Display panel, manufacturing method and display terminal

Abstract

The present application discloses a display panel, a manufacturing method and a display terminal. The display panel includes a display portion, a bending portion and a binding portion connected in sequence. The display panel includes a first backplane, a second backplane, a binding terminal portion and a functional portion. The first backplane is arranged on the back of the display portion; the second backplane is arranged on the side of the binding portion close to the display portion and is provided with an opening; the binding terminal portion is arranged on the side of the binding portion away from the display portion; the functional portion is arranged corresponding to the opening, the modulus of the functional portion is greater than the modulus of the second backplane, and the positive projection of the binding terminal portion on the functional portion is located within the functional portion. The present application arranges an opening corresponding to the second backplane and a functional portion corresponding to the opening. Since the modulus of the functional portion is greater than the modulus of the second backplane, it is not easy to deform under heat and pressure, thereby reducing the degree of deformation of the binding portion caused by heat and pressure in the binding process, thereby reducing the degree of uneven stress distribution within the binding portion and reducing the risk of microcracks inside the film layer.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a manufacturing method and a display terminal. Background Art

[0002] Flexible display panels can be folded or bent, thus achieving narrower bezels or smaller volumes, and are favored by consumers.

[0003] To ensure foldable or bendable performance, display panel substrates often use flexible film layers, such as polyethylene terephthalate. Due to the poor support of flexible films, when driver chips, flexible circuit boards, and other components are bonded to the flexible film, the film deforms under temperature and pressure conditions. This causes uneven stress distribution within the film, forming microcracks at stress concentrations. Moisture and other substances can easily intrude along these microcracks, leading to corrosion of the display panel's circuitry and poor functionality.

[0004] Therefore, it is urgent to solve the above technical problems. Summary of the Invention

[0005] The present application provides a display panel, a manufacturing method and a display terminal to improve the technical problem that the display panel deforms under temperature and pressure conditions, the stress distribution inside the film layer is uneven, microcracks are formed at the stress concentration point, and water vapor and the like can easily invade along the microcracks, causing corrosion of the display panel circuit and causing poor functionality of the display panel.

[0006] To solve the above technical problems, the technical solutions provided by this application are as follows:

[0007] The present application provides a display panel, comprising a display portion, a binding portion, and a bent portion connecting the display portion and the binding portion, wherein the binding portion is provided on a side of the display portion away from a light emitting direction of the display panel, and further comprising:

[0008] a first back plate, disposed on a side of the display portion that is away from a light emitting direction of the display panel;

[0009] a second back plate, disposed on a side of the binding portion close to the display portion, the second back plate being provided with an opening;

[0010] a binding terminal portion, provided on a side of the binding portion away from the display portion;

[0011] a functional portion, arranged corresponding to the opening;

[0012] The orthographic projection of the binding terminal portion on the functional portion is located within the functional portion, and the modulus of the functional portion is greater than the modulus of the second backplane.

[0013] In the display panel of the present application, the second backplane includes a stacked first base layer and a first adhesive layer, wherein the first base layer is disposed on a side of the first adhesive layer close to the display portion;

[0014] The functional portion includes a stacked support layer and a second adhesive layer, wherein the support layer is disposed on a side of the second adhesive layer close to the display portion;

[0015] Wherein, the modulus of the support layer is greater than the modulus of the first base layer, and / or the modulus of the second adhesive layer is greater than the modulus of the first adhesive layer.

[0016] In the display panel of the present application, the modulus of the supporting layer is greater than the modulus of the first base layer, the modulus of the second adhesive layer is greater than the modulus of the first adhesive layer, and the supporting layer and the second adhesive layer are both spaced apart from the sidewalls of the opening.

[0017] In the display panel of the present application, the orthographic projection of the supporting layer on the second adhesive layer is located within the second adhesive layer, and the area of ​​the second adhesive layer is greater than or equal to the area of ​​the supporting layer.

[0018] In the display panel of the present application, the modulus of the support layer is greater than the modulus of the first base layer, and the first adhesive layer and the second adhesive layer are made of the same material.

[0019] In the display panel of the present application, the modulus of the second adhesive layer is greater than the modulus of the first adhesive layer, and the first base layer and the support layer are made of the same material.

[0020] In the display panel of the present application, an area of ​​an orthographic projection of the binding terminal portion on the functional portion is smaller than an area of ​​the functional portion.

[0021] In the display panel of the present application, the thickness of the functional portion is greater than or equal to the thickness of the second backplane.

[0022] In the display panel of the present application, the modulus of the functional portion is greater than or equal to 50 kPa.

[0023] In the display panel of the present application, the display panel includes a binding member, the binding terminal portion is bound and connected to the binding member, and the binding member includes at least one of a driving chip and a flexible circuit board.

[0024] In the display panel of the present application, the display panel includes a stacked composite functional layer and a first support plate, the composite functional layer is arranged on a side of the first support plate close to the first back plate, and the material of the first support plate is the same as that of the functional part.

[0025] The present application also provides a method for manufacturing a display panel, the method comprising:

[0026] Providing a backplane mother material, cutting the backplane mother material to form a first backplane and a second backplane, wherein the second backplane is provided with an opening;

[0027] providing a functional portion, the functional portion being arranged corresponding to the opening, and the modulus of the functional portion being greater than the modulus of the second back plate;

[0028] Providing a flattened display portion, a binding portion, and a bending portion connecting the display portion and the binding portion, wherein a binding terminal portion is provided on a side of the binding portion facing away from a light emitting direction of the display panel;

[0029] The first backplane, the second backplane, and the functional part are arranged on the side of the display part away from the light emitting direction of the display panel. The first backplane is arranged corresponding to the display part, and the second backplane is arranged corresponding to the binding part. The orthographic projection of the binding terminal part on the functional part is located within the functional part.

[0030] The present application also provides a display terminal, which includes the above-mentioned display panel.

[0031] Beneficial effects: The present application discloses a display panel, a manufacturing method and a display terminal. The display panel includes a display portion, a binding portion and a bending portion connecting the display portion and the binding portion. The binding portion is arranged on the side of the display portion away from the light emitting direction of the display panel. The display panel also includes a first backplane, a second backplane, a binding terminal portion and a functional portion. The first backplane is arranged on the side of the display portion away from the light emitting direction of the display panel; the second backplane is arranged on the side of the binding portion close to the display portion, and the second backplane is provided with an opening; the binding terminal portion is arranged on the side of the binding portion away from the display portion, and the functional portion is arranged corresponding to the opening; wherein the orthographic projection of the binding terminal portion on the functional portion is located within the functional portion, and the modulus of the functional portion is greater than the modulus of the second backplane. The present application sets an opening on the second backplane and a functional part at the opening. Since the modulus of the functional part is greater than the modulus of the second backplane, it is not easy to deform under heat and pressure, thereby reducing the degree of deformation of the binding part caused by heat and pressure in the binding process, thereby reducing the degree of uneven stress distribution in the binding part and reducing the risk of microcracks inside the film layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0033] Figure 1A schematic diagram of a top view of a display panel provided in an embodiment of the present application;

[0034] Figures 2a to 2d They are Figure 1 A schematic diagram of a cross-sectional structure at BB in FIG;

[0035] Figure 3 for Figure 2a A schematic diagram of a flattened structure of a partial film layer of a display panel;

[0036] Figure 4 for Figure 2a A schematic diagram of a flattened structure of another partial film layer of a display panel;

[0037] Figures 5a to 5e for Figure 3 The process flow chart of the backplane in FIG;

[0038] Figure 6 A schematic structural diagram of a display terminal provided in an embodiment of the present application.

[0039] Description of reference numerals:

[0040] Display panel 1, display area AA, non-display area NA, display part 11, bending part 12, binding part 13, first backplane 21, second base layer 211, third adhesive layer 212, second backplane 22, opening 22a, first base layer 221, first adhesive layer 222, binding member 30, binding terminal part 130, functional part 40, supporting layer 41, second adhesive layer 42, polarizer 43, cover plate 44, driving chip 51, flexible circuit board 52, first raising layer 611, second raising layer 612, composite functional layer 60, grid glue 62, buffer layer 63, first supporting plate 641, second supporting plate 642, pressure-sensitive adhesive 66, base material layer 67, double-sided tape 65, backplane mother material 20A, functional mother material 40A, first size L1, second size L2, display terminal 2, terminal body 3. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0042] The present application provides a display panel 1, such as Figures 1 to 4 As shown, the display panel 1 includes a display part 11, a binding part 13 and a bending part 12 connecting the display part 11 and the binding part 13, the binding part 13 is arranged on the side of the display part 11 away from the light emitting direction of the display panel 1, and the display panel 1 also includes a first back panel 21, a second back panel 22, a binding terminal part 130 and a functional part 40, the first back panel 21 is arranged on the back of the display part 11; the second back panel 22 is arranged on the side of the binding part 13 close to the display part 11, and the second back panel 22 is provided with an opening 22a; the binding terminal part 130 is arranged on the side of the binding part 13 away from the display part 11; the functional part 40 is arranged corresponding to the opening 22a, wherein the positive projection of the binding terminal part 130 on the functional part 40 is located in the functional part 40, and the modulus of the functional part 40 is greater than the modulus of the second back panel 22.

[0043] In this embodiment, the display panel 1 is a flexible panel, and the display panel 1 can be an OLED panel, a Mini-LED panel, a Micro-LED panel, etc.

[0044] In this embodiment, the display portion 11, the bending portion 12, and the binding portion 13 are integrally formed. The display portion 11 includes a light-emitting surface and a back surface. The light-emitting surface is used to display images, and the back surface is the surface opposite the light-emitting surface. The light-emitting surface of the display portion 11 is the side of the display portion 11 facing away from the binding portion 13. The direction of the light-emitting surface of the display portion 11 is the direction of light emission from the display panel 1.

[0045] like Figure 1 As shown, the display portion 11 includes a display area AA and a non-display area NA disposed around the display area AA. The display area AA is provided with a plurality of sub-pixels (not shown in the figure), which may include red sub-pixels, green sub-pixels, and blue sub-pixels, thereby realizing color image display. The non-display area NA may be provided with a driving circuit, such as a gate driving circuit, which is used to provide driving signals to the sub-pixels.

[0046] like Figure 2a As shown, the binding terminal portion 130 is provided on a side of the binding portion 13 facing away from the display portion 11. The binding terminal portion 130 is used to bind and connect with the binding member 30. The binding member 30 can be at least one of a driver chip 51, a flexible circuit board 52, a chip-on-film, etc., but is not limited thereto. The binding terminal portion 130 is used to input the driving signal of the binding member 30 to the display panel 1.

[0047] The binding terminal portion 130 includes a plurality of binding terminals, and the binding terminals are made of conductive material. A plurality of connecting wires are provided inside the binding portion 13, and a connecting wire is connected to one or more binding terminals. The surface of the binding terminal is exposed and is used for binding and connecting with the binding member 30. Binding connection refers to connecting the conductive materials on both sides of the anisotropic conductive adhesive through anisotropic conductive adhesive, etc., thereby realizing electrical connection of the conductive materials on the upper and lower sides of the anisotropic conductive adhesive. But it is not limited to this. Specifically, a plurality of binding terminals are provided on the surface of one side of the binding member 30 close to the binding portion 13, and the anisotropic conductive adhesive is placed between the binding terminals of the binding terminal portion 130 and the binding terminals of the binding member 30. By hot pressing, the anisotropic conductive adhesive realizes the electrical connection between the binding terminals of the binding terminal portion 130 and the binding terminals of the binding member 30. The binding terminals of the binding terminal portion 130 can be electrically connected to the binding terminals of the binding member 30 in a one-to-one correspondence.

[0048] The bending portion 12 includes a plurality of wirings (not shown in the figure), one end of which can be connected to the sub-pixel in the display portion 11, and the other end can be connected to the binding terminal portion 130, thereby realizing the transmission of the driving signal.

[0049] In this embodiment, if Figure 2a As shown, the bending portion 12 can be semicircular, and the binding portion 13 is provided on the back of the display portion 11. Through the above arrangement, the binding portion 13 can overlap with the display portion 11, thereby reducing the frame width occupied by the binding portion 13 and achieving a narrow frame effect.

[0050] In this embodiment, if Figures 2a to 2d As shown, a first back plate 21 is provided on the back of the display portion 11, and a second back plate 22 is provided on the surface of the side of the binding portion 13 close to the display portion 11. The materials of the first back plate 21 and the second back plate 22 can be the same or different. The materials of the first back plate 21 and the second back plate 22 may include one or more of silica, polyester resin, polyethylene, polypropylene, polystyrene, polylactic acid, polyethylene terephthalate, polyimide or polyurethane, but are not limited thereto. The first back plate 21 can prevent the display portion 11 from being damaged by external forces and can block water vapor, and the second back plate 22 can prevent the binding portion 13 from being damaged by external forces and can block water vapor.

[0051] In this embodiment, if Figures 2a to 2cAs shown, the display panel 1 may further include a laminated composite functional layer 60 and a second support plate 642. The composite functional layer 60 may be composed of multiple film layers. The composite functional layer 60 may protect and support the display portion 11. The film layers of the composite functional layer 60 may be configured as needed and are not limited in this application.

[0052] In this embodiment, if Figures 2a to 2c A statically foldable display panel 1 is shown. In the statically foldable display panel 1 , the composite functional layer 60 may include a stacked grid glue 62 , a buffer layer 63 , etc. The grid glue 62 is located on a side of the buffer layer 63 close to the first backplane 21 .

[0053] The grid glue 62 has the functions of laminating, venting and bonding, and will not affect the flexibility of the display panel 1 .

[0054] The material of the buffer layer 63 can be at least one of foam, rubber, silicone and plastic, but is not limited thereto. The buffer layer 63 can achieve shock absorption and prevent the display layer from being damaged by external stress.

[0055] In this embodiment, if Figures 2a to 2c As shown, the second support plate 642 is disposed on a side of the composite functional layer 60 near the second back plate 22. The second support plate 642 has a certain degree of rigidity and can provide back support and protection for the display panel 1, thereby preventing the back of the display panel 1 from being damaged by impact. The material of the second support plate 642 can be a metal material such as copper, but is not limited thereto.

[0056] In this embodiment, if Figures 2a to 2c As shown, a second elevating layer 612 is provided between the second support plate 642 and the second back plate 22. The second elevating layer 612 may be made of fiberglass, polymer material, aluminum sheet, steel sheet, etc. Adhesive layers (not shown) are provided on opposite sides of the second elevating layer 612. The adhesive layers on the two side surfaces are respectively used to bond to the second support plate 642 and the second back plate 22, thereby securing the binding portion 13.

[0057] In this embodiment, if Figure 2d A dynamically foldable display panel 1 is shown. The display panel 1 includes a laminated composite functional layer 60 and a first support plate 641. The composite functional layer 60 may include a pressure-sensitive adhesive 66, a substrate layer 67, and the pressure-sensitive adhesive 66, which are sequentially laminated. The substrate layer 67 may be made of a flexible material such as polyimide or polyethylene terephthalate. The pressure-sensitive adhesive 66 is provided on both sides of the substrate layer 67. The pressure-sensitive adhesive 66 is sticky and can achieve adhesion between the film layers.

[0058] In this embodiment, the material of the first support plate 641 can be metal materials such as stainless steel, but is not limited thereto.

[0059] In this embodiment, if Figure 2d As shown, a first elevating layer 611 is provided between the first support plate 641 and the second back plate 22. Adhesive layers (not shown) are provided on opposite sides of the first elevating layer 611. The adhesive layers on the two side surfaces are respectively used to bond with the first support plate 641 and the second back plate 22, thereby securing the binding portion 13. The first elevating layer 611 may be made of polyimide, polyester fiber, or the like.

[0060] In this embodiment, the material of the first support plate 641 can be the same as that of the functional portion 40. For example, the material of the first support plate 641 and the material of the functional portion 40 can both be stainless steel. Stainless steel is relatively inexpensive and has a high modulus. By using stainless steel for the first support plate 641 and the functional portion 40, the production cost of the display panel 1 can be reduced.

[0061] In this embodiment, the display panel 1 includes a polarizer 43 disposed on the light-emitting surface of the display portion 11 . The polarizer 43 is used to reduce reflected light and improve the glare problem of the display panel 1 .

[0062] In this embodiment, the display panel 1 includes a cover plate 44, which is disposed on the side of the polarizer 43 facing away from the display portion 11. The cover plate 44 may be made of, but is not limited to, polyimide or glass. The cover plate 44 protects the display portion 11 from damage caused by external impacts.

[0063] In this embodiment, the second back plate 22 is provided with an opening 22a. The opening 22a can penetrate the second back plate 22 or partially penetrate the second back plate 22. In other words, the opening 22a can be a through hole or a blind hole. The shape of the opening 22a can match the shape of the binding terminal portion 130, which is not limited in this application. For example, the shape of the opening 22a can be rectangular, etc.

[0064] In this embodiment, the functional portion 40 is provided corresponding to the opening 22a and can fill the opening 22a. The surface of the functional portion 40 facing away from the binding portion 13 can be flush with the surface of the second back plate 22 facing away from the binding portion 13, or the surface of the functional portion 40 facing away from the binding portion 13 can be slightly higher than the surface of the second back plate 22 facing away from the binding portion 13.

[0065] In this embodiment, the modulus of the functional portion 40 is greater than the modulus of the second back plate 22. Under conditions of heat and pressure, the functional portion 40 is less likely to deform due to its higher modulus. When the binding member 30 is bound and connected to the binding portion 13, under the action of heat and pressure in the binding process, the degree of deformation of the functional portion 40 is lower than the deformation condition of the second back plate 22 under the same conditions, thereby reducing the degree of deformation of the binding portion 13, reducing the degree of uneven stress distribution within the binding portion 13, and reducing the risk of microcracks inside the film layer of the binding portion 13. Since microcracks are not easily generated inside the film layer of the binding portion 13, it is not easy to provide an intrusion path for water vapor, thereby reducing the risk of corrosion of the binding member 30 due to the influence of water vapor.

[0066] In this embodiment, the modulus of the functional portion is greater than or equal to 50 kilopascals (KPa).

[0067] In this embodiment, the orthographic projection of the binding terminal portion 130 on the functional portion 40 is located within the functional portion 40. For example, the orthographic projection of the binding terminal portion 130 on the functional portion 40 may coincide with the functional portion 40, or the area of ​​the orthographic projection of the binding terminal portion 130 on the functional portion 40 may be smaller than the area of ​​the functional portion 40. When the area of ​​the orthographic projection of the binding terminal portion 130 on the functional portion 40 is smaller than the area of ​​the functional portion 40, the orthographic projection pattern of the binding terminal portion 130 may be spaced apart from the side wall of the functional portion 40, and the spacing may be 3 mm to 5 mm, so that the functional portion 40 can have a larger area and can provide better support for the binding portion 13 in the area corresponding to the binding terminal portion 130. This is because when the functional portion 40 has a larger area, the pressure applied to the functional portion 40 during the binding process is reduced, and the degree of deformation of the functional portion 40 is reduced, thereby reducing the degree of uneven stress distribution within the binding portion 13 and further reducing the risk of microcracks forming inside the film layer of the binding portion 13.

[0068] The area of ​​the functional portion 40 refers to the area of ​​the largest surface of the functional portion 40. The functional portion 40 is a flat plate structure, and its largest surface is parallel to the back surface of the display portion 11 and the largest surface of the binding portion 13.

[0069] In the display panel 1 of the present application, as Figure 2a As shown, the second back panel 22 includes a stacked first base layer 221 and a first adhesive layer 222, and the first base layer 221 is arranged on the side of the first adhesive layer 222 close to the display part 11; the functional part 40 includes a stacked support layer 41 and a second adhesive layer 42, and the support layer 41 is arranged on the side of the second adhesive layer 42 close to the display part 11; wherein the modulus of the support layer 41 is greater than the modulus of the first base layer 221, and / or the modulus of the second adhesive layer 42 is greater than the modulus of the first adhesive layer 222.

[0070] In this embodiment, the first adhesive layer 222 and the second adhesive layer 42 may be made of adhesive materials. The first adhesive layer 222 may be bonded to the binding portion 13 on a side facing away from the first base layer 221. The second adhesive layer 42 may be bonded to the binding portion 13 on a side facing away from the support layer 41.

[0071] In this embodiment, the modulus of the support layer 41 is greater than the modulus of the first base layer 221, and / or the modulus of the second adhesive layer 42 is greater than the modulus of the first adhesive layer 222. This means that the overall modulus of the functional portion 40 is greater than the modulus of the second backsheet 22. Furthermore, the modulus of at least one of the laminated film layers of the functional portion 40 is greater than the modulus of at least one of the laminated film layers of the second backsheet 22.

[0072] For example, when the material of the supporting layer 41 is different from the material of the first base layer 221, and the material of the first adhesive layer 222 is different from the material of the second adhesive layer 42, the modulus of the supporting layer 41 can be greater than the modulus of the first base layer 221, and the modulus of the second adhesive layer 42 is greater than the modulus of the first adhesive layer 222.

[0073] When the material of the support layer 41 is the same as that of the first base layer 221 , ie, the modulus of the support layer 41 is equal to that of the first base layer 221 , the modulus of the second adhesive layer 42 may be greater than that of the first adhesive layer 222 .

[0074] When the material of the second adhesive layer 42 is the same as that of the first adhesive layer 222 , ie, the modulus of the second adhesive layer 42 is equal to the modulus of the first adhesive layer 222 , the modulus of the support layer 41 may be greater than the modulus of the first base layer 221 .

[0075] In this embodiment, the thickness of the functional portion 40 can be equal to the thickness of the second backplane 22. For example, the thickness of the second adhesive layer 42 can be equal to the thickness of the first adhesive layer 222, and the thickness of the support layer 41 can be equal to the thickness of the first base layer 221. The thickness of the second backplane 22 and the functional portion 40 can both be 0.075 mm. Specifically, the thickness of the first adhesive layer 222 and the second adhesive layer 42 can be 0.025 mm, and the thickness of the support layer 41 and the first base layer 221 can be 0.05 mm.

[0076] It should be understood that the thickness of the second back plate 22 and the thickness of the functional portion 40 can be adjusted as needed, and this application does not impose any limitation on this.

[0077] In some embodiments, due to the thickness tolerance of the functional part 40, the thickness of the functional part 40 may be greater than the thickness of the second back plate 22. That is to say, the thickness of the functional part 40 has an upper tolerance, and the thickness of the functional part 40 may be slightly greater than the thickness of the second back plate 22. The difference between the thickness of the functional part 40 and the thickness of the second back plate 22 may be a tolerance. For example, the difference between the thickness of the functional part 40 and the thickness of the second back plate 22 may be greater than 0 and less than 0.01 mm. Through the above arrangement, the functional part 40 slightly protrudes from the surface of the second back plate 22, so that the functional part 40 withstands the binding pressure during the binding process. At the same time, the difference between the thickness of the functional part 40 and the thickness of the second back plate 22 is small, which will not affect the bonding of the padding layer 61 and the surface of the second back plate 22 close to the display part 11.

[0078] In this embodiment, the first backplane 21 and the second backplane 22 can be made of the same material. When the second backplane 22 includes a stacked first base layer 221 and a first adhesive layer 222, the first backplane 21 can include a stacked second base layer 211 and a third adhesive layer 212. The second base layer 211 is made of the same material as the first base layer 221, and the third adhesive layer 212 is made of the same material as the first adhesive layer 222. Thus, the first backplane 21 and the second backplane 22 can be formed using the same die-cutting process.

[0079] In the display panel 1 of the present application, as Figure 2a As shown, the modulus of the support layer 41 is greater than that of the first base layer 221 , the modulus of the second adhesive layer 42 is greater than that of the first adhesive layer 222 , and both the support layer 41 and the second adhesive layer 42 are spaced apart from the sidewall of the opening 22 a .

[0080] In this embodiment, the material of the support layer 41 is different from the material of the first base layer 221, and the modulus of the support layer 41 is greater than that of the material of the first base layer 221. For example, the material of the support layer 41 can be a metal such as stainless steel or copper. The material of the first base layer 221 can be polyethylene terephthalate, polyimide, etc.

[0081] In this embodiment, the material of the second adhesive layer 42 is different from the material of the first adhesive layer 222. The material of the second adhesive layer 42 has a greater modulus than that of the first adhesive layer 222. For example, the material of the first adhesive layer 222 may be, but is not limited to, optically clear adhesive (OCA), and the material of the second adhesive layer 42 may be, but is not limited to, hot melt adhesive. The modulus of optical adhesive is approximately 30 kPa, while the modulus of hot melt adhesive is approximately 50 kPa.

[0082] In this embodiment, if Figure 2aAs shown, the support layer 41 is spaced apart from the sidewalls of the opening 22a. This means that the area of ​​the support layer 41 is smaller than the area of ​​the bottom wall of the opening 22a, allowing the support layer 41 to fit within the opening 22a. Furthermore, considering the processing tolerances of the opening 22a and the functional portion 40, the spacing between the support layer 41 and the sidewalls of the opening 22a can be 0.2 mm to 0.5 mm. For example, the spacing between the support layer 41 and the sidewalls of the opening 22a can be 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, etc.

[0083] Similarly, if Figure 2a As shown, the distance between the second adhesive layer 42 and the sidewall of the opening 22a may also be 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, etc.

[0084] It should be noted that when the distance between the support layer 41 and the sidewall of the opening 22a is small, the process precision requirement is higher. When the distance between the support layer 41 and the sidewall of the opening 22a is large, the process precision requirement is lower.

[0085] In the display panel 1 of the present application, as Figure 2a As shown, the orthographic projection of the support layer 41 on the second adhesive layer 42 is located within the second adhesive layer 42 , and the area of ​​the second adhesive layer 42 is greater than or equal to the area of ​​the support layer 41 .

[0086] In this embodiment, the area of ​​the second adhesive layer 42 is larger than that of the support layer 41. In other words, the sidewalls of the second adhesive layer 42 can extend beyond the sidewalls of the support layer 41. This arrangement increases the area of ​​the second adhesive layer 42 and reduces the risk of the support layer 41 forming embossing marks on the binding portion 13.

[0087] In this embodiment, the area of ​​the second adhesive layer 42 is equal to the area of ​​the support layer 41 , so that the second adhesive layer 42 and the support layer 41 can be manufactured using the same die-cutting process, simplifying the processing of the functional portion 40 .

[0088] During the bonding process, the second adhesive layer 42 will overflow under heat and pressure, filling the gap between the second adhesive layer and the sidewall of the opening 22a. The overflow of the second adhesive layer 42 can absorb part of the pressure during the bonding process, further reducing the risk of the support layer 41 forming an imprint on the bonding portion 13.

[0089] In the display panel 1 of the present application, as Figure 2b As shown, the modulus of the support layer 41 is greater than the modulus of the first base layer 221 , and the first adhesive layer 222 and the second adhesive layer 42 are made of the same material.

[0090] In this embodiment, the first adhesive layer 222 and the second adhesive layer 42 are made of the same material. For example, the first adhesive layer 222 and the second adhesive layer 42 can both be made of optical adhesive. The modulus of the support layer 41 is greater than that of the first base layer 221. The support layer 41 can be made of a metal such as stainless steel or copper. The first base layer 221 can be made of polyethylene terephthalate, polyimide, or the like.

[0091] In this embodiment, the first adhesive layer 222 and the second adhesive layer 42 can be arranged continuously or spaced apart. Figure 2a The situation is similar and will not be repeated here.

[0092] Optionally, in an embodiment, as Figure 2b As shown, the first adhesive layer 222 and the second adhesive layer 42 are continuously provided, which means that the opening 22a is a blind hole. The opening 22a only passes through the first base layer 221, and the support layer 41 is located within the opening 22a. The continuous provision of the first adhesive layer 222 and the second adhesive layer 42 prevents moisture from invading through the gap between the functional portion 40 and the sidewall of the opening 22a, further reducing the risk of moisture intrusion.

[0093] In the display panel 1 of the present application, as Figure 2c As shown, the modulus of the second adhesive layer 42 is greater than the modulus of the first adhesive layer 222 , and the first base layer 221 and the support layer 41 are made of the same material.

[0094] In this embodiment, the material of the second adhesive layer 42 may be hot melt adhesive, etc., and the material of the first adhesive layer 222 may be optical adhesive, etc.

[0095] The first base layer 221 and the support layer 41 can both be made of polyethylene terephthalate, polyimide, or the like.

[0096] In one embodiment, the first base layer 221 and the support layer 41 can be arranged continuously or spaced apart. Figure 2a The situation is similar and will not be repeated here.

[0097] Optionally, in this embodiment, if Figure 2c As shown, the first base layer 221 and the support layer 41 are arranged continuously. This means that the opening 22a is a blind hole. The opening 22a only passes through the first adhesive layer 222, and the second adhesive layer 42 is located within the opening 22a. The support layer 41 has better waterproof performance than the second adhesive layer 42. By arranging the first base layer 221 and the support layer 41 continuously, water vapor can be further prevented from invading the gap between the functional portion 40 and the sidewall of the opening 22a, reducing the risk of water vapor intrusion.

[0098] In the display panel 1 of the present application, as Figure 2a and Figure 3 As shown, the binding member 30 includes a driving chip 51 and a flexible circuit board 52 . The flexible circuit board 52 is located on a side of the driving chip 51 away from the bending portion 12 .

[0099] In this embodiment, if Figure 2a As shown, the flexible circuit board 52 can be connected to the edge area of ​​the binding portion 13 through the binding terminal portion 130, and the driver chip 51 can be connected to the middle area of ​​the binding portion 13 through the binding terminal portion 130. The orthographic projections of the binding terminal portion 130 on the functional portion 40 are all located within the functional portion 40.

[0100] When the binding member 30 includes both the driver chip 51 and the flexible circuit board 52, the functional components 40 corresponding to the driver chip 51 and the flexible circuit board 52 can be arranged continuously. This means that the same functional component 40 can support both the driver chip 51 and the flexible circuit board 52. This arrangement reduces the number of functional components 40 and reduces the difficulty in manufacturing the display panel 1.

[0101] like Figure 2a and Figure 3 As shown, the opening 22a can be provided near the edge of the second back plate 22, and a side wall of the opening 22a can overlap with a side wall of the second back plate 22, i.e., the pattern of the opening 22a is an open pattern. The flexible circuit board 52 can be provided corresponding to the open side wall of the opening 22a. The flexible circuit board 52 has a portion that does not overlap with the binding portion 13. The portion of the flexible circuit board 52 that does not overlap with the binding portion 13 can be fixed to the side of the second support plate 642 facing away from the light-emitting surface of the display panel 1 using double-sided tape 65.

[0102] Figure 4 shows another schematic diagram of a flattened structure of a portion of the film layer of the display panel 1, Figure 4 and Figure 3 The difference is the opening 22a. Figure 4 In the embodiment of FIG. 5 , the opening 22 a is in a closed pattern and is located in the middle region of the binding portion 13 . In this case, the binding member 30 may only include the driving chip 51 .

[0103] This application also provides a method for manufacturing a display panel 1, such as Figures 5a to 5d As shown, a method for manufacturing the display panel 1 is described by taking an embodiment of the present application as an example.

[0104] like Figure 5a As shown, a backplane mother material 20A is provided, and the backplane mother material 20A is cut to form a first backplane 21 and a second backplane 22, and the second backplane 22 is provided with an opening 22a;

[0105] In this embodiment, if Figure 5a As shown, a backplane mother material 20A is provided, and the backplane mother material 20A is cut once to obtain a first backplane 21 and a second backplane 22 at the same time. The first backplane 21 and the second backplane 22 are made of the same material, and the second backplane 22 is provided with an opening 22a. In this embodiment, the dimensional accuracy of the first dimension L1 and the second dimension L2 of the first backplane 21 and the second backplane 22 can be ensured by molding the first backplane 21 and the second backplane 22 in one step. This is because, when the first backplane 21 and the second backplane 22 are cut separately, the first dimension L1 and the second dimension L2 of the first backplane 21 and the second backplane 22 are affected by the deviation of the assembly process, and the fluctuation range increases.

[0106] In this embodiment, the first backplane 21 may include a stacked second base layer 211 and a third adhesive layer 212; the second backplane 22 may include a stacked first base layer 221 and a first adhesive layer 222. The second base layer 211 is made of the same material as the first base layer 221, and the third adhesive layer 212 is made of the same material as the first adhesive layer 222. Therefore, the first and second backplanes 21 and 22 may be formed using the same die-cutting process.

[0107] like Figure 5b and Figure 5c As shown, a functional portion 40 is provided, the functional portion 40 is arranged corresponding to the opening 22a, and the modulus of the functional portion 40 is greater than the modulus of the second back plate 22;

[0108] In this embodiment, if Figure 5b As shown, a functional mother material 40A may be provided, and the functional mother material 40A may be cut once to obtain the functional portion 40 .

[0109] In this embodiment, the functional portion 40 includes a support layer 41 and a second adhesive layer 42 that are stacked. Figure 5c As shown, the functional part 40 is correspondingly attached to the opening 22a. It should be noted that the second adhesive layer 42 is located on the side of the support layer 41 close to the second back plate 22. Then the first back plate 21, the second back plate 22, and the functional part 40 are bonded to the display part 11 and the binding part 13 as a whole. At this time, the bending part 12 is not bent, and the first back plate 21, the second back plate 22, and the functional part 40 can be realized through the same bonding process, which simplifies the processing technology of the display panel 1 and ensures that the first dimension L1 and the second dimension L2 are not affected by the deviation of the assembly process. Among them, the first back plate is bonded to the display part 11, and the second back plate 22 and the functional part 40 are bonded to the binding part 13.

[0110] like Figure 5dAs shown, a flattened display portion 11 , a binding portion 13 and a bending portion 12 connecting the display portion 11 and the binding portion 13 are provided, and a binding terminal portion 130 is provided on the side of the binding portion 13 facing away from the light emitting direction of the display panel 1 .

[0111] In this embodiment, the display portion 11 , the binding portion 13 , and the bending portion 12 are arranged flat, that is, the display portion 11 , the binding portion 13 , and the bending portion 12 are arranged in the same plane.

[0112] In this embodiment, a binding terminal portion 130 is provided on a side of the binding portion 13 facing away from the light emitting direction of the display panel 1 . Figure 5d The binding terminal portion 130 is shown in dotted line form. Figure 5d It is not visible in the figure, but is located on the other side surface of the binding portion 13 in the view.

[0113] like Figure 5e As shown, the first backplane 21, the second backplane 22, and the functional part 40 are arranged on the side of the display part 11 away from the light emitting direction of the display panel 1. The first backplane 21 is arranged corresponding to the display part 11, and the second backplane 22 is arranged corresponding to the binding part 13. The positive projection of the binding terminal part 130 on the functional part 40 is located inside the functional part 40.

[0114] In this embodiment, within the allowable range of machining tolerance, the first back plate 21 and the display portion 11 have substantially the same outer contour, and the second back plate 22 and the binding portion 13 have substantially the same outer contour.

[0115] In this embodiment, the orthographic projection of the binding terminal portion 130 on the functional portion 40 is located within the functional portion 40. The area of ​​the orthographic projection of the binding terminal portion 130 may be smaller than or equal to the area of ​​the functional portion 40.

[0116] After completing the above steps, a binding process can be performed to connect the binding member 30 to the binding terminal portion 130. Since the functional portion 40 can support the binding member 30 and the modulus of the functional portion 40 is greater than the modulus of the second backplane 22, the deformation degree of the binding portion 13 can be reduced, thereby reducing the degree of uneven stress distribution within the binding portion 13 and reducing the risk of microcracks in the film layer.

[0117] After the binding process is completed, the bent portion 12 may be bent so that the binding portion 13 is located on the back side of the display portion 11 .

[0118] like Figure 6 As shown, the present application further provides a display terminal 2 , which includes the above-mentioned display panel 1 .

[0119] In this embodiment, the display terminal 2 includes a display panel 1 and a terminal body 3 , and the display panel 1 and the terminal body 3 are combined into one body.

[0120] In this embodiment, the display terminal 2 can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, or a navigator.

[0121] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0122] The above is a detailed introduction to the display panel, manufacturing method and display terminal provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: The display panel includes a display portion, a binding portion, and a bending portion connecting the display portion and the binding portion, wherein the binding portion is provided on a side of the display portion away from a light emitting direction of the display panel, and the display panel further includes: a first back plate, disposed on a side of the display portion that is away from a light emitting direction of the display panel; a second back plate, disposed on a side of the binding portion close to the display portion, the second back plate being provided with an opening; a binding terminal portion, provided on a side of the binding portion away from the display portion; a functional portion, arranged corresponding to the opening; The orthographic projection of the binding terminal portion on the functional portion is located within the functional portion, and the modulus of the functional portion is greater than the modulus of the second backplane.

2. The display panel according to claim 1, wherein: The second backplane includes a first base layer and a first adhesive layer stacked together, wherein the first base layer is arranged on a side of the first adhesive layer close to the display portion; The functional portion includes a stacked support layer and a second adhesive layer, wherein the support layer is disposed on a side of the second adhesive layer close to the display portion; Wherein, the modulus of the support layer is greater than the modulus of the first base layer, and / or the modulus of the second adhesive layer is greater than the modulus of the first adhesive layer.

3. The display panel according to claim 2, wherein: The modulus of the support layer is greater than that of the first base layer, the modulus of the second adhesive layer is greater than that of the first adhesive layer, and both the support layer and the second adhesive layer are spaced apart from the sidewall of the opening.

4. The display panel according to claim 2, wherein: The modulus of the support layer is greater than the modulus of the first base layer, and the material of the first adhesive layer is the same as that of the second adhesive layer.

5. The display panel according to claim 2, wherein: The modulus of the second adhesive layer is greater than that of the first adhesive layer, and the material of the first base layer is the same as that of the support layer.

6. The display panel according to any one of claims 3 to 5, characterized in that: The orthographic projection of the supporting layer on the second adhesive layer is located within the second adhesive layer, and the area of ​​the second adhesive layer is greater than or equal to the area of ​​the supporting layer.

7. The display panel according to claim 1, wherein: An area of ​​an orthographic projection of the binding terminal portion on the functional portion is smaller than an area of ​​the functional portion.

8. The display panel according to claim 1, wherein: The thickness of the functional portion is greater than or equal to the thickness of the second back plate.

9. The display panel according to claim 1, wherein: The modulus of the functional portion is greater than or equal to 50 kPa.

10. The display panel according to claim 1, wherein The display panel includes a binding member, the binding terminal portion is bound and connected to the binding member, and the binding member includes at least one of a driving chip and a flexible circuit board.

11. The display panel according to claim 1, wherein The display panel includes a stacked composite functional layer and a first support plate. The composite functional layer is arranged on a side of the first support plate close to the first back plate. The material of the first support plate is the same as that of the functional part.

12. A method for manufacturing a display panel, characterized in that: include: Providing a backplane mother material, cutting the backplane mother material to form a first backplane and a second backplane, wherein the second backplane is provided with an opening; providing a functional portion, the functional portion being arranged corresponding to the opening, and the modulus of the functional portion being greater than the modulus of the second back plate; Providing a flattened display portion, a binding portion, and a bending portion connecting the display portion and the binding portion, wherein a binding terminal portion is provided on a side of the binding portion facing away from a light emitting direction of the display panel; The first backplane, the second backplane, and the functional part are arranged on the side of the display part away from the light emitting direction of the display panel. The first backplane is arranged corresponding to the display part, and the second backplane is arranged corresponding to the binding part. The orthographic projection of the binding terminal part on the functional part is located within the functional part.

13. A display terminal, characterized in that: The display terminal includes the display panel according to any one of claims 1 to 11.

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