Carrier plate assembly and wafer detection device

Abstract

The present application relates to a carrier plate assembly and a wafer detection device. The carrier plate assembly includes: a carrier and a chassis member, the carrier having a first surface and a second surface disposed opposite to each other along a preset direction, the carrier also having a plurality of holes arranged at intervals, each of the holes respectively passing through the first surface and the second surface, the first surface being used to carry a sample to be detected; the chassis member is disposed on the second surface of the carrier, the chassis member and the carrier enclose a chamber, the chamber is respectively connected to the plurality of holes, the chamber and the plurality of holes cooperate to form a negative pressure to adsorb the sample to be detected on the first surface side. The carrier plate assembly enables the sample to be detected to be arranged flatly on the first surface side of the carrier.

Description

Technical Field

[0001] The present application relates to the field of wafer detection technology, and in particular to a carrier plate assembly and a wafer detection device. Background Art

[0002] In the field of wafer inspection technology, large-sized wafers are prone to warping. If a probe is used to directly touch a warped wafer for inspection, the wafer is easily punctured and damaged. Therefore, after placing the wafer on the chuck, the warped wafer needs to be flattened to avoid damage to the wafer during the inspection process. Summary of the invention

[0003] In view of this, the present application provides a carrier plate assembly and a wafer inspection device, wherein the carrier plate assembly can enable a sample to be inspected to be evenly disposed on the first surface side of the carrier.

[0004] The present application provides a carrier plate assembly, which includes: a carrier and a chassis member, the carrier having a first surface and a second surface arranged opposite to each other along a preset direction, the carrier also having a plurality of holes arranged at intervals, each of the holes respectively penetrating the first surface and the second surface, the first surface being used to carry a sample to be detected; the chassis member is arranged on the second surface of the carrier, the chassis member and the carrier enclose a chamber, the chamber is respectively connected to the plurality of holes, the chamber and the plurality of holes cooperate to form a negative pressure to adsorb the sample to be detected on the first surface side.

[0005] Furthermore, the carrier also has a peripheral side wall and a vent hole, the peripheral side wall is respectively connected to the first surface and the second surface, the vent hole is connected to the chamber and passes through the peripheral side wall, and the vent hole is used to connect to the negative pressure device to form a negative pressure between the chamber and the multiple channels.

[0006] Furthermore, the carrier plate assembly further includes a first sealing member, which is disposed on the first surface and around the outer circumference of the plurality of holes.

[0007] Furthermore, the carrier plate assembly also includes a plurality of adsorption components, which are arranged on the first surface and partially penetrate the channel, one adsorption component corresponds to one channel setting, and different adsorption components correspond to different channel settings.

[0008] Further, the chamber includes a plurality of first sub-cavities, and the plurality of first sub-cavities are arranged at intervals; the plurality of channels include a plurality of first channel groups, each first channel group includes a plurality of the channels, each first channel group corresponds to a first sub-cavity setting, and different first channel groups correspond to different first sub-cavity settings.

[0009] Furthermore, the chamber also includes a plurality of second sub-cavities, wherein the second sub-cavities are arranged between two adjacent first sub-cavities, and the plurality of second sub-cavities are interconnected, and the plurality of channels also include a plurality of second channel groups, each second channel group includes a plurality of channels, and each second channel group corresponds to a second sub-cavity setting, and different second channel groups correspond to different second sub-cavity settings.

[0010] Furthermore, the carrier plate assembly also includes a second seal and a third seal, the second seal is arranged on the outer periphery of the plurality of first sub-cavities, and the third seal is arranged around the outer periphery of the plurality of second sub-cavities and is located between the first sub-cavity and the second sub-cavity.

[0011] Further, the supporting member has a plurality of first mounting holes, some of which are arranged at intervals on the outer periphery of the plurality of first sub-cavities, and some of which are arranged between two adjacent groups of the first channel groups, and the first mounting holes pass through the second surface; the chassis member has a plurality of second mounting holes, and along a preset direction, the second mounting holes pass through two opposite surfaces of the chassis member; the supporting plate assembly includes a plurality of first mounting members, and each of the first mounting members is respectively passed through the second mounting hole and the first mounting hole to connect the supporting member and the chassis member.

[0012] Further, the supporting member has a plurality of third mounting holes and a plurality of fourth mounting holes, the plurality of third mounting holes are arranged at intervals on the outer periphery of the plurality of first sub-cavities and the third mounting holes penetrate the second surface, the fourth mounting holes are located in the plurality of second sub-cavities and the fourth mounting holes penetrate the bottom wall of the second sub-cavities; the chassis member has a plurality of fifth mounting holes, and along a preset direction, the fifth mounting holes penetrate two opposite surfaces of the chassis member; the supporting plate assembly includes a plurality of second mounting members and a plurality of third mounting members, each of the second mounting members is respectively penetrated through the fifth mounting hole and the third mounting hole, and each of the third mounting members is respectively penetrated through the fifth mounting hole and the fourth mounting hole, so as to connect the supporting member and the chassis member.

[0013] The present application also provides a wafer detection device, which includes: a carrier plate assembly and a probe assembly provided in the present application, wherein the carrier plate assembly is used to carry a sample to be detected; the probe assembly is arranged on the first surface side of the carrier plate assembly, and the probe assembly is used to be electrically connected to the sample to be detected to achieve detection of the sample to be detected.

[0014] In the present application, when the carrier plate assembly is used to carry a sample to be tested, the sample to be tested is carried on the first surface, and the chamber cooperates with the multiple holes to form a negative pressure to exhaust the air in the space enclosed by the sample to be tested and the carrier, and to exhaust the air in the space enclosed by the carrier and the chassis, so that the side of the sample to be tested facing the first surface is arranged in contact with the first surface, so that the sample to be tested is arranged flatly on the carrier. In the present application, the multiple holes of the carrier are arranged at intervals, and when the chamber is evacuated, the air between the sample to be tested and the first surface is evenly discharged through the multiple holes, so that each part of the sample to be tested can be flatly attached to the first surface, avoiding local warping of the sample to be tested and being unable to fit the first surface. When the carrier plate assembly is applied to the wafer detection device, the chamber cooperates with the multiple channels to form a negative pressure, so that each part of the sample to be detected can fit the first surface evenly, so that the probe assembly can detect the sample to be detected, avoiding the tip of the probe assembly from piercing the sample to be detected, and can also effectively improve the accuracy of the wafer detection device for detecting the sample to be detected. The carrier plate assembly provided in the present application is suitable for large-sized samples to be detected, and can effectively solve the problem that large-sized samples to be detected cannot fit the carrier. Furthermore, when it is necessary to separate the sample to be detected from the carrier, the chamber cooperates with the multiple channels to form a positive pressure. In other words, by introducing air into the chamber, the air is allowed to evenly enter the space formed by the sample to be detected and the first surface through the multiple channels, so as to achieve rapid separation of the sample to be detected from the carrier, thereby improving the performance of the carrier plate assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the implementation will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 This is a structural schematic diagram of a carrier plate assembly according to a first embodiment of the present application;

[0017] Figure 2 Schematic diagram of the exploded structure of the carrier plate assembly of the first embodiment of the present application Figure 1 ;

[0018] Figure 3 It is a schematic diagram of the top view of the structure of the carrier plate assembly of the first embodiment of the present application;

[0019] Figure 4 for Figure 3 Schematic diagram of the cross-sectional structure in the AA direction;

[0020] Figure 5 This is a schematic diagram of the structure of a protective film according to an embodiment of the present application;

[0021] Figure 6 Schematic diagram of the exploded structure of the carrier plate assembly of the first embodiment of the present application Figure 2 ;

[0022] Figure 7 for Figure 3 Schematic diagram of the cross-sectional structure in the middle BB direction;

[0023] Figure 8 This is a structural schematic diagram of a carrier plate assembly according to a second embodiment of the present application;

[0024] Fig. 9 It is a schematic diagram of the exploded structure of the carrier plate assembly of the second embodiment of the present application;

[0025] Fig.10 This is a schematic diagram of the structure of an adsorption component according to an embodiment of the present application;

[0026] Fig.11 It is a schematic top view of the structure of the carrier plate assembly of the second embodiment of the present application;

[0027] Fig.12 for Fig.11 Schematic diagram of the cross-sectional structure in the CC direction;

[0028] Fig.13 Schematic diagram of the structure of a wafer inspection device according to an embodiment of the present application.

[0029] Description of reference numerals:

[0030] 100-carrying plate assembly, 110-carrying member, 111-first surface, 1111-groove, 112-second surface, 113-channel, 114-side wall, 115-vent, 1151-pipe hole, 1152-through hole, 116-first mounting hole, 117-third mounting hole, 118-fourth mounting hole, 120-chassis member, 121-second mounting hole, 122-fifth mounting hole Hole, 130-chamber, 131-first sub-chamber, 132-second sub-chamber, 140-first sealing member, 150-adsorption member, 151-nozzle portion, 152-installation portion, 160-second sealing member, 170-third sealing member, 180-protective film, 181-pore, 200-wafer detection device, 210-probe assembly, 220-moving mechanism, 230-transfer assembly, 240-manipulator. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0033] Reference to "embodiment" or "implementation" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment or implementation may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0034] In the field of wafer inspection technology, large-sized wafers are prone to warping. If a probe is used to directly touch a warped wafer for inspection, the wafer is easily punctured and damaged. Therefore, after placing the wafer on the chuck, the warped wafer needs to be flattened to avoid damage to the wafer during the inspection process.

[0035] In the related technology, the chuck of the wafer probe station is an important part of the wafer probe station. Its function is to fix the wafer and ensure the stability and accuracy of the wafer or chip during the test process. The diameter of the wafer has different standard sizes. The common diameters of wafers are 6 inches (150 mm), 8 inches (200 mm) and 12 inches (300 mm). When the diameter of the wafer is less than or equal to 12 inches, the wafer is generally flat and has no warping, and can be directly adsorbed using a vacuum tank. However, with the advancement and development of technology, wafer manufacturing is moving towards larger size, higher integration and higher performance. Unconventional wafers with double-sided circuits, non-silicon materials, square, large size, poor flatness, and excessive warping have appeared. Conventional chucks can no longer be used to adsorb and fix this new type of wafer. Therefore, a new type of chuck must be designed to adapt.

[0036] See also Figure 1 and Figure 2 The present application provides a carrier plate assembly 100, the carrier plate assembly 100 comprising: a carrier 110 and a chassis 120, the carrier 110 having a predetermined direction (such as Figure 1 The carrier 110 further comprises a first surface 111 and a second surface 112 which are arranged opposite to each other (as shown in the X direction), the carrier 110 further comprises a plurality of channels 113 which are arranged at intervals, each of the channels 113 respectively penetrates the first surface 111 and the second surface 112, and the first surface 111 is used to carry the sample to be detected; the chassis 120 is arranged on the second surface 112 of the carrier 110, the chassis 120 and the carrier 110 enclose a chamber 130, the chamber 130 is respectively connected to the plurality of channels 113, and the chamber 130 cooperates with the plurality of channels 113 to form a negative pressure so as to adsorb the sample to be detected on the side of the first surface 111.

[0037] It can be understood that along the preset direction, the support member 110 and the chassis member 120 are arranged in sequence.

[0038] It can be understood that the extension direction of each of the holes 113 is parallel to the preset direction.

[0039] Optionally, the chamber 130 and the plurality of holes 113 cooperate to form a negative pressure by evacuating the space formed by the chamber 130 and the plurality of holes 113 .

[0040] It can be understood that, in the terminology of the present application, "plurality" means greater than or equal to two, and can be but is not limited to two, five, ten, twenty, thirty, fifty, sixty, etc.

[0041] In this embodiment, when the carrier plate assembly 100 is used to carry the sample to be tested, the sample to be tested is carried on the first surface 111, and the chamber 130 and the plurality of holes 113 cooperate to form a negative pressure to exhaust the air in the space enclosed by the sample to be tested and the carrier 110, and exhaust the air in the space enclosed by the carrier 110 and the chassis 120, so that the side of the sample to be tested facing the first surface 111 is arranged in contact with the first surface 111, so that the sample to be tested is evenly arranged on the carrier 110. In this embodiment, the plurality of holes 113 of the carrier 110 are arranged at intervals, and when the chamber 130 is evacuated, the air between the sample to be tested and the first surface 111 is evenly exhausted through the plurality of holes 113, so that each part of the sample to be tested can evenly fit the first surface 111, and avoid the sample to be tested from being partially warped and unable to fit the first surface 111. When the carrier plate assembly 100 is applied to the wafer detection device 200, the chamber 130 cooperates with the multiple channels 113 to form a negative pressure, so that each part of the sample to be detected can fit smoothly on the first surface 111, so that the probe assembly 210 can detect the sample to be detected, avoiding the tip of the probe assembly 210 from piercing the sample to be detected, and can also effectively improve the accuracy of the wafer detection device 200 in detecting the sample to be detected. The carrier plate assembly 100 provided in the embodiment of the present application is suitable for large-sized samples to be detected, and can effectively solve the problem that large-sized samples to be detected cannot fit on the carrier 110. Furthermore, when it is necessary to separate the sample to be tested from the carrier 110, the chamber 130 cooperates with the multiple channels 113 to form a positive pressure. In other words, air is introduced into the chamber 130 so that the air evenly enters the space formed by the sample to be tested and the first surface 111 through the multiple channels 113, so as to achieve rapid separation of the sample to be tested and the carrier 110, thereby improving the performance of the carrier plate assembly 100.

[0042] Optionally, the supporting member 110 is in a square shape, and the chassis member 120 is in a square shape.

[0043] Optionally, the sample to be detected may be, but is not limited to, a wafer, a circuit board, etc.

[0044] Optionally, the size of the sample to be tested may be, but is not limited to, 400mm×400mm, 450mm×450mm, 500mm×500mm, 550mm×550mm, 600mm×600mm, etc. For example, when the size of the sample to be tested is 400mm×400mm, it means that the length and width of the sample to be tested are both 400mm.

[0045] Optionally, in some embodiments, the plurality of channels 113 are arranged in an array.

[0046] In this embodiment, when the chamber 130 cooperates with the multiple channels 113 to form a negative pressure, the multiple channels 113 are arranged in an array, which can, on the one hand, increase the rate of adsorbing the sample to be detected on the first surface 111, and on the other hand, can evenly adsorb the space formed by the sample to be detected and the first surface 111, so that each part of the sample to be detected can be set in contact with the first surface 111, which is beneficial to improving the flatness of the sample to be detected set on the carrier 110.

[0047] See also Figure 3 and Figure 4 In some embodiments, the carrier 110 further has a peripheral side wall 114 and a vent 115, wherein the peripheral side wall 114 is respectively connected to the first surface 111 and the second surface 112, and the vent 115 is connected to the chamber 130 and passes through the peripheral side wall 114, and the vent 115 is used to connect to a negative pressure device so that negative pressure is formed between the chamber 130 and the multiple channels 113.

[0048] It can be understood that the peripheral side wall 114 is disposed around the outer circumference of the plurality of holes 113 .

[0049] In this embodiment, the vent hole 115 passes through the peripheral side wall 114 and is connected to the chamber 130, so that when the vent hole 115 is connected to the negative pressure device, the negative pressure device vacuums the chamber 130, the multiple channels 113, and the space enclosed by the sample to be detected and the carrier 110 through the vent hole 115, so that the chamber 130 and the multiple channels 113 form a negative pressure, so that the sample to be detected is set in contact with the first surface 111, thereby improving the flatness of the sample to be detected set on the carrier 110.

[0050] Optionally, there is at least one vent hole 115 , and the larger the number and aperture of the vent holes 115 , the higher the efficiency of forming negative pressure on the chamber 130 and the plurality of channels 113 .

[0051] It can be understood that, in the terminology of the present application, "at least one" means greater than or equal to one, and can be one or more.

[0052] Optionally, the carrier 110 has a recessed groove, the recessed groove is located on the second surface 112 , and the recessed groove cooperates with the chassis 120 to form the chamber 130 .

[0053] It can be understood that the plurality of channels 113 penetrate the bottom wall of the sink, so that the plurality of channels 113 are in communication with the chamber 130 .

[0054] In this embodiment, the carrier 110 has a sink located on the second surface 112, so that when the chassis 120 is disposed on the second surface 112 side of the carrier 110, there is a space between the carrier 110 and the chassis 120 to form the chamber 130. When the warped sample to be tested is disposed on the carrier 110, the chamber 130 cooperates with the plurality of channels 113 to form a negative pressure to clear the air between the sample to be tested and the first surface 111, the air in the plurality of channels 113, and the air in the sink, so that the sample to be tested is disposed in contact with the first surface 111. When it is necessary to separate the sample to be tested and the carrier 110, the chamber 130 cooperates with the multiple channels 113 to form a positive pressure, and air is filled into the sink, the multiple channels 113, and the space enclosed by the sample to be tested and the first surface 111 to achieve rapid separation of the sample to be tested and the carrier 110, thereby improving the performance of the carrier plate assembly 100.

[0055] It can be understood that the peripheral side wall 114 is arranged around the outer circumference of the sink.

[0056] Optionally, the vent hole 115 includes a pipe hole portion 1151 and a through hole portion 1152 connected by bending, and the pipe hole portion 1151 is along a first direction (such as Figure 4 The through hole portion 1152 extends along the preset direction; the pipe hole portion 1151 passes through the peripheral side wall 114 and part of the bottom wall of the trough, and the end of the pipe hole portion 1151 away from the through hole portion 1152 is used to connect a negative pressure device, the through hole portion 1152 passes through the bottom wall of the trough, the pipe hole portion 1151 is staggered with the multiple channels 113, the through hole portion 1152 is staggered with the multiple channels 113, and the first direction intersects with the preset direction.

[0057] Optionally, in some embodiments, the first direction is perpendicular to the preset direction.

[0058] It can be understood that the pipe hole portion 1151 and the through hole portion 1152 are arranged in an "L" shape.

[0059] In this embodiment, when the end of the duct hole portion 1151 away from the through hole portion 1152 is connected to a negative pressure device, the duct hole portion 1151, the through hole portion 1152, the chamber 130, the multiple channels 113, and the space enclosed by the sample to be detected and the first surface 111 are sequentially connected, and the duct hole portion 1151 is evacuated by the negative pressure device to form a negative pressure between the chamber 130 and the multiple channels 113, so that the sample to be detected is arranged in contact with the first surface 111. By introducing air into the duct hole, air can enter the space enclosed by the duct hole portion 1151, the through hole portion 1152, the chamber 130, and the multiple channels 113 from the duct hole portion 1151, so that the first surface 111 stops adsorbing the sample to be detected, and the sample to be detected can be quickly separated from the carrier 110. Furthermore, compared with the solution in which the pipe hole portion 1151 or the through hole portion 1152 is directly connected to the multiple channels 113, the pipe hole portion 1151 in this embodiment is staggered with the multiple channels 113, and the through hole portion 1152 is staggered with the multiple channels 113, which is beneficial to improving the efficiency of the negative pressure device in vacuuming the pipe hole portion 1151 and the through hole portion 1152, thereby further improving the efficiency of vacuuming the chamber 130, the multiple channels 113, and the space enclosed by the sample to be tested and the carrier 110, which is beneficial to the efficiency of flatly adsorbing the warped sample to be tested on the first surface 111, thereby improving the performance of the carrier plate assembly 100.

[0060] See also Figure 5 Optionally, the carrier plate assembly 100 further includes a protective film 180 , wherein the protective film 180 has a plurality of fine holes 181 arranged in an array, and the protective film 180 is arranged in contact with the first surface 111 , and the plurality of fine holes 181 are arranged in one-to-one correspondence with the plurality of channels 113 .

[0061] It can be understood that the number of the pores 181 is equal to the number of the channels 113 , one pore 181 corresponds to one channel 113 , and different pores 181 correspond to different channels 113 .

[0062] In this embodiment, the carrier plate assembly 100 also includes a protective film 180, and along the preset direction, the protective film 180, the carrier member 110 and the chassis member 120 are arranged in sequence, and the multiple pores 181 of the protective film 180 are respectively arranged in one-to-one correspondence with the multiple channels 113 to ensure that when the chamber 130 and the multiple channels 113 cooperate to form a negative pressure, the air between the sample to be tested and the protective film 180 can be cleared through the pores 181, so that the sample to be tested is flatly arranged on the side of the first surface 111. Furthermore, the protective film 180 can protect the surface of the sample to be tested facing the first surface 111, so that in the process of the chamber 130 and the multiple channels 113 cooperating to form a negative pressure to adsorb the sample to be tested, the protective film 180 serves as a buffer layer, which can effectively prevent the surface of the sample to be tested facing the first surface 111 from being scratched against the carrier 110, thereby avoiding damage to the sample to be tested and improving the performance of the carrier plate assembly 100.

[0063] Optionally, in some embodiments, the sample to be detected has only one surface with multiple units to be detected. When the supporting plate assembly 100 is used to carry the sample to be detected and is applied to the wafer detection device 200, the surface of the sample to be detected with the units to be detected is set away from the first surface 111, so that the tip of the probe assembly 210 can contact the units to be detected and detect the units to be detected.

[0064] Optionally, in other embodiments, along a preset direction, two opposite surfaces of the sample to be detected are provided with multiple units to be detected. Then, when the supporting plate assembly 100 is used to carry the sample to be detected and is applied to the wafer detection device 200, one side of the sample to be detected is set away from the first surface 111, so that the tip of the probe assembly 210 can contact the unit to be detected and detect the unit to be detected, and the other side of the sample to be detected is set facing the first surface 111, and the protective film 180 is arranged between the sample to be detected and the first surface 111 to protect the surface of the sample to be detected facing the first surface 111, so as to prevent the units to be detected arranged on the surface of the sample to be detected facing the first surface 111 from being scratched and damaged.

[0065] See also Figure 6 In the first embodiment of the present application, the carrier plate assembly 100 further includes a first seal 140 , which is disposed on the first surface 111 and around the outer periphery of the plurality of holes 113 .

[0066] It can be understood that the carrier 110 has a groove 1111 , the groove 1111 is located on the first surface 111 , the groove 1111 is arranged around the outer circumference of the plurality of channels 113 , and the groove 1111 is used to set the first sealing member 140 .

[0067] In this embodiment, the first sealing member 140 is disposed on the first surface 111 and is disposed around the periphery of the plurality of holes 113. When the sample to be detected is disposed on the first surface 111, the first sealing member 140 faces the surface of the sample to be detected and presses against the sample to be detected, so as to seal the space formed by the sample to be detected and the first surface 111. When the vent 115 is connected to the negative pressure device, the space formed by the sample to be detected, the first surface 111, the plurality of holes 113 and the chamber 130 is a closed space, which is beneficial to improving the efficiency of forming negative pressure between the chamber 130 and the plurality of holes 113, and improving the efficiency of flatly arranging the sample to be detected on the carrier 110.

[0068] Optionally, in some embodiments, the first sealing member 140 is a rubber member.

[0069] See also Figure 4 , optionally, the height h of the first seal 140 protruding from the first surface 111 is in the range of 0<h≤1mm. Specifically, the value of the height h of the first seal 140 protruding from the first surface 111 can be, but not limited to, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm and 1mm, etc. When the height h of the first seal 140 protruding from the first surface 111 satisfies the range of 0<h≤1mm, the sealing performance of the first seal 140 on the space formed by the sample to be detected and the first surface 111 can be guaranteed, and when the chamber 130 and the plurality of channels 113 form a negative pressure, the first seal 140 is compressed and flush with the first surface 111.

[0070] See also Figure 7 Optionally, the radial dimension d of the hole 113 satisfies the range of 0.3 mm ≤ d ≤ 1 mm. Specifically, the radial dimension of the hole 113 may be, but is not limited to, 0.3 mm, 0.35 mm, 0.38 mm, 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm, 0.65 mm, 0.7 mm, 0.75 mm, 0.8 mm, 0.85 mm, 0.9 mm, 0.95 mm, 1 mm, etc.

[0071] In this embodiment, when the radial dimension d of the channel 113 satisfies the range of 0.3mm≤d≤1mm, the radial dimension of the channel 113 is within a reasonable range, so that it can not only improve the efficiency of forming negative pressure between the chamber 130 and the multiple channels 113, but also ensure that the sample to be tested is flatly adsorbed on the side of the first surface 111.

[0072] In some embodiments, the chamber 130 includes a plurality of first sub-cavities 131, and the plurality of first sub-cavities 131 are arranged at intervals; the plurality of channels 113 include a plurality of first channel groups, each first channel group includes a plurality of channels 113, each first channel group corresponds to a first sub-cavity 131 setting, and different first channel groups correspond to different first sub-cavity 131 settings.

[0073] It can be understood that in this embodiment, the number of the first channel groups is equal to the number of the first sub-cavities 131 , and one group of the first channel groups corresponds to one first sub-cavity 131 .

[0074] In this embodiment, the plurality of first sub-cavities 131 are arranged at intervals and are independent of each other, and each of the first sub-cavities 131 is provided with at least one vent hole 115 to connect the negative pressure device and a group of first channels in each of the first sub-cavities 131. In this embodiment, when the sample to be detected is set on the first surface 111, each of the first sub-cavities 131 cooperates with the plurality of channels 113 to form a negative pressure to adsorb each part of the sample to be detected on the side of the first surface 111. On the one hand, the plurality of first sub-cavities 131 are arranged at intervals and are independent of each other, which is conducive to improving the efficiency of flatly setting the sample to be detected on the carrier 110. On the other hand, multiple first sub-cavities 131 are arranged at intervals, and each first sub-cavity 131 is provided with a group of first channel groups, so that when the sample to be detected is carried on the supporting member 110, the multiple first sub-cavities 131 and the multiple groups of first channel groups cooperate to evenly flatten the various parts of the sample to be detected, so that the sample to be detected is flatly adsorbed on the side of the first surface 111, thereby improving the flatness of the sample to be detected set on the supporting member 110, and facilitating further testing of the sample to be detected.

[0075] Optionally, the number of the first sub-cavities 131 may be, but is not limited to, two, three, four, six, eight or nine, etc.

[0076] In some embodiments, the supporting member 110 has a plurality of first mounting holes 116, some of the first mounting holes 116 are spaced apart at the outer periphery of the plurality of first sub-cavities 131, and some of the first mounting holes 116 are disposed between the two adjacent groups of the first channel groups, and the first mounting holes 116 pass through the second surface 112; the chassis member 120 has a plurality of second mounting holes 121, and along a preset direction, the second mounting holes 121 pass through two opposite surfaces of the chassis member 120; the supporting plate assembly 100 includes a plurality of first mounting members (not shown in the figure), and each of the first mounting members is respectively passed through the second mounting hole 121 and the first mounting hole 116 to connect the supporting member 110 and the chassis member 120.

[0077] In this embodiment, each of the second mounting members is respectively inserted into the second mounting hole 121 and the first mounting hole 116 to assemble the chassis member 120 and the supporting member 110 into an integral structure and enclose the chamber 130, so that the chamber 130 cooperates with the multiple channels 113 to form a negative pressure, thereby achieving the adsorption of the sample to be detected on the side of the first surface 111.

[0078] See also Figures 8 to 10 In some embodiments, the carrier plate assembly 100 further includes a plurality of adsorption members 150 , which are disposed on the first surface 111 and partially penetrate the channel 113 , one adsorption member 150 is disposed corresponding to one channel 113 , and different adsorption members 150 correspond to different channel 113 settings.

[0079] It can be understood that the number of the adsorption members 150 is equal to the number of the channels 113 , and the plurality of adsorption members 150 are arranged in a one-to-one correspondence with the plurality of channels 113 .

[0080] In the present embodiment, the carrier plate assembly 100 further includes a plurality of adsorbents 150, and each of the holes 113 is provided with one adsorbent 150. Compared with the solution of directly forming negative pressure by cooperating with the chamber 130 and the plurality of holes 113, the adsorbent 150 provided in the present application can enhance the adsorption force on the sample to be detected. In other words, in the process of cooperating with the chamber 130 and the plurality of holes 113 to form negative pressure, the adsorbent 150 is passed through the hole 113 and removes the air formed by the sample to be detected and the first surface 111. The adsorbent 150 is evenly distributed on the carrier 110, so that the plurality of adsorbents 150 cooperate to suck and flatten each part of the sample to be detected and tightly adsorb the sample to be detected, which is conducive to further flattening the warped sample to be detected and further improving the flatness of the sample to be detected set on the carrier 110.

[0081] Optionally, the adsorbent 150 is an accordion suction cup.

[0082] Optionally, the adsorbent 150 includes a connected suction nozzle portion 151 and a mounting portion 152, the mounting portion 152 is installed in the channel 113, the suction nozzle portion 151 is arranged on the side of the mounting portion 152 away from the second surface 112 and partially protrudes from the first surface 111, and the mounting portion 152 has an airway hole, which is connected to the chamber 130.

[0083] In this embodiment, when the sample to be detected is carried on the first surface 111, the suction nozzle 151, the airway hole and the chamber 130 are evacuated through the vent hole 115, so that the suction nozzle 151 sucks the side of the sample to be detected facing the first surface 111 and makes the sample to be detected adhere to the first surface 111. The suction nozzle 151 is relatively soft and has a certain elasticity, and can adapt to the micro-warping of the sample to be detected and absorb it flat, so as to improve the adsorption effect of the sample to be detected.

[0084] See also Fig.11 and Fig.12 Optionally, when the adsorbent 150 is disposed in the hole 113, the radial dimension d of the hole 113 satisfies the range of 3.5 mm ≤ d ≤ 4.5 mm. Specifically, the radial dimension of the hole 113 may be, but is not limited to, 3.5 mm, 3.55 mm, 3.6 mm, 3.65 mm, 3.7 mm, 3.75 mm, 3.8 mm, 3.85 mm, 3.9 mm, 4 mm, 4.1 mm, 4.2 mm, 4.3 mm, 4.4 mm, 4.5 mm, etc.

[0085] In this embodiment, when the radial dimension d of the channel 113 satisfies the range of 3.5mm≤d≤4.5mm, the radial dimension of the channel 113 is within a reasonable range, so that the adsorption member 150 can be passed through, so that when the chamber 130 and the multiple channels 113 form a negative pressure, the multiple adsorption members 150 cooperate and flatten the sample to be tested, so as to set the warped sample to be tested flatly on the side of the first surface 111.

[0086] In some embodiments, the chamber 130 includes a plurality of first sub-cavities 131 and a plurality of second sub-cavities 132, the plurality of first sub-cavities 131 are arranged at intervals, a second sub-cavity 132 is provided between two adjacent first sub-cavities 131, and the plurality of second sub-cavities 132 are interconnected; the plurality of channels 113 include a plurality of first channel groups and a plurality of second channel groups, each first channel group includes a plurality of channels 113, each first channel group corresponds to a first sub-cavity 131 setting, and different first channel groups correspond to different first sub-cavity 131 settings; each second channel group includes a plurality of channels 113, each second channel group corresponds to a second sub-cavity 132 setting, and different second channel groups correspond to different second sub-cavity 132 settings.

[0087] It can be understood that the multiple first sub-cavities 131 are arranged at intervals, and the second sub-cavity 132 is provided between two adjacent first sub-cavities 131. The multiple second sub-cavities 132 are interconnected, and each second sub-cavity 132 can be sandwiched between two first sub-cavities 131. When the multiple first sub-cavities 131 are arranged at intervals, the multiple second sub-cavities 132 are located between the multiple first sub-cavities 131, that is, the multiple second sub-cavities 132 are interconnected and present a "cross" structure or a "well" structure.

[0088] It can be understood that the number of the first channel groups is equal to the number of the first sub-cavities 131, and multiple groups of the first channel groups are arranged in a one-to-one correspondence with multiple first sub-cavities 131; the number of the second channel groups is equal to the number of the second sub-cavities 132, and multiple groups of the second channel groups are arranged in a one-to-one correspondence with multiple second sub-cavities 132.

[0089] It can be understood that each of the first sub-cavities 131 is provided with at least one of the vent holes 115 to connect the negative pressure device and form negative pressure on the first sub-cavity 131 and the multiple channels 113; each of the second sub-cavities 132 is provided with one of the vent holes 115 to connect the negative pressure device and form negative pressure on the second sub-cavity 132 and the multiple channels 113.

[0090] In this embodiment, the chamber 130 includes a plurality of first sub-cavities 131 and a second sub-cavity 132, wherein the plurality of first sub-cavities 131 are arranged at intervals and a second sub-cavity 132 is arranged between two adjacent first sub-cavities 131. When the sample to be detected is arranged on the carrier 110, a negative pressure is first formed by cooperating with the second sub-cavity 132 and the plurality of channels 113, so as to adsorb a partial area of ​​the sample to be detected through the plurality of adsorbents 150 arranged in the second channel group, and the area of ​​the sample to be detected corresponding to the plurality of adsorbents 150 of the second channel group forms a stable "anchor point", which is beneficial to pre-adsorb the sample to be detected and reduce the distance between the sample to be detected and the first surface 111, increase the contact area between the sample to be detected and the adsorbent 150, and facilitate the subsequent adsorption of the sample to be detected by the plurality of adsorbents 150 arranged in the first channel group, which is beneficial to improve the adsorption efficiency of the sample to be detected. Furthermore, by forming a negative pressure by cooperating the first sub-cavity 131 with the plurality of channels 113, the remaining area of ​​the sample to be detected is adsorbed by the plurality of adsorbents 150 arranged in the first channel group, so as to further flatten the sample to be detected and make the sample to be detected fit the first surface 111 side, thereby improving the flatness of the sample to be detected arranged on the carrier 110. The carrier plate assembly 100 provided in the embodiment of the present application is suitable for wafers with a large degree of warping. By dividing the carrier 110 into different areas and forming a negative pressure in the second sub-cavity 132 and the first sub-cavity 131 in sequence, the sample to be detected is gradually adsorbed. When the carrier plate assembly 100 is applied to the wafer detection device 200, it is convenient to further detect the sample to be detected.

[0091] Optionally, in some embodiments, the number of the second sub-cavities 132 and the first sub-cavities 131 are both four, and along the first direction, two of the second sub-cavities 132 are connected and arranged in sequence, and the overlapping part of the two second sub-cavities 132 is located at the center of the second surface 112; along the second direction, another two of the second sub-cavities 132 are connected and arranged in sequence, and the overlapping part of the two second sub-cavities 132 is located at the center of the second surface 112, wherein the first direction intersects with the second direction.

[0092] It can be understood that the four second sub-cavities 132 are interconnected and form a "cross" structure.

[0093] It can be understood that the four second sub-cavities 132 are closer to the center of the second surface 112 than the four first sub-cavities 131, the four second sub-cavities 132 form a central cavity, and the four first sub-cavities 131 are sequentially arranged on the four quadrants of the central cavity. In other words, one first sub-cavity 131 is arranged between two second sub-cavities 132, and one second sub-cavity 132 is arranged between two first sub-cavities 131.

[0094] In this embodiment, the four second sub-cavities 132 are interconnected and each of the second sub-cavities 132 is located between two of the first sub-cavities 131, and the four second sub-cavities 132 form a central cavity, and the four second sub-cavities 132 are arranged around the periphery of the central cavity. When the sample to be detected is set on the carrier 110, the second sub-cavity 132 and the plurality of channels 113 are firstly used to form a negative pressure, so that the central area of ​​the sample to be detected is adsorbed by the plurality of adsorbents 150 arranged in the second channel group, so that the sample to be detected is initially adsorbed on the side of the first surface 111, and it is helpful to reduce the distance between other areas of the sample to be detected and the plurality of adsorbents 150 arranged in the first channel group, and it is helpful to guide the plurality of adsorbents 150 arranged in the first channel group to further adsorb the sample to be detected. Furthermore, by forming a negative pressure by cooperating the first sub-cavity 131 with the plurality of channels 113, the remaining area of ​​the sample to be detected is adsorbed by the plurality of adsorbents 150 arranged in the first channel group, so as to further flatten the non-central area of ​​the sample to be detected and make the entire area of ​​the sample to be detected fit the first surface 111 side, thereby improving the flatness of the sample to be detected arranged on the carrier 110. The carrier plate assembly 100 provided in the embodiment of the present application is suitable for wafers with a large degree of warping. By dividing the carrier 110 into different areas and sequentially forming a negative pressure on the second sub-cavity 132 and the first sub-cavity 131, the sample to be detected is gradually adsorbed, which is beneficial to improving the flatness of the sample to be detected arranged on the first surface 111 side, and is beneficial to improving the efficiency of flattening the warped sample to be detected and making the sample to be detected evenly arranged on the carrier 110. When the carrier plate assembly 100 is applied to the wafer detection device 200, it is convenient to further detect the sample to be detected.

[0095] In some embodiments, the carrier plate assembly 100 also includes a second seal 160 and a third seal 170, wherein the second seal 160 is disposed on the periphery of the plurality of first sub-cavities 131, and the third seal 170 is disposed around the periphery of the plurality of second sub-cavities 132 and is located between the first sub-cavity 131 and the second sub-cavity 132.

[0096] In this embodiment, the second seal 160 is arranged on the periphery of the multiple first sub-cavities 131. In other words, the second seal 160 is arranged on the periphery of the multiple first sub-cavities 131 and the multiple second sub-cavities 132, that is, the second seal 160 is arranged on the periphery of the chamber 130, which is beneficial to improve the sealing performance of the chamber 130, and then improve the efficiency of forming negative pressure between the chamber 130 and the multiple channels 113. Furthermore, the second sealing member 160 is arranged around the outer circumference of the plurality of second sub-cavities 132 and is located between the first sub-cavity 131 and the second sub-cavity 132. The second sealing member 160 is used to separate the first sub-cavity 131 and the second sub-cavity 132, so as to separate the plurality of first sub-cavities 131 and the plurality of second sub-cavities 132 into a plurality of independent chambers 130. On the one hand, it is beneficial to evacuate the second sub-cavity 132 and the first sub-cavity 131 in turn, and make the second sub-cavity 132 and the first sub-cavity 131 in a negative pressure state in turn, so as to realize the partitioned adsorption of the sample to be detected, and finally improve the flatness of the sample to be detected arranged on the side of the first surface 111. On the other hand, by evacuating each of the first sub-cavity 131 and each of the second sub-cavity 132 in turn, it is helpful to quickly change the first sub-cavity 131 and the second sub-cavity 132 into a negative pressure state, so that the adsorption component 150 arranged in each of the first sub-cavity 131 and the adsorption component 150 of each of the second sub-cavity 132 can quickly adsorb the sample to be detected, thereby improving the efficiency of flatly setting the sample to be detected on the carrier 110, so that the carrier plate assembly 100 has better applicability.

[0097] Optionally, in some embodiments, the second sealing member 160 is a rubber member, and the third sealing member 170 is a rubber member.

[0098] In some embodiments, the supporting member 110 has a plurality of third mounting holes 117 and a plurality of fourth mounting holes 118, wherein the plurality of third mounting holes 117 are spaced apart at the periphery of the plurality of first sub-cavities 131 and the third mounting holes 117 penetrate the second surface 112, and the fourth mounting holes 118 are located in the plurality of second sub-cavities 132 and the fourth mounting holes 118 penetrate the bottom wall of the second sub-cavity 132; the chassis member 120 has a plurality of fifth mounting holes 122, wherein the fifth mounting holes 122 penetrate two opposite surfaces of the chassis member 120 along a preset direction; the supporting plate assembly 100 includes a plurality of second mounting members and a plurality of third mounting members, each of the second mounting members is respectively penetrated through the fifth mounting hole 122 and the third mounting hole 117, and each of the third mounting members is respectively penetrated through the fifth mounting hole 122 and the fourth mounting hole 118, so as to connect the supporting member 110 and the chassis member 120.

[0099] In this embodiment, each of the second mounting members is respectively penetrated in the fifth mounting hole 122 and the third mounting hole 117, and each of the third mounting members is respectively penetrated in the fifth mounting hole 122 and the fourth mounting hole 118, so as to assemble the chassis member 120 and the carrier member 110 into an integral structure and enclose the chamber 130, so as to facilitate the chamber 130 to cooperate with the plurality of channels 113 to form a negative pressure, thereby achieving the adsorption of the sample to be detected on the side of the first surface 111. In this embodiment, the plurality of third mounting holes 117 are arranged at intervals on the periphery of the plurality of first sub-cavities 131, and the fourth mounting hole 118 is located in the plurality of second sub-cavities 132. The second mounting member and the third mounting member cooperate to respectively connect the peripheral area and the middle area of ​​the carrier member 110 and the chassis member 120, so as to improve the structural stability of the carrier member 110 and the chassis member 120 as a whole.

[0100] It can be understood that, in the second sub-cavity 132 , the fourth mounting hole 118 and the channel 113 are arranged at intervals.

[0101] Optionally, when the sample to be detected is arranged on the carrier 110, the flatness of the sample to be detected is less than or equal to 200 μm. More preferably, the flatness of the sample to be detected is less than or equal to 200 μm. The first surface 111 of the sample to be detected provided with the carrier 110 has a high flatness. Specifically, the value of the flatness of the sample to be detected can be, but is not limited to, 200 μm, 180 μm, 160 μm, 150 μm, 120 μm, 100 μm, 80 μm, 60 μm, 50 μm, 30 μm, 15 μm, 10 μm, 8 μm and 0 μm, etc.

[0102] Preferably, when the sample to be detected is disposed on the carrier 110 , the flatness of the sample to be detected is less than or equal to 50 μm.

[0103] See also Fig.13 The present application also provides a wafer detection device 200, which includes: a carrier plate assembly 100 and a probe assembly 210 provided in the present application, wherein the carrier plate assembly 100 is used to carry a sample to be detected; the probe assembly 210 is arranged on the first surface 111 side of the carrier plate assembly 100, and the probe assembly 210 is used to be electrically connected to the sample to be detected to realize the detection of the sample to be detected.

[0104] In the present embodiment, the carrier plate assembly 100 is used to carry the sample to be detected. When the sample to be detected is set on the carrier 110, the chamber 130 cooperates with the multiple channels 113 to form a negative pressure to adsorb the sample to be detected on the side of the first surface 111, so that the warped sample to be detected is flatly set on the carrier 110, which is convenient for the tip of the probe assembly 210 to contact the sample to be detected and electrically connect with the sample to be detected to realize the detection of the sample to be detected, which can avoid the tip of the probe assembly 210 piercing the sample to be detected, and can also effectively improve the accuracy of the wafer detection device 200 for detecting the sample to be detected. The carrier plate assembly 100 provided in the embodiment of the present application is suitable for large-sized samples to be detected, and can effectively solve the problem that large-sized samples to be detected cannot fit the carrier 110. Furthermore, when it is necessary to separate the sample to be detected from the carrier 110, the chamber 130 cooperates with the multiple channels 113 to form a positive pressure. In other words, by introducing air into the chamber 130, the air is allowed to evenly enter the space formed by the sample to be detected and the first surface 111 through the multiple channels 113, so as to achieve rapid separation of the sample to be detected and the carrier 110, thereby improving the use performance and detection performance of the wafer detection device 200.

[0105] Understandably, in Fig.13 In the embodiment, only the positions of the probe assembly 210, the moving mechanism 220, the transfer assembly 230 and the manipulator 240 are simply illustrated, and it should not be understood that the probe assembly 210, the moving mechanism 220, the transfer assembly 230 and the manipulator 240 are suspended.

[0106] Optionally, the wafer inspection device 200 further includes a moving mechanism 220 , which is disposed on a side of the carrier plate assembly 100 away from the probe assembly 210 and connected to the carrier plate assembly 100 , and is used to drive the carrier plate assembly 100 to move.

[0107] It can be understood that the moving mechanism 220 drives the carrier plate assembly 100 to move, including the moving mechanism 220 driving the carrier plate assembly 100 to move in a first direction, or in a second direction, or in a preset direction, so as to achieve movement of the sample to be tested carried on the carrier 110.

[0108] Optionally, the wafer inspection device 200 also includes a transfer component 230 and a manipulator 240, the transfer component 230 and the probe component 210 are arranged at the same side of the carrier plate assembly 100, the manipulator 240 is used to transport samples to be inspected, and the transfer component 230 is used to transfer and transport samples to be inspected between the manipulator 240 and the carrier plate assembly 100, the transfer component 230 includes an adsorption panel, and the adsorption panel has an adsorption surface on the side facing the carrier plate assembly 100, and the adsorption surface can adsorb the samples to be inspected transported by the manipulator 240, and the carrier plate assembly 100 moves to one side of the adsorption panel and receives the samples to be inspected adsorbed by the transfer component 230.

[0109] In this embodiment, the transfer assembly 230 is spaced apart from the probe assembly 210. In the process of placing the sample to be detected on the carrier 110, the sample to be detected is first moved to the side of the adsorption panel with the adsorption surface by the manipulator 240, and the sample to be detected is moved close to the adsorption panel, and the adsorption panel adsorbs the sample to be detected. Further, the manipulator 240 is moved out, and the sample to be detected is set on the adsorption surface of the adsorption panel facing the carrier plate assembly 100. Further, the carrier plate assembly 100 is moved by the moving mechanism 220 so that the first surface 111 of the carrier 110 is close to the side of the sample to be detected away from the adsorption panel, and the negative pressure is formed by the cooperation between the chamber 130 and the channel 113 to adsorb the sample to be detected on the first surface 111 side of the carrier 110. Furthermore, the adsorption of the sample to be detected by the adsorption panel is released, and the sample to be detected is moved to a position close to the probe assembly 210 through the moving mechanism 220, so that the tip of the probe assembly 210 can contact the sample to be detected and detect the sample to be detected. In this process, the transfer assembly 230 transfers and transports the sample to be detected between the manipulator 240 and the carrier plate, which can further reduce the difficulty of the carrier 110 to adsorb the sample to be detected, improve the efficiency of the carrier 110 to adsorb the sample to be detected, and help improve the flatness of the sample to be detected on the side of the first surface 111, which is convenient for the probe assembly 210 to detect the sample to be detected, and improve the applicability and detection performance of the wafer detection device 200.

[0110] It can be understood that the adsorption panel has a vacuum adsorption cavity composed of an accordion suction cup, and negative pressure is formed by the vacuum adsorption cavity to adsorb the sample to be detected.

[0111] Optionally, the accordion suction cups are arranged at intervals around the periphery of the adsorption panel, so that when the accordion suction cups adsorb the sample to be detected, the area to be detected of the sample to be detected can be avoided to avoid damaging the sample to be detected.

[0112] Optionally, the transfer assembly 230 has a plurality of clamping jaws, which are spaced apart on the adsorption panel so that when the adsorption panel adsorbs the sample to be detected, the plurality of clamping jaws cooperate to clamp the sample to be detected to prevent the sample to be detected from falling.

[0113] Optionally, the transfer component 230 further includes a buffer, which is disposed on the adsorption surface of the adsorption panel. When the sample to be detected is adsorbed on the adsorption panel, the buffer can avoid damaging the sample to be detected.

[0114] Mentioning "embodiment" and "implementation method" in this application means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, provided that there is no contradiction between them.

[0115] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the above preferred implementation modes, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A carrier plate assembly, characterized in that: The carrier plate assembly comprises: A carrier, the carrier having a first surface and a second surface disposed opposite to each other along a preset direction, the carrier further having a plurality of holes arranged at intervals, each hole respectively passing through the first surface and the second surface, the first surface being used to carry a sample to be detected; and A chassis member, wherein the chassis member is arranged on the second surface of the carrier, the chassis member and the carrier enclose a chamber, the chamber is respectively connected to the multiple channels, and the chamber and the multiple channels cooperate to form a negative pressure to adsorb the sample to be detected on the first surface side; the chamber includes a plurality of first sub-cavities, and the multiple first sub-cavities are arranged at intervals; the multiple channels include a plurality of first channel groups, each group of first channel groups includes a plurality of channels, each group of first channel groups corresponds to a first sub-cavity setting, and different first channel groups correspond to different first sub-cavity settings; the chamber also includes a plurality of second sub-cavities, the second sub-cavity is provided between two adjacent first sub-cavities, the multiple second sub-cavities are all connected to each other, the multiple channels also include a plurality of second channel groups, each group of second channel groups includes a plurality of channels, each group of second channel groups corresponds to a second sub-cavity setting, and different second channel groups correspond to different second sub-cavity settings.

2. The carrier plate assembly according to claim 1, characterized in that: The carrier also has a peripheral side wall and a vent hole, the peripheral side wall is connected to the first surface and the second surface respectively, the vent hole is connected to the chamber and passes through the peripheral side wall, and the vent hole is used to connect to the negative pressure device to form a negative pressure between the chamber and the multiple channels.

3. The carrier plate assembly according to claim 1 or 2, characterized in that: The carrier plate assembly further includes a first sealing member disposed on the first surface and surrounding the outer periphery of the plurality of holes.

4. The carrier plate assembly according to claim 1 or 2, characterized in that: The carrier plate assembly further includes a plurality of adsorption members, which are arranged on the first surface and partially penetrate the channels. One adsorption member corresponds to one channel, and different adsorption members correspond to different channel settings.

5. The carrier plate assembly according to claim 1, characterized in that: The carrier plate assembly also includes a second seal and a third seal. The second seal is disposed on the periphery of the plurality of first subcavities, and the third seal is disposed around the periphery of the plurality of second subcavities and is located between the first subcavity and the second subcavity.

6. The carrier plate assembly according to claim 2, characterized in that: The supporting member has a plurality of first mounting holes, some of which are arranged at intervals on the outer periphery of the plurality of first sub-cavities, and some of which are arranged between two adjacent groups of the first channel groups, and the first mounting holes penetrate the second surface; the chassis member has a plurality of second mounting holes, and along a preset direction, the second mounting holes penetrate the two opposite surfaces of the chassis member; the supporting plate assembly includes a plurality of first mounting members, and each of the first mounting members is respectively penetrated through the second mounting hole and the first mounting hole to connect the supporting member and the chassis member.

7. The carrier plate assembly according to claim 2, characterized in that: The supporting member has a plurality of third mounting holes and a plurality of fourth mounting holes, the plurality of third mounting holes are arranged at intervals on the outer periphery of the plurality of first sub-cavities and the third mounting holes penetrate the second surface, the fourth mounting hole is located in the plurality of second sub-cavities and the fourth mounting hole penetrates the bottom wall of the second sub-cavity; the chassis member has a plurality of fifth mounting holes, and along a preset direction, the fifth mounting holes penetrate two opposite surfaces of the chassis member; the supporting plate assembly includes a plurality of second mounting members and a plurality of third mounting members, each of the second mounting members is respectively penetrated in the fifth mounting hole and the third mounting hole, and each of the third mounting members is respectively penetrated in the fifth mounting hole and the fourth mounting hole, so as to connect the supporting member and the chassis member.

8. A wafer inspection device, characterized in that: The wafer detection device comprises: The carrier plate assembly according to any one of claims 1 to 7, wherein the carrier plate assembly is used to carry a sample to be tested; and A probe assembly is disposed on the first surface side of the carrier plate assembly, and is used to electrically connect with the sample to be detected to achieve detection of the sample to be detected.

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