the reflow oven to solder the memory slots and other devices to the PCB.

[0113] For example, in the reflow oven, the solder paste on the PCB melts at high temperature, and the liquid solder flows back to form solder joints at the pads of the PCB and the pins of the devices, and the solder joints solidify after the cold zone to solder the memory slots and other devices to the PCB.

[0114] Since the pressing jig continuously presses the memory slots during the reflow soldering process, the soldering quality of the memory slots can be improved, and the yield of the product can be improved.

[0115] On the basis of the above-mentioned embodiments, before S105 is performed, the pressing jig is removed, and the PCB is removed from the tray.

[0116] For example, after the PCB comes out of the reflow oven, the pressing jig that presses the memory slots is removed, and then the PCB is removed from the tray. Subsequently, the removed PCB is sent into the AOI device to detect the soldering quality of the memory slots and other devices.

[0117] In some embodiments, before S104 is performed, the following steps are further included:

[0118] S401, based on the multi-angle camera, an attachment image of the pins of the memory slots and other devices is acquired.

[0119] For example, the PCB with the memory slots and other devices attached thereon is transmitted to the AOI device, and the AOI device is used to detect the attachment quality of the memory slots and other devices. The AOI device for detecting the attachment quality of the memory slots and other devices and the AOI device for detecting the soldering quality of the memory slots and other devices can be different devices of the same model or the same device.

[0120] Hereinafter, taking the AOI device for detecting the attachment quality of the memory slots and other devices and the AOI device for detecting the soldering quality of the memory slots and other devices as different devices of the same model as an example, the following is described. The AOI device for detecting the soldering quality of the memory slots and other devices is referred to as a first AOI device, and the AOI device for detecting the attachment quality of the memory slots and other devices is referred to as a second AOI device.

[0121] If the PCB has the memory slots and resistors attached thereon, the second AOI device includes a first side camera, a second side camera, and a top camera. The first side camera can acquire an attachment image of the pins of the first row of memory slots, the second side camera can acquire an attachment image of the pins of the second row of memory slots, and the top camera can acquire an attachment image of the pins of the resistors.

[0122] If the PCB is mounted with memory slots and capacitors, the second AOI device comprises a first side camera, a second side camera and a top camera. Among them, the first side camera can collect the mounting image of the first row of memory slot pins, the second side camera can collect the mounting image of the second row of memory slot pins, and the top camera can collect the mounting image of the capacitor pin.

[0123] If the PCB is mounted with memory slots, resistors and capacitors, the second AOI device comprises a first side camera, a second side camera and a top camera. Among them, the first side camera can collect the mounting image of the first row of memory slot pins, the second side camera can collect the mounting image of the second row of memory slot pins, and the top camera can collect the mounting image of the resistor pin and the capacitor pin.

[0124] If the PCB is mounted with memory slots and BGA chips, the second AOI device comprises a first side camera, a second side camera, a third side camera and a fourth side camera. Among them, the first side camera can collect the mounting image of the first row of memory slot pins, the second side camera can collect the mounting image of the second row of memory slot pins, and the first side camera, the second side camera, the third side camera and the fourth side camera can collect the mounting image of the BGA chip pin in different directions.

[0125] If the PCB is mounted with memory slots, BGA chips and resistors, the second AOI device comprises a first side camera, a second side camera, a third side camera, a fourth side camera and a top camera. Among them, the first side camera can collect the mounting image of the first row of memory slot pins, the second side camera can collect the mounting image of the second row of memory slot pins, the top camera can collect the mounting image of the resistor pin, and the first side camera, the second side camera, the third side camera and the fourth side camera can collect the mounting image of the BGA chip pin in different directions.

[0126] If the PCB is mounted with memory slots, BGA chips and capacitors, the second AOI device comprises a first side camera, a second side camera, a third side camera, a fourth side camera and a top camera. Among them, the first side camera can collect the mounting image of the first row of memory slot pins, the second side camera can collect the mounting image of the second row of memory slot pins, the top camera can collect the mounting image of the capacitor pin, and the first side camera, the second side camera, the third side camera and the fourth side camera can collect the mounting image of the BGA chip pin in different directions.

[0127] If the PCB is mounted with memory slots, BGA chips, resistors and capacitors, the second AOI device comprises a first side camera, a second side camera, a third side camera, a fourth side camera and a top camera. Among them, the first side camera can collect the mounting image of the first row of memory slot pins, the second side camera can collect the mounting image of the second row of memory slot pins, the top camera can collect the mounting image of the resistor pins and the capacitor pins, and the first side camera, the second side camera, the third side camera and the fourth side camera can collect the mounting image of the BGA chip pins in different directions.

[0128] In this way, based on the first side camera and the second side camera of the second AOI device, the mounting images of a plurality of memory slot pins can be obtained. Based on the first side camera, the second side camera, the third side camera and the fourth side camera of the second AOI device, and / or the top camera of the second AOI device, the mounting images of the pins of other devices can be obtained.

[0129] S402, according to the mounting image and the corresponding standard image, determine the mounting quality of the memory slot and other devices.

[0130] For example, the first side camera corresponds to the first mounting standard image, the second side camera corresponds to the second mounting standard image, the third side camera corresponds to the third mounting standard image, the fourth side camera corresponds to the fourth mounting standard image, and the top camera corresponds to the fifth mounting standard image.

[0131] Compare each memory slot pin in the mounting image of the first row of memory slot pins with the first mounting standard image to determine whether each memory slot pin in the first row of memory slot pins is floating high, thereby determining the mounting quality of the first row of memory slot pins. For example, when there is at least one memory slot pin floating high in the first row of memory slot pins, it is determined that the mounting quality of the first row of memory slot pins is unqualified. When there is no floating high in the first row of memory slot pins, it is determined that the mounting quality of the first row of memory slot pins is qualified.

[0132] Compare each memory slot pin in the mounting image of the second row of memory slot pins with the second mounting standard image to determine whether each memory slot pin in the second row of memory slot pins is floating high, thereby determining the mounting quality of the second row of memory slot pins. For example, when there is at least one memory slot pin floating high in the second row of memory slot pins, it is determined that the mounting quality of the second row of memory slot pins is unqualified. When there is no floating high in the second row of memory slot pins, it is determined that the mounting quality of the second row of memory slot pins is qualified.

[0133] According to the mounting quality of the first row of memory slot pins and the mounting quality of the second row of memory slot pins, the mounting quality of the memory slot is determined. For example, when the mounting quality of the first row of memory slot pins or the second row of memory slot pins is unqualified, it is determined that the mounting quality of the corresponding memory slot is unqualified. When the mounting quality of the first row of memory slot pins and the second row of memory slot pins is qualified, it is determined that the mounting quality of the corresponding memory slot is qualified.

[0134] In this way, by comparing the mounting images of all memory slot pins of the same memory slot with the corresponding mounting standard images, the mounting quality of the memory slot can be determined.

[0135] Each resistance pin in the mounting image of the resistance pin is compared with the fifth mounting standard image to determine the mounting quality of each resistance pin. For example, when one resistance pin is floating high, it is determined that the mounting quality of the resistance pin is unqualified.

[0136] Then, according to the mounting quality of all resistance pins of the same resistance, the mounting quality of the resistance is determined. For example, when the mounting quality of at least one resistance pin of the same resistance is unqualified, it is determined that the mounting quality of the resistance is unqualified, and when the mounting quality of all resistance pins of the same resistance is qualified, it is determined that the mounting quality of the resistance is qualified.

[0137] Each capacitor pin in the mounting image of the capacitor pin is compared with the fifth mounting standard image to determine the mounting quality of each capacitor pin. For example, when one is floating high, it is determined that the mounting quality of the capacitor pin is unqualified.

[0138] Then, according to the mounting quality of all capacitor pins of the same capacitor, the mounting quality of the capacitor is determined. For example, when the mounting quality of at least one capacitor pin of the same capacitor is unqualified, it is determined that the mounting quality of the capacitor is unqualified, and when the mounting quality of all capacitor pins of the same capacitor is qualified, it is determined that the mounting quality of the capacitor is qualified.

[0139] Each BGA chip pin in the mounting image of the BGA chip pin collected by the first side camera is compared with the first mounting standard image, each BGA chip pin in the mounting image of the BGA chip pin collected by the second side camera is compared with the second mounting standard image, each BGA chip pin in the mounting image of the BGA chip pin collected by the third side camera is compared with the third mounting standard image, and each BGA chip pin in the mounting image of the BGA chip pin collected by the fourth side camera is compared with the fourth mounting standard image to determine the mounting quality of each BGA chip pin. For example, when one BGA chip pin is floating high, it is determined that the mounting quality of the BGA chip pin is unqualified.

[0140] Then, the mounting quality of the BGA chip is determined according to the mounting quality of all the BGA chip pins of the same BGA chip. For example, when the mounting quality of at least one BGA chip pin of the same BGA chip is unqualified, the mounting quality of the BGA chip is determined as unqualified; when the mounting quality of all the BGA chip pins of the same BGA chip is qualified, the mounting quality of the BGA chip is determined as qualified.

[0141] In this way, by comparing the mounting image of all the pins of the same other device with the corresponding mounting standard image, the mounting quality of the other device can be determined.

[0142] S403, the PCBs with the mounting quality of the memory slot and the other device being qualified are sent into the reflow oven.

[0143] For example, if the mounting quality of the memory slot and the other device of the same PCB is qualified, the PCB is sent into the reflow oven. If the mounting quality of the memory slot or the other device of the same PCB is unqualified, the PCB is sent to the maintenance station to adjust the position of the unqualified pin.

[0144] In summary, the mounting quality of the memory slot and the other device can be detected before reflow soldering, so that the soldering quality problem caused by unqualified mounting can be avoided, thereby improving the yield of products.

[0145] In some embodiments, the surface mounting process of the memory slot after S105 further includes:

[0146] S501, the memory slot with unqualified soldering quality is removed from the PCB.

[0147] For example, the PCB with the memory slot with unqualified soldering quality is sent to the memory slot maintenance station. The memory slot maintenance station includes a memory slot fixing jig, the memory slot with unqualified soldering quality can be fixed on the memory slot fixing jig, and the memory slot fixed on the memory slot fixing jig can be separated from the PCB on which the memory slot is mounted.

[0148] S502, the tin paste remaining on the solder pad from which the memory slot is removed is removed.

[0149] For example, after the memory slot is removed from the PCB, a certain amount of tin paste remains on the solder pad to which the memory slot is soldered. The tin paste remaining on the solder pad can be removed by a tin suction line to flatten the surface of the solder pad, facilitate the re-mounting of the memory slot, and improve the yield of products.

[0150] S503, tin paste is printed on all the pins of the removed memory slot.

[0151] Exemplarily, the memory slot maintenance work station further comprises a memory slot printing jig. The removed memory slot can be placed on the memory slot printing jig so that the memory slot pins are upward, facilitating printing of the solder paste on the memory slot pins.

[0152] S504, welding the removed memory slot to the corresponding PCB.

[0153] Exemplarily, the memory slot maintenance work station further comprises a welding device. The welding device can weld all the memory slot pins printed with the solder paste on the corresponding pads of the PCB.

[0154] In the embodiments of the present disclosure, by removing the memory slot with unqualified welding quality from the PCB, removing the residual solder paste on the pads of the PCB from which the memory slot is removed, printing the solder paste on all the memory slot pins of the removed memory slot, and welding the removed memory slot to the corresponding PCB, the memory slot can be re-pasted on the PCB with unqualified memory slot welding, thereby improving the yield of the product.

[0155] In some embodiments, before S102 is performed, the PCB is further detected for solder paste printing quality.

[0156] Exemplarily, after S101 is performed, the PCB is sent into a solder paste inspection (SPI) device. The SPI device can detect the height, volume, area, short circuit, and offset of the solder paste on each pad of the PCB, determine the solder paste printing quality of each pad, and thus determine the solder paste printing quality of the PCB. The PCB with qualified solder paste printing quality is sent into the ChipMounter to perform S102.

[0157] For example, if the height, volume, area, short circuit, or offset of the solder paste on at least one pad is unqualified, i.e., if the solder paste printing quality of at least one pad is unqualified, it is determined that the solder paste printing quality of the PCB is unqualified and the solder paste needs to be re-printed. If the height, volume, area, short circuit, and offset of the solder paste on all pads are qualified, i.e., the solder paste printing quality of all pads is qualified, it is determined that the solder paste printing quality of the PCB is qualified.

[0158] Unless the context clearly indicates otherwise, as used herein and in the appended claims, the singular form "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Accordingly, the use of "a," "an," and "the" herein and in the following claims are to be construed as meaning "one or more" unless the context clearly indicates otherwise. Similarly, the words "comprise," "comprises," and "comprising," and the like, are to be construed in an inclusive sense as opposed to an exclusive sense, so that any listed steps can be comprised of another step and the like. Also, the words "containing," "contain," and "contained," and the like, have the same inclusive sense. Similarly, the terms "including," "includes," and "include," and the like, have the same inclusive sense as the words "comprising," "comprises," and "comprise," and the like. Also, the terms "coupled," "coupling," and "coupling," and the like, have the same inclusive sense as the words "comprising," "comprises," and "comprise," and the like.

[0159] Further aspects and ranges of adaptation become apparent from the description provided herein. It should be understood that various aspects of the application can be implemented alone or in combination with one or more other aspects. It should also be understood that the description and specific examples herein are intended to be illustrative only and are not intended to limit the scope of the present application.

[0160] The above detailed description of several embodiments of the disclosure has been presented for the purposes of illustration and description. It is apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the disclosure without departing from the spirit and scope of the disclosure. The scope of the disclosure is defined by the appended claims.

Claims

1. A surface mount process for a memory socket, comprising: The memory slot comprises opposite first and second surfaces, the first surface of the memory slot is provided with a first positioning member, a second positioning member and a third positioning member, the first and second positioning members are located on opposite sides of the first surface, and the third positioning member is located between the first and second positioning members; the memory slot comprises a plurality of memory slot pins, and the memory slot pins are located between the first and second positioning members; The surface mounting process comprises: printing tin paste on the pads of the printed circuit board; the surface of the printed circuit board is provided with a first positioning hole, a second positioning hole and a third positioning hole; mounting other devices other than the memory slot to the printed circuit board, the other devices comprising at least one of a resistor, a capacitor and a ball grid array chip; manually mounting the memory slot to the printed circuit board; reflow soldering the memory slot and the other devices to the printed circuit board; detecting the soldering quality of the memory slot and the other devices; The manual mounting of the memory slot to the printed circuit board comprises: inserting the first positioning member into the first positioning hole, inserting the third positioning member into the third positioning hole, and inserting the second positioning member into the second positioning hole; pressing the second surface of the memory slot, which is opposite to the first surface; Before the insertion of the first positioning member into the first positioning hole, the third positioning member into the third positioning hole and the second positioning member into the second positioning hole, the process further comprises: facing the side surface of the printed circuit board printed with the tin paste away from the tray, and fixing the printed circuit board on the tray, which is horizontally arranged; The pressing of the second surface of the memory slot comprises: After mounting the memory slot on all memory slot mounting positions of the printed circuit board, fixing a pressing jig directly above the tray, so that the pressing jig presses the second surface; The reflow soldering of the memory slot and the other devices to the printed circuit board comprises: After mounting the memory slot on all memory slot mounting positions of the printed circuit board, fixing a pressing jig directly above the tray, part of the pressing jig abuts against the second surface of the memory slot and applies a certain pressure to the second surface, so that the memory slot pins of all memory slots are in full contact with the corresponding tin paste and pads, and the tray with the printed circuit board and the pressing jig is sent into a reflow furnace to solder the memory slot and the other devices to the printed circuit board.

2. The surface mount process of memory slot according to claim 1, wherein, Before the detection of the soldering quality of the memory slot and the other devices, the process further comprises: removing the pressing jig; removing the printed circuit board from the tray.

3. The surface mount process of memory slot according to claim 1, wherein, The detection of the soldering quality of the memory slot and the other devices comprises: acquiring soldering images of the pins of the memory slot and the other devices based on a multi-angle camera; determining the soldering quality according to the soldering images and corresponding soldering standard images.

4. The surface mount process of memory slot according to claim 1, wherein, Before the reflow soldering of the memory slot and the other devices to the printed circuit board, the process further comprises: Based on a multi-angle camera, a mounting image of pins of the memory slot and the other devices is acquired; According to the mounting image and a corresponding mounting standard image, mounting quality of the memory slot and the other devices is determined; The printed circuit board on which the mounting quality of the memory slot and the other devices is qualified is sent into a reflow oven.

5. The surface mount process of memory slot according to claim 1, wherein, The surface mounting process of the memory slot further includes: The memory slot with unqualified welding quality is removed from the printed circuit board; The tin paste remaining on the solder pad from which the memory slot is removed is removed; Tin paste is printed on all pins of the removed memory slot; The removed memory slot is welded to the corresponding printed circuit board.

6. The surface mount process of memory slot according to any one of claims 1-5, wherein, The mounting of the other devices other than the memory slot to the printed circuit board further includes: Tin paste printing quality of the printed circuit board is detected.

Images