Display panel, manufacturing method of display panel and spliced panel

Abstract

The application discloses a display panel, a manufacturing method of the display panel and a spliced panel. The display panel comprises a display area and a binding area located on one side of the display area; the display area comprises a substrate, first wires located on a first surface of the substrate, second wires located on a second surface of the substrate and a connecting part electrically connecting the first wires and the second wires, the first surface and the second surface being two opposite surfaces of the substrate; the binding area comprises a bound integrated circuit board and third wires, and the second wires extend from a first edge of the second surface to a second edge of the second surface and are electrically connected with the third wires, the first edge and the second edge being two opposite edges of the second surface. Through the application, the problem that the back binding process in the prior art causes damage to the display area of the display panel is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a manufacturing method of the display panel and a spliced panel. BACKGROUND

[0002] With the birth of spliced display technology, the backplane design of the conventional display panel cannot meet the requirements of narrow frame and narrow splicing gap of the spliced display screen.

[0003] In order to reduce the frame of the spliced display screen, the binding area of the chip is introduced to the back of the display screen in the prior art, and the chip is bound to the back of the display screen through the back wiring of the display screen. However, the front surface of the display screen is usually provided with front surface wiring and light emitting devices electrically connected with the front surface wiring, so that the binding of the chip and the back wiring of the display screen occurs in the display area of the display screen. In addition, the back binding process involved in the chip bonding process usually has a pressure of several MPa and a high temperature of 150 or more, so that in the case that the front surface wiring and the back wiring have overlapping parts, the high pressure / temperature in the back binding process in the prior art will inevitably cause damage to the front surface of the display screen, thereby easily leading to display failure of the front surface of the display screen and other problems, and reducing the product reliability. The influence on the front surface includes but is not limited to:

[0004] 1. Mura of the packaging material;

[0005] 2. Pressure injury of the Array line leading to electrical drift;

[0006] 3. Dark spot / bad spot caused by LED bonding failure. SUMMARY

[0007] The present application provides a display panel, a manufacturing method of the display panel and a spliced panel to at least solve the problem that the back binding process in the related art causes damage to the display area of the display panel.

[0008] According to one aspect of the present application, a display panel is provided, which comprises a display area and a binding area located on one side of the display area;

[0009] The display area comprises a substrate, a first wiring located on a first surface of the substrate, a second wiring located on a second surface of the substrate, and a connecting part electrically connecting the first wiring and the second wiring, the first surface and the second surface being two opposite surfaces of the substrate;

[0010] The binding area comprises a bound integrated circuit board and a third wiring, and the second wiring extends from a first edge of the second surface to a second edge of the second surface and is electrically connected with the third wiring, the first edge and the second edge being two opposite edges of the second surface.

[0011] According to another aspect of the present application, a manufacturing method of a display panel is provided, comprising the following steps:

[0012] A substrate is provided, having a third surface provided with a first trace and a fourth surface opposite to the third surface, wherein the substrate comprises a functional area and a non-functional area adjacent to the functional area, and the first trace is located in the functional area;

[0013] A second trace and a third trace are formed on the fourth surface, wherein the second trace is located in the functional area, the third trace is located in the non-functional area, and the second trace extends from a first edge of the fourth surface to a second edge of the fourth surface and is electrically connected with the third trace, wherein the first edge is an edge of the fourth surface corresponding to an area of the functional area away from an area of the non-functional area, and the second edge is a separation line between the functional area and the non-functional area;

[0014] The first trace and the second trace are electrically connected by a connecting part, and an integrated circuit board is bound with the third trace;

[0015] After the substrate is cut along a reserved cutting path between the functional area and the non-functional area, the third trace is peeled off from the surface of the non-functional area to remove the non-functional area, and the remaining third trace and the integrated circuit board form a binding area of the display panel, and the remaining functional area forms a display area of the display panel.

[0016] According to another aspect of the present application, a spliced panel is also provided, which is formed by splicing a plurality of the above display panels.

[0017] In the display panel provided in the embodiments of the present application, the display panel comprises a display area and a binding area, wherein the binding area is located at one side of the display area. For the display area, the display area comprises a substrate having opposite first and second surfaces, a first trace located on the first surface of the substrate, and a second trace located on the second surface of the substrate, and in order to electrically connect the first trace and the second trace on the two surfaces of the substrate, the display area further comprises a connecting part for electrically connecting the first trace and the second trace, and it should be noted that the second surface has opposite first and second edges, and the second trace extends from the first edge to the second edge of the second surface. For the binding area, the binding area comprises a bound integrated circuit board and a third trace, and the third trace is electrically connected with the second trace extending from the first edge to the second edge, so that for the integrated circuit board requiring the binding area, the binding of the integrated circuit board and the third trace does not occur in the display area, but occurs at one side of the display area, so that the present application can avoid damaging the first trace on the first surface of the substrate, i.e., the present application solves the technical problem that the back binding process in the prior art damages the display area of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0018] The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification. The illustrations are shown in the drawings through exemplary embodiments of the present application and their descriptions serve to explain the present application, and do not constitute an improper limitation to the present application. In the drawings:

[0019] Figure 1 is a cross-sectional structure schematic diagram of a display panel provided according to an embodiment of the present application;

[0020] Figure 2 is Figure 1 is a connection position relationship schematic diagram of an integrated circuit board and a third trace of a binding area;

[0021] Figure 3 is Figure 1 is a connection position relationship schematic diagram of another integrated circuit board and a third trace of a binding area;

[0022] Figure 4 is a cross-sectional structure schematic diagram of a substrate provided in a manufacturing method of a display panel according to an embodiment of the present application;

[0023] Figure 5 is a cross-sectional structure schematic diagram of a substrate provided in a manufacturing method of a display panel according to an embodiment of the present application; Figure 4 is a cross-sectional structure schematic diagram of a second trace and a third trace formed on the basis of the structure;

[0024] Figure 6 is a cross-sectional structure schematic diagram of a connection part formed on the basis of the structure; Figure 5

[0025] Figure 7 is a cross-sectional structure schematic diagram of an integrated circuit board bound on the basis of the structure; Figure 6

[0026] is a cross-sectional structure schematic diagram of a spliced panel provided according to an embodiment of the present application; Figure 8

[0027] is another cross-sectional structure schematic diagram of a spliced panel provided according to an embodiment of the present application. Figure 9 In the above drawings, the following reference signs are included:

[0028] 100, display area; 101, substrate; 1011, first substrate; 1012, second substrate; 102, first trace; 103, second trace; 104, connection part; 105, light emitting unit; 200, binding area; 201, third trace; 202, integrated circuit board; 1001, functional area; 2001, non-functional area.

[0029] DETAILED DESCRIPTION

[0030] ​​It should be noted that the embodiments and features of the embodiments in the present application can be combined with each other in the case of no conflict. The technical solutions in the embodiments of the present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0031] In order for those skilled in the art to better understand the scheme of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should belong to the scope of protection of the present application.

[0032] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or a chronological sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0033] As described in the background, in order to reduce the frame of the spliced display screen, the binding area of the chip is usually introduced to the back of the display screen, and the chip is bound to the back of the display screen through the back wiring of the display screen. However, the front surface of the display screen usually also has front surface wiring and light emitting devices electrically connected to the front surface wiring, so that the binding of the chip and the back wiring of the display screen occurs in the display area of the display screen. In addition, the back bonding process involved in the chip bonding process usually has a pressure of several MPa and a high temperature of 150 or more, so that in the case of overlapping between the front surface wiring and the back wiring, the high pressure / temperature in the back bonding process in the prior art will inevitably cause damage to the front surface of the display screen, thereby easily leading to display failure of the front surface of the display screen and other problems, and making the product reliability poor. The impact on the front surface includes but is not limited to Mura of the packaging material, pressure injury of the Array circuit leading to electrical drift, and dark spots / bad spots caused by LED bonding failure. In order to at least solve the problem that the back bonding process in the prior art causes damage to the display area of the display panel, the present application provides a display panel, a manufacturing method of the display panel and a display device.

[0034] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application.

[0035] According to embodiments of the present application, a display panel is provided, as shown in Figure 1 The display panel includes:

[0036] a display area 100 and a binding area 200 located on one side of the display area 100;

[0037] Further, the display area 100 includes a substrate 101, a first trace 102 located on a first surface of the substrate 101, a second trace 103 located on a second surface of the substrate 101, and a connecting portion 104 electrically connecting the first trace 102 and the second trace 103, wherein the first surface and the second surface are opposite surfaces of the substrate 101.

[0038] For example, in a direction perpendicular to the first surface, the binding area 200 can have a perpendicular projection on a side surface of the display area 100; or for example, in a direction parallel to the first surface, the binding area 200 can be arranged side by side with the display area 100. The substrate 101 can be a flexible substrate and / or a glass substrate.

[0039] The first trace 102 is a trace in a trace layer located on the first surface of the substrate 101, and the second trace 103 is a trace in a trace layer located on the second surface of the substrate 101. When the first surface and the second surface of the substrate 101 are opposite surfaces, the first trace 102 is located on the first surface, and the second trace 103 is located on the second surface. Therefore, in a direction perpendicular to the first surface or the second surface, the perpendicular projection of the second trace 103 on the first surface can overlap the first trace 102.

[0040] For the connecting portion for electrically connecting the first trace 102 and the second trace 103, in some optional embodiments, the connecting portion 104 can be a side trace layer located on the side wall of the substrate 101. In this case, the first trace 102 can extend on the first surface to one side near the side wall of the substrate 101 for arranging the side trace layer, and the second trace 103 can extend on the second surface to one side near the side wall of the substrate 101 for arranging the side trace layer, so that one end of the trace in the side trace layer is electrically connected to the first trace, and the other end is electrically connected to the second trace. In other optional embodiments, the first trace 102 located on the first surface of the substrate 101 and the second trace 103 located on the second surface of the substrate 101 can be electrically connected by a connecting portion 104 penetrating through the substrate 101. Those skilled in the art can reasonably select the layout of the connecting portion according to actual needs to achieve the electrical connection of the first trace 102 and the second trace 103.

[0041] Further, the binding area 200 includes a binding integrated circuit board 202 and a third trace 201, and in order to make the binding of the third trace 201 and the integrated circuit board 202 occur in an area other than the display area 100, to avoid damaging the trace of the display area 100, the second trace 103 extends from a first edge of the second surface to a second edge of the second surface and is electrically connected to the third trace 201, the first edge and the second edge being opposite edges of the second surface.

[0042] The integrated circuit board 202 can be a flexible printed circuit board or a rigid printed circuit board.

[0043] It can be seen that for the integrated circuit board 202 that needs a binding area 200, the binding of the integrated circuit board 202 and the third trace 201 in the present application does not occur in the display area 100, but occurs on one side of the display area 100, so that during the binding of the integrated circuit board 202 and the third trace 201, the pressure and temperature in the binding process do not act on the substrate 101 of the display area 100, so that the present application does not cause damage to the first trace 102 located on the first surface of the substrate 101, and further can avoid the phenomenon of electrical drift caused by the first trace 102 being pressed.

[0044] Specifically, as shown in Figure 1 The substrate 101 includes a first substrate 1011 and a second substrate 1012 arranged in layers, the surface of the first substrate 1011 away from the second substrate 1012 is the first surface, i.e. the first trace 102 is arranged on the surface of the first substrate 1011 away from the second substrate 1012, the surface of the second substrate 1012 away from the first substrate 1011 includes a first area A opposite the first surface and a second area B adjacent to the first area A, the third trace 201 is located in the second area B, i.e. the second trace 103 is arranged on the surface of the second substrate 1012 away from the first substrate 1011 corresponding to the first area A, and the third trace 201 is arranged on the surface of the second substrate 1012 away from the first substrate 1011 corresponding to the second area B. Accordingly, the surface corresponding to the first surface and the first area of the substrate 101 of the display area 100 of the display panel is the opposite first surface and second surface, the part of the second substrate 1012 other than the substrate of the display area 100 of the second substrate 1012 can be considered as the substrate of the binding area 200, and the surface corresponding to the part of the second substrate 1012 other than the substrate of the display area 100 of the second substrate 1012 is the second area B adjacent to the first area A, so that the binding area 200 is adjacent to the edge of the display area 100, and the binding of the third trace 201 and the integrated circuit board 202 does not occur in the display area 100.

[0045] The first substrate 1011 can be a flexible substrate or a glass substrate, and the second substrate 1012 can be a flexible substrate. It should be noted that when the first substrate 1011 and the second substrate 1012 are both flexible substrates, the materials of the first substrate 1011 and the second substrate 1012 can be different, so as to facilitate peeling the second substrate 1012 corresponding to the binding area 200 from the first substrate 1011.

[0046] Specifically, when the first substrate 1011 is a glass substrate and the second substrate 1012 is a flexible substrate, the first trace 102 and the second trace 103 of the display area 100 usually need to be electrically connected through the connection part 104, and when the connection part 104 corresponds to the side trace layer of the substrate 101, the side trace layer of the glass substrate can usually be formed by physical vapor deposition or magnetron sputtering, etc. These methods can ensure that the side trace layer and the side of the substrate form a dense strong binding force, and improve the reliability of the trace. Therefore, the first substrate 1011 can be a glass substrate. In addition, since the glass substrate and the flexible substrate can be accurately separated by using laser peeling technology, and the flexible substrate can realize the bending of the third trace 201, the second substrate 1012 can be a flexible substrate.

[0047] On this basis, as shown in Figure 1 The projection of the first substrate 1011 on the second substrate 1012 can coincide with the first area A.

[0048] Optionally, in the direction away from the first area A, in order to improve the reliability of the third trace 201, the layout length of the third trace 201 in the second area B can be less than the extension length of the second area B, and then after binding the third trace 201 and the integrated circuit board 202, the third trace 201 can also be protected by using the dispensing method.

[0049] In some optional embodiments, the second trace 103 has a first line width, the third trace 201 has a second line width, and the first line width is greater than the second line width. That is, in this embodiment, the second trace 103 can have a larger line width, so as to reduce the pressure drop. In order to enable the binding area 200 to be bent, the second line width of the third trace 201 can be smaller, so as to facilitate bending the binding area 200 to the back of the display area 100, so that the display panel realizes a narrow frame of the screen body.

[0050] In some alternative embodiments, the first spacing between two adjacent second traces 103 is greater than the second spacing between two adjacent third traces 201, so as to facilitate the folding of the binding area 200 to the back of the display area 100.

[0051] Of course, in the case where the first line width of the second traces 103 is greater than the second line width of the third traces 201, the first spacing between two adjacent second traces 103 can be greater than the second spacing between two adjacent third traces 201, so as to achieve the purpose of reducing the voltage drop based on the line width design, and further facilitate the folding of the binding area 200 to the back of the display area 100 by reducing the spacing between the traces.

[0052] In one aspect, for the connection position of the binding area 200, the integrated circuit board 202 and the third traces 201, in some alternative embodiments, the binding area 200 includes a folding region near the side of the display area 100 and a binding region away from the side of the display area 100, the third traces 201 include a trace portion located in part of the folding region and a connection portion located in another part of the folding region and the binding region, and the integrated circuit board 202 is electrically connected to the connection portion. That is, the integrated circuit board 202 in this embodiment can be closer to the display area 100, so that the length of the third traces 201 of the binding area 200 is shorter, thereby reducing the voltage drop.

[0053] In addition, in this embodiment, the integrated circuit board 202 can be a flexible printed circuit board, so even if the length of the third traces 201 of the binding area 200 is shorter, the binding area 200 can still be folded to the back of the display area 100 because the integrated circuit board 202 can be folded.

[0054] It should be noted that although the integrated circuit board 202 can be folded, in order to avoid damaging the mechanical and electrical properties of the integrated circuit board 202, the bending radius of the folding region during the folding of the binding area 200 to the back of the display area 100 is greater than the minimum bending radius of the integrated circuit board 202.

[0055] On the other hand, in some alternative embodiments, as shown in FIG. 6, the binding area 200 includes a folding region near the side of the display area 100 and a binding region away from the side of the display area 100, the third traces 201 include a trace portion located in part of the folding region and a connection portion located in another part of the folding region and the binding region, and the integrated circuit board 202 is electrically connected to the connection portion. Figure 2 or Figure 3As shown, for the connection position of the binding area integrated circuit board 202 and the third trace 201, the binding area 200 can include a bending area close to one side of the display area 100 and a binding area away from the display area 100 side of the bending area, and the integrated circuit board 202 is electrically connected to the third trace 201 of the binding area. The binding position of the integrated circuit board 202 and the third trace 201 in this embodiment is further away from the display area 100, so that the influence of the binding process of the integrated circuit board 202 and the third trace 201 on the display area 100 trace can be avoided.

[0056] Correspondingly, in this embodiment, even if the integrated circuit board 202 is a rigid printed circuit board, as the length of the third trace 201 is long enough, the purpose of bending the binding area 200 to the back of the display area 100 can be achieved.

[0057] Optionally, in order to make the integrated circuit board 202 and the third trace 201 fully contact, the contact connection length of the third trace 201 and the integrated circuit board 202 can be greater than or equal to 800 μm.

[0058] In some optional embodiments, as Figure 1 As shown, the display panel further includes a light emitting unit 105 located on the side of the first trace 102 away from the substrate 101. That is, the light emitting unit 105 is located in the display area 100, and the first trace 102 is used to drive the light emitting unit 105 to emit light. Similarly, according to the present application, since the binding area 200 is located on one side of the display area 100, the temperature and pressure of the binding process will not act on the light emitting unit 105 in the process of binding the integrated circuit board 202 and the third trace 201, thereby avoiding the influence of the binding process on the light emitting unit 105, and solving the problem of LED bonding failure of the light emitting unit 105 caused by binding in the prior art.

[0059] Further, the side of the light emitting unit 105 away from the substrate 101 also has an encapsulation layer (not shown in the figure), and the present application can also avoid causing the encapsulation material Mura of the encapsulation layer, thereby improving the quality and reliability of the encapsulation material.

[0060] According to another aspect of the present application, a display panel manufacturing method is also provided, comprising:

[0061] As Figure 4 As shown, a substrate (first substrate 1011) is provided, having a third surface provided with a first trace 102 and a fourth surface opposite to the third surface, wherein the substrate includes a functional area 1001 and a non-functional area 2001 adjacent to the functional area 1001, and the first trace 102 is located in the functional area 1001;

[0062] Specifically, the substrate can be a glass substrate. The functional area 1001 is used to form a display area, and the non-functional area 2001 is used to form a bonding area. The first wire 102 can be a front-side wire of the display area.

[0063] Further, in order to form a back-side wire of the display area, as shown in Figure 5 the second wire 103 and the third wire 201 can be formed on the fourth surface, wherein the second wire 103 is located in the functional area 1001, the third wire 201 is located in the non-functional area 2001, and the second wire 103 extends from a first edge of the fourth surface to a second edge of the fourth surface and is electrically connected to the third wire 201, wherein the first edge is an edge of the fourth surface corresponding to the functional area 1001 away from the non-functional area 2001, and the second edge is a separation line between the functional area 1001 and the non-functional area 2001.

[0064] The first wire 102 and the second wire 103 are electrically connected by the connecting part 104, as shown in Figure 6 , and the integrated circuit board 202 is bonded to the third wire 201, as shown in Figure 7 .

[0065] Specifically, the connecting part 104 can be formed on the side surface of the substrate to electrically connect the first wire 102 and the second wire 103, or the connecting part 104 can be formed by penetrating the substrate from the first wire 102 to the second wire 103 to electrically connect the first wire 102 and the second wire 103.

[0066] At this time, after the third wire 201 is formed on the non-functional area 2001, the third wire 201 and the integrated circuit board 202 of the non-functional area 2001 can be bonded, so that the temperature and pressure in the bonding process act on the substrate of the non-functional area.

[0067] In this step, the above-mentioned steps are combined Figure 7 and Figure 1It can be seen that since the third trace 201 has been bound with the integrated circuit board 202, in order to facilitate hiding the integrated circuit board 202 after being bound in the back of the functional area 1001, a cutting path can be first set in the substrate to divide the non-functional area 2001 and the functional area 1001 of the substrate, and then the substrate can be cut along the reserved cutting path between the functional area 1001 and the non-functional area 2002, the third trace 201 is peeled off from the surface of the non-functional area 2001, the substrate of the non-functional area is removed, and the remaining third trace 201 and the integrated circuit board 202 constitute the binding area 200 of the display panel, and the remaining functional area 1001 constitutes the display area 100 of the display panel.

[0068] In order to facilitate the separation of the third trace 201 and the substrate of the non-functional area 2001, in some optional embodiments, the step of forming the second trace 103 and the third trace 201 includes: Figure 5 As shown in the figure, a flexible substrate (second substrate 1012) is formed on the fourth surface to cover the fourth surface of the substrate (first substrate 1011), and the second trace 103 and the third trace 201 are formed on the side surface of the flexible substrate away from the substrate. Optionally, the thickness of the substrate is H, and the depth of the reserved cutting path in the substrate is h, h≥1 / 3H, so that the substrate of the non-functional area 2001 is more easily cut off.

[0069] Optionally, in order to further reduce the damage of the binding process to the first trace 102, the second trace 103, the light emitting unit 105 and the packaging layer of the functional area 1001, in the step of binding the integrated circuit board 202 with the third trace 201, the substrate of the non-functional area can be first adsorbed on the carrier by a special binding method to fix the substrate through the non-functional area 2001 and the carrier, and then the integrated circuit board 202 and the third trace 201 are bound in the non-functional area 2001.

[0070] According to another aspect of the present application, a spliced panel is also provided, which is formed by splicing a plurality of display panels. Since the binding area of each display panel can be folded to the back of the display area, the spliced panel provided by the present application can realize the requirements of narrow frame and narrow splicing gap of the spliced screen body.

[0071] Specifically, the plurality of display panels are spliced along a first direction, and a display area and a binding area of any one of the display panels in the first direction satisfy at least one of the following conditions: the binding area of any one of the display panels has a vertical projection in the display area of a previous display panel, and the binding area of any one of the display panels has a vertical projection in the display area of the display panel itself.

[0072] As shown in FIG. 1, for the spliced screen in which the binding area 200 of any one of the display panels has a vertical projection in the display area 100 of a previous display panel, the binding area 200 of each display panel can be hidden to the back of the display area 100 of the previous display panel, so as to achieve the requirements of narrow frame of the spliced screen body and narrow splicing gap, etc. Figure 8 As shown in FIG. 2, for the spliced screen in which the binding area 200 of any one of the display panels has a vertical projection in the display area 100 of the display panel itself, the binding area 200 of each display panel can be hidden to the back of the display area 100 of the display panel itself, so as to achieve the requirements of narrow frame of the spliced screen body and narrow splicing gap, etc.

[0073] Figure 9 As shown in FIG. 2, for the spliced screen in which the binding area 200 of any one of the display panels has a vertical projection in the display area 100 of the display panel itself, the binding area 200 of each display panel can be hidden to the back of the display area 100 of the display panel itself, so as to achieve the requirements of narrow frame of the spliced screen body and narrow splicing gap, etc.

[0074] In some other optional embodiments, among the plurality of display panels spliced along the first direction, the binding area of at least one display panel can be located at the back of the display area of a previous display panel, and the binding area of at least one display panel can be located at the back of the display area of the display panel itself.

[0075] It should be further noted that the terms "comprising", "containing", or any other variant thereof are intended to cover non-exclusive inclusions, so that a process, method, article, or device that includes a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such a process, method, article, or device. Without more limitations, the element defined by the phrase "comprising a" does not exclude the presence of another identical element in the process, method, article, or device that includes the element.

[0076] The above is only an embodiment of the present application and is not intended to limit the present application. The present application can have various modifications and changes for those skilled in the art. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the scope of claims of the present application.​

Claims

1. A display panel, comprising a display area and a bonding area located on one side of the display area, characterized in that, The display area includes a substrate, a first trace located on a first surface of the substrate, a second trace located on a second surface of the substrate, and a connection portion electrically connecting the first trace and the second trace, wherein the first surface and the second surface are two opposite surfaces of the substrate; The bonding area includes a bonded integrated circuit board and a third trace, and the second trace extends from a first side of the second surface to a second side of the second surface and is electrically connected to the third trace. The first side and the second side are two opposite sides of the second surface. The second trace has a first trace width, and the third trace has a second trace width, wherein the first trace width is greater than the second trace width.

2. The display panel according to claim 1, characterized in that, The substrate includes a first substrate and a second substrate stacked together. The surface of the first substrate away from the second substrate is the first surface. The surface of the second substrate away from the first substrate includes a first region opposite to the first surface and a second region adjacent to the first region. The third trace is located in the second region.

3. The display panel according to claim 2, characterized in that, The second substrate is a flexible substrate.

4. The display panel according to claim 2, characterized in that, The projection of the first substrate onto the second substrate coincides with the first region.

5. The display panel according to any one of claims 1 to 4, characterized in that, There is a first spacing between two adjacent second traces and a second spacing between two adjacent third traces, wherein the first spacing is greater than the second spacing.

6. The display panel according to any one of claims 1 to 4, characterized in that, The bonding area includes a bent area near the display area and a bonding area away from the display area. The third trace includes a trace portion located in part of the bent area and a connection portion located in another part of the bent area and the bonding area. The integrated circuit board is electrically connected to the connection portion.

7. The display panel according to any one of claims 1 to 4, characterized in that, The bonding area includes a bent area near the display area and a bonding area away from the display area, and the integrated circuit board is electrically connected to the third trace of the bonding area.

8. The display panel according to claim 7, characterized in that, The bending radius of the bending region is greater than the minimum bending radius of the integrated circuit board.

9. The display panel according to any one of claims 1 to 4, characterized in that, The display panel also includes: The light-emitting unit is located on the side of the first trace away from the substrate.

10. A method for manufacturing a display panel, characterized in that, include: A substrate is provided having a third surface on which a first trace is disposed and a fourth surface opposite to the third surface, wherein the substrate includes a functional region and a non-functional region adjacent to the functional region, and the first trace is located in the functional region; A second trace and a third trace are formed on the fourth surface, wherein the second trace is located in the functional area and the third trace is located in the non-functional area, and the second trace extends from a first side of the fourth surface to a second side of the fourth surface and is electrically connected to the third trace, wherein the first side is the side of the fourth surface that is away from the area corresponding to the functional area and the area corresponding to the non-functional area, and the second side is the dividing line between the functional area and the non-functional area; The first trace and the second trace are electrically connected by a connector, and the integrated circuit board is bound to the third trace. The second trace has a first line width, the third trace has a second line width, and the first line width is greater than the second line width. After the substrate is cut along the reserved cutting path between the functional area and the non-functional area, the third trace is peeled off from the surface of the non-functional area to remove the non-functional area, and the remaining third trace and the integrated circuit board constitute the bonding area of ​​the display panel and the remaining functional area constitute the display area of ​​the display panel.

11. The manufacturing method according to claim 10, characterized in that, The steps for forming the second trace and the third trace include: A flexible substrate is formed on the fourth surface so that the flexible substrate covers the fourth surface of the substrate; The second and third traces, which are electrically connected, are formed on the surface of the flexible substrate away from the substrate.

12. The manufacturing method according to claim 10 or 11, characterized in that, In the step of binding the integrated circuit board to the third trace, the substrate is fixed to the stage through the non-functional area.

13. The manufacturing method according to claim 10 or 11, characterized in that, The thickness of the substrate is H, and the depth of the reserved cutting channel in the substrate is h, where h ≥ 1 / 3H.

14. The manufacturing method according to claim 10 or 11, characterized in that, The length of the third trace bound to the integrated circuit board is greater than or equal to 800 μm.

15. A splicing panel, characterized in that, It is formed by splicing together multiple display panels as described in any one of claims 1 to 9.

16. The splicing panel according to claim 15, characterized in that, The plurality of display panels are spliced ​​along a first direction, wherein the display area and the binding area of ​​any one of the display panels in the first direction satisfy at least one of the following conditions: the binding area of ​​any one of the display panels has a vertical projection in the display area of ​​the preceding display panel; or the binding area of ​​any one of the display panels has a vertical projection in its own display area.

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