A wafer polishing slurry cleaning apparatus and method thereof

Abstract

This invention discloses a wafer slurry cleaning device and method, specifically relating to the field of wafer cleaning technology. It includes a fixed plate and ultrasonic cleaning chambers located on both sides of the fixed plate. A rotating support structure is provided on the fixed plate, and a wafer is placed on the rotating support structure. A cleaning slurry spraying system is provided above and to the sides of the fixed plate to spray cleaning slurry onto both sides of the wafer. Each ultrasonic cleaning chamber has a rotating frame on its outer side, comprising a pair of supports, a tube assembly, a pair of support plate assemblies, and a rotation drive unit. This invention solves the technical problems of current wafer cleaning brushes accumulating a large amount of particulate matter from the chemical mechanical polishing process on the wafers after prolonged use, which affects the cleaning quality and causes defects in the wafer structure. It also addresses the lack of an effective integrated cleaning and drying structure to quickly meet the processing requirements of wafer cleaning and drying.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, and more specifically, to a wafer polishing slurry cleaning apparatus and method. Background Technology

[0002] As the feature size of integrated circuits continues to shrink, the requirements for wafer surface quality are becoming increasingly stringent. Consequently, the control of defect size and quantity in the wafer manufacturing process is becoming increasingly rigorous. During wafer processing, the surface of the wafer requires precision grinding. To achieve more refined grinding, a chemical mechanical polishing (CMP) process, combining mechanical and chemical polishing, can be employed. Its main working principle is that, under certain pressure and in the presence of a polishing slurry, the wafer being polished moves relative to a polishing pad. The highly organic combination of the mechanical polishing action of nano-abrasives and the chemical action of various chemical reagents allows the polished wafer surface to achieve highly flattened surfaces, low surface roughness, and low defects. During the CMP process, a polishing slurry containing abrasive particles and chemical etchants is used to polish the wafer surface. After the polishing process, the wafer surface contains contaminants such as foreign particles and abrasive materials. Therefore, the wafer surface needs to be thoroughly cleaned after polishing to ensure the quality and performance of the wafer.

[0003] Patent CN112371591B discloses a wafer cleaning apparatus, which includes: a housing; a support assembly located in the housing for rotatably supporting a wafer to be cleaned arranged in a vertical direction; cleaning brushes arranged in parallel and at intervals and rolling about their axis; and a guard plate disposed on the upper side of the cleaning brushes to prevent fluid generated by the rolling of the cleaning brushes from splashing onto the wafer surface.

[0004] In the aforementioned patent, the inventors believe from the perspective of those skilled in the art that when the patent is used, the brush used for wafer cleaning will accumulate a large amount of particulate matter on the wafer due to the chemical mechanical polishing process over a long period of use. This will change the surface structure of the brush, thereby affecting the cleaning quality of the wafer and causing defects in the wafer structure. In addition, the cleaned wafer needs to be dried, but since there is no effective integrated structure for cleaning and drying to quickly meet the processing requirements of wafer cleaning and drying, the efficiency of wafer cleaning is affected. Therefore, this application provides a wafer polishing slurry cleaning device that facilitates the cleaning of wafers with a cleaning brush and an integrated cleaning and drying setup to improve the efficiency and quality of wafer cleaning. Summary of the Invention

[0005] To overcome the above-mentioned defects of the prior art, embodiments of the present invention provide a wafer polishing slurry cleaning device and method. The technical problem to be solved by the present invention is that the brushes used for wafer cleaning currently accumulate a lot of particulate matter on the wafer due to the chemical mechanical polishing process when used for a long time. This will affect the cleaning quality of the wafer and cause defects in the wafer structure. There is also a lack of an effective integrated cleaning and drying structure to quickly meet the processing requirements of the wafer cleaning and drying process.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a wafer polishing slurry cleaning device, comprising a fixed plate and ultrasonic cleaning chambers located on both sides of the fixed plate, a rotating support structure provided on the fixed plate, a wafer being disposed on the rotating support structure, a cleaning slurry spraying system for spraying cleaning slurry onto both sides of the wafer being disposed on the upper side of the fixed plate, and a rotating frame being disposed on the outer side of each ultrasonic cleaning chamber, the rotating frame comprising a pair of supports, a tube assembly rotatably connected to the pair of supports, a pair of support plates fixedly connected to the tube assembly, and a rotating drive unit disposed on one of the supports for driving the tube assembly to rotate;

[0007] The pipe assembly includes a fixed steam inlet pipe and a wire inlet pipe, which are rotatably connected to corresponding supports. A pair of support plates are fixedly connected to the steam inlet pipe and the wire inlet pipe, and the support plate assembly consists of a pair of support plates one and a pair of support plates two.

[0008] The cleaning brush cylinders are provided in pairs, and each cleaning brush cylinder is rotatably connected to two parallel support plates. The support plates are provided with a rotary motor for driving the pair of cleaning brush cylinders to rotate.

[0009] An extrusion moving structure, the number of which is the same as the number of the second support plate, and the extrusion moving structure is disposed on the second support plate;

[0010] A wafer drying structure is provided in a pair. Each wafer drying structure includes a superheated steam pipe disposed on a pair of extrusion moving structures, a steam nozzle disposed on the superheated steam pipe, and a sealed telescopic pipe fixedly connected to the superheated steam pipe. The end of the sealed telescopic pipe facing away from the superheated steam pipe is disposed on the steam inlet pipe.

[0011] The sealing telescopic tube includes an outer tube, an inner tube movably inserted into the outer tube, and a sealing ring seamlessly connected to one end of the outer tube. The inner tube is slidably connected in the sealing ring. The outer tube is connected to the superheated steam pipe, and the inner tube is connected to the steam inlet pipe.

[0012] Each superheated steam pipe is equipped with a pair of rotational balancing structures, and the extrusion moving structure and the ultrasonic cleaning box are equipped with auxiliary pushing components.

[0013] When the rotating frame drives the superheated steam pipe to rotate and approach the ultrasonic cleaning box, the extrusion moving structure, through the auxiliary components, drives the superheated steam pipe away from the ultrasonic cleaning box and lifts it up.

[0014] In a preferred embodiment, an ultrasonic probe is provided inside the ultrasonic cleaning chamber, and an ultrasonic generator electrically connected to the ultrasonic probe is provided on the side of the ultrasonic cleaning chamber.

[0015] In a preferred embodiment, the rotating support structure includes at least three support rollers rotatably connected to the fixed plate and a rotary motor disposed on the fixed plate and driven by a first pulley mechanism to rotate one of the support rollers. The support rollers are provided with limiting annular grooves, and the wafer is rolled in the limiting annular grooves of the support rollers.

[0016] In a preferred embodiment, the rotary drive unit includes a second rotary motor fixedly connected to one of the brackets, a first gear fixedly connected to the output end of the second rotary motor, and a second gear meshing with the first gear. The second gear is coaxially fixedly connected to the steam inlet pipe.

[0017] In a preferred embodiment, a rotary joint is provided at one end of the steam inlet pipe, a conductive slip ring is provided at one end of the inlet pipe, and an electromagnetic valve is provided on the outer pipe.

[0018] In a preferred embodiment, the rotary motor is fixed on one of the support plates, and the rotary motor is connected to a pair of cleaning brush cylinders via a belt pulley drive mechanism. Two horizontally arranged support plates are fixedly connected to baffles, which are located on the outside of the cleaning brush cylinders.

[0019] In a preferred embodiment, the extrusion moving structure includes a groove formed on the second support plate, a damping slide block slidably connected in the groove, a smooth rod fixedly connected in the groove, and a spring sleeved on the smooth rod. The smooth rod moves through the damping slide block, and the superheated steam pipe is fixedly connected to a pair of damping slide blocks.

[0020] In a preferred embodiment, the rotational balancing structure includes a rotating ring rotatably connected to the superheated steam pipe and a plurality of rubber rollers rotatably connected to the side of the rotating ring, with a wear-resistant zone reserved between a pair of rotational balancing structures arranged on the superheated steam pipe.

[0021] In a preferred embodiment, the auxiliary pushing assembly includes a limiting slide plate fixedly connected to one side of the top of the ultrasonic cleaning chamber and a wear-resistant top block fixedly connected to each damping slide block, the wear-resistant top block being in active contact with the limiting slide plate.

[0022] A wafer polishing slurry cleaning method, applied to the aforementioned wafer polishing slurry cleaning apparatus, is characterized by comprising the following steps:

[0023] S1. The loading robot places the wafer on the support roller. By controlling the rotation of the support plate group located on both sides of the wafer, the corresponding cleaning brush cylinder is rotated and contacts the wafer. By controlling the rotation of the wafer and the cleaning brush cylinder respectively, the cleaning liquid spraying system sprays cleaning liquid towards both sides of the wafer. In this way, the foreign particles and abrasives caused by chemical mechanical abrasion on the wafer surface can be cleaned.

[0024] S2. Following step S1, continue to rotate the support plate assembly to spray superheated steam through the wafer end face. With the smoothing and guiding effect of the rotating balance structure on the wafer end face, and in conjunction with the rotation of the wafer, the drying process of wafer cleaning can be completed.

[0025] S3. Following step S2, when the superheated steam pipe is applied to the wafer for drying, the cleaning brush can be immersed in the cleaning water of the ultrasonic cleaning box. By using ultrasonic vibration for cleaning and the effect of the cleaning brush rotating in the cleaning water, particulate matter on the surface of the cleaning brush can be removed, thus improving the cleanliness of the cleaning brush applied to the wafer.

[0026] S4. Following step S3, when using the cleaned cleaning brush, the support plate assembly can continue to be controlled. At this time, the position of the superheated steam pipe close to the ultrasonic cleaning box is adjusted by the sliding contact of the limiting slide plate and the wear-resistant top block, which can adaptively lift the superheated steam pipe and prevent it from getting wet.

[0027] The technical effects and advantages of this invention are as follows:

[0028] This invention, by arranging cleaning brushes and superheated steam pipes in pairs on a support assembly and flexibly adjusting their positions facing the wafer end face, integrates wafer cleaning and drying processes. By using an ultrasonic cleaning chamber along the path of the cleaning brushes, ultrasonic cleaning is provided to the brushes during the wafer cleaning and drying process switching, removing accumulated particles from their surfaces. This improves the cleaning brushes' ability to clean the wafers, ensuring cleaning quality and preventing structural defects.

[0029] This invention, by setting a rotational balance structure, allows the rubber rollers to rotate adaptively on the wafer during the drying process of superheated steam when the superheated steam pipe acts on the wafer end face. This increases the balance of wafer rotational drying and ensures drying stability.

[0030] This invention, by setting up a squeezing and moving structure and an auxiliary pushing component, with the auxiliary pushing component providing squeezing force to the squeezing and moving structure, can effectively avoid contact with the cleaning water in the ultrasonic cleaning box when the superheated steam pipe is adjusted by rotation, thus ensuring the reliability of the superheated steam jet from the superheated steam pipe.

[0031] This invention provides a sealing and telescopic tube on the superheated steam pipe and the steam inlet pipe. When the superheated steam pipe avoids the location of the ultrasonic cleaning box, the sealing and telescopic tube can be extended and closed in a suitable manner, thus ensuring the effectiveness of the superheated steam pipe in transporting superheated steam. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0033] Figure 2 This is a schematic diagram of the support plate, rotating support structure, and wafer structure of the present invention.

[0034] Figure 3 For the present invention Figure 1 A schematic diagram of the structure excluding the support plate, rotating support structure and wafer.

[0035] Figure 4 This is a schematic diagram of the rotating frame of the present invention.

[0036] Figure 5 For the present invention Figure 4 Enlarged view of part A in the image.

[0037] Figure 6 This is a schematic diagram of the support plate and cleaning brush cylinder of the present invention.

[0038] Figure 7 This is a schematic diagram of the support plate II and the wafer drying structure of the present invention.

[0039] Figure 8 This is a plan perspective view of the sealing telescopic tube of the present invention.

[0040] Figure 9 This is a schematic diagram of the rotational balance structure of the present invention.

[0041] Figure 10 This is a schematic diagram of the extrusion moving structure of the present invention.

[0042] The attached diagram is labeled as follows: 1. Fixed plate; 2. Ultrasonic cleaning box; 3. Rotary support structure; 31. Support roller; 32. Rotary motor one; 4. Cleaning liquid spraying system; 5. Rotary frame; 51. Support; 52. Pipe assembly; 521. Steam inlet pipe; 522. Inlet pipe; 53. Support plate assembly; 531. Support plate one; 532. Support plate two; 54. Rotary drive unit; 541. Rotary motor two; 542. Gear one; 543. Gear two; 6. Cleaning brush cylinder; 61. Rotary motor three; 7. Extrusion movement. Structure; 71. Slide groove; 72. Damping slide; 73. Smooth rod; 74. Spring; 8. Wafer drying structure; 81. Superheated steam pipe; 82. Steam nozzle; 83. Sealed telescopic pipe; 831. Outer pipe; 832. Inner pipe; 833. Sealing ring; 9. Rotational balance structure; 91. Rotating ring; 92. Rubber roller; 10. Wear-resistant top block; 11. Limiting slide plate; 12. Ultrasonic probe; 13. Ultrasonic generating device; 14. Liquid baffle; 15. Rotary joint; 16. Conductive slip ring; 17. Solenoid valve. Detailed Implementation

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example

[0044] This invention provides a wafer polishing slurry cleaning device, which should be used in a dust-free environment, in conjunction with the following reference. Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 7 The ultrasonic cleaning system includes a fixed plate 1 and ultrasonic cleaning chambers 2 located on both sides of the fixed plate 1. A rotating support structure 3 is provided on the fixed plate 1, and a wafer is provided on the rotating support structure 3. A cleaning fluid spraying system 4 is provided on the upper side of the fixed plate 1 to spray cleaning fluid onto both sides of the wafer. In this application, the cleaning fluid spraying system 4 can be composed of a spray pipe and a spray head. The spray pipe can be connected to a cleaning fluid pumping device. In this way, by spraying cleaning fluid onto the wafer surface, foreign particles and abrasive materials and other contaminants caused by the grinding fluid containing abrasive particles and chemical etchants grinding the wafer surface can be washed away. Each ultrasonic cleaning chamber 2 has a rotating frame 5 on its outer side. The rotating frame 5 includes a pair of supports 51, a pipe assembly 52 rotatably connected to the pair of supports 51, a pair of support plate assemblies 53 fixedly connected to the pipe assembly 52, and a rotating drive unit 54 provided on one of the supports 51 for driving the pipe assembly 52 to rotate.

[0045] The pipe assembly 52 includes a fixed steam inlet pipe 521 and an inlet pipe 522. The steam inlet pipe 521 and the inlet pipe 522 are rotatably connected to the corresponding brackets 51. A pair of support plate assemblies 53 are fixedly connected to the steam inlet pipe 521 and the inlet pipe 522. The steam inlet pipe 521 can be connected to a superheated steam generator. The inlet pipe 522 can be easily threaded and wired. The support plate assembly 53 consists of a pair of support plates 1 531 and a pair of support plates 2 532.

[0046] A rotary joint 15 is provided at one end of the steam inlet pipe 521. One end of the rotary joint 15 can be directly connected to the superheated steam generating equipment. In this way, when the steam inlet pipe 521 rotates, it can ensure that superheated steam is stably input into the steam inlet pipe 521. A conductive slip ring 16 is provided at one end of the inlet pipe 522. In this application, the conductive slip ring 16 can be mounted on the bracket 51 to limit the fixed end of the conductive slip ring 16. Wiring is carried out to one end of the inlet pipe 522 through the rotating end of the conductive slip ring 16, which can meet the needs of rotating power supply for electrical devices.

[0047] An ultrasonic probe 12 is installed inside the ultrasonic cleaning chamber 2, and an ultrasonic generator 13 electrically connected to the ultrasonic probe 12 is installed on the side of the ultrasonic cleaning chamber 2. With the cooperation of the ultrasonic probe 12 and the ultrasonic generator 13, the ultrasonic cleaning chamber 2 can achieve the effect of ultrasonic cleaning.

[0048] The rotating support structure 3 includes at least three support rollers 31 rotatably connected to the fixed plate 1 and a rotary motor 32 disposed on the fixed plate 1 and driven by a first pulley mechanism to rotate one of the support rollers 31. The support rollers 31 are provided with limiting annular grooves, and the wafers are rolled in the limiting annular grooves of the support rollers 31.

[0049] Specifically, the wafer to be cleaned is placed into the limiting ring grooves corresponding to the three support rollers 31 by the loading robot, so that one of the support rollers 31 can be rotated by the rotary motor 32, so that the wafer can be rotated for cleaning.

[0050] The rotary drive unit 54 includes a second rotary motor 541 fixedly connected to one of the brackets 51, a first gear 542 fixedly connected to the output end of the second rotary motor 541, and a second gear 543 meshing with the first gear 542. The second gear 543 is coaxially fixedly connected to the steam inlet pipe 521. In this application, the second rotary motor 541 can be equipped with an encoder to achieve high-precision drive control.

[0051] Specifically, the rotating motor 541 drives the gear 542 to rotate, and the meshing transmission gear 543 drives the steam inlet pipe 521 to rotate, so that the support plate assembly 53 based on the pipe assembly 52 can rotate along the path.

[0052] The aforementioned wafer polishing slurry cleaning device also includes a cleaning brush cylinder 6, a squeezing and moving structure 7, and a wafer drying structure 8.

[0053] See also Figure 6 The cleaning brush cylinders 6 are provided in pairs, and each cleaning brush cylinder 6 is rotatably connected to two parallel support plates 531. The support plates 531 are provided with a rotary motor 61 for driving the pair of cleaning brush cylinders 6 to rotate. In this application, the cleaning brush cylinders 6 can be made of polyurethane material, which can improve the cleaning quality of the wafer.

[0054] Rotary motor 361 is fixed on one of the support plates 531. Rotary motor 361 is connected to a pair of cleaning brush cylinders 6 via a belt pulley drive mechanism. Two horizontally arranged support plates 531 are fixedly connected with baffle plates 14. The baffle plates 14 are located on the outside of the cleaning brush cylinders 6. The baffle plates 14 can prevent the cleaning fluid from being splashed onto the wafer when the cleaning brush cylinders 6 are cleaning the wafer. When the cleaning brush cylinders 6 are idle, after the ultrasonic cleaning is completed, the pair of cleaning brush cylinders 6 rotate synchronously, which can prevent the cleaning water from being splashed out.

[0055] Specifically, by controlling the rotation of the support plate assembly 53, the cleaning brush cylinder 6 is rotated to the position of the wafer end face. With the rotation of the wafer and the rotation of the cleaning brush cylinder 6 driven by the rotary motor 61, cleaning fluid is sprayed onto the wafer. In this way, the cleaning brush cylinder 6 can clean the wafer surface to remove contaminants such as foreign particles and abrasives from the chemical mechanical polishing process.

[0056] See also Figure 7 The number of wafer drying structures 8 is set in pairs. Each wafer drying structure 8 includes a superheated steam pipe 81 set on a pair of extrusion moving structures 7, a steam nozzle 82 set on the superheated steam pipe 81, and a sealed telescopic pipe 83 fixedly connected to the superheated steam pipe 81. One end of the sealed telescopic pipe 83 facing away from the superheated steam pipe 81 is set on the steam inlet pipe 521.

[0057] An electromagnetic valve 17 is installed on the outer tube 831. The electromagnetic valve 17 can be used to control the on / off of the superheated steam supply of the outer tube 831. In this way, the output of superheated steam from the superheated steam pipe 81 close to the wafer can be arbitrarily controlled. The setting of the conductive slip ring 16 can make the electromagnetic valve 17 stably perform electrical control.

[0058] Specifically, after the cleaning brush 6 completes the cleaning of the wafer, it can continue to rotate 90 degrees by controlling the support plate assembly 53 until the superheated steam pipe 81 is moved to the vicinity of the wafer's end face. Then, superheated steam is output through the external superheated steam generator. The superheated steam can enter the superheated steam pipe 81 through the steam inlet pipe 521 and the sealed telescopic pipe 83 in sequence, and be sprayed onto the wafer's end face through the steam nozzle 82. With the rotation of the wafer, the superheated steam can evenly dry the wafer's end face. After the wafer has completed the cleaning and drying process, it can be transferred by a robotic arm.

[0059] It is worth noting that when the superheated steam pipe 81 dries the wafer, the position of the superheated steam pipe 81 allows one of the cleaning brush cylinders 6 to be located inside the ultrasonic cleaning chamber 2 and immersed in the cleaning water. The ultrasonic generator 13 is then controlled to operate, and the rotary motor 61 drives the cleaning brush cylinder 6 to rotate. In this way, the cleaning brush cylinder 6 can rotate and clean inside the ultrasonic cleaning chamber 2, thereby improving the thoroughness of removing accumulated particles from the surface of the cleaning brush cylinder 6. This aims to reduce the amount of particles on the cleaning brush cylinder 6, thereby improving the cleaning quality of the wafer. Furthermore, by using a pair of cleaning brush cylinders 6 alternately, the cleaning brush cylinder 6 can be directly cleaned during the wafer drying time intervals, ensuring that the cleaning brush cylinder 6 is used for brushing in real time, thus improving the wafer cleaning efficiency.

[0060] Each superheated steam pipe 81 is equipped with a pair of rotational balancing structures 9, and the extrusion moving structure 7 and the ultrasonic cleaning box 2 are equipped with auxiliary pushing components.

[0061] See also Figure 9 The rotational balancing structure 9 includes a rotating ring 91 rotatably connected to the superheated steam pipe 81 and several rubber rollers 92 rotatably connected to the side of the rotating ring 91. A wear-resistant zone is reserved between a pair of rotational balancing structures 9 arranged on the superheated steam pipe 81. The setting of this wear-resistant zone can prevent the rubber rollers 92 from rubbing against the wafer center, thus improving the protection of wafer positioning. It is worth noting that in this application, the rubber rollers 92 on the rotating ring 91 are set to a certain tilt angle while being parallel to the wafer end face. This allows the angle of rotation of the rubber rollers 92 to be adjusted, so that the rubber rollers 92 can rotate in accordance with the rotation direction of the wafer.

[0062] Specifically, when the support plate assembly 53 moves the superheated steam pipe 81 to one side of the wafer end face, the rubber roller 92 can be pressed against the wafer end face. When the wafer is drying and rotating, the rubber roller 92 can adapt to the rotation, which can improve the stability of wafer rotation drying.

[0063] See also Figure 10The number of extrusion moving structures 7 is the same as the number of support plates 532. The extrusion moving structures 7 are set on support plates 532. The extrusion moving structures 7 include a groove 71 opened on support plates 532, a damping slide 72 slidably connected in the groove 71, a smooth rod 73 fixedly connected in the groove 71, and a spring 74 sleeved on the smooth rod 73. The smooth rod 73 moves through the damping slide 72. The superheated steam pipe 81 is fixedly connected to a pair of damping slides 72. In this application, a damping pad can be set at one end of the damping slide 72. In this way, when the spring 74 elastically returns to push the damping slide 72, the damping slide 72 can buffer the impact force that contacts the inner wall of the groove 71.

[0064] The auxiliary pushing component includes a limiting slide plate 11 fixedly connected to one side of the top of the ultrasonic cleaning box 2 and a wear-resistant top block 10 fixedly connected to each damping slide 72, with the wear-resistant top block 10 in active contact with the limiting slide plate 11.

[0065] See also Figure 8 The sealing telescopic pipe 83 includes an outer pipe 831, an inner pipe 832 that is movably inserted into the outer pipe 831, and a sealing ring 833 that is seamlessly connected to one end of the outer pipe 831. The inner pipe 832 is slidably connected in the sealing ring 833. The outer pipe 831 is connected to the superheated steam pipe 81, and the inner pipe 832 is connected to the steam inlet pipe 521.

[0066] Specifically, after the superheated steam pipe 81 completes the drying process of the wafer, when the cleaning brush 6 is needed, the support plate assembly 53 can be rotated 90 degrees. This allows the cleaning brush 6 to approach the end face of the wafer to be cleaned. At this time, the superheated steam pipe 81 will approach the ultrasonic cleaning chamber 2 under the action of the support plate assembly 53. After the wear-resistant top block 10 contacts the limiting slide plate 11 on the ultrasonic cleaning chamber 2, the wear-resistant top block 10 can be lifted up, driving the damping slide 72 to move on the smooth rod 73. At this time, the spring 74 is in a compressed state, and the outer tube 831 and the inner tube 832 achieve sealed expansion and contraction. The superheated steam pipe 81 can move towards the pipe assembly 52. ​​In this way, when the support plate 532 is set in a vertical state, the superheated steam pipe 81 will not be immersed in the cleaning water of the ultrasonic cleaning chamber 2, thus achieving water immersion protection. Until the wear-resistant top block 10 is disengaged from the limiting slide plate 11, the elastic reset of the spring 74 allows the superheated steam pipe 81 to return to its initial position. Example

[0067] This invention provides a wafer polishing slurry cleaning method, which is applied in Example 1 and includes the following steps:

[0068] S1. The loading robot places the wafer on the support roller 31. By controlling the rotation of the support plate group 53 located on both sides of the wafer, the corresponding cleaning brush 6 is rotated and contacts the wafer. By controlling the rotation of the wafer and the cleaning brush 6 respectively, the cleaning liquid spraying system 4 sprays cleaning liquid towards both sides of the wafer. In this way, the cleaning of foreign particles and abrasives caused by chemical mechanical polishing on the wafer surface can be completed.

[0069] S2. Following step S1, the support plate assembly 53 is rotated to spray superheated steam through the end face of the wafer via the superheated steam pipe 81. With the smoothing and guiding effect of the rotational balance structure on the end face of the wafer, and in conjunction with the rotation of the wafer, the drying process of wafer cleaning can be completed.

[0070] S3. Following step S2, when the superheated steam pipe 81 is applied to the wafer for drying, the cleaning brush 6 can be immersed in the cleaning water of the ultrasonic cleaning box 2. By using ultrasonic vibration cleaning and the effect of the cleaning brush 6 rotating in the cleaning water, the particulate matter on the surface of the cleaning brush 6 is removed, thus improving the cleanliness of the cleaning brush 6 applied to the wafer.

[0071] S4. Following step S3, when using the cleaned cleaning brush 6, the support plate assembly 53 can continue to be controlled. At this time, the superheated steam pipe 81 is close to the ultrasonic cleaning box 2. With the cooperation of the limiting slide plate 11 and the wear-resistant top block 10 sliding contact, the superheated steam pipe 81 can be adaptively lifted, which can prevent the superheated steam pipe 81 from being soaked in water.

[0072] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.

[0073] Secondly: The accompanying drawings of the embodiments disclosed in this invention only involve the structures involved in the embodiments disclosed in this invention. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this invention can be combined with each other.

[0074] In conclusion, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer polishing slurry cleaning device, comprising a fixed plate (1) and ultrasonic cleaning chambers (2) located on both sides of the fixed plate (1), wherein a rotating support structure (3) is provided on the fixed plate (1), a wafer is provided on the rotating support structure (3), a cleaning slurry spraying system (4) for spraying cleaning slurry onto both sides of the wafer is provided above the side of the fixed plate (1), and a rotating frame (5) is provided on the outer side of each ultrasonic cleaning chamber (2), characterized in that: The rotating frame (5) includes a pair of supports (51), a pipe assembly (52) rotatably connected to the pair of supports (51), a pair of support plate assemblies (53) fixedly connected to the pipe assembly (52), and a rotating drive unit (54) disposed on one of the supports (51) for driving the pipe assembly (52) to rotate. The pipe assembly (52) includes a fixed steam inlet pipe (521) and an inlet pipe (522), which are rotatably connected to corresponding supports (51). A pair of support plate assemblies (53) are fixedly connected to the steam inlet pipe (521) and the inlet pipe (522), and the support plate assembly (53) consists of a pair of support plates one (531) and a pair of support plates two (532). Cleaning brush cylinder (6), the number of the cleaning brush cylinder (6) is set in a pair, each cleaning brush cylinder (6) is rotatably connected to two parallel support plates (531), and the support plates (531) are provided with a rotary motor (61) for driving the pair of cleaning brush cylinders (6) to rotate. The number of extrusion moving structures (7) is the same as the number of the second support plate (532), and the extrusion moving structures (7) are disposed on the second support plate (532); A wafer drying structure (8) is provided in pairs. Each wafer drying structure (8) includes a superheated steam pipe (81) provided on a pair of extrusion moving structures (7), a steam nozzle (82) provided on the superheated steam pipe (81), and a sealed telescopic pipe (83) fixedly connected to the superheated steam pipe (81). One end of the sealed telescopic pipe (83) facing away from the superheated steam pipe (81) is provided on the steam inlet pipe (521). The sealing telescopic tube (83) includes an outer tube (831), an inner tube (832) movably inserted into the outer tube (831), and a sealing ring (833) seamlessly connected to one end of the outer tube (831). The inner tube (832) is slidably connected in the sealing ring (833). The outer tube (831) is connected to the superheated steam pipe (81), and the inner tube (832) is connected to the steam inlet pipe (521). Each superheated steam pipe (81) is provided with a pair of rotational balancing structures (9), and the extrusion moving structure (7) and the ultrasonic cleaning box (2) are provided with auxiliary pushing components; When the rotating frame (5) drives the superheated steam pipe (81) to rotate and approach the ultrasonic cleaning box (2), the extrusion moving structure (7) drives the superheated steam pipe (81) away from the ultrasonic cleaning box (2) and rises and moves through the auxiliary components.

2. The wafer polishing slurry cleaning device according to claim 1, characterized in that: An ultrasonic probe (12) is installed inside the ultrasonic cleaning box (2), and an ultrasonic generator (13) electrically connected to the ultrasonic probe (12) is installed on the side of the ultrasonic cleaning box (2).

3. The wafer polishing slurry cleaning device according to claim 1, characterized in that: The rotating support structure (3) includes at least three support rollers (31) rotatably connected to the fixed plate (1) and a rotary motor (32) mounted on the fixed plate (1) and driven by a first belt pulley mechanism to rotate one of the support rollers (31). The support rollers (31) are provided with limiting ring grooves, and the wafer is rolled in the limiting ring grooves of the support rollers (31).

4. The wafer polishing slurry cleaning device according to claim 1, characterized in that: The rotary drive unit (54) includes a second rotary motor (541) fixedly connected to one of the brackets (51), a first gear (542) fixedly connected to the output end of the second rotary motor (541), and a second gear (543) meshing with the first gear (542). The second gear (543) is coaxially fixedly connected to the steam inlet pipe (521).

5. The wafer polishing slurry cleaning device according to claim 1, characterized in that: A rotary joint (15) is provided at one end of the steam inlet pipe (521), a conductive slip ring (16) is provided at one end of the inlet pipe (522), and an electromagnetic valve (17) is provided on the outer pipe (831).

6. The wafer polishing slurry cleaning device according to claim 1, characterized in that: The rotary motor three (61) is fixed on one of the support plates one (531). The rotary motor three (61) is connected to a pair of cleaning brush cylinders (6) through a belt pulley drive mechanism. Two horizontally arranged support plates one (531) are fixedly connected with baffle plates (14), which are located on the outside of the cleaning brush cylinders (6).

7. The wafer polishing slurry cleaning device according to claim 1, characterized in that: The extrusion moving structure (7) includes a groove (71) opened on the second support plate (532), a damping slide (72) slidably connected in the groove (71), a smooth rod (73) fixedly connected in the groove (71), and a spring (74) sleeved on the smooth rod (73). The smooth rod (73) moves through the damping slide (72), and the superheated steam pipe (81) is fixedly connected to a pair of damping slides (72).

8. The wafer polishing slurry cleaning device according to claim 1, characterized in that: The rotational balancing structure (9) includes a rotating ring (91) rotatably connected to the superheated steam pipe (81) and several rubber rollers (92) rotatably connected to the side of the rotating ring (91). A wear-resistant zone is reserved between a pair of rotational balancing structures (9) arranged on the superheated steam pipe (81).

9. A wafer polishing slurry cleaning device according to claim 1, characterized in that: The auxiliary pushing assembly includes a limiting slide plate (11) fixedly connected to one side of the top of the ultrasonic cleaning box (2) and a wear-resistant top block (10) fixedly connected to each damping slide (72), the wear-resistant top block (10) being in active contact with the limiting slide plate (11).

10. A method for cleaning a wafer polishing slurry, applied to a wafer polishing slurry cleaning apparatus according to any one of claims 1-9, characterized in that: Includes the following steps: S1. The loading robot places the wafer on the support roller (31). By controlling the rotation of the support plate group (53) located on both sides of the wafer, the corresponding cleaning brush cylinder (6) is rotated and contacts the wafer. By controlling the rotation of the wafer and the cleaning brush cylinder (6) respectively, the cleaning liquid is sprayed towards both sides of the wafer by the cleaning liquid spraying system (4). In this way, the cleaning of foreign particles and abrasives caused by chemical mechanical grinding on the wafer surface can be completed. S2. Following step S1, continue to rotate the support plate assembly (53) to spray superheated steam through the end face of the wafer via the superheated steam pipe (81). With the smoothing and guiding effect of the rotation balance structure on the end face of the wafer, and in conjunction with the rotation of the wafer, the drying process of wafer cleaning can be completed. S3. Following step S2, when the superheated steam pipe (81) is applied to the wafer for drying, the cleaning brush (6) can be immersed in the cleaning water of the ultrasonic cleaning box (2). By using ultrasonic vibration cleaning and the effect of the cleaning brush (6) rotating in the cleaning water, the particles on the surface of the cleaning brush (6) can be removed, thus improving the cleanliness of the cleaning brush (6) applied to the wafer. S4. Following step S3, when using the cleaned cleaning brush (6), the support plate group (53) can continue to be controlled. At this time, the position of the superheated steam pipe (81) close to the ultrasonic cleaning box (2) is adjusted by the sliding contact of the limiting slide plate (11) and the wear-resistant top block (10), so as to prevent the superheated steam pipe (81) from being soaked in water.

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