Support plate, flexible display module and electronic device

By controlling the distance between the carbon fiber filaments and the surface of the support layer and by depositing a conductive film layer, the conductivity of the carbon fiber support plate was optimized, which solved the display abnormality problem of the flexible display module under electric field reliability test and electrostatic effect, and achieved good conductivity and support strength.

CN118887874BActive Publication Date: 2026-05-08HEFEI VISIONOX TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HEFEI VISIONOX TECH CO LTD
Filing Date
2024-07-31
Publication Date
2026-05-08

AI Technical Summary

Technical Problem

The poor conductivity of the carbon fiber support plate caused display abnormalities in the flexible display module under electric field reliability testing or electrostatic effects.

Method used

By controlling the distance between the carbon fiber filaments and the surface of the support layer to be 0.5 micrometers to 2 micrometers, and depositing a conductive film layer on the cross-section of the support plate to achieve conduction and grounding with other layer materials, the conductivity of the carbon fiber support plate is optimized.

Benefits of technology

It effectively avoids display abnormalities in flexible display modules caused by electric fields or static electricity, such as brightening of the hole area or uneven display in the bending area, and improves conductivity and support strength.

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Abstract

The application provides a support plate, a flexible display module and an electronic device. The support plate comprises at least one support layer, the support layer has a first surface and a second surface opposite to each other along the thickness direction of the support layer; and each support layer is provided with a carbon fiber substance, and the distance between the carbon fiber substance and the first surface and the second surface of the support layer along the thickness direction of the support layer is 0.5-2 microns. The support plate is light in weight, the resistance of the support plate is reduced, the conductive requirement of the support plate is met, and the problem that the flexible display module displays abnormally due to the electric field or static electricity when the electric field reliability test is performed on the flexible display module or static electricity is generated in the flexible display module is effectively avoided when the support plate is applied to the flexible display module.
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Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a support plate, a flexible display module, and an electronic device. Background Technology

[0002] Flexible display modules consist of a flexible display screen and a support plate. Because steel sheets have excellent bending and electrical conductivity, flexible display modules typically use steel sheets to support and fix the flexible display screen, facilitating grounding. However, the high density of the steel sheets results in excessive weight and a disproportionately large weight distribution within the flexible display module.

[0003] In related technologies, carbon fiber support plates are used to replace traditional metal support sheets. However, carbon fiber support plates have poor electrical conductivity, which can lead to problems with the reliability of the electric field in flexible display modules or display abnormalities caused by electrostatic discharge. Summary of the Invention

[0004] The support plate, flexible display module, and electronic device provided in this application aim to solve the problem that the poor conductivity of the carbon fiber support plate leads to display abnormalities caused by unreliable electric field or electrostatic effects in the flexible display module.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a support plate, which is applied to a flexible display module, the support plate comprising: at least one support layer, the support layer having a first surface and a second surface opposite to each other along its thickness direction; each support layer is provided with carbon fiber material, and the distance between the carbon fiber material and the first surface and the second surface of the support layer along the thickness direction is 0.5 micrometers to 2 micrometers.

[0006] In one embodiment of this application, the carbon fiber material includes a plurality of carbon fiber filaments, the extension direction of each carbon fiber filament is perpendicular to the thickness direction of the support plate, and every two carbon fiber filaments are parallel to each other.

[0007] Preferably, the distance between any two adjacent carbon fiber filaments is 0.5 micrometers to 2 micrometers;

[0008] Preferably, the material of the support layer includes an adhesive material, which is used to bond and fix the plurality of carbon fiber filaments.

[0009] In one embodiment of this application, the support plate includes multiple layers of the support layer stacked sequentially, wherein the carbon fiber filaments in at least two of the multiple support layers have different extension directions;

[0010] Preferably, the carbon fiber filaments in at least two of the multiple support layers extend in directions perpendicular to each other;

[0011] Preferably, the carbon fiber filaments in each pair of adjacent support layers extend in perpendicular directions to each other;

[0012] Preferably, the support plate includes a first support layer, a second support layer, and a third support layer stacked sequentially; the extension direction of the carbon fiber filaments in the first support layer is the same as the extension direction of the carbon fiber filaments in the third support layer; the extension direction of the carbon fiber filaments in the first support layer is perpendicular to the extension direction of the carbon fiber filaments in the second support layer.

[0013] Preferably, the thickness of the first support layer and the third support layer is 25um-35um; the thickness of the second support layer is 80um-100um.

[0014] In one embodiment of this application, the cross-sectional area of ​​the carbon fiber filament is 28 μm. 2 -50um 2 ;

[0015] Preferably, the carbon fiber filament is cylindrical, and the diameter of the cylindrical carbon fiber filament is 6µm to 8µm.

[0016] In one embodiment of this application, the at least one support layer includes a first portion, a bent portion, and a second portion connected sequentially along a first direction; the first direction is perpendicular to the thickness direction of the support layer.

[0017] The support plate also includes:

[0018] A first conductive film layer is disposed on the first surface of the first portion and the second portion;

[0019] A second conductive film layer is disposed on the second surface of the first portion and the second portion;

[0020] The third conductive film layer includes a first conductive portion disposed on at least one side of the bent portion along the second direction, and extends from the first surface of the bent portion to the second surface along the thickness direction of the support layer; wherein the second direction is perpendicular to both the first direction and the thickness direction of the support layer.

[0021] Preferably, the thickness of the first conductive film layer, the second conductive film layer, and the third conductive film layer is 1 micrometer to 3 micrometers.

[0022] In one embodiment of this application, the first conductive portion is connected to the first conductive film layer and the second conductive film layer on the upper and lower surfaces of the first portion and the second portion, respectively; or,

[0023] The third conductive film layer further includes a second conductive portion disposed on at least one side of the first portion and the second portion along the second direction, and respectively connected to the first conductive film layer and the second conductive film layer on the upper and lower surfaces of the first portion and the second portion, so as to connect the first conductive film layer and the second conductive film layer on the upper and lower surfaces of the first portion and the second portion.

[0024] In one embodiment of this application, the tensile strength of the support plate is not less than 700 MPa; the elastic modulus of the support plate is not less than 70 GPa.

[0025] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a support plate, comprising:

[0026] The dielectric layer has a first portion, a bent portion, and a second portion connected sequentially along a first direction; the first direction is perpendicular to the thickness direction of the dielectric layer.

[0027] A first conductive film layer is disposed on the first surface of the first portion and the second portion;

[0028] A second conductive film layer is disposed on the second surface of the first portion and the second portion;

[0029] The third conductive film layer includes a first conductive portion disposed on at least one side of the bent portion along the second direction, and extends from the first surface of the bent portion to the second surface along the thickness direction of the support layer; the second direction is perpendicular to both the first direction and the thickness direction of the support layer.

[0030] Wherein, the first conductive portion is connected to the first conductive film layer and the second conductive film layer on the upper and lower surfaces of the first portion and the second portion, respectively, so as to connect the first conductive film layer and the second conductive film layer on the upper and lower surfaces of the first portion and the second portion; or,

[0031] The third conductive film layer further includes a second conductive portion disposed on at least one side of the first portion and the second portion along the second direction, and respectively connected to the first conductive film layer and the second conductive film layer on the upper and lower surfaces of the first portion and the second portion.

[0032] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a flexible display module, which includes: a flexible display screen having opposite display surfaces and non-display surfaces; and a support plate disposed on the side of the flexible display screen where the non-display surface is located, for supporting the flexible display screen; the support plate is the support plate mentioned above.

[0033] To solve the above-mentioned technical problems, another technical solution adopted in this application is to provide an electronic device that includes the flexible display module mentioned above.

[0034] The beneficial effects of this application embodiment, which differ from the prior art, are as follows: This application embodiment provides a support plate applied to a flexible display module. The support plate includes at least one support layer, with a first surface and a second surface facing away from each other along its thickness direction. Each support layer contains carbon fiber material, and the distance between the carbon fiber material and the first and second surfaces of the support layer is 0.5 micrometers to 2 micrometers along the thickness direction. Thus, compared to a metal support plate, using carbon fiber material reduces the weight of the support plate; and by maintaining the distance between the carbon fiber material and the first and second surfaces of the support layer at 0.5 micrometers to 2 micrometers, the resistance of the support plate is reduced, meeting the conductivity requirements. Therefore, when this support plate is applied to a flexible display module, it effectively avoids the problem of abnormal display caused by electric field or static electricity during electric field reliability testing or when the flexible display module generates static electricity. Attached Figure Description

[0035] Figure 1 This is a schematic diagram illustrating electron diffusion on a flexible display module during an electric field reliability test, provided as an embodiment of this application.

[0036] Figure 2 This is a simplified structural diagram of an electronic device provided in an embodiment of this application;

[0037] Figure 3 This is a schematic diagram of the stacked structure of a flexible display module provided in an embodiment of this application;

[0038] Figure 4a This is a cross-sectional view of a support plate along its thickness direction provided in an embodiment of this application;

[0039] Figure 4b A three-dimensional structural diagram of carbon fiber filaments distributed within a support layer according to an embodiment of this application;

[0040] Figure 5 This is a cross-sectional view of the support plate along its thickness direction provided in another embodiment of this application;

[0041] Figure 6 This is a cross-sectional view of the support plate along its thickness direction provided in another embodiment of this application;

[0042] Figure 7 This is a three-dimensional structural diagram of a support plate provided in another embodiment of this application;

[0043] Figures 8 to 9This is a three-dimensional structural diagram of the support plate provided in different embodiments of this application.

[0044] Explanation of the reference numerals in the attached figures.

[0045] 100 - Flexible display module; 10 - Flexible display screen; 20 - Support plate; 1 - Support layer; 1a - First support layer; 1b - Second support layer; 1c - Third support layer; 11 - First part; 12 - Bending part; - Through hole; 13 - Second part; 14 - Dielectric layer; 2 - Carbon fiber filament; 3a - First conductive film layer; 3b - Second conductive film layer; 3c - First conductive part; 3d - Second conductive part; 30 - Flexible cover plate; 40 - Polarizing film; 50 - Adhesive layer; 60 - Support film. Detailed Implementation

[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0047] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0048] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0049] The inventors of this application have discovered that while carbon fiber support plates and metal support plates offer similar support strength, the weight of a carbon fiber support plate is almost half that of a metal support plate of the same size. Therefore, applying carbon fiber support plates to flexible display modules can effectively reduce the weight of the flexible display module. However, carbon fiber support plates are typically composed of multiple layers of carbon fiber sheets, which are formed by encapsulating carbon fiber filaments with epoxy resin. While carbon fiber filaments themselves possess excellent electrical conductivity, epoxy resin acts as an adhesive and is not itself conductive. Therefore, after the carbon fiber filaments are encapsulated in epoxy resin, the electrical conductivity of the carbon fiber support plate is poor, with a resistance typically in the MΩ (megaohm) range.

[0050] Thus, when conducting electric field reliability tests on flexible display modules using this carbon fiber support plate, such as high-voltage electric field tests, electrons can be transferred downwards through the interfaces of the flexible display module's cover plate, adhesive layer (such as optically clear adhesive OCA), and flexible display screen. However, due to the poor conductivity of the carbon fiber support plate, the internal electron diffusion speed of the carbon fiber support plate is slow, thereby generating an internal electric field that acts on the TFT (Thin Film Transistor) device of the flexible display module, resulting in the problem of bright spots in the hole area.

[0051] See Figure 1 , Figure 1 This is a schematic diagram illustrating electron diffusion on a flexible display module during electric field reliability testing, provided as an embodiment of this application. In related technologies, a conductive liquid is typically coated on the side of the flexible display module to bring the potentials of each film layer to the same level. The following is combined with... Figure 1 The deterioration mechanism of the hole area is analyzed as follows: (1) With R1 fixed, the smaller R2 is, the less likely Vx is to be negative, and the slower the electron diffusion in the support film (BP). (2) The thickness direction of the carbon fiber support plate is not conductive, which increases the resistance of R2, and the potential of Vx is more negative, which is equivalent to the back grid effect causing the hole area to brighten and deteriorate. (3) Applying conductive liquid to the side of the flexible display module can provide other conductive paths and reduce the amount of charge entering the support film (BP).

[0052] However, due to the small thickness of the flexible display module and the thinness of each film layer, there is a problem of insufficient conductive liquid coating. During electric field reliability testing, such as high-voltage electric field testing or electrostatic testing, abnormalities in the flexible display still occur, such as brightening of the hole area and uneven display (mura) in the bending area.

[0053] Furthermore, when the flexible display module introduces static electricity during support due to film tearing or other reasons, the poor conductivity of the carbon fiber support plate prevents the static electricity from dissipating, generating an internal electric field. Simultaneously, the patterned through-holes in the bent sections of the carbon fiber support plate cause inconsistencies in electric field strength between these sections and other areas, resulting in uneven brightness (mura) in the bent areas of the display module compared to other regions. Therefore, optimizing the conductivity of the carbon fiber support plate is a key research topic in current materials science.

[0054] This application provides a support plate that reduces the resistance of the support plate by controlling the distance between the carbon fiber filaments and the outer surface of the epoxy resin, or by depositing a conductive film layer on the cross-section of the support plate to achieve conductivity and grounding with other layers of materials, thereby avoiding display problems caused by electric field and static electricity, such as avoiding the problem of bright hole areas or uneven brightness (mura) between the bending area and other areas.

[0055] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0056] Please see Figure 2 , Figure 2 This is a simplified structural diagram of an electronic device provided in one embodiment of this application. In this embodiment, an electronic device is provided, which can be any of various types of computer system devices that are mobile or portable and perform wireless communication. For example, the electronic device can be a mobile phone or smartphone (e.g., an iPhone™-based phone, an Android™-based phone), a portable gaming device (e.g., Nintendo DS™, PlayStation Portable™, Gameboy Advance™, iPhone™), a laptop computer, a PDA, a portable internet device, a music player, and a data storage device, other handheld devices, and devices such as headphones. The electronic device can also be other wearable devices that require charging (e.g., head-mounted devices such as electronic bracelets, electronic necklaces, electronic devices, or smartwatches).

[0057] The electronic device can also be any one of a plurality of electronic devices, including but not limited to vehicle transport instruments, cellular phones, video recorders, programmable remote controls, other wireless communication devices, personal digital assistants, audio players, other media players, smartphones, music recorders, other media recorders, radios, medical devices, calculators, pagers, laptop computers, desktop computers, and printers and combinations thereof.

[0058] In some cases, electronic devices can perform multiple functions (e.g., playing music, displaying video, storing pictures, and receiving and sending telephone calls). If desired, electronic devices can be such as cellular phones, media players, other handheld devices, wristwatches, pendant devices, handset devices, or other compact, portable devices.

[0059] The electronic device may include, but is not limited to, a flexible display module 100 and a housing assembly (not shown). The housing assembly is capable of unfolding or folding. The flexible display module 100 is connected to the housing assembly, and the flexible display module 100 can unfold as the housing assembly unfolds and fold as the housing assembly folds.

[0060] See Figure 3 , Figure 3 This is a schematic diagram of the stacked structure of a flexible display module provided in an embodiment of this application. The flexible display module 100 includes a flexible display screen 10 and a support plate 20. The structure and function of the support plate 20 are described below. The flexible display screen 10 has a display surface and a non-display surface facing away from each other. The display surface of the flexible display screen 10 is used to display images. The support plate 20 is attached to the side of the flexible display screen 10 where the non-display surface is located. The surface of the support plate 20 facing away from the flexible display screen 10 can be connected to the housing assembly through grounding foam. With this arrangement, on the one hand, the support plate 20 can support and fix the flexible display screen 10, so that the flexible display screen 10 can be unfolded or folded with the support plate 20; on the other hand, the static electricity generated by the flexible display screen 10 can be conducted into the housing assembly through the support plate 20 and the grounding foam, thereby grounding the flexible display screen 10.

[0061] Of course, in specific embodiments, the flexible display module 100 also includes functional layers such as a flexible cover plate 30, a polarizer 40, an adhesive layer 50, and a support film 60 (BP). The adhesive layer 50 can be OCA adhesive. The specific structure and function of these functional layers are similar to those of related functional layers in existing flexible display modules, and will not be described in detail here.

[0062] See Figure 4a , Figure 4aThis is a cross-sectional view of a support plate along its thickness direction according to an embodiment of this application. In this embodiment, a support plate 20 is provided, which includes at least one support layer 1. The support layer 1 has a first surface and a second surface facing away from each other along its thickness direction Y. The first surface of the support plate 20 is used to adhere to the side of the flexible display screen 10 where the non-display surface is located. The material of the support layer 1 includes an adhesive, such as epoxy resin, which may contain dicyandiamide as a curing agent. A carbon fiber material is disposed in each support layer 1, and the distance between the carbon fiber material and the first surface and the second surface of the support layer 1 along the thickness direction Y is 0.5 micrometers to 2 micrometers. For example, the distance M between the carbon fiber material and the first surface and the second surface of the support layer 1 can be 0.5 micrometers, 1.0 micrometers, 1.5 micrometers, or 2 micrometers. The distance between the carbon fiber material and the first surface (or second surface) of the support layer 1 refers to the minimum distance between the carbon fiber material and the first surface (or second surface) of the support layer 1 along the thickness direction Y.

[0063] Compared to a metal support plate 20, the above solution uses carbon fiber material, which can reduce the weight of the support plate 20. Furthermore, by making the distance M between the carbon fiber material and the first and second surfaces of the support layer 1 0.5 micrometers to 2 micrometers, the resistance of the support plate 20 is reduced, meeting the conductivity requirements of the support plate 20. Thus, when the support plate 20 is applied to the flexible display module 100, it effectively avoids the problem of abnormal display caused by electric field or static electricity when the flexible display module 100 is subjected to electric field reliability testing or when static electricity is generated in the flexible display module 100.

[0064] In some embodiments, the material of the support layer 1 includes an adhesive material used to bond and fix a plurality of carbon fiber filaments 2. During the preparation of the support plate 20, the carbon fiber sheet can be laminated, hot-pressed, and cut from prepreg to ultimately achieve the required product shape. The prepreg is a mixture of carbon fiber material and adhesive material, which bonds the individual carbon fiber materials together. Then, hot pressing and cutting are performed to form a support layer 1 or support plate 20. The distance M between the carbon fiber material and the first and second surfaces of the support layer 1 can be controlled by the coating rate and time.

[0065] In one embodiment, see Figure 4a and Figure 4b , Figure 4b This is a three-dimensional structural diagram of carbon fiber filaments distributed within a support layer according to an embodiment of this application; the carbon fiber material includes a plurality of carbon fiber filaments 2, each carbon fiber filament 2 extending in a direction perpendicular to the thickness direction Y of the support layer 1; and the extending directions of any two carbon fiber filaments 2 are parallel to each other. Specifically, the carbon fiber filaments 2 are elongated; for example, the carbon fiber filaments 2 can be cylindrical.

[0066] The distance between any two adjacent carbon fiber filaments 2 is 0.5 micrometers to 2 micrometers; for example, it can be 0.5 micrometers, 1.0 micrometers, 1.5 micrometers or 2 micrometers, etc.

[0067] In one specific embodiment, the cross section of the support plate 20 along its thickness direction Y is a vertical cross section, in which a number of carbon fiber filaments 2 can be distributed in multiple rows and columns within the support layer 1.

[0068] Of course, in other embodiments, the carbon fiber material may also include at least one layer of carbon fiber cloth, each layer of carbon fiber cloth being woven from the warp and weft threads of carbon fiber filaments 2. The distance between any two adjacent layers of carbon fiber cloth is 0.5 micrometers to 2 micrometers; for example, it can be 0.5 micrometers, 1.0 micrometers, 1.5 micrometers, or 2 micrometers, etc.

[0069] In this case, although the conductivity of the carbon fiber filament 2 is good due to its large cross-sectional area, its preparation is difficult; conversely, if the cross-sectional area of ​​the carbon fiber filament 2 is too small, it is prone to breakage. Therefore, in some embodiments, the cross-sectional area of ​​the carbon fiber filament 2 is 28 μm. 2 -50um 2 For example, the cross-sectional area of ​​carbon fiber filament 2 is 28 μm. 2 30um 2 35um 2 40um 2 45um 2 or 50um 2 .

[0070] It is understandable that when the carbon fiber filament 2 is cylindrical, the diameter of the cross-section of the carbon fiber filament 2 can be 6um to 8um, such as 6um, 7um or 8um, etc.

[0071] In some embodiments, see Figure 5 , Figure 5 This is a cross-sectional view of the support plate along its thickness direction provided in another embodiment of this application; the support plate 20 includes multiple layers of support layers 1 stacked sequentially, wherein the carbon fiber filaments 2 in at least two of the multiple support layers 1 have different extension directions. This enhances the overall support strength of the support plate 20. Furthermore, in the process of preparing support plates 20 of equal thickness, the method of stacking multiple support layers 1 to form the support plate 20, compared to a single-layer support layer 1 structure, allows the curing degree of the middle portion of the support plate 20 to be substantially consistent with the curing degree of the two side edge portions along the thickness direction Y of the support plate 20 after hot pressing, thereby improving the uniformity of the support strength of the support plate 20.

[0072] It can be understood that when preparing a support plate 20 with a preset thickness, the thickness of the support plate 20 including one support layer 1 is the same as the thickness of the support plate 20 including multiple support layers 1; that is, when the support plate 20 includes one support layer 1, the thickness of the support layer 1 is equal to the sum of the thicknesses of the multiple support layers 1 when the support plate 20 includes multiple support layers 1.

[0073] In this embodiment, during the preparation of the support plate 20, multiple support layers 1 can be pre-formed; then the multiple support plates are stacked together in a preset order, and then the whole is hot-pressed and cured to form the final support plate 20.

[0074] In some embodiments, combined with Figure 5 In the multi-layer support layer 1, the carbon fiber filaments 2 in at least two of the support layers 1 extend in directions perpendicular to each other.

[0075] In some embodiments, the carbon fiber filaments 2 in each pair of adjacent support layers 1 extend in perpendicular directions to each other. This further enhances the overall support strength of the support plate 20.

[0076] In some specific embodiments, such as Figure 5 As shown, the support plate 20 includes a first support layer 1a, a second support layer 1b, and a third support layer 1c stacked sequentially; the extension direction of the carbon fiber filaments 2 in the first support layer 1a is the same as the extension direction of the carbon fiber filaments 2 in the third support layer 1c; the extension direction of the carbon fiber filaments 2 in the first support layer 1a is perpendicular to the extension direction of the carbon fiber filaments 2 in the second support layer 1b.

[0077] Along the thickness direction Y of the support plate 20, the thickness of the first support layer 1a and the third support layer 1c can be 25um-35um; for example, 25um, 28um, 30um, 32um or 35 micrometers. The thickness of the second support layer 1b is 80um-100um; for example, 80um, 85um, 90um, 95um or 100 micrometers.

[0078] See Figure 6 , Figure 6 This is a three-dimensional structural diagram of a support plate provided in an embodiment of this application. The structure formed by stacking all support layers 1 includes a first part 11, a bent part 12, and a second part 13 connected in sequence. The flexible display screen 10 can display at positions corresponding to the first part 11, the bent part 12, and the second part 13. The flexible display module 100 can be unfolded or folded at positions corresponding to the bent part 12. The bent part 12 has several through holes to release bending stress.

[0079] In some embodiments, the support plate 20 further includes a first conductive film layer 3a, a second conductive film layer 3b, and a third conductive film layer. The first conductive film layer 3a is disposed on the first surfaces of the first portion 11 and the second portion 13; the second conductive film layer 3b is disposed on the second surfaces of the first portion 11 and the second portion 13; the third conductive film layer includes a first conductive portion 3c, which is disposed on at least one side of the bent portion 12 along the second direction Z and extends from the first surface of the bent portion 12 to the second surface along the thickness direction Y of the support layer 1. The second direction Z is perpendicular to both the first direction X and the thickness direction Y of the support layer 1.

[0080] The above solution forms conductive film layers only on the first and second surfaces of the first part 11 and the first and second surfaces of the second part 13, while not forming conductive film layers on the first and second surfaces of the bending part 12. This is because the bending part 12 will subsequently have through holes to release bending stress, and conductive film layers may affect the processing temperature of the through holes, and debris from the conductive film layer can easily fall into the through holes, affecting the bending. Furthermore, by providing a first conductive part 3c on at least one side of the bending part 12 along the second direction Z and extending from the first surface of the bending part 12 to the second surface along the thickness direction Y of the support layer 1, when a high-voltage electric field is applied or static electricity is generated, electrons in the bending part 12 of the support plate 20 can continue to be conducted downwards through the first conductive part 3c and to the surface of the support plate 20 for grounding, thereby dissipating external charges and avoiding display problems caused by electric fields and static electricity, such as brightening of the hole area and mura in the bending area, thus solving the problem at its root.

[0081] In some embodiments, the first conductive film layer 3a may cover all first surfaces of the first portion 11 and the second portion 13. The second conductive film layer 3b is disposed on all second surfaces of the first portion 11 and the second portion 13. The bent portion 12 is provided with a first conductive portion 3c on both sides along the second direction Z, and the first conductive portion 3c may cover the entire side of each side of the bent portion 12 along the second direction Z.

[0082] The conduction resistance of the first conductive film layer 3a, the second conductive film layer 3b, and the third conductive film layer is less than 0.5 ohms. Therefore, the first conductive film layer 3a, the second conductive film layer 3b, and the third conductive film layer can be made of metals with good conductivity. Specifically, the materials of the first conductive film layer 3a, the second conductive film layer 3b, and the third conductive film layer can be one or more of silver, copper, chromium, nickel, platinum, and gold, which will not be listed here.

[0083] The thicknesses of the first conductive film layer 3a, the second conductive film layer 3b, and the third conductive film layer can be between 1 micrometer and 3 micrometers, respectively; for example, 1 micrometer, 1.5 micrometers, 2 micrometers, 2.5 micrometers, or 3 micrometers. This ensures that the support plate 20 has good conductivity, guaranteeing the stability of the first conductive film layer 3a, the second conductive film layer 3b, and / or the third conductive film layer. Furthermore, the thicknesses of the first conductive film layer 3a, the second conductive film layer 3b, and the third conductive film layer can have a wide range of values, allowing for adjustment of the conductive film layer thickness as needed.

[0084] In some embodiments, the first conductive film layer 3a, the second conductive film layer 3b, and / or the third conductive film layer may be deposited onto the surface of the support layer 1 using one or more of the following processes: physical vapor deposition, aqueous plating, vacuum evaporation, screen printing, and electroplating. In other embodiments, the first conductive film layer 3a, the second conductive film layer 3b, and / or the third conductive film layer may also be a metal sheet or a metal plate.

[0085] In some embodiments, combined with Figure 6 The first conductive part 3c is connected to the first conductive film layer 3a and the second conductive film layer 3b on the upper and lower surfaces of the first part 11 and the second part 13, respectively. That is, the first conductive part 3c is connected to the first conductive film layer 3a and the second conductive film layer 3b on the upper and lower surfaces (i.e., the first surface and the second surface) of the first part 11 along the first direction X on the first side; the first conductive part 3c is connected to the first conductive film layer 3a and the second conductive film layer 3b on the upper and lower surfaces (i.e., the first surface and the second surface) of the second part 13 along the second side of the first direction X. The first conductive part 3c enables the first conductive film layer 3a and the second conductive film layer 3b to be connected, so that when a high voltage electric field is applied or static electricity is generated, electrons on the side where the first surface of the first part 11 and the second part 13 are located can be conducted downward and grounded in sequence through the first conductive film layer 3a, the first conductive part 3c, and the second conductive film layer 3b, so as to conduct away external charges and avoid display problems caused by electric field and static electricity.

[0086] In other embodiments, see Figure 7 , Figure 7 This is a three-dimensional structural schematic diagram of a support plate provided in another embodiment of this application. The third conductive film layer further includes a second conductive portion 3d, which is disposed on at least one side of the first part 11 and the second part 13 along the second direction Z, and is respectively connected to the first conductive film layer 3a and the second conductive film layer 3b on the upper and lower surfaces of the first part 11 and the second part 13, so as to connect the first conductive film layer 3a and the second conductive film layer 3b on the upper and lower surfaces of the first part 11 and the second part 13.

[0087] In one specific embodiment, each side of the first part 11 and the second part 13 along the second direction Z is provided with a second conductive part 3d, and the second conductive part 3d covers the entire surface of each side to maximize the conductive area.

[0088] It should be noted that the attached drawings are for illustrative purposes only. The second conductive part 3d and the first conductive part 3c can be integrally formed for ease of manufacturing and simple process.

[0089] Experiments have verified that the tensile strength of the support plate 20 provided in the above embodiment is not less than 700 MPa, and the elastic modulus of the support plate 20 is not less than 70 GPa.

[0090] The following comparative test is performed on the flexible display module 100 using the support plate 20 provided in the above embodiment and the comparative sample. The test results are shown in Table 1.

[0091] Table 1 shows the test results of the comparative sample and the flexible display module 100 of this application.

[0092]

[0093]

[0094] As can be seen from the above, the support plate 20 provided in this embodiment has low resistance and good conductivity; and the smaller the distance M between the carbon fiber material and the surface of the support layer 1, the lower the resistance of the support plate 20. Furthermore, in conjunction with... Figure 8 It can be seen that the clearer the texture of the carbon fiber filaments 2 on the surface of the support plate 20, the more obvious the effect on improving the reliability of the electric field or static electricity problems.

[0095] This embodiment provides a support plate 20, which is applied to a flexible display module 100. The support plate 20 includes at least one support layer 1, and the support layer 1 has a first surface and a second surface facing away from each other along its thickness direction Y. Each support layer 1 is provided with carbon fiber material. Along the thickness direction Y of the support layer 1, the distance M between the carbon fiber material and the first surface and the second surface of the support layer 1 is 0.5 micrometers to 2 micrometers. Thus, compared to a metal support plate 20, using carbon fiber material can reduce the weight of the support plate 20; and by making the distance M between the carbon fiber material and the first and second surfaces of the support layer 1 0.5 micrometers to 2 micrometers, the resistance of the support plate 20 is reduced, meeting the conductivity requirements of the support plate 20. Therefore, when the support plate 20 is applied to the flexible display module 100, when the flexible display module 100 is subjected to electric field reliability testing or when the flexible display module 100 generates static electricity, electrons can be transferred from the first surface of the support plate 20 to the carbon fiber material, and then transferred to the second surface of the support plate 20 via the carbon fiber material, achieving grounding and avoiding the problem of abnormal display of the flexible display module 100 caused by electric field or static electricity.

[0096] In some embodiments, see Figures 8 to 9 This is a three-dimensional structural diagram of a support plate provided in different embodiments of this application. In this embodiment, another support plate is provided, which includes a dielectric layer 14, a first conductive film layer 3a, a second conductive film layer 3b, and a third conductive film layer.

[0097] The dielectric layer 14 has a first portion 11, a bent portion 12, and a second portion 13 connected sequentially along a first direction X; the first direction X is perpendicular to the thickness direction Y of the dielectric layer 14. The dielectric layer 14 can be an insulating material with a certain supporting strength, such as resin. The thickness of the dielectric layer 14 can be set according to actual needs.

[0098] A first conductive film layer 3a is disposed on the first surfaces of the first portion 11 and the second portion 13; a second conductive film layer 3b is disposed on the second surfaces of the first portion 11 and the second portion 13; a third conductive film layer includes a first conductive portion 3c, which is disposed on at least one side of the bent portion 12 along the second direction Z and extends from the first surface of the bent portion 12 to the second surface along the thickness direction Y of the support layer 1. The second direction Z is perpendicular to both the first direction X and the thickness direction Y of the support layer 1.

[0099] In one embodiment, see Figure 8 The first conductive part 3c is connected to the first conductive film layer 3a and the second conductive film layer 3b on the upper and lower surfaces of the first part 11 and the second part 13, respectively, so as to connect the first conductive film layer 3a and the second conductive film layer 3b on the upper and lower surfaces of the first part 11 and the second part 13. The specific distribution of the first conductive film layer 3a, the second conductive film layer 3b, and the first conductive part 3c on the first part 11, the bent part 12, and the second part 13 is as described above. Figure 6 The relevant content in the corresponding embodiments is the same or similar.

[0100] In another embodiment, see Figure 9 The third conductive film layer further includes a second conductive portion 3d, which is disposed on at least one side of the first part 11 and the second part 13 along the second direction Z, and is respectively connected to the first conductive film layer 3a and the second conductive film layer 3b on the upper and lower surfaces of the first part 11 and the second part 13, so that the first conductive film layer 3a and the second conductive film layer 3b are connected through the second conductive portion 3d at corresponding positions. In this embodiment, the distribution of the first conductive film layer 3a, the second conductive film layer 3b and the second conductive portion 3d in the first part 11 and the second part 13 and the connection method between the first conductive portions 3c are similar to those in the previous embodiment. Figure 7 The relevant content in the corresponding embodiments is the same or similar.

[0101] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A support plate, used in a flexible display module, characterized in that, The support plate includes: at least one support layer, the support layer having a first surface and a second surface opposite to each other along its thickness direction; Each of the support layers contains carbon fiber material, and the distance between the carbon fiber material and the first and second surfaces of the support layer is 0.5 micrometers to 2 micrometers along the thickness direction of the support layer. The carbon fiber material includes a plurality of carbon fiber filaments, each of which extends in a direction perpendicular to the thickness direction of the support plate, and any two carbon fiber filaments are parallel to each other.

2. The support plate according to claim 1, characterized in that, The distance between any two adjacent carbon fiber filaments is 0.5 micrometers to 2 micrometers.

3. The support plate according to claim 2, characterized in that, The support layer is made of an adhesive material, which is used to bond and fix the plurality of carbon fiber filaments.

4. The support plate according to claim 2, characterized in that, The support plate comprises multiple layers of support layers stacked sequentially, wherein the carbon fiber filaments in at least two of the multiple support layers have different extension directions.

5. The support plate according to claim 4, characterized in that, In at least two of the multiple support layers, the carbon fiber filaments extend in directions perpendicular to each other.

6. The support plate according to claim 5, characterized in that, The carbon fiber filaments in each pair of adjacent support layers extend in a direction perpendicular to each other.

7. The support plate according to claim 4, characterized in that, The support plate includes a first support layer, a second support layer, and a third support layer stacked in sequence. The carbon fiber filaments in the first support layer extend in the same direction as the carbon fiber filaments in the third support layer. The extension direction of the carbon fiber filaments in the first support layer is perpendicular to the extension direction of the carbon fiber filaments in the second support layer.

8. The support plate according to claim 7, characterized in that, The thickness of the first support layer and the third support layer is 25um-35um; The thickness of the second support layer is 80um-100um.

9. The support plate according to claim 2, characterized in that, The cross-sectional area of ​​the carbon fiber filament is 28µm-50µm; The carbon fiber filaments are cylindrical, and the diameter of the cylindrical carbon fiber filaments is 6µm to 8µm.

10. The support plate according to any one of claims 1-9, characterized in that, The at least one support layer includes a first part, a bent part, and a second part connected sequentially along a first direction; The first direction is perpendicular to the thickness direction of the support layer; The support plate further includes: a first conductive film layer disposed on the first surface of the first portion and the second portion; A second conductive film layer is disposed on the second surface of the first portion and the second portion; The third conductive film layer includes a first conductive portion disposed on at least one side of the bent portion along the second direction, and extends from the first surface of the bent portion to the second surface along the thickness direction of the support layer. The second direction is perpendicular to both the first direction and the thickness direction of the support layer.

11. The support plate according to claim 10, characterized in that, The thickness of the first conductive film layer, the second conductive film layer, and the third conductive film layer is 1 micrometer to 3 micrometers.

12. The support plate according to claim 10, characterized in that, The first conductive part is connected to the first conductive film layer and the second conductive film layer on the upper and lower surfaces of the first part and the second part, respectively; Alternatively, the third conductive film layer may further include a second conductive portion disposed on at least one side of the first portion and the second portion along the second direction, and respectively connected to the first conductive film layer and the second conductive film layer on the upper and lower surfaces of the first portion and the second portion, so as to connect the first conductive film layer and the second conductive film layer on the upper and lower surfaces of the first portion and the second portion.

13. The support plate according to any one of claims 1-9, characterized in that, The tensile strength of the support plate is not less than 700 MPa; The elastic modulus of the support plate is not less than 70 GPa.

14. A flexible display module, characterized in that, include: Flexible display screens have opposing display and non-display surfaces; A support plate is disposed on the side of the flexible display screen where the non-display surface is located, and is used to support the flexible display screen; The support plate is the support plate as described in any one of claims 1-13.

15. An electronic device, characterized in that, Including the flexible display module as described in claim 14.

Citation Information

Patent Citations

  • Supporting plate, display screen assembly and flexible screen electronic equipment

    CN114822268A