A high temperature resistant composite glaze and preparation method thereof, ceramic tile and preparation method thereof

Abstract

The invention discloses a high temperature resistant composite glaze and a preparation method thereof, a ceramic tile and a preparation method thereof. The high temperature resistant composite glaze comprises: an organosilicon modified resin, a silicate, a metal oxide, a glass former and an auxiliary agent, wherein the raw materials of the organosilicon modified resin comprise talcum powder, mica powder, wollastonite and epoxy resin, and the organosilicon modified resin is obtained by selecting talcum powder, mica powder, wollastonite and epoxy resin for modification, and can form a metal-silicon-oxygen network under high temperature conditions, which plays both a skeleton role and a high temperature resistance role. After mixed reaction with the silicate, the metal oxide and the glass former, the organosilicon resin can better cover the outer wall thereof, further improve the high temperature resistance of the composite glaze, and has a broader market application prospect when applied to ceramic tiles.

Description

Technical Field

[0001] The invention relates to the field of ceramic tiles, and in particular to a high temperature resistant composite glaze and a preparation method thereof, a ceramic tile and a preparation method thereof. Background Art

[0002] Ceramic tiles have always been an important development direction in terms of high temperature resistance, especially in the industrial field and special environments. The current progress in high temperature resistance is mainly concentrated in the following aspects: Application of new materials: Researchers are exploring new ceramic materials to improve the high temperature resistance of ceramic tiles. For example, high temperature ceramic materials such as strontium titanate and alumina have excellent high temperature resistance and can be used to make high temperature resistant ceramic tiles; Surface treatment technology: The use of special surface treatment technology, such as coating or coating process, can enhance the high temperature resistance of ceramic tiles. These coatings can provide an additional layer of protection to prevent ceramic tiles from cracking or deforming at high temperatures; Optimization of structural design: Improve the structural design of ceramic tiles so that they can better withstand thermal stress in high temperature environments. By optimizing the internal structure and shape of ceramic tiles, thermal stress concentration can be reduced and their high temperature resistance can be improved.

[0003] In the prior art, although ceramic tiles have made some progress in high temperature resistance, there are still some defects, such as cracks and breakage: ceramic tiles are prone to cracks and breakage under long-term high temperature, which affects their service life and performance, or the use of high-temperature ceramic materials or special surface treatment technology will increase the production cost of ceramic tiles, making the price of high-temperature ceramic tiles higher. These defects are mainly caused by factors such as thermal stress, material performance limitations and manufacturing processes in high temperature environments. Due to cost and technical limitations, the application range of high-temperature ceramic tiles is relatively narrow, and they are mainly used in special environments, such as industrial furnaces and stoves.

[0004] In summary, it is imperative to develop a low-cost and high-temperature resistant ceramic tile to expand the application range of ceramic tiles. Summary of the invention

[0005] The main purpose of the present invention is to provide a high temperature resistant composite glaze and a preparation method thereof, a ceramic tile and a preparation method thereof, aiming to provide a ceramic tile with low cost and high temperature resistance.

[0006] To achieve the above-mentioned purpose, the present invention proposes a high-temperature resistant composite glaze for use on ceramic tiles. The high-temperature resistant composite glaze comprises: an organosilicon-modified resin, a silicate, a metal oxide and a glass former, wherein the raw materials of the organosilicon-modified resin comprise talcum powder, mica powder, wollastonite, epoxy resin and an epoxy crosslinking agent.

[0007] In some embodiments, the following raw materials are included in weight fractions: 5 to 10 parts of organosilicon modified resin, 30 to 60 parts of silicate, 5 to 25 parts of metal oxide and 10 to 20 parts of glass former; and / or,

[0008] In the organosilicon modified resin, the mass ratio of the talc powder, the mica powder, the wollastonite to the epoxy resin and the epoxy crosslinking agent is (3-8): (4-6): (2-4): (20-30): (4-5).

[0009] In some embodiments, the silicate comprises sodium silicate; and / or,

[0010] The metal oxide comprises at least one of aluminum oxide, calcium oxide and magnesium oxide; and / or,

[0011] The glass former comprises at least one of potassium oxide and sodium oxide; and / or,

[0012] The epoxy crosslinking agent includes γ-mercaptopropyltrimethoxysilane; and / or,

[0013] The epoxy resin includes at least one of E12, E20, E44, and E51.

[0014] The present invention further provides a method for preparing the high temperature resistant composite glaze as described above, comprising the following steps:

[0015] S10, mixing an organosilicon-modified resin, a silicate, a metal oxide and a glass former to obtain a solid mixture, wherein the raw materials of the organosilicon-modified resin include talc powder, mica powder, wollastonite, an epoxy resin and an epoxy crosslinking agent;

[0016] S20, grinding the solid mixture to obtain a high temperature resistant composite glaze.

[0017] In some embodiments, S10 includes the following steps:

[0018] S1, mixing a silicate, a metal oxide and a glass former to obtain a first mixture;

[0019] S2, coating the organosilicon-modified resin and the first mixture, and curing them to obtain a solid mixture.

[0020] In some embodiments, in step S10, the method for preparing the organosilicon-modified resin comprises the following steps:

[0021] S101, pre-treating talcum powder, mica powder and wollastonite, grinding and mixing to obtain a second mixture;

[0022] S102, mixing the second mixture with epoxy resin and epoxy crosslinking agent, heating and cooling to solidify, to obtain organosilicon modified resin.

[0023] In some embodiments, in step S102, the temperature of the heating treatment is 60-80°C; and / or the time of the heating treatment is 1-2 hours.

[0024] In some embodiments, the steps of preparing the tile include:

[0025] S100, providing a high temperature resistant composite glaze and a tile substrate as described in any one of the above;

[0026] S200, coating the high temperature resistant composite glaze on the tile substrate to obtain a green layer;

[0027] S300, sintering the green layer at high temperature and applying pressure to obtain ceramic tiles.

[0028] In some embodiments, in step S300, the sintering temperature is 1000-1200°C.

[0029] The present invention also proposes a ceramic tile, comprising the high temperature resistant composite glaze as described in any one of the above items, or the high temperature resistant composite glaze prepared by the method for preparing the high temperature resistant composite glaze as described in any one of the above items, or the ceramic tile prepared by the method for preparing the ceramic tile as described above.

[0030] In the technical solution provided by the present invention, a high-temperature resistant composite glaze is proposed. By selecting talcum powder, mica powder, wollastonite, epoxy resin and epoxy cross-linking agent for modification, a silicone modified resin is obtained. The silicone modified resin can form a metal-silicon-oxygen network under high temperature conditions, which plays both a skeleton role and a high-temperature resistant role. When mixed with silicates, metal oxides and glass formers, the silicone resin can better cover the outer wall, further improving the high-temperature resistance of the composite glaze, and has a broader market application prospect when used in ceramic tiles. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 This is a flow chart of Example 5 of the present invention.

[0033] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0034] To make the purpose, technical scheme and advantages of the embodiment of the present invention clearer, the technical scheme in the embodiment of the present invention will be described clearly and completely below. If the specific conditions are not specified in the embodiment, it is carried out according to the normal conditions or the conditions recommended by the manufacturer. If the reagents or instruments used do not specify the manufacturer, they are all conventional products that can be purchased commercially. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes, taking "A and / or B" as an example, including scheme A, or scheme B, or schemes that A and B meet at the same time. In addition, the technical schemes between the various embodiments can be combined with each other, but must be based on the ability of ordinary technicians in the field to achieve. When the combination of technical solutions is contradictory or cannot be achieved, it should be considered that the combination of such technical solutions does not exist, and is not within the scope of protection required by the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present invention.

[0035] In the prior art, although ceramic tiles have made some progress in high temperature resistance, there are still some defects, such as cracks and breakage: ceramic tiles are prone to cracks and breakage under long-term high temperature, which affects their service life and performance, or the use of high-temperature ceramic materials or special surface treatment technology will increase the production cost of ceramic tiles, making the price of high-temperature ceramic tiles higher. These defects are mainly caused by factors such as thermal stress, material performance limitations and manufacturing processes in high temperature environments. Due to cost and technical limitations, the application range of high-temperature ceramic tiles is relatively narrow, and they are mainly used in special environments, such as industrial furnaces and stoves.

[0036] In view of this, the present invention proposes a high temperature resistant composite glaze for use on ceramic tiles. The high temperature resistant composite glaze comprises: an organosilicon modified resin, a silicate, a metal oxide and a glass former, wherein the raw materials of the organosilicon modified resin comprise talcum powder, mica powder, wollastonite and epoxy resin.

[0037] In the technical solution provided by the present invention, a high-temperature resistant composite glaze is proposed. By selecting talcum powder, mica powder, wollastonite, epoxy resin and epoxy cross-linking agent for modification, a silicone modified resin is obtained. The metal-silicon-oxygen network can be formed under high temperature conditions, which plays both a skeleton role and a high-temperature resistant role. When mixed with silicates, metal oxides and glass formers, the silicone resin can better cover its outer wall, and the formed outer wall can better block the doping of other impurities and the harmful effects on the high-temperature resistance. Therefore, the high-temperature resistance of the composite glaze can be further improved, and its application in ceramic tiles has a broader market application prospect.

[0038] It should be noted that the raw materials of silicone modified resin include talcum powder, mica powder, wollastonite and epoxy resin. Among them, talcum powder is used as a filler, mainly to increase the volume, mica powder increases wear resistance and scratch resistance, wollastonite provides hardness and heat resistance, and epoxy resin, as a matrix material, provides adhesion and increases toughness. Epoxy cross-linking agent is used to promote the curing and cross-linking of the resin and improve the heat resistance and hardness of the glaze.

[0039] In some embodiments, 所述 The high temperature resistant composite glaze includes the following raw materials in parts by mass: 5-10 parts of organosilicon modified resin, 30-60 parts of silicate, 5-25 parts of metal oxide and 10-20 parts of glass former. Selecting appropriate proportions of organosilicon modified resin, silicate, metal oxide and glass former to form the high temperature resistant composite glaze can further improve the high temperature resistance of the composite glaze.

[0040] In some embodiments, in the organosilicon modified resin, the mass ratio of the talc powder, the mica powder, the wollastonite, the epoxy resin and the epoxy crosslinking agent is (3-8): (4-6): (2-4): (20-30): (4-5). Within this range, the prepared organosilicon modified resin can form a stable protective film at high temperature, which can protect the surface of the tile and prevent the glaze from falling off or discoloring at high temperature. Within this ratio range, the protective film formed is more stable, thereby further improving the high temperature resistance of the tile glaze and extending the service life of the tile.

[0041] It should be noted that talcum powder, mica powder and wollastonite have low thermal conductivity and chemical stability, which can enhance the high temperature resistance of the glaze, while epoxy resin has excellent high temperature resistance and chemical stability.

[0042] In some embodiments, the silicate comprises sodium silicate; and / or,

[0043] The metal oxide comprises at least one of aluminum oxide, calcium oxide and magnesium oxide; and / or,

[0044] The glass former comprises at least one of potassium oxide and sodium oxide; and / or,

[0045] The epoxy crosslinking agent includes γ-mercaptopropyltrimethoxysilane; and / or,

[0046] The epoxy resin includes at least one of E12, E20, E44, and E51.

[0047] Any one or more of the above-mentioned materials may be adopted, without limitation. Among them, the main role of sodium silicate in high-temperature resistant glaze is to serve as a silicon source, which helps to form silicon dioxide in the glaze and increase the hardness and wear resistance of the glaze. Alumina has a high melting point and good high-temperature resistance, which can improve the thermal stability of the glaze and prevent the deformation, cracking or falling off of tiles at high temperatures. Potassium oxide is used as a glass former mainly to promote the melting and fluidity of the glaze, and can form a glass phase with other ingredients, increase the liquid phase content of the glaze, and make it easier to flow and fuse during the firing process, thereby forming a smooth and uniform glaze layer. The epoxy resin and the cross-linking agent here are to further enhance the high-temperature resistance and mechanical properties of the resin and form a stable cross-linked network structure.

[0048] The present invention further provides a method for preparing the high temperature resistant composite glaze as described above, comprising the following steps:

[0049] S10, mixing an organosilicon-modified resin, a silicate, a metal oxide and a glass former to obtain a solid mixture, wherein the raw materials of the organosilicon-modified resin include talc powder, mica powder, wollastonite, an epoxy resin and an epoxy crosslinking agent;

[0050] S20, grinding the solid mixture to obtain a high temperature resistant composite glaze.

[0051] Specifically, this step can be performed by mixing the organosilicon modified resin, silicate, metal oxide and glass former to obtain a solid mixture, starting a stirrer to stir the mixed solid mixture to ensure that the various components are evenly dispersed and to achieve appropriate viscosity and fluidity to form a high temperature resistant composite glaze.

[0052] In some embodiments, S10 includes the following steps:

[0053] S1, mixing a silicate, a metal oxide and a glass former to obtain a first mixture;

[0054] S2, coating the organosilicon-modified resin and the first mixture, and curing them to obtain a solid mixture.

[0055] The above steps are mainly to coat the first mixture with the organosilicon modified resin, so that a high temperature resistant glaze can be obtained later, which can further improve the heat resistance. This is because the coating effect of the organosilicon modified resin can prevent oxidation and corrosion on the surface of the first mixture, protect the first mixture from high temperature erosion, and extend the service life of the tile.

[0056] The preparation method of the organosilicon modified resin comprises the following steps:

[0057] S101, pre-treating talcum powder, mica powder and wollastonite, grinding and mixing to obtain a second mixture;

[0058] S102, mixing the second mixture with epoxy resin and epoxy crosslinking agent, heating and cooling to solidify, to obtain organosilicon modified resin.

[0059] In some embodiments, in step S102, the heating treatment temperature is 60-80°C; and / or the heating treatment time is 1-2 hours. In this heating range, the epoxy resin and the cross-linking agent undergo a chemical reaction to form a high temperature resistant glaze.

[0060] Specifically, this step can be performed by the following method: mixing a silicate, a metal oxide and a glass former to obtain a first mixture, mixing the first mixture with the organosilicon-modified resin, heating at a temperature of 60 to 80° C. for 1 to 2 hours for coating, cooling to room temperature and curing to obtain a solid mixture.

[0061] In some embodiments, the steps of preparing the tile include:

[0062] S100, providing a high temperature resistant composite glaze and a tile substrate as described in any one of the above;

[0063] S200, coating the glaze on the tile substrate to obtain a green layer;

[0064] S300, sintering the green layer at high temperature and applying pressure to obtain ceramic tiles.

[0065] In some embodiments, in step S300, the sintering temperature is 1000-1200°C.

[0066] Under the above conditions, the temperature is set at 1000-1200°C in order to fix the high temperature resistant composite glaze to the tile matrix more tightly and firmly to form a dense porcelain structure.

[0067] It should be noted that the tile matrix refers to the main part of the tile, which is usually composed of natural fuels such as clay, quartz and feldspar, and can be purchased directly from the market. It should be noted that the tiles used to form the test later should select the same tile matrix during the test to ensure the experimental effect.

[0068] The present invention also proposes a ceramic tile, comprising the high temperature resistant composite glaze as described in any one of the above items, or the high temperature resistant composite glaze prepared by the method for preparing the high temperature resistant composite glaze as described in any one of the above items, or the ceramic tile prepared by the method for preparing the ceramic tile as described above.

[0069] The technical solution of the present invention is further described in detail below in conjunction with specific embodiments and drawings. It should be understood that the following embodiments are only used to explain the present invention and are not used to limit the present invention.

[0070] Example 1

[0071] The present application provides a high temperature resistant composite glaze, comprising 5g of organosilicon modified resin, 30g of sodium silicate, 5g of aluminum oxide, and 10g of potassium oxide.

[0072] Example 2

[0073] The present application provides a high temperature resistant composite glaze, comprising 10 g of organosilicon modified resin, 60 g of sodium silicate, 25 g of magnesium oxide, and 20 g of sodium oxide.

[0074] Example 3

[0075] The present application provides a high temperature resistant composite glaze, comprising 8g of organosilicon modified resin, 40g of sodium silicate, 20g of calcium oxide, and 15g of potassium oxide.

[0076] Example 4

[0077] The present application provides a high temperature resistant composite glaze, comprising 15 g of organosilicon modified resin, 20 g of sodium silicate, 30 g of aluminum oxide, and 8 g of potassium oxide.

[0078] Example 5

[0079] The present application provides a method for preparing a ceramic tile, comprising the following steps:

[0080] (1) putting 40 g of sodium silicate, 20 g of calcium oxide and 15 g of potassium oxide into a container and stirring evenly to obtain a first mixture;

[0081] (2) 3 g of talc powder, 5 g of mica powder and 4 g of wollastonite were pretreated in a mortar, and ground and mixed to obtain a second mixture;

[0082] (3) mixing the second mixture with 20 g of epoxy resin and 4 g of epoxy crosslinking agent, heating at 70° C., and cooling to solidify to obtain an organosilicon-modified resin;

[0083] (4) 8 g of the organosilicon-modified resin prepared in step (3) is applied to the first mixture prepared in step (1) to ensure uniform mixing, and then the mixture is sent to a curing device for curing to obtain a solid mixture;

[0084] (5) grinding the solid mixture to obtain a high temperature resistant composite glaze;

[0085] (6) Spraying the high temperature resistant composite glaze described in step (5) onto the surface of the ceramic tile substrate, placing it in a kiln for high temperature firing, sintering at a high temperature of 1200° C., and cooling to obtain ceramic tiles, wherein the epoxy resin is E51 and the epoxy crosslinking agent is γ-mercaptopropyltrimethoxysilane.

[0086] Example 6

[0087] The present application provides a method for preparing a ceramic tile, comprising the following steps:

[0088] (1) putting 40 g of sodium silicate, 20 g of calcium oxide and 15 g of potassium oxide into a container and stirring evenly to obtain a first mixture;

[0089] (2) 8 g of talc powder, 5 g of mica powder and 2 g of wollastonite were pretreated in a mortar, and ground and mixed to obtain a second mixture;

[0090] (3) mixing the second mixture with 30 g of epoxy resin and 5 g of epoxy crosslinking agent, heating at 70° C., and cooling to solidify to obtain an organosilicon-modified resin;

[0091] (4) 8 g of the organosilicon-modified resin prepared in step (3) is applied to the first mixture prepared in step (1) to ensure uniform mixing, and then the mixture is sent to a curing device for curing to obtain a solid mixture;

[0092] (5) grinding the solid mixture to obtain a high temperature resistant composite glaze;

[0093] (6) Spraying the high temperature resistant composite glaze described in step (5) onto the surface of the ceramic tile substrate, placing it in a kiln for high temperature firing, sintering at a high temperature of 1200° C., and cooling to obtain ceramic tiles, wherein the epoxy resin is E51 and the epoxy crosslinking agent is γ-mercaptopropyltrimethoxysilane.

[0094] Example 7

[0095] The present application provides a method for preparing a ceramic tile, comprising the following steps:

[0096] (1) putting 40 g of sodium silicate, 20 g of calcium oxide and 15 g of potassium oxide into a container and stirring evenly to obtain a first mixture;

[0097] (2) 4 g of talc powder, 4 g of mica powder and 4 g of wollastonite were pretreated in a mortar, and ground and mixed to obtain a second mixture;

[0098] (3) mixing the second mixture with 20 g of epoxy resin and 4 g of epoxy crosslinking agent, heating at 70° C., and cooling to solidify, thereby obtaining an organosilicon-modified resin;

[0099] (4) 8 g of the organosilicon-modified resin prepared in step (3) is applied to the first mixture prepared in step (1) to ensure uniform mixing, and then the mixture is sent to a curing device for curing to obtain a solid mixture;

[0100] (5) grinding the solid mixture to obtain a high temperature resistant composite glaze;

[0101] (6) Spraying the high temperature resistant composite glaze described in step (5) onto the surface of the ceramic tile substrate, placing it in a kiln for high temperature firing, sintering at a high temperature of 1200° C., and cooling to obtain ceramic tiles, wherein the epoxy resin is E51 and the epoxy crosslinking agent is γ-mercaptopropyltrimethoxysilane.

[0102] Example 8

[0103] The present application provides a method for preparing a ceramic tile, comprising the following steps:

[0104] (1) putting 40 g of sodium silicate, 20 g of calcium oxide and 15 g of potassium oxide into a container and stirring evenly to obtain a first mixture;

[0105] (2) 2 g of talc powder, 7 g of mica powder and 5 g of wollastonite were pretreated in a mortar, and ground and mixed to obtain a second mixture;

[0106] (3) mixing the second mixture with 5 g of epoxy resin and epoxy crosslinking agent, heating at 70° C., and cooling to solidify to obtain an organosilicon-modified resin;

[0107] (4) 8 g of the organosilicon-modified resin prepared in step (3) is applied to the first mixture prepared in step (1) to ensure uniform mixing, and then the mixture is sent to a curing device for curing to obtain a solid mixture;

[0108] (5) grinding the solid mixture to obtain a high temperature resistant composite glaze;

[0109] (6) Spraying the high temperature resistant composite glaze described in step (5) onto the surface of the ceramic tile substrate, placing it in a kiln for high temperature firing, sintering at a high temperature of 1200° C., and cooling to obtain ceramic tiles, wherein the epoxy resin is E51 and the epoxy crosslinking agent is γ-mercaptopropyltrimethoxysilane.

[0110] Comparative Example 1

[0111] Remove the epoxy resin from the material of the organosilicon-modified resin, and the rest of the steps are the same as those in Example 5.

[0112] Comparative Example 2

[0113] Except for the organosilicon modified resin in step (1), the rest of the steps are the same as those in Example 5.

[0114] The thermal stability of the ceramic tiles prepared in Examples 5 to 8 and the ceramic tiles prepared in Comparative Examples 1 to 2 was tested as follows:

[0115] Test method: The high temperature resistant tiles prepared in Examples 5 to 8 were selected as tiles of the same shape 3CM thick, and each sample was tested at test temperatures of 1000°C, 1200°C and 1300°C, respectively, and maintained at high temperature for 1 hour. After the samples were cooled, the surface of the tiles was observed for obvious damage, such as structural deformation, discoloration, cracking, etc. The test results are shown in Table 1.

[0116] Table 1 High temperature resistance performance test of each embodiment

[0117]

[0118]

[0119] It can be seen from Table 1 that the tiles prepared in Examples 5 to 8 of the present invention can withstand high temperature tests, and the tiles prepared themselves meet the requirements of national standards. However, since no epoxy resin is added to Comparative Example 1, the first mixture of the present invention cannot be coated, so the heat resistance will be worse. Since no silicone modified resin is added to Comparative Example 2, a protective film cannot be formed, and the high temperature resistance of the tiles will be weakened.

[0120] 2. Water absorption test, according to ASTM C373 standard, is used to evaluate the change of water absorption of tiles under high temperature conditions, which can indirectly reflect the density of tiles and their stability at high temperatures.

[0121] The tiles of Examples 1-5 and Comparative Examples 1-2 were heated to 1300° C., cooled and immersed in water, and the water absorption was tested. The test results are shown in Table 2.

[0122] sample Water absorption Example 5 0.3％ Example 6 0.3％ Example 7 0.4％ Example 8 0.5％ Comparative Example 1 8％ Comparative Example 2 9％

[0123] It should be noted that the increase in water absorption may mean that the structure of the tile has changed, thereby affecting its heat resistance. Tiles with lower water absorption often exhibit better temperature resistance. This is because lower water absorption means that the tile structure is denser. Under high temperature conditions, the water in the pores will not evaporate and expand, causing cracking or breakage. It can be seen from Table 2 that the water absorption performance of the above embodiment is better than that of Comparative Examples 1 and 2, and meets the high temperature resistance conditions of the tile.

[0124] In summary, the technical solution provided by the present invention proposes a high-temperature resistant composite glaze, which is modified by selecting talcum powder, mica powder, wollastonite and epoxy resin to obtain an organosilicon modified resin, which can form a metal-silicon-oxygen network under high temperature conditions, and plays both a skeleton role and a high-temperature resistant role. When mixed with silicates, metal oxides and glass formers, the organosilicon resin can better cover its outer wall, and the formed outer wall can better block the doping of other impurities and the harmful effects on the high-temperature resistance. Therefore, the high-temperature resistance of the composite glaze can be further improved, and its application in ceramic tiles has a broader market application prospect.

[0125] The above are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. For those skilled in the art, the present invention may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the patent protection scope of the present invention.

Claims

1. A high temperature resistant composite glaze, applied to ceramic tiles, characterized in that: The high temperature resistant composite glaze comprises: organic silicon modified resin, silicate, metal oxide and glass former, wherein the raw materials of organic silicon modified resin comprise talcum powder, mica powder, wollastonite, epoxy resin and epoxy crosslinking agent; The high temperature resistant composite glaze comprises the following raw materials in parts by weight: 5-10 parts of organosilicon modified resin, 30-60 parts of silicate, 5-25 parts of metal oxide and 10-20 parts of glass former; in the organosilicon modified resin, the mass ratio of the talc powder, the mica powder, the wollastonite, the epoxy resin and the epoxy crosslinking agent is (3-8): (4-6): (2-4): (20-30): (4-5); Wherein, the organosilicon modified resin is prepared by the following method: S101, pre-treating talcum powder, mica powder and wollastonite, grinding and mixing to obtain a second mixture; S102, mixing the second mixture with an epoxy resin and an epoxy crosslinking agent, heating the mixture, and cooling the mixture for solidification to obtain an organosilicon-modified resin; In step S102, The temperature of the heating treatment is 60-80° C.; the time of the heating treatment is 1-2 hours.

2. The high temperature resistant composite glaze according to claim 1, characterized in that: The silicate comprises sodium silicate; and / or, The metal oxide comprises at least one of aluminum oxide, calcium oxide and magnesium oxide; and / or, The glass former comprises at least one of potassium oxide and sodium oxide; and / or, The epoxy crosslinking agent includes γ-mercaptopropyltrimethoxysilane; and / or, The epoxy resin includes at least one of E12, E20, E44, and E51.

3. A method for preparing a high temperature resistant composite glaze according to any one of claims 1 or 2, characterized in that: The following steps are involved: S10, mixing an organosilicon-modified resin, a silicate, a metal oxide and a glass former to obtain a solid mixture, wherein the raw materials of the organosilicon-modified resin include talc powder, mica powder, wollastonite, an epoxy resin and an epoxy crosslinking agent; S20, grinding the solid mixture to obtain a high temperature resistant composite glaze.

4. The method for preparing the high temperature resistant composite glaze according to claim 3, characterized in that: S10 includes the following steps: S1, mixing a silicate, a metal oxide and a glass former to obtain a first mixture; S2, coating the organosilicon-modified resin and the first mixture, and curing them to obtain a solid mixture.

5. A method for preparing a tile, characterized in that: The steps of preparing the ceramic tile include: S100, providing the high temperature resistant composite glaze and the tile substrate as described in any one of claims 1 or 2; S200, coating the high temperature resistant composite glaze on the tile substrate to obtain a green layer; S300, sintering the green layer at high temperature and applying pressure to obtain ceramic tiles.

6. The method for preparing a tile according to claim 5, characterized in that: In step S300, the sintering temperature is 1000-1200°C.

7. A ceramic tile, characterized in that: The ceramic tile comprises the high temperature resistant composite glaze as described in claim 1 or 2, or the high temperature resistant composite glaze prepared by the preparation method of the high temperature resistant composite glaze as described in claim 3 or 4, or the ceramic tile prepared by the preparation method of the ceramic tile as described in claim 5 or 6.

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