Method for bonding electrostatic chuck substrate to ceramic plate

Abstract

The application discloses a kind of electrostatic chuck base plate and ceramic plate bonding method, belong to electrostatic chuck technical field, the bonding method includes the following steps: S1: electrostatic chuck base plate is coated with glue, and glue layer is formed;S2: flatly place electrostatic chuck base plate, let the side with glue layer be upwards, ceramic plate is located above glue layer and is inclined, let the side edge of ceramic plate first contact with glue layer, then slowly adjust the inclined ceramic plate, let ceramic plate gradually contact with glue layer;To the lower sidewall of ceramic plate is all contacted with glue layer;S3: after ceramic plate and glue layer are completely attached, ceramic plate is adjusted, and glue layer is dried.The electrostatic chuck base plate and ceramic plate bonding method can reduce the bubble formed between electrostatic chuck ceramic plate and electrostatic chuck base plate.

Description

Technical Field

[0001] This invention relates to the field of electrostatic chuck technology, and in particular to a method for bonding an electrostatic chuck substrate to a ceramic plate. Background Technology

[0002] When two sheet-like parts are bonded together with adhesive, air bubbles are easily generated. In the prior art, air bubbles in the adhesive layer are often discharged by setting through holes, such as the adhesive sheet and its manufacturing method disclosed in CN1930260B, which prevents or removes air pockets or air bubbles by connecting the ventilation path of the substrate and the through hole of the adhesive layer. However, this method cannot be used when the two sheet-like parts cannot be provided with ventilation paths, or when the adhesive layer cannot be provided with through holes. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a method for bonding an electrostatic chuck substrate to a ceramic plate, which can reduce the air bubbles formed between the ceramic plate and the electrostatic chuck substrate during the bonding process.

[0004] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows:

[0005] A method for bonding an electrostatic chuck substrate to a ceramic plate, the method comprising the following steps:

[0006] S1: Apply glue to the electrostatic chuck substrate to form an glue layer;

[0007] S2: Place the electrostatic chuck substrate flat with the side with the adhesive layer facing up. Place the ceramic plate on top of the adhesive layer and tilt it so that one edge of the ceramic plate contacts the adhesive layer first. Then slowly adjust the tilted ceramic plate so that the ceramic plate gradually contacts the adhesive layer until the entire lower side wall of the ceramic plate is in contact with the adhesive layer.

[0008] S3: After the ceramic plate and the adhesive layer are fully bonded, level the ceramic plate and wait for the adhesive layer to dry.

[0009] Preferably, the electrostatic chuck substrate is provided with a limiting sleeve, the limiting sleeve includes a limiting sleeve body, an inclined guide sleeve is provided above the limiting sleeve body, and the adhesive layer is disposed in the limiting sleeve body.

[0010] Preferably, the limiting sleeve is bonded to the electrostatic chuck substrate.

[0011] Preferably, the side wall of the limiting sleeve is provided with a feed pipe communicating with the inside of the limiting sleeve and a discharge pipe communicating with the inside of the limiting sleeve.

[0012] Preferably, a clamping device is provided above the ceramic plate, the clamping device including a ceramic plate clamping assembly and a ceramic plate pressing assembly.

[0013] Preferably, the ceramic plate clamping assembly includes a first clamping member and a second clamping member, the first clamping member and the second clamping member are connected to a fixing plate, the fixing plate is connected to a frame, and the electrostatic chuck base plate is disposed on the frame.

[0014] Preferably, the first clamping member includes a first clamping block, which is disposed on a first support rod, and the first support rod is connected to a fixed plate via a first telescopic rod.

[0015] Preferably, the second clamping member includes a second support rod, the second support rod is provided with a second clamping block, the second clamping block is connected to the second support rod by a first spring, and the second support rod is connected to the fixing plate by a second telescopic rod.

[0016] Preferably, the ceramic plate pressing assembly includes a third telescopic rod, one end of which is fixed to a plate, and the other end of which is connected to the pressing push block assembly.

[0017] Preferably, the pressing push block assembly includes a push block support sleeve and a push block, the push block support sleeve is connected to the telescopic end of the third telescopic rod, and the push block and the push block support sleeve are connected by a connecting rod.

[0018] The above technical solution has the following beneficial effects:

[0019] By first allowing one edge of the ceramic slab to contact the adhesive layer, and then gradually adjusting the tilted ceramic slab to allow it to gradually come into contact with the adhesive layer until the entire lower sidewall of the ceramic slab is in contact with the adhesive layer, air bubbles can be effectively expelled during the bonding process as the ceramic slab gradually comes into contact with the adhesive layer and finally adheres to it completely. After bonding, there are fewer air bubbles in the adhesive layer, improving product quality and making the bond between the two more reliable. This solves the problem of a large number of air bubbles forming between the ceramic slab and the adhesive layer caused by directly contacting a whole piece of ceramic slab with the adhesive layer.

[0020] By setting up a ceramic plate clamping assembly, it is possible to bond one side first and then the other side slowly during the bonding process. This prevents air bubbles from forming between the ceramic plate and the adhesive layer during the contact process, ensuring that the ceramic plate and the adhesive layer first make partial contact and then make full contact to complete the bonding of the ceramic plate. The operation is stable and reliable. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the main structure of the electrostatic chuck substrate and ceramic plate bonding device in Example 1;

[0022] Figure 2 This is a three-dimensional structural diagram of the electrostatic chuck substrate and ceramic plate bonding device in Example 1;

[0023] Figure 3 for Figure 2 A magnified structural diagram of A in the middle;

[0024] Figure 4 This is a schematic diagram of the main structure of the electrostatic chuck substrate and ceramic plate bonding device in Example 2;

[0025] Figure 5 This is a three-dimensional structural diagram of the electrostatic chuck substrate and ceramic plate bonding device in Example 2;

[0026] Figure 6 for Figure 5 A magnified structural diagram of B in the diagram. Detailed Implementation

[0027] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings. It should be noted that these descriptions are for the purpose of aiding understanding the present invention, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0028] Example 1

[0029] refer to Figures 1-3 The method for bonding the electrostatic chuck substrate 16 to the ceramic plate 12 includes the following steps:

[0030] S1: Apply adhesive to the electrostatic chuck substrate 16 to form an adhesive layer 17;

[0031] S2: Place the electrostatic chuck substrate 16 on a flat surface with the side of the electrostatic chuck substrate 16 with the adhesive layer 17 facing upwards, so that the ceramic plate 12 can be bonded to the adhesive layer 17. The ceramic plate 12 is located above the adhesive layer 17 and is tilted at a certain angle, so that the ceramic plate 12 and the adhesive layer 17 are at a certain angle. Let one edge of the ceramic plate 12 contact the adhesive layer 17 first, and then slowly adjust the tilted ceramic plate 12 so that the angle between the ceramic plate 12 and the adhesive layer 17 gradually decreases, that is, the ceramic plate 12 and the adhesive layer 17 gradually adhere to each other, and the ceramic plate 12 gradually contacts the adhesive layer 17 until the entire lower side wall of the ceramic plate 12 is in contact with the adhesive layer 17.

[0032] S3: Adjust the ceramic plate 12 so that its upper surface is parallel to the horizontal plane so that the upper surface of the ceramic plate 12 can be horizontal when the electrostatic chuck is in use. During the adjustment of the ceramic plate 12, the thickness of the adhesive layer 17 can also be adjusted as needed. Pressure can be applied from one side of the ceramic plate 12 toward the electrostatic chuck substrate 16 to make the thickness of the adhesive layer 17 thinner to a suitable thickness. After the adjustment is completed, the adhesive layer 17 can be dried.

[0033] The electrostatic chuck substrate 16 is provided with a limiting sleeve, which includes a limiting sleeve body 18. The limiting sleeve body 18 is a cylindrical hollow sleeve. An inclined guide sleeve 19 is provided above the limiting sleeve body 18. An adhesive layer 17 is disposed in the limiting sleeve body 18. The limiting sleeve body 18 is bonded to the electrostatic chuck substrate 16.

[0034] A clamping device is provided above the ceramic plate 12, and the clamping device includes a ceramic plate 12 clamping assembly and a ceramic plate 12 pressing assembly;

[0035] The ceramic plate 12 clamping assembly is used to clamp the ceramic plate 12. When the ceramic plate 12 is bonded to the adhesive layer 17, the ceramic plate 12 clamping assembly clamps the ceramic plate 12, first allowing one side of it to contact the adhesive layer 17, then slowly adjusting the angle between the ceramic plate 12 and the plane of the adhesive layer 17, and finally allowing the ceramic plate 12 to be bonded flatly to the adhesive layer 17. After the adhesive layer 17 dries, the bonding of the ceramic plate 12 and the electrostatic chuck substrate 16 is completed.

[0036] By controlling the ceramic plate 12 clamping assembly to clamp the ceramic plate 12, the ceramic plate 12 is bonded to the adhesive layer 17. The operation is reliable. When adjusting the angle between the ceramic plate 12 and the adhesive layer 17, the angle becomes smaller more uniformly, making it easier to control the angle adjustment.

[0037] The ceramic plate 12 pressing assembly is used to adjust the thickness of the adhesive layer 17 when the ceramic plate 12 is fully bonded to the adhesive layer 17. To achieve the goal of first bonding one side of the ceramic plate 12 to the adhesive layer 17, and then gradually bonding it to the adhesive layer 17 until it is fully bonded, the adhesive layer 17 needs to have a certain thickness. This thickness is greater than the final thickness of the bonding between the ceramic plate 12 and the electrostatic chuck substrate 16. Therefore, after the ceramic plate 12 is bonded to the adhesive layer 17, the ceramic plate 12 pressing assembly is needed to adjust the thickness of the adhesive layer 17 to reduce it to the required thickness. After the ceramic plate 12 and the adhesive layer 17 are fully bonded, the ceramic plate 12 clamping assembly releases the ceramic plate 12, and the ceramic plate 12 pressing assembly applies a force to the ceramic plate 12 in the direction of the electrostatic chuck substrate 16, which can make the thickness of the adhesive layer 17 thinner and adjust the thickness of the adhesive layer 17 to a suitable size. In addition, by pressing down the ceramic plate 12 by the ceramic plate 12 pressing assembly, the ceramic plate 12 can also be leveled so that its surface is parallel to the surface of the electrostatic chuck substrate 16, ensuring that the upper surface of the ceramic plate 12 is horizontal and meets the usage requirements of the electrostatic chuck.

[0038] The ceramic plate 12 clamping assembly includes a first clamping member and a second clamping member. The first clamping member and the second clamping member are connected to the fixing plate 2. The fixing plate 2 is connected to the frame 1 through the connecting plate 3. The electrostatic chuck base plate 16 is disposed on the frame 1.

[0039] The first and second clamping parts are provided to better clamp the ceramic plate 12 and facilitate one side to contact the adhesive layer 17 first, while the other side gradually approaches the adhesive layer 17. The first and second clamping parts are required to be symmetrically arranged about the ceramic plate 12. The first clamping part clamps the left side wall of the ceramic plate 12, and the second clamping part clamps the right side wall of the ceramic plate 12. This allows the left side of the ceramic plate 12 to contact the adhesive layer 17 first, and then the angle of the right side is adjusted to allow the ceramic plate 12 to gradually contact the adhesive layer 17. Finally, the entire lower side wall of the ceramic plate 12 is in contact with the adhesive layer 17.

[0040] The first clamping member includes a first clamping block 9, which is disposed on a first support rod 7. The first support rod 7 is connected to the fixed plate 2 through a first telescopic rod 4.

[0041] The first clamping block 9 contacts the ceramic plate 12 and applies force to the ceramic plate 12 in order to clamp the ceramic plate 12. The first clamping block 9 can be made of rubber material. The first clamping block 9 made of rubber can avoid damaging the ceramic plate 12 on the one hand, and on the other hand, the first clamping block 9 made of rubber has a certain elasticity, which can better clamp the ceramic plate 12.

[0042] In general, the ceramic plate 12 is in a disc shape. In order to better clamp the ceramic plate 12, the first clamping block 9 can be provided with an arc-shaped sidewall. The arc-shaped sidewall fits against the sidewall of the ceramic plate 12, which better clamps the ceramic plate 12 and avoids the situation where the contact area between the first clamping block 9 and the ceramic plate 12 is too small, thus damaging the ceramic plate 12 and better protecting the ceramic plate 12.

[0043] The first support rod 7 is used to support the first clamping block 9. The first support rod 7 is connected to the first telescopic rod 4. The first telescopic rod 4 is used to adjust the distance between the first clamping block 9 and the adhesive layer 17 so that the ceramic plate 12 is bonded to the adhesive layer 17. The telescopic direction of the first telescopic rod 4 is away from or close to the adhesive layer 17.

[0044] The fixing plate 2 is used to support the first clamping member and the second clamping member. The fixing plate 2 is connected to the frame 1, and the frame 1 supports the fixing plate 2, thereby supporting the first clamping member and the second clamping member.

[0045] The second clamping member includes a second support rod 8, a second clamping block 10 is provided on the second support rod 8, the second clamping block 10 is connected to the second support rod 8 by a first spring 11, and the second support rod 8 is connected to the fixing plate 2 by a second telescopic rod 6.

[0046] The second clamping block 10 is in direct contact with the ceramic plate 12. In order to protect the ceramic plate 12, the material used to manufacture the second clamping block 10 can also be rubber. In order to better clamp the ceramic plate 12, protrusions can also be provided on the rubber material to prevent slippage.

[0047] The second telescopic rod 6 extends or retracts away from or towards the adhesive layer 17. The second clamping member is used to clamp the ceramic plate 12 and slowly move it towards the adhesive layer 17 through the extension and retraction of the second telescopic rod 6.

[0048] The second clamping block 10 is connected to the second support rod 8 via the first spring 11. Since the ceramic plate 12 is tilted at a certain angle before being bonded to the adhesive layer 17, the distance between the first clamping block 9 and the second clamping block 10 is smaller than the distance when the ceramic plate 12 is fully bonded to the adhesive layer 17, even without reducing the angle between the ceramic plate 12 and the adhesive layer 17. As the angle between the ceramic plate 12 and the adhesive layer 17 is reduced, the distance between the first clamping block 9 and the second clamping block 10 gradually increases. To avoid excessive pressure on the ceramic plate 12 during adjustment, the distance between the first clamping block 9 and the second clamping block 10 must adapt to changes in the angle. The second telescopic rod 6 is fixedly connected to the fixed plate 2. In order to achieve the requirement that the ceramic plate 12 gradually adheres to the adhesive layer 17, a first spring 11 is provided. When the second clamping block 10 contacts the ceramic plate 12, the first spring 11 is compressed and applies a reaction force to the second clamping block 10. Then, the ceramic plate 12 is clamped by the second clamping block 10 in conjunction with the first clamping block 9. When the ceramic plate 12 is gradually adhered to the adhesive layer 17, the angle between the ceramic plate 12 and the upper plane of the adhesive layer 17 gradually decreases. The first spring 11 is further compressed, and the distance between the second clamping block 10 and the first clamping block 9 continuously increases, so as to adapt to the change of the angle of the ceramic plate 12 and continue to clamp the ceramic plate 12.

[0049] The ceramic plate 12 pressing assembly includes a third telescopic rod 5. One end of the third telescopic rod 5 is connected to the fixed plate 2, and the other end of the third telescopic rod 5 is connected to the pressing push block 15. The position of the pressing block can be moved by the third telescopic rod 5.

[0050] The ceramic plate 12 pressing component can adjust the thickness of the adhesive layer 17. By pressing the ceramic plate 12 down towards the adhesive layer 17, the thickness of the adhesive layer 17 is adjusted when it reaches the required thickness. In addition, after the first clamping block 9 and the second clamping block 10 have bonded the ceramic plate 12 to the adhesive layer 17, they need to be separated from the ceramic plate 12. At this time, the ceramic plate 12 pressing component acts on the ceramic plate 12, and then the first telescopic rod 4 and the second telescopic rod 6 are retracted, allowing the first clamping block 9 and the second clamping block 10 to be separated from the ceramic plate 12.

[0051] In use, the pressing block 15 directly contacts the upper surface of the ceramic plate 12. When adjusting the thickness of the adhesive layer 17, a force is applied to the ceramic plate 12 in the direction of the ceramic plate 12. When the first clamping block 9 and the second clamping block 10 are separated from the ceramic plate 12, they contact the upper surface of the ceramic plate 12, restricting the vertical position of the ceramic plate 12 and allowing the first clamping block 9 and the second clamping block 10 to separate from the ceramic plate 12.

[0052] The push block 15 assembly includes a push block support sleeve 13 and a push block 15. The push block support sleeve 13 is connected to the telescopic end of the third telescopic rod 5, and the push block 15 and the push block support sleeve 13 are connected by a connecting rod 14.

[0053] Multiple push blocks 15 can be set and evenly arranged along the circumference of the push block support sleeve 13. The connecting rod 14 can be an L-shaped connecting rod 14. One end of the L-shaped connecting rod 14 is connected to the push block support sleeve 13, and the other end of the L-shaped connecting rod 14 is connected to the push block 15. The lower surface of the push block 15 is horizontal so as to better support the ceramic plate 12. The lower surface of the push block 15 is lower than the L-shaped connecting rod 14 and lower than the lower surface of the push block support sleeve 13.

[0054] By first allowing one edge of the ceramic plate 12 to contact the adhesive layer 17, and then slowly adjusting the tilted ceramic plate 12 to gradually contact the adhesive layer 17 until the entire lower sidewall of the ceramic plate 12 is in contact with the adhesive layer 17, during the bonding process, as the ceramic plate 12 gradually contacts the adhesive layer 17 and finally adheres to it completely, air bubbles in the bonding process can be effectively expelled. After bonding, the amount of air bubbles in the adhesive layer is reduced, improving product quality and making the bond between the two more reliable. This solves the problem of a large number of air bubbles forming between the ceramic plate 12 and the adhesive layer 17 caused by directly contacting a whole piece of ceramic plate 12 with the adhesive layer 17.

[0055] By setting up the ceramic plate 12 clamping assembly, it is possible to bond one side first and then the other side slowly during the bonding process. This ensures that no air bubbles are formed between the ceramic plate 12 and the adhesive layer 17 during the contact process, and satisfies the requirement that the ceramic plate 12 and the adhesive layer 17 first make partial contact and then make full contact, thus completing the bonding of the ceramic plate 12. The operation is stable and reliable.

[0056] Example 2

[0057] refer to Figures 4-6By setting the limiting sleeve 18 and the inclined guide sleeve 19, when the ceramic plate 12 is not bonded to the adhesive layer 17, the adhesive has not cured. The adhesive in the limiting sleeve 18 can be set to be thicker so that the ceramic plate 12 can be bonded to the adhesive on one side first, and then gradually bonded to the adhesive layer 17 until they are all bonded together. After the bonding is completed, by pressing down the ceramic plate 12, the adhesive layer 17 can be thinned to the required thickness. The inclined guide sleeve 19 is set on the limiting sleeve 18 and connected to the upper side wall of the limiting sleeve 18. Since the first clamping block 9 and the second clamping block 10 are on the edge of the ceramic plate 12, in order to facilitate the bonding of the ceramic plate 12 and the adhesive layer 17, the opening of the inclined guide sleeve 19 continuously increases from bottom to top.

[0058] The side wall of the limiting sleeve 18 is provided with a feed pipe 20 communicating with the inside of the limiting sleeve 18 and a discharge pipe 21 communicating with the inside of the limiting sleeve 18.

[0059] When in use, the thickness of the adhesive layer 17 exceeds the height of the limiting sleeve 18. When the ceramic plate 12 is attached to the adhesive layer 17, the opening of the inclined guide sleeve 19 continuously increases from bottom to top, leaving room for the operation of the first clamping block 9 and the second clamping block 10. After the operation is completed, the ceramic plate 12 pressing component is now in the position of the ceramic plate 12. After the first clamping block 9 and the second clamping block 10 are separated from the ceramic plate 12, the ceramic plate 12 pressing component continues to push the ceramic plate 12 downward, allowing the adhesive liquid to be discharged from the discharge pipe 21. A valve can be installed on the discharge pipe 21 until the adhesive layer 17 reaches a suitable thickness. In order to expel the small amount of air bubbles still present in the adhesive layer 17, airless adhesive is discharged from the feed pipe 20, allowing the adhesive to be discharged from the discharge pipe 21, thereby carrying the air bubbles out of the discharge pipe 21. After the thickness of the adhesive layer 17 is adjusted to a suitable size, the limiting sleeve 18 can be removed before the adhesive layer 17 is completely dry.

[0060] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and these variations still fall within the protection scope of the present invention.

Claims

1. A method for bonding an electrostatic chuck substrate to a ceramic plate, characterized in that, The bonding method includes the following steps: S1: Apply glue to the electrostatic chuck substrate to form an glue layer; S2: Place the electrostatic chuck substrate flat with the side with the adhesive layer facing up. Place the ceramic plate on top of the adhesive layer and tilt it so that one edge of the ceramic plate contacts the adhesive layer first. Then slowly adjust the tilted ceramic plate so that the ceramic plate gradually contacts the adhesive layer until the entire lower side wall of the ceramic plate is in contact with the adhesive layer. The electrostatic chuck substrate is provided with a limiting sleeve, the limiting sleeve includes a limiting sleeve body, an inclined guide sleeve is provided above the limiting sleeve body, and the adhesive layer is disposed in the limiting sleeve body; A clamping device is provided above the ceramic plate. The clamping device includes a ceramic plate clamping assembly and a ceramic plate pressing assembly. The ceramic plate clamping assembly includes a first clamping member and a second clamping member. The first clamping member and the second clamping member are connected to a fixed plate. The fixed plate is connected to a frame. The electrostatic chuck base plate is disposed on the frame. The first clamping member includes a first clamping block, which is disposed on a first support rod. The first support rod is connected to the fixed plate through a first telescopic rod. The second clamping member includes a second support rod, on which a second clamping block is disposed. The second clamping block is connected to the second support rod through a first spring. The second support rod is connected to the fixed plate through a second telescopic rod. S3: After the ceramic plate and the adhesive layer are fully bonded, level the ceramic plate and wait for the adhesive layer to dry.

2. The method for bonding an electrostatic chuck substrate to a ceramic plate according to claim 1, characterized in that, The limiting sleeve is bonded to the electrostatic chuck substrate.

3. The method for bonding an electrostatic chuck substrate to a ceramic plate according to claim 1, characterized in that, The side wall of the limiting sleeve is provided with a feed pipe communicating with the inside of the limiting sleeve and a discharge pipe communicating with the inside of the limiting sleeve.

4. The method for bonding an electrostatic chuck substrate to a ceramic plate according to claim 1, characterized in that, The ceramic plate pressing assembly includes a third telescopic rod, one end of which is connected to a fixed plate, and the other end of which is connected to a pressing push block assembly.

5. The method for bonding an electrostatic chuck substrate to a ceramic plate according to claim 4, characterized in that, The pressing push block assembly includes a push block support sleeve and a push block. The push block support sleeve is connected to the telescopic end of the third telescopic rod, and the push block is connected to the push block support sleeve through a connecting rod.

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